TW201144503A - Conducting yarn, yarn circuit and fabric circuit board - Google Patents

Abstract

A conducting yarn, a yarn circuit and a fabric circuit board are provided. The conducting yarn comprises a first metallic yarn, a second metallic yarn, at least one first nonmetallic yarn and at least one second nonmetallic yarn. The at least one first nonmetallic yarn is disposed parallel between the first metallic yarn and the second metallic yarn for electrical isolation. The at least one second nonmetallic yarn weave the first metallic yarn, the second metallic yarn and the at least one first nonmetallic yarn for fastening. The yarn circuit comprises the aforesaid conducting yarn and at least one surface mount device component surface mounted on the conducting yarn for electrical connection. The fabric circuit board comprises a plurality of aforesaid conducting yarns and a plurality of nonmetallic yarns. Some nonmetallic yarns disposed parallel between the conducting yarns for electrical isolation, and other nonmetallic yarns weave aforementioned yarns for fastening.

Description

201144503 VI. Description of the Invention: [Technical Field of the Invention] The present invention relates to a conductive woven wire, a woven wire circuit, and a textile circuit board. In particular, the present invention relates to a conductive woven wire, a woven wire circuit, and a woven circuit board that can be electrically connected to a surface mount device component. [Prior Art] With the development of the technology era, the traditional textile industry is facing strong transformation and competition pressure. Therefore, it is necessary to continuously innovate and combine advanced technologies to develop high-value new products and expand product application. In recent years, with the booming of the electronics industry, electronic components have been gradually applied to textiles, the most common of which is the incorporation of light-emitting diode components into textiles, so that conventional textiles can provide a luminous function. A method for bonding a light-emitting diode element to a textile is to provide a conductive contact on the covered wire, and connect the electrode of the light-emitting diode element to the conductive contact to make the electrode of the light-emitting diode element The conductive wire is electrically connected to the wire, and the covered wire electrically connected to the light emitting diode element is attached to the textile by sewing. The coated wire is a conductive wire with a coating layer, and the conductive contact is a joint for removing the coating layer in the covered wire. In the above method, in order to electrically connect the light-emitting diode element to the covered wire, the coating layer at the conductive contact must be removed, which in turn tends to increase the processing complexity. In addition, since the covered wire comprises a conductive wire and a cladding layer, it will have a larger radius and a larger volume than a conventional wire. Therefore, if the covered wire is fixed to the textile, the weight and volume of the textile will be increased. On the other hand, considering the processability of electronic components combined with textiles, the prior art 201144503 packaged light-emitting diodes will affect the overall aesthetics, and the electronic components used for bonding to textiles are mostly limited to components, if other The electronic component is connected to the textile, so the application elasticity of the combination of the textile and the electronic component is comprehensively described, and a conductive woven wire is processed in a volume and applied to: ::: adhesive: device component and easy to use 'is The related technology industry needs to achieve the goal. SUMMARY OF THE INVENTION One object of the present invention is to provide an eight-line. The electrically conductive woven wire comprises a first metal yarn, a second metal yarn, and a non-metallic yarn. At least the first-partial-- and at least one of the second-to-ii, y-series are in parallel with the first-metal yarn and the second metal yarn, and are electrically insulated from the first metal yarn and the second and second metal yarns. At least - the first genus; = wrong to make the first - _ second metal yarn and at least - the first - non-all genus inexhaustible and the first - metal yarn, the first non-Meng, / / woven to fix the first metal yarn, the first a second metal yarn and at least one first non-metallic yarn. Another object of the present invention is to provide a wire drawing circuit. The woven circuit