TW201201632A - Surface treatment device - Google Patents
Surface treatment device Download PDFInfo
- Publication number
- TW201201632A TW201201632A TW100107787A TW100107787A TW201201632A TW 201201632 A TW201201632 A TW 201201632A TW 100107787 A TW100107787 A TW 100107787A TW 100107787 A TW100107787 A TW 100107787A TW 201201632 A TW201201632 A TW 201201632A
- Authority
- TW
- Taiwan
- Prior art keywords
- chamber
- sub
- processed
- carry
- guide roller
- Prior art date
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- 238000004381 surface treatment Methods 0.000 title claims abstract description 28
- 238000011282 treatment Methods 0.000 claims abstract description 43
- 239000007789 gas Substances 0.000 claims description 98
- 238000012545 processing Methods 0.000 claims description 76
- 230000007246 mechanism Effects 0.000 claims description 29
- 238000005192 partition Methods 0.000 claims description 25
- 238000004804 winding Methods 0.000 claims description 22
- 239000011261 inert gas Substances 0.000 claims description 8
- 230000007723 transport mechanism Effects 0.000 claims description 4
- 230000002093 peripheral effect Effects 0.000 claims description 3
- 238000012546 transfer Methods 0.000 claims description 3
- 238000013022 venting Methods 0.000 claims 1
- 238000009423 ventilation Methods 0.000 abstract 2
- QTBSBXVTEAMEQO-UHFFFAOYSA-N Acetic acid Chemical compound CC(O)=O QTBSBXVTEAMEQO-UHFFFAOYSA-N 0.000 description 9
- CBENFWSGALASAD-UHFFFAOYSA-N Ozone Chemical compound [O-][O+]=O CBENFWSGALASAD-UHFFFAOYSA-N 0.000 description 9
- 238000004891 communication Methods 0.000 description 8
- 230000032258 transport Effects 0.000 description 8
- 238000000034 method Methods 0.000 description 7
- 230000008569 process Effects 0.000 description 7
- SMZOUWXMTYCWNB-UHFFFAOYSA-N 2-(2-methoxy-5-methylphenyl)ethanamine Chemical compound COC1=CC=C(C)C=C1CCN SMZOUWXMTYCWNB-UHFFFAOYSA-N 0.000 description 6
- NIXOWILDQLNWCW-UHFFFAOYSA-N 2-Propenoic acid Natural products OC(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 description 6
- -1 polypropylene Polymers 0.000 description 6
- 239000000178 monomer Substances 0.000 description 5
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 4
- 230000007613 environmental effect Effects 0.000 description 4
- 230000003287 optical effect Effects 0.000 description 4
- 239000004698 Polyethylene Substances 0.000 description 3
- 230000004323 axial length Effects 0.000 description 3
- 230000008859 change Effects 0.000 description 3
- 238000001514 detection method Methods 0.000 description 3
- 230000035515 penetration Effects 0.000 description 3
- 239000011347 resin Substances 0.000 description 3
- 229920005989 resin Polymers 0.000 description 3
- 238000011144 upstream manufacturing Methods 0.000 description 3
- HGINCPLSRVDWNT-UHFFFAOYSA-N Acrolein Chemical compound C=CC=O HGINCPLSRVDWNT-UHFFFAOYSA-N 0.000 description 2
- SOGAXMICEFXMKE-UHFFFAOYSA-N Butylmethacrylate Chemical compound CCCCOC(=O)C(C)=C SOGAXMICEFXMKE-UHFFFAOYSA-N 0.000 description 2
- 229920000089 Cyclic olefin copolymer Polymers 0.000 description 2
- 239000004713 Cyclic olefin copolymer Substances 0.000 description 2
- BAPJBEWLBFYGME-UHFFFAOYSA-N Methyl acrylate Chemical compound COC(=O)C=C BAPJBEWLBFYGME-UHFFFAOYSA-N 0.000 description 2
- KJTLSVCANCCWHF-UHFFFAOYSA-N Ruthenium Chemical compound [Ru] KJTLSVCANCCWHF-UHFFFAOYSA-N 0.000 description 2
- 239000012159 carrier gas Substances 0.000 description 2
- 239000000428 dust Substances 0.000 description 2
- 238000005530 etching Methods 0.000 description 2
- SUPCQIBBMFXVTL-UHFFFAOYSA-N ethyl 2-methylprop-2-enoate Chemical compound CCOC(=O)C(C)=C SUPCQIBBMFXVTL-UHFFFAOYSA-N 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 229920000573 polyethylene Polymers 0.000 description 2
- 229920000139 polyethylene terephthalate Polymers 0.000 description 2
- 239000005020 polyethylene terephthalate Substances 0.000 description 2
- 238000006116 polymerization reaction Methods 0.000 description 2
- 238000005096 rolling process Methods 0.000 description 2
- 229910052707 ruthenium Inorganic materials 0.000 description 2
- 229920002818 (Hydroxyethyl)methacrylate Polymers 0.000 description 1
- BMOSXUUJLUXGDE-UHFFFAOYSA-N 2,4-dimethylpent-3-enoic acid Chemical compound OC(=O)C(C)C=C(C)C BMOSXUUJLUXGDE-UHFFFAOYSA-N 0.000 description 1
- JAHNSTQSQJOJLO-UHFFFAOYSA-N 2-(3-fluorophenyl)-1h-imidazole Chemical compound FC1=CC=CC(C=2NC=CN=2)=C1 JAHNSTQSQJOJLO-UHFFFAOYSA-N 0.000 description 1
- DAWJJMYZJQJLPZ-UHFFFAOYSA-N 2-sulfanylprop-2-enoic acid Chemical compound OC(=O)C(S)=C DAWJJMYZJQJLPZ-UHFFFAOYSA-N 0.000 description 1
- NRWRTFLQWVVHQV-UHFFFAOYSA-N 3-methylheptane;prop-2-enoic acid Chemical compound OC(=O)C=C.CCCCC(C)CC NRWRTFLQWVVHQV-UHFFFAOYSA-N 0.000 description 1
- 229920002284 Cellulose triacetate Polymers 0.000 description 1
- WOBHKFSMXKNTIM-UHFFFAOYSA-N Hydroxyethyl methacrylate Chemical compound CC(=C)C(=O)OCCO WOBHKFSMXKNTIM-UHFFFAOYSA-N 0.000 description 1
- 239000004642 Polyimide Substances 0.000 description 1
- 239000004743 Polypropylene Substances 0.000 description 1
- OFOBLEOULBTSOW-UHFFFAOYSA-N Propanedioic acid Natural products OC(=O)CC(O)=O OFOBLEOULBTSOW-UHFFFAOYSA-N 0.000 description 1
- XTXRWKRVRITETP-UHFFFAOYSA-N Vinyl acetate Chemical compound CC(=O)OC=C XTXRWKRVRITETP-UHFFFAOYSA-N 0.000 description 1
- NNLVGZFZQQXQNW-ADJNRHBOSA-N [(2r,3r,4s,5r,6s)-4,5-diacetyloxy-3-[(2s,3r,4s,5r,6r)-3,4,5-triacetyloxy-6-(acetyloxymethyl)oxan-2-yl]oxy-6-[(2r,3r,4s,5r,6s)-4,5,6-triacetyloxy-2-(acetyloxymethyl)oxan-3-yl]oxyoxan-2-yl]methyl acetate Chemical compound O([C@@H]1O[C@@H]([C@H]([C@H](OC(C)=O)[C@H]1OC(C)=O)O[C@H]1[C@@H]([C@@H](OC(C)=O)[C@H](OC(C)=O)[C@@H](COC(C)=O)O1)OC(C)=O)COC(=O)C)[C@@H]1[C@@H](COC(C)=O)O[C@@H](OC(C)=O)[C@H](OC(C)=O)[C@H]1OC(C)=O NNLVGZFZQQXQNW-ADJNRHBOSA-N 0.000 description 1
- 230000004913 activation Effects 0.000 description 1
- 238000010923 batch production Methods 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 230000000903 blocking effect Effects 0.000 description 1
- CQEYYJKEWSMYFG-UHFFFAOYSA-N butyl acrylate Chemical compound CCCCOC(=O)C=C CQEYYJKEWSMYFG-UHFFFAOYSA-N 0.000 description 1
- 210000000078 claw Anatomy 0.000 description 1
- 238000004140 cleaning Methods 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- MLUCVPSAIODCQM-NSCUHMNNSA-N crotonaldehyde Chemical compound C\C=C\C=O MLUCVPSAIODCQM-NSCUHMNNSA-N 0.000 description 1
- MLUCVPSAIODCQM-UHFFFAOYSA-N crotonaldehyde Natural products CC=CC=O MLUCVPSAIODCQM-UHFFFAOYSA-N 0.000 description 1
- 238000009792 diffusion process Methods 0.000 description 1
- 229910001873 dinitrogen Inorganic materials 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- WCZHHZGITDJUQI-UHFFFAOYSA-N ethane-1,2-diol;methyl prop-2-enoate Chemical compound OCCO.COC(=O)C=C WCZHHZGITDJUQI-UHFFFAOYSA-N 0.000 description 1
- 230000005284 excitation Effects 0.000 description 1
- 239000002360 explosive Substances 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 230000036571 hydration Effects 0.000 description 1
- 238000006703 hydration reaction Methods 0.000 description 1
- 230000008595 infiltration Effects 0.000 description 1
- 238000001764 infiltration Methods 0.000 description 1
- VZCYOOQTPOCHFL-UPHRSURJSA-N maleic acid Chemical compound OC(=O)\C=C/C(O)=O VZCYOOQTPOCHFL-UPHRSURJSA-N 0.000 description 1
- 239000011976 maleic acid Substances 0.000 description 1
- LVHBHZANLOWSRM-UHFFFAOYSA-N methylenebutanedioic acid Natural products OC(=O)CC(=C)C(O)=O LVHBHZANLOWSRM-UHFFFAOYSA-N 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 229910052757 nitrogen Inorganic materials 0.000 description 1
- 229940065472 octyl acrylate Drugs 0.000 description 1
- ANISOHQJBAQUQP-UHFFFAOYSA-N octyl prop-2-enoate Chemical compound CCCCCCCCOC(=O)C=C ANISOHQJBAQUQP-UHFFFAOYSA-N 0.000 description 1
- DVZMDSYZCLQXGK-UHFFFAOYSA-N oxiran-2-ylmethyl 2-sulfanylacetate Chemical compound SCC(=O)OCC1CO1 DVZMDSYZCLQXGK-UHFFFAOYSA-N 0.000 description 1
- 229920003229 poly(methyl methacrylate) Polymers 0.000 description 1
- 229920001721 polyimide Polymers 0.000 description 1
- 229920000642 polymer Polymers 0.000 description 1
- 239000004926 polymethyl methacrylate Substances 0.000 description 1
- 229920000098 polyolefin Polymers 0.000 description 1
- 229920001155 polypropylene Polymers 0.000 description 1
- 230000001737 promoting effect Effects 0.000 description 1
- BDERNNFJNOPAEC-UHFFFAOYSA-N propan-1-ol Chemical compound CCCO BDERNNFJNOPAEC-UHFFFAOYSA-N 0.000 description 1
- BOQSSGDQNWEFSX-UHFFFAOYSA-N propan-2-yl 2-methylprop-2-enoate Chemical compound CC(C)OC(=O)C(C)=C BOQSSGDQNWEFSX-UHFFFAOYSA-N 0.000 description 1
- 230000001681 protective effect Effects 0.000 description 1
- 230000004044 response Effects 0.000 description 1
- 239000002002 slurry Substances 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
- SJMYWORNLPSJQO-UHFFFAOYSA-N tert-butyl 2-methylprop-2-enoate Chemical compound CC(=C)C(=O)OC(C)(C)C SJMYWORNLPSJQO-UHFFFAOYSA-N 0.000 description 1
- ISXSCDLOGDJUNJ-UHFFFAOYSA-N tert-butyl prop-2-enoate Chemical compound CC(C)(C)OC(=O)C=C ISXSCDLOGDJUNJ-UHFFFAOYSA-N 0.000 description 1
- VZCYOOQTPOCHFL-UHFFFAOYSA-N trans-butenedioic acid Natural products OC(=O)C=CC(O)=O VZCYOOQTPOCHFL-UHFFFAOYSA-N 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
- IGELFKKMDLGCJO-UHFFFAOYSA-N xenon difluoride Chemical compound F[Xe]F IGELFKKMDLGCJO-UHFFFAOYSA-N 0.000 description 1
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
- H01J37/32431—Constructional details of the reactor
- H01J37/32733—Means for moving the material to be treated
- H01J37/32752—Means for moving the material to be treated for moving the material across the discharge
- H01J37/32761—Continuous moving
- H01J37/3277—Continuous moving of continuous material
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05H—PLASMA TECHNIQUE; PRODUCTION OF ACCELERATED ELECTRICALLY-CHARGED PARTICLES OR OF NEUTRONS; PRODUCTION OR ACCELERATION OF NEUTRAL MOLECULAR OR ATOMIC BEAMS
- H05H1/00—Generating plasma; Handling plasma
- H05H1/24—Generating plasma
- H05H1/46—Generating plasma using applied electromagnetic fields, e.g. high frequency or microwave energy
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/56—Apparatus specially adapted for continuous coating; Arrangements for maintaining the vacuum, e.g. vacuum locks
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
- H01L21/306—Chemical or electrical treatment, e.g. electrolytic etching
- H01L21/3065—Plasma etching; Reactive-ion etching
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05H—PLASMA TECHNIQUE; PRODUCTION OF ACCELERATED ELECTRICALLY-CHARGED PARTICLES OR OF NEUTRONS; PRODUCTION OR ACCELERATION OF NEUTRAL MOLECULAR OR ATOMIC BEAMS
- H05H1/00—Generating plasma; Handling plasma
- H05H1/24—Generating plasma
