201211699 六、發明說明： 【發明所屬之技術領域】 本發明係有關一種改善防焊開窗尺寸之曝光方法及實 施該方法之曝光框，尤指一種把曝光框上框之撓性透光板 採托撐式設計，且於用以托撐該透光板之框邊托板部形成 有一個以上通氣孔，而得於對曝光框内部空間抽真空，致 使底片自然垂懸貼靠於基板之際，隨即藉由透光板將底片 下壓，俾使底片更加貼靠於基板之設計者。 • 【先前技術】 按，電路板防焊層之曝光程序，係令定位於曝光框之 曝光底片及待曝光基板，先於曝光機外部之對位區進行對 位之程序，然後再將曝光框送入曝光機内部之曝光室，.把 曝光底片對於電路焊墊所製作之防焊開窗圖案，藉由曝光 顯影而成像於基板。 次按，如第一圖所示之習知曝光框，係令底片（10)附 著於一上框（20)下方，而該上框（20)乃於一框體（22)固定 φ 設置一玻璃板（21)，並將基板（30)置放於一底座（40)之對 位平台（41)上方；但由於進行曝光程序前，該基板（30)必 須相對該底片（10)進行對位工作，致使該基板（30)與該底 片（10)之間必須留有對位間距，並於對位後，藉由對該上 框（20)與底座（40)間之曝光框内部空間抽真空，俾讓該底 片（10)得以因自然垂懸而貼靠於該基板（30)。 再按，如第二圖所示，由於習知曝光框，並無法讓該 底片（10)非常密合於該基板（30)，遂會讓該底片（10)之防 m -3 - 201211699 焊開窗圖案（11)與該基板（30)之電路焊墊（32)間產生些許 之夾角，致使底片（10)之防焊開窗圖案（11)之實際罩遮面 積縮小，故會於進行後續之防焊層（31)顯影工作後，產生 防焊開窗（311)尺寸縮小之現象，嚴重的話，防焊層（3丨）甚 至會覆蓋到電路焊墊（32)。 【發明内容】 本發明之主要目的，係欲解決先前技術無法讓底片非 常密合於基板進而造成防㈣窗尺寸縮小之問豸，而具有201211699 VI. Description of the Invention: [Technical Field] The present invention relates to an exposure method for improving the size of a solder-proof window and an exposure frame for carrying out the method, and more particularly to a flexible light-transmissive plate for the frame of the exposure frame a support type design, and more than one vent hole is formed in the frame side plate portion for supporting the light-transmitting plate, and the inner space of the exposure frame is vacuumed, so that the negative film naturally hangs against the substrate Then, the negative film is pressed down by the light-transmitting plate, so that the negative film is more closely placed against the designer of the substrate. • [Prior Art] Press, the exposure process of the solder mask of the board, the exposure film positioned in the exposure frame and the substrate to be exposed, before the alignment area outside the exposure machine is aligned, and then the exposure frame The film is fed into the exposure chamber inside the exposure machine, and the anti-weld window pattern formed by the exposure film on the circuit pad is imaged on the substrate by exposure and development. Pressing, as shown in the first figure, the conventional exposure frame is such that the negative film (10) is attached to an upper frame (20), and the upper frame (20) is fixed to a frame (22) by φ. a glass plate (21), and the substrate (30) is placed on the alignment platform (41) of a base (40); however, the substrate (30) must be opposed to the negative film (10) before the exposure process is performed. Positioning, such that the substrate (30) and the film (10) must have a registration gap, and after the alignment, by the exposure frame between the upper frame (20) and the base (40) The vacuum film is evacuated so that the film (10) can be placed against the substrate (30) by hanging naturally. Press again, as shown in the second figure, because the conventional exposure frame does not allow the film (10) to be in close contact with the substrate (30), the film (10) is prevented from being soldered by m -3 - 201211699 A slight angle is formed between the window opening pattern (11) and the circuit pad (32) of the substrate (30), so that the actual cover area of the anti-weld window pattern (11) of the film (10) is reduced, so After the subsequent solder mask (31) is developed, the size of the solder-proof window (311) is reduced. If it is serious, the solder resist layer (3丨) may even cover the circuit pad (32). SUMMARY OF THE INVENTION The main object of the present invention is to solve the problem that the prior art cannot make the film very close to the substrate and thus the size of the window is reduced.
