201207793 . 六、發明說明： 【發明所屬之技術領域】 其特別是指一種觸 [0001] 本發明係有關於一種顯示面板 控顯示面板。 【先前技術】 [0002] ◎ 〇 099125933 按，現今科技的進步，因此電子廠家為了因應民眾 的需求而發展出許多電子裝置，該些電子裝置的功能越 來越為強大，而帶給現今民眾在生活上許多的便利性。 現今各種電子裝置大都提供有—面板，以供使用者觀看 電子裝置所提供之功能，以讓使用者依據面板所顯示之 功能，而操作電子裝置之按鍵而執行電子裝置之功能， 但是此種操作方式係有-定的不便性。現今電子裝置廠 商為了更制於錢者料電子m提供之顯示 面板大都為觸控顯示面板’觸控顯示面杈是一種典型的 座標輸人裝置’使用者可藉由簡單的翻觸控顯示面板 所顯示^功能，即可簡錢行電子裝置所提供之功能。 隨著經濟提昇„業結構改變，現今科技日新月異 ’對於產業結構產生很大的改變，也造成衝擊，為符合 世界潮流，使企#能永續經營，唯⑽低生產成本，提 南整體經營績效，才可純企㈣爭力。近年來觸控顯 業發展迅速’也是繼半導體之後帶動台灣經濟 成長的重要產業。現今觸控顯示面板都是由單—個顯示 單—個觸控模組裝配而成。由於顯示模組跟觸 控^旦都是單—個個體，因此在生產上必需加以組裝才 ::控顯示面板，如此會增加生產成本。此外，由 表單編號二面板個顯示模組與單—個觸控模組 第3頁/共42頁 0992045507-0 201207793 組裝而成’如此即會增加觸控顯示面板之整體厚度，而 不符合目前電子裝置講餘、薄、短、小的趨勢。 請參閱第-圖，係習用觸控顯示面板之剖視圖。如 圖所不’習用觸控顯示面板包含顯示模組與觸控模組， 顯不模組包含—第一基層10’、一第二基層12,、一彩 色濾光片14’、一第一導電層16，一第二導電層以，與 -膠框19。第-基層1〇’相對應於第二基層12，，彩 色濾光片14設置於第一基層1〇，，第一導電層16，與 第二導電層18’分別設置於彩色瀘光片14，貞第二基層 12 ，膠框19，設置吟第一導電層16，與第二導電層18 ，之間。 復參閱第一圖，觸控模組包含一第一基層20’ 、一 第二基層22’、一第一導電層26，一第二導電⑽，與 一膠框29，。第一基層2〇，相對應於第二基層22,，第 一導電層26與第二導電層28，分別設置於第一基層2〇 ，與第二基層22，，膠框29’設置於第一導電層26，與 第一導電層28之間。由上述可!知，習知觸控顯示面板 是由單一個顯示模組與單一個觸控模組組裝而成，所以 會增加組裝費用，而提高生產成本，且會增加觸控顯示 面板的整體厚度。此外，由於觸控模組之製程精度不高 ’所以第一導電層26’與第二導電層28’之訊號線的線 寬較大，所以訊號線的數量即會受到一定限制，如此即 會限制觸控模組的觸控精度。 099125933 因此，本發明即在針對上述問題而提出一種觸控顯 示面板，其不僅可改善上述習用缺點，又可改良傳統觸 控模組之訊號線之線寬的限制，而提高觸控顯示面板的 表單編號A0101 第4頁/共42頁 0992045507-0 201207793 觸控精度，以解決上述問題。 【發明内容】 [0003] 本發明之主要目的，在於提供一種觸控顯示面板， 其不需組裝單一個顯示模組與單一個觸控模組，而僅包 含三個基層，所以可降低生產成本以及整體厚度。 本發明之另一目的，在於提供一種觸控顯示面板， 其可提高觸控模組之導電層之訊號線的精度，而提高觸 控顯示面板之觸控精度。 本發明之又一目的，在於提供一種觸控顯示面板， Ο 其整合觸控晶片於觸控顯示面板，以降低電子裝置之電 路板與觸控顯示面板間之電路的複雜度，以及降低電路 佔用電子裝置之電路板之面積，進而降低成本。 本發明之又一目的，在於提供一種觸控顯示面板， 其藉由設置金屬層於導電層，以達到降低阻抗與增加信 號傳輸穩定性之目的。 本發明觸控顯示面板，其包含有一顯示基層、一共 ο 用基層與一觸控基層，顯示基層具有一第一導電層，共 用基層具有一第二導電層與一第三導電層，而分別位於 共用基層之兩側面，第二導電層對應於第一導電層，觸 控基層具有一第四導電層，第四導電層對應於第三導電 層。由於第二導電層與第三導電層分別設置於共用基層 ，所以本發明之觸控顯示面板僅需要三個基層，而不需 設置四個基層，如此可降低生產成本以及觸控顯示面板 之整體厚度。此外，第三導電層與第四導電層之訊號線 的線寬可降低，而提高第三導電層與第四導電層之訊號 線的精度，進而提高觸控顯示面板之觸控精度。 099125933 表單編號Α0101 第5頁/共42頁 0992045507-0 201207793 【實施方式】 [0004] 茲為使貴審查委員對本發明之技術特徵及所達成 之功效更有進一步之瞭解與認識，謹佐以較佳之實施例 圖及配合詳細之說明，說明如後： 首先，凊參閱第二圖，係本發明觸控顯示面板之一 較佳實施例的剖視圖。如圖所示，本發明之觸控顯示面 板包含一顯示基層10、一共用基層11與一觸控基層12， 共用基層11對應於顯示基層1〇，觸控基層12對應於共用 基層11。顯示基層1〇與共用基層丨丨之—實施例為一玻璃 基板，而觸控基層12$ —實施鋼為膜片，顯示基層具 有一第一導電層13，而一彩色濾光片14設置於顯示基層 1 0與第一導電層13之間。於另一實施例..中，彩色淚光片 14可替換為一金屬層。共用基層u具有一第二導電層15 與一第三導電層16，而分別設置於共用基層丨丨之兩侧面 ，第一導電層15對應於第一導電層13。觸控基層12具有 一第四導電層17，其對應於第三導電層16。第一導電層 13與第一導電層15之間設有一膠框18::且第三導電層μ 與第四導電層17之間設置有j膠框i 9。上述之第一導電 層13、第二導電層15、第三導電層16與第四導電層17分 別包含有複數訊號線，此為此領域技術人員所皆知的技 術’所以在此不再詳述。 由上述可知，由於本發明之觸控顯示面板僅需要顯 示基層10、共用基層11與觸控基層12，所以相較於習用 觸控顯示面板需要四個基層，因此本發明之觸控顯示面 板之整體厚度較小，而符合現今講究輕、薄、短、小的 趨勢，且可降低生產成本。此外，本發明之觸控顯示面 099125933 表單編號A0101 第6頁/共42頁 0992045507-0 201207793 板疋直接形成觸控模組於顯示模組上方，所以不需要組 裝單一個顯示模組與單一個觸控模組，故不需要組裝時 間與費用’因此更可進—步節省生產成本。另外，因為 本發明之觸控顯示面板是直接形成觸控模組於顯示模組 上方，所以可採用顯示模組的製程，如此可降低第三導 電層16與第四導電層丨7之訊號線的之線寬，所以可提高 第三導電層16與第四導電層17之訊號線的數量，而提高 觸控模組的精度，進而提高觸控顯示面板的觸控精度，201207793. VI. Description of the Invention: [Technical Field of the Invention] It particularly refers to a touch [0001] The present invention relates to a display panel control display panel. [Prior Art] [0002] ◎ 〇099125933 According to the progress of today's technology, electronic manufacturers have developed many electronic devices in response to the needs of the people. The functions of these electronic devices are becoming more and more powerful, and they are brought to the present public. A lot of convenience in life. Most of today's electronic devices are provided with a panel for the user to view the functions provided by the electronic device, so that the user can operate the functions of the electronic device according to the functions displayed by the panel, but the operation is performed. The method has a certain inconvenience. In today's electronic device manufacturers, the display panels provided by the electronic device m are mostly touch display panels. The touch display surface is a typical coordinate input device. The user can simply flip the touch display panel. The function displayed by the ^ function can be used to provide the functions provided by the electronic device. With the economic upgrading, the industry structure is changing, today's technology is changing with each passing day, it has caused great changes to the industrial structure, and it has also caused shocks. In order to comply with the world trend, the company can continue to operate, only (10) low production costs, and overall business performance of the country. In order to be purely enterprise (four), the development of touch display industry has become an important industry that has driven Taiwan's economic growth after the semiconductor. Today's touch display panels are assembled by single-display single-touch module. Since the display module and the touch screen are both single-individual, it must be assembled in production: control the display panel, which will increase the production cost. In addition, the display module is numbered by the second panel. As with the single-touch module, page 3/42, 0992045507-0 201207793, this will increase the overall thickness of the touch display panel, which is not consistent with the current electronic devices, thin, short, and small. Trends Please refer to the figure--, which is a cross-sectional view of the conventional touch display panel. As shown in the figure, the touch display panel includes a display module and a touch module, and the display module includes - a base layer 10', a second base layer 12, a color filter 14', a first conductive layer 16, a second conductive layer, corresponding to the - plastic frame 19. The first base layer 1 〇 ' corresponds to the first The second base layer 12, the color filter 14 is disposed on the first base layer 1 , the first conductive layer 16 and the second conductive layer 18 ′ are respectively disposed on the color light-emitting sheet 14 , the second base layer 12 , and the plastic frame 19 . The first conductive layer 16 is disposed between the first conductive layer 16 and the second conductive layer 18. Referring to the first embodiment, the touch module includes a first base layer 20 ′, a second base layer 22 ′, and a first conductive layer 26 . a second conductive layer (10), and a plastic frame 29, the first base layer 2〇, corresponding to the second base layer 22, the first conductive layer 26 and the second conductive layer 28 are respectively disposed on the first base layer 2〇, And the second base layer 22, the plastic frame 29' is disposed between the first conductive layer 26 and the first conductive layer 28. As can be seen from the above, the conventional touch display panel is composed of a single display module and a single one. The touch module is assembled, so the assembly cost is increased, the production cost is increased, and the overall thickness of the touch display panel is increased. The process precision of the touch module is not high, so the line width of the signal lines of the first conductive layer 26' and the second conductive layer 28' is relatively large, so the number of signal lines is limited, which limits the touch. The touch precision of the module is 