201138445 六、發明說明： 【發明所屬之技術領域】 本發明是有關於一種感測裝置，且特別是有關於一種影像 感測裝置。 【先前技術】 圖1是習知一種影像感測裝置的剖面示意圖，而圖2是包 3夕個圖1之影像感測裝置的晶圓的示意圖。請參照圖1與圖 2’從晶圓50切割下來的影像感測裝置1〇〇包括影像感測晶片 110、間隙物120、保護玻璃130及鏡頭模組14〇。影像感測晶 鲁片110的正面ill具有影像感測區112 ,且影像感測區112設 有呈陣列排列的多個感光單元114。每一感光單元〖Μ上設有 彩色濾光圖案116,而每一彩色濾光圖案116上設有微透鏡 118。此外，間隙物120設置於影像感測晶片11〇 的正面111 上，且圍繞影像感測區112。間隙物12〇用以支撐保護玻璃 130，而鏡頭模組140配置於保護玻璃130上。 習知技術中，晶圓50上的多個保護玻璃13〇是整片式的， 而晶圓50上的多個鏡頭模組140也是整片式的。換言之，這 • 些保護玻璃130是經過晶圓50的切割製程後才彼此分離，而 這些鏡頭模組140也是經過晶圓50的切割製程後才彼此分 離。所以，鏡頭模組140投影於影像感測晶片11〇的正面m 的正投影面積會等於正面111的面積。 習知技術的保護玻璃13 0可用以承載鏡頭模組丨4 〇並防止 微粒掉落至影像感測區112。然而，習知技術需使用間隙物HQ 來支撐保護玻璃130，但因間隙物120及保護玻璃130皆具有 厚度，所以會使影像感測裝置100的厚度變厚。而且，若間隙 物120及保護玻璃130的平整度不佳，則會影響光路徑，導致 影像感測品質降低。此外，保護玻璃130對光線的穿透率難以 201138445 達到100%，所以會降低光利用效率。 【發明内容】 月提供—種影像感測裝置，其具有厚度較薄的優點。 為達上述優點，本發明提出一種影像感測襄置，直包括影 像感測“ ' 絲额錢賴件。f彡像制W具有正面， 且此正面具有影像感測區。光學模組包括筒體及至少一透光 件。筒體直接配置於所述正面’並圍繞影減漸，而透201138445 VI. Description of the Invention: [Technical Field] The present invention relates to a sensing device, and more particularly to an image sensing device. [Prior Art] FIG. 1 is a schematic cross-sectional view of a conventional image sensing device, and FIG. 2 is a schematic view of a wafer of the image sensing device of FIG. The image sensing device 1 cut from the wafer 50 with reference to FIGS. 1 and 2' includes an image sensing wafer 110, a spacer 120, a cover glass 130, and a lens module 14A. The front side ill of the image sensing crystal chip 110 has an image sensing area 112, and the image sensing area 112 is provided with a plurality of photosensitive cells 114 arranged in an array. Each of the photosensitive cells is provided with a color filter pattern 116, and each of the color filter patterns 116 is provided with a microlens 118. In addition, the spacer 120 is disposed on the front surface 111 of the image sensing wafer 11A and surrounds the image sensing area 112. The spacer 12 is for supporting the cover glass 130, and the lens module 140 is disposed on the cover glass 130. In the prior art, the plurality of protective glasses 13 on the wafer 50 are monolithic, and the plurality of lens modules 140 on the wafer 50 are also one-piece. In other words, the protective glass 130 is separated from each other after the cutting process of the wafer 50, and the lens modules 140 are also separated from each other after the cutting process of the wafer 50. Therefore, the orthographic projection area of the front surface m of the lens module 140 projected on the image sensing wafer 11A is equal to the area of the front surface 111. The protective glass 130 of the prior art can be used to carry the lens module 丨4 〇 and prevent particles from falling to the image sensing area 112. However, the prior art requires the spacer HQ to support the cover glass 130. However, since the spacer 120 and the cover glass 130 have thicknesses, the thickness of the image sensing device 100 is thickened. Further, if the flatness of the spacer 120 and the cover glass 130 is not good, the light path is affected, resulting in deterioration of image sensing quality. In addition, the penetration rate of the protective glass 130 to light is difficult to reach 100% in 201138445, so the light utilization efficiency is lowered. SUMMARY OF THE INVENTION An image sensing device is provided in the month, which has the advantage of being thinner in thickness. In order to achieve the above advantages, the present invention provides an image sensing device, which directly includes image sensing "'s silk money. The image has a front side, and the front side has an image sensing area. The optical module includes a tube a body and at least one light transmissive member. The cylinder body is directly disposed on the front surface and is circulated around the shadow
