201205883 六、發明說明： 【發明所屬之技術領 [0001] 本發明涉及一種發光二極體光源模塊。 [先前技術3 [0002] 先前的發光二極體封裝體一般是藉由激發包覆在發光二 極體晶片表面的螢先粉來發出各種顏色的光線。惟係， 在此種發光二極體封裝體中’因所述螢光粉與發光二極 體晶片直接接觸’所述發光二極體晶片所產生的熱量會 造成該螢光粉過熱而使最終發出的光線產生色衰，從而 影響發光二極體封裝體的發光品質。而且，所述發光二 極晶片被螢光粉所包覆會導致發光二極體封裝體散熱不 良，從而縮短了發光二極體封裝體的使用壽命。 【發明内容】 [0003] 有鑒於此，有必要提供一種可避免色衰且能提高發光二 極體使用壽命的發光二極體光源模塊。 [0004] —種發光二極體光源模塊，其包括基板、發光二極體封 裝體、透鏡及筆光粉。所述發光二極體封裝體固設在所 述基板上’並藉由該基板與外界實現電連接。所述透鏡 形成有一内凹的容置空間，所述透鏡固設在所述基板上 以將所述發光二極體封裝體密封在所述容置空間内。所 述榮光粉塗布在所述透鏡的表面上。所述發光二極體封 裝體所發出的光線在穿過所述透鏡的過程中被塗布在透 鏡上的螢光粉轉換為具有特定波長的光線而向外輻射。 [0005] 相對於習知技術，本發明所提供的發光二極體光源模塊 是藉由塗布在透鏡上的螢光粉來轉換發光二極體封裝體 099124607 表單編號A0101 第3頁/共】3頁 0992043264-0 201205883 所發出的光線的波長。所以，該發光二極體封裝體内的 發光二極體晶片上不再需要直接覆蓋螢光粉，從而使得 所述發光二極體晶片在發光過程中所產生的熱量可以得 到及時的疏散’亦避免了所述螢光粉因過熱而產生的色 衰’大大地延長了所述發光二極體光源模塊的使用壽命 ，且提高了所述發光二極體光源模塊的發光品質。 【實施方式】 [0006] [0007] [0008] [0009] 099124607 下面參照附圖，結合實施例對本發明作進一步說明。 如圖1所示，本發明實施方式所提供的發光二極體光源模 塊1包括基板10、發光二極體封裝體】2、透鏡14及螢光粉 16。所述發光二極體封裝體12固設在所述基板1〇上。所 述透鏡14黏設在所述基板1〇上以遮蓋蜡述發光二極體封 裝體12。所述螢光粉16塗敷在所述透鏡μ的表面上。所 述發光二極體封裝體12所發出的光線在穿過透鏡14時被 螢光粉16轉變為特定波長的光線而向外輻射。 ：. .. .... · . 所述基板10上佈設有傳輸電路(圖来示）。所述發光二極 體封裝體12藉由覆晶或連接導i綠的方式貼設於所述基板 10上，並藉由所述基板10與外界實現電連接。 所述透鏡14為一内凹的中空半球體’可以理解地，透鏡 14還可以根據配光需要實施成其他形狀。所述透鏡包括 内凹的入光面140、外凸的出光面142及連接所述入光面 140和出光面142的連择部143。所述螢光粉16塗布在所 述透鏡14的入光面140或出光面142上，以轉換由所述發 光二極體封裝體12所發出光線的波長。所述螢光粉16可 為硫化物、鋁酸鹽、氧化物、矽酸鹽或氮化物。具體地 表單煸號A0101 第4頁/共13頁 0992043264-0 201205883 ’所述螢光粉16的化學成可以為：Ca2A 11209 : Μη、 (Ca, Sr, Ba)A1204:Eu ' Y3A15012:Ce3 + (YAG) ' Tb3A15012:Ce3 + (TAG) ' BaMgA110017:Eu2 +(Mn2 + ) ' Ca2Si5N8:Eu2+ ' (Ca,Sr,Ba)S:Eu2+ ' (Mg, Ca，Sr,Ba)2Si〇4:Eu2+、 (Mg，Ca，Sr，Ba)3Si207:Eu2+、 Ca8Mg(Si04)4C12:Eu2+、Y202S:Eu3+、CdS、CdTe或 CdSe ° 0 [0010] 在進行組裝時，所述透鏡14遮蓋住所述基板10上的發光 二極體封裝體12，所述連接部143藉由膠體15固定連接 在所述基板10上。所述透鏡14與基:板1〇共同形成一密閉 的容置空間17，所述發光二極鱧封裝體12被密封在所述 容置空間17内。所述容置空間17可抽成真空，亦可以充 入氮氣或其他惰性氣體。 [0011] G 在所述發光二極體封裝體12正常工作時，斬述發光二極 體封裝體12所發出的光線在穿過所述透鏡14的過程中被 塗布在透鏡14上的螢光粉16轉換為具有特定波長的光線 。藉由選擇具有不同化學成份的螢光粉16可以使得所述 發光二極體光源模塊1發出不同顏色的光線。 [0012] 請一併參閱圖1、圖2、圖3及圖4，可以理解的是，所述 螢光粉16既可以如圖1所示塗布在所述透鏡14的整個出光 面142，亦可以如圖2所示塗布在所述透鏡14的整個出光 面142，以將所述發光二極體封裝體所發出的光轉換為 099124607 一種特定波長的光。進一步地，所述螢光粉16亦可以如 圖3所示只塗布在所述透鏡14的一部分入光面14〇或一部 表單編號A0101 第5頁/共13頁 0992043264-0 201205883 分出光面142，以使得所述發光二極體封裝體12所發出的 光線一部分保留原有的波長，另一部分被所述螢光粉16 轉換為另一種特定的波長。另外，如圖4所示，還可以採 用具有不同化學成份的第一螢光粉16a和第二螢光粉16b 分別塗布在所述出光面142的不同部分或分別塗布在所述 入光面140的不同部分，以將所述發光二極體封裝體12所 發出的光線分別轉換為具有不同特定波長的光線，從而 使得所述發光二極體光源模塊1實現多色光同時輸出的效 果。 [0013] 因為所述發光二極體光源模塊1是藉由塗布在透鏡14上的 螢光粉16來轉換發光二極體封裝體12所發出的光線的波 長。所以，該發光二極體封裝體12内的發光二極體晶片 上不再需要直接覆蓋螢光粉16，從而使得所述發光二極 體晶片在發光過程中所產生的熱量可以得到及時的疏散 ，亦避免了所述螢光粉16因過熱而產生的色衰，大大地 延長了所述發光二極體光源模塊1的使用壽命，且提高了 所述發光二極體光源模塊1的發光品質。 [0014] 綜上所述，本發明符合發明專利要件，爰依法提出專利 申請。惟，以上所述者僅為本發明之較佳實施例，舉凡 熟悉本案技藝之人士，在爰依本發明精神所作之等效修 飾或變化，皆應涵蓋於以下之申請專利範圍内。 【圖式簡單說明】 [0015] 圖1所示為本發明實施方式所提供的發光二極體光源模塊 的第一種螢光粉塗布方式示意圖。 [0016] 圖2所示為圖1中的發光二極體光源模塊的第二種螢光粉 099124607 表單編號A0101 第6頁/共13頁 0992043264-0 201205883 [0017] 塗布方式示意圖。 圖3所示為圖1中的發光二極體光源模塊的第三種螢光粉 塗布方式示意圖。 [0018] 圖4所示為圖1中的發光二極體光源模塊的第四種螢光粉 塗布方式不意圖。 [0019] 【主要元件符號說明】 發光二極體光源模塊：1 [0020] Ο [0021] 基板：10 發光二極體封裝體：12 [0022] 透鏡：14 [0023] 螢光粉：16 [0024] 膠體：15 [0025] 入光面：14 0 Ο [0026] 出光面：142 [0027] 連接部：143 [0028] 容置空間：17 [0029] 第一螢光粉：16a [0030] 第二螢光粉：16b 099124607 表單編號A0101 第7頁/共13頁 0992043264-0201205883 VI. Description of the Invention: [Technical Field] [0001] The present invention relates to a light emitting diode light source module. [Prior Art 3 [0002] A conventional light-emitting diode package generally emits light of various colors by exciting a powder of fluorescing powder coated on the surface of a light-emitting diode wafer. However, in such a light-emitting diode package, the heat generated by the light-emitting diode wafer due to the direct contact between the phosphor powder and the light-emitting diode wafer causes the phosphor powder to overheat and eventually The emitted light produces color fading, which affects the illuminating quality of the LED package. Moreover, the light-emitting diode chip is covered with the phosphor powder, which may cause poor heat dissipation of the light-emitting diode package, thereby shortening the service life of the light-emitting diode package. SUMMARY OF THE INVENTION [0003] In view of the above, it is necessary to provide a light-emitting diode light source module that can avoid color decay and improve the service life of a light-emitting diode. [0004] A light emitting diode light source module comprising a substrate, a light emitting diode package, a lens, and a pencil powder. The LED package is fixed on the substrate and electrically connected to the outside by the substrate. The lens is formed with a concave receiving space, and the lens is fixed on the substrate to seal the light emitting diode package in the accommodating space. The glare powder is coated on the surface of the lens. The light emitted by the light-emitting diode package is converted into light having a specific wavelength and radiated outward during the passage of the lens through the lens. [0005] Compared with the prior art, the LED light source module provided by the present invention converts the LED package by using the phosphor powder coated on the lens. 099124607 Form No. A0101 Page 3 / Total 3 Page 0992043264-0 201205883 The wavelength of the light emitted. Therefore, it is no longer necessary to directly cover the phosphor powder on the LED body of the LED package, so that the heat generated by the LED chip during the illumination process can be timely evacuated. The color decay caused by the overheating of the phosphor powder is avoided, the service life of the light emitting diode light source module is greatly prolonged, and the light emitting quality of the light emitting diode light source module is improved. [Embodiment] [0007] [0009] [0009] The following is a further description of the present invention with reference to the accompanying drawings. As shown in FIG. 1, a light-emitting diode light source module 1 according to an embodiment of the present invention includes a substrate 10, a light-emitting diode package 2, a lens 14, and a