comprises a conductive woven wire and at least one surface mount component, at least the surface of the surface mount component is adhered to the conductive woven wire for electrical connection with the conductive woven wire. Wherein, the conductive woven wire=containing: a first metal yarn, a second metal yarn, at least a first-non-metallic yarn, and a _>-a non-metallic yarn. At least one of the first non-metallic yarns is parallel to the first metal yarn and the third metal yarn, and is disposed between the first metal yarn and the second metal yarn to electrically insulate the metal yarn and the second metal yarn. At least - the second non-metallic yarn is interlaced with the first C. 1 metal yarn, the second metal yarn and the at least - the first non-metallic yarn to fix the first metal yarn, the third metal yarn and at least the first non-metal yarn 5

I 201144503 A further object of the invention is to provide a textile substrate for a plurality of conductive threads. The _ woven circuit board contains yarn. Each conductive woven bag: a first second non-metallic yarn and at least a third non-metallic non-metallic yarn. At least—when:—a metal yarn, a second metal yarn, and at least—parallel, and disposed on the _ 非 non-metallic yarn and the first metal yarn and the second metal yarn 孟 纱 and the second 吟The pq $&amp;. yarn and the second metal yarn are electrically insulated with a 'missing to make the first metal parallel, and 4 2 non-gold I (four) with the conductive threads and 4 荨 2 non-metallic yarns at least A In one of the questions, one of the v-shaped members is disposed between the conductive wires to electrically insulate the conductive wires. The conductive filaments and the material mm are not interwoven with the non-Muscular yarn, and the yarn is interlaced to fix the conductive threads and the i, y疋, so that the surface of the device component is adhered to the textile circuit. Each layer of the board is conductive and weaving! · m a , , and 漳 are electrically connected to each of the V electric wires, and the electronic components are laid out on the textile circuit board. As described above, the present invention provides an electrically conductive woven wire, a woven wire circuit, and a textile circuit board. Through surface adhesion technology, other micro-small electronic components, such as surface-adhesive components (such as surface-adhesive resistors, surface-adhesive capacitors, and surface-adhesive inductors) can be combined with conductive threads to form a braided circuit or further And the textile circuit board, thereby effectively overcoming the shortcomings of the prior art, thereby increasing the added value of the textile. Other objects of the present invention, as well as the technical means and embodiments of the present invention, will be apparent to those of ordinary skill in the art. The present invention will be explained by way of example only. However, the description of the embodiment 201144503 is only for the purpose of illustrating the invention and is not intended to limit the invention. It should be noted that in the following embodiments and the drawings, elements that are not directly related to the present invention have been omitted and are not shown; and the dimensions and relative positional relationship of the elements in the drawings are only used to illustrate that 'not used Limit the actual scale and size. A first embodiment of the present invention is shown in the drawings, which depicts a schematic diagram of a conductive woven j. The conductive woven wire 1 comprises a first metal yarn 111, a second metal yarn 112, a first non-metallic yarn 121, a second non-metal yam 22, a first joint 131 and a second joint 132. The first non-metallic yarn 121 is parallel to the first metal yarn 111 and the second metal yarn yam 2, and the second non-metal yarn 121 is disposed between the first metal yarn 111 and the second metal yarn 丨2, thereby making the first The metal yarn 1丨丨 and the second metal yarn 112 are electrically insulated. The first non-metallic yarn 122 is interlaced with the first metal yarn in, the second metal yarn 112 and the first non-metal yarn 121 for fixing the first metal yarn m, the second metal yarn 112 and the second non-metal yarn 12 The interlacing manner of the second non-metallic yarn 122 and the first metal yarn lu, the second metal yarn 112, and the first non-metallic yarn 121 is a plain weave. = that is, the first metal yarn 11 and the second metal yarn II2 and the first non-metal yarn 121 are the weft yarns of the non-metal yarn 12 2 , and the flat weave interlace is