配置於筒如’且與影減舰相對。賴件覆細述正面之 位於光學模組外的區域並圍繞筒體。 在本發明之一實施例中，上述之保護件為封裝膠體，且體 而吕，保護件的例如是環氧塑封料（epoxy mold compound)。此外，筒體具有頂面，而保護件例如更延_ 部分頂面。另外，保護件例如更延伸覆蓋影像感測晶 月的多個側面。 在本發明之—實施财吐狀賴件絲設於筒體的保 遵壞。此保護件的材質例如包括金屬、塑膠或陶竟。此外，筒 體具有頂面’而保護件例如更延伸覆蓋筒體的部分頂面。另 外’保護件例如是透過膠體而黏附於筒體及影像感測晶片。 在本發0月之—實施例巾，上述之筒體透過賴㈣附於所 述正面。 在本發明之-實施例中’上述之光學模組投影於所述正面 的正投影面積小於所述正面的面積且大於影像劇區的面積。 在本發明之一實施例中’上述之影像感測區設有呈陣列排 列的多個感光單元以及對應感光單元的多個彩色航圖案且 彩色滤光圖案分別配置於感光單元上。 在本發明之一實施例中，上述之影像感測區更設有對應彩 201138445 色濾光圖案的多個微透鏡，且微透鏡分別配置於彩色濾光圖案 上。 在本發明之一實施例中’上述之彩色濾光圖案包括多個紅 色濾光圖案、多個綠色濾光圖案與多個藍色濾光圖案。 在本發明之-實施例中’上述之影像感測晶片為前面照射 (front side illumination, FSI)的互補式金氧半（CM〇s)影像 感測晶片。It is placed in the barrel like 'and opposite to the shadow reduction ship. The parts are placed in the area outside the optical module and surround the barrel. In an embodiment of the invention, the protective member is an encapsulant, and the protective member is, for example, an epoxy mold compound. In addition, the barrel has a top surface and the protective member is for example extended to the top surface. In addition, the protective member extends, for example, to cover a plurality of sides of the image sensing crystal. In the present invention, the implementation of the smear-like filaments is provided in the cylinder. The material of the protection member includes, for example, metal, plastic or ceramic. In addition, the barrel has a top surface ' and the protective member extends, for example, to cover a portion of the top surface of the barrel. In addition, the protective member is adhered to the cylinder and the image sensing wafer through a colloid, for example. In the embodiment of the present invention, the above-mentioned cylinder is attached to the front surface via a slab (4). In the embodiment of the present invention, the orthographic projection area of the optical module projected on the front surface is smaller than the area of the front surface and larger than the area of the video screen area. In an embodiment of the invention, the image sensing region is provided with a plurality of photosensitive cells arranged in an array and a plurality of color navigation patterns corresponding to the photosensitive cells, and the color filter patterns are respectively disposed on the photosensitive cells. In an embodiment of the invention, the image sensing area is further provided with a plurality of microlenses corresponding to the color filter pattern of the 201138445 color, and the microlenses are respectively disposed on the color filter pattern. In an embodiment of the invention, the color filter pattern described above includes a plurality of red filter patterns, a plurality of green filter patterns, and a plurality of blue filter patterns. In the embodiment of the invention, the image sensing wafer described above is a front side illumination (FSI) complementary metal oxide half (CM) image sensing wafer.