大幅增加底片與基板密合度俾以改善防焊開窗尺寸之功 效。 本發明之另一目的，則具有方便更換底片之功效。 為達上述功效，本發明改善防焊開窗尺寸之曝光方 法，係包括下列步驟： a. )將底片附著定位於曝光框内部； b. )將基板置放定位於曝光框内部； c. )令基板相對底片進行對位程序； 〇對曝光框内部空間抽真空，底片與基板間乃因真空 之形成，致使底片自然垂懸而貼靠於基板； 工 〇將底片下屋，確保底片與基板間無空氣殘留且致 使底片更加貼靠於基板；以及 f.)對密合度極高之Μ與基板進行曝絲序者。 再者，本發明用以實施前述改善防谭開窗尺寸之 方法之曝光框，係包括有· λ 一底座’設置有對位平台；以及 -4· IS] 201211699 一上框，將一框邊樞設於該底座，並於該底座與框邊 間权置有第-氣密膠條，而該框邊底緣向框内設置具有一 個以上通氣孔之托板部，且藉該托板部托撐一具有撓性之 透光板’而於該托板部與透光板間設置有位於該通氣孔外 圍之第二氣密膠條，另由一片以上之壓板壓制該透光板者。 此外，該框邊由樞設於該底座之固定外框與設置該托 板。卩之活動内框所組成。又，進一步於該固定外框與活動 内框之間设置有快拆鎖件。另，該托板部一體成型於該框 邊或是另外裝設於該框邊底緣。再者，該透光板為壓克力 板或是薄玻璃板。 【實施方式】 首先，請參閱第三、四圖所示，本發明之曝光方法係 包括下列步驟：a.)將底片（1〇)附著定位於曝光框上框（5〇) 之框邊（52)下方’而具有撓性之透光板（51)被托撐設置於 該框體（52) ’且令該框體（52)形成有通氣孔（521) ; b.)將 基板（30)置放定位於曝光框底座（4〇)之對位平台（41)上 方，c·)令基板（3〇)相對底片（1〇)進行對位程序；d.)對上 框（50)與底座（4〇)間之曝光框内部空間抽真空，底片（1〇) 與基板（30)間乃因真空之形成，致使底片（10)自然垂懸而 貼靠於基板（30) ; e·)因該框體（52)之通氣孔（521)而致使 底片（10)與透光板（51)間形成真空，該透光板（51)乃因其 撓性而將底片（10)下壓，確保底片（10)與基板（3〇)間無空 氣殘留’且致使底片（10)更加貼靠於基板（3〇);以及f.) 對密合度極高之底片（1〇)與基板（30)進行曝光程序者。 201211699 接著，本發明用以實施前述方法之曝光框，係包括有： 一底座（40)，設置有供待曝光基板（30)置放定位之對位平 台（41);以及一上框（50)，將一框邊（52)樞設於該底座 (40)，並於該底座（40)與框邊（52)間設置有第一氣密膠條 (42)，而該框邊（52)底緣向框内設置具有一個以上通氣孔 (521) 之托板部（522)，該托板部（522)可一體成型於該框邊 (52)或是另外裝設於該框邊（52)底緣，且藉該托板部（522) 托撐一具有撓性之透光板（51)，該透光板（51)可為壓克力 板或是薄玻璃板，而於該托板部（522)與透光板（51)間設置 • 有位於該通氣孔（521)外圍之第二氣密膠條（523)，另由一 片以上之壓板（524)壓制該透光板（51)，俾以確保該托板部 (522) 與透光板（51)間之氣密性者。 再者，該框邊（52)可由樞設於該底座（4〇)之固定外框 (52a)與設置該托板部（522)之活動内框（52b)所組成，並進 一步於該固定外框（52a)與活動内框（52b)之間設置有快拆 鎖件（525);藉此’可將該活動内框（52b)快速自該固定外 框（52a)拆解下來，而具有方便更換底片之功效。 φ 基於如是之構成，本發明係把曝光框上框（50)之撓性 透光板（51)採托撐式設計，乃有別於習知之固定式設計， 且於用以托撐該透光板（51)之框邊（52)托板部（522)形成 有一個以上通氣孔（521 )，而把底片（1〇)附著定位於框邊 (52)之托板部（522)下緣，且令該底片（1〇)不會遮蓋住該通 氣孔（521);於是’當對曝光框内部空間抽真空之際，底片 (10)與基板（30)間乃因真空之形成，致使底片（1〇)自然垂 懸而貼靠於基板（30) ’隨即因該通氣孔（521)而致使該底片Significantly increase the adhesion of the film to the substrate to improve the size of the solder-proof window. Another object of the present invention is to facilitate the replacement of the backsheet. In order to achieve the above effects, the present invention improves the exposure method of the size of the solder-proof window, and includes the following steps: a.) attaching the film to the inside of the exposure frame; b. placing the substrate in the interior of the exposure frame; c. Aligning the substrate with the negative film; 抽 vacuuming the inner space of the exposure frame, the vacuum is formed between the negative film and the substrate, so that the negative film is naturally suspended and abuts against the substrate; the work piece lowers the negative film to ensure the negative film and the substrate There is no air remaining between them and the film is more closely attached to the substrate; and f.) the substrate with a very high degree of closeness and the substrate is exposed. Furthermore, the exposure frame of the present invention for implementing the method for improving the size of the anti-tank window comprises: λ a base 'with an alignment platform; and -4· IS] 201211699 an upper frame, pivoting a frame In the base, a first air-tight adhesive strip is disposed between the base and the frame edge, and the bottom edge of the frame is provided with a tray portion having one or more vent holes in the frame, and the support portion is supported by the support portion A flexible light-transmitting plate is disposed between the plate portion and the light-transmitting plate, and a second airtight rubber strip is disposed on the periphery of the venting hole, and the light-transmitting plate is pressed by one or more pressing plates. In addition, the frame edge is provided by the fixed outer frame pivoted to the base and the tray is disposed. The