099125933. Therefore, the present invention provides a touch display panel that not only improves the above-mentioned disadvantages, but also improves the line width limitation of the signal line of the conventional touch module. And improving the touch display panel form number A0101 page 4 / total page 42 0992045507-0 201207793 touch accuracy to solve the above problem. [0003] The main purpose of the present invention is to provide a touch display panel It does not need to assemble a single display module and a single touch module, but only contains three base layers, so the production cost and the overall thickness can be reduced. Another object of the present invention is to provide a touch display panel that can improve the accuracy of the signal line of the conductive layer of the touch module and improve the touch precision of the touch control display panel. Another object of the present invention is to provide a touch display panel, which integrates a touch chip on a touch display panel to reduce the complexity of the circuit between the circuit board and the touch display panel of the electronic device, and reduce the circuit occupation. The area of the circuit board of the electronic device, thereby reducing the cost. Another object of the present invention is to provide a touch display panel which is provided with a metal layer on a conductive layer for the purpose of reducing impedance and increasing signal transmission stability. The touch display panel of the present invention comprises a display base layer, a common base layer and a touch base layer, the display base layer has a first conductive layer, and the common base layer has a second conductive layer and a third conductive layer, respectively The two conductive layers correspond to the first conductive layer, the touch base layer has a fourth conductive layer, and the fourth conductive layer corresponds to the third conductive layer. Since the second conductive layer and the third conductive layer are respectively disposed on the common base layer, the touch display panel of the present invention only needs three base layers, and does not need to provide four base layers, thereby reducing the production cost and the overall touch display panel. thickness. In addition, the line width of the signal lines of the third conductive layer and the fourth conductive layer can be reduced, and the precision of the signal lines of the third conductive layer and the fourth conductive layer can be improved, thereby improving the touch precision of the touch display panel. 099125933 Form No. 1010101 Page 5 of 42 0992045507-0 201207793 [Embodiment] [0004] In order to give your reviewers a better understanding and understanding of the technical features and effects of the present invention, BRIEF DESCRIPTION OF THE DRAWINGS FIG. 1 is a cross-sectional view showing a preferred embodiment of a touch display panel of the present invention. As shown in the figure, the touch display panel of the present invention comprises a display base layer 10, a common base layer 11 and a touch base layer 12. The common base layer 11 corresponds to the display base layer 1 and the touch base layer 12 corresponds to the common base layer 11. The base layer 1 〇 and the common base layer are shown—the embodiment is a glass substrate, and the touch base layer 12$—implements the steel as a diaphragm, the display base layer has a first conductive layer 13 , and a color filter 14 is disposed on the Between the base layer 10 and the first conductive layer 13 is shown. In another embodiment: the colored tear sheet 14 can be replaced with a metal layer. The common base layer u has a second conductive layer 15 and a third conductive layer 16 respectively disposed on two sides of the common base layer, and the first conductive layer 15 corresponds to the first conductive layer 13. The touch substrate 12 has a fourth conductive layer 17 corresponding to the third conductive layer 16. A plastic frame 18 is disposed between the first conductive layer 13 and the first conductive layer 15 : and a plastic frame i 9 is disposed between the third conductive layer μ and the fourth conductive layer 17 . The first conductive layer 13, the second conductive layer 15, the third conductive layer 16, and the fourth conductive layer 17 respectively include a plurality of signal lines, which are well known to those skilled in the art, and therefore are not detailed here. Said. As described above, since the touch display panel of the present invention only needs to display the base layer 10, the common base layer 11 and the touch base layer 12, four base layers are required compared to the conventional touch display panel, and thus the touch display panel of the present invention The overall thickness is small, and it is in line with the current trend of light, thin, short and small, and can reduce production costs. In addition, the touch display surface of the present invention 099125933 Form No. A0101 Page 6 / Total 42 Page 0992045507-0 201207793 The board directly forms the touch module above the display module, so there is no need to assemble a single display module and a single one. The touch module eliminates the need for assembly time and expense, so it is more convenient to save production costs. In addition, since the touch display panel of the present invention directly forms the touch module above the display module, the process of the display module can be adopted, so that the signal lines of the third conductive layer 16 and the fourth conductive layer 丨7 can be reduced. The line width is wide, so that the number of signal lines of the third conductive layer 16 and the fourth conductive layer 17 can be increased, and the precision of the touch module is improved, thereby improving the touch precision of the touch display panel.
以提升觸控顯示面板的效能。上述之顯示模組可為液晶 顯示模組或者其他類型之顯示模組。To improve the performance of the touch display panel. The display module described above can be a liquid crystal display module or other types of display modules.