phosphor powder 16. The LED package 12 is fixed on the substrate 1 . The lens 14 is adhered to the substrate 1 to cover the wax-emitting diode package 12. The phosphor powder 16 is coated on the surface of the lens μ. The light emitted by the LED package 12 is converted to a specific wavelength of light by the phosphor 16 as it passes through the lens 14 and radiates outward. : . . . . . . . . . The substrate 10 is provided with a transmission circuit (shown). The LED package 12 is attached to the substrate 10 by flip chip or connection, and is electrically connected to the outside by the substrate 10. The lens 14 is a concave hollow hemisphere. As can be understood, the lens 14 can also be embodied in other shapes as needed for light distribution. The lens includes a concave light-incident surface 140, a convex light-emitting surface 142, and a connecting portion 143 connecting the light-incident surface 140 and the light-emitting surface 142. The phosphor powder 16 is coated on the light incident surface 140 or the light exit surface 142 of the lens 14 to convert the wavelength of light emitted by the light emitting diode package 12. The phosphor powder 16 can be a sulfide, an aluminate, an oxide, a niobate or a nitride. Specifically, the form nickname A0101 Page 4 / 13 pages 0992043264-0 201205883 'The chemical formation of the phosphor powder 16 can be: Ca2A 11209 : Μη, (Ca, Sr, Ba) A1204: Eu ' Y3A15012: Ce3 + (YAG) 'Tb3A15012:Ce3 + (TAG) ' BaMgA110017:Eu2 +(Mn2 + ) ' Ca2Si5N8:Eu2+ ' (Ca,Sr,Ba)S:Eu2+ ' (Mg, Ca,Sr,Ba)2Si〇4:Eu2+ (Mg, Ca, Sr, Ba) 3Si207: Eu2+, Ca8Mg(Si04)4C12: Eu2+, Y202S: Eu3+, CdS, CdTe or CdSe ° 0 [0010] When assembled, the lens 14 covers the substrate 10 In the upper LED package 12, the connecting portion 143 is fixedly connected to the substrate 10 by a colloid 15. The lens 14 and the base plate 1 together form a sealed accommodating space 17, and the LED package 12 is sealed in the accommodating space 17. The accommodating space 17 can be evacuated or filled with nitrogen or other inert gas. [0011] When the LED package 12 is in normal operation, the light emitted by the LED package 12 is coated on the lens 14 during the process of passing through the lens 14. The powder 16 is converted into light having a specific wavelength. The light-emitting diode light source module 1 can emit light of different colors by selecting the phosphor powder 16 having different chemical compositions. [0012] Please refer to FIG. 1, FIG. 2, FIG. 3 and FIG. 4 together. It can be understood that the phosphor powder 16 can be applied to the entire light-emitting surface 142 of the lens 14 as shown in FIG. The entire light exiting surface 142 of the lens 14 can be applied as shown in FIG. 2 to convert the light emitted by the light emitting diode package into 099124607 light of a specific wavelength. Further, the phosphor powder 16 may also be applied only to a part of the light-incident surface 14 of the lens 14 as shown in FIG. 3 or a part