composition of the activity is composed of inner frames. Further, a quick release lock is further disposed between the fixed outer frame and the movable inner frame. Further, the tray portion is integrally formed on the frame or additionally attached to the bottom edge of the frame. Furthermore, the light transmissive plate is an acrylic plate or a thin glass plate. [Embodiment] First, referring to the third and fourth figures, the exposure method of the present invention comprises the following steps: a.) attaching the negative film (1〇) to the frame edge of the upper frame (5〇) of the exposure frame ( 52) The lower and flexible translucent plate (51) is supported by the frame (52)' and the frame (52) is formed with a vent (521); b.) the substrate (30) Place the positioning platform (41) above the exposure frame base (4〇), c·) align the substrate (3〇) with the negative film (1〇); d.) the upper frame (50) The inner space of the exposure frame between the base and the base (4〇) is evacuated, and the vacuum is formed between the negative film (1〇) and the substrate (30), so that the negative film (10) is naturally suspended and abuts against the substrate (30); ·) A vacuum is formed between the negative film (10) and the light-transmitting plate (51) due to the vent hole (521) of the frame body (52), and the light-transmitting plate (51) is a film (10) due to its flexibility. Press down to ensure that there is no air remaining between the film (10) and the substrate (3〇) and the film (10) is placed closer to the substrate (3〇); and f.) The film with a very high degree of adhesion (1〇) Exposure procedure with substrate (30) . 201211699 Next, the exposure frame of the present invention for implementing the foregoing method includes: a base (40) provided with an alignment platform (41) for positioning the substrate to be exposed (30); and an upper frame (50) a frame edge (52) is pivotally disposed on the base (40), and a first airtight strip (42) is disposed between the base (40) and the frame edge (52), and the frame edge (52) a bottom plate is provided with a plate portion (522) having one or more vent holes (521), and the plate portion (522) may be integrally formed on the frame edge (52) or additionally mounted on the frame edge ( 52) a bottom edge, and the flexible plate (51) is supported by the plate portion (522), and the light-transmitting plate (51) may be an acrylic plate or a thin glass plate, and Between the plate portion (522) and the light-transmitting plate (51), there is a second airtight rubber strip (523) located at the periphery of the vent hole (521), and the light-transmitting plate is pressed by more than one pressure plate (524). (51), to ensure the airtightness between the pallet portion (522) and the light-transmitting plate (51). Furthermore, the frame edge (52) may be composed of a fixed outer frame (52a) pivoted to the base (4〇) and a movable inner frame (52b) provided with the plate portion (522), and further fixed thereto. A quick release lock (525) is disposed between the outer frame (52a) and the movable inner frame (52b); thereby the movable inner frame (52b) can be quickly disassembled from the fixed outer frame (52a), and It has the effect of easy replacement of the film. According to the composition of the present invention, the flexible light-transmitting plate (51) of the upper frame (50) of the exposure frame is designed to be different from the conventional fixed design, and is used for supporting the transparent The frame side (52) of the light plate (51) is formed with one or more ventilation holes (521), and the negative film (1) is attached to the plate portion (522) of the frame side (52). The edge, and the film (1〇) does not cover the vent (521); then 'when the inner space of the exposure frame is evacuated, the vacuum film is formed between the film (10) and the substrate (30). Causing the backsheet (1〇) to hang naturally and abut against the substrate (30)', which is then caused by the vent (521)
