201146122 32372twf.doc/n 六、發明說明： 【發明所屬之技術領域】 本發明是有關於-種電路板的製作方法，且特 關於一種軟硬結合板的製作方法。 【先前技術】 簡單來說，軟硬結合板(汉^(^1以〇：^1^3(^(1)，就 φ 是將軟板與硬板組合成同一產品的電路板，兼具有軟性線 路板的可撓性以及硬性線路板的強度。早期的用途多在軍 事、醫療、工業儀器等領域，近幾年開始用於手機和消費 性電子產品(數位相機、數位攝影機等）等終端產品。在手 機内軟硬結合板的應用，常見的有摺疊式手機的影像模 組、按鍵模組及射頻模組等。 手機使用軟硬結合板的優點，包括讓手機的零件更容 易整合以及訊號傳輸量的可靠度提高。使用軟硬結合板， 可以取代原先利用二連接器加軟板的組合，以增加手機摺 • 疊處活動點的耐用性和長期使用的可靠度。 軟硬結合板的應用漸漸拓展至其他領域，如快閃記憶 體（Flash Memory)、動態隨機存取記憶體模組（DRAM Module )、薄膜電晶體液晶顯示模組（TFT-LCD Module ) 等，然而，在一般軟硬板結合製程中，通常都是軟板介於 二個硬板的中間層’軟板的兩端被二個硬板夾合’而軟板 的中間段為可彎折的區域，以做為傳輸訊號於二個硬板之 間的橋接段。然而’軟硬結合板的長度會受到印刷電路板 201146122 32372twf.doc/n 生產設備之加工區域限制’使得軟硬結合板的板長度無法 擴大至加工區域以外，特別是針對長條形軟硬結合板的製 作方法仍無法突破尺寸上的障礙，此外軟硬結合板的外型 限制’亦可能造成了硬板的利用率降低。因而如何改善既 有的生產方式及後續組裝上的便利性，均是業界所需解決 的問題。 【發明内容】.. 本發明提供一種軟硬結合板的製作方法，以突破尺寸 上的障礙，並可經由對折軟板，以使硬板單元在一方向上 延伸排列，進而改善既有的生產方式及後續組裝上的便 性。 本發明提出一種軟硬結合板的製作方法。首先，提供 一具有一第一線路層的硬板，與複數個具有一第二線路層 的軟板，硬板包含一預定移除區域與複數個硬板單元。^ ^ i在這些硬板單元與該預定移除區域之間切割複數條預 疋露出軟板的區域的切割線。利用一膠合層結合這些軟板 於硬板上。之後，形成複數個導通孔於硬板與這些軟^中， 以電性導通硬板上的第—線路層與軟板上的第二線路層。 沿著硬板上的這些切割線分別折斷預定移除區域，以^露 出各錄板，域這些硬板單元成型。將各錄板沿著各 自的複數條摺麵對折，以使這些硬板單元在— 伸排列。 、 在本發明之一實施例中，上述之軟板對折步驟包括依 201146122 yeuuzivV 32372twf.doc/n 序將一軟板沿著垂直摺叠绩# ΐ對折而使軟板㈣份區 二硬==軟方法，包括:提供 元之間’使軟硬結合板具有一^層接合於—硬板單 ;數=疊ΠΓ使軟硬結合板:著=== 第-長度，第—長度Α於第—長度。 “有 層的實施例中‘之硬板為具有雙面線路 層實施例中，上述之軟板為具有雙面線路 更包實施例中，上述軟硬結合板接合之後， 更包括I成夕個導通孔於軟板與二硬板單元中。 著一 實施例中，上述軟板對折步驟包括:沿 &姑的一4 i、折，以及沿著一水平摺疊線對折，而使 軟板的一精區域重疊於軟板的另-部分區域上。 〜實施例中，上述軟板對折步驟包括：沿 折；以及沿著一對角摺疊線對折，而使 軟板的。P伤區域重疊於軟板的另一部分區域上。 二、；上述本發明的軟硬結合板的製作方法克服了尺 寸上:法突破的障礙’可組合成一延伸型軟硬結合板，改 善既有:的生產方柄缺陷及提高後續《上的便利性。 為讓本發明之上述特徵和優點能更明顯易懂，下文特 5 201146122 ^ouuziw 32372twf.doc/n 舉實施例，並配合所附圖式作詳細說明如下。 【實施方式】 圖1為本發明-實施例之軟硬結合板未展開時的示音 圖。.圖2A〜圖2B為垂直於圖1的摺疊線切割沿著w & 的軟硬結合板的剖面示意圖。 請參考圖1及圖2Α，軟硬結合板1〇〇包括硬板㈣、 多個軟板120以及連接於硬板11〇與軟板ι2〇之間的一膠 合層130。硬板110具有一預定移除區域u〇A以及多個硬 板單元111〜118，而各個硬板單元U1〜118與預定移除 區域110A之間可形成多個切割線hob。切割線u〇B例 如利用V型切割機或以雷射切割形成，但不完全切斷，深 度可控制在8〜16密爾。膠合層130可先利用模具沖壓或 以雷射切割’以移除對應於各個軟板120須挽曲位置的巴 域132形成具有圖樣的膠合層130。而各個硬板11()再^ 由膠合層130與軟板120的聚亞醯胺（p〇lyimide)膜 壓合成一體。 硬板110具有第一線路層110D，而各個軟板120具有 第二線路層124。在硬板110與軟板12〇壓合之後，多個 導通孔140可形成於硬板110與各個軟板120之間。導通 孔140 —般利用鑽孔方式形成再利用電鍍形成導電層於孔 壁上，以電性導通第一線路層110D與第二線路層124。硬 板110或軟板120上，可利用一般的電路板增層方式再形 成外層線路。 201146122 y»0U2lW 32372twf.doc/n …之後，在折斷預絲除區域的步财，先使錢硬板 單元m〜m成型’其成型方式可為—般印刷電路板所常 用之方式。接著在各個硬板單元lu〜118的下表面相對於 預定移除區域11GA的切割線11GB再以v型切割機或以 雷射切割出V型_線職，在此以不完全切斷此預定 移除區域11GA為原則，深度可控制在8〜16密爾，殘留 厚度約I控制在4〜2G錢，以方便在後續折斷。 接著，如圖2B所示，各個硬板單元lu〜n8可經由 扳折而使預定移除區域1騰沿著切割線UGB被折斷，並 取出这些已折斷的移除區域UGA而顯露出軟板12〇的聚 亞醯胺膜122。 以下將詳細"紹如何利用上述的軟硬結合板來製 作延伸型電路板。請參考圖1，在本實施例中，在-預定 尺寸的硬板110上形成有多個平行排列的硬板單元1U〜 118此外，多個軟板12〇接合於兩硬板單元之間，但不重 複接合相同的兩硬板，而是採較錯的方式依序連接兩硬 板-早70。本發明經由上述的配置，可將8片硬板單元⑴ 乂及7片軟板120相結合並經由後續加工製程步驟 (，如：導通孔步驟、防焊步驟等)處理後，利用硬板單元 成型與預定移除區域丨的移除步驟並藉由_步驟而 .、且成=伸型軟硬結合板。上述的硬板⑴〜—及軟板⑽ 的數量只是舉例，可錢實際的需求調整。 + # ^板110較佳是一具有雙面線路層的硬質電路板，可 由玻纖樹脂和圖案化的銅箱以疊合或增層的方式形成，並 201146122 98002TW 32372twf.doc/n 經由固化而成形，可提供組料支撐軟板12()的功能。軟 板po較佳疋一具有雙面線路層的軟性電路板，但亦可具 有單面第二線路層124(如圖2A所示;)，可由聚亞醯胺膜、 黏膠和圖案化的銅箔製成。 請參考圖2A及圖2B，首先，在各個硬板單元ηι〜 118與預定移除區域110A之間切割出多條預定露出軟板 的區域的切割線110B。接著，利用一膠合層13〇結合這些 軟板120於硬板11〇上。形成多個導通孔14〇於硬板11〇 與這些軟板120中，以電性導通硬板11〇上的第一線路層 110D與軟板120上的第二線路層124。之後，沿著硬板 上的這些切割線110B對應形成v型切割線11〇c，再分別 折斷預定移除區域110A，以顯露出各個軟板12〇，並使這 些硬板單元111〜118成型。 