201040004 六、發明說明： 【發明所屬之技術領域】 本發明是有關於一種接合方法，特別是指—種異 料成型結合方法。 ' 【先前技術】 , 陶瓷材料是一種具有優異的熱特性、抗腐蝕性、及抗 磨耗性的材料，因此，被廣泛的應用在電子零件、電子裝 置、引擎，或是化學工廢中的結構元件上。特別是在一般 〇 性電子產品上’由於陶究特殊的質感及其具有高硬度 不易刮傷的特點，更是受到一般消費者的喜愛。 然而，以陶竞材料製成之元件的缺點就是脆性太高， 因此，經外力碰擊後容易脆裂；而為了改善陶莞元件易脆 的缺點，提高陶竟元件的結構強度，因此會利用高分子材 料製成的補強層貼合在陶眘亓杜本 j尤70件表面’利用結合在陶瓷元 件表面的補強層吸收碰揸時的應力，而提升陶竟元件的财 衝擊性；但是，經燒結後之 ^ ^ <闹无70件表面由於具有高細緻 ϋ 度及平滑度，因此與其它不η +从上丨^ 匕不同之材料進行貼合時之接合性 差，而容易剝離或脫落。 1^1 ΙΡϋ Μ r；又吾陶瓷材料與其 料構成之元件之間的接合性 的方法，改善一般陶瓷材料的 易脆性’以增加其實用性，每 Κ為此技術領域者不斷思考改 良的方向。 【發明内容】 因此，本發明之目的， 即在提供一種適用於異質材料 3 201040004 間結合’特別是陶 成型接合方法。 才子塑料間結合的異質材料 此外，本發明之 — 材料間結合，特幻a 的，即在提供一種適用於異質 材料結合-分子㈣4収其它異質 於是’本發明— 個步驟。 種異貝材料成型接合方法包含以下幾 =準備步驟，準備—由陶瓷材料構成的基材。 -呈右—其 步驟’自該基材表面加玉，令該基材形成 土底及~形成在該基底之微結構的第一基材，且 該微結構具有複數個孔穴。 且 置入步驟，將該第一基材以不具有該微結構之 面朝向該成型模具並製人該成型模具的-第-模穴中， '、中a成型模具還具有—與該第—模穴相配合的第二模 八*該成型拉具合模使該第一、二模穴彼此配合時，該 第基材與δ亥第二模穴形成—間$。 ▲最後，合模步驟，將該成型模具合模，並將一液態之 冋分子塑料注入該間隙，讓該高分子塑料填置入該等孔穴 中，之後令該高分子塑料固化形成一高分子層，即可完成 該異質材料成型接合方法。 又本發明一種異質材料成型接合方法包含以下五個 步 首先’準備一由陶瓷材料構成的基材。 接著，自该基材表面加工，令該基材形成一具有一基 201040004 一基材，且該微結 底及一形成在該基底表面之微結構的第 構具有複數個孔穴。 …'後，將該第-基材以不具有該微結構之表面朝向〜 成型模具並製人該成型模具的—第_模穴中，.其中，該成 型模具還具有一與該第一模穴相配合的第二模穴。 接著，再將一第二基材製入該第二模穴中、，當該成型 模具合模時，該第-、二基材之間會形成一間隙。201040004 VI. Description of the Invention: TECHNICAL FIELD OF THE INVENTION The present invention relates to a bonding method, and more particularly to a method of forming a foreign material. [Prior Art] Ceramic materials are materials with excellent thermal properties, corrosion resistance, and abrasion resistance. Therefore, they are widely used in electronic components, electronic devices, engines, or chemical waste structures. On the component. Especially in general enamel electronic products, it is popular among consumers because of its special texture and its high hardness and scratch resistance. However, the disadvantage of the components made of Tao Jing material is that the brittleness is too high, so it is easy to be brittle after being hit by external force; and in order to improve the fragility of the ceramic component, and improve the structural strength of the ceramic component, it will be utilized. The reinforcing layer made of polymer material is attached to the surface of Tao Shendu Du Benj, especially 70 pieces, which utilizes the reinforcing layer combined with the reinforcing layer on the surface of the ceramic component to absorb the stress when the collision is encountered, thereby improving the financial impact of the ceramic component; however, After sintering, there are no more than 70 surfaces with high fineness and smoothness. Therefore, when they are bonded to other materials that are not different from 丨+, they have poor bondability and are easily peeled off or peeled off. . 1^1 ΙΡϋ Μ r; and the method of bonding between the ceramic material and the components of the material to improve the brittleness of the general ceramic material to increase its practicability, and every technologist constantly thinks about the direction of improvement. . SUMMARY OF THE INVENTION Accordingly, it is an object of the present invention to provide a method of bonding, particularly ceramic molding, for a heterogeneous material 3 201040004. In addition, the present invention - a combination of materials, special illusion a, that is to provide a suitable for