TW201141807A - Surface treatment method for glass substrate and device thereof - Google Patents
Surface treatment method for glass substrate and device thereof Download PDFInfo
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201141807 六、發明說明: 【發明所屬之技術領域】 本發明係有關一種玻璃基板之表面處理方法及其裝置, 主要是於該玻璃基板表面進行離子源前處理’不僅可達到表 面清潔之作用,更可降低後續玻璃基板導電膜之表面電阻, 以增加其導電性。 【先前技術】 • 近來,平面顯示器被廣泛應用在如液晶電視、電腦、行 動電話及個人數位助理(Personal Digital Assistant, PDA) 上。其中,玻璃基板是平面顯示器面板的製造過程中一項重 要關鍵材料之一。然而,現行基板製造過程中所應用的基板 清潔系統有尚待改進的問題。 傳統玻璃基板之清潔方式須耗費大量化學清潔溶劑,以 及後續需使用大量清水沖洗及烘乾,此清潔程序不僅會產生 揮發性有機氣體造成空污問題,且浪費水資源及耗時。以台 • 灣而言,環保署最近擬修改法規,開徵V0C空污費,對此將 在國内造成清潔製程更改壓力。另國際趨勢亦朝綠色製程之 綠色產品方向前進,相關法規亦在擬定或實施中,故習有濕 式清潔方式已無法符合需求。 【發明内容】 本發明係之主要目的即在提供一種應用於電子裝置之玻 璃基板表面處理方法及其裝置,主要是於該玻璃基板表面進 行離子源前處理,不僅可達到表面清潔之作用,更可降低後 201141807 續玻璃基板導電膜之表面電阻,以增加其導電性。 為達上揭目的*本發明中玻璃基板之表面處理方法*係 先將玻璃基板放置於一真空處理室中,再通入氣體於該真空 處理室内,並提供電源以產生離子源,以利用該離子源於該 玻璃基板表面進行表面處理,不僅可達到表面清潔之作用, 更可降低後績玻璃基板導電膜之表面電阻,以增加其導電 性’且可增加表面鍍膜之結晶性。 【實施方式】 本發明之特點,可參閱本案圖式及實施例之詳細說 明而獲得清楚地瞭解。 本發明「玻璃基板之表面處理方法及其裝置」,如第一 圖及第二圖所示,該玻璃基板之表面處理裝置至少包含有: 一玻璃置放台車21,用以置放玻璃基板2〇,並可將該玻 璃基板輸送至一真空處理室10中; 一真空處理室10,設有電子槍11 ; 一抽真空組件30 ,201141807 VI. Description of the Invention: [Technical Field] The present invention relates to a surface treatment method and device for a glass substrate, mainly for performing ion source pretreatment on the surface of the glass substrate, which not only achieves the effect of surface cleaning, but also The surface resistance of the subsequent glass substrate conductive film can be lowered to increase its conductivity. [Prior Art] • Recently, flat panel displays have been widely used in, for example, LCD TVs, computers, mobile phones, and Personal Digital Assistants (PDAs). Among them, the glass substrate is one of the important key materials in the manufacturing process of the flat panel display panel. However, the substrate cleaning system used in the current substrate manufacturing process has problems to be improved. The cleaning method of the traditional glass substrate requires a large amount of chemical cleaning solvent, and the subsequent use of a large amount of water to rinse and dry. This cleaning process not only causes air pollution caused by volatile organic gases, but also wastes water resources and time. In the case of Taiwan • Bay, the EPA recently proposed to amend the regulations and levy a V0C air pollution fee, which will cause pressure on the cleaning process in the country. In addition, the international trend is also moving towards the green products of green processes. Relevant regulations are also being formulated or implemented. Therefore, the wet cleaning methods have not been able to meet the demand. SUMMARY OF THE INVENTION The main object of the present invention is to provide a method and a device for treating a surface of a glass substrate applied to an electronic device, mainly for performing ion source pretreatment on the surface of the glass substrate, which not only achieves the effect of surface cleaning, but also The surface resistance of the conductive film of the glass substrate can be reduced after 201141807 to increase its conductivity. In order to achieve the above object, the surface treatment method of the glass substrate in the present invention is to first place the glass substrate in a vacuum processing chamber, then pass a gas into the vacuum processing chamber, and provide a power source to generate an ion source to utilize the The surface treatment of the ion source on the surface of the glass substrate not only achieves the surface cleaning effect, but also reduces the surface resistance of the conductive film of the glass substrate to increase the conductivity thereof and increase the crystallinity of the surface coating film. [Embodiment] The features of the present invention can be clearly understood by referring to the drawings and the detailed description of the embodiments. The surface treatment device for a glass substrate of the present invention, as shown in the first and second figures, includes at least one glass placement trolley 21 for placing the glass substrate 2 〇, and the glass substrate can be transported into a vacuum processing chamber 10; a vacuum processing chamber 10, provided with an electron gun 11; a vacuum assembly 30,