- H05H1/47—Generating plasma using corona discharges
- H05H1/473—Cylindrical electrodes, e.g. rotary drums
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05H—PLASMA TECHNIQUE; PRODUCTION OF ACCELERATED ELECTRICALLY-CHARGED PARTICLES OR OF NEUTRONS; PRODUCTION OR ACCELERATION OF NEUTRAL MOLECULAR OR ATOMIC BEAMS
- H05H2240/00—Testing
- H05H2240/10—Testing at atmospheric pressure
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Plasma & Fusion (AREA)
- Chemical & Material Sciences (AREA)
- Analytical Chemistry (AREA)
- Spectroscopy & Molecular Physics (AREA)
- Power Engineering (AREA)
- Materials Engineering (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- General Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Manufacturing & Machinery (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Electromagnetism (AREA)
- Treatments Of Macromolecular Shaped Articles (AREA)
- Chemical Vapour Deposition (AREA)
- Physical Vapour Deposition (AREA)
Abstract
Description
201201632 六、發明說明： 【發明所屬之技術領域】 本發明係關於一種於大氣壓或大氣壓左右對被處理物進 行表面處理之裝置，特別是關於一種適合於一面連續搬送 被處理物一面進行大氣壓電漿處理等表面處理之表面處理 裝置。 【先前技術】 一般而言，於大氣麼電跋處理等表面處理令，為防止處 理氣體成分之洩漏等，而藉由處理槽圍住處理區域（參照 專利文獻1等）。於該處理槽上連接排氣機或排氣泵等排氣 源，抽吸包含處理槽内之處理氣體之氣體並將其排出。於 處理槽之端壁設置有搬入搬出被處理物之開口。於被處理 物為單片狀或者進行批次處理之情形時等，若於上述開口 上設置窗，每當搬入、搬出各被處理物時打開或關閉窗， 而可防止處理氣體之洩漏。但是，於被處理物為連續薄片 狀或者一面沿處理線搬送被處理物一面進行連續處理之情 形時等，窗之打開關閉困難或者不可能。因此，於專利文 獻1中，係將搬入側及搬出側之壁分別設為雙重構造並設 置小室。於各壁上形成始終打開之開口。 [先前技術文獻] [專利文獻] [專利文獻1]日本專利特開2001_102198號公報（〇〇54、圖 8) 【發明内容】 -4 - 154537.doc201201632 VI. Description of the Invention: [Technical Field] The present invention relates to a device for surface treatment of a workpiece at atmospheric pressure or atmospheric pressure, and more particularly to an atmospheric piezoelectric slurry suitable for continuously conveying a workpiece on one side. A surface treatment device for treating surface treatments. [Prior Art] Generally, a surface treatment order such as an atmosphere treatment process is used to prevent a leak of a process gas component, and the treatment zone is surrounded by a treatment tank (see Patent Document 1, etc.). An exhaust source such as an exhauster or an exhaust pump is connected to the treatment tank, and the gas containing the processing gas in the treatment tank is sucked and discharged. An opening for loading and unloading the object to be processed is provided on the end wall of the treatment tank. When the object to be processed is in the form of a single sheet or in a batch process, if a window is provided in the opening, the window is opened or closed each time the workpiece is carried in and out, and leakage of the processing gas can be prevented. However, when the object to be processed is in the form of a continuous sheet or continuous processing while conveying the object to be processed along the processing line, it is difficult or impossible to open and close the window. Therefore, in Patent Document 1, the walls on the carry-in side and the carry-out side are each provided in a double structure and a small chamber is provided. An opening that is always open is formed on each wall. [Prior Art Document] [Patent Document 1] [Patent Document 1] Japanese Patent Laid-Open Publication No. 2001-102198 (〇〇54, Fig. 8) [Summary of the Invention] -4 - 154537.doc
S 201201632 [發明所欲解決之問題] 根據上述專利文獻1之搬入側及搬出側之雙重壁，來 處理槽之流出氣體暫時滯留於上述雙重壁内之小h " 疋，存在其後氣體擴散而向外部洩漏之可能。特別是，、 搬出側，接觸被處理物之氣體會由被處理物帶動而易向外 部=。為防止該情形，需要增大排氣機或排氣粟等排1 源之容量0 本發明係鑒於上述情形研究而成者，其主要目的係於一 面例如連續搬送被處理物一面於處理槽内進行表面處理之 ，置t Fp便處理槽之排氣源不大型化亦可充分抑制處理 氣體成分自處理槽向外部漏出之情形。 [解決問題之技術手段] 為解決上述問題，本發明之表面處理裝置之特徵在於， 其於大氣壓或大氣壓左右之處理辱域對被處理物進行表面 處理，且具備： ⑷搬送機構’其於搬送方向上搬送上述被處理物，以便使 其通過上述處理區域； ()處理;fg，其具有含有上述處理區域之主室、及設置於上 述主至之上述搬送方向之搬入側及搬出側中之至少搬出側 且猎由間隔i而與上述主室隔開的副室，且於搬入側之外 2及搬出側t外壁以及上述間隔壁形成有可搬入搬出上述 被處理物之始終打開之開口； Ο}排氣機才冓’其連接於上述主冑，抽吸上述主室内之氣體 而使上述主室之内壓低於上述處理槽之外部之壓力；及 154537.doc 201201632 (d)副室供氣機構，其連接於上述副室，向上述副室内供給 空氣或惰性氣體’使上述副室之内壓高於上述處理槽之外 部之壓力。 自副室供氣機構供給至副室之空氣或惰性氣體因上述壓 力差而自間隔壁之開口流入主室内。藉由該流動，可確實 地防止包含主室内之處理氣體成分之氣體向外部洩漏。特 別是於主室内之搬出側之部分，接觸被處理物之氣體由被 處理物帶動而向搬出側之副室、進而向槽外移動。相對於 $，來自搬出側之副室之氣體流入主室。來自該搬出側副 室之氣體流入方向與上述被處理物之移動方向、進而與被 處理物上之氣體之流動方向大致為反方向。藉由該反方向 之流入氣體，可將被處理物上之氣體推回。藉此，可確實 地防止含有處理氣體成分之氣體與被處理物—併向外部茂 漏。主室之内麼只要低於大氣壓便可，無須增大主室排氣 機構之排氣源之排氣容量，可使排氣源小型化。 ' 又’自副室供氣機構供給至副室之空氣或惰性氣體之一 部分自外壁之開口向外部流出。#由該流動，可防止外部 之環境氣體進入處理槽内。 於上述被處理物為連續薄片狀之情形時，上述搬送機構 較好的是含有捲繞上述被處理物之複數之導親。例如，於 搬入側之槽外設置捲_，於搬出側之槽外設置捲取親，、 :上述捲出輥及上述捲取輥之間排列上述複數之導輥。該 等複數之導親之-部分或全部係配置於處理槽之内部。2 述連續薄片狀之被處理物自捲出輥捲出後，導引至上述導 154537.doc 201201632 輕之行並通過處理槽之含有處理區域之主室及副室，然後 捲取於捲取輥上。 較好的是上述導輥中之第1導輥係收容於上述副室内。 藉由於上述第1導輥上捲繞連續薄片狀之被處理物，而定 位副室内之連續薄片狀被處理物，從而防止偏差。因此， 可將外壁及間隔壁之各開口之開口度設定為基本上無須考 慮連續薄片狀被處理物之偏差。進而，可確實地防止來自 主室之氣體洩漏或外部環境氣體之滲入。 較好的是上述第1導輥之直徑大於區分上述副室之外壁 與間隔壁之間的距離，且上述第i導輥之外周部伸入上述 外壁之開口及上述間隔壁之開口。 藉此’可藉由上述第1導輥而堵住上述開口之大部分。 而且，上述第1導輥之圓周面上之上述連續薄片狀之被處 理物之進入接點及送出接點，可恰好位於上述開口之内部 或上述開口附近。如此，可將上述連續薄片狀之被處理物 之配置於上述副室内之部分的大致全體捲繞於上述第1導 輥。因此，可確實地防止上述副室内之上述連續薄片狀之 被處理物之偏差。由此，可充分減小上述開口之開口度 (即上述開口之緣部與上述第i導輥之圓周面之間所形成之 間隙大小），從而可確實地防止來自主室之氣體浅漏或外 部％境氣體之滲入。副室内只要設置丨個第丨導輥便可，從 而可減少零件數。 於上述第1導輥之圓周面之圓周方向之一側部捲繞有上 述被處理物，上述副至供氣機構較好的是含有於上述副室 I54537.doc 201201632 之：向上述一側部之室部分形成開口之供氣口。藉此，可 確貫地使上述室部分為高Μ。因&，可確實地減少含有主 室内之處理氣體成分之氣體由被處理物帶動而進入副室， 或者外部之環境氣體進人副室内之情形。進而，可更確實 地防止含有處理氣體成分之氣體向外部流出，或者外部之 環境氣體流入主室内之情形。 較好的是上述複數之導輥中之與上述第i導輥鄰接之第2 導輥，配置於上述處理槽之上述搬送方向之外側或上述主 室内’藉由上述第i導輥與上述第2導輕而設定上述被處理 物通過上述開口之位置。 藉此’可充分減小上述開口之開口度，從而確實地防止 來自主室之氣體洩漏或外部環境氣體之滲入。上述第2導 輥係介於1述捲出輥與搬入側之副室内《導輥t間、或者 搬出側之副室内之導輥與上述捲取較之間。即便捲出輕或 捲取輥上之被處理物之繞徑隨著捲出及捲取之進行而變 化’上述位置亦不會變化。因此’可將外壁之開口之開口 度設定地充分小。進而，可確實地防止來自主室之氣體洩 漏或外部環境氣體之滲入。特別是將上述第丨導輥設置於 搬出側之副室’將上述P導報配置於上述搬出側之外壁 與上述捲取輥之間，藉此即便上述捲取輥上之被處理物之 繞徑隨著捲取之進行而增大，亦可避免被處理物自第^導 輥向第2導輥送出之角度變化之狀況，且可避免被處理物 通過上述搬出側之外壁之開口之位置變化的狀況。因此， 可將上述搬出側之外壁之開口之緣與被處理物之間所形成 154537.docS 201201632 [Problem to be Solved by the Invention] According to the double wall of the carry-in side and the carry-out side of Patent Document 1, the small gas flowing out of the groove is temporarily trapped in the double wall, and there is a gas diffusion thereafter. And the possibility of leaking to the outside. In particular, on the carry-out side, the gas that contacts the object to be treated is driven by the object to be processed and is easily outward. In order to prevent this, it is necessary to increase the capacity of the exhaust source or the exhaust gas source. The present invention has been made in view of the above circumstances, and its main object is to continuously transport the object to be processed in one side of the processing tank, for example. When the surface treatment is performed, if the exhaust source of the treatment tank is not increased in size, the treatment gas component may be sufficiently prevented from leaking from the treatment tank to the outside. [Means for Solving the Problems] In order to solve the above problems, the surface treatment apparatus of the present invention is characterized in that it is subjected to surface treatment of the object to be treated in an atmosphere of atmospheric pressure or atmospheric pressure, and has: (4) a transport mechanism Transmitting the object to be processed in the direction so as to pass through the processing region; () processing; fg having a main chamber including the processing region, and a loading side and a carrying side provided in the main transport direction a sub-chamber that is separated from the main chamber by the interval i at least on the carry-out side, and an opening that can be carried in and out of the object to be processed is formed on the outer side of the carry-in side 2 and the outer wall of the carry-out side t and the partition wall;排气}the exhauster is connected to the main raft, sucking the gas in the main chamber such that the internal pressure of the main chamber is lower than the pressure outside the treatment tank; and 154537.doc 201201632 (d) The air mechanism is connected to the sub-chamber, and supplies air or an inert gas to the sub-chamber to make the internal pressure of the sub-chamber higher than the pressure outside the processing tank. The air or inert gas supplied from the sub-chamber air supply mechanism to the sub-chamber flows into the main chamber from the opening of the partition wall due to the above-described pressure difference. By this flow, it is possible to surely prevent the gas containing the processing gas component in the main chamber from leaking to the outside. In particular, in the portion on the carry-out side of the main chamber, the gas that is in contact with the workpiece is moved by the workpiece to the sub-chamber on the carry-out side and further to the outside of the tank. Relative to $, the gas from the sub-chamber of the carry-out side flows into the main chamber. The gas inflow direction from the carry-out side sub-chamber is substantially opposite to the moving direction of the object to be processed and the flow direction of the gas on the object to be processed. The gas on the object to be treated can be pushed back by the inflow gas in the opposite direction. Thereby, the gas containing the processing gas component and the object to be treated can be surely prevented from leaking to the outside. In the main chamber, as long as it is lower than atmospheric pressure, it is not necessary to increase the exhaust capacity of the exhaust source of the main chamber exhaust mechanism, and the exhaust source can be miniaturized. 