其中，導通孔140的作法如下：（丨）使用鑽孔機鑽出 連通於軟板120與硬板110之中的通孔140A，在較佳情況 下，通孔140A的直徑為〇.2mm〜3.175mm ; (2)對通孔 140A進行電鍍，以電性導通各個硬板110上的第一線路層 110D與各個軟板120上的第二線路層124。通常電链之 前’先對通孔140A進行除膠渣的作業，然後於電鍍液中 通入直流電流’進行化學還原反應，以使硬板上的第 一線路層110D以及軟板120上的第二線路層124與通孔 140B中的導電層140A導通’導電層140A的厚度可控制 在0.5〜2密爾。 完成導通孔140之後’可再於軟板120的第二線路層 201146122 98002IW 32372twf.doc/n 124上以及硬板110的第—線路層ii〇d上塗佈一防焊層 广2’以冗止線路層氧化或被焊料污染，但顯露出接點‘ 於防焊層142之外，以做為訊號傳輸的接合面。 請參考圖3八〜圖3G的摺疊順序示意圖，其代表性緣 示四個硬㈣摺_序，但也適驗更多 如圖3A〜圖3C所示，將第一硬板單元ui向左摺 «，以使軟板120沿著垂直摺疊線u向左對折，之後軟 板120再沿著水平摺疊線u向下對折而使軟板12〇的一 部份區域重疊於軟板12〇的另一部分區域上。接著，如圖 3D及圖3E所示，將第三硬板單元113及第四硬板單元114 向右摺疊，以使軟板120沿著垂直摺疊線L1向右對折， 之後軟板再沿著水平摺疊線L2向上對折而使軟板12〇的 一部份區域重疊於軟板120的另一部分區域上。接著，如 圖3F及圖3G所示，將第四硬板單元114向右摺疊，以使 軟板120沿著垂直摺疊線L1向右對折，之後軟板12〇再 沿著水平摺疊線L2向下對折而使軟板12〇的一部份區域 重疊於軟板120的另一部分區域上。在圖3G中，所有第 一到第四硬板單元111〜114均排列在延伸方向上。如此， 延伸型軟硬結合板100a大致上完成，故摺疊之後的軟硬結 合板100a的長度S2 (第二長度）大於摺疊前軟硬結合板 100的原先長度S1 (第一長度）即大於原先印刷電路板生 產設備上預定尺寸的電路板。因此，不會受到印刷電路板 生產設備之限制。 請參考圖4A及圖4B的摺疊示意圖，在另一實施例 201146122 , ^ουυ^,χγν 32372twf.d〇C/n 中’軟板22〇上的二摺疊線不限定是垂直摺疊線和水平摺 疊線，亦可以是=於對角線上的摺疊線。首先，第一硬板 單元211向下摺疊，以使軟板220沿著水平摺疊3 下對折，之後第二硬板單元212向上指疊，以使=板220 沿著對角摺疊線L4肖上對折，而使軟板22〇白勺一部份區 域重疊於軟板220的另一部分區域上。如此，第二硬板單 元212與第一硬板單元211呈直角交叉的£形，不是排列 在長度方向上。故本發明可依照客戶的需求製作不同摺疊 方式的軟硬結合板’以符合客製化的要求。 综上所述，本發明的軟硬結合板的製作方法克服了尺 寸上無法突破的障礙，可經由對折硬板使其沿著相同方向 或不同方向延伸而組合成一延伸型軟硬結合板，改善既有 的生產方式的缺陷及提高後續組裝上的便利性，可^泛地 應用在面板、手機、記憶體模組等電子產品的產業丄。 雖然本發明已以實施例揭露如上，然其並非用以限定 本發明’任何所屬技術領域中具有通常知識者，在不^離 本發明之精神和範圍.内，當可作些許之更動與潤飾，故本 發明之保護範圍當視後附之申請專利範圍所界定者為準。 【圖式簡單說明】 圖1為本發明一實施例之軟硬結合板未展開時的示音 圖。 心 圖2A〜圖2B為垂直於圖1的摺疊線切割的軟硬結合 板的剖面示意圖。 σσ 圖3Α〜圖3G為本發明之軟硬結合板展開時的摺疊順 201146122 y〇Kjvz l W 32372twf.doc/n 序示意圖。 圖4A〜圖4B為本發明另一實施例之軟硬結合板的摺 疊示意圖。 【主要元件符號說明】 100 :軟硬結合板 100a :延伸型軟硬結合板 110 :硬板 110A :預定移除區域 110B :切割線 110C : V型切割線 110D :第一線路層 111〜118 :硬板單元 120 :軟板 122 :聚亞醯胺膜 124 :第二線路層 130 :膠合層 132 :撓曲位置的區域 140 :導通孔 140A :導電層 140B :通孔 142 :防焊層 211、212 :硬板單元 220 :軟板 a、C2 :接點 U、L2 :摺疊線 L3、L4 :摺疊線 11201146122 32372twf.doc/n VI. Description of the Invention: [Technical Field] The present invention relates to a method of fabricating a circuit board, and particularly to a method of fabricating a soft and hard bonding board. [Prior Art] In simple terms, the combination of soft and hard boards (Han ^(^1〇:^1^3(^(1), φ is a circuit board that combines a soft board and a hard board into the same product, both The flexibility of flexible circuit boards and the strength of rigid circuit boards. Early applications in the military, medical, industrial equipment, etc., have been used in mobile phones and consumer electronics (digital cameras, digital cameras, etc.) in recent years. Terminal products. In the application of soft and hard board in mobile phones, there are common image modules, button modules and RF modules of folding mobile phones. The advantages of using soft and hard boards are included in the mobile phone, including making the parts of the mobile phone easier to integrate. And the reliability of the signal transmission is improved. The combination of the soft connector and the soft board can replace the original combination of the two connectors and the soft board to increase the durability of the folding point of the mobile phone and the reliability of long-term use. The application of the board has gradually expanded to other fields, such as flash memory, DRAM Module, TFT-LCD Module, etc. However, In the general soft and hard board bonding process, the soft board is usually in the middle layer of two hard boards. 