TW201144884A - Optical transmitter/receiver - Google Patents

Optical transmitter/receiver

Info

Publication number
TW201144884A
TW201144884A TW100112017A TW100112017A TW201144884A TW 201144884 A TW201144884 A TW 201144884A TW 100112017 A TW100112017 A TW 100112017A TW 100112017 A TW100112017 A TW 100112017A TW 201144884 A TW201144884 A TW 201144884A
Authority
TW
Taiwan
Prior art keywords
photodiode
optical fiber
receiver
light
laser diode
Prior art date
Application number
TW100112017A
Other languages
Chinese (zh)
Inventor
Yasunari Maeda
Makoto Suzuki
Satoshi Kanbe
Original Assignee
Qd Laser Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Qd Laser Inc filed Critical Qd Laser Inc
Publication of TW201144884A publication Critical patent/TW201144884A/en

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01SDEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00Semiconductor lasers
    • H01S5/02Structural details or components not essential to laser action
    • H01S5/022Mountings; Housings
    • H01S5/02208Mountings; Housings characterised by the shape of the housings
    • H01S5/02212Can-type, e.g. TO-CAN housings with emission along or parallel to symmetry axis
    • GPHYSICS
    • G02OPTICS
    • G02BOPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24Coupling light guides
    • G02B6/42Coupling light guides with opto-electronic elements
    • G02B6/4201Packages, e.g. shape, construction, internal or external details
    • G02B6/4204Packages, e.g. shape, construction, internal or external details the coupling comprising intermediate optical elements, e.g. lenses, holograms
    • G02B6/4214Packages, e.g. shape, construction, internal or external details the coupling comprising intermediate optical elements, e.g. lenses, holograms the intermediate optical element having redirecting reflective means, e.g. mirrors, prisms for deflecting the radiation from horizontal to down- or upward direction toward a device
    • GPHYSICS
    • G02OPTICS
    • G02BOPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24Coupling light guides
    • G02B6/42Coupling light guides with opto-electronic elements
    • G02B6/4201Packages, e.g. shape, construction, internal or external details
    • G02B6/4246Bidirectionally operating package structures
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01SDEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00Semiconductor lasers
    • H01S5/02Structural details or components not essential to laser action
    • H01S5/022Mountings; Housings
    • H01S5/0225Out-coupling of light
    • H01S5/02251Out-coupling of light using optical fibres
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42Wire connectors; Manufacturing methods related thereto
    • H01L2224/47Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805Shape
    • H01L2224/4809Loop shape
    • H01L2224/48091Arched
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01SDEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00Semiconductor lasers
    • H01S5/02Structural details or components not essential to laser action
    • H01S5/022Mountings; Housings
    • H01S5/0225Out-coupling of light
    • H01S5/02255Out-coupling of light using beam deflecting elements
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01SDEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00Semiconductor lasers
    • H01S5/02Structural details or components not essential to laser action
    • H01S5/022Mountings; Housings
    • H01S5/023Mount members, e.g. sub-mount members
    • H01S5/02325Mechanically integrated components on mount members or optical micro-benches

Abstract

Disclosed is an optical transmitter/receiver which is provided with: a first photodiode (16) which receives receiving light outputted from an optical fiber (20); a second photodiode (17) which has a light receiving surface (42b) that forms the same plane as the light receiving surface (42a) of the first photodiode (16); a laser diode (14) which outputs, toward the first photodiode (16) and the second photodiode (17), transmitting light inputted to the optical fiber (20); and a thin film (18), which is provided on the light receiving surface (42a) of the first photodiode (16), reflects, toward the optical fiber (20), some of the transmitting light outputted from the laser diode (14), and which passes through the receiving light outputted from the optical fiber (20). The second photodiode (17) receives some of other transmitting light outputted from the laser diode (14).
TW100112017A 2010-04-08 2011-04-07 Optical transmitter/receiver TW201144884A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2010089746A JP2011221249A (en) 2010-04-08 2010-04-08 Optical transmitter/receiver

Publications (1)

Publication Number Publication Date
TW201144884A true TW201144884A (en) 2011-12-16

Family

ID=44762416

Family Applications (1)

Application Number Title Priority Date Filing Date
TW100112017A TW201144884A (en) 2010-04-08 2011-04-07 Optical transmitter/receiver

Country Status (3)

Country Link
JP (1) JP2011221249A (en)
TW (1) TW201144884A (en)
WO (1) WO2011125460A1 (en)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2014075536A (en) * 2012-10-05 2014-04-24 Sumitomo Electric Ind Ltd Optical module and cap for optical module
JP2020102578A (en) * 2018-12-25 2020-07-02 三菱電機株式会社 Optical transmitter module

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3267859B2 (en) * 1996-04-15 2002-03-25 株式会社三協精機製作所 Semiconductor laser module and optical pickup
JPH10173207A (en) * 1996-10-11 1998-06-26 Sharp Corp Optical transmission-reception module
JP2001215368A (en) * 2000-02-04 2001-08-10 Japan Aviation Electronics Industry Ltd Optical transceiving module
JP2003233923A (en) * 2002-02-08 2003-08-22 Sony Corp Optical pickup and disk drive unit
JP2004031512A (en) * 2002-06-24 2004-01-29 Matsushita Electric Ind Co Ltd Wavelength-selective light receiving apparatus and optical transmitting-receiving module
JP4445220B2 (en) * 2003-07-22 2010-04-07 パナソニック株式会社 Semiconductor laser device and pickup device
JP2006310704A (en) * 2005-05-02 2006-11-09 Sumitomo Electric Ind Ltd Optical transmission and reception module

Also Published As

Publication number Publication date
WO2011125460A1 (en) 2011-10-13
JP2011221249A (en) 2011-11-04

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