201206327 六、發明說明： 【發明所屬之技術領域】 [0001]本發明涉及一種導風罩，尤指一種用於電子器件散”、、 導風罩。 對系統内 相關電子 【先前技術】 [0002]201206327 VI. Description of the Invention: [Technical Field] [0001] The present invention relates to an air hood, and more particularly to an electronic device, and an air hood. Related electronic systems in the system [Prior Art] [0002] ]
現今電腦之配置越來越高，功能越來越強大’ 部電子器件處理資料之速度要求亦越來越高’ 器件產生之熱量亦大量增加。如果不及時將熱量排出’ 將影響電腦運行時之穩定性。因此，具有良好散熱效果 之散熱裝置對保證電腦產品正常運行至關重要。通常’ 於電子裝置内採用導風罩辅助散熱裝置對電子器件散熱 。然而’即使這樣，系統仍然於一些沒有安装電子器件 之位置上消耗了風流，而於一些真正需要散熱之電子器 件上卻沒有足夠之風流，這就導致了系統風流不均衡與 嚴重浪費。 【發明内容】 〇 [0003]鑒於以上内容’有必要提供一種將空間處風流引導至所 需電子器件之導風罩。 [0004] -種導風罩，包括有用於引導系統風流之罩體、及轉動 安裝到所述罩體上之擔板，所述擋板包括有第 一把手及 與第-把手連接之第二把手，所述第—把手伸出所述罩 體之外侧’所述第二把手位於所述罩體之内側，所述稽 板可於帛位置與-第二位置間轉動’於第一位置時 ’所述第二把手允許系統風流穿過所述罩體，於第二位 置時，所述第二把手阻擋系統風流穿過所述罩體。 099124752 表單編號A0101 第3頁/共15頁 0992043505-0 201206327 [0005] 與習知技術相比’所述導風罩之撞板於系統不安裝記憶 體之地方將風流擋住，從而增強了安裝記憶體處之風流 。就不會造成系統風流之浪費，進而提高系統之散熱能 力。 【實施方式】 [00〇6]請參閱圖1 ’本發明導風罩之一實施方式包括一罩體10與 複數擋板20。 [0007]所述罩體1 〇包括一頂壁1 01、及沿所述頂壁1 〇 1兩相對侧 邊緣分別垂直向下延伸之兩側壁103、1〇5。所述頂壁 101開設兩切口 1019。請參考圖3及圖5，所述頂壁1〇1開 設複數開口 1017。所述頂壁1〇1之上表面沿每一開口 1017之兩大致平行於所述側壁1〇3之邊緣設有一對突塊 110，下表面則設有兩對卡鉤113。每一突塊ho及每一 卡鉤113均可彈性變形。每一對突塊no中，其中一突塊 110之靠近另一突塊110之表面上設有一突起HI。每對 卡鉤113間形成一安裝槽11〆 [〇〇〇8]請參考圖4 ’每一擋板20包括一第一把手21、一第二把手 22及連接所述第一把手21與第二把手22之銷軸23。所述 第一把手21之長度及寬度均小於第二把手22，且所述第 一把手21之寬度略加小於所述開口 1〇17之兩大致平行於 所述側壁10 3之邊緣之間之距離’但大於所述每對突塊 110之突起111之間之距離。所述銷軸23之直徑大於每對 卡鉤113之間之最小距離，但小於每對卡鉤113之間之最 大距離。於一實施方式中，所述第一把手21與第二把手 22大致相互垂直。 099124752 表單編號A0101 第4頁/共15頁 0992043505-0 201206327 [0009] 辦·述主機 請參考圖1，所述導風罩可用於一主機80中° ^ 。所述機箱 包括一機箱30、複數風扇40、及一主機扳81 衡邊緣 30包括一底板32、與兩設置於所述底板32之 口㈤定 上之側板31、33。所述風扇40藉由一固定衆U 、 . . 所述主機板 底板3 2上，且位於所述兩側板31、3 3之間° 81固定於所述底板32上，並位於所述風扇貧’ ^ 裝有兩個散熱器50與複數插槽60。所述散熱灸 、/ #電子器件 於所述導風罩之罩體10之切口 1019令，用以訂 ，比如cpu (中央處理器），進行散熱。戶斤述插槽6〇<Nowadays, the configuration of computers is getting higher and higher, and the functions are getting stronger and stronger. The speed of processing electronic data by electronic devices is also increasing. The heat generated by devices is also increasing. If the heat is not discharged in time, it will affect the stability of the computer when it is running. Therefore, a heat sink with good heat dissipation is essential for ensuring the normal operation of computer products. Typically, an air hood is used in the electronic device to assist the heat sink to dissipate heat from the electronic device. However, even in this case, the system still consumes wind flow at some locations where no electronic components are installed, but there is not enough wind flow on some electronic devices that really need to dissipate heat, which leads to unbalanced and severe waste of system airflow. SUMMARY OF THE INVENTION [0003] In view of the above, it is necessary to provide an air hood that directs airflow at a space to a desired electronic device. [0004] A wind deflector includes a cover for guiding a system flow, and a support plate rotatably mounted to the cover, the baffle including a first handle and a second handle connected to the first handle The first handle extends out of the outer side of the cover body. The second handle is located inside the cover body, and the check plate is rotatable between the top position and the second position 'in the first position'. The second handle allows the system to flow through the cover, and in the second position, the second handle blocks the system from flowing through the cover. 