interwoven by the warp and the weft yarn. to make. In other embodiments, the second non-metallic yarn 122 is the same as the first. The interlacing manner of the metal yarn 11 and the second metal yarn 112 and the first non-metal yarn 121 may also be one of a twill weave, a satin weave, and a knit interlace, or the other may be used to fix the first metal yarn 1U and the second metal. The weaving method of the yarn U2 and the first non-metallic yarn U1 is such that the above weave is for illustrative purposes only and does not limit the scope of the invention. The first joint is electrically connected to the end of the first metal yarn U1, and the second joint 7 201144503 132 is connected to the end of the second metal yarn 112. The first connector 131 and the second connector 132 are electrically connected to a primary electrode. For example, the first connector d is connected to the anode of the power source, and the first connector 132 is electrically connected to the cathode; or the first connector 131 is electrically connected to the anode of the power source. The materials of the first metal yarn (1) and the second metal yarn 112 are all conductive, Π: steel, silver, an alloy of the foregoing metals or other metals. In the present embodiment, the first metal, the yarn (1) and the second metal yarn 112 are a bare metal wire, in other words, the first metal banknote 111 and the second metal yarn 112, 191 β ^, and a plurality of layers. A non-metallic yarn is a non-conductive insulating material, such as para-aramid, para-aramid, polyester, cotton or other non-metallic materials. In this embodiment, the conductive woven wire 1 only includes a second non-metallic yarn 122. In the embodiment, the conductive woven wire may also include a plurality of second non-metallic yarns to achieve different textile requirements. Therefore, the above embodiments are not intended to limit the scope of the invention. The m of the present invention is shown in the second circle, for example, the type of the conductive woven wire 2 is the same as the embodiment, and the conductive woven wire 2 includes the first non-metallic yarn 222 of the first metal woven metal yarn. - the first joint (3) in addition to the second joint 232, including three first-non-metallic yarn cut a, 2 Sichuan _, ★ and ° brother's 疋 'the number of the first non-metallic yarn in this embodiment is only used For example, it will be appreciated by those skilled in the art that other embodiments can be implemented. 々 隹 金属 金属 金属 金属 金属 金属 金属 金属 金属 金属 金属 金属 金属 金属 金属 金属 金属 金属 金属 金属 金属 金属 金属 金属 金属 金属 金属 金属 金属 金属 金属 金属 金属 金属 金属 金属 金属 金属 金属 金属 金属 金属 金属 金属 金属 金属 金属 金属 金属 金属 金属 金属 金属 金属 金属 金属 金属 金属 金属 金属 金属 金属 金属 金属 金属 金属 金属 金属 金属 金属 金属 金属 金属 金属 金属 金属 金属 金属 金属 金属 金属 金属 金属 金属 金属 金属 金属 金属 金属 金属 金属 金属The yarn 211 and the second metal yarn 2! 2 are electrically insulated. The remaining technical features of the conductive woven wire 2 of 201144503 are the same as those of the conductive woven wire described in the first embodiment, and thus will not be further described herein. In other words, the present invention can adjust the width of the conductive woven wire by changing the number of the first non-metallic yarns between the first metal and the -i genus according to the demand. The first F of this month is shown in Fig. 3, which depicts a schematic diagram of a braided circuit 3. Compared with the first embodiment, the woven wire circuit 3 comprises - a - metal, a v 311 first metal yarn 312, a first non-metallic yarn 321 , a second non-metallic yarn milk, a first joint 331 and In addition to the second joint 332, a surface mount device (SMD) element 341 is further included. The SMD element 341 includes a first conductor 341 & and a second conductor 鸠, the first body 341a is electrically connected to the first metal yarn 311, and the second conductor (4)b is electrically connected to the second (four) (four) 2 . In detail, the surface of the NaH element 34H is adhered to the first metal yarn 311 and the second metal yarn 312 by a surface mount technology (Surface Mount Techn〇1〇gy; SMT). Please also refer to Fig. 4A, which is a cross-sectional view of the weaving line circuit 3 depicted by the A_A section line in Fig. 3. The first conductor is electrically connected to the first metal yarn 3U through the first solder 351, and the second conductor 341b is electrically connected to the second metal yarn 312 through a second solder 352. The first joint 331 is electrically connected to the end of the first metal yarn 311, and the second joint 332 is electrically connected to the end of the second gold yarn 312. The