'The two ends of the soft board are sandwiched by two hard boards' and the middle part of the soft board is a bendable area. As the transmission signal between the two hard boards, the length of the 'soft and hard board will be limited by the processing area of the printed circuit board 201146122 32372twf.doc/n production equipment', so the board length of the hard and soft board can not be Expanding beyond the processing area, especially for the production of long strips of soft and hard bonding boards, it is still unable to break through the obstacles in size, and the shape limitation of the soft and hard bonding boards may also result in a decrease in the utilization rate of the hard boards. Improving the existing production methods and the convenience of subsequent assembly are all problems that the industry needs to solve. [Invention] The present invention provides a method for manufacturing a soft and hard bonding board, which breaks through obstacles in size and can By folding the flexible board, the hard board unit is arranged to extend in one direction, thereby improving the existing production mode and the convenience of subsequent assembly. The invention provides a soft and hard bonding board. First, a hard board having a first circuit layer is provided, and a plurality of soft boards having a second circuit layer, the hard board includes a predetermined removal area and a plurality of hard board units. ^ ^ i in these hard Cutting a plurality of cutting lines pre-exposed to expose the soft board between the board unit and the predetermined removal area. The soft boards are combined on the hard board by a glue layer. Thereafter, a plurality of through holes are formed on the hard board and the soft board ^, electrically conducting the first circuit layer on the hard board and the second circuit layer on the soft board. The predetermined removal areas are respectively broken along the cutting lines on the hard board to expose the respective recording boards. The hard disk unit is formed. The respective recording boards are folded along the respective plurality of strips so that the hard board units are arranged in a row. In an embodiment of the invention, the soft board folding step comprises the following: 201146122 yeuuzivV 32372twf.doc/n The order of a soft board along the vertical folding score ΐ ΐ 而 而 而 软 软 软 四 四 四 四 四 = = = = = = = = = = = = = = = = = = = = = = = = = = = = On - hard board single; number = stacking makes soft and hard board: = == The first length, the first length is the first length. In the embodiment of the layered embodiment, the hard board is in the embodiment with the double-sided circuit layer, and the soft board is in the embodiment with the