201210432 六、發明說明： 【發明所屬之技術領域】 [0001] 本發明涉及一種殼體及其製造方法。 【先前技術】 [0002] 金屬及塑膠因其較好之耐水、耐腐蝕及機械性能廣泛應 用於電子產品中。惟，由於金屬及塑膠部很難僅利用面 結合緊密固定在一起，一般需要於其中間設置黏接層以 連接固定基體及塑膠部。然，此種結構中金屬與塑膠部 之結合強度不高，且長久使用後隨著黏接層之老化，其 I 結合強度會進一步降低。 【發明内容】 [0003] 鑒於上述内容，有必要提供一種結合強度高之殼體及其 製造方法。 [0004] 一種殼體，其包括基體及與基體一體成型之塑膠部，該 基體包括與塑膠部連接之結合面，該結合面上形成有親 水性之奈米結構。 ^ [0005] 一種殼體之製造方法，其包括以下步驟：提供基體，該 基體具有結合面；該結合面上形成有親水性之奈米結構 ;將該基體置於成型模具中，注入熔融塑膠材質於結合 面上以成型塑膠部，冷卻後即形成殼體。 [0006] 上述殼體之基體之結合面上形成有親水性之奈米結構， 使結合面之表面自由能降低，從而使塑膠部更容易與基 體之材質結合起來，提高了殼體之基體與塑膠部之結合 強度。 099127505 表單編號A0101 第3頁/共11頁 0992048330-0 201210432 【實施方式】 [0007] 下面結合附圖及實施方式對本發明之殼體及其製造方法 作進一步之詳細說明。 [0008] 請參見圖1及圖2，本發明較佳實施方式之殼體100係將塑 膠部30形成於基體20上而形成之一體結構。可根據實際 應用將基體20及塑膠部30設計為不同之形狀，如基體20 作為行動電話内之導電片，塑膠部30為行動電話外殼等 。基體20於其與塑膠部30之結合面201上形成有親水性之 奈米結構203。本實施方式中，親水性之奈米結構203為 一連續齒形結構。奈米結構203之深度h為10〜100奈米， 節距d為10~500奈米，表面粗糙度為卜10奈米。塑膠部 30之部分材質填充於奈米結構203内，從而將基體20與塑 膠部30緊密固定結合在一起，形成一體結構。 [0009] 基體20之材質包括金屬、合金、玻璃、陶瓷、搪瓷等。 金屬材質可為鎮、銘、鐵等，合金材質可為鎂合金、銘 合金等。奈米結構203之具體結構，需根據塑膠部30之材 質力學特性而具體設置，其主要目的為使該奈米結構203 親水化，從而使基體20與塑膠部30—體成型達到增加其 二者之間之結合強度。 [0010] 請同時參見圖3，本發明之殼體100製造方法步驟如下： [0011] 步驟301中，提供基體20，該基體20材質包括金屬、合金 、陶瓷、搪瓷或玻璃，基體20具有結合面201 ; [0012] 步驟302中，於基體20之結合面201形成有親水性之奈米 結構203。本實施方式中採用雷射之加工方法形成奈米結 099127505 表單編號A0101 第4頁/共11頁 0992048330-0 201210432 構203。 [0013] Ο [0014] ❹ [0015] 採用雷射使物體表面親水化之加工方法包括以下步驟： 首先提供欲使其表面具有親水性之一待加工基體，該基 體材質包括金屬、合金、陶瓷、搪瓷或玻璃等；提供一 雷射源，例如’可採用推敍記銘石權石（Nd-YAG)雷射器 ，或採用飛秒雷射器；將該雷射源產生之雷射光束照射 於該基體之結合面201 ’使得一具有親水性之奈米結構 203形成於結合面201 °其中’該種用雷射源加工之方法 可控制使雷射源輸出之高強度雷射聚焦至待加工之物體 上，通過電腦控制使該待加工物體表面形成預定形狀。 由於雷射焦點處之功率密度高違〜1012瓦/平方釐米 ，溫度高達1萬攝氏度以上，使待如工材質暫態熔化、氣 化。 步驟303中，將形成奈米結構203之基體20置於成型模具 (未圖示）内’注入熔融塑膠。部分塑膠材質成型於奈米 結構203表面，冷卻後，最終使塑膠部30與基體20緊密結 合形成殼體100 f ？二 本發明之殼體100之基體20用於與塑膠部30之結合之結合 面201上形成有親水性之奈米結構203，使結合面201之 表面自由能降低，從而使塑膠部30更容易與基體2〇之材 質結合起來’故提高了殼體1〇〇之基體2〇與塑膠部30之結 合強度。並且，奈米結構203之尺寸較小，人之肉眼幾乎 看不到，不會影響基體2〇本身之結構強度。另，塑膠部 30與基體20之結合近似於面結合，故，無需設置鼓入卡 合結構，有利於薄形化，能夠適應現在電子裝置輕薄化 099127505 表單編號A0101 第5頁/共n頁 0992048330-0 201210432 之需求。 [0016] 可理解，本發明用雷射方法加工物體表面使其具有親水 性所得之奈米表面結構可進一步包括其他形狀結構如連 續梯形結構、連續矩形結構或連續駝峰形結構。 [0017] 可理解，該親水性之奈米結構203不限於形成於之結合面 201之全部區域，也可選擇性地形成於結合面201之部分 區域。 [0018] 綜上所述，本發明確已符合發明專利之要件，遂依法提 出專利申請。惟，以上所述者僅為本發明之較佳實施方 式，自不能以此限制本案之申請專利範圍。舉凡熟悉本 案技藝之人士援依本發明之精神所作之等效修飾或變化 ，皆應涵蓋於以下申請專利範圍内。 【圖式簡單說明】 [0019] 圖1係本發明之殼體之剖視圖。 [0020] 圖2係圖1中殼體之基體與塑膠部結合處之局部放大圖。 [0021] 圖3係圖1中殼體之製造方法之流程圖。 【主要元件符號說明】 [0022] 殼體 1 0 0 [0023] 基體 2 0 [0024] 結合面2 0 1 [0025] 奈米結構2 0 3 [0026] 塑膠部3 0 099127505 表單編號A0101 第6頁/共11頁 0992048330-0201210432 VI. Description of the Invention: [Technical Field of the Invention] [0001] The present invention relates to a casing and a method of manufacturing the same. [Prior Art] [0002] Metals and plastics are widely used in electronic products because of their good water resistance, corrosion resistance and mechanical properties. However, since the metal and plastic parts are difficult to be tightly fixed by only the surface combination, it is generally necessary to provide an adhesive layer in the middle to connect the fixed base and the plastic part. However, in this structure, the bonding strength between the metal and the plastic portion is not high, and the I bond strength is further lowered as the adhesive layer ages after long-term use. SUMMARY OF THE INVENTION [0003] In view of the above, it is necessary to provide a housing having a high bonding strength and a method of manufacturing the same. [0004] A casing comprising a base body and a plastic portion integrally formed with the base body, the base body including