在本發明之-實施例中，上述之影像感測晶片為f面照射 (back side illumination，BSI)的互補式金氧半影像感測晶片。 在本發明之一實施例中，上述之影像感測裝置更包括基 板。影像感測晶片配置於基板的承載面上，且雷料、击拉_ - 通石夕晶穿孔（ThroughSmconViajsv)，且影像感測晶片透 過這些直通矽晶穿孔而電性連接至基板。 在本發明之-實施射’上述之基板之相對 面設有多個電性連接部。 在本發明之一實施例中，上述之光學模租 透光件為雜。 ^為鏡賴組，而 模组㈣之影像感师置巾’砂可料鏡職組的光學 模^疋直接配置於影像感測晶片的正面，所以可省 ς 所使用的間隙物及保護玻璃。如此，可減 ’目 裝置的厚度。 赞月之衫像感測 為讓本㈣之上述和其他目的、特徵和優频 隨下文特舉較佳實施例，並配合所附圖式 ** 【實施方式】 乍评細说明如下。 圖 是本發明一實施例之一種影像感測裝置的剖面示意 201138445 圖。請參照圖3，本實施例之影像感測裝置2〇〇包括影像感測 晶片210、光學模組22〇以及保護件23〇。影像感測晶片 具有正面211，且此正面211具有影像感測區212。光學模組 220包括筒體222及至少一透光件224。筒體222直接配置於 所述正面211，並圍繞影像感測區212，而透光件224配置於 筒體222内，且與影像感測區212相對。保護件23〇覆蓋所述 正面211之位於光學模組220外的區域並圍繞筒體230。In an embodiment of the invention, the image sensing wafer is a back side illumination (BSI) complementary MOS image sensing wafer. In an embodiment of the invention, the image sensing device further includes a substrate. The image sensing wafer is disposed on the bearing surface of the substrate, and the laser material is pulled, and the image sensing wafer is electrically connected to the substrate through the through-silicone perforations. In the present invention, a plurality of electrical connecting portions are provided on the opposite side of the substrate. In an embodiment of the invention, the optical molded light transmissive member is a hybrid. ^ is the mirror group, and the image sensor of the module (4) is used to set the optical module of the sand-coated mirror group directly on the front side of the image sensing chip, so the spacers and protective glass used can be saved. . In this way, the thickness of the device can be reduced. The above-mentioned and other objects, features and advantages of the present invention are described in the following with respect to the preferred embodiments of the present invention and in conjunction with the accompanying drawings ** [Embodiment]. Figure 1 is a cross-sectional view of an image sensing device according to an embodiment of the present invention. Referring to FIG. 3, the image sensing device 2 of the present embodiment includes an image sensing wafer 210, an optical module 22A, and a protective member 23A. The image sensing wafer has a front side 211, and the front side 211 has an image sensing area 212. The optical module 220 includes a barrel 222 and at least one light transmissive member 224. The barrel 222 is disposed directly on the front surface 211 and surrounds the image sensing area 212. The light transmitting member 224 is disposed in the barrel 222 and opposite to the image sensing area 212. The protective member 23 covers the area of the front surface 211 outside the optical module 220 and surrounds the barrel 230.
上述之景；^象感測晶片210可為前面照射的互補式金氧半 影像感測晶片或是背面照射的互補式金氧半影像感測晶片，但 不=此為限。此外，影像感測區212設有呈陣列排列的多個感 光單元214以及對應這些感光單元214的多個彩色濾光圖案 216，且這些彩色濾光圖案216分別配置於這些感光單元2M 上。這些彩色濾光圖案216例如包括多個紅色濾光圖案、多個 綠色慮光圖案與多個藍色絲圖案，以使影像感測晶片21〇能 感測到彩色影像。當然，彩色濾光圖案216的顏色並不限於上 述^有關於彩色據光圖帛216的排列方式為所屬技術領域中 的通吊知識’在此將不詳細說明。另外，為了提升感光單元 214的感光效果，影像感測區2122可進一步設置對應這些彩 色遽光圖案216的多個微透鏡218。這些微透鏡218 別配置 於彩色渡光圖案216上’以將光線匯聚至對應的感光單元 214，進而提升感光單元214的感光效果。 上述之光學模組220的筒體222例如是透過膠體（圖未示 而，附於影像感測晶片21〇的正面211。光學模組，投影方 所述正面211的正投影面積A1小於所述正面2ιι的面積a: 影像感測區212的面積A3。此外，光學模組22。的i| 一 4可防止微粒掉落至影像感測區212。透光件224可肩 201138445 平板或是具有曲率的透鏡。換言之，在一實施例中，光學模組 220可為鏡頭模組，其透光件224 (即透鏡）可用以匯聚光線， 以提升感光單元214的感光效果。 在本實施例中，保護件230例如是封裝膠體，具體而言， 保邊件230例如是環氧塑封料（ep〇Xy molding compound)。 亦即，保護件230是藉由封裝製程所形成的。保護件23〇可用 以保護影像感測晶片210，並使光學模組220能更穩固地固定 於影像感測晶片210的正面211。此外，筒體222具有頂面 223 ’而保護件230可更延伸覆蓋筒體222的部分頂面223， 響以提升保護件230與筒體222之間的結合強度，防止保護件 =〇與筒體222之間產生間隙。另外，保護件23〇還可延伸覆 蓋影像感測晶片210的多個侧面213 ,以使影像感測晶片21〇 受到更完整的保護。 上述之影像感測裝置200可更包括基板24〇，而影像感測 晶片210是配置於基板240的承載面242上，且電性連接至基 板240。此外，影像感測晶片21〇可具有多個直通矽晶穿孔 215，且影像感測晶片21〇是透過這些直通矽晶穿孔而電 φ I·生連接至基板24〇。需注意的是，影 其他方式而電性連接至基板240。另外，基板24〇之:= 载面242的背面244可設有多個電性連接部246 (如錫球）。 