'Another part of the air or inert gas supplied from the sub-chamber air supply mechanism to the sub-chamber flows out from the opening of the outer wall to the outside. # By this flow, the external ambient gas can be prevented from entering the treatment tank. In the case where the object to be treated is in the form of a continuous sheet, the conveying means preferably contains a plurality of guide members wound around the object to be processed. For example, a roll _ is provided outside the groove on the loading side, and a winding member is provided outside the groove on the carry-out side, and the plurality of guide rolls are arranged between the take-up roll and the take-up roll. Some or all of these complex numbers are disposed inside the processing tank. 2 After the continuous sheet-like object is rolled out from the take-up roll, it is guided to the above-mentioned guide 154537.doc 201201632 and passes through the main chamber and the auxiliary chamber containing the treatment area of the treatment tank, and then taken up in the winding. On the roller. Preferably, the first guide roller of the guide roller is housed in the sub-chamber. The continuous sheet-like object to be processed in the sub-chamber is positioned by winding the continuous sheet-like object on the first guide roller to prevent variation. Therefore, the opening degree of each of the outer wall and the partition wall can be set to substantially eliminate the deviation of the continuous sheet-like object to be processed. Further, it is possible to surely prevent gas leakage from the main chamber or penetration of external environmental gas. Preferably, the diameter of the first guide roller is larger than the distance between the outer wall of the sub-chamber and the partition wall, and the outer peripheral portion of the i-th guide roller extends into the opening of the outer wall and the opening of the partition wall. Thereby, most of the openings can be blocked by the first guide roller. Further, the entry contact and the feed contact of the continuous sheet-like workpiece on the circumferential surface of the first guide roller may be located just inside the opening or in the vicinity of the opening. In this manner, substantially all of the portion of the continuous sheet-like object to be disposed in the sub-chamber can be wound around the first guide roller. Therefore, it is possible to surely prevent the deviation of the continuous sheet-like object to be processed in the sub-chamber. Thereby, the opening degree of the opening (that is, the size of the gap formed between the edge of the opening and the circumferential surface of the ith guide roller) can be sufficiently reduced, so that the gas leakage from the main chamber can be reliably prevented or Infiltration of external % gas. It is only necessary to set a second guide roller in the sub-chamber, thereby reducing the number of parts. The object to be processed is wound around one side of the circumferential surface of the first guide roller, and the sub-air supply mechanism is preferably included in the sub-chamber I54537.doc 201201632 The chamber portion forms an open air supply port. Thereby, the above-mentioned chamber portion can be surely made high. By &, it is possible to surely reduce the gas containing the processing gas component in the main chamber from being driven into the sub-chamber or the external ambient gas entering the sub-chamber. Further, it is possible to more reliably prevent the gas containing the processing gas component from flowing out to the outside or the external ambient gas flowing into the main chamber. Preferably, the second guide roller adjacent to the ith guide roller of the plurality of guide rollers is disposed outside the transfer direction of the processing tank or in the main chamber by the ith guide roller and the first 2, the light guide is set to set the position of the object to pass through the opening. Thereby, the opening degree of the above opening can be sufficiently reduced, thereby reliably preventing gas leakage from the main chamber or penetration of external environmental gas. The second guide roller is interposed between the take-up roller and the sub-chamber in the sub-chamber of the carry-in side, or between the guide rollers in the sub-chamber on the carry-out side and the winding. Even if the winding is light or the winding path of the object to be processed on the take-up roll changes as the unwinding and winding take place, the above position does not change. Therefore, the opening degree of the opening of the outer wall can be set sufficiently small. Further, it is possible to surely prevent gas leakage from the main chamber or penetration of external environmental gas. In particular, the sub-chamber of the second guide roller is disposed on the carry-out side, and the P guide is disposed between the outer wall of the carry-out side and the take-up roll, whereby the diameter of the object to be processed on the take-up roll is As the winding is increased, the angle at which the workpiece is fed from the second guide roller to the second guide roller can be prevented from changing, and the position of the workpiece passing through the opening of the outer wall of the carry-out side can be prevented from being changed. The situation. Therefore, the edge of the opening of the outer wall of the above-mentioned carry-out side can be formed between the object to be processed and 154537.doc
S 201201632 的間隙大小維持固定。由此，可將上述搬出側之外壁之開 口之開口度設定地充分小。其結果為，可確實地防止來自 主室之氣體自上述搬出側之外壁之開口向外部流出，或者 外部之環境氣體自上述搬出側之外壁之開口流入處理槽内 之狀況。 上述主室之内壓較佳為比上述處理槽之外部之壓力低10 Pa〜50 Pa。由此’可減小主室排氣源之排氣容量。 上述副室之内壓較佳為比上述處理槽之外部之壓力高5 Pa〜20 Pa。藉此’可確實地防止處理氣體成分之洩漏。 此處，所謂大氣壓或大氣壓左右，係指〜 50.663xl〇4 pa之範圍’若考慮壓力調整之容易性及裝置構 成之簡便化，較佳為1.333x104〜1〇·664χ104 Pa，更佳為 9_331xl〇4〜l〇_397xl04 Pa。 [發明之效果] 根據本發明，可充分抑制處理氣體成分自處理槽向外部 漏出。排氣源無須大型化。 【實施方式】 以下’依照圖式而對本發明之實施形態進行說明。 圖1係表示本發明之一實施形態者。本實施形態之被處 理物9係由連續薄片狀之薄膜而構成。被處理薄膜係例如 偏光板等之光學裝置用之光學樹脂薄膜。此處，作為被處 理薄膜9係使用偏光板之保護薄膜之光學樹脂薄膜。作為 被處理薄膜9之主成分，例如可列舉三乙醯纖维素（tac， Triacetyl Cellulose)、聚丙稀（pp，p〇lypr〇pylene)、聚乙烯 154537.doc 201201632 (PE，polyethylene)、環烯烴聚合物（COP，CyCl〇〇lefin polymer)、環烯烴共聚物（COC)、聚對苯二曱酸乙二酯 (PET ’ polyethylene terephthalate)、聚甲基丙稀酸甲酯 (PMMA ’ polymethyl methacrylate)、聚醯亞胺（pi， polyimide)等，但並不限定於此。薄膜之厚度為例如1〇〇 μπι左右。 本實施形態之表面處理裝置1相對於被處理薄膜9而實施 用以提高與偏光薄膜之接著步驟之接著性的表面處理。作 為處理氣體係使用聚合性單體與載體氣體之混合氣體等。 作為聚合性單體，係使用例如丙烯酸（CH2 = CHCOOH)。 丙烯酸具有如醋酸之臭氣’且亦具有爆炸性等，故需要適 當之管理。作為聚合性單體，並不限定於丙烯酸，亦可為 曱基丙烯酸、衣康酸、馬來酸、2-甲基丙烯醯基丙酸、乙 二醇甲基丙稀酸酯、稀丙醇、曱基丙烯酸羥基乙酯、乙酸 乙烯酯、曱基丙稀酸縮水甘油酯、丙稀酸甲酯、丙婦酸乙 酯、丙稀酸丁酯、丙稀酸第三丁酯、丙烯酸-2-乙基己酷、 丙稀酸辛酯、曱基丙稀酸曱酯、甲基丙烯酸乙酯、曱基丙 烯酸丁酯、曱基丙烯酸第三丁酯、曱基丙烯酸異丙酯、曱 基丙烯酸-2-乙酯、丙烯醛、巴豆醛等。作為載體氣體係使 用惰性氣體。作為惰性氣體可列舉氮氣（N2)，但並不限定 於此，亦可為Ar、He等稀有氣體。 表面處理裝置1具備處理部10、搬送機構20、及處理槽 30 〇 處理部10係藉由利用大氣壓或大氣壓左右電漿對被處理 -10- 154537.docThe gap size of S 201201632 remains fixed. Thereby, the opening degree of the opening of the outer wall on the carry-out side can be set sufficiently small. As a result, it is possible to reliably prevent the gas from the main chamber from flowing out from the opening of the outer wall on the carry-out side, or the external atmosphere gas flowing into the processing tank from the opening of the outer wall of the carry-out side. The internal pressure of the main chamber is preferably 10 Pa to 50 Pa lower than the pressure outside the treatment tank. Thereby, the exhaust capacity of the main chamber exhaust source can be reduced. The internal pressure of the sub-chamber is preferably 5 Pa to 20 Pa higher than the pressure outside the treatment tank. Thereby, leakage of the process gas component can be surely prevented. Here, the term "atmospheric pressure or atmospheric pressure" means a range of ~50.663xl 〇4 pa'. Considering the ease of pressure adjustment and the simplification of the device configuration, it is preferably 1.333x104~1〇·664χ104 Pa, more preferably 9_331xl. 〇 4~l〇_397xl04 Pa. [Effects of the Invention] According to the present invention, it is possible to sufficiently suppress the leakage of the processing gas component from the processing tank to the outside. The exhaust source does not need to be enlarged. [Embodiment] Hereinafter, embodiments of the present invention will be described with reference to the drawings. Fig. 1 shows an embodiment of the present invention. The workpiece 9 of the present embodiment is composed of a continuous sheet-like film. The film to be processed is an optical resin film for an optical device such as a polarizing plate. Here, as the film to be treated 9, an optical resin film using a protective film of a polarizing plate is used. Examples of the main component of the film to be processed 9 include tac, Triacetyl Cellulose, polypropylene (pp, p〇lypr〇pylene), polyethylene 154537.doc 201201632 (PE, polyethylene), and ring. Olefin polymer (COP, CyCl〇〇lefin polymer), cyclic olefin copolymer (COC), PET 'polyethylene terephthalate, polymethyl methacrylate , pi, polyimide, etc., but is not limited thereto. The thickness of the film is, for example, about 1 〇〇 μπι. The surface treatment apparatus 1 of the present embodiment performs a surface treatment for improving the adhesion to the subsequent step of the polarizing film with respect to the film to be processed 9. As the treatment gas system, a mixed gas of a polymerizable monomer and a carrier gas or the like is used. As the polymerizable monomer, for example, acrylic acid (CH2 = CHCOOH) is used. Acrylic acid has an odor such as acetic acid and is also explosive, so it needs to be properly managed. The polymerizable monomer is not limited to acrylic acid, and may be mercaptoacrylic acid, itaconic acid, maleic acid, 2-methylpropenylpropionic acid, ethylene glycol methyl acrylate, or dilute propanol. , hydroxyethyl methacrylate, vinyl acetate, glycidyl thioglycolate, methyl acrylate, ethyl propyl acrylate, butyl acrylate, tert-butyl acrylate, acrylic acid-2 -ethylhexan, octyl acrylate, decyl propyl acrylate, ethyl methacrylate, butyl methacrylate, tert-butyl methacrylate, isopropyl methacrylate, methacrylic acid - 2-ethyl ester, acrolein, crotonaldehyde, and the like. An inert gas is used as the carrier gas system. The inert gas is, for example, nitrogen (N2), but is not limited thereto, and may be a rare gas such as Ar or He. The surface treatment apparatus 1 includes a processing unit 10, a transport mechanism 20, and a processing tank 30. The processing unit 10 is processed by using a plasma pair of atmospheric pressure or atmospheric pressure. -10- 154537.doc
S 201201632 物9進行表面處理之大氣壓電毁處理部而構成。大氣壓電 桌處理4 10具有至少2個電極u。該等電極U形成為圓筒 形狀（輥狀卜2個輥電極丨丨係將軸線朝向與圖t之紙面正交 之水平方向而平行配置。輥電極11、n彼此間之最窄部位 及/、附近之空間成為處理區域i 9。雖省略圖示，但2個親 電極11之—方係連接於電源。另—方之1¾電極11係電性接 地。藉由電源之供電，在大氣壓或大氣壓左右之壓力下於 報電極11、11間生成電聚放電。於處理區域19之上方及下 方刀別配置有喷嘴12。各喷嘴12之喷出口係面向處理區域 19。自未圖示之處理氣體源之處理氣體供給至喷嘴12,並 自喷嘴12向處理區域19喷出。藉此，處理氣體於處理區域 19内被電漿化（包含激發、活性化、自由基化、離子化 等），而進行被處理薄膜9之表面處理。具體而言，處理氣 體中之丙烯酸（聚合性單體）於被處理薄膜9上產生聚合反 應，於被處理薄膜9之表面形成接著性促進層。 可自上下之喷嘴12、12同時喷出處理氣體，亦可僅自上 下中任一噴嘴12喷出處理氣體，並將另一喷嘴12用作處理 區域19之閉塞構件。 亦可於被處理薄膜9之搬送方向之上游側之輥電極丨丨之 圓周面上’使含有丙烯酸等聚合性單體之氣體喷附於被處 理薄臈9並附著，繼而對處理區域19供給氮氣等惰性氣體 而使其電漿化，從而產生聚合性單體之聚合反應。 搬送機構20將被處理薄膜9於搬送方向（圖！中為大致右 方向）搬送。搬送機構20具備捲出輥21、捲取輥22、及導 I54537.doc 201201632 輥23。該等輥21、22、23均為軸線朝向與圖1之紙面正交 之方向之圓筒形狀。捲出輥21係較處理槽30更配置於搬送 方向之上游側即搬入側（圖1中為左）。自捲出輥21中捲出被 處理薄膜9。捲取輥22係配置於較處理槽30更靠搬送方向 之下游側即搬出側（圖1中為右）》將處理完畢之被處理薄膜 9捲取於捲取輥22上。於捲出輥21與捲取輥22之間排列有 複數之導輥23(231〜236)。於該等導輥23上繞有被處理薄 膜9之中間部分。於導輥23之行之中間配置有輥電極u、 11。被處理薄膜9係以半周之程度捲繞於輥電極丨〗、丨！之 上側部分。2個輥電極11之中間之被處理薄膜9穿過處理區 域19。各輥電極11可圍繞軸線而旋轉。輥21、22及親電極 11、11彼此同步地旋轉驅動，搬送被處理薄膜9。輥電極 11構成搬送機構20之一要素❶導輥23(23 1〜236)係對應於被 處理薄膜9之搬送而從動旋轉。藉由導輥23而設定被處理 薄膜9之搬送路徑’且對被處理薄膜9賦予張力。 處理槽30具有主室3 1、搬入側之副室32、及搬出側之副 室33。主室31佔據處理槽3〇之内部容積之大部分。於主室 31之内部配置有處理部1〇，進而配置有處理區域丨今。 處理槽30之搬入側之壁形成為搬入側外壁34與搬入側間 隔壁35之雙重構造。外壁34將處理槽3〇之搬入側之外部與 處理槽30之内部隔開。藉由間隔壁35，而將主室31與搬入 側副室32關。於外壁34與間隔壁35之間形成有搬入側副 至2搬入側田彳至32形成為於與輥23之軸線同方向（與圖j 之紙面正交之方向）上延伸之筒狀空間。