TW201209557A - Modular datacenter element and modular datacenter cooling element - Google Patents

Modular datacenter element and modular datacenter cooling element Download PDF

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Publication number
TW201209557A
TW201209557A TW100103692A TW100103692A TW201209557A TW 201209557 A TW201209557 A TW 201209557A TW 100103692 A TW100103692 A TW 100103692A TW 100103692 A TW100103692 A TW 100103692A TW 201209557 A TW201209557 A TW 201209557A
Authority
TW
Taiwan
Prior art keywords
data center
modular data
component
air
modular
Prior art date
Application number
TW100103692A
Other languages
English (en)
Chinese (zh)
Inventor
Cornelis Albert Zwinkels
Original Assignee
Dataxenter Ip B V
Kgg Dataxenter Holding B V
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Dataxenter Ip B V, Kgg Dataxenter Holding B V filed Critical Dataxenter Ip B V
Publication of TW201209557A publication Critical patent/TW201209557A/zh

Links

Classifications

    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00Constructional details common to different types of electric apparatus
    • H05K7/14Mounting supporting structure in casing or on frame or rack
    • H05K7/1485Servers; Data center rooms, e.g. 19-inch computer racks
    • H05K7/1497Rooms for data centers; Shipping containers therefor
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00Constructional details common to different types of electric apparatus
    • H05K7/20Modifications to facilitate cooling, ventilating, or heating
    • H05K7/20709Modifications to facilitate cooling, ventilating, or heating for server racks or cabinets; for data centers, e.g. 19-inch computer racks
    • H05K7/20718Forced ventilation of a gaseous coolant
    • H05K7/20745Forced ventilation of a gaseous coolant within rooms for removing heat from cabinets, e.g. by air conditioning device
    • EFIXED CONSTRUCTIONS
    • E04BUILDING
    • E04HBUILDINGS OR LIKE STRUCTURES FOR PARTICULAR PURPOSES; SWIMMING OR SPLASH BATHS OR POOLS; MASTS; FENCING; TENTS OR CANOPIES, IN GENERAL
    • E04H5/00Buildings or groups of buildings for industrial or agricultural purposes
    • E04H2005/005Buildings for data processing centers

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • General Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Structure Of Telephone Exchanges (AREA)
TW100103692A 2010-02-01 2011-01-31 Modular datacenter element and modular datacenter cooling element TW201209557A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
EP20100152323 EP2354378A1 (en) 2010-02-01 2010-02-01 Modular datacenter element and modular datacenter cooling element

Publications (1)

Publication Number Publication Date
TW201209557A true TW201209557A (en) 2012-03-01

Family

ID=42286678

Family Applications (1)

Application Number Title Priority Date Filing Date
TW100103692A TW201209557A (en) 2010-02-01 2011-01-31 Modular datacenter element and modular datacenter cooling element

Country Status (7)

Country Link
US (1) US20130061624A1 (https=)
EP (2) EP2354378A1 (https=)
CN (1) CN102812192A (https=)
AR (1) AR080097A1 (https=)
IN (1) IN2012DN06568A (https=)
TW (1) TW201209557A (https=)
WO (1) WO2011092333A1 (https=)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI774462B (zh) * 2021-07-06 2022-08-11 勤誠興業股份有限公司 伺服器系統
US11558975B2 (en) 2019-10-28 2023-01-17 Chenbro Micom Co., Ltd. Server system
US11812575B2 (en) 2019-10-28 2023-11-07 Chenbro Micom Co., Ltd. Server system

