201212398 六、發明說明： 【發明所屬之技術領域】 本發明係關於一種安裝了 LED或有機EL等發光元 化基板與具備控制該等功能性元件的電路n其 板的連接構造以及用於該連結構造之中的插座，；==基 LED 燈。 【先前技術】 在習知的LED燈中，係牽拉電線以連接安裝 發光板與控制㈣ *，組基板上將電線焊 的疑ii卜在亦有電線自模組化基板揚起而遮住咖等構件的光線 線相s電種將用來與LED基板連接的供電 咖i 本t中心線從偏移到端部附近的位置導出的 屬必要。......糸以牽拉電線為讀的改良，電線的連接作業仍 連接的 連接;觸，與連接器的 利文獻1]曰本特開2010一4〇223號公 [專利文獻2]日本特開2__218綱號公^ 【發明内容】 [發明所欲解決的問題】 ”及二:組;路基板的連接構 少組裝步驟數’且能夠防止在安裝有發 201212398 線受到遮蔽。201212398 6. Technical Field of the Invention The present invention relates to a connection structure in which a light-emitting elementized substrate such as an LED or an organic EL is mounted, and a circuit having a circuit for controlling the functional elements, and a connection structure therefor. The socket in the construction, == base LED light. [Prior Art] In the conventional LED lamp, the wire is pulled to connect the light-emitting board and the control (4) *, and the wire soldering on the group substrate is raised and the wire is lifted from the module substrate to cover it. The ray line phase s of the component such as the coffee is necessary for the power supply to be connected to the LED substrate. The center line of the t is derived from the position shifted to the vicinity of the end. ...... 糸 牵 牵 牵 牵 牵 牵 牵 牵 牵 牵 牵 牵 牵 牵 牵 牵 牵 牵 牵 牵 牵 牵 牵 牵 牵 牵 牵 牵 牵 牵 牵 牵 牵 牵 牵 牵 牵 牵 牵 牵 牵 牵 牵 牵] Japanese Patent Laid-Open No. 2__218 No. 2 [Disclosure] [The problem to be solved by the invention] "and two: group; the number of assembly steps of the road substrate is small" and it is possible to prevent the line of the 201212398 from being shielded.
[解決問題之技術手段；I 元件的用來連接在表面上安裝了功能性 裝力贫if ΐ，，的表面朝背面側貫通突出的狀， 裝在該模組化基板上’同時並内的狀態下，安 接觸體;該電路基板在端部附近白;2面ίϊί'ίίί J連ΐ的 基板與電路基板的連接構造， 係在 ===== 直=威= 能性㈣在—的功 模組罩的插座中，_座從該 ^ ’便可有效使翻體從制關雜緣。土板上。 所使連結構造 合用於LED燈。 例里贼-具或电子1置，特別適 201212398 [發明之效果] 關於本發明之插座m將電路基板的端部插入朝模组 化基板的背面側突出的插座中’内裝於插座的接觸體便與設置在 電路基板的端部附近的電連接部接觸，構造簡單 較f匕較容易組裝或連接，也不會有f知的因^電:匕 連接器南度而遮住光線的疑慮。 另外’關於本發曰月之模組化基板與電路基板的連接構造，由 於模組化基板設有從表面朝背面側貫通突出而與功能性元件電連 接的接觸體’且電路基板在端部附近設有電連接部，電路基板面 以相對於模組化基板的背面約略直交方向上的方式配置，接觸體 與電路基板的電連接部彈性接觸，故不必像習知技卿樣使 線也能夠電連接。 【實施方式】 以下根據圖式説明將本發明之插座以及模組化基板與電路基 板的連接構造應用於LED燈的實施例。 圖1係將圖式省略之透光蓋取下，模組化基板1〇與電 20的位置關係以示意方式表現的圖式。 在外殼30的下部設有圖示省略之套圈等，在該外殼3〇的 部組裝電路基板20。 内·部的詳細構造省略，.僅表示出電路基板20。.. 電路基板20具備電晶體、電容等的電路元件同時在電路基板 上設有由配線圖案所構成的電連接部2ia、2lb。 在外殼30的上部設有模組化基板1〇的安裝部31，在該安裝 部31的中央部位上設有插座13的插入孔32。 模組化基板10在表面形成配線圖案12,且以與該配線圖案 連接的方式安裝了 LED晶片11。 ' 本實施例，係將複數的小LED晶片11配置在同心圓周上的 實施例’惟並非以此為限。 在模組化基板10的中央部位上設有貫通孔15，插座13從模 6 201212398 組化基板的表面向背面側，以大約朝垂直方向配置 通孔15完成安裝。 座it的構造例’如圖4所不的’設有可在樹脂製的絶緣性 冗又罩13a内裝設接觸體14的裝設孔13b。 型。接觸體14係由金屬製的彈性體所構成，在本實施例中為2p 剌用來插人設置在殼罩仏上的細冓13d的基 部的上部朝水平方向f折成直角，然後再將其 月1J k朝室:直方向，.％折成長條狀的彈性接觸片14c。 ΐ安ΐίί!5148的上部設有可焊接安餘模組化基板10 L t 線部14b，在基端部14a的下部形成2片插入片 =形成f路基板2G的端部可插人的插入部， 田將一對接觸體14插入殼罩13a的定位'、盖 l3c時，彈性接觸片Mc便位於貫 / 弓I、友載置溝 蔣砵奸疝m θ 1 忒叹孔13b的背面側的開口部。 嗓邻ιϋί 的組裝在模組化基板1G上，並將引 線邓14b知接女裝在配線圖案I]上。 -將插座13安裝在模組化基板10上，然後如圖1所 在外殼3G的安裝部31 過外殼3㈣插人孔32並 i?n r \ 裒圖式令略的小螺釘等構件。 二將插 的記載，顯示出接觸體14的立體圖。 14的基端部14a垂下的2片^入基板2 =部被引導至從接觸體 此時接觸體14的彈性接觸片 、e之間的插入部I4f。 的基板單面上的圖案上的在形成於電路基 板10與電路基板2〇便電連接。a、- b彈性接觸，模組化基 3的muc的動作顯示於圖3。 觸體的變化實施例。 114的功能藉此使另一方万碑予可進行電連接的彈性接觸片 插入片114d可與電路基板20進行定位 201212398 的實施例。 下使======⑵-㈣情況 例。 0者電路基板面彈性變形的實施 鎖狀圖電連接部設成由銷221a、221b所構成的 銷狀觸體§域插絲的彈性接觸片⑽的實施例。 某板模組化基板上將+極與—極分離並配置在例如 土板的兩側周緣°卩而形成有效的單線型插觸構造例。 【圖式簡單說明】 (a)[=係本發明之模組化基板與電路基板的連接構造例 跳基域祕基紐接前，㈦絲示連接後 U)係表不接觸體與電連接部的位置關係。 [，2]係表示賴組化基板分解成基板部與插座的 [圖3]係表示接觸體與電路基板的接觸構造，（a)係表 圖。 係表示ϋ 3]係表示接觸體與電路基板的接 接前，（b)係表示連接後。 的構糊’⑷絲示分_接觸體和 座冗又罩的狀態，（b)係表示組裝後。 _係表示將插入部與接觸部一體化的實施例。（a)係; 不連接前’（b)係表示連接後。 … n]係表示在電路基板上設置突片狀的電連接部的 U)係表示連接前，（b)係表示連接後。 、 [圖7] (a) (b)係表示電路基板的電連接部設成銷 她例。 - [圖8]係表示單線型插座的實施例。 