a joint surface connected to the plastic portion, the joint surface being formed with a hydrophilic nanostructure. [0005] A method of manufacturing a casing, comprising the steps of: providing a substrate having a bonding surface; forming a hydrophilic nanostructure on the bonding surface; placing the substrate in a molding die, injecting a molten plastic The material is formed on the joint surface to form a plastic part, and after cooling, the shell is formed. [0006] A hydrophilic nanostructure is formed on the bonding surface of the base of the casing, so that the surface free energy of the bonding surface is reduced, so that the plastic portion is more easily combined with the material of the substrate, thereby improving the base of the casing and The bonding strength of the plastic part. 099127505 Form No. A0101 Page 3 of 11 0992048330-0 201210432 [Embodiment] The casing of the present invention and its manufacturing method will be further described in detail below with reference to the accompanying drawings and embodiments. Referring to FIGS. 1 and 2, a housing 100 according to a preferred embodiment of the present invention forms a plastic structure 30 on a base 20 to form a one-piece structure. The base body 20 and the plastic part 30 can be designed in different shapes according to practical applications, such as the base body 20 as a conductive sheet in a mobile phone, and the plastic part 30 being a mobile phone case or the like. The base body 20 is formed with a hydrophilic nanostructure 203 on its bonding surface 201 with the plastic portion 30. In the present embodiment, the hydrophilic nanostructure 203 is a continuous tooth structure. The depth h of the nanostructure 203 is 10 to 100 nm, the pitch d is 10 to 500 nm, and the surface roughness is 10 nm. A part of the material of the plastic portion 30 is filled in the nanostructure 203, so that the base 20 and the plastic portion 30 are tightly fixedly bonded together to form an integral structure. [0009] The material of the base 20 includes metal, alloy, glass, ceramic, enamel, and the like. The metal material can be town, Ming, iron, etc., and the alloy material can be magnesium alloy, Ming alloy, and the like. The specific structure of the nanostructure 203 is specifically set according to the mechanical properties of the plastic part 30, and its main purpose is to hydrophilize the nanostructure 203, so that the base 20 and the plastic part 30 are integrally formed to increase the two. The strength of the bond between. [0010] Please refer to FIG. 3 at the same time, the manufacturing method of the housing 100 of the present invention is as follows: [0011] In step 301, a base 20 is provided, the base 20 material comprises a metal, an alloy, a ceramic, an enamel or a glass, and the base 20 has a combination. [0012] In step 302, a hydrophilic nanostructure 203 is formed on the bonding surface 201 of the substrate 20. In this embodiment, a laser processing method is used to form a nano-knot. 099127505 Form No. A0101 Page 4 of 11 0992048330-0 201210432 Structure 203. [0013] 加工 [0015] A processing method for hydrophilizing an object surface by using a laser includes the following steps: First, providing a substrate to be processed having a surface to be hydrophilic, the substrate material including a metal, an alloy, and a ceramic , enamel or glass; provide a laser source, such as 'can use the Nd-YAG laser, or use a femtosecond laser; the laser beam