heterogeneous material binding - molecules (four) 4 other heterogeneous then 'the present invention - a step. The isobar material forming joining method comprises the following steps: preparing a substrate made of a ceramic material. - is right - the step of adding jade from the surface of the substrate to form the substrate and the first substrate formed on the microstructure of the substrate, and the microstructure has a plurality of holes. And inserting the first substrate into the mold cavity without the microstructure facing the molding die and forming the molding die, the ', a a molding die further has — and the first die The second mold of the cavity is matched with the mold. When the first and second mold cavities are matched with each other, the first substrate forms a second pocket with the second mold cavity. ▲ Finally, in the mold clamping step, the molding die is closed, and a liquid molecular plastic is injected into the gap, and the polymer plastic is filled into the holes, and then the polymer plastic is solidified to form a polymer. The layer, the method of forming the heterogeneous material forming joint can be completed. Further, a heterogeneous material forming joining method of the present invention comprises the following five steps: First, preparing a substrate composed of a ceramic material. Next, the surface of the substrate is processed to form a substrate having a substrate 201040004, and the microstructure and the microstructure of a microstructure formed on the surface of the substrate have a plurality of holes. After the 'substrate, the first substrate is formed in the first cavity of the molding die without the surface of the microstructure facing the molding die, wherein the molding die further has a first cavity Matching second cavity. Then, a second substrate is further formed into the second cavity, and when the molding die is closed, a gap is formed between the first and second substrates.
〇 、最後，將該成型模具合模，並將—液態之高分子塑料 注入該間隙，讓該高分子塑料填置入該等孔穴中，之後人 該高分子塑料固化形成-高分子層，即可完成該異質材; 成型接合方法。 本發明之功效在於：藉由加工方式讓陶究基材形成— 具有孔穴的微結構，並同時利用埋人成型方式讓液態之高 :子塑料填覆於孔穴中’形成可與該微結構緊密結合的高 ，子層’而可改善㈣材料與高分子材料之間的密著性問 題並改善陶瓷的易脆性，而有效增加其實用性。 【實施方式】 、有關本發明之前述及其他技術内容、特點與功效，在 以下配合參考圖式之兩個較佳實施例的詳細說明中，將可 清楚的呈現。 參閱圖1，本發明一種異質材料成型接合 較佳實施例是包含以下四個步驟。 首先進行準備步驟u’準備一由陶竞材料構成之基 材’該基材具有一表面。 201040004 配合參閱圖2,接著進行加工步驟12，自該基材表面 加工，形成一如圖2所示具有一基底31及一形成在該基底 31表面之微結構32的第一基材3，且該微結構32具複數 個孔穴321，其中圖2僅為示意結構，該微結構32會依加 工方式之不同呈現不同之形態。 要說明的是，當該微結構32的平均高度小於該第一基 材3厚度的1/2時，該第一基材3本身的結構強度會優於該 微結構32的平均高度大於該第一基材3厚度1/2時的結構 強度，而另一方面來說，當該微結構32的粗糙度的大小與 高分子塑料與該微結構32之接觸面積多募相關’也會影響 該第一基材3與異質材料（高分子塑料）間的結合強度，因 此，較佳地，該微結構32的平均高度不大於該第一基材3 厚度的1/2 ’且粗糖度（Ra)不小於〇1μιη。 該第-基材3的微結構32是選自用機械加工、放電加 工、超音波加卫、砂磨加工、雷射加卫，或是利用化學水 解方式形成。 具體的說’以砂磨加工方式而言：是先在該基材表面 形成-光阻層後’再以微影方式將部分光阻層移除形成一 具預定圖案的遮罩’接著準備由礙化⑦（SiC)及氧化|g(Al2〇3) 所構成的研磨砂材對未被該遮罩彼覆的基材表面進行研磨 加工，之後再將該遮罩移除，即可形成具有複數個孔穴的 微結構，且該等孔穴的分布可配合該遮罩的圖案進行規劃 設計。 工而言：該等孔穴可以利用轉速大於 又，以機械加 201040004 • 7〇’〇〇〇rprn的兩迷研磨及鑽頭的配合於該基材表面加工形 . 成此外，還可再配合研磨角度的變化而形成具有彎曲角 度之孔八而可讓高分子塑料於滲入該等孔穴固化後的卡 固f更為提升，要說明的是，配合鑽頭的設計而可得到例 如錐形體、橢圓3丨 ^ ^ _ w孔，、方立面體等不同形狀及不同孔徑的 孔 較“地，该鑽頭的直徑是介於20μιη〜200μΓη之間， 而使得加工成型出的該等孔穴的孔徑介於20μιη〜200μιη之 間。