搬入側副室32之 154537.docS 201201632 The object 9 is configured by performing an atmospheric treatment of the surface. Atmospheric piezoelectric table processing 4 10 has at least 2 electrodes u. The electrodes U are formed in a cylindrical shape (two roller electrodes are arranged in a roll shape, and the axes are arranged in parallel in a horizontal direction orthogonal to the plane of the paper of FIG. t. The narrowest portion between the roller electrodes 11 and n and/or The space in the vicinity is the processing area i 9. Although not shown, the two electrodes 11 are connected to the power source. The other electrodes 11 are electrically grounded. The power supply is supplied at atmospheric pressure or Electrostatic discharge is generated between the reporter electrodes 11 and 11 under a pressure of about atmospheric pressure. The nozzles 12 are disposed above and below the processing region 19. The discharge ports of the nozzles 12 face the processing region 19. The processing gas of the gas source is supplied to the nozzle 12, and is ejected from the nozzle 12 to the processing region 19. Thereby, the processing gas is plasmaized in the processing region 19 (including excitation, activation, radicalization, ionization, etc.). On the other hand, the surface treatment of the film to be processed 9 is performed. Specifically, acrylic acid (polymerizable monomer) in the processing gas generates a polymerization reaction on the film 9 to be processed, and an adhesion promoting layer is formed on the surface of the film 9 to be processed. From top to bottom The nozzles 12 and 12 simultaneously eject the processing gas, and may discharge the processing gas from only one of the upper and lower nozzles 12, and use the other nozzle 12 as the blocking member of the processing region 19. The conveying direction of the processed film 9 may also be used. On the circumferential surface of the roller electrode 丨丨 on the upstream side, a gas containing a polymerizable monomer such as acrylic acid is sprayed onto the treated thin crucible 9 and adhered thereto, and then an inert gas such as nitrogen gas is supplied to the treatment region 19 to be plasma-formed. The polymerization reaction unit 20 transports the film to be processed 9 in the conveyance direction (in the right direction in the drawing). The conveyance mechanism 20 includes the take-up roll 21, the take-up roll 22, and the guide I54537. Doc 201201632 Roller 23. These rolls 21, 22, and 23 are each having a cylindrical shape whose axis is oriented in a direction orthogonal to the plane of the paper of Fig. 1. The take-up roll 21 is disposed on the upstream side of the conveyance direction, that is, on the upstream side of the conveyance direction. The loading side (left side in Fig. 1) winds up the film to be processed 9 from the winding roller 21. The winding roller 22 is disposed on the downstream side of the processing tank 30 in the transport direction (the right side in Fig. 1) )" takes the processed film 9 processed into On the take-up roll 22, a plurality of guide rolls 23 (231 to 236) are arranged between the take-up roll 21 and the take-up roll 22. The intermediate portion of the film 9 to be processed is wound around the guide rolls 23. The roller electrodes u and 11 are disposed in the middle of the row of the roller 23. The film to be processed 9 is wound around the upper side of the roller electrode 半 and 半 in a half cycle. The film 9 to be processed in the middle of the two roller electrodes 11 is worn. Each of the roller electrodes 11 is rotatable about an axis. The rollers 21 and 22 and the electrophilic electrodes 11 and 11 are rotationally driven in synchronization with each other to transport the film 9 to be processed. The roller electrode 11 constitutes an element of the conveying mechanism 20 23 (23 1 to 236) is driven to rotate in response to the conveyance of the film to be processed 9. The conveyance path ' of the film to be processed 9 is set by the guide roller 23, and the tension is applied to the film to be processed 9. The treatment tank 30 has a main chamber 31, a sub-chamber 32 on the carry-in side, and a sub-chamber 33 on the carry-out side. The main chamber 31 occupies most of the internal volume of the treatment tank 3〇. A processing unit 1 is disposed inside the main chamber 31, and a processing area is disposed. The wall on the carry-in side of the treatment tank 30 has a double structure in which the carry-in side outer wall 34 and the carry-in side partition wall 35 are formed. The outer wall 34 separates the outside of the loading side of the processing tank 3 from the inside of the processing tank 30. The main chamber 31 and the carry-in side sub-chamber 32 are closed by the partition wall 35. Between the outer wall 34 and the partition wall 35, a loading side pair to a loading side field 32 is formed as a cylindrical space extending in the same direction as the axis of the roller 23 (a direction orthogonal to the paper surface of Fig. j). Move into the side sub-chamber 32 154537.doc
S -12· 201201632 内部容積充分小於主室31之内部容積。搬入侧副室32之内 部容積為主室31之㈣容積之例如5叫之⑴咖分之 1 ° 處理槽30之搬出側之壁形成為搬出側外壁36與搬出側間 隔壁37之雙重構造。外壁36將處理槽3()之搬出側之外部與 處理槽30之内部隔開。藉由間隔壁37,而將主室31與搬出 側副室33隔開。於外壁36與間隔壁”之間形成有搬出側副 室33。搬出側副室33形成為於與輥23之軸線同方向（與圖i 之紙面正交之方向）上延伸之筒狀空間。搬出側副室33之 内部容積係與搬入側副室32之内部容積大致相同，且充分 小於主室31之内部容積。搬出側副室33之内部容積為主室 31之内部容積之例如5〇〇分之1至2〇〇〇分之1。搬入側之副 至32之内部容積與搬出側之副室33之内部容積亦可彼此不 同。 進而詳細說明處理槽30之搬入側部及搬出側部之構造。 於搬入側之外壁34形成有搬入側外開口 34a。搬入側副 室32經由開口 34a而與搬入側之外部空間連通。於搬入側 間隔壁3 5形成有搬入側内開口 3 5 a。主室3 1經由開口 3 5 a而 與搬入側副室32連通。被處理薄膜9自外部通過外開口 34a 而搬入至搬入側副室32，進而通過内開口 35a搬入至主室 31。搬入開口 34a、35a為始終打開，且並不設置窗。 於搬入側副室3 2内收容有搬入側副室内導觀2 3 2 (第1導 輥）。副室内導輥232之直徑與副室32之水平短邊方向（圖1 之左右方向）之尺寸即壁34、35間之距離相比略大。副室 154537.doc -13- 201201632 内導輥232之左右之周側部略微伸入各搬入開口 34a、 3 5a。藉由副室内導輥232而堵住搬入開口 34a、35a之大部 分。各搬入開口 34a ' 35a之上下之緣與副室内導輥232之 圓周面之間之間隙（clearance)充分小。各搬入開口 34a、 3 5a之上緣與副室内導輥232之圓周面之垂直方向之相隔距 離較佳為0.5 mm〜4 mm左右，更佳為1 mm左右。各搬入開 口 34a、3 5a之下緣與副室内導輥232之圓周面之垂直方向 之相隔距離比上述上緣侧之相隔距離略大，較佳為i mm〜6 mm左右，更佳為3 mm左右。藉由副室内導輥232， 而將搬入側副室3 2隔開為較導輥232更下側之室部分32a、 及較導輥232更上側之室部分32b。 如圖2所示’副室内導輥232之沿軸線。之軸長短於搬入 側副室32之沿軸線L2之長度，進而略短於搬入開口 34a、 35a之沿軸線La之長度。副室内導輥232之軸線L2方向之端 面、與搬入開口 34a、3 5a之軸線Ls方向之端緣之間的間隙 較佳為1 mm〜3 mm左右。於副室内導輥232之軸方向之兩 側之各端面與搬入側副室32之同側之内端面之間形成有足 夠廣的連通空間32e。副室32之下側之室部分32a與上側之 室部分32b係經由連通空間32e而連通。 如圖1所示，被處理薄膜9係部分捲繞於副室内導輥232 之圓周面之下側部（圓周方向之一側部）。被處理薄膜9之捲 繞於導輥232之捲繞部分9a遍及被處理薄膜9之配置於搬入 側副室32内的部分之大致整體。捲繞部分“係面向搬入側 副室32之下側之室部分32a。藉由副室内導輥232而決定被 •14· 154537.docS -12· 201201632 The internal volume is sufficiently smaller than the internal volume of the main chamber 31. The internal volume of the moving-in side sub-chamber 32 is, for example, 5 (1) of the volume of the main chamber 31. The wall of the carrying-out side of the processing tank 30 is formed into a double structure of the carry-out side outer wall 36 and the carry-out side partition wall 37. The outer wall 36 separates the outer side of the carry-out side of the processing tank 3 () from the inside of the processing tank 30. The main chamber 31 and the carry-out side sub-chamber 33 are separated by the partition wall 37. The carry-out side sub-chamber 33 is formed between the outer wall 36 and the partition wall. The carry-out side sub-chamber 33 is formed in a cylindrical space extending in the same direction as the axis of the roller 23 (the direction orthogonal to the plane of the paper of FIG. i). The internal volume of the carry-out side sub-chamber 33 is substantially the same as the internal volume of the carry-in side sub-chamber 32, and is sufficiently smaller than the internal volume of the main chamber 31. The internal volume of the carry-out side sub-chamber 33 is, for example, 5 内部 of the internal volume of the main chamber 31. The internal volume of the sub-chamber 32 and the internal volume of the sub-chamber 33 on the carry-out side may be different from each other. The loading side and the carrying-out side of the processing tank 30 will be described in detail. The loading-side outer wall 34 is formed with a loading-side outer opening 34a. The loading-side sub-chamber 32 communicates with the external space of the loading-side side via the opening 34a. The loading-side partition wall 35 forms a loading-side inner opening 35. a. The main chamber 31 is in communication with the carry-in side sub-chamber 32 via the opening 35a. The processed film 9 is carried into the carry-in side sub-chamber 32 through the outer opening 34a from the outside, and is carried into the main chamber 31 through the inner opening 35a. The loading openings 34a, 35a are always open, The window is not provided. The loading side sub-chamber 2 2 2 (first guide roller) is housed in the loading-side sub-chamber 3 2. The diameter of the sub-chamber 232 and the horizontal short-side direction of the sub-chamber 32 (Fig. 1) The distance between the left and right directions, that is, the distance between the walls 34 and 35 is slightly larger. The sub-chamber 154537.doc -13-201201632 The left and right circumferential sides of the inner guide roller 232 slightly extend into the respective carry-in openings 34a, 35a. Most of the carry-in openings 34a and 35a are blocked by the sub-chamber 232. The clearance between the upper edge of each of the carry-in openings 34a' to 35a and the circumferential surface of the sub-chamber 232 is sufficiently small. The distance between the upper edge of 34a, 35a and the circumferential direction of the circumferential surface of the sub-chamber 232 is preferably about 0.5 mm to 4 mm, more preferably about 1 mm. The lower edges of the respective loading openings 34a, 35a are The distance between the circumferential surfaces of the sub-room guide rollers 232 in the vertical direction is slightly larger than the distance between the upper edge sides, preferably about 1 mm to 6 mm, more preferably about 3 mm. By the sub-chamber 232, The moving-side sub-chamber 3 2 is partitioned into a lower portion of the chamber portion 32a than the guide roller 232 and the upper side of the guide roller 232. The chamber portion 32b. As shown in Fig. 2, the axis of the sub-chamber 232 is shorter than the length of the loading-side sub-chamber 32 along the axis L2, and is thus slightly shorter than the length of the loading opening 34a, 35a along the axis La. The gap between the end surface of the sub-chamber 232 in the direction of the axis L2 and the end of the direction of the axis Ls of the loading openings 34a and 35a is preferably about 1 mm to 3 mm. In the axial direction of the sub-chamber 232. A sufficiently wide communication space 32e is formed between each of the end faces on both sides and the inner end face on the same side of the carry-in side subchamber 32. The chamber portion 32a on the lower side of the sub-chamber 32 and the chamber portion 32b on the upper side communicate with each other via the communication space 32e. As shown in Fig. 1, the film to be processed 9 is partially wound around the lower side (one side in the circumferential direction) of the circumferential surface of the sub-chamber 232. The wound portion 9a of the film to be processed 9 wound around the guide roller 232 is spread over substantially the entire portion of the film to be processed 9 disposed in the carry-in side subchamber 32. The winding portion "is facing the chamber portion 32a of the lower side of the sub-chamber 32. It is determined by the sub-chamber 232. 142 537.