first connector and the second connector 332 are respectively electrically connected to the two electrodes of a power source. For example, the first connector 33! is electrically connected to the anode of a power source, the second connector is electrically connected to the cathode of the power source; or the first connector 331 is electrically connected to the cathode of the power source, and the second terminal is 201144503 The head 332 is electrically connected to the anode of a power source. Thereby, the power of the SMD element 34ι can be supplied via the first metal yarn 3U, the first metal yarn 312, the first joint 331 and the second joint 332. It is to be noted that the other elements except the SMD element 341 in the woven wire circuit 3 have the same technical features as the corresponding elements of the conductive woven wire i described in the first embodiment, and thus will not be described herein. Another aspect 'Fig. 4A further depicts a cross section of the SMD element M1. As shown, element 341 includes an electronic component unit 411a, a first lead 421, a second lead 422, a first conductor 3, a second conductor, and a package (5). Wherein the 'electronic component unit 411a has a first electrode and a second electrode (not shown, . . . ), the first electrode of the electronic 7L device unit 411a is electrically connected through the first wire-like conductor: the conductor. The second electrode of the electronic component unit 411a is electrically connected to the package portion 45 through the first wire 4U and the second conductor 34b to block the life component unit 411a, the first wire 421, the second wire 422, and the first conductor. 2 and the second conductor 341b, and the material of the sealing portion 451 may be one of a light transmissive material or an opaque material, and does not limit the scope of the invention. It should be specially stated that the electrode of the electronic component unit in the component can also be set in the T-mode. Therefore, the electronic component unit can be electrically connected to the first conductor and the conductor through other connection methods. The arrangement of the upper first electrode and the second electrode (fourth) does not limit the scope of the invention. For example, the surname </ br> diagram depicts a cross-sectional view of another embodiment of the SMD component. The L-like SMDtc member 431 &amp; includes an electronic component unit 4ub, a Chuche secret second conductor 423, a first conductor 431a, and a second conductor 431b. ^ having a first electrode and a second electrode (the first electrode and the second electrode of the electronic component unit 411b 201144503 are respectively disposed on the lower surface of the electronic component unit 411b and Since the electronic component unit 411b is directly disposed on the first conductor 431a, the first electrode of the lower surface is directly electrically connected to the first conductor 431a, and the second electrode is transmitted through a third conductor 423 and the second The conductors 431b are electrically connected to each other. The electronic component units 411a and 411b are all a diode component, that is, the electronic component units 411a and 411b comprise only two electrodes. In other embodiments, the electronic component unit may also be It is a triode element, that is, it contains three electrodes, such as a Light Emitting Diode (LED) component. Please refer to Figure 4C, which is another implementation of a triode type SMD component. The SMD component 441 includes an electronic component unit 411c, a fourth conductor 424, a fifth conductor 425, a first conductor 441a, and a second conductor 441b. The element unit 411c has a first electrode, a second electrode, and a third electrode (not shown). The first electrode and the second electrode of the electronic component unit 411c are respectively disposed on the upper surface of the electronic component unit 411c. The three-electrode system is disposed on the surface opposite to the upper surface. Since the electronic component unit 411c is also disposed on the first conductive body 441a, the third electrode of the lower surface is directly electrically connected to the first conductor 441a, and the electronic component The first electrode of the unit 411c is electrically connected to the third electrode of the electronic component unit 411c and the first conductor 441a through a fourth wire 424. The second electrode of the electronic component unit 411c is transmitted through a fifth wire 425 and a second conductor. 441b is electrically connected.