099124752 Form No. A0101 Page 3 of 15 0992043505-0 201206327 [0005] Compared with the prior art, the baffle of the air deflector blocks the wind flow where the system does not have a memory, thereby enhancing the installation memory. The wind is flowing. It will not cause waste of system airflow, and thus improve the cooling capacity of the system. [Embodiment] [00〇6] Please refer to FIG. 1. One embodiment of the air duct of the present invention includes a cover 10 and a plurality of baffles 20. The cover body 1 includes a top wall 101, and two side walls 103, 1〇5 extending vertically downward along opposite side edges of the top wall 1 〇 1 respectively. The top wall 101 defines two slits 1019. Referring to Figures 3 and 5, the top wall 1〇1 is provided with a plurality of openings 1017. The upper surface of the top wall 1〇1 is provided with a pair of protrusions 110 along the edges of each of the openings 1017 substantially parallel to the side walls 1〇3, and the lower surface is provided with two pairs of hooks 113. Each of the projections ho and each of the hooks 113 are elastically deformable. Among the pair of protrusions no, one of the protrusions 110 is provided with a protrusion HI on the surface of the other protrusion 110. Each of the pair of hooks 113 forms a mounting groove 11 〆 [〇〇〇 8] Please refer to FIG. 4 'each baffle 20 includes a first handle 21, a second handle 22 and a connection between the first handle 21 and the second handle 22 pin 23. The length and width of the first handle 21 are smaller than the second handle 22, and the width of the first handle 21 is slightly smaller than the distance between the two edges of the opening 1〇17 substantially parallel to the edge of the side wall 103. However, it is larger than the distance between the protrusions 111 of each pair of protrusions 110. The diameter of the pin 23 is greater than the minimum distance between each pair of hooks 113, but less than the maximum distance between each pair of hooks 113. In one embodiment, the first handle 21 and the second handle 22 are substantially perpendicular to each other. 099124752 Form No. A0101 Page 4 of 15 0992043505-0 201206327 [0009] Office Refer to Figure 1, the air hood can be used in a host 80 ° ^. The chassis includes a chassis 30, a plurality of fans 40, and a main board 81 balance edge 30 including a bottom plate 32 and two side plates 31, 33 disposed on the bottom (5) of the bottom plate 32. The fan 40 is fixed on the bottom plate 32 by a fixing member U, . . . on the motherboard bottom plate 3 2 and located between the two side plates 31, 33, and is located at the fan ' ^ Mounted with two heat sinks 50 and multiple slots 60. The heat-dissipating moxibustion, / #electronic device is in the slit 1019 of the cover 10 of the air hood, for ordering, for example, a CPU (central processing unit) for heat dissipation. User said slot 6〇<
以插接複數記憶體70。 加手21從 [0010] 請參閱圖2至圖5，安裝時，所述擋板20之第〆犯 所述罩體ίο之頂壁ιοί之下表面穿過所述開口1()17而 到所述頂壁ιοί之上表面，且位於對應之兩突塊110之麽 。將所述擋板20之銷軸23放置於對應之卡鉤113上°To plug in the plurality of memories 70. Handle 21 from [0010] Please refer to FIG. 2 to FIG. 5, the third surface of the baffle 20 passes through the opening 1 () 17 after the top wall of the cover body ίο The top wall ιοί has an upper surface and is located between the corresponding two protrusions 110. The pin 23 of the baffle 20 is placed on the corresponding hook 113.