請參閱第三圖與第四圖，係本發明觸控顯示面板之 第二較佳實施例的前視圖與剖視圖。如圖所糸，此實施 例相較於第二圖實施例，此實施例更包含有一顯示控制 電路與一觸控電路，顯示控制電路用於電性連接第一導 電層13與第二導電層15 ,以控制顯示模組顯示影像，而 觸控電路則用於電性連接第三導電層16與第四導電層17 ，以接收第三導電層1&與第四導電層17之訊號線所產生 之觸控訊號，以得知使用者按壓觸控顯示面板之位置。 於此實施例中顯示控制電路包含一顯示控制晶片2 〇 ，其設置於共用基層11 ,並電性連接於第一導電層13與 第二導電層15。顯示控制晶片2〇為利用覆晶玻璃接合技 術（Chip On Glass)設置於共用基層灯。於此實施例 中，顯示基層10之長度係短於共用基層丨丨之長度，以讓 顯示控制晶片20設置於共用基層丨丨。顯示控制電路更包 含兩傳輸元件21與22，傳輸元件21設置於第一導電層13 與第二導電層15之間，如此第一導電層13與第二導電層 099125933 表單編號A0101 第7頁/共42頁 0992045507-0 201207793 15之間即可傳遞訊號 片20與弟二導雷思1C;Please refer to the third and fourth figures, which are front and cross-sectional views of a second preferred embodiment of the touch display panel of the present invention. As shown in the figure, in this embodiment, the embodiment further includes a display control circuit and a touch control circuit, and the display control circuit is configured to electrically connect the first conductive layer 13 and the second conductive layer. 15 . The control display module displays an image, and the touch circuit is configured to electrically connect the third conductive layer 16 and the fourth conductive layer 17 to receive the signal lines of the third conductive layer 1 & and the fourth conductive layer 17 The touch signal is generated to know the position where the user presses the touch display panel. In this embodiment, the display control circuit includes a display control chip 2 设置 disposed on the common base layer 11 and electrically connected to the first conductive layer 13 and the second conductive layer 15. The display control wafer 2 is disposed on a common base lamp using a chip on glass. In this embodiment, the length of the base layer 10 is shown to be shorter than the length of the common base layer 以 to allow the display control wafer 20 to be disposed in the common base layer. The display control circuit further includes two transmission elements 21 and 22, and the transmission element 21 is disposed between the first conductive layer 13 and the second conductive layer 15, such that the first conductive layer 13 and the second conductive layer 099125933 Form No. A0101 Page 7 / A total of 42 pages 0992045507-0 201207793 15 between the signal can be transmitted 20 and the second guide Lei Si 1C;
至第一導電層13與第二導電層15。 而傳輪元件22設置於顯示控制晶 間，所以顯示控制晶片2 〇即可電 顯示控制晶片20更電性連接—軟性電路板23，軟性 電路板23具有兩導通層231與233，而分別設置於軟性電 路板23之兩端。—傳輸元㈣設置於軟性電路板μ之導 通層231與第—導電層15之間，如此軟性電路板^即電性 連接於第—導電層!5 ,以可與顯示控制晶片別傳遞訊號 。軟性電路板23之導通層23.3連接於電子裝置之内部電路 板（圖未示），以接收電子裝置之控制晶片（圖未示） 所傳輸之訊號，以傳輸至顯示控制晶片2〇，顯示控制晶 片20即依據電子裝置内部之控制晶片的訊號而傳遞對 應的訊號至第一導電層13與第二導電層15，以顯示影像 。上述之傳輸元件21、22、24之一較佳實施例為異方性 導電膠（Anisotropic Cdnductive Film/ Paste， ACF/ACP )。 復參閱第四圖，於此實施例中觸控電路包含一觸控 晶片25，其設置於共用基層π並電性連接於第三導電層 16與第四導電層17。觸控晶片25為利用覆晶玻璃接合技 術設置於共用基層11。於此實施例中，觸控基層12之長 度係短於共用基層11之長度，以讓觸控晶片25設置於共 用基層11。觸控電路更包含兩傳輸元件26與27，傳輸元 件26設置於第三導電層16與第四導電層17之間，如此第 三導電層16與第四導電層17之間即可傳遞訊號，而傳輸 099125933 表單編號A0101 第8頁/共42頁 0992045507-0 201207793 元件27設置於觸控晶片25與第三導電層16之間，所以觸 控晶片25即可電性連接第三導電層16，且可藉由第三導 電層16以與第四導電層17電性連接，如此觸控晶片25即 可接收第三導電層16與第四導電層17之訊號線所產生之 觸控訊號，而得知使用者按壓觸控顯示面板之位置。 Ο 觸控晶片2 5更電性連接一軟性電路板2 8，軟性電路 板28具有兩導通層281與283，而分別設置於軟性電路板 28之兩端。一傳輸元件29設置於軟性電路板28之導通層 281與第三導電層16之間，如此軟性電路板28即電性連接 於第三導電層16 ’以可與觸控晶片25傳遞訊號，如此觸 控晶片25即會將觸控位置傳送至軟性電路板28。軟性電 路板28之導通層283連接於電子裝置之内部電路板，以將 觸控晶片25所傳送之觸控位置傳輸至電子裝置之控制晶 片’以供控制晶片得知使用者按壓觸控顯示面板之位置 ，進而執行對應的功能。上述之傳輸元件25、26、29之 一較佳實施例為異方性導電膠》To the first conductive layer 13 and the second conductive layer 15. The transmission wheel element 22 is disposed in the display control crystal, so that the display control chip 2 can electrically display the control chip 20 to be more electrically connected - the flexible circuit board 23, and the flexible circuit board 23 has two conduction layers 231 and 233, respectively At both ends of the flexible circuit board 23. The transmission element (4) is disposed between the conductive layer 231 of the flexible circuit board μ and the first conductive layer 15, such that the flexible circuit board is electrically connected to the first conductive layer !5 so as to transmit signals to the display control chip. The conductive layer 23.3 of the flexible circuit board 23 is connected to an internal circuit board (not shown) of the electronic device to receive the signal transmitted by the control chip (not shown) of the electronic device for transmission to the display control chip 2, display control The wafer 20 transmits corresponding signals to the first conductive layer 13 and the second conductive layer 15 according to the signals of the control wafers inside the electronic device to display images. A preferred embodiment of one of the above-described transmission elements 21, 22, 24 is an anisotropic Cdnductive Film/Paste (ACF/ACP). Referring to the fourth embodiment, in the embodiment, the touch control circuit includes a touch control chip 25 disposed on the common base layer π and electrically connected to the third conductive layer 16 and the fourth conductive layer 17. The touch wafer 25 is provided on the common base layer 11 by a flip-chip bonding technique. In this embodiment, the length of the touch base layer 12 is shorter than the length of the common base layer 11 to allow the touch wafer 25 to be disposed on the common base layer 11. The touch circuit further includes two transmission elements 26 and 27. The transmission element 26 is disposed between the third conductive layer 16 and the fourth conductive layer 17, so that the signal can be transmitted between the third conductive layer 16 and the fourth conductive layer 17. And the transmission of the 099125933 form number A0101 page 8 / total 42 page 0992045507-0 201207793 element 27 is disposed between the touch wafer 25 and the third conductive layer 16, so that the touch wafer 25 can be electrically connected to the third conductive layer 16, And the third conductive layer 16 is electrically connected to the fourth conductive layer 17 , so that the touch control chip 25 can receive the touch signals generated by the signal lines of the third conductive layer 16 and the fourth conductive layer 17 , and The location where the user presses the touch display panel is known.触摸 The touch wafer 25 is electrically connected to a flexible circuit board 2, and the flexible circuit board 28 has two conductive layers 281 and 283, which are respectively disposed at two ends of the flexible circuit board 28. A transmission component 29 is disposed between the conductive layer 281 of the flexible circuit board 28 and the third conductive layer 16, such that the flexible circuit board 28 is electrically connected to the third conductive layer 16 ′ to transmit signals to the touch wafer 25 . The touch wafer 25 transmits the touch position to the flexible circuit board 28. The conductive layer 283 of the flexible circuit board 28 is connected to the internal circuit board of the electronic device to transmit the touch position transmitted by the touch chip 25 to the control chip of the electronic device for controlling the chip to learn that the user presses the touch display panel. The location, in turn, performs the corresponding function. A preferred embodiment of the above-described transmission elements 25, 26, 29 is an anisotropic conductive paste.