Families Citing this family (45)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102834787A (zh) * 2009-10-23 2012-12-19 冈田良介 数据中心及用于数据中心的计算机容纳机柜
US8233270B2 (en) * 2009-11-20 2012-07-31 Turbine Air Systems, Ltd. Modular data center
FR2979141B1 (fr) * 2011-08-19 2018-06-15 Ovh Sas Infrastructure technique de centre de donnees
FR2979720B1 (fr) 2011-09-01 2013-08-23 Ovh Sas Conteneur amenage en une infrastructure technique
WO2013119243A1 (en) 2012-02-09 2013-08-15 Hewlett-Packard Development Company, L.P. Heat dissipating system
EP2826347B1 (en) 2012-03-12 2017-10-25 Hewlett-Packard Enterprise Development LP Liquid temperature control cooling
CN102650173A (zh) * 2012-05-24 2012-08-29 上海华甬智能系统有限公司 一种模块式数据中心及其配置方法
AU2013100359B4 (en) * 2012-07-11 2013-11-28 1Space Pty Ltd Modular Building
US8833001B2 (en) * 2012-09-04 2014-09-16 Amazon Technologies, Inc. Expandable data center with movable wall
US9258930B2 (en) * 2012-09-04 2016-02-09 Amazon Technologies, Inc. Expandable data center with side modules
JPWO2014041819A1 (ja) * 2012-09-14 2016-08-18 Gac株式会社 空調システム
EP2901828A4 (en) 2012-09-28 2016-06-01 Hewlett Packard Development Co COOLING ARRANGEMENT
EP2915417B1 (en) 2012-10-31 2017-11-29 Hewlett-Packard Enterprise Development LP Modular rack system
WO2014120182A1 (en) 2013-01-31 2014-08-07 Hewlett-Packard Development Company, L.P. Liquid cooling
ES2523806B1 (es) * 2013-05-31 2015-09-29 Ast Modular, S.L. Centro de procesamiento de datos modular
US9255417B2 (en) * 2014-03-12 2016-02-09 Panduit Corp. Independent aisle containment system
US9723273B2 (en) * 2014-04-16 2017-08-01 Vivint, Inc. Camera with a lens connector
CN105321898A (zh) * 2014-06-03 2016-02-10 住友电木株式会社 金属基座安装基板以及金属基座安装基板安装部件
US11209410B2 (en) * 2014-06-10 2021-12-28 Logan Instruments Corporation Dissolution tester assembly with integrated imaging system
CN104238689B (zh) * 2014-09-12 2018-09-07 北京百度网讯科技有限公司 数据中心及其热空气的排放方法
WO2016053273A1 (en) 2014-09-30 2016-04-07 Hewlett Packard Enterprise Development Lp Modular cooling
US9380727B2 (en) * 2014-10-03 2016-06-28 Dell Products, L.P. Modular information technology (IT) rack and air flow system
WO2016131138A1 (en) * 2015-02-17 2016-08-25 Vert.Com Inc Modular high-rise data centers and methods thereof
CN104837318A (zh) * 2015-05-04 2015-08-12 亚翔系统集成科技(苏州)股份有限公司 一种模块式数据处理中心及其空调方法
WO2017213497A1 (en) * 2016-06-06 2017-12-14 Switch Datacenter Group B.V. Data center and method for cooling said data center
NL2016901B1 (nl) * 2016-06-06 2017-12-13 Switch Datacenter Group B V Datacenter en werkwijze voor het koelen van een dergelijk datacenter
US10736231B2 (en) * 2016-06-14 2020-08-04 Dell Products L.P. Modular data center with passively-cooled utility module
US10609326B2 (en) * 2016-10-21 2020-03-31 TEKVOX, Inc. Self-contained video security system
US11574372B2 (en) 2017-02-08 2023-02-07 Upstream Data Inc. Blockchain mine at oil or gas facility
CN112204335A (zh) 2017-11-17 2021-01-08 北狄空气应对加拿大公司 用于向热负荷提供冷却的混合运行模式
US11375641B2 (en) 2017-11-17 2022-06-28 Nortek Air Solutions Canada, Inc. Blended operation mode for providing cooling to a heat load
DK3550245T3 (da) 2018-04-06 2020-08-17 Ovh Varmeveksleranordning
PL3550244T3 (pl) 2018-04-06 2023-05-02 Ovh Zespół chłodzący i sposób jego instalacji
CN108834363B (zh) * 2018-06-01 2020-07-10 中国移动通信集团设计院有限公司 微模块
US10820452B2 (en) * 2018-07-05 2020-10-27 Baidu Usa Llc Control and optimization of indirect evaporative cooling units for data center cooling
WO2020163968A2 (en) * 2019-02-15 2020-08-20 Scot Arthur Johnson Transportable datacenter
CA3139776A1 (en) 2019-05-15 2020-11-19 Upstream Data Inc. Portable blockchain mining system and methods of use
DE102019115126A1 (de) * 2019-06-05 2020-12-10 Cloud & Heat Technologies GmbH Rechenzentrum-Modul und Verfahren
CA3076653A1 (en) 2020-03-21 2021-09-21 Upstream Data Inc. Portable blockchain mining systems and methods of use
WO2021199075A1 (en) * 2020-04-02 2021-10-07 Lightspeedai Labs Private Limited A system and method for enabling reconfigurable and flexible modular compute
JP6991382B1 (ja) * 2021-06-07 2022-01-12 Dmg森精機株式会社 工作機械
GB2607906A (en) * 2021-06-14 2022-12-21 Dataqube Global Ltd Modular data centre
CN114025596A (zh) * 2022-01-06 2022-02-08 广东欢联电子科技有限公司 一种模块化多功能数据中心的基础设施
GB2627011A (en) * 2023-02-13 2024-08-14 Lacey & Saltykov Arch Ltd A pair of vertically-adjacent storeys for a building configured for mixed laboratory use
EP4518594B1 (en) * 2023-08-31 2025-12-17 Ovh Multi-level modular datacenter electric infrastructure and layout configuration