【主要元件符號說明】[Technical means to solve the problem; the I component is used to connect a surface of the surface of the functional mounting force that is mounted on the surface, and is mounted on the modular substrate. In the state, the contact body; the circuit substrate is white near the end; the connection structure of the substrate and the circuit substrate of the two sides is at ===== straight = wei = energy (four) at - In the socket of the power module cover, the _ seat can effectively make the turning body from the sealing edge. On the soil board. The connection structure is used in combination with an LED lamp. In the case of the thief-integral or the electronic device, it is particularly suitable for 201212398. [Effect of the invention] The socket m of the present invention inserts the end of the circuit board into the socket protruding toward the back side of the module substrate. The body is in contact with the electrical connection portion provided near the end of the circuit board, and the structure is simpler than that of the device, and it is easier to assemble or connect, and there is no doubt that the power is blocked by the south of the connector. . In addition, the connection structure of the module substrate and the circuit board of the present invention is such that the module substrate is provided with a contact body that is electrically connected to the functional element from the front surface toward the back surface side and the circuit substrate is at the end portion. An electrical connection portion is provided in the vicinity, and the circuit board surface is disposed in a direction orthogonal to the back surface of the module substrate, and the contact body is in elastic contact with the electrical connection portion of the circuit board, so that it is not necessary to make the line like a conventional technician. Can be electrically connected. [Embodiment] Hereinafter, an embodiment in which a socket of the present invention and a connection structure of a module substrate and a circuit board are applied to an LED lamp will be described with reference to the drawings. Fig. 1 is a schematic view showing the positional relationship between the modular substrate 1 and the electric circuit 20 in a schematic manner in which the light-transmissive cover omitted from the drawing is removed. A ferrule or the like (not shown) is provided at a lower portion of the outer casing 30, and the circuit board 20 is assembled at a portion of the outer casing 3''. The detailed structure of the inner portion is omitted, and only the circuit board 20 is shown. The circuit board 20 is provided with circuit elements such as transistors and capacitors, and electrical connection portions 2ia and 2bb each having a wiring pattern are provided on the circuit board. An attachment portion 31 of the modular substrate 1A is provided on the upper portion of the outer casing 30, and an insertion hole 32 of the socket 13 is provided at a central portion of the attachment portion 31. The module substrate 10 has a wiring pattern 12 formed on its surface, and the LED wafer 11 is mounted in such a manner as to be connected to the wiring pattern. The present embodiment is an embodiment in which a plurality of small LED chips 11 are arranged on a concentric circumference, but is not limited thereto. A through hole 15 is formed in a central portion of the module substrate 10. The socket 13 is disposed from the surface of the module 6 201212398 to the back side, and the through hole 15 is disposed approximately in the vertical direction. The structure example of the seat is 'not shown in Fig. 4' is provided with a mounting hole 13b in which the contact body 14 can be mounted in the insulating cover 13a made of resin. type. The contact body 14 is made of a metal elastic body, and in the present embodiment, 2p 剌 is used to insert the upper portion of the base portion of the fine raft 13d provided on the casing 朝 into a right angle in the horizontal direction f, and then The month 1J k toward the room: straight direction, .