double-sided line. After the above-mentioned soft and hard bonding board is joined, the The through hole is in the soft board and the second hard board unit. In an embodiment, the folding step of the soft board comprises: folding along a & a fold, and folding along a horizontal folding line to make the soft board A fine area overlaps the other partial area of the flexible board. In the embodiment, the folding step of the soft board includes: folding along; and folding along a pair of corner folding lines, so that the P area of the soft board is overlapped The other part of the soft board is in the second part. The method for manufacturing the soft and hard joint board of the present invention overcomes the size: the obstacle of the method breakthrough can be combined into an extended type of soft and hard joint board, and the existing production handle is improved. Defects and enhancements of the convenience of the following. In order to make the above features and advantages of the present invention more obvious, the following is a specific example of the present invention and is described in detail below with reference to the accompanying drawings. [Embodiment] Figure 1 FIG. 2A to FIG. 2B are schematic cross-sectional views of the soft and hard bonding board along w & perpendicular to the folding line of FIG. 1 . 1 and FIG. 2A, the hard and soft bonding board 1 includes a hard board (4), a plurality of soft boards 120, and a bonding layer 130 connected between the hard board 11〇 and the soft board ι2〇. The hard board 110 has a predetermined removal. a region u〇A and a plurality of hard plate units 111 to 118, and a plurality of cutting lines hob may be formed between each of the hard plate units U1 to 118 and the predetermined removal region 110A. The cutting line u〇B is, for example, a V-shaped cutter or Formed by laser cutting, but not completely cut, the depth can be controlled at 8~16 mils. The glue layer 130 can be first stamped with a die or cut with a laser to remove the position corresponding to each soft plate 120. The bundle 132 forms a patterned glue layer 130. Each of the hard plates 11 is further integrated into the p〇lyimide film of the soft plate 120 by the glue layer 130. The hard plate 110 has a first line. The layer 110D, and each of the flexible boards 120 has a second circuit layer 124. After the hard board 110 and the soft board 12 are pressed together, a plurality of The through hole 140 may be formed between the hard plate 110 and each of the soft plates 120. The through holes 140 are generally formed by drilling to form a conductive layer on the hole wall to electrically conduct the first circuit layer 110D and the second layer. The circuit layer 124. The hard board 110 or the soft board 120 can be formed into a thin layer by a general circuit board layering method. 