number A0101 page 5 / 13 pages 0992043264-0 201205883 142, such that a part of the light emitted by the LED package 12 retains the original wavelength, and another part is converted by the phosphor 16 into another specific wavelength. In addition, as shown in FIG. 4, the first phosphor powder 16a and the second phosphor powder 16b having different chemical compositions may be respectively applied to different portions of the light-emitting surface 142 or respectively coated on the light-incident surface 140. The different portions of the light-emitting diode package 12 are respectively converted into light rays having different specific wavelengths, thereby enabling the light-emitting diode light source module 1 to realize the simultaneous output of multi-color light. [0013] Since the light-emitting diode light source module 1 is converted by the phosphor powder 16 coated on the lens 14, the wavelength of light emitted by the light-emitting diode package 12 is converted. Therefore, it is no longer necessary to directly cover the phosphor powder 16 on the LED chip in the LED package 12, so that the heat generated by the LED wafer during the illumination process can be evacuated in time. The color fading caused by the overheating of the phosphor powder 16 is also avoided, the service life of the light emitting diode light source module 1 is greatly prolonged, and the illuminating quality of the illuminating diode light source module 1 is improved. . [0014] In summary, the present invention complies with the requirements of the invention patent, and submits a patent application according to law. However, the above description is only the preferred embodiment of the present invention, and equivalent modifications or variations made by those skilled in the art of the present invention should be included in the following claims. BRIEF DESCRIPTION OF THE DRAWINGS [0015] FIG. 1 is a schematic view showing a first type of phosphor coating method of a light-emitting diode light source module according to an embodiment of the present invention. 2 is a second type of phosphor powder of the light-emitting diode light source module of FIG. 1 099124607 Form No. A0101 Page 6 of 13 0992043264-0 201205883 [0017] Schematic diagram of coating method. FIG. 3 is a schematic view showing a third fluorescent powder coating method of the light emitting diode light source module of FIG. 1. 4 is a schematic view showing a fourth type of phosphor coating method of the light emitting diode light source module of FIG. 1. [Description of Main Component Symbols] Light Emitting Diode Light Source Module: 1 [0020] 基板 [0021] Substrate: 10 Light Emitting Diode Package: 12 [0022] Lens: 14 [0023] Fluorescent Powder: 16 [ 0024] Colloid: 15 [0025] Light-in surface: 14 0 Ο [0026] Light-emitting surface: 142 [0027] Connection: 143 [0028] accommodating space: 17 [0029] First phosphor: 16a [0030] Second Fluorescent Powder: 16b 099124607 Form No. A0101 Page 7 / Total 13 Page 0992043264-0