S 201201632 處理薄膜9之於搬入側副室32内的位置或姿勢❶藉由副室 内導輥232及鄰接於其前段之槽外導輥231(第2導輥），而決 定被處理薄膜9自槽外進入副室内導輥232之角度及接觸副 室内導親232之圓周面之位置（進入接點a)、以及被處理薄 膜9通過外開口 34a的位置。上述進入接點a恰好係位於外 開口 34a或其附近。藉由副室内導輥232及鄰接於其後段之 主室内導輥233(第2導輥），而決定被處理薄膜9自副室内導 輥232之圓周面送出之位置（送出接點b)及角度、以及被處 理薄膜9通過内開口 3 5 a的位置。上述送出接點b恰好位於 内開口 35a之内部或其附近。 上述槽外導輥231係近接於外開口 34a而配置於處理槽3〇 之搬入側之外部。槽外導輥23 1係介於捲出輥21與搬入側 之外壁34之間。 上述主室内導報233係近接於内開口 35a而配置於主室31 之内部。 同樣地，於處理槽3〇之搬出側之間隔壁37形成有搬出側 内開口 37a。搬出侧副室33係經由開口 37&而與主室31連 通。於搬出側外壁36形成有搬出侧外開口 36a。搬出側副 室33與搬出側之外部空間係經由開口 36a而連通。由處理 部ίο處理完畢之被處理薄膜9自主室31通過内開〇37a而自 搬出側副室33搬出’進而通過外開口遍而搬出至外部。 搬出開口 36a、37a為始終打開，且不設置窗。 如圖3及圖4所示，於搬出側副室33内收容有搬出側副室 内導親235(第i導輥）。副室内導輥加之直徑與副室33之水 154537.doc •15· 201201632 平短邊方向（圖1之左右方向）之尺寸即壁36、37間之距離相 比略大。副室内導輥235之左右之周側部略微伸入各搬出 開口 36a、37a。藉由副室内導輥235而堵住搬出開口 36a、 37a之大部分。各搬出開口 36a、37a之上下之緣與副室内 導報235之圓周面之間之間隙（clearance )充分窄。各搬出 開口 36a、37a之上緣與副室内導輥235之圓周面之垂直方 向之相隔距離較佳為0.5 mm~4 mm左右，更佳為1 mm左 右。各搬出開口 36a、37a之下緣與副室内導輥235之圓周 面之垂直方向之相隔距離比上述上緣側之相隔距離略大， 較佳為1 mm〜6 mm左右，更佳為3 mm左右。藉由副室内 導輥235 ’而將搬出側副室33隔開為較導輥235更下側之室 部分33a、及較導輥235更上側之室部分33b。 如圖2及圖4所示，副室内導輥235之沿軸線L3之軸長短 於搬出側副室33之沿軸線L3之長度，進而略短於搬出開口 36a、37a之沿軸線La之長度。副室内導輥235之軸線L3方 向之端面、與搬出開口 36a、37a之抽線L3方向之端緣之間 的間隙較佳為1 mm〜3 mm左右》於副室内導輥235之軸方 向之兩側之端面與搬出側副室3 3之同側之内端面之間，形 成有足夠廣之連通空間33e »副室33之下側之室部分33a與 上側之室部分33b係經由連通空間33e而連通。 如圖1所不’被處理薄膜9係部分捲繞於副室内導輥235 之圓周面之下側部（圓周方向之一側部）。被處理薄膜9之捲 堯於導輥23 5之捲繞部分外遍及被處理薄膜9之配置於搬出 側副室33内的部分之大致整體。捲繞部分％係面向搬出側 154537.doc •16· 201201632 副室33之下側之室部分33a。藉由副室内導輥235而決定被 處理薄膜9之於搬出側副室3 3内的位置或姿勢。藉由副室 内導輥235及鄰接於其前段之主室内導輥234(第2導輥），而 決定被處理薄膜9自主室31進入副室内導輥235之角度及接 觸田彳至内導輥235之圓周面的位置（進入接點c)、以及被處 理薄膜9通過内開口 35a之位置，上述進入接點〇恰好係位 於内開口 35a或其附近。藉由副室内導輥235及鄰接於其後 段之槽外導輥236(第2導輥），而決定被處理薄膜9自副室内 導輥23 5之圓周面送出之位置（送出接點d)及角度、以及被 處理薄膜9通過外開口 36a之位置。上述送出接點d恰好係 位於外開口 36a之内部或其附近。 上述主室内導輥234係配置於主室31内，且近接間隔壁 37進而近接其開口 37a而配置。 上述槽外導輥236係近接於外開口 36a而配置於處理槽3〇 之搬出側之外部。槽外導輥23 6係介於搬出側之外壁3 6與 捲取輥22之間。 於處理槽30之主室31連接有主室排氣機構4〇。排氣機構 40包含排氣口 41、及排氣源43。於主室31之底部設置有排 氣口 41。自排氣口 41起延伸有排氣路徑42。該排氣路徑42 係連接於排氣源43。排氣源43係由吹風機構成，但亦可由 排氣泵構成。藉由排氣源43之驅動，主室31内之氣體自排 氣口 41吸入’並經排氣路徑42而排出。 如圖1所示，於搬入側副室32連接有搬入側副室供氣機 構5 1。副室供氣機構5丨包含複數之供氣口 5 lp、及供氣源 154537.doc 17 201201632 5 1X如圖2所示，供氣口 5 1 p係於搬入側副室32之底部沿 軸線L2而隔開間隔設置。如圖【所示，各供氣口51p係於搬 入側副室32之下側之室部分32a處開口。副室内導輥232之 下側部（繞有被處理薄膜9之部分）與供氣口 51p係上下對 向0 供氣源5lx係由吹風機構成，但亦可由供氣泵構成。來 自供氣源51x之供氣路徑51a分支為複數個（圖中為5個），且 連接於各供氣口 51p。藉由供氣源51χ之驅動，空氣經供氣 路徑5 1 a而自各供氣口 5 1 ρ供給至搬入側副室3 2内。 如圖1所示，於搬出側副室33連接有搬出側副室供氣機 構52 ^副室供氣機構52包含複數之供氣口 52p、及供氣源 52x。如圖2及圖4所示，供氣口 52p係於搬出側副室33之底 部沿軸線L3而隔開間隔設置。如圖3及圖4所示，各供氣口 52p係於搬出側副室33之下側之室部分33a處開口。副室内 導輥23 5之下側部（繞有被處理薄膜9之部分）與供氣口 52p係 上下對向。 供氣源52x係由吹風機構成，但亦可由供氣泵構成。i個 供氣源亦可作為搬入側副室供氣源5 1χ及搬出側副室供氣 源52χ而共用》來自供氣源52χ之供氣路徑52a分支為複數 個（圖中為5個），且連接於各供氣口 52p。藉由供氣源52χ之 驅動’工氣經供氣路從5 2 a而自各供氣口 5 2 ρ供給至搬出側 副室3 3内。 以處理槽30内之壓力控制為中心而對上述構成之表面處 理裝置1之動作進行說明。 154537.docS 201201632 The position or posture of the processing film 9 in the loading-side sub-chamber 32 is determined by the sub-chamber 232 and the groove outer guide roller 231 (second guide roller) adjacent to the front portion thereof, thereby determining the film to be processed 9 from The outside of the tank enters the angle of the sub-chamber 232 and the position of the circumferential surface of the sub-chamber 232 (into the joint a) and the position of the film 9 to be processed through the outer opening 34a. The above-mentioned entry contact a is just located at or near the outer opening 34a. The sub-chamber 232 and the main indoor guide roller 233 (second guide roller) adjacent to the rear portion thereof determine the position (feeding contact b) from which the processed film 9 is fed from the circumferential surface of the sub-chamber 232 and The angle, and the position of the film 9 to be processed through the inner opening 35 a. The above-mentioned delivery contact b is located just inside or near the inner opening 35a. The groove outer guide roller 231 is disposed adjacent to the outer opening 34a and disposed outside the loading side of the processing tank 3''. The groove outer guide roller 23 1 is interposed between the take-up roll 21 and the carry-in side outer wall 34. The main indoor guide 233 is disposed in the interior of the main chamber 31 in proximity to the inner opening 35a. Similarly, the partition side inner opening 37a is formed in the partition wall 37 on the carry-out side of the treatment tank 3. The carry-out side sub-chamber 33 is connected to the main chamber 31 via the opening 37 & A carry-out side outer opening 36a is formed in the carry-out side outer wall 36. The carry-out side sub-chamber 33 and the external space on the carry-out side communicate with each other via the opening 36a. The processed film 9 processed by the processing unit ίο is moved out of the side sub-chamber 33 by the inner opening 37a, and is carried out to the outside through the outer opening. The carry-out openings 36a, 37a are always open and no window is provided. As shown in Fig. 3 and Fig. 4, the carry-out side sub-chamber 235 (i-th guide roller) is accommodated in the carry-out side sub-chamber 33. The secondary indoor guide roller plus the diameter and the water of the sub-chamber 33 154537.doc •15· 201201632 The dimension of the flat short side direction (the left and right direction of Fig. 1), that is, the distance between the walls 36 and 37 is slightly larger. The left and right peripheral sides of the sub-chamber 235 slightly extend into the respective carry-out openings 36a and 37a. Most of the carry-out openings 36a, 37a are blocked by the sub-chamber 235. The clearance between the upper edge of each of the carry-out openings 36a and 37a and the circumferential surface of the sub-chamber 235 is sufficiently narrow. The distance between the upper edge of each of the carry-out openings 36a, 37a and the circumferential direction of the sub-chamber 235 is preferably about 0.5 mm to 4 mm, more preferably about 1 mm. The distance between the lower edge of each of the carry-out openings 36a, 37a and the circumferential direction of the circumferential surface of the sub-chamber 235 is slightly larger than the distance of the upper edge side, preferably about 1 mm to 6 mm, more preferably 3 mm. about. The carry-out side sub-chamber 33 is partitioned by the sub-chamber 235' into a chamber portion 33a which is lower than the guide roller 235 and a chamber portion 33b which is higher than the guide roller 235. As shown in Figs. 2 and 4, the axial length of the sub-chamber 235 along the axis L3 is shorter than the length of the carry-out sub-chamber 33 along the axis L3, and is also slightly shorter than the length of the carry-out openings 36a, 37a along the axis La. The gap between the end surface of the sub-chamber 235 in the direction of the axis L3 and the end of the unloading openings 36a and 37a in the direction of the drawing line L3 is preferably about 1 mm to about 3 mm, which is in the axial direction of the sub-chamber 235. Between the end faces on both sides and the inner end faces on the same side of the carry-out side sub-chambers 3, a sufficiently wide communication space 33e is formed. The chamber portion 33a on the lower side of the sub-chamber 33 and the upper chamber portion 33b pass through the communication space 33e. And connected. The film 9 to be processed as shown in Fig. 1 is partially wound around the lower side (one side in the circumferential direction) of the circumferential surface of the sub-chamber 235. The wound film 9 is wound around the winding portion of the guide roller 23 5 over the entire portion of the portion of the film to be processed 9 disposed in the carry-out side sub-chamber 33. The winding portion % is facing the carry-out side 154537.doc • 16· 201201632 The chamber portion 33a on the lower side of the sub-chamber 33. The position or posture of the to-be-processed film 9 in the carry-out side sub-chamber 3 3 is determined by the sub-chamber 235. The auxiliary chamber guide roller 235 and the main indoor guide roller 234 (second guide roller) adjacent to the front portion thereof determine the angle at which the process film 9 is in the auxiliary chamber guide roller 235 and the contact lens to the inner guide roller. The position of the circumferential surface of 235 (into the contact c) and the position of the film 9 to be processed through the inner opening 35a, the above-mentioned entry contact 〇 is located at or near the inner opening 35a. By the sub-chamber 235 and the groove outer guide roller 236 (second guide roller) adjacent to the rear stage, the position at which the film 9 to be processed is fed from the circumferential surface of the sub-chamber 23 5 (feeding contact d) is determined. And the angle, and the position of the film 9 to be processed through the outer opening 36a. The above-mentioned delivery contact d is just inside or near the outer opening 36a. The main indoor guide roller 234 is disposed in the main chamber 31, and is disposed adjacent to the partition wall 37 and further adjacent to the opening 37a. The groove outer guide roller 236 is disposed adjacent to the outer opening 36a and disposed outside the carry-out side of the processing tank 3''. The groove outer guide roller 23 6 is interposed between the carry-out side outer wall 36 and the take-up roll 22. A main chamber exhaust mechanism 4A is connected to the main chamber 31 of the treatment tank 30. The exhaust mechanism 40 includes an exhaust port 41 and an exhaust source 43. An exhaust port 41 is provided at the bottom of the main chamber 31. An exhaust path 42 extends from the exhaust port 41. The exhaust path 42 is connected to the exhaust source 43. The exhaust source 43 is constituted by a blower, but may be constituted by an exhaust pump. By the driving of the exhaust source 43, the gas in the main chamber 31 is sucked in from the exhaust port 41 and discharged through the exhaust path 42. As shown in Fig. 1, a carry-in side sub-chamber air supply mechanism 51 is connected to the carry-in side sub-chamber 32. The auxiliary chamber air supply mechanism 5 includes a plurality of air supply ports 5 lp and a gas supply source 154537.doc 17 201201632 5 1X as shown in FIG. 2, the air supply port 5 1 p is attached to the bottom of the loading side sub-chamber 32 along the axis L2 is set at intervals. As shown in the figure [4], each of the air supply ports 51p is opened at the chamber portion 32a on the lower side of the moving-side sub-chamber 32. The lower side portion of the sub-chamber 232 (the portion around which the film to be processed 9 is wound) and the air supply port 51p are vertically opposed to each other. The air supply source 51x is constituted by a blower, but may be constituted by a gas supply pump. The air supply path 51a from the air supply source 51x is branched into a plurality of (five in the figure), and is connected to each air supply port 51p. By the supply of the air supply source 51, air is supplied from the respective air supply ports 5 1 ρ to the carry-in side sub-chamber 3 2 via the air supply path 5 1 a. As shown in Fig. 1, a carry-out side sub-chamber air supply mechanism 52 is connected to the carry-out side sub-chamber 33. The sub-chamber air supply mechanism 52 includes a plurality of air supply ports 52p and an air supply source 52x. As shown in Figs. 2 and 4, the air supply port 52p is provided at intervals along the axis L3 at the bottom of the carry-out side sub-chamber 33. As shown in Figs. 3 and 4, each of the air supply ports 52p is opened at the chamber portion 33a on the lower side of the carry-out side sub-chamber 33. The lower side portion (the portion around which the film to be processed 9 is wound) of the sub-chamber 23 5 is vertically opposed to the air supply port 52p. The air supply source 52x is constituted by a blower, but may be constituted by an air supply pump. The one supply air source may be shared as the supply side air supply source 5 1χ and the carry-out side sub-chamber supply source 52χ. The air supply path 52a from the air supply source 52 is branched into a plurality of (5 in the figure) And connected to each air supply port 52p. The driving gas supply 52 is supplied to the unloading side sub-chamber 3 3 from the respective air supply ports 5 2 ρ through the air supply path from the air supply path. The operation of the surface treatment apparatus 1 configured as described above will be described centering on the pressure control in the treatment tank 30. 154537.doc