Finally, the molding die is closed, and the liquid polymer is injected into the gap, and the polymer plastic is filled into the holes, and then the polymer plastic is solidified to form a polymer layer, that is, The heterogeneous material can be completed; a molding joining method. The effect of the invention is that the ceramic substrate is formed by processing - the micro-structure with holes, and at the same time, the liquid is high by using the buried molding method: the sub-plastic is filled in the cavity to form a tight structure with the micro-structure The combination of high and sub-layers can improve the adhesion between the material and the polymer material and improve the brittleness of the ceramic, thereby effectively increasing its practicability. The above and other technical contents, features and effects of the present invention will be apparent from the following detailed description of the preferred embodiments of the invention. Referring to Figure 1, a preferred embodiment of a heterogeneous material forming joint of the present invention comprises the following four steps. First, a preparation step u' is prepared to prepare a substrate composed of a ceramic material. The substrate has a surface. 201040004, referring to FIG. 2, followed by processing step 12, processing from the surface of the substrate to form a first substrate 3 having a substrate 31 and a microstructure 32 formed on the surface of the substrate 31 as shown in FIG. The microstructure 32 has a plurality of holes 321 , wherein FIG. 2 is only a schematic structure, and the microstructures 32 will exhibit different shapes depending on the processing mode. It should be noted that when the average height of the microstructure 32 is less than 1/2 of the thickness of the first substrate 3, the structural strength of the first substrate 3 itself is better than the average height of the microstructure 32 is greater than the first The structural strength of a substrate 3 having a thickness of 1/2, and on the other hand, when the roughness of the microstructure 32 is related to the contact area between the polymer plastic and the microstructure 32, The bonding strength between the first substrate 3 and the heterogeneous material (polymer plastic), therefore, preferably, the average height of the microstructure 32 is not more than 1/2 ' of the thickness of the first substrate 3 and the roughness (Ra) ) Not less than 〇1μιη. The microstructure 32 of the first substrate 3 is selected from the group consisting of machining, discharge machining, ultrasonic blasting, sanding, laser blasting, or chemical hydrolysis. Specifically, 'in the case of sanding processing: after forming a photoresist layer on the surface of the substrate, then removing some of the photoresist layer by lithography to form a mask with a predetermined pattern' is then prepared by Abrasive 7 (SiC) and oxidized |g (Al2〇3) are used to grind the surface of the substrate that is not covered by the mask, and then remove the mask to form The microstructure of the plurality of holes, and the distribution of the holes can be planned in accordance with the pattern of the mask. In terms of work: these holes can be used with a rotating speed greater than that, and mechanically plus 201040004 • 7〇'〇〇〇rprn's two grinding and bit matching on the surface of the substrate. In addition, it can also be used with the grinding angle. The change of the hole 8 is formed to have a bending angle, and the fixing of the polymer plastic after the penetration into the holes is further improved. It is to be noted that the design of the drill bit can be obtained, for example, by a cone or an ellipse. ^ ^ _ w hole, square face and other holes of different shapes and different apertures are more than "ground, the diameter of the drill bit is between 20μηη~200μΓη, so that the aperture of the holes formed by machining is between 20μιηη Between ~200μιη.