generated by the laser source Irradiating the bonding surface 201' of the substrate such that a hydrophilic nanostructure 203 is formed on the bonding surface 201°. The method of processing with a laser source can control the high-intensity laser output of the laser source to be focused to On the object to be processed, the surface of the object to be processed is formed into a predetermined shape by computer control. Because the power density at the laser focus is high, it is ~1012 watts/cm 2 , and the temperature is up to 10,000 degrees Celsius, so that the material to be melted and vaporized temporarily. In step 303, the substrate 20 forming the nanostructure 203 is placed in a molding die (not shown) to inject molten plastic. A portion of the plastic material is formed on the surface of the nanostructure 203. After cooling, the plastic portion 30 is finally tightly bonded to the substrate 20 to form the housing 100 f ? The base 20 of the casing 100 of the present invention is formed with a hydrophilic nanostructure 203 on the bonding surface 201 for bonding with the plastic portion 30, so that the surface free energy of the bonding surface 201 is reduced, thereby making the plastic portion 30 easier. In combination with the material of the base member 2', the bonding strength between the base 2' of the casing 1 and the plastic portion 30 is improved. Moreover, the size of the nanostructure 203 is small, and the human eye is hardly visible, and does not affect the structural strength of the substrate 2 itself. In addition, the combination of the plastic part 30 and the base body 20 is similar to the surface combination, so that it is not necessary to provide a bulging and engaging structure, which is advantageous for thinning, and can be adapted to the current slimness of the electronic device. 099127505 Form No. A0101 Page 5 / Total n Page 0992048330 -0 201210432 Requirements. It will be appreciated that the present invention utilizes a laser method to machine an object surface to render it hydrophilic. The resulting nanosurface structure may further comprise other shape structures such as a continuous trapezoidal structure, a continuous rectangular structure or a continuous hump-shaped structure. It is to be understood that the hydrophilic nanostructure 203 is not limited to the entire region of the bonding surface 201, and may be selectively formed in a portion of the bonding surface 201. [0018] In summary, the present invention has indeed met the requirements of the invention patent, and the patent application is filed according to law. However, the above description is only a preferred embodiment of the present invention, and it is not possible to limit the scope of the patent application of the present invention. Equivalent modifications or variations made by persons skilled in the art in light of the spirit of the invention are intended to be included within the scope of the following claims. BRIEF DESCRIPTION OF THE DRAWINGS [0019] FIG. 1 is a cross-sectional view of a casing of the present invention. 2 is a partial enlarged view of a joint between a base body and a plastic part of the housing of FIG. 1. [0021] FIG. 3 is a flow chart of a method of manufacturing the housing of FIG. 1. [Description of main component symbols] [0022] Housing 1 0 0 [0023] Base 2 0 [0024] Bonding surface 2 0 1 [0025] Nanostructure 2 0 3 [0026] Plastic part 3 0 099127505 Form No. A0101 No. 6 Page / Total 11 pages 0992048330-0