本發明藉由將觸控晶片25設置於共用基層11，並與 共用基層11之第三導電層16與觸控基層12之第四導電層 17電性連接。如此當使用者觸壓該觸控顯示面板時，第 三導電層16與第四導電層17之訊號線所產生之觸控訊號 ，即會傳遞至觸控晶片25，如此觸控晶片25即可得知使 用者觸壓該觸控顯示面板之位置，並藉由軟性電路板28 將觸控位置傳遞至電子裝置之電路板的控制晶片，以供 電子裝置之控制晶片依據此觸控位置執行後續之對應動 作。此實施例整合觸控晶片25於觸控顯示面板，係可讓 電子裝置之電路板不需要與觸控顯示面板之第三導電層 099125933 表單編號Α0101 第9頁/共42頁 0992045507-0 201207793 16與第四導電層17之所有訊號線相連接，而只需幾條訊 號線與觸控晶片25連接，即可得知使用者之觸控位置。 由上述可知，若為了提高觸控顯示面板之觸控精度 或者具有多點觸控功能，而增加第三導電層16與第四導 電層17之訊號線的數量時，本發明僅會增加觸控晶片25 與第三導電層16和第四導電層17之訊號線相連接的接腳 數量，而不需增加觸控晶片25與電子裝置之電路板連接 的接腳，也就是不需增加電子裝置之電路板之電路，如 此可降低電子裝置與觸控顯示面板之間的電路的複雜度 ，以及降低電路板之電路佔用電路板之面積，進而可降 低成本。由於現今晶片之技術相當進步，所以增加觸控 晶片25之接腳數相較於增加電路板之接腳數並不會增加 太多面積與成本。 請參閱第五圖，係本發明觸控顯示面板之第三較佳 實施例的前視圖。此實施例與第四圖實施例之差異處在 於此實施例之軟性電路板23更可具有複數導通層233，即 增加複數輸入/輸出埠，且該些導通層233所在之位置係 不相同，該些導通層233會經由軟性電路板23而與顯示控 制晶片2 0之至少一輸入/輸出埠（圖未示）電性連接，如 此可因應各種電路板所設置之輸入/輸出埠位於不同位置 ，而使得軟性電路板23便於連接電子裝置之電路板。同 於上述，軟性電路板28更可具有複數導通層283，即增加 複數輸入/輸出埠，且該些導通層283所在之位置係不相 同，該些導通層283會經由軟性電路板28而與觸控晶片25 之至少一輸入/輸出埠（圖未示）電性連接。 請參閱第六圖，係本發明觸控顯示面板之第四較佳 099125933 表單編號A0101 第10頁/共42頁 0992045507-0 201207793 實施例的剖視圖。如圖所示，此實施例不同於第四圖實 施例之處在於此實施例增加一第一金屬層3 0與一第二金 屬層31，第一金屬層30與第二金屬層31分別位於第三導 電層16與第四導電層17,且涵蓋第三導電層16與第四導 電層17，而可用於降低阻抗與干擾，以提高訊號之穩定 性。本發明亦可僅於第三導電層16或第四導電層17設置 金屬層。 請參閱第七圖，係本發明觸控顯示面板之第五較佳 實施例的剖視圖。如圖所示。此實施例不同於上一實施 〇 例之處在於此實施例之第一金屬層30與第二金屬層31並 未涵蓋第三導電層16與第四導電層17之所有面積，此實 施例之第一金屬層30僅函蓋相對於傳輸元件26與傳輸元 件29位置之第三導電層16，而第二金屬層31僅函蓋相對 於傳輸元件26位置之第四導電層17。此方式可讓觸控顯 示面板之邊框不會受到第一金屬層30與第二金屬層31不 透明的影響，所以觸控顯示面板之邊框可保持透明。 請參閱第八圖與第九圖，係本發明觸控顯示面板之 〇 w 第六較佳實施例的前視圖與剖視圖。如圖所示，觸控基 層12具有一穿孔121，第八圖所示之穿孔121的位置，其 僅為本發明之一實施例，並非侷限穿孔121所設置之位置 ，其可依據使用需求而決定。一觸控晶片33穿於觸控基 層12之穿孔121並設置於共用基層11，且電性連接第三導 電層16與第四導電層17,觸控晶片33為利用覆晶玻璃接 合技術而設置於共用基層11。一軟性電路板34，其設置 於共用基層11之一端與觸控基層12之一端之間，且分別 電性連接於共用基層11之第三導電層16與觸控基層12之 099125933 表單編號A0101 第11頁/共42頁 0992045507-0 201207793 第四導電層17。由於觸控晶片33電性連接第三導電層16 ，所以軟性電路板34電性連接於觸控晶片33。軟性電路 板34具有複數導通孔（VIA) 341，以藉由軟性電路板34 讓第三導電層16與第四導電層17電性連接，以傳遞訊號 〇 承接上述，軟性電路板34具有兩導通層343、345。 一第一傳輸元件36設置於第三導電層16與軟性電路板34 之導通層343之間，使得軟性電路板34電性連接於第三導 電層16。一第二傳輸元件37設置於第四導電層17與軟性 電路板34之導通層345之間，使得軟性電路板34電性連接 於第四導電層17。一第三傳輸元件38設置於觸控晶片33 與共用基層11的第三導電層16之間。觸控晶片33藉由共 用基層11之第三導電層16之複數訊號線173以與軟性電路 板34電性相接，並且經由軟性電路板34之該些導通孔341 ，以與觸控基層12之第四導電層17電性相接，如此觸控 晶片33即可接收第四導電層17之訊號線的觸控訊號。上 述之傳輸元件36、37、38之一較佳實施例為異方性導電 膠。 觸控晶片33用於和第三導電層16之訊號線與第四導 電層17之訊號線電性連接的接腳可分別設置於觸控晶片 33之兩側，以分別接收第三導電層16與第四導電層17的 觸控訊號。於此實施例中，觸控晶片33用於接收第三導 電層1 6之觸控訊號的接腳係設置於觸控晶片33之左侧， 而觸控晶片33用於接收第四導電層17之觸控訊號的接腳 係設置於觸控晶片33之右側，如此可讓觸控晶片33之接 腳平均設置於觸控晶片33之兩側，而不會集中於一側， 099125933 表單編號 A0101 第 12 頁/共 42 頁 0992045507-0 201207793 以降低阻抗且可避免接腳過於集中，而避免相互干擾， 進而提高訊號之穩定性。 另外，軟性電路板34更具有一導通層347，以用於 連接電子裝置之内部電路板。觸控晶片33依據第三導電 層16與第四導電層17之觸控訊號，而所得知的觸控位置 會藉由第三導電層16的該些訊號線173傳輸至軟性電路板 34，並經由導通層347傳輸觸控位置至電子裝置的控制晶 片，以供控制晶片得知使用者按壓觸控顯示面板之位置 ，進而執行對應的功能。此外，此實施例之軟性電路板 34更可具有複數導通層347，即增加複數輸入/輸出埠， 且該些導通層347所在之位置係不相同.，該些導通層347 會經由軟性電路板34而與觸控晶片33之;至少一輸入/輸出 埠（圖未示）電性連接，如此可因應各種電路板所設置 之輸入/輸出槔位於不同位置，而使得_軟性電路板34便於 連接電子裝置之電路板。 請參閱第十圖與第十一圖，係本發明觸控顯示面板 之第七較佳實施例的上視圖與剖視圖。此實施例之觸控 電路包含一覆晶薄膜模組（Chip On Film，C0F) 40， 其設置於共用基層11且電性連接於第三導電層16與第四 導電層17。於此實施例中，觸控基層12之長度係短於共 用基層11之長度，以讓覆晶薄膜模組40設置於共用基層 11。覆晶薄膜模組40包含有一可撓性線路板42與一觸控 晶片44。可撓性線路板42具有兩導通層421與423，並分 別設置於可撓性線路板42之兩端。 復參閱第十圖與第十一圖，一第一傳輸元件45設置 於可撓性線路板42之導通層421與共用基層11之第三導電 099125933 表單編號A0101 第13頁/共42頁 0992045507-0 201207793 層16之間’即第—傳輸元件45設置於覆晶㈣模組4〇與 共用基層11之間’如此覆晶薄膜模組4〇即設置於共用基 層11，且電性連接於第三導電層16，以接收第三導電層 16之觸控訊號。一第二傳輸元件46設置於共用基層^之 第三導電層16與觸控基層12之第四導電層17之間如此 第二導電層16即可傳遞觸控訊號至第四導電層17，而傳 輸至可撓性線路板42。第一傳輸元件45與第二傳輸元件 46之一實施例為異方性導電膠。 另外，觸控晶片44設置於可辑性線路板42，以接收 第二導電層16與第四導電層17之訊號線的觸控訊號如 此觸控晶片44即可依據觸控訊號得知使用者按壓觸控顯 不面板之位置。此外，可撓性線路板42可藉由導通層 直接與電子I置之電路板（圖未示）相互連接，使得觸 控晶片44與電路板之間可以相互傳遞訊號，而直接傳遞 使用者按壓觸控顯示面板之位置至電路板，或者如第十 一圖所示’藉由導通層423外接一教性電路板47，使得觸 控晶片4 4經由軟性電路板4 7與電子裝置之電路板相互連 接，如此觸控晶片44可傳遞訊號至電子裝置之電路板的 控制晶片。軟性電路板47之一端具有一導通層471，—傳 輸元件48設置於可撓性線路板42之導通層423與軟性電路 板47的導通層471之間。如此，軟性電路板47即電性連接 於可撓性線路板42。上述之傳輸元件48之—實施例為異 方性導電膠。 、 本發明藉由將覆晶薄膜模組4〇設置於共用基層u， 099125933 使得覆晶薄膜模組4〇可與共用基層丨丨之第三導電層丨6的 訊號線相互電性連接，且經由第二傳輸元件46而與觸控 表單編號A0101 第14頁/共42頁 工 0992〇455〇7-〇 201207793 基層12之第四導電層17的訊號線電性連接。如此當使用 者觸壓該觸控顯示面板時，共用基層u之第三導電層16 的訊號線與觸控基層12之第四導電層17的訊號線所產生 之觸控訊號，即會傳遞至觸控晶片44，如此觸控晶片44 即可得知使用者觸壓該觸控顯示面板之位置，並將觸控 位置傳遞至電子裝置之電路板的控制晶片，以供電子裝 置之控制晶片依據此觸控位置執行後續之對應動作。此 實施例整合觸控晶片44於觸控顯示面板，係可讓電子裝 > 置之電路板不需要與觸控顯示珥板之第三導電層16和第 四導電層17的訊號線相連接，而只需幾條訊號線與覆晶 薄媒模組40連接即可得知使用者之觸控伞置。此外，覆 晶薄膜模組40亦可設置於觸控基層丨2，且與第三導電層 16和第四導電層17電性連接，並未限定覆晶薄膜模組4〇 必須設置於共用基層11。 復參閱第十圖，本發明之軟性電路板47可具有複數 輸入/輸出埠473與複數導通層471，該些輸入/輸出埠 473與該些導通層4fl相對應，且該些輸入/輸出埠473所 在之位置係不相肯，而可撓性線路板4 2對應具有複數導 通層423 ’即透過該些導通層423以與該些輸入/輸出埠 473電性連接’該些導通層423係與觸控晶片44之至少一 輸入/輸出槔（圖未示）電性連接，如此可因應電子裝置 之各種電路板所設置之輪入/輸出埠位於不同位置，而使 得軟性電路板47便於連接電子裝置内部之電路板。 請參閱第十二圖與第十三圖，係本發明觸控顯示面 板之第八較佳實施例的上視圖與剖視圖。如圖所示，此 實施例不同於第十一圖實施例之處在於此實施例之共用 099125933 表單編號 A0101 第还頁/共 42 頁 0992045507-0 201207793 基層11的長度相同於觸控基層丨2之長度，而且—覆晶薄 膜模組50設於共用基層11之一端與觸控基層丨2之—端之 間，且分別電性連接於共用基層丨丨之第三導電層16與觸 控基層12之第四導電層17。此實施例之覆晶薄獏模組 之一可撓性線路板52之兩側面分別電性連接第三導電層 16與第四導電層Π ’且具有複數導通孔（via) 521，如 此設置於可挽性線路板52之一觸控晶片54可接收第三導 電層16與第四導電層17之訊號線的觸控訊號，觸控晶片 54即可依據觸控訊號得知使用者觸摩該觸控顯示面板之 位置。 承接上述，可撓性線路板52具有三導通層523、525 、527，導通層523、525分別設置於可撓性線路板52之 一端的兩側，而導通層527則設置於可撓性線路板52之另 一端。一第一傳輸元件56設置於共用基層11之第三導電 層16與可撓性線路板52的導通層523之間，即設置於共用 基層11與覆晶薄膜模組50之間。一第二傳輸元件57則設 置於觸控基層12之第四導電層17輿可撓性線路板5 2的導 通層525之間’即設置於觸控基層12與覆晶薄膜模組5〇之 間。可撓性線路板52之導通層527則外接一軟性電路板58 。可挽性線路板525之導通層527與外接之軟性電路板58 的導通層581之間設置有一傳輸元件59。軟性電路板58 同於前述實施例具有複數輸入/輸出槔583並與覆晶薄膜 模組50之觸控晶片54之至少一輸入/輸出埠電性連接。上 述之傳輸元件56、57與59之一實施例為異方性導電膠。 099125933 請參閱第十四圖與第十五圖，係本發明觸控顯示面 板之第九較佳實施例的上視圖與剖視圖。如圖所示，此 表單編號A0101 第16頁/共42頁 0992045507-0 201207793 Ο 實施例之觸控電路包含一軟性電路板6〇與一覆晶薄膜模 組70，軟性電路板60設置於共用基層丨丨之第三導電層16 與觸控基層12之第四導電層17之間，而電性連接第三導 電層16與第四導電層17。軟性電路板6〇更具有複數導通 孔601 ’使得軟性電路板60之兩側面可電性相接而傳遞訊 號。軟性電路板60具有三導通層603、605、607，導通 層603與605設置於軟性電路板60之一端的兩側面，而導 通層607則設置於軟性電路板60之另—端。—第一傳輸元 件62設置於第三導電層16與軟性電路板6〇的導通層6〇3 之間’使得軟性電路板60電性連接於第三導電層16。一 第一傳輸元件64设置於第四導電層η與軟性電路板的 導通層605之間，使得軟性電路板電性連接於第四導電 層17。第一傳輸元件62與第二傳輸元件64之一實施例為 異方性導電膠。 ❹ 覆晶薄膜模組70設置於軟性電路板6〇，並具有一可 撓性線路板72與一觸控晶片741可撓性繅路板72電性連 接於軟性電路板60，而觸控晶片74設置於可撓性線路板 72。覆晶薄膜模組70之可撓性線路板72具有兩導通層 721、723，導通層721、723設於覆晶薄膜模組7〇之可撓 性線路板72的兩端，導通層721與軟性電路板6〇之導通層 607之間設置有一傳輸元件76，使得覆晶薄膜模組7〇之可 撓性線路板72電性連接於軟性電路板6〇，如此覆晶薄膜 模組70之觸控晶片74即與軟性電路板6〇電性相接，所以 觸控晶片74即可藉由軟性電路板6〇與共用基層u之第三 導電層16和觸控基層12之第四導電層17電性相接，而接 收觸控訊號。傳輸元件76之一實施例為異方性導電膠。 099125933 表單編號A0101 第Π頁/共42頁 0992045507-0 201207793 此外’覆晶薄骐模組7〇之可撓性線路板72更外接一 軟性電路板80 ’軟性電路板8()具有—導通層謝，導通層 801與可挽性線路板72之導通層m之間設置有—傳輪元曰 件82使传覆晶薄膜模組7〇之可撓性線路板η外接軟性 電路板80。傳輪元件82之—實施例為異紐導電膠。軟 性電路板⑽同於前述實施例具有至少—輸人/輸出埠803 :與覆晶薄膜模組7°之觸控晶片74之至少一輸入/輸出埠 电性連接。另外’軟性電路板6〇亦可藉由至少-輸入/輸 出蟑並與覆晶薄組7G之觸控晶片74之至少—輪入/輸 :埠電性連接’即藉由軟性電卿.導通層6。7與觸： 晶片74之至少—輪人/輸出埠電性連接，如此即可不需外 接軟性電路板8〇。 综上所述，本發明觸控顯示面板包含有顯示基層' 、用基層與觸控基層，顯示基層具有第—導電層，共用 基層具有第二導電層與第三導電層，觸控基層具有第四 導電層’第-導電層對應第二導電層，第三導電層對鹿 第四導電層。由於本發明之觸控顯示面板僅需要三個基 層，如此可降低生產成本以及觸控巔示面板之整體厚度 此外，第三導電層與第四導電層之訊號線的線寬可降 低而提兩第三導電層與第四導電層之訊號線的精度， 進而提高觸控顯示面板之觸控精度。 故本發明實為一具有新穎性、進步性及可供產業上 =用者’應符合我目專利法專射請要件錢，美依法 β發月專牙j申凊，祈鉤局早曰賜准專利，至感為禱。 099125933 惟以上所述者，僅為本發明 表單編號Α0101 一較佳實施例而已 第18頁/共42頁 並 0992045507-0 201207793 非用來限定本發明實施之範圍，故舉凡依本發明申請專 利範圍所述之形狀、構造、特徵及精神所為之均等變化 與修飾，均應包括於本發明之申請專利範圍内。 【圖式簡單說明】 [0005] 第一圖係習用觸控顯示面板的剖視圖； 第二圖係本發明觸控顯示面板之一較佳實施例的剖視圖 9 第三圖係本發明觸控顯示面板之第二較佳實施例的上視 圖； Ο 第四圖係本發明觸控顯示面板之第二較佳實施例的剖視 圖， 第五圖係本發明觸控顯示面板之第三較佳實施例的上視 圖， 第六圖係本發明觸控顯示面板之第四較佳實施例的剖視 圖， Ο 第七圖係本發明觸控顯示面板之第五較佳實施例的剖視 圖， 第八圖係本發明觸控顯示面板之第六較佳實施例的上視 圖； 第九圖係本發明觸控顯示面板之第六較佳實施例的剖視 圖， 第十圖係本發明觸控顯示面板之第七較佳實施例的上視 圖， 第十一圖係本發明觸控顯示面板之第七較佳實施例的剖 視圖， 099125933 第十二圖係本發明觸控顯示面板之第八較佳實施例的上 表單編號Α0101 第19頁/共42頁 0992045507-0 201207793 視圖； 第十二圖係本發明觸控顯示面板之第八較佳實施例的剖 視圖； 第十四圖係本發明觸控顯示面板之第九較佳實施例的上 視圖；以及 第十五圖係本發明觸控顯示面板之第九較佳實施例的剖 視圖。 