再以雷射加工而言：可利用能量大於15W的雷射在該 基材表面進行加卫’當該基材表面收到雷射的能量照射時 該基材鍵結較脆弱處會被燒蝕破壞，再經過冷卻後即可带 成具有複數個不規則形狀之孔穴的微結構，而可讓高分子7 塑料於渗人騎不規則形狀之孔穴固化後的卡固性更為提 升。 又，以放電加式而f :是先將該陶莞基材表面度 上一層導電層後，再利用放電加工方式對該鑛有導電層的 的基材加工，而形成該具有複數孔穴的微結構，要說明的 是’上述該等孔穴可利用電極形狀的設計及電流的控制而 可得到例如錐形體、橢圓孔、六方立面體等不同形狀及不 同孔k的孔人’較佳地，該等孔穴的孔徑介於卿m〜細 之間。 又，再以化學水魅^7 T 4 t A β 鮮力工方式而s，疋將該由陶瓷構成 的基材浸置在一水解液中，禮陶这 ^ T 讓陶£結構經水解破壞後產生 不規則的孔穴，而可讜离八工 j承回刀子塑科於滲入該孔穴中而進一 7 201040004 步提升固化形成之高分子層與該第一基材結合性，要說明 的疋，上述該微結構可利用水解液的pH值控制而可得到不 同形狀及不同孔徑的孔穴，較佳地，當pH值控制在8〜9之 間時，該等凹洞的孔徑介κ20μηι〜2〇〇μιη之間。 接著進行置入步驟13,將上述形成有該微結構之第一 基材以不具有該微結構之表面朝向該成型模具並置入該成 型模具中，且該成型模具於合模後會在該第一基材表面與 該模具間形成一間隙。 最後進行合模步驟14,將該成型模具合模，並將一液 態之高分子塑料注入該間隙中，讓該高分子塑料與該微結 構接觸並填覆該等孔穴，之後將該高分子塑料固化形成一 高分子層，即完成該異質材料成型接合方法。 詳細的說，該高分子塑料是選自熱塑性高分子或熱固 性高分子材料，以埋入成型方式將融熔後之高分子塑料注 入该間隙中，令該高分子塑料可完全包覆與該高分子塑料 接觸之該第一基材表面並滲入該等微結構的孔穴中，之後 再將該高分子塑料冷各p、匕成型I即可在該第一基材表 面得到一由預定高分子塑料製得之高分子層，完成該異質 材料的結合方法’而得到一結合性佳且有效提升該陶曼基 材之結構強度的陶瓷、高分子異質材料結合元件。 參閱圖3,本發明一種異質材料成型接合方法的一第二 較佳實施例是包含五個步驟。 首先，進行準備步驟21，準備—由陶瓷材料構成之基 材’該基材具有一表面。 201040004 接著，進行加工步驟22，自該基材表面加工，形成一 具有一基底及一形成在該基底表面之微結構的第一基材， 且該微結構具有複數個孔穴’由於該微結構的結構特徵及 形成該微結構的方式與該第一較佳實施例相同，因此不再 多加贅述。 接著進行置入一步驟23,將上述形成有該微結構之第 一基材以不具有該微結構之表面朝向該成型模具並置入該 成型模具中。 〇 詳細的說，該成型模具具有彼此形狀相 互配合的一第 一模穴及一第二模穴，該成型模具於合模後，該第一、二 模穴之間會形成一間隙，且該第一基材係製入該成型模具 的第一模穴中。 再進行置入二步驟24,將一第二基材置入該第二模穴 中，該第二基材的構成材料可選自與該第一基材相同或不 同材料，例如金屬、陶瓷，或塑膠等材料。 最後進行合模步驟25，將該成型模具合模，並將一液 D _之尚分子塑料注入該間隙中，令該高分子塑料可完全包 覆與該高分子塑料接觸之該第一、二基材表面並滲入該第 基材之微結構的孔穴，因此，將該高分子塑料冷卻、固 化成型後，該由陶瓷材料構成的第一基材即可藉由該高分 子層與6亥第一基材之間彼此成無接縫一體成形的緊密結 〇，而得到一結合性佳且可有效提升該陶瓷基材之結構強 度的異質結合元件。 本發明利用开）成微結構而讓該基材具有粗縫界面，並 201040004 同時再利用埋入成型方式注入液態高分子塑料，㈣態高 分子塑料可滲入該微結構的孔穴中而增加與該第一基材的 接觸面積與結合力，最後再將高分子塑料固化後即可形成 與該陶竟基材表面緊密结的古八2 刊衣四冢山、.0。的円分子層，而完成該異質材 料成型接合方法，不僅可提升異質材料之間的接著性且可 提升結合後之陶竟結合元件的結構強度，故確實可達到本 發明之目的。 惟以上所述者，僅為本發明之較佳實施例而已，當不 能以此限定本發明實施之範圍’即大凡依本發明申請專利 範圍及發明說明内容所作之簡單的等效變化與修飾皆仍 屬本發明專利涵蓋之範圍内。 【圖式簡單說明】 圖1是一流程圖，說明本發明異質材料成型接合方法 的第一較佳實施例； 圖2是一示意圖，說明利用該較佳實施例之一加工步 驟所製成之-第-基材之結構；及 圖3 & 矛呈圖’說明本發明異質材料成型接合方法 的第二較佳實施例。 10 201040004 【主要元件符號說明】 11 準備步驟 24 置入二步驟 12 加工步驟 25 合模步驟 13 置入步驟 3 第一基材 14 合模步驟 31 基底 21 準備步驟 32 微結構 22 加工步驟 321 孔穴 23 置入一步驟 〇In terms of laser processing, a laser with an energy greater than 15 W can be used to enhance the surface of the substrate. When the surface of the substrate is irradiated with laser energy, the substrate is weakened and ablated. After being destroyed, it can be brought into a microstructure having a plurality of irregularly shaped cavities, and the polymer 7 plastic can be more rigidly cured after the infiltrated person rides the irregular shaped cavity. Further, in the case of discharge addition, f: firstly, a conductive layer is formed on the surface of the base material of the ceramics, and then the base material having the conductive layer is processed by an electric discharge machining method to form the microstructure having the plurality