In this embodiment, the SMD component 341 is an LED component, including one of a top-view LED and a side-view LED. In other embodiments, the SMD component 341 is also It can be a surface-adhesive resistor, Table S 201144503 surface-adhesive capacitor, and surface-adhesive inductor, which are used as components. Therefore, the scope of the present invention is not limited by the above contents. , circuit, reading system is - unencapsulated electronic components, for replacement, bare crystal components do not seal the dream, seal 4 邛. Referring to Figure 5, a schematic diagram of the cross-section of the bare-line component 54U, the eight-line I曰4 circuit 5, the octave m, and the small connection in the 1-wire circuit 5a. The woven thread package 3 is a first metal yam... a second metal yarn 512a, a first non-human yarn 521, a first conductor 53b, a non-Meng, a ridge-line 532, and a bare element 541a. The bare crystal element has a first Thunder_Electricity and a second electrode (not shown), and the naked day component (4) is disposed on the first metal yarn, the first non-metal yarn 521, and the first On the metal yarn 512a, the first electrode of the bare metal element 541a is electrically connected through the first wire 531, and the second electrode of the bare element 5 is transmitted through the wire 532. The second metal yarn 512a is electrically connected; thereby, the bare element cell can be electrically connected to the wire circuit 5a. It should be specially stated that the electrodes of the bare-crystal components can also be arranged in other ways. Therefore, the bare-shaped a 7L piece can also be electrically connected to the first-metal yarn and the second metal yarn through other connection methods. The arrangement of the first electrode and the second electrode does not limit the scope of the invention. For example, please refer to FIG. 5B_, which is a schematic cross-sectional view showing the connection of the bare element side to the metal yarn in the weaving line circuit 5b. The wire circuit 5b includes a first metal yarn 5Ub, a second metal yarn M2b, a first wire 533, and a bare element 541b. The die element 54 includes a first electrode and a second electrode (not shown), and the first electrode and the second electrode of the die element 541b are respectively disposed on the lower surface and the upper surface of the die element 541b. . The semiconductor element 541b is directly disposed on the first metal yarn 5Ub (that is, the portion of the conductive woven wire) by 12 201144503, so the first electrode of the lower surface thereof is directly electrically connected to the first metal yarn. The first electrode is electrically connected to the second metal yarn (four) through the third wire 533.

Further, the aforementioned bare crystal elements 541a and 鸠 are both - the diode element, that is, the bare element 541a, and only two electrodes are included in the pass. In other embodiments, the germanium element can also be a triode element, that is, include three electrodes. Please refer to the πth figure, which is a _ line circuit, and the bare-crystal element is not intended to be connected to the metal yarn. The wire circuit 5c includes a first metal yarn 5uc, a second metal yarn, a fourth wire 534, a fifth wire milk, and a bare element 541c. The bare crystal read 5 仏 includes a first electrode, a second electrode, and a third electrode (not shown), wherein the bare crystal elements 54 ic are respectively disposed on the upper surface of the surface of the bare crystal element 541 e, The third electrode is disposed on the surface of the upper surface. Because of the bare-crystalline component, he is placed on the first metal yarn 5UC, and the third electrode of the lower surface is directly connected to the first metal yarn 5, the carrier, the fourth conductor 534, and the bare crystal component. - the metal yarn 511C is electrically connected, and the first electrode of the bare crystal element 541c is transmitted through a fifth remote ampere &amp; 'spring 535, the second metal yarn 51 and electrically connected. 卜, other in this embodiment In the embodiment, the braided circuit 3 is further covered, please refer to FIG. 6A, which is a schematic diagram, and the following is included: ^: 敎_路3 includes - the woven portion of the cladding portion After that, the section line drawing edge covering portion 6〇1 is in the middle of the hair. The braided circuit 3 further includes a

', G钹杉〇 Η is used to coat the first metal yarn 3! 1, the second gold P 13

I 201144503 is a yarn 3i2, a first non-metallic yarn 321 and an SMD element 34, and the material of the covering portion _ can be a light-transmitting material or a non-permeable (four) towel, which is limited in scope. In this embodiment, the woven wire circuit 3 only includes a second non-metallic yarn work. In other embodiments, the woven wire circuit may further comprise a plurality of second non-metallic yarns, thereby achieving different textile requirements. Therefore, the above embodiments are not intended to limit the scope of the invention. The fourth embodiment of the present invention is shown in Fig. 7, which is a schematic view of a wire drawing circuit 7. In contrast to the third embodiment, the wire circuit 7 comprises a first metal yarn 71, a second metal yarn 712', a second non-metal yarn 722, a first joint-second joint 732, and an SMD element. In addition to 741, three first non-metallic yarns 721a, 72lb, and 721c are included. It should be noted that the number of the first non-metal yarns in this embodiment is for illustrative purposes only, and those skilled in the art can deduce other embodiments. ^