S 201201632 自捲出輥21中連續捲出被處理薄膜9，沿導輥23及輥電 極11之行而連續搬送，於途中之處理區域19進行表面處 理’並藉由捲取輥22而連續捲取。 與上述被處理薄膜9之搬送及表面處理同時地，藉由主 室排氣機構40抽吸主室31内之氣體並將其排出。藉此，主 室31之内壓於大氣壓或大氣壓左右之壓力範圍内變得低於 處理槽30之外部之壓力（大氣壓）。較佳為，主室31之内壓 比大氣壓低10 pa〜50 Pa左右，更佳為低2〇 pa左右。 進而，藉由副室供氣機構51、52而對副室32、33供給空 氣。該空氣自供氣口 51p、52p首先填充副室32、33之下側 之室部分32a、33a，進而通過連通空間32e、33e而填充上 側之室部分32b、33b内。藉此，副室32、33之内壓於大氣 壓或大氣壓左右之壓力範圍内變得高於處理槽3〇之外部之 塵力（大氣壓）。更佳為副室32、33之内壓比大氣壓高5 Pa〜20 Pa左右。因此，以下之關係成立。 (主室31之内壓）<(大氣壓）<(副室32、33之内壓）（式1) 因此’自副室供氣機構51、52供給至副室32、33之空氣自 外開口 34a、36a向外部流出，並且自内開口 35a、37a流入 主室3 1内。藉由自外開口 34a、36a向外部流出之流動，可 防止外部之環境氣體進入處理槽30内》藉由自内開口 35丑、37a流入主室31内之流動’可防止含有主室31内之處 理氣體成分之氣體向外部洩漏。 進而，來自供氣口 5 lp、52p之空氣直接被供給至下側之 室部分32a、33a，並自該部分擴散至上側之室部分32b、 154537.doc -19- 201201632 33b，故以下之關係成立。 (下側之室部分32a、33a之内壓）>(上側之室部分32b、 33b之内壓） ·..（式2) 因此’可使下側之室部分32a、33a、即被處理薄膜$之捲 繞部分9a、9b所面對之室部分32a、33a之内壓確實地變為 高壓。由此，可更確實地防止含有主室31内之處理氣體成 分之氣體經室部分32a、33a向外部流出，或者外部之環境 氣體經室部分32a、33a流入主室32内之狀況。特別是，如 圖3所示，於主室3 1之搬出側之部分，接觸被處理薄膜9之 氣體gl由被處理薄膜9帶動而向搬出側副室33移動，進而 向處理槽30之搬出側之外部移動。相對於此，薄臈捲繞側 之室部分33a内之空氣通過搬出側副室内導輥235與搬出側 内開口 37a之下緣之間而流入主室3丨内。該流入氣體g3之 流動方向係與被處理薄膜9之搬送方向、進而與被處理薄 膜9上之氣體gl之流動為反方向。藉由該反方向之流入氣 體g3，可將被處理薄膜9上之氣體gl推離被處理薄膜9而推 回主室3 1之内側。藉此，可確實地防止氣體gl與被處理薄 膜9一併向槽外流出之狀況。因此，可確實地防止處理氣 體成分向外部漏出之狀況。由此，可減輕環境負擔。於處 理氣體含有丙烯酸之情形時，可確實地防止丙烯酸特有之 如醋酸之臭氣散佈至外部環境氣體中，從而可確保良好之 作業環境》 主室3 1之内壓只要略低於大氣壓便可，無須增大主室排 氣源43之排氣容量，從而可使主室排氣源43小型化。 154537.docS 201201632 The film to be processed 9 is continuously wound out from the take-up roll 21, continuously conveyed along the line of the guide roll 23 and the roll electrode 11, and the surface of the processing area 19 on the way is subjected to surface treatment 'and continuously wound by the take-up roll 22 take. Simultaneously with the conveyance and surface treatment of the film 9 to be processed, the gas in the main chamber 31 is sucked by the main chamber exhaust mechanism 40 and discharged. Thereby, the pressure inside the main chamber 31 is lower than the pressure (atmospheric pressure) outside the treatment tank 30 in the pressure range of about atmospheric pressure or atmospheric pressure. Preferably, the internal pressure of the main chamber 31 is lower by 10 Pa to 50 Pa than atmospheric pressure, and more preferably about 2 Pa. Further, air is supplied to the sub chambers 32, 33 by the sub chamber supply mechanisms 51, 52. The air self-supply ports 51p, 52p first fill the chamber portions 32a, 33a on the lower side of the sub-chambers 32, 33, and further fill the upper chamber portions 32b, 33b through the communication spaces 32e, 33e. Thereby, the internal pressure of the sub chambers 32, 33 becomes higher than the dust force (atmospheric pressure) outside the treatment tank 3 within the pressure range of about atmospheric pressure or atmospheric pressure. More preferably, the internal pressure of the sub-chambers 32 and 33 is higher than the atmospheric pressure by about 5 Pa to 20 Pa. Therefore, the following relationship is established. (internal pressure in the main chamber 31) <(atmospheric pressure)<(internal pressure of the sub-chambers 32 and 33) (Expression 1) Therefore, the air supplied from the sub-chamber air supply mechanisms 51 and 52 to the sub-chambers 32 and 33 is self-contained. The outer openings 34a, 36a flow out to the outside and flow into the main chamber 31 from the inner openings 35a, 37a. By flowing out from the outer openings 34a, 36a to the outside, it is possible to prevent the external ambient gas from entering the processing tank 30. "The flow flowing into the main chamber 31 from the inner opening 35 ugly, 37a" prevents the main chamber 31 from being contained. The gas of the process gas component leaks to the outside. Further, the air from the air supply ports 5 lp, 52p is directly supplied to the lower chamber portions 32a, 33a, and diffuses from the portion to the upper chamber portions 32b, 154537.doc -19-201201632 33b, so the following relationship Established. (internal pressure of the lower chamber portions 32a, 33a) > (internal pressure of the upper chamber portions 32b, 33b) · (2) Therefore, the lower chamber portions 32a, 33a can be processed The internal pressure of the chamber portions 32a, 33a faced by the wound portions 9a, 9b of the film $ is surely changed to a high pressure. Thereby, it is possible to more reliably prevent the gas containing the processing gas component in the main chamber 31 from flowing out to the outside through the chamber portions 32a, 33a, or the external ambient gas flowing into the main chamber 32 through the chamber portions 32a, 33a. In particular, as shown in FIG. 3, the gas gl which is in contact with the film to be processed 9 is moved by the film to be processed 9 to the carry-out side sub-chamber 33, and is carried out to the processing tank 30, in the portion on the unloading side of the main chamber 31. External movement of the side. On the other hand, the air in the chamber portion 33a on the thin winding side flows into the main chamber 3 through the between the transfer-side sub-chamber 235 and the lower edge of the carry-out inner opening 37a. The flow direction of the inflowing gas g3 is opposite to the direction in which the film to be processed 9 is transported and further to the flow of the gas gl on the film 9 to be processed. By flowing the gas g3 in the opposite direction, the gas gl on the film 9 to be processed can be pushed away from the film to be processed 9 and pushed back to the inside of the main chamber 31. Thereby, it is possible to surely prevent the gas gl from flowing out of the groove together with the film to be processed 9. Therefore, it is possible to surely prevent the situation in which the processing gas component leaks to the outside. Thereby, the environmental burden can be reduced. When the treatment gas contains acrylic acid, it can surely prevent the odor of acetic acid, such as acetic acid, from being dispersed into the external environment gas, thereby ensuring a good working environment. The internal pressure of the main chamber 31 can be slightly lower than atmospheric pressure. The main chamber exhaust source 43 can be miniaturized without increasing the exhaust capacity of the main chamber exhaust source 43. 154537.doc
S -20· 201201632 搬出側副室3 3内之被處理薄膜9係藉由繞於搬出側副室 内導親235而進行定位。因此，可防止被處理薄膜9於搬出 側副室33内晃動。而且，被處理薄膜9之於搬出側副室33 内之部分的大致整體係繞於副室内導輥235上，故可確實 地防止搬出側副室3 3内之偏差。此外，藉由搬出側主室内 導輥234及搬出側副室内導輥235 ’可確定被處理薄膜9之 向搬出側副室内導輥23 5之進入接點c、以及被處理薄膜9 橫切搬出側間隔壁37之位置及角度。因此，可使搬出側内 開口 3 7a之下緣與副室内導輥23 5之圓周面之間隙充分小。 由此’被處理薄膜9上之氣體g 1難以通過開口 37a，可確實 地防止氣體g 1之向槽外之流出。來自副室3 3之氣體g3之流 入勢頭增大，亦有助於防止氣體gl之向槽外之流出。 藉由搬出側副室内導輥235及搬出側槽外導輥236，可確 定被處理薄膜9之自搬出側副室内導輥235之送出接點d、 以及被處理薄膜9橫切搬出側外壁3 6之位置及角度。藉由 於搬出側副室内導輥235與捲取輥22之間介入槽外導概 236，即便捲取輥22上之被處理薄膜9之繞徑隨著捲取之進 行而變化，上述副室内導輥235之圓周面上之送出接點d以 及被處理薄膜9橫切外壁36之位置及角度亦不會變化（如圖 3之兩點鎖線所示，槽外導輥23 6與捲取輥22之間之被處理 薄膜9之角度係隨著捲取之進行而變化）。因此，可使搬出 側外開口 36a之下緣與副室内導輥235之圓周面之間隙充分 小。又’各搬出開口 36a、37a之上緣與副室内導親235之 圓周面之間之間隙，於副室内導輥235不接觸各搬出開口 154537.doc -21 _ 201201632 36a、37a之上緣的範圍内可儘可能地小。 其結果為，可進一步確實地防止含有主，室31内之處理氣 體成分之氣體經搬出側副室3 3而向外部茂漏之狀況。又， 可確實地防止外部之環境氣體經搬出側副室33流入主室31 内之狀況。 搬入側副室32内之被處理薄膜9係藉由繞於搬入側副室 内導輥232而進行定位。因此，可防止被處理薄膜9於搬入 側副至3 2内晃動。而且，被處理薄膜9之於搬入側副室3 2 内之部分之大致整體係繞於副室内導觀2 3 2上，故可確實 地防止搬入側副至3 2内之偏差。此外，藉由搬入側槽外導 輥23 1及搬入側副室内導輥232，可確定被處理薄膜9之向 搬入側副室内導輥232之進入接點a、以及被處理薄膜9橫 切搬入側外壁34之位置及角度。藉由於捲出輥21與副室内 導輥232之間介入槽外導輥231，即便捲出輥21上之被處理 薄膜9之繞徑隨者捲出之進行而變化，上述副室内導親2 3 2 之圓周面上之進入接點a以及被處理薄膜9橫切外壁34的位 置及角度亦不會變化。因此，可使搬入側外開口 34a之下 緣與副室内導輥232之圓周面之間隙充分小。藉由搬入側 副室内導輥232及搬入側主室内導輥233，可確定被處理薄 膜9之自搬入側副室内導輥232之送出接點b、以及被處理 薄膜9橫切搬入側間隔壁35之位置及角度。因此，可使搬 入側内開口 3 5a之下緣與搬入側副室内導輥232之圓周面之 間隙充分小。又’各搬入開口 34a、35a之上緣與副室内導 輥232之圓周面之間之間隙，於副室内導輥232不接觸各搬 154537.doc •22· 201201632 入開口 34a、35a之上緣的範圍内可儘可能地小。其結果 為’可確實地防止含有纟室31内之處理氣體成分之氣體經 搬入側副室32而向外部洩漏之狀況，且可確實地防止外部 之環境氣體經搬入側副室32而流入主室3丨内之狀況。 由此，可將表面處理裝置丨簡單地組入例如偏光板之生 產線寺’可容易地進行線内化。 本發明並不限定於上述實施形態，於不脫離其主旨之範 圍内可進行各種改變。 例如’自副室供氣機構5 1、52供給至副室32、33之氣體 並不限於空氣，亦可為氮氣等惰性氣體。 處理槽30中只要設置搬入側副室32及搬出側副室33中之 至少搬出側副室3 3即可。特別是，就防止含有處理槽3 〇内 之處理氣體成分之氣體與被處理薄膜9 一併向外部漏出之 觀點而言’亦可僅設置搬入側副室3 2及搬出側副室3 3中之 搬出側副室3 3，省略搬入側副室3 2。 再者’就防止槽外之氣體與被處理薄膜9 一併進入處理 槽30内之觀點而言，亦可僅設置搬入側副室32及搬出側副 室33中之搬入副室32。 亦可將副室供氣機構51、52連接於副室32、33之上側之 室部分5 lb、52b，自副室供氣機構51、52將氣體直接供給 至上述上側之室部分5 lb、52b。亦可自副室供氣機構5 1、 52將氣體分別直接供給至副室32、33之上側之室部分 51b、52b及下側之室部分51a、52a。 副室内導輥232、235之直徑既可與副室32、33之水平短 154537.doc -23- 201201632 邊方向（圖1之左右）之内尺寸相等，亦可小於上述内尺寸。 該情形時，副室32、33之開口 34a、35a、36a、37a之上下 方向之寬度較佳為1〜mm左右β 亦可於搬出側副室33内配置2個以上之導輥235 »該情形 時，較佳為將1個導輥23 5配置於内開口 37a附近，將另1個 導輥235配置於外開口 36a附近。 亦可於搬入側副室32内配置2個以上之導輥。該情形 時，較佳為將1個導輥232配置於外開口 34a附近，將另^固 導輥232配置於内開口 35a附近。 亦可於副室33之内部或間隔壁37附近設置風刀噴嘴，沿 被處理薄膜9之表面喷附風刀，使被處理薄膜9上之氣體以 離開被處理薄膜9'或者推回主室31之内側。處理部1〇之 電極構造並不限於一對輥電極11，既可為報電極與平板電 極之組合’亦可為輥電極與具有沿該輥電極之圓周面之凹 曲面之凹板電極的組合，還可為平行平板電極。 處理部10並不限於在—對電極間導人被處理物並直接照 射電衆之所謂直接式之電漿處理部，亦可為噴出-對電極 間生成之電漿氣體，並將其喷附至自電極間空間隔開配 之被處理物之所謂間接式之電漿處理部。 被處理薄膜9並不限於連續薄膜，亦可為玻璃基板 導體晶圓❶搬送機構20並不限於輥21、 仃，亦可 為移動平台、滾動輸送機、操作器。 處理内容並不限於用以提高樹脂薄膜之接著性之電聚产 理。進而，處理内容並不限於雷 处 於電毁處理。本發明可適用於 I54537.doc •24- 201201632 清洗、表面改質、蝕刻、成膜等各種表面處理。 處理氣體之成分可根據處理内容而適當選擇。例如，於 斥水化處理或矽含有膜之蝕刻處理中，作為處理氣體成分 而使用 CF4、C2F6、C3F6、C3F8、chf3、ch2f2、ch3f、 SF6 NF3 XeF2專3氟化合物。於親水化處理中，使用 〇2、N2等作為處理氣體成分。 [實施例1] 對實施例進行說明，但本發明並不限定於以下之實施 例。 使用與圖1及圖2實質上相同構造之裝置1。 使用T A C薄膜作為被處理薄膜9。薄膜9之寬度（與圖1之 紙面正交之方向之尺寸）為154〇 mm。 導輥232、235之軸長為1586 mm。導輥23 2、235之直徑 為 φ100 mm。 副室32、33之上述軸長方向之長度為1〇95爪爪^副室32 之水平短邊方向之尺寸為128 mm。 開口 34a、35a、36a、37a之下緣與副室内導輥232、235 之圓周面之間的間隙於垂直方向上為3 mm。 開口 34a、35a、36a、3 7a之上緣與副室内導輥232、235 之圓周面之間的間隙於垂直方向上為1 mm。 開口 34a、3 5a、3 6a、37a之軸線L2 ' L3方向之端緣與副 室内導輥232 ' 235之端面之間之間隙為2 mm ° 主室排氣機43之排氣流量設定為i〇m3/min。 搬入側副室供氣吹風機51χ及搬出側副室供氣吹風機52χ 154537.doc •25- 201201632 之供氣流量分別設定為0.5 m3/min。 薄膜9之搬送速度係於5 m/min〜4〇 m/min之範圍内調 節。 處理部1 0之電衆條件係如下所示。