【主要元件符號說明】 [0006] 10， 第一基層 12， 第二基層 14， 彩色濾光片 16， 第一導電層 18， 第二導電層 19， 膠框 20， 第一基層 22， 第二基層 26， 第一導電層 28， 第二導電層 29， 膠框 10 顯示基層 11 共用基層 12 觸控基層 121 穿孔 13 第一導電層 14 彩色濾光片 15 第二導電層 表單煸號A0101 第20頁/共42頁 099125933 0992045507-0 201207793 第三導電層 第四導電層 訊號線 膠框 膠框 θ 顯不控制晶片 傳輸元件 傳輸元件 軟性電路板 導通層 導通層 傳輸元件 觸控晶片 傳輸元件 傳輸元件 軟性電路板 導通層 導通層 傳輸元件 第一金屬層 第二金屬層 觸控晶片 軟性電路板 導通孔 導通層 導通層 099125933 表單編號Α0101 第21頁/共42頁 0992045507-0 201207793 347 導通層 36 第一傳輸元件 37 第二傳輸元件 38 第三傳輸元件 40 覆晶薄膜模組 42 可撓性線路板 44 觸控晶片 421 導通層 423 導通層 45 第一傳輸元件 46 第二傳輸元件 47 軟性電路板 471 導通層 473 輸入/輸出埠 48 傳輸元件 50 覆晶薄膜模組 52 可撓性線路板 521 導通孔 523 導通層 525 導通層 527 導通層 54 觸控晶片 56 第一傳輸元件 57 第二傳輸元件 58 軟性電路板 581 導通層 表單編號A0101 099125933 第22頁/共42頁 0992045507-0 201207793In the present invention, the touch wafer 25 is disposed on the common base layer 11 and electrically connected to the third conductive layer 16 of the common base layer 11 and the fourth conductive layer 17 of the touch base layer 12. When the user touches the touch display panel, the touch signals generated by the signal lines of the third conductive layer 16 and the fourth conductive layer 17 are transmitted to the touch wafer 25, so that the touch wafer 25 can be touched. Knowing that the user touches the position of the touch display panel, and transmits the touch position to the control chip of the circuit board of the electronic device through the flexible circuit board 28, so that the control chip of the electronic device performs subsequent steps according to the touch position. Corresponding action. In this embodiment, the touch panel 25 is integrated on the touch display panel, so that the circuit board of the electronic device does not need to be connected to the third conductive layer of the touch display panel. 099125933 Form No. 1010101 Page 9 / Total 42 Page 0992045507-0 201207793 16 It is connected to all the signal lines of the fourth conductive layer 17, and only a few signal lines are connected to the touch wafer 25 to know the touch position of the user. As described above, if the number of signal lines of the third conductive layer 16 and the fourth conductive layer 17 is increased in order to improve the touch precision of the touch display panel or the multi-touch function, the present invention only increases the touch. The number of pins of the wafer 25 connected to the signal lines of the third conductive layer 16 and the fourth conductive layer 17 does not need to increase the pins of the touch panel 25 and the circuit board of the electronic device, that is, no need to add electronic devices. The circuit of the circuit board can reduce the complexity of the circuit between the electronic device and the touch display panel, and reduce the area occupied by the circuit board of the circuit board, thereby reducing the cost. Since the technology of today's wafers is quite advanced, increasing the number of pins of the touch wafer 25 does not increase the area and cost compared to increasing the number of pins of the board. Referring to FIG. 5, a front view of a third preferred embodiment of the touch display panel of the present invention is shown. The difference between the embodiment and the fourth embodiment is that the flexible circuit board 23 of the embodiment may further have a plurality of conductive layers 233, that is, a plurality of input/output ports are added, and the positions of the conductive layers 233 are different. The conductive layer 233 is electrically connected to at least one input/output port (not shown) of the display control chip 20 via the flexible circuit board 23, so that the input/output ports provided for the various circuit boards are located at different positions. Therefore, the flexible circuit board 23 facilitates connection of the circuit board of the electronic device. As described above, the flexible circuit board 28 can further have a plurality of conductive layers 283, that is, a plurality of input/output ports are added, and the conductive layers 283 are located at different positions. The conductive layers 283 are connected via the flexible circuit board 28. At least one input/output port (not shown) of the touch wafer 25 is electrically connected. Please refer to the sixth figure, which is a fourth preferred embodiment of the touch display panel of the present invention. 099125933 Form No. A0101 Page 10 of 42 0992045507-0 201207793 A cross-sectional view of an embodiment. As shown in the figure, this embodiment is different from the fourth embodiment. In this embodiment, a first metal layer 30 and a second metal layer 31 are added. The first metal layer 30 and the second metal layer 31 are respectively located. The third conductive layer 16 and the fourth conductive layer 17 cover the third conductive layer 16 and the fourth conductive layer 17, and can be used to reduce impedance and interference to improve signal stability. The present invention may also provide a metal layer only for the third conductive layer 16 or the fourth conductive layer 17. Referring to Figure 7, a cross-sectional view of a fifth preferred embodiment of the touch display panel of the present invention is shown. as the picture shows. This embodiment is different from the previous embodiment. The first metal layer 30 and the second metal layer 31 of this embodiment do not cover all areas of the third conductive layer 16 and the fourth conductive layer 17, and this embodiment The first metal layer 30 only covers the third conductive layer 16 at a position relative to the transport element 26 and the transport element 29, while the second metal layer 31 only covers the fourth conductive layer 17 at a position relative to the transport element 26. In this way, the frame of the touch display panel is not affected by the opacity of the first metal layer 30 and the second metal layer 31, so the frame of the touch display panel can remain transparent. Please refer to the eighth and ninth drawings, which are front and cross-sectional views of a sixth preferred embodiment of the touch display panel of the present invention. As shown in the figure, the touch base layer 12 has a through hole 121, and the position of the through hole 121 shown in the eighth figure is only an embodiment of the present invention, and does not limit the position of the through hole 121, which can be used according to the use requirement. Decide. A touch wafer 33 is inserted through the through hole 121 of the touch base layer 12 and disposed on the common base layer 11 , and electrically connected to the third conductive layer 16 and the fourth conductive layer 17 . The touch wafer 33 is set by using a flip-chip bonding technology. The base layer 11 is shared. A flexible circuit board 34 is disposed between one end of the common base layer 11 and one end of the touch base layer 12, and electrically connected to the third conductive layer 16 of the common base layer 11 and the touch base layer 12, respectively, 099125933 Form No. A0101 11 pages/total 42 pages 0992045507-0 201207793 Fourth conductive layer 17. Since the touch wafer 33 is electrically connected to the third conductive layer 16 , the flexible circuit board 34 is electrically connected to the touch wafer 33 . The flexible circuit board 34 has a plurality of vias (VIA) 341 for electrically connecting the third conductive layer 16 and the fourth conductive layer 17 by the flexible circuit board 34 to transmit signals, and the flexible circuit board 34 has two conductive lines. Layers 343, 345. A first transmission element 36 is disposed between the third conductive layer 16 and the conductive layer 343 of the flexible circuit board 34 such that the flexible circuit board 34 is electrically connected to the third conductive layer 16. A second transmission component 37 is disposed between the fourth conductive layer 17 and the conductive