The first non-metallic yarns 721a, 721b, and 721c are respectively parallel to the first metal yarn 7 ι second metal yarn 712, and are disposed between the first metal yarn 711 and the second metal 712, thereby making the first metal yarn 711 and the first Two metal yarn? The other technical features and the changeable implementations of the 12-wire 1 circuit are the same as those of the wire circuit 3 of the third embodiment, and thus will not be described herein. In other words, this; = the first non-metallic yarn between the first metal yarn and the second metal yarn is adjusted to adjust the width of the yarn circuit. A fifth embodiment of the present invention is shown in Fig. 8, which is a schematic view of a green textile circuit board. The textile circuit board 8 includes a plurality of conductive threads 8〇1, a plurality of first non-metallic yarns 822, a third non-metallic yarn 823, and a plurality of SMD elements gw. Each of the 14 201144503 conductive woven wires 8G1 includes a -th metal yarn 811, a second metal yarn 8i2, a non-monitor yarn 821, a first joint 831, and a second joint 832. In the present embodiment, the characteristics and the connection relationship of the respective elements in the respective conductive woven wires 8G1 are the same as those of the components in the conductive woven wire 1 described in the first embodiment, and the characteristics of the respective elements 841 and The connection of the respective conductive woven wires 8 is the same as that of the smd elements 341 in the woven wire circuit 3 described in the third example, and therefore is not separately described herein. A plurality of second non-metallic yarns 822 are parallel to the plurality of conductive threads 801, and each of the first non-metallic yarns 822 is disposed between the conductive threads (10) 1 to electrically insulate the conductive threads. As shown in FIG. 8, the third non-metallic yarn 812 is interlaced with a plurality of conductive threads 8〇1 and a plurality of first-non-metal yarns 822 to fix a plurality of conductive threads 801 and a plurality of second non-metal yarns 822. . In this embodiment, the third non-metallic yarn 812 and the plurality of conductive woven threads 8 (H and the plurality of second non-metallic yarns are interlaced by a plain weave. In the embodiment, the oblique weave interlacing may also be used. The satin weave and the knit interlace, or other interlacing manners for fixing a plurality of conductive threads and a plurality of second non-metals 822, so the above weave is for illustrative purposes only, and the invention is not limited thereto. In other embodiments of the present embodiment, the textile circuit board 8 described in the fifth embodiment may have a plurality of covering portions as described in the third embodiment, and each covering portion (Fig. The SMD element for covering each of the conductive woven wires and the corresponding conductive woven wires: 'and the material of each of the covering portions is a light transmissive material. In another embodiment of the present embodiment, ' The visitor woven circuit board 8 described in the fifth embodiment may further comprise a covering portion 15 201144503 «Multiple conductive woven wires, genus, ... three non-metallic yarns and a plurality of SMD components: - non-gold external Miscellaneous with cladding, up to _ the insulation or the result = circuit board 8 (4) may be a pure material or an opaque material 之 + = demand 'is to limit the scope of the present invention. Not with the fifth embodiment t, each conductive woven wire only contains - only one for each conductive one The second non-metallic yarn 822,=2 contains only one third non-metal., 'Xie can also include a plurality of μ t, each conductive woven wire grabs a plurality of first-non-metallic yarns 82 and each conductive woven wire (10): ::=2, metal yarn 822, textile circuit board 8 may also include a plurality of third to send 23'# to achieve different textile requirements'. Therefore, the above embodiments are not intended to limit the scope of the present invention. The invention provides a conductive woven wire, a woven wire circuit and a textile circuit board. The surface adhesive device can be bonded to the conductive woven wire, the woven wire circuit and the textile circuit board through the surface adhesion technology. The electronic component combined with the textile material may not necessarily be limited to the light-emitting diode component; on the other hand, the invention further applies the surface adhesive technology to the surface adhesive device component to the textile, which has the advantages of being easy to use and small in size. this The disadvantages of the prior art can be effectively overcome, thereby increasing the added value of the textile. The foregoing detailed examples are only used to exemplify the embodiments of the present invention, and the technical features of the present invention are not intended to limit the protection of the present invention. Any changes or equalities that can be easily accomplished by those skilled in the art are within the scope of the invention. The scope of protection of the rights of the invention shall be subject to the scope of the patent application. 