[SJ *6- 201211699 (10)與透光板（51)間形成真空，該透光板（51)乃因其撓性 而將底片（10)下壓，將底片（10)與基板（30)間之殘留空氣 驅離，讓該底片（10)得以更加貼靠於基板（30)，再於如第 五圖所示之狀態下進行曝光程序，基板（30)之防焊層（31) 所顯影出來之防焊開窗（311)尺寸，乃會非常接近於底片 (10)之防焊開窗圖案（11)尺寸，避免防焊層（31)覆蓋到電 路焊墊（32);是以，本發明讓底片（10)與基板（30)以密合度 極高之狀態進行曝光程序，而具有大幅增加底片與基板密 合度俾以改善防焊開窗尺寸之功效。 Φ 綜上所述，本發明所揭示之技術手段，確具「新穎性」、 「進步性」、「可供產業利用」等發明專利要件，祺請鈞局 惠賜專利，以勵發明，無任德感。 惟，上述所揭露之圖式、說明，僅為本發明之較佳實施 例，大凡熟悉此項技藝人士，依本案精神範疇所作之修飾或 等效變化，仍應包括本案申請專利範圍内。[SJ *6- 201211699 (10) A vacuum is formed between the light-transmitting plate (51), which is pressed by the film (10) for its flexibility, and the film (10) and the substrate (30) are pressed. The residual air is driven away to allow the negative film (10) to be placed closer to the substrate (30), and then subjected to an exposure process as shown in FIG. 5, and the solder resist layer (31) of the substrate (30) The developed solder-proof window (311) size will be very close to the size of the solder-proof window pattern (11) of the film (10), avoiding the solder resist layer (31) covering the circuit pad (32); Therefore, the present invention allows the negative film (10) and the substrate (30) to be exposed in an extremely high degree of adhesion, and has the effect of greatly increasing the adhesion of the negative film to the substrate to improve the size of the solder-proof window. Φ In summary, the technical means disclosed in the present invention have the invention patents such as "novelty", "progressiveness" and "available for industrial use", and invite the bureau to give a patent to encourage invention, no Ren De sense. The drawings and descriptions of the present invention are merely preferred embodiments of the present invention. Those skilled in the art, which are modified by the spirit of the present invention, should be included in the scope of the patent application.
I SJ -7 - 201211699 【圖式簡單說明】 第一圖係習知曝光框之結構說明圖。 第二圖係習知曝光技術產生防焊開窗尺寸縮小現象之 說明圖。 第三圖係本發明之結構外觀圖。 第四圖係本發明之結構剖示圖。 第五圖係本發明改善防焊開窗尺寸之說明圖。I SJ -7 - 201211699 [Simple description of the diagram] The first diagram is a structural description of the conventional exposure frame. The second figure is an illustration of the conventional exposure technique to produce a phenomenon in which the size of the solder-proof window is reduced. The third drawing is a structural view of the structure of the present invention. The fourth figure is a cross-sectional view of the structure of the present invention. The fifth figure is an explanatory view of the invention for improving the size of the solder-proof window.
【主要元件符號說明】 (10)底片 (42)第一氣密膠條 (11)防焊開窗圖案 (50)上框 (20)上框 (51)透光板 (21)玻璃板 (52)框邊 (22)框體 (52a)固定外框 (30)基板 (5 2b)活動内框 (31)防焊層 (521)通氣孔 (311)防焊開窗 (522)托板部 (32)電路焊墊 (523)第二氣密膠條 (40)底座 (524)壓板 (41)對位平台 (525)快拆鎖件 m -8-[Description of main component symbols] (10) Negative film (42) First airtight rubber strip (11) Solderproof window opening pattern (50) Upper frame (20) Upper frame (51) Light-transmissive plate (21) Glass plate (52 Frame side (22) frame body (52a) fixed outer frame (30) substrate (52b) movable inner frame (31) solder resist layer (521) vent hole (311) solder-proof window (522) pallet portion ( 32) Circuit pad (523) Second airtight strip (40) Base (524) Plate (41) Alignment platform (525) Quick release lock m -8-