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5586932A (en) * 1993-11-05 1996-12-24 Professional Supply, Inc. Environmental control airhouse with variable output
US6986708B2 (en) * 2002-05-17 2006-01-17 Airfixture L.L.C. Method and apparatus for delivering conditioned air using dual plenums
CA2653817C (en) * 2006-06-01 2012-10-16 Google Inc. Modular computing environments
US7430118B1 (en) * 2007-06-04 2008-09-30 Yahoo! Inc. Cold row encapsulation for server farm cooling system
US9480186B2 (en) * 2007-12-18 2016-10-25 International Business Machines Corporation Apparatus and method for facilitating air cooling of an electronics rack
US20090186572A1 (en) * 2008-01-22 2009-07-23 Gerald Farrell Air distributing apparatus for reducing energy consumption
US20090229194A1 (en) 2008-03-11 2009-09-17 Advanced Shielding Technologies Europe S.I. Portable modular data center
US8763414B2 (en) * 2008-03-31 2014-07-01 Google Inc. Warm floor data center
KR101075076B1 (ko) * 2008-05-16 2011-10-21 코오롱인더스트리 주식회사 광학 시트
US9008844B2 (en) * 2008-06-09 2015-04-14 International Business Machines Corporation System and method to route airflow using dynamically changing ducts
US8251784B2 (en) * 2008-06-09 2012-08-28 International Business Machines Corporation System and method to route airflow through dynamically changing ducts

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US11558975B2 (en) 2019-10-28 2023-01-17 Chenbro Micom Co., Ltd. Server system
US11812575B2 (en) 2019-10-28 2023-11-07 Chenbro Micom Co., Ltd. Server system
TWI774462B (zh) * 2021-07-06 2022-08-11 勤誠興業股份有限公司 伺服器系統

Also Published As

Publication number Publication date
EP2531673A1 (en) 2012-12-12
CN102812192A (zh) 2012-12-05
AR080097A1 (es) 2012-03-14
EP2354378A1 (en) 2011-08-10
WO2011092333A1 (en) 2011-08-04
IN2012DN06568A (https=) 2015-10-23
US20130061624A1 (en) 2013-03-14

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