真工處理室抽氣至一真空度; 一氣體提供組件40,係J ’係與該真空處理室10連接,用以將 ’係與該真空處理室10連接,用以 提供氣體至該真空處理室1〇内; 一電源供應組件5〇 ,係奧該The vacuum processing chamber is evacuated to a vacuum; a gas supply assembly 40 is connected to the vacuum processing chamber 10 for connecting the vacuum system to the vacuum processing chamber 10 for supplying gas to the vacuum processing Room 1〇; a power supply component 5〇, is the Austrian
201141807 供組件40通入氣體之壓力、功率或時間,亦或者控制電源之 電壓大小等。 而利用上述之裝置可進行下列之處理方法,請同時參閱 第二圖所不,其至少包含有下列步驟: 步称A、該玻璃基板20藉由該玻璃置放台車21傳送至 該真空處理室1〇中; 步称B、藉由該氣體提供組件40通入氣體於該真空處理 室之電子搶u内,其中可通入氧氣(其氣體流量為 1〇~5〇SCCM) ’以及通入氬氣(其氣體流量為10〜50SCCM); 步驟c、利用該電源供應組件50提供電源以產生離子 源’其中該電源之電壓可控制介於500〜2000伏特(而以 800〜1200伏特為較佳)之間,而該真空處理室1〇内之工作壓 力可控制於1〜5mtc)i*:r ; 步驟1>、利用該離子源於該玻璃基板20表面進行表面處 理〇 本發明利用離子源内之低能量活性原子團對玻璃基板進 行表面處理,不僅可達到表面清潔之作用,更可降低後續玻 璃基板導電膜之表面電阻,以增加其導電性。 該表面處理裝置可進一步設有一鍍膜組件70,如第四圖 所示,該鍍膜組件70設於該真空處理室10之後,可使進行 步驟D後之玻璃基板進行鍍膜步驟,該鍍膜步驟係於該玻璃 基板至少一表面上鍍覆有導電薄膜,例如可以為銦錫氧化物 (Indium Tin Oxide,ITO)導電薄膜,其中本發明之玻璃基板 係預先經由離子源前處理,可增加後績表面鐘膜之結晶性, 而如表一所示係為離子源前處理對玻璃基板表面電阻之影 201141807 響,該實施例一係為無實施離子源前處理之玻璃基板,而實 施例二~四係為實施離子源前處理後之玻璃基板,其中橫座標 (v)係為真空處理室之腔室所提供電源之電壓大小,而縱座標 (ohm·/square)則為玻璃基板表面電阻值,由表一可清楚得 知,無實施離子源前處理之玻璃基板(亦即實施例一)其表面 電阻值較大(約為683 ohm·/square),而其他實施離子源前 處理後之玻璃基板(亦即實施例二~四)其表面電阻值較小,其 中更以實施例四之玻璃基板具有最小之表面電阻值(約為402 ohm. /square) °201141807 The pressure, power or time of the gas supplied to the component 40, or the voltage of the control power source. With the above device, the following processing methods can be performed. Please refer to the second figure at the same time, which includes at least the following steps: Step A, the glass substrate 20 is transferred to the vacuum processing chamber by the glass placing trolley 21. In the step S, the gas supply unit 40 is supplied with gas into the electron processing chamber of the vacuum processing chamber, wherein oxygen can be introduced (the gas flow rate is 1 〇 5 〇 SCCM) 'and access Argon gas (the gas flow rate is 10~50 SCCM); Step c, using the power supply component 50 to provide power to generate an ion source 'where the voltage of the power source can be controlled between 500 and 2000 volts (and 800 to 1200 volts) Between the two, and the working pressure in the vacuum processing chamber can be controlled to 1~5mtc)i*:r; Step 1>, using the ion source to surface treatment on the surface of the glass substrate 20, the present invention utilizes ions The surface treatment of the glass substrate by the low-energy active atomic group in the source not only achieves the surface cleaning effect, but also reduces the surface resistance of the subsequent glass substrate conductive film to increase its conductivity. The surface treatment device may further be provided with a coating assembly 70. As shown in the fourth figure, the coating assembly 70 is disposed after the vacuum processing chamber 10, and the glass substrate after the step D is subjected to a coating step, which is performed on the coating step. At least one surface of the glass substrate is plated with a conductive film, for example, an indium tin oxide (ITO) conductive film, wherein the glass substrate of the present invention is pre-treated by an ion source to increase the surface clock The crystallinity of the film, as shown in Table 1, is the effect of the ion source pretreatment on the surface resistance of the glass substrate 201141807. This embodiment is a glass substrate without ion source pretreatment, and the second to fourth embodiment For the implementation of the ion source pre-treatment of the glass substrate, wherein the abscissa (v) is the voltage of the power supply provided by the chamber of the vacuum processing chamber, and the ordinate (ohm·/square) is the surface resistance value of the glass substrate, As can be clearly seen in Table 1, the glass substrate (ie, Example 1) without the ion source pretreatment has a large surface resistance value (about 683 ohm·/square), and other implementations before the ion source. The treated glass substrate (i.e., Examples 2 to 4) has a small surface resistance value, and the glass substrate of the fourth embodiment has a minimum surface resistance value (about 402 ohm. / square).