% folded into a strip-shaped elastic contact piece 14c. The upper part of the 5148 is provided with a solderable mounting module substrate 10 L t line portion 14b, and two insertion pieces are formed at the lower portion of the base end portion 14a = the end portion of the f-path substrate 2G is insertable When the pair inserts the contact body 14 into the positioning 'of the cover 13a' and the cover l3c, the elastic contact piece Mc is located on the back side of the / 弓 弓 、 、 、 、 、 、 、 、 、 、 、 、 、 、 疝 疝 疝 疝 13 13 13 The opening. The assembly of the adjacent ιϋί is on the modular substrate 1G, and the lead Deng 14b is attached to the wiring pattern I]. - The socket 13 is mounted on the modular substrate 10, and then the mounting portion 31 of the casing 3G as shown in Fig. 1 is inserted through the casing 3 (4) through the casing 32 and i?n r \ 裒 令 令 略 略 。 。 。 。 。. The description of the insertion will show a perspective view of the contact body 14. The two pieces of the substrate 2 that are suspended from the base end portion 14a of the 14 are guided to the insertion portion I4f between the elastic contact piece and the e of the contact body 14 at this time. The pattern on one side of the substrate is electrically connected to the circuit board 10 and the circuit board 2 on the pattern. The motion of a, - b elastic contact, and the muc of the modular base 3 is shown in Fig. 3. A variation of the contact body. The function of 114 thereby allows the other side to be electrically connected. The resilient contact piece insertion piece 114d can be positioned with the circuit substrate 20 in the embodiment of 201212398. Let the ======(2)-(4) case. Embodiment of Elastomeric Deformation of Circuit Board Surface of 0. The lock diagram electrical connection portion is an embodiment of an elastic contact piece (10) of a pin-shaped contact body formed by pins 221a and 221b. On a modularized substrate of a board, the + pole and the pole are separated and disposed, for example, on both sides of the earth plate to form an effective single-wire type of plug-in structure. [A brief description of the drawings] (a) [= Before the connection structure of the modular substrate and the circuit substrate of the present invention is connected to the base of the hop base, (7) after the wire connection, the U) is not in contact with the electrical connection. The positional relationship of the department. [2] shows that the laminated substrate is decomposed into a substrate portion and a socket. [Fig. 3] shows a contact structure between the contact body and the circuit board, and (a) is a table view. The system indicates that ϋ 3] indicates that the contact body is connected to the circuit board, and (b) indicates that the connection is made. The structure of the (4) silk indicates the state of the contact body and the cover and the cover, and (b) indicates the assembly. _ indicates an embodiment in which the insertion portion and the contact portion are integrated. (a) is the system; the front is not connected. The n] indicates that the blade-shaped electrical connection portion is provided on the circuit board. U) indicates that the connection is made before the connection (b) indicates that the connection is made. [Fig. 7] (a) (b) shows an example in which the electrical connection portion of the circuit board is provided as a pin. - [Fig. 8] shows an embodiment of a single-wire type socket. [Main component symbol description]
川模組化基板 HLED 12配線圖案 8 201212398 13插座 13a殼罩 13b裝設孔 13c引線載置溝 13d定位溝 13e插入部 14接觸體 14a基端部 14b引線部 14c彈性接觸片 14d、14e插入片 14f插入部 15貫通孔 20電路基板 21、21a、21b電連接部 30外殼 31安裝部 32插入孔 114彈性接觸片 114b引線部 114d插入片_ 121a、121b電連接部 214c彈性接觸片 221a、221b 銷 314c彈性接觸片川Modular substrate HLED 12 wiring pattern 8 201212398 13 socket 13a cover 13b mounting hole 13c lead mounting groove 13d positioning groove 13e insertion portion 14 contact body 14a base end portion 14b lead portion 14c elastic contact piece 14d, 14e insertion piece 14f insertion portion 15 through hole 20 circuit board 21, 21a, 21b electrical connection portion 30 outer casing 31 mounting portion 32 insertion hole 114 elastic contact piece 114b lead portion 114d insertion piece _121a, 121b electrical connection portion 214c elastic contact piece 221a, 221b pin 314c elastic contact piece