S -20· 201201632 The film to be processed 9 in the unloading side sub-chamber 3 3 is positioned by being wound around the guide 235 in the carry-out side sub-chamber. Therefore, the film to be processed 9 can be prevented from rattling in the carry-out side sub-chamber 33. Further, substantially the entire portion of the processed film 9 in the carry-out side sub-chamber 33 is wound around the sub-chamber 235, so that variations in the carry-out side sub-chassis 3 3 can be surely prevented. Further, the carry-in side main guide roller 234 and the carry-out sub-chamber 235' can be used to determine the entry point c of the processed film 9 to the carry-out side sub-chamber 23, and the processed film 9 to be carried out transversely. The position and angle of the side partition wall 37. Therefore, the gap between the lower edge of the carry-out side inner opening 37a and the circumferential surface of the sub-chamber 23 5 can be made sufficiently small. Therefore, it is difficult for the gas g 1 on the film to be processed 9 to pass through the opening 37a, and the outflow of the gas g1 to the outside of the groove can be surely prevented. The increase in the momentum of the gas g3 from the sub-chamber 3 3 also helps to prevent the outflow of the gas gl out of the tank. By the carry-out side sub-guide roller 235 and the carry-out side guide outer guide roller 236, it is possible to specify the feed contact d of the processed film 9 from the carry-out side sub-chamber 235, and the processed film 9 to cross the carry-out side outer wall 3 6 position and angle. By interposing the groove outer guide 236 between the carry-out side sub-chamber 235 and the take-up roll 22, even if the diameter of the film to be processed 9 on the take-up roll 22 changes as the take-up progresses, the above-mentioned sub-chamber The position and angle of the feed contact d on the circumferential surface of the roller 235 and the outer surface 36 of the film to be processed 9 do not change (as shown by the two-point lock line in FIG. 3, the outer guide roller 23 6 and the take-up roller 22) The angle between the film 9 to be treated varies as the winding takes place. Therefore, the gap between the lower edge of the carry-out side outer opening 36a and the circumferential surface of the sub-chamber 235 can be made sufficiently small. Further, the gap between the upper edge of each of the carry-out openings 36a and 37a and the circumferential surface of the sub-chamber 235 is not in contact with the upper edge of each of the carry-out openings 154537.doc -21 _ 201201632 36a, 37a. The range can be as small as possible. As a result, it is possible to more reliably prevent the gas containing the processing gas component in the main chamber 31 from leaking to the outside through the carry-out side sub-chamber 3 3 . Moreover, it is possible to surely prevent the external ambient gas from flowing into the main chamber 31 through the carry-out side sub-chamber 33. The film 9 to be processed placed in the side sub-chamber 32 is positioned by being wound around the transfer-side sub-chamber inner guide roller 232. Therefore, it is possible to prevent the film to be processed 9 from being shaken in the carry-in side to the inside of 32. Further, substantially the entire portion of the processed film 9 in the carry-in side sub-chamber 3 2 is wound around the sub-chamber 2 2 2 , so that the deviation of the carry-in side pair into the 32 can be surely prevented. Further, by loading the side groove outer guide roller 23 1 and the carry-in side auxiliary inner guide roller 232, it is possible to determine the entry point a of the processed film 9 to the carry-in side sub-chamber 232 and the processed film 9 to be moved transversely. The position and angle of the side outer wall 34. Since the outer guide roller 231 is interposed between the take-up roll 21 and the sub-chamber 232, even if the winding diameter of the film to be processed 9 on the take-up roll 21 changes as the roll-out is performed, the above-mentioned sub-room guide 2 The position and angle of the entry contact a on the circumferential surface of the 3 2 and the processed film 9 transverse to the outer wall 34 do not change. Therefore, the gap between the lower edge of the carry-in side outer opening 34a and the circumferential surface of the sub-chamber 232 can be made sufficiently small. By the loading-side sub-chamber 232 and the loading-side main guide roller 233, it is possible to determine the delivery contact b of the processed film 9 from the loading-side sub-chamber 232, and the processed film 9 transversely-transforming the side partition. 35 position and angle. Therefore, the gap between the lower edge of the inside-side opening 35a and the circumferential surface of the carrying-side auxiliary guide roller 232 can be made sufficiently small. Further, the gap between the upper edge of each of the loading openings 34a and 35a and the circumferential surface of the sub-chamber 232 is not contacted by the sub-chamber 232. 154537.doc •22·201201632 The upper edge of the opening 34a, 35a The range can be as small as possible. As a result, it is possible to reliably prevent the gas containing the processing gas component in the chamber 31 from leaking to the outside through the loading-side sub-chamber 32, and it is possible to reliably prevent the external ambient gas from flowing into the main chamber 32 through the loading-side sub-chamber 32. The situation within the room 3 。. Thereby, the surface treatment apparatus can be easily incorporated into a production line temple such as a polarizing plate, which can be easily in-line. The present invention is not limited to the above embodiments, and various changes can be made without departing from the spirit and scope of the invention. For example, the gas supplied to the sub-chambers 32, 33 from the sub-chamber air supply means 5 1, 52 is not limited to air, and may be an inert gas such as nitrogen. The treatment tank 30 may be provided with at least the carry-out side sub-chamber 3 3 of the carry-in side sub-chamber 32 and the carry-out side sub-chamber 33. In particular, from the viewpoint of preventing the gas containing the process gas component in the treatment tank 3 from leaking to the outside together with the film to be treated 9, it is also possible to provide only the carry-in side sub-chamber 3 2 and the carry-out side sub-chamber 3 3 . The side sub-chamber 3 3 is removed, and the carry-in side sub-chamber 3 2 is omitted. Further, from the viewpoint of preventing the gas outside the tank from entering the treatment tank 30 together with the film to be treated 9, it is also possible to provide only the carry-in sub-chamber 32 in the carry-in side sub-chamber 32 and the carry-out side sub-chamber 33. The sub-chamber air supply mechanisms 51, 52 may be connected to the chamber portions 5 lb, 52b on the upper side of the sub-chambers 32, 33, and the gas is directly supplied from the sub-chamber air supply mechanisms 51, 52 to the upper chamber portion 5 lb, 52b. The gas may be directly supplied to the chamber portions 51b and 52b on the upper side of the sub chambers 32 and 33 and the chamber portions 51a and 52a on the lower side from the sub chamber supply mechanisms 51 and 52, respectively. The diameters of the sub-chambers 232, 235 may be equal to or smaller than the inner dimensions of the sub-chambers 32, 33 which are shorter than the horizontal direction of the 154537.doc -23-201201632 side (left and right of Fig. 1). In this case, the widths of the openings 34a, 35a, 36a, and 37a of the sub chambers 32 and 33 in the vertical direction are preferably about 1 to mm. β or two or more guide rollers 235 may be disposed in the carry-out sub-chamber 33. In the case, it is preferable to arrange one guide roller 23 5 in the vicinity of the inner opening 37a and to arrange the other guide roller 235 in the vicinity of the outer opening 36a. Two or more guide rolls may be disposed in the carry-in side sub-chamber 32. In this case, it is preferable to arrange one guide roller 232 in the vicinity of the outer opening 34a and to arrange the other fixing roller 232 in the vicinity of the inner opening 35a. An air knife nozzle may be disposed in the interior of the sub-chamber 33 or in the vicinity of the partition wall 37, and the air knife may be sprayed along the surface of the film 9 to be treated, so that the gas on the film 9 to be processed leaves the film 9' to be processed or pushed back to the main chamber. The inside of 31. The electrode structure of the processing unit 1 is not limited to the pair of roller electrodes 11, and may be a combination of a reporter electrode and a plate electrode. It may also be a combination of a roller electrode and a concave plate electrode having a concave curved surface along the circumferential surface of the roller electrode. It can also be a parallel plate electrode. The processing unit 10 is not limited to a so-called direct plasma processing unit that directly guides the object to be processed between the electrodes, and may be a plasma gas generated between the discharge and the counter electrode, and may be attached thereto. A so-called indirect plasma processing unit that separates the object to be treated from the space between the electrodes. The film to be processed 9 is not limited to a continuous film, and may be a glass substrate. The conductor wafer transport mechanism 20 is not limited to the rolls 21 and 仃, and may be a moving platform, a rolling conveyor, or an operator. The processing contents are not limited to the electropolymerization process for improving the adhesion of the resin film. Further, the processing content is not limited to lightning damage. The invention can be applied to various surface treatments such as cleaning, surface modification, etching, film formation, etc., I54537.doc • 24-201201632. The composition of the processing gas can be appropriately selected depending on the content of the treatment. For example, CF4, C2F6, C3F6, C3F8, chf3, ch2f2, ch3f, SF6 NF3 XeF2 specific trifluorochemicals are used as the processing gas component in the hydration treatment or the etching treatment of the ruthenium-containing film. In the hydrophilization treatment, ruthenium 2, N2 or the like is used as the processing gas component. [Example 1] Examples are described, but the present invention is not limited to the following examples. The apparatus 1 having substantially the same configuration as that of Figs. 1 and 2 was used. A T A C film was used as the film 9 to be processed. The width of the film 9 (the dimension in the direction orthogonal to the plane of the paper of Fig. 1) was 154 mm. The guide rollers 232, 235 have an axial length of 1586 mm. The diameter of the guide rolls 23, 235 is φ100 mm. The length of the sub-chambers 32, 33 in the axial length direction is 1 〇 95 claws. The dimension of the sub-chamber 32 in the horizontal short-side direction is 128 mm. The gap between the lower edges of the openings 34a, 35a, 36a, 37a and the circumferential faces of the sub-chambers 232, 235 is 3 mm in the vertical direction. The gap between the upper edges of the openings 34a, 35a, 36a, 37a and the circumferential faces of the sub-chambers 232, 235 is 1 mm in the vertical direction. The gap between the end edge of the opening 34a, 35a, 36a, 37a in the direction of the axis L2 'L3 and the end face of the sub-chamber 232' 235 is 2 mm. The exhaust flow rate of the main chamber exhauster 43 is set to i. 〇m3/min. The air supply flow rate of the air supply blower 51χ and the carry-out side sub-chamber blower 52χ 154537.doc •25- 201201632 are set to 0.5 m3/min. The conveying speed of the film 9 is adjusted in the range of 5 m/min to 4 m/min. The battery condition of the processing unit 10 is as follows.