of holes. It is to be noted that the above-mentioned holes can be obtained by using the shape of the electrode and the control of the current to obtain a hole of a different shape and a different hole k such as a cone, an elliptical hole or a hexagonal facade. The pore size of the pore is between the m and the fine. In addition, the chemical water glaze is used to immerse the substrate made of ceramics in a hydrolyzate, and the ceremonial structure of the terracotta is destroyed by hydrolysis. After the generation of irregular holes, but can be separated from the eight workers j to return the knife plastic infiltration into the hole and into a 7 201040004 step to enhance the formation of the polymer layer and the first substrate bonding, to explain, The microstructure can be controlled by the pH of the hydrolyzate to obtain pores having different shapes and different pore sizes. Preferably, when the pH is controlled between 8 and 9, the pores of the pores are κ20μηι 2 〇 Between ιμιη. Next, the placing step 13 is performed, the first substrate on which the microstructure is formed is faced with the surface of the microstructure without the microstructure, and placed in the molding die, and the molding die is after the mold clamping. A gap is formed between the surface of the first substrate and the mold. Finally, the mold clamping step 14 is performed, the molding die is closed, and a liquid polymer plastic is injected into the gap, and the polymer plastic is brought into contact with the microstructure and the holes are filled, and then the polymer plastic is filled. Curing to form a polymer layer, that is, the method of forming and joining the heterogeneous material is completed. In detail, the polymer plastic is selected from a thermoplastic polymer or a thermosetting polymer material, and the melted polymer plastic is injected into the gap by a buried molding method, so that the polymer plastic can be completely coated and high. The surface of the first substrate contacting the molecular plastic is infiltrated into the pores of the microstructures, and then the polymer plastic is cooled and p-shaped, and a predetermined polymer plastic is obtained on the surface of the first substrate. The obtained polymer layer completes the bonding method of the heterogeneous material to obtain a ceramic or polymer heterogeneous material binding element which is excellent in combination and effectively improves the structural strength of the Tauman substrate. Referring to Figure 3, a second preferred embodiment of a method of forming a heterogeneous material forming joint of the present invention comprises five steps. First, a preparation step 21 is carried out to prepare a substrate composed of a ceramic material. The substrate has a surface. 201040004 Next, a processing step 22 is performed to process a surface of the substrate to form a first substrate having a substrate and a microstructure formed on the surface of the substrate, and the microstructure has a plurality of holes 'because of the microstructure The structural features and the manner in which the microstructures are formed are the same as in the first preferred embodiment, and thus will not be further described. Next, a step 23 is performed in which the first substrate