201146122 y»0U2lW 32372twf.doc/n ... After the break of the pre-filament area, first Forming the money hard board unit m~m' can be formed in the manner commonly used for printed circuit boards. Then, the cutting line 11GB of the lower surface of each of the hard board units lu~118 with respect to the predetermined removal area 11GA is further The v-type cutting machine or the laser cuts the V-type line, here the principle is not completely cut off the predetermined removal area 11GA, the depth can be controlled at 8~16 mils, and the residual thickness is about I is controlled at 4~ 2G money to facilitate breaks in the follow-up. Next, as shown in FIG. 2B, each of the hard board units lu~n8 can be broken along the cutting line UGB by the folding, and the broken removal areas UGA are taken out to reveal the soft board. 12 聚 polyimide membrane 122. In the following, the details of how to use the above-mentioned soft and hard bonding board to make an extended circuit board will be described in detail. Referring to FIG. 1, in the embodiment, a plurality of hard-plate units 1U to 118 arranged in parallel are formed on a predetermined size of the hard board 110. Further, a plurality of flexible boards 12 are joined between the two hard board units. However, instead of repeatedly joining the same two hard plates, the two hard plates are connected in sequence in a wrong manner - early 70. According to the above configuration, the eight hard board units (1) and the seven soft boards 120 can be combined and processed through a subsequent processing process (eg, a via step, a solder resist step, etc.), using a hard board unit. Forming and pre-removing the area 丨 removal step and by step _, and into = extension type soft and hard bonding board. The number of the above-mentioned hard plates (1) to - and soft boards (10) is only an example, and can be adjusted according to actual needs. + #^板110 is preferably a rigid circuit board having a double-sided circuit layer, which may be formed by laminating or layering a glass fiber resin and a patterned copper box, and is cured by 201146122 98002TW 32372twf.doc/n Formed to provide the function of the binder support soft board 12(). The flexible board po is preferably a flexible circuit board having a double-sided circuit layer, but may also have a single-sided second circuit layer 124 (as shown in FIG. 2A), which may be made of a polyimide film, a glue, and a patterned Made of copper foil. Referring to Fig. 2A and Fig. 2B, first, a plurality of cutting lines 110B which are intended to expose a region of the flexible board are cut between the respective hard board units η to 118 and the predetermined removal area 110A. Next, these flexible sheets 120 are bonded to the hard board 11 by a glue layer 13 。. A plurality of via holes 14 are formed in the hard board 11A and the soft board 120 to electrically conduct the first circuit layer 110D on the hard board 11 and the second circuit layer 124 on the soft board 120. Thereafter, the v-shaped cutting lines 11〇c are formed correspondingly along the cutting lines 110B on the hard board, and the predetermined removal areas 110A are respectively broken to expose the respective soft boards 12〇, and the hard board units 111 to 118 are molded. . The via hole 140 is implemented as follows: (丨) The through hole 140A communicating with the soft board 120 and the hard board 110 is drilled using a drill, and preferably, the diameter of the through hole 140A is 〇.2 mm~ 3. 