layer 345 of the flexible circuit board 34 such that the flexible circuit board 34 is electrically connected to the fourth conductive layer 17. A third transmission component 38 is disposed between the touch wafer 33 and the third conductive layer 16 of the common substrate 11. The touch control chip 33 is electrically connected to the flexible circuit board 34 through the plurality of signal lines 173 of the third conductive layer 16 of the common base layer 11 and via the via holes 341 of the flexible circuit board 34 to the touch base layer 12 . The fourth conductive layer 17 is electrically connected, so that the touch wafer 33 can receive the touch signal of the signal line of the fourth conductive layer 17. A preferred embodiment of one of the above described transmission elements 36, 37, 38 is an anisotropic conductive paste. The pins of the touch wafer 33 for electrically connecting the signal lines of the third conductive layer 16 and the signal lines of the fourth conductive layer 17 are respectively disposed on two sides of the touch wafer 33 to respectively receive the third conductive layer 16 The touch signal with the fourth conductive layer 17. In this embodiment, the touch chip 33 is configured to receive the touch signal of the third conductive layer 16 and is disposed on the left side of the touch wafer 33, and the touch die 33 is configured to receive the fourth conductive layer 17 The pin of the touch signal is disposed on the right side of the touch chip 33, so that the pins of the touch chip 33 are evenly disposed on both sides of the touch chip 33, and are not concentrated on one side, 099125933 Form No. A0101 Page 12 of 42 0992045507-0 201207793 To reduce the impedance and avoid excessive concentration of the pins, and avoid mutual interference, thus improving the stability of the signal. In addition, the flexible circuit board 34 further has a conductive layer 347 for connecting the internal circuit board of the electronic device. The touch control chip 33 transmits the touch positions of the third conductive layer 16 and the fourth conductive layer 17 to the flexible circuit board 34 through the signal lines 173 of the third conductive layer 16 and The control chip is transmitted to the control device of the electronic device via the conductive layer 347 for the control chip to know the position of the user pressing the touch display panel, thereby performing the corresponding function. In addition, the flexible circuit board 34 of this embodiment may further have a plurality of conductive layers 347, that is, a plurality of input/output ports are added, and the conductive layers 347 are located at different positions. The conductive layers 347 pass through the flexible circuit board. 34 is electrically connected to at least one input/output port (not shown) of the touch wafer 33, so that the input/output ports provided for the various circuit boards are located at different positions, so that the flexible circuit board 34 is convenient to be connected. A circuit board for an electronic device. Referring to the tenth and eleventh drawings, a top view and a cross-sectional view of a seventh preferred embodiment of the touch display panel of the present invention are shown. The touch control circuit of the embodiment includes a chip on film (C0F) 40 disposed on the common base layer 11 and electrically connected to the third conductive layer 16 and the fourth conductive layer 17. In this embodiment, the length of the touch base layer 12 is shorter than the length of the common base layer 11 to allow the flip chip module 40 to be disposed on the common base layer 11. The flip chip module 40 includes a flexible circuit board 42 and a touch wafer 44. The flexible wiring board 42 has two conductive layers 421 and 423 and is disposed at both ends of the flexible wiring board 42, respectively. Referring to the tenth and eleventh drawings, a first transmission element 45 is disposed on the conductive layer 421 of the flexible circuit board 42 and the third conductive 099125933 of the common base layer 11. Form No. A0101 Page 13 / Total 42 Page 0992045507- 0 201207793 Between the layers 16 'that is, the first transmission element 45 is disposed between the flip chip (4) module 4 〇 and the common base layer 11 'The flip chip module 4 is disposed on the common base layer 11 and electrically connected to the The three conductive layers 16 receive the touch signals of the third conductive layer 16. A second transmission element 46 is disposed between the third conductive layer 16 of the common base layer and the fourth conductive layer 17 of the touch base layer 12, such that the second conductive layer 16 can transmit the touch signal to the fourth conductive layer 17, and Transfer to the flexible circuit board 42. An embodiment of the first transmission element 45 and the second transmission element 46 is an anisotropic conductive paste. In addition, the touch chip 44 is disposed on the selectable circuit board 42 to receive the touch signals of the signal lines of the second conductive layer 16 and the fourth conductive layer 17 so that the touch wafer 44 can be used according to the touch signal. Press the touch to display the position of the panel. In addition, the flexible circuit board 42 can be directly connected to the circuit board (not shown) of the electronic I through the conductive layer, so that the touch chip 44 and the circuit board can transmit signals to each other, and directly transmit the user's pressing. Touching the position of the display panel to the circuit board, or as shown in FIG. 11 'connecting a teaching circuit board 47 through the conduction layer 423, so that the touch wafer 44 is connected to the circuit board of the electronic device via the flexible circuit board 47 Interconnected, such that the touch wafer 44 can transmit signals to the control wafer of the circuit board of the electronic device. One end of the flexible circuit board 47 has a conduction layer 471, and the transmission member 48 is disposed between the conduction layer 423 of the flexible wiring board 42 and the conduction layer 471 of the flexible circuit board 47. Thus, the flexible circuit board 47 is electrically connected to the flexible wiring board 42. An embodiment of the above-described transmission element 48 is an anisotropic conductive paste. In the present invention, the flip chip module 4 is disposed on the common substrate u, 099125933 so that the flip chip module 4 can be electrically connected to the signal line of the third conductive layer 丨6 of the common base layer, and The second transmission element 46 is electrically connected to the signal line of the fourth conductive layer 17 of the base layer 12 of the touch panel No. A0101, page 14/42, 0992〇455〇7-〇201207793. When the user touches the touch display panel, the touch signal generated by the signal line of the third conductive layer 16 of the common layer u and the signal line of the fourth conductive layer 17 of the touch base layer 12 is transmitted to The touch wafer 44 can be used to control the position of the touch display panel and transmit the touch position to the control chip of the circuit board of the electronic device for controlling the wafer of the electronic device. This touch position performs subsequent corresponding actions. In this embodiment, the touch panel 44 is integrated on the touch display panel, so that the electronic device can be connected to the signal lines of the third conductive layer 16 and the fourth conductive layer 17 of the touch display panel. Only a few signal lines are connected to the flip-chip thin film module 40 to know the user's touch umbrella. In addition, the flip chip module 40 can also be disposed on the touch substrate 丨 2 and electrically connected to the third conductive layer 16 and the fourth conductive layer 17 , and the flip chip module 4 并未 must not be disposed on the common base layer. 