201144503 [Simple description of the diagram] 2 is a schematic view of a conductive woven wire according to a second embodiment of the present invention; FIG. 3 is a schematic view of a woven wire circuit according to a third embodiment of the present invention; 4A is a schematic cross-sectional view of an SMD device according to a third embodiment of the present invention; FIG. 4B is a cross-sectional view showing another embodiment of the SMD device according to the third embodiment of the present invention; FIG. 5A is a schematic cross-sectional view showing another embodiment of the SMD device according to another embodiment of the present invention; FIG. 5A is a cross-sectional view showing a connection between a bare crystal element and a conductive woven wire according to another embodiment of the present invention; FIG. 5C is a schematic cross-sectional view showing a connection between a bare crystal element and a conductive woven wire according to another embodiment of the present invention; FIG. 5C is a schematic cross-sectional view showing a connection between a bare crystal element and a conductive woven wire according to another embodiment of the present invention; FIG. 6B is a schematic cross-sectional view showing a braided circuit including a covering portion according to a third embodiment of the present invention; FIG. 7 is a schematic view showing a braided wire circuit including a covering portion according to a third embodiment of the present invention; A schematic diagram of a woven wire circuit according to a fourth embodiment of the present invention; and 201144503 is a schematic view of a textile circuit board according to a fifth embodiment of the present invention. [Description of main component symbols] 1 : Conductive woven wire m: first metal yarn 112: second metal yarn 121: first non-metal yarn 122: second-non-metal yarn 131: first joint 132: second. joint 2 : conductive yarn 211 : first metal yarn 212 : second metal yarn 221 a - non-metal yarn 221b : first non-metal yarn 221c : first - non-metal yarn 222 : second non-metal yarn 231 : first joint 232 : Second joint 3: woven wire circuit 311: first metal yarn 312: second metal yarn 321: first non-metal yarn 322: second non-metal yarn 331: first joint 332: second joint 341: SMD element 341a: First - - conductor 341b : second conductor 351 : first solder 351 : second solder 411a : electronic component unit 411b : electronic component unit 411c : electronic component unit 421 : first wire 422 : second wire 423 : third wire 424 : Fourth wire 425 : Fifth wire 431 : SMD 1 element 431a : First conductor 431 b ' % Two conductor 441 : SMD element 441a : - - Conductor 441b : Second conductor

18 201144503

451: encapsulation portion 5b: woven wire circuit 511a: first metal yarn 511c: first metal yarn 512b: second metal yarn 521: first non-metal yarn 532: second wire yarn 532: fourth wire yarn 5 41 a. Bare member 541c: bare element 7: wire circuit 712: second metal yarn 721b: first-non-metal yarn 731: first joint yarn 741: SMD element 801: wire circuit 812: second metal yarn 822: Second non-metallic yarn 831 : first joint 841 : SMD element 5a : woven wire circuit 5c : woven wire circuit 511b : first metal yarn 512a : second metal yarn 512c : second metal yarn 531 : first wire 533 : Three-wire yarn 535: fifth wire yarn 541b: bare metal element 601: cladding portion 711: first metal yarn 721a: first non-metal yarn 731c: first non-metal yarn 732: second joint 8: textile circuit board 811 : first metal yarn 821 : first non-metal yarn 823 : third non-metal yarn 832 : second joint 19

Claims (1)

201144503 VII. Patent application scope: 1. A conductive woven wire 'includes: - a first metal yarn; - a second metal yarn; a brother" yarn is parallel to the first metal yarn and yarn, and is disposed at the first ^ between the soil, v and the two metal yarns, electrically insulating the first metal yarn and the second metal yarn; and ^ and the second metal yarn, and the first metal yarn, the second metal Yarn..., the first non-metallic yarn interlaced 'to solid two metal yarn and the at least-first non-metallic yarn. and 2. 2. The conductive 所述8, (9) electric wire according to claim 1 The at least one first non-metallic gauze 3 has a plurality of first non-metallic yarns and a second non-metallic yarn. The non-metallic yarns comprise a plurality of electrically conductive threads as claimed in claim 1 wherein the at least __ second non-metallic The yarn is a metal yarn, the second metal yarn, and the at least one first non-woven interlace (et 4. The conductive ecstasy according to claim 1, i is made up of an electric cymbal, The yarn and the second metal yarn are respectively connected to the two electrodes of a power source. 