所述擋板20，使對應卡鉤113發生彈性變形，從而將所述 銷軸23壓入到所述安裝槽11内。此時，所述卡鉤1丨3禪性 恢復，所述銷軸23被卡釣113卡住’所述銷軸23可於所述 安裝槽11内轉動。 [0011] 請參考圖3及圖4，所述擋板20可於一第〜位置與一第二 位置間轉動。當所述擔板位於所述第-位置時，所述 第一把手21轉動到一大致垂直所述罩體10之頂壁丨01之位 置，並為所述突塊110之突起1Π所阻擋，從而防止所述 擋板20向下轉動，所述第二把手22與所述頂壁1〇1大致平 行。當所述擔板位於所述第一位置時，所述第一把手 21向下轉動到靠近所述頂壁1〇1之上表面，並與所述頂壁 099124752 表單編號A0101 第5頁/共15頁 0992043505-0 201206327 101之夾角為銳角’且為所述突起111所阻於，认 Μ ’攸而防止 所述擋板20向上轉動’所述第二把手22與所述頂壁1〇1之 間成之夾角為銳角。 [0012] 於所述擋板20於所述第一位置與所述第二位置之間轉動 之過程中，當所述第一把手21擠壓所述突塊11〇之突起 111時，會驅使所述突塊Π0彈性變形，直到所述第—把 手21能夠越過所述突起Π1。而當所述第一把手21越過所 述突起111後，所述突塊11〇彈性回復，以使所述突起 111能夠阻擋所述第一把手21轉動。 [0013] 請參考圖2，使用時，將所述導風覃放置於所述主機8〇之 主機板81上中，並位於所述風扇40之一側。所述撞板2〇 位於所述主機板81之60之上方’所述散熱器50收容於所 述罩體10之切口 1019中。所述導風罩可將所述風扇4〇帶 動之風流集中到所述散熱器50及記憶體70處。 [0014] 當所述插槽60安裝有記憶體70時，所述擋板20轉動到第 二位置，此時，所述第二把手22木阻擋風流流到所述記 憶體70進行散熱。 [0015] #有的插槽不安裝記憶體70時’轉動對應之擋板2〇到 所述第-位置，所述第二把手22會阻擋了來自風扇40之 風流，從而風流能㈣集巾地藉祕述散鮮5G與記憶 體，提高了系統散熱效率。 [0016] 、综上所述，本發㈣已符合發明專利要求’爰依法提出 專利申請。惟，以上所述者僅為本發明之較佳實施方式 ，舉凡熟悉本發明技藝之人士，羡依本發明之精神所作 099124752 表單編號A0101 0992043505-0 201206327 之等效修飾或變化，皆應涵蓋於以下之申請專利範圍内 〇 [0017] 【圖式簡單說明】 圖1是本發明實施方式導風罩與主機之一立體分解圖。 [0018] 圖2是本發明實施方式導風罩與主機之一立體組裝圖。 [0019] 圖3是圖1之導風罩之一部分立體圖。 [0020] 圖4是圖3之一部分立體分解圖。 八 [0021] Ο 圖5是圖4之局部放大圖。 【主要元件符號說明】 [0022] 罩體：10 [0023] 擋板：20 [0024] 頂壁：101 [0025] 侧壁：103、105 [0026] ❹ [0027] 切口 ： 1019 開口 ： 1 01 7 [0028] 凸塊：11 0 [0029] 卡鉤：113 [0030] 突起：111 [0031] 安裝槽：11 [0032] 第一把手：21 099124752 表單編號Α0101 第7頁/共15頁 0992043505-0 201206327 [0033] 第二把手：22 [0034] 鎖軸：2 3 [0035] 主機：80 [0036] 主機板：81 [0037] 機箱：30 [0038] 風扇：4 0 [0039] 底板：32 [0040] 侧板：31、33 [0041] 散熱器：50 [0042] 插槽’· 6 0 [0043] 記憶體：70 099124752 表單編號A0101 第8頁/共15頁 0992043505-0The baffle 20 elastically deforms the corresponding hook 113 to press the pin 23 into the mounting groove 11. At this time, the hooks 1丨3 are restored, and the pin 23 is caught by the catch 113. The pin 23 is rotatable in the mounting groove 11. Referring to FIG. 3 and FIG. 4, the baffle 20 is rotatable between a first position and a second position. When the support plate is in the first position, the first handle 21 is rotated to a position substantially perpendicular to the top wall 丨01 of the cover body 10, and is blocked by the protrusion 1Π of the protrusion 110, thereby The baffle 20 is prevented from rotating downward, and the second handle 22 is substantially parallel to the top wall 1〇1. When the plate is in the first position, the first handle 21 is rotated downward to be close to the upper surface of the top wall 〇1, and with the top wall 099124752 Form No. A0101 Page 5 of 15 The angle of the page 0992043505-0 201206327 101 is an acute angle 'and is blocked by the protrusion 111, which prevents the baffle 20 from rotating upwards'. The second handle 22 and the top wall 1〇1 The angle between the formations is an acute angle. [0012] during the rotation of the baffle 20 