175 mm; (2) Electroplating the via hole 140A to electrically conduct the first circuit layer 110D on each of the hard plates 110 and the second circuit layer 124 on each of the soft plates 120. Usually, before the electric chain, the through hole 140A is subjected to desmear operation, and then a direct current is applied to the plating solution to perform a chemical reduction reaction to make the first circuit layer 110D on the hard board and the first on the soft board 120. The two wiring layers 124 are electrically connected to the conductive layer 140A in the via hole 140B. The thickness of the conductive layer 140A can be controlled to be 0.5 to 2 mils. After the via 140 is completed, a solder mask can be applied to the second circuit layer 201146122 98002IW 32372twf.doc/n 124 of the soft board 120 and the first circuit layer ii〇d of the hard board 110. The circuit layer is oxidized or contaminated with solder, but the contact is exposed 'outside the solder resist layer 142' as the interface for signal transmission. Please refer to the folding sequence diagram of FIG. 3 8 to FIG. 3G. The representative edge shows four hard (four) folds, but it is also more suitable as shown in FIG. 3A to FIG. 3C. The first hard board unit ui is left. Folding « so that the soft board 120 is folded to the left along the vertical folding line u, and then the soft board 120 is folded down along the horizontal folding line u so that a part of the soft board 12 重叠 overlaps the soft board 12 〇 On another part of the area. Next, as shown in FIG. 3D and FIG. 3E, the third hard board unit 113 and the fourth hard board unit 114 are folded to the right so that the soft board 120 is folded rightward along the vertical folding line L1, and then the soft board is further along The horizontal folding line L2 is folded upwardly so that a part of the area of the flexible board 12 is overlapped with another part of the soft board 120. Next, as shown in FIG. 3F and FIG. 3G, the fourth rigid plate unit 114 is folded to the right so that the soft plate 120 is folded to the right along the vertical folding line L1, and then the soft plate 12 is further folded along the horizontal folding line L2. The lower half is folded so that a part of the area of the flexible board 12 is overlapped with another part of the soft board 120. In Fig. 3G, all of the first to fourth hard board units 111 to 114 are arranged in the extending direction. Thus, the extended soft and hard bonding plate 100a is substantially completed, so the length S2 (second length) of the soft and hard bonding plate 100a after folding is greater than the original length S1 (first length) of the soft and hard bonding plate 100 before folding is greater than the original A printed circuit board produces a circuit board of a predetermined size on the device. Therefore, it is not subject to the limitations of printed circuit board production equipment. Please