5. As stated in the claim! a conductive woven wire, wherein the first metal yarn and the second metal yarn are a bare metal wire. 6. A woven wire circuit comprising: 'the conductive woven wire as claimed in claim 】; and at least one surface adhesive device (Surface Mount Device; SMD) The surface of the element is adhered to the conductive wire of the έ海 to be electrically connected to the conductive woven wire. 20 201144503 7. The wire circuit of claim 6, wherein the at least the first- The metal yarn comprises a plurality of first-non-metallic yarns, and the at least-second non-metallic yarn comprises a plurality of second non-metallic yarns. 8. The braided circuit of claim 6, wherein t is at least - second non- The metal yarn is interwoven with the brother-metal yarn, the second metal yarn, and the at least-first-non-metal yarn. 9. The woven wire circuit of claim 6, wherein the first metal yarn and the second metal yarn are respectively connected to two electrodes of a power source. The wire circuit of claim 6, wherein the at least one smd element is transmitted through a surface adhesion technique (Surface Mo_Techn〇1〇gy; Xie) surface is adhered to the conductive woven wire. The woven wire circuit of claim 6, wherein the first metal yarn and the second metal yarn are a bare metal wire. 12. The braided circuit of claim 6, wherein the at least smd component is a Llght Emitting Diode (EDC) component. 3. The braided circuit of claim 6, wherein the at least one component is a bare component. 14. The wire circuit of claim 6, wherein the at least-SMD component comprises a 7L piece and a package portion, the package is formed to encapsulate the electronic component π, and the package The material of the part is a light transmissive material. The woven wire circuit of claim 6, wherein the woven wire circuit further comprises a covering Ρ for covering the conductive woven wire and the at least — SMD _ u 丨卞 and the covering 4 is a Light transmissive material. Γ C 1 t- i ~ kinds of textile circuit boards, comprising: 21 16. 201144503 a plurality of electrically conductive woven wires, each of the electrically conductive woven wires comprising: - a first metal yarn; - a second metal yarn; and at least - a first non-metal a yarn, which is parallel to the first metal yarn and the second yarn, and disposed between the first metal yarn and the second metal yarn, so that the first metal yarn and the second metal yarn are electrically Slightly insulating; obtaining a plurality of second non-metallic yarns in parallel with the conductive threads, and at least one of the non-metallic yarns is disposed between the conductive threads of the materials, thereby making the conductive wires of the crucible Sexual insulation; At least a third non-metallic yarn interlaced with the electrically conductive threads and the second non-metallic yarns to enclose the electrically conductive threads and the second non-metallic yarns. π. The textile circuit board of claim 16, wherein the at least first first non-metallic yarn comprises a plurality of non-metallic yarns, and the at least "third non-metallic yarn" comprises a plurality of second non-metallic yarns. 18. For example. The textile circuit board of claim 16 is characterized in that the metal yarns are connected to a plurality of electrodes. The textile circuit board of claim 16, wherein the metal yarn is a bare metal wire. 20. The textile circuit board of claim 16 further comprising at least a lion component, wherein the at least-SMD component is surface-attached to each of the electrically conductive wires for electrically connecting to each of the electrically conductive wires. 21. The textile circuit board of claim 2, wherein the at least-SMD component is adhered to the electrically conductive wires through a -SMT surface. 22. The textile circuit board of claim 2, wherein the at least smd component system 22 201144503 is an LED component. 23. The textile circuit board of claim 20, wherein the at least one SMD component is a bare component. The textile circuit board of claim 20, wherein the at least one SMD component further comprises an electronic component unit and a package portion, the package portion is for packaging the electronic component unit, and the material of the package portion is A light transmissive material. 25. The textile circuit board of claim 20, wherein the textile circuit board further comprises a plurality of cladding portions for covering each of the conductive threads and the at least one SMD component, and the material of the cladding portion is It is a light transmissive material. The textile circuit board of claim 20, wherein the textile circuit board further comprises a covering portion for covering the conductive woven wires, the second non-metallic yarns, and the at least one third non-metal The yarn and the at least one SMD component, and the material of the cladding portion is a light transmissive material. twenty three