11. Referring to the tenth figure, the flexible circuit board 47 of the present invention may have a plurality of input/output ports 473 and a plurality of conductive layers 471, the input/output ports 473 corresponding to the conductive layers 4fl, and the input/output ports The location of the 473 is unbiased, and the flexible circuit board 42 has a plurality of conductive layers 423 ′, that is, through the conductive layers 423 to electrically connect with the input/output ports 473. It is electrically connected to at least one input/output port (not shown) of the touch wafer 44, so that the wheel input/output ports provided in various circuit boards of the electronic device are located at different positions, so that the flexible circuit board 47 is convenient to be connected. A circuit board inside the electronic device. Referring to Figures 12 and 13, there are shown a top view and a cross-sectional view of an eighth preferred embodiment of the touch display panel of the present invention. As shown in the figure, this embodiment is different from the embodiment of the eleventh embodiment in the embodiment of the common 099125933 Form No. A0101 The second page / Total 42 page 0992045507-0 201207793 The base layer 11 has the same length as the touch base layer 丨 2 The length, and the flip chip module 50 is disposed between one end of the common base layer 11 and the end of the touch substrate 丨2, and is electrically connected to the third conductive layer 16 and the touch base layer respectively connected to the common base layer The fourth conductive layer 17 of 12. The two sides of the flexible circuit board 52 of the flip chip module of the embodiment are respectively electrically connected to the third conductive layer 16 and the fourth conductive layer Π ' and have a plurality of vias 521, which are disposed on the removable The touch chip 54 of the circuit board 52 can receive the touch signals of the signal lines of the third conductive layer 16 and the fourth conductive layer 17. The touch chip 54 can know that the user touches the touch according to the touch signal. The position of the display panel. In response to the above, the flexible circuit board 52 has three conductive layers 523, 525, and 527. The conductive layers 523 and 525 are respectively disposed on both sides of one end of the flexible circuit board 52, and the conductive layer 527 is disposed on the flexible circuit. The other end of the board 52. A first transmission element 56 is disposed between the third conductive layer 16 of the common base layer 11 and the conductive layer 523 of the flexible wiring board 52, that is, between the common base layer 11 and the flip chip module 50. A second transmission component 57 is disposed between the fourth conductive layer 17 of the touch base layer 12 and the conductive layer 525 of the flexible circuit board 52, that is, disposed on the touch base layer 12 and the flip chip module 5. between. The conductive layer 527 of the flexible circuit board 52 is externally connected to a flexible circuit board 58. A transmission member 59 is disposed between the conductive layer 527 of the flexible circuit board 525 and the conductive layer 581 of the external flexible circuit board 58. The flexible circuit board 58 has a plurality of input/output ports 583 in the same manner as the foregoing embodiment and is electrically connected to at least one input/output of the touch wafer 54 of the flip chip module 50. One embodiment of the transmission elements 56, 57 and 59 described above is an anisotropic conductive paste. 099125933 Please refer to FIG. 14 and FIG. 15 for a top view and a cross-sectional view of a ninth preferred embodiment of the touch display panel of the present invention. As shown in the figure, this form number A0101 page 16 / total 42 page 0992045507-0 201207793 触控 The touch circuit of the embodiment comprises a flexible circuit board 6〇 and a flip chip module 70, and the flexible circuit board 60 is disposed in common. The third conductive layer 16 of the base layer and the fourth conductive layer 17 of the touch base layer 12 are electrically connected to the third conductive layer 16 and the fourth conductive layer 17. The flexible circuit board 6 has a plurality of via holes 601' such that the two sides of the flexible circuit board 60 are electrically connected to each other to transmit signals. The flexible circuit board 60 has three conductive layers 603, 605, and 607. The conductive layers 603 and 605 are disposed on both sides of one end of the flexible circuit board 60, and the conductive layer 607 is disposed on the other end of the flexible circuit board 60. The first transmission element 62 is disposed between the third conductive layer 16 and the conductive layer 6〇3 of the flexible circuit board 6〇 such that the flexible circuit board 60 is electrically connected to the third conductive layer 16. A first transmission element 64 is disposed between the fourth conductive layer η and the conductive layer 605 of the flexible circuit board such that the flexible circuit board is electrically connected to the fourth conductive layer 17. An embodiment of the first transmission element 62 and the second transmission element 64 is an anisotropic conductive paste. The flip chip module 70 is disposed on the flexible circuit board 6 and has a flexible circuit board 72 and a touch wafer 741 flexible circuit board 72 electrically connected to the flexible circuit board 60, and the touch chip 74 is disposed on the flexible circuit board 72. The flexible circuit board 72 of the flip chip module 70 has two conductive layers 721 and 723. The conductive layers 721 and 723 are disposed at the two ends of the flexible circuit board 72 of the flip chip module 7 and the conductive layer 721 and A transmission component 76 is disposed between the conductive layer 607 of the flexible circuit board 6 such that the flexible circuit board 72 of the flip chip module 7 is electrically connected to the flexible circuit board 6 , such that the flip chip module 70 The touch wafer 74 is electrically connected to the flexible circuit board 6. Therefore, the touch wafer 74 can pass through the flexible circuit board 6 and the third conductive layer 16 of the common base layer u and the fourth conductive layer of the touch base layer 12. 