refer to the folding schematic diagrams of FIG. 4A and FIG. 4B. In another embodiment 201146122, ^ουυ^, χγν 32372twf.d〇C/n, the two folding lines on the soft board 22〇 are not limited to vertical folding lines and horizontal folding. The line can also be a fold line on the diagonal. First, the first rigid board unit 211 is folded downward so that the soft board 220 is folded down along the horizontal fold 3, and then the second hard board unit 212 is folded upward so that the = board 220 is diagonally folded along the line L4. In the opposite direction, a portion of the soft plate 22 is overlapped with another portion of the soft plate 220. Thus, the second rigid plate unit 212 and the first rigid plate unit 211 are formed in a right-angled shape at a right angle, not in the longitudinal direction. Therefore, the present invention can manufacture soft and hard bonding plates of different folding modes according to the needs of customers to meet the requirements of customization. In summary, the manufacturing method of the soft and hard bonding board of the present invention overcomes the obstacle that cannot be broken in size, and can be combined into an extended soft and hard bonding board by folding the hard board to extend in the same direction or in different directions, thereby improving The defects of the existing production methods and the convenience of subsequent assembly can be applied to the industrial products of electronic products such as panels, mobile phones, and memory modules. Although the present invention has been disclosed in the above embodiments, it is not intended to limit the invention to those of ordinary skill in the art, and it is possible to make some modifications and refinements without departing from the spirit and scope of the invention. Therefore, the scope of protection of the present invention is subject to the definition of the scope of the patent application. BRIEF DESCRIPTION OF THE DRAWINGS Fig. 1 is a diagram showing a sound and soft bond plate unexpanded according to an embodiment of the present invention. 2A to 2B are schematic cross-sectional views of the soft and hard bonding board cut perpendicularly to the folding line of Fig. 1. Σσ FIG. 3Α to FIG. 3G are schematic diagrams showing the folding of the soft and hard bonding board of the present invention when it is unfolded, 201146122 y〇Kjvz l W 32372twf.doc/n. 4A to 4B are schematic views showing the folding of the soft and hard bonding board according to another embodiment of the present invention. [Main component symbol description] 100: Soft and hard bonding plate 100a: Extended hard and soft bonding plate 110: Hard plate 110A: predetermined removal region 110B: Cutting line 110C: V-shaped cutting line 110D: First wiring layer 111 to 118: Hard board unit 120: soft board 122: polyimide film 124: second wiring layer 130: glue layer 132: region 140 in flexing position: via hole 140A: conductive layer 140B: through hole 142: solder resist layer 211, 212: Hard board unit 220: Soft board a, C2: Contact U, L2: Folding line L3, L4: Folding line 11