on which the microstructure is formed is faced with the surface having the microstructure toward the molding die and placed in the molding die. In detail, the molding die has a first cavity and a second cavity which are mutually matched in shape, and after the molding is clamped, a gap is formed between the first and second cavity, and the molding die The first substrate is formed into the first cavity of the forming mold. And then performing the second step 24, placing a second substrate into the second cavity, the constituent material of the second substrate may be selected from the same or different materials as the first substrate, such as metal, ceramic, Or plastic and other materials. Finally, the mold clamping step 25 is performed, the mold is clamped, and a liquid D _ molecular plastic is injected into the gap, so that the polymer plastic can completely cover the first and second contacts with the polymer plastic. The surface of the substrate penetrates into the pores of the microstructure of the first substrate. Therefore, after the polymer plastic is cooled and solidified, the first substrate made of the ceramic material can be made of the polymer layer and the 6th A substrate is formed into a tight joint integrally formed with each other without seams, thereby obtaining a hetero-bonding element which is excellent in bonding and can effectively improve the structural strength of the ceramic substrate. The invention utilizes the micro structure to make the substrate have a rough joint interface, and 201040004 simultaneously uses the embedded molding method to inject the liquid polymer plastic, and the (four) state polymer plastic can penetrate into the pore of the microstructure to increase The contact area and bonding force of the first substrate, and finally the polymer plastic is solidified to form an ancient eight-two coat of clothing, which is closely related to the surface of the ceramic substrate. The bismuth molecular layer, and the completion of the heterogeneous material forming and joining method, can not only improve the adhesion between the heterogeneous materials, but also improve the structural strength of the bonded ceramic composite elements, so that the object of the present invention can be achieved. However, the above is only the preferred embodiment of the present invention, and the scope of the present invention is not limited thereto. It is still within the scope of the invention patent. BRIEF DESCRIPTION OF THE DRAWINGS FIG. 1 is a flow chart showing a first preferred embodiment of a method for forming a joint of a heterogeneous material according to the present invention; FIG. 2 is a schematic view showing the processing steps of a preferred embodiment of the present invention. - Structure of the first substrate; and Fig. 3 & lanced' illustrates a second preferred embodiment of the method of forming a joint of a heterogeneous material of the present invention. 10 201040004 [Description of main component symbols] 11 Preparation step 24 Placement 2 step 12 Processing step 25 Clamping step 13 Placing step 3 First substrate 14 Clamping step 31 Substrate 21 Preparation step 32 Microstructure 22 Processing step 321 Hole 23 Put in a step 〇
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