17 electrical connection, and receive touch signals. One embodiment of the transmission element 76 is an anisotropic conductive paste. 099125933 Form No. A0101 Page/Total 42 Page 0992045507-0 201207793 In addition, the flexible circuit board 72 of the 'Crystal Thin Film Module 7' is further connected to a flexible circuit board 80'. The flexible circuit board 8() has a conductive layer. Between the conductive layer 801 and the conductive layer m of the switchable circuit board 72, a transfer element 82 is disposed to externally connect the flexible circuit board n of the transfer film module 7 to the flexible circuit board 80. The embodiment of the transfer element 82 is an iso-conductive paste. The flexible circuit board (10) has at least one input/output 埠 electrically connected to the touch wafer 74 of the flip chip module 7° as in the previous embodiment. In addition, the flexible circuit board 6 can also be electrically connected by at least - input/output 蟑 and at least with the touch wafer 74 of the flip chip 7G. Layer 6. 7 and touch: At least the wheel/output of the wafer 74 is electrically connected, so that no external flexible circuit board 8〇 is required. In summary, the touch display panel of the present invention comprises a display base layer, a base layer and a touch base layer, the display base layer has a first conductive layer, the common base layer has a second conductive layer and a third conductive layer, and the touch base layer has a first The fourth conductive layer 'the first conductive layer corresponds to the second conductive layer, and the third conductive layer corresponds to the fourth conductive layer of the deer. Since the touch display panel of the present invention only needs three base layers, the production cost and the overall thickness of the touch display panel can be reduced, and the line widths of the signal lines of the third conductive layer and the fourth conductive layer can be reduced. The precision of the signal lines of the third conductive layer and the fourth conductive layer further improves the touch precision of the touch display panel. Therefore, the present invention is a novelty, progressive and available for the industry = the user's should meet the requirements of my patent law, the special requirements, the United States, according to the law, the law of the month, the jail, the jail Quasi-patent, to the feeling of prayer. 099125933 However, the above description is only the form number Α0101 of the present invention, a preferred embodiment, and the 18th page/total 42 page and 0992045507-0 201207793 are not intended to limit the scope of the practice of the present invention. Equivalent changes and modifications of the shapes, configurations, features and spirits are intended to be included in the scope of the invention. BRIEF DESCRIPTION OF THE DRAWINGS [0005] The first figure is a cross-sectional view of a conventional touch display panel; the second figure is a cross-sectional view of a preferred embodiment of the touch display panel of the present invention. The third figure is a touch display panel of the present invention. FIG. 4 is a cross-sectional view showing a second preferred embodiment of the touch display panel of the present invention, and FIG. 5 is a third preferred embodiment of the touch display panel of the present invention. FIG. 7 is a cross-sectional view of a fourth preferred embodiment of the touch display panel of the present invention, and FIG. 7 is a cross-sectional view of a fifth preferred embodiment of the touch display panel of the present invention, and FIG. A top view of a sixth preferred embodiment of the touch display panel; a ninth drawing is a cross-sectional view of a sixth preferred embodiment of the touch display panel of the present invention, and a tenth view is a seventh preferred embodiment of the touch display panel of the present invention. 1 is a cross-sectional view of a seventh preferred embodiment of the touch display panel of the present invention, and 0129125933 is a top form number of the eighth preferred embodiment of the touch display panel of the present invention. Α0101 Page 19 / 42. 0992045507-0 201207793 views; FIG. 12 is a cross-sectional view of an eighth preferred embodiment of the touch display panel of the present invention; FIG. 14 is a top view of a ninth preferred embodiment of the touch display panel of the present invention And a fifteenth view is a cross-sectional view of a ninth preferred embodiment of the touch display panel of the present invention. [Main component symbol description] [0006] 10, first base layer 12, second base layer 14, color filter 16, first conductive layer 18, second conductive layer 19, plastic frame 20, first base layer 22, second Base layer 26, first conductive layer 28, second conductive layer 29, plastic frame 10 display base layer 11 common base layer 12 touch base layer 121 perforation 13 first conductive layer 14 color filter 15 second conductive layer form nickname A0101 20 Page / Total 42 pages 099125933 0992045507-0 201207793 Third conductive layer Fourth conductive layer Signal line plastic frame plastic frame θ Display control chip transmission component Transmission component Flexible circuit board conduction layer conduction layer transmission component touch wafer transmission component transmission component softness Circuit board conduction layer conduction layer transmission element first metal layer second metal layer touch wafer flexible circuit board via hole conduction layer conduction layer 099125933 Form No. 1010101 Page 21 / Total 42 Page 0992045507-0 201207793 347 Conduction layer 36 First transmission Element 37 second transmission element 38 third transmission element 40 flip chip module 42 flexible circuit board 44 touch wafer 421 conduction layer 423 conduction layer 45 first transmission element 46 second transmission element 47 flexible circuit board 471 conduction layer 473 input/output 埠 48 transmission element 50 flip chip module 52 flexible circuit board 521 via 523 conduction layer 525 Conduction layer 527 conduction layer 54 touch wafer 56 first transmission element 57 second transmission element 58 flexible circuit board 581 conduction layer form number A0101 099125933 page 22 / total 42 page 0992045507-0 201207793
Ο 583 輸入/輸出埠 59 傳輸元件 60 軟性電路板 601 導通孔 603 導通層 605 導通層 607 導通層 62 第一傳輸元件 64 第二傳輸元件 70 覆晶薄膜模組 72 可撓性線路板 721 導通層 723 導通層 74 觸控晶片 76 傳輸元件 80 軟性電路板 801 導通層 803 輸入/輸出埠 099125933 表單編號Α0101 第23頁/共42頁 0992045507-0583 583 Input/Output 埠 59 Transmission Element 60 Flexible Circuit Board 601 Via 603 Conduction Layer 605 Conduction Layer 607 Conduction Layer 62 First Transmission Element 64 Second Transmission Element 70 Flip Chip Module 72 Flexible Circuit Board 721 Conduction Layer 723 conduction layer 74 touch wafer 76 transmission component 80 flexible circuit board 801 conduction layer 803 input / output 埠 099125933 form number Α 0101 page 23 / total 42 page 0992045507-0