300 200 實施例一 None 實施例二 800 實施例三 1000 實施例四 1200 ion source(V) 表一 再者,本發明之玻璃基板係預先經由離子源前處理,可 增加後續表面鍍膜之結晶性,進而降低該鍍膜之厚度,令具 有導電薄膜之玻璃基板更適合應用於光電裝置中,例如可應 用於觸控面板中,可藉由該薄型鍍膜而增加整體透光率。 而如表二所示係為離子源前處理對鍍膜後玻璃基板銦錫 氧化物厚度之影響(於相同面電阻條件下),該實施例一係為 201141807 無實施離子源前處理之玻璃基板,而實施例二〜四係為實施離 子源前處理後之玻璃基板,其中橫座標(v)係為真空處理室之300 200 Embodiment 1 None Embodiment 2 800 Embodiment 3 1000 Embodiment 4 1200 ion source (V) Table 1 again, the glass substrate of the present invention is pre-treated by an ion source to increase the crystallinity of the subsequent surface coating, and further The thickness of the coating is reduced, so that the glass substrate with the conductive film is more suitable for application in an optoelectronic device, for example, in a touch panel, and the overall transmittance can be increased by the thin coating. As shown in Table 2, the effect of the ion source pretreatment on the thickness of the indium tin oxide of the glass substrate after coating (under the same surface resistance condition) is that the first embodiment is the 201141807 glass substrate without the ion source pretreatment. In the second to fourth embodiments, the glass substrate after the ion source pretreatment is performed, wherein the abscissa (v) is a vacuum processing chamber.
腔至所提供電源之電壓大λ!、’而縱座獅丨為锻膜後銦錫氧化 =膜=(單位為Α),由表二可清楚得知,無實施離子源前處 ”氧化物(亦即實施例-)其膜厚較厚(約為義,而 其他實施離伟前處理後之銦锡氧化物(亦即實施例二 其膜厚較小,其中更以實施例四之銦料 厚(約為150Α)。 小之膜The voltage from the cavity to the supplied power supply is large λ!, 'and the vertical lion's girth is a forged film after indium tin oxidation = film = (unit is Α), as can be clearly seen from Table 2, there is no implementation of the ion source before the oxide (that is, the embodiment -) has a thick film thickness (about the same meaning, and other implementations of the indium tin oxide after the pretreatment) (that is, the film thickness of the second embodiment is smaller, and the indium material of the fourth embodiment is further Thick (about 150 Α). Small film
本發明之技術内容及技術特點已揭示如上, 項技術之人士仍可能基於本發明之揭 發明精神之替換及修飾。因此,本發明不背離本案 實施例所揭示者,而應包括各種不背、:日,圍應不限於 飾,並為以下之申請專利範圍所涵蓋。 之替換及修 【圖式簡單說明】 之結構立體圖。 第一圖係為本發明中表面處理裝置 201141807 第二圖係為本發明中表面處理裝置之結構示意圖。 第三圖係為本發明中表面處理方法之示意圖。 第四圖係為本發明中表面處理裝置之另一結構示意圖。 【主要元件代表符號說明】 真空處理室10 電子槍11 玻璃基板20 玻璃置放台車21 抽真空組件30 氣體提供組件40 電源供應組件50 控制組件60 鍍膜組件70The technical content and technical features of the present invention have been disclosed as above, and those skilled in the art may still make substitutions and modifications based on the spirit of the invention. Therefore, the present invention is not to be construed as being limited to the details disclosed in the embodiments of the present invention. Replacement and repair [Simplified description of the drawings] The structural perspective view. The first figure is the surface treatment apparatus of the present invention. 201141807 The second figure is a schematic structural view of the surface treatment apparatus of the present invention. The third figure is a schematic diagram of the surface treatment method in the present invention. The fourth figure is another schematic structural view of the surface treatment apparatus of the present invention. [Description of main components and symbols] Vacuum processing chamber 10 Electron gun 11 Glass substrate 20 Glass placing trolley 21 Vacuuming assembly 30 Gas supply assembly 40 Power supply assembly 50 Control assembly 60 Coating assembly 70
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