供電：1200 WPower supply: 1200 W
施加電壓：Vpp = 17 kV 輥電極11、11間之間隙：1 mm 於上述親電極11、11間引起空氣放電，產生臭氧。不進 行自喷嘴12之氣體供給。 藉由差壓感測器測定主室3 1之内壓時，於薄膜9之搬送 速度為5 m/min~15 m/min之範圍内，可將主室31之内壓維 持為比大氣壓低20 Pa之負壓。即便搬送速度為4〇 m/min， 亦可將主室3 1之内壓維持為比大氣壓低丨7 pa之負壓。因 此，可確認即便增大搬送速度，亦可抑制來自搬入開口 34a之氣體流入量，無須增大主室排氣機構之排氣流量。 進而’於各外壁開口 34a、36a之外側設置臭氧檢測器 (理研計器株式會社製、型號GD-K77D)而進行臭氧檢測 時，無論搬送速度如何，任一開口 34a、36a側均未檢測到 臭氧。因此’確認可充分防止主室3丨内之氣體自開口 34a、36a向外部洩漏之狀況。再者，上述臭氧檢測器之檢 測極限臭氧濃度為0.02 ppm。 [實施例2] 於實施例2中，使用與實施例1相同之裝置1，將主室排 氣機43之排氣流置於2.5 m3/min~30 m3/min之範圍内調 •26· 154537.docApplied voltage: Vpp = 17 kV The gap between the roller electrodes 11, 11: 1 mm causes an air discharge between the above-mentioned electro-electrodes 11, 11 to generate ozone. The gas supply from the nozzle 12 is not performed. When the internal pressure of the main chamber 31 is measured by the differential pressure sensor, the internal pressure of the main chamber 31 can be maintained lower than the atmospheric pressure in the range of the transport speed of the film 9 of 5 m/min to 15 m/min. 20 Pa of negative pressure. Even if the conveying speed is 4 〇 m/min, the internal pressure of the main chamber 31 can be maintained at a negative pressure lower than atmospheric pressure by 7 pa. Therefore, it can be confirmed that even if the transport speed is increased, the amount of gas inflow from the carry-in opening 34a can be suppressed, and it is not necessary to increase the exhaust flow rate of the main chamber exhaust mechanism. Further, when an ozone detector (Model GD-K77D, manufactured by Riken Keiki Co., Ltd.) was installed on the outside of each of the outer wall openings 34a and 36a to perform ozone detection, ozone was not detected on any of the openings 34a and 36a regardless of the transport speed. . Therefore, it has been confirmed that the gas in the main chamber 3丨 can be sufficiently prevented from leaking to the outside from the openings 34a and 36a. Further, the above-mentioned ozone detector has a detection limit ozone concentration of 0.02 ppm. [Embodiment 2] In Embodiment 2, the same apparatus 1 as in Embodiment 1 is used, and the exhaust flow of the main chamber exhauster 43 is adjusted in the range of 2.5 m3/min to 30 m3/min. 154537.doc
S 201201632 節。薄膜9之搬送速度設為15 m/min(固定）。除此之外的條 件及檢測方法係與實施例1相同。 當主室排氣機43之排氣流量為2.5 m3/min~5.0 m3/min 時，於兩開口 34a、36a側檢測出臭氧。排氣流量5 〇 1113/111丨11時之主室31之内壓為比大氣壓低4.5?3之負壓。 當主室排氣機43之排氣流量為7.5 m3/min時，有時檢測 到臭氧有時檢測不到。 當主室排氣機43之排氣流量為1〇.〇 m3/min〜30.0 m3/min 時’任一開口 34a、36a側均未檢測到臭氧。排氣流量1〇 〇 m3/min時之主室31之内壓為比大氣壓低165 pa之負壓。排 氣流量15.0 m3/min時之主室31之内壓為比大氣壓低34.5 Pa 之負Μ。排氣流量20.0 m3/min時之主室31之内壓為比大氣 壓低48 Pa之負塵。 因此’確認只要主室3 1之内壓比大氣壓低10 Pa左右， 便可防止洩漏。確認只要主室31之内壓比大氣壓低i5 pa 左右以上，便可充分防止洩漏。由此，無須增大主室排氣 機構之排氣容量。 [產業上之可利用性] 本發明可適用於例如偏光板等之光學裝置之製造。 【圖式簡單說明】 圖1係表示本發明之第丨實施形態之表面處理裝置之概略 構成的解說正面圖； 圖2將破處理薄膜省略而表示上述表面處理裝置之處理 槽之搬入側之部分及搬出側之部分，且係沿圖RH-Π線 154537.doc •1Ί· 201201632 之平面剖面圖； 圖3係將上述處理槽之搬出側之部分放大表示之正面剖 面圖；及 圖4係沿圖3之IV-IV線之、上述處理槽之搬出侧之部分 之側面圖。 【主要元件符號說明】S 201201632 section. The conveying speed of the film 9 was set to 15 m/min (fixed). Other conditions and detection methods are the same as in the first embodiment. When the exhaust flow rate of the main chamber exhauster 43 is 2.5 m3/min to 5.0 m3/min, ozone is detected on the sides of the openings 34a and 36a. The internal pressure of the main chamber 31 at an exhaust gas flow rate of 5 〇 1113/111丨11 is a negative pressure of 4.5 to 3 lower than the atmospheric pressure. When the exhaust flow rate of the main chamber exhauster 43 is 7.5 m3/min, sometimes ozone is sometimes detected. When the exhaust flow rate of the main chamber exhauster 43 is 1 〇.〇 m3/min to 30.0 m3/min, no ozone is detected on either side of the openings 34a, 36a. The internal pressure of the main chamber 31 at an exhaust gas flow rate of 1 〇 3 m3/min is a negative pressure of 165 pa lower than the atmospheric pressure. The internal pressure of the main chamber 31 at an exhaust gas flow rate of 15.0 m3/min was a negative pressure of 34.5 Pa lower than the atmospheric pressure. The internal pressure of the main chamber 31 at an exhaust gas flow rate of 20.0 m3/min was negative dust of 48 Pa lower than the atmospheric pressure. Therefore, it is confirmed that leakage can be prevented as long as the internal pressure of the main chamber 31 is lower by about 10 Pa than the atmospheric pressure. It is confirmed that leakage can be sufficiently prevented as long as the internal pressure of the main chamber 31 is lower than the atmospheric pressure by about i5 pa or more. Thereby, it is not necessary to increase the exhaust capacity of the main chamber exhaust mechanism. [Industrial Applicability] The present invention is applicable to the manufacture of an optical device such as a polarizing plate. BRIEF DESCRIPTION OF THE DRAWINGS Fig. 1 is a front view showing a schematic configuration of a surface treatment apparatus according to a third embodiment of the present invention; and Fig. 2 is a view showing a portion of a surface of a processing chamber of the surface treatment apparatus And the cross-sectional view of the RH-Π line 154537.doc •1Ί· 201201632; FIG. 3 is a front cross-sectional view showing a portion of the carrying-out side of the processing tank; and FIG. 3 is a side view of a portion of the IV-IV line on the carrying-out side of the processing tank. [Main component symbol description]
S 1 表面處理裝置 9 被處理物 9a、9b 捲繞部分 10 處理部 11 輥電極 12 喷嘴 19 處理區域 20 搬送機構 21 捲出輥 22 捲取輥 23 導輥 30 處理槽 31 主室 32 搬入側之副室 32a 搬入側副室之下側（被處理薄膜之捲繞側） 之室部分 32b 搬入側副室之上側（非捲繞側）之室部分 32e 搬入側之連通空間 154537.doc •28· 201201632 33 搬出側之副室 33a 搬出側副室之下側(被處理薄膜之捲繞側) 之室部分 33b 搬出側副室之上側（非捲繞側）之室部分 33e 搬入側之連通空間 34 搬入側之外壁 34a 搬入側外開口（外壁之開口） 35 搬入側之間隔壁 35a 搬入側之内開口（間隔壁之開口） 36 搬出側之外壁 36a 搬出側之外開口（外壁之開口） 37 ^ 搬出側之間隔壁 37a 搬出側之内開口（間隔壁之開口） 40 主室排氣機構 41 排氣口 42 排氣路徑 43 排氣源 51 搬入側之副室供氣機構 51a > 52a 供氣路徑 5lp 、 52p 供氣口 51x、52x 供氣源 52 搬出側之副室供氣機構 231 搬入側之槽外導輥（第2導輥） 232 搬入側之副室内導輥（第1導輥） 154537.doc -29- 201201632 233 搬入側之 234 搬出側之 235 搬出側之 236 搬入側之 a ' c 進入接點 b ' d 送出接點 主室内導輥（第2導輥） 主室内導輥（第2導輥） 副室内導親（第1導親） 槽外導輥（第2導輥） -30· 154537.docS 1 Surface treatment device 9 Objects 9a, 9b Winding portion 10 Processing portion 11 Roll electrode 12 Nozzle 19 Processing region 20 Transfer mechanism 21 Rolling roller 22 Winding roller 23 Guide roller 30 Processing tank 31 Main chamber 32 Moving side The chamber portion 32b of the sub chamber 32a on the lower side of the loading side sub chamber (the winding side of the film to be processed) is carried into the communication space 154537.doc of the chamber portion 32e on the upper side (non-winding side) of the side sub chamber. 201201632 33 The sub-chamber 33a on the carry-out side, the chamber portion 33b on the lower side of the carry-out sub-chamber (the winding side of the film to be processed), and the communication portion 34 on the carry-in side of the chamber portion 33e on the upper side (non-wound side) of the carry-out side sub-chamber The loading-side outer wall 34a is inserted into the side outer opening (opening of the outer wall). 35 The loading side wall 35a is inserted into the inner opening (the opening of the partition wall). 36. The carrying-out outer wall 36a is moved out of the opening (the opening of the outer wall) 37 ^ The partition wall 37a on the carry-out side (the opening of the partition wall) 40 The main chamber exhaust mechanism 41 The exhaust port 42 The exhaust path 43 The exhaust source 51 The auxiliary chamber air supply mechanism on the carry-in side 51a > 52a Air supply path 5lp, 52p Air supply port 51x, 52x Air supply source 52 Sub-chamber air supply mechanism 231 Carrying-out groove outer guide roller (2nd guide roller) 232 Carry-in side auxiliary guide roller (1st guide roller) 154537.doc -29- 201201632 233 234 on the carry-in side 235 on the carry-out side 236 on the carry-out side a ' c on the carry-in side b ' d Feed the main guide roller (the second guide roller) ) Main indoor guide roller (2nd guide roller) Sub-room guide (1st guide) Slot guide roller (2nd guide roller) -30· 154537.doc
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| KR (1) | KR101268242B1 (en) |
| CN (1) | CN102792783A (en) |
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| WO (1) | WO2011111626A1 (en) |
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| JP6066707B2 (en) * | 2012-12-13 | 2017-01-25 | 日東電工株式会社 | Manufacturing method of polarizing film |
| JP2014138160A (en) * | 2013-01-18 | 2014-07-28 | Fujifilm Corp | Method for manufacturing wiring board |
| JP6426953B2 (en) * | 2014-09-05 | 2018-11-21 | 積水化学工業株式会社 | Film surface treatment method and apparatus |
| KR20210122507A (en) | 2020-04-01 | 2021-10-12 | 한국전기연구원 | System for estimating stator resistance and inductance of permanent magnet synchronous motor, and permanent magnet synchronous motor control system using the same |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| JPS6196071A (en) * | 1984-10-17 | 1986-05-14 | Hitachi Ltd | Continuous vacuum treatment device |
| KR880000215A (en) * | 1986-06-10 | 1988-03-24 | 나까므라 히사오 | Plasma treatment apparatus for sheet-like objects |
| JPH0768621B2 (en) * | 1988-05-12 | 1995-07-26 | 三菱重工業株式会社 | Continuous vacuum deposition equipment |
| JP3315238B2 (en) * | 1994-02-10 | 2002-08-19 | 富士写真フイルム株式会社 | Sealing method and apparatus for vacuum treatment of photosensitive material support |
| JP3675189B2 (en) | 1998-08-31 | 2005-07-27 | コニカミノルタホールディングス株式会社 | Surface treatment apparatus for support and surface treatment method for support |
| JP2000246091A (en) | 1998-12-29 | 2000-09-12 | Konica Corp | Method and apparatus for surface treatment of substrate and surface-treated substrate |
| JP4058857B2 (en) * | 1999-10-01 | 2008-03-12 | 松下電工株式会社 | Plasma processing apparatus and plasma processing method |
| JP2002322558A (en) * | 2001-04-25 | 2002-11-08 | Konica Corp | Thin film forming method, optical film, polarizing plate and image display device |
| JP4442053B2 (en) | 2001-05-24 | 2010-03-31 | パナソニック電工株式会社 | Plasma processing apparatus and plasma processing method |
| JP5081712B2 (en) * | 2008-05-02 | 2012-11-28 | 富士フイルム株式会社 | Deposition equipment |
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2011
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| CN102792783A (en) | 2012-11-21 |
| KR20120117947A (en) | 2012-10-24 |
| KR101268242B1 (en) | 2013-05-31 |
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