between the first position and the second position, when the first handle 21 presses the protrusion 111 of the protrusion 11 The projection Π 0 is elastically deformed until the first handle 21 can pass over the projection Π1. When the first handle 21 passes over the protrusion 111, the protrusion 11 〇 elastically recovers, so that the protrusion 111 can block the rotation of the first handle 21. Referring to FIG. 2, in use, the air guide is placed on the main board 81 of the main unit 8 and located on one side of the fan 40. The bumper 2 is located above the 60 of the main board 81. The heat sink 50 is received in the slit 1019 of the cover 10. The air hood can concentrate the wind flow driven by the fan 4 to the heat sink 50 and the memory 70. [0014] When the slot 60 is mounted with the memory 70, the shutter 20 is rotated to the second position, at which time the second handle 22 blocks the wind flow to the memory body 70 for heat dissipation. [0015] When the memory slot 70 is not installed, the corresponding baffle 2 is turned to the first position, and the second handle 22 blocks the wind flow from the fan 40, so that the wind energy can be (4) The ground uses the secret 5G and memory to improve the heat dissipation efficiency of the system. [0016] In summary, the present invention (4) has met the requirements of the invention patent 爰 提出 filed a patent application according to law. However, the above description is only a preferred embodiment of the present invention, and equivalent modifications or variations of 099124752 Form No. A0101 0992043505-0 201206327 in accordance with the spirit of the present invention should be encompassed by those skilled in the art. BRIEF DESCRIPTION OF THE DRAWINGS [0017] BRIEF DESCRIPTION OF THE DRAWINGS FIG. 1 is an exploded perspective view of an air duct and a main body according to an embodiment of the present invention. 2 is a perspective assembled view of an air hood and a main body according to an embodiment of the present invention. 3 is a partial perspective view of the air hood of FIG. 1. 4 is a partial exploded perspective view of FIG. 3. 8 [0021] FIG. 5 is a partial enlarged view of FIG. 4. [Main component symbol description] [0022] Cover: 10 [0023] Baffle: 20 [0024] Top wall: 101 [0025] Side wall: 103, 105 [0026] ❹ [0027] Cut: 1019 Opening: 1 01 7 [0028] Bump: 11 0 [0029] Hook: 113 [0030] Protrusion: 111 [0031] Mounting groove: 11 [0032] First handle: 21 099124752 Form number Α 0101 Page 7 / Total 15 page 0992043505-0 201206327 [0033] Second handle: 22 [0034] Locking shaft: 2 3 [0035] Main unit: 80 [0036] Motherboard: 81 [0037] Chassis: 30 [0038] Fan: 4 0 [0039] Base plate: 32 [ 0040] Side panel: 31, 33 [0041] Heatsink: 50 [0042] Slot '· 6 0 [0043] Memory: 70 099124752 Form No. A0101 Page 8 of 15 0992043505-0