影像感測裝f 200可透過這些電性連接部246❿電性連接至電 子產品（如行動電話、筆記型電腦、數位相機等）的電路板。 <本實施例之影像感測裝置2〇〇中，由於光學模組22〇是直 接设置於影像感測晶片210的正面211，所以可省略習知技 所使用的間隙物及保護玻璃。因此，相較於習知影像感測裝 置’本實施例之影像感測裝置200具有較薄的厚度，而使用^ 201138445 影像感測裝置200的電子產品之厚度亦可變薄。此外，由於本 實施之影像感測裝置200省略了間隙物及保護玻璃，所以可避 免因間隙物及保護玻璃的平整度不佳導致影像感測品質降低 的問題。而且’在本實施例中，由於省略了保護玻璃，所以可 避免保護玻璃所造成的光損失，進而提升影像感測裝置2〇〇的 光利用效率。 圖4是本發明另一實施例之一種影像感測裝置的剖面示 意圖。請參照圖4，本實施例之影像感測裝置200,與上述之影 像感測裝置200相似，差別處在於保護件。更詳細地說，本實 籲 施例之影像感測裝置200’的保護件230’例如是預先成型的保 護環。也就是說’保護件230’是成型後才套設於筒體222。^ 護件230’可透過緊配的方式而與筒體222結合。在一實施例 中’為了使保護件230’與筒體222能更穩固的結合，並防Z保 護件230’與影像感測晶片210的正面211之間產生間隙，保^ 件230’可透過膠體（圖未示）·而黏附於筒體222及影像咸琪j曰 片210。 〜0曰 此保護件230’的材質可為金屬、塑膠、陶竞或其他a適 φ 的材質。此外’保護件230’除了覆蓋影像感測晶片21〇的 211之位於光學模組220外的區域並圍繞筒體222外，保 230’的形狀可設計成能延伸覆蓋筒體222的部分頂面223°。^ 另一實施例中，保護件230’的形狀亦可設計成能延伸覆蓋影 感測晶片210的側面213。 本實施例之影像感測裝置200’與上述之影像感測 2〇〇的優點相似，在此將不再重述。 〜、置 雖然本發明已以較佳實施例揭露如上’然其並非用以 — 本發明，任何熟習此技藝者，在不脫離本發明之精神二 201138445 内，當可作些許之更動與潤飾，因此本發明之保護範圍當視後 附之申請專利範圍所界定者為準。 【圖式簡單說明】 圖1是習知一種影像感測裝置的剖面示意圖。 圖2是包含多個圖1之影像感測裝置的晶圓的示意圖。 圖3是本發明一實施例之一種影像感測裝置的剖面示意 圖。 圖4是本發明另一實施例之一種影像感測裝置的剖面示 意圖。 【主要元件符號說明】 50 :晶圓 100、200、200’ ：影像感測裝置 110、 210 :影像感測晶片 111、 211 :正面 120 :間隙物 130 :保護玻璃 140 :鏡頭模組 112、 212 :影像感測區 114、214 :感光單元 116、216 :彩色濾光圖案 118、218 :微透鏡 213 :側面 215 :直通矽晶穿孔 220 :光學模組 222 :筒體 223 :頂面 201138445 224 :透光件 230、230’ ：保護件 240 :基板 242 :承載面 244 :背面 246 :電性連接部 A卜A2、A3 :面積The image sensing wafer 210 may be a complementary MOS image sensing wafer that is irradiated in front or a complementary MOS image sensing wafer that is back-illuminated, but not limited thereto. In addition, the image sensing area 212 is provided with a plurality of photosensitive cells 214 arranged in an array and a plurality of color filter patterns 216 corresponding to the photosensitive cells 214, and the color filter patterns 216 are respectively disposed on the photosensitive cells 2M. The color filter patterns 216 include, for example, a plurality of red filter patterns, a plurality of green light patterns, and a plurality of blue line patterns to enable the image sensing wafers 21 to sense color images. Of course, the color of the color filter pattern 216 is not limited to the above-described arrangement of the color map 216, which is not described in detail in the art. In addition, in order to enhance the light-sensing effect of the photosensitive unit 214, the image sensing area 2122 may further provide a plurality of microlenses 218 corresponding to the color-coloring patterns 216. The microlenses 218 are disposed on the color light-passing pattern 216 to concentrate the light to the corresponding photosensitive unit 214, thereby enhancing the photosensitive effect of the photosensitive unit 214. The cylindrical body 222 of the optical module 220 is, for example, a transparent body (not shown, attached to the front surface 211 of the image sensing wafer 21A. The optical module, the front projection area A1 of the front side 211 of the projection side is smaller than the The area of the front surface 2: the area A3 of the image sensing area 212. In addition, the i|4 of the optical module 22 prevents the particles from falling to the image sensing area 212. The light transmitting part 224 can be shouldered or has a shoulder of 201138445 The lens of the curvature. In other words, the optical module 220 can be a lens module, and the light transmissive member 224 (ie, the lens) can be used to concentrate light to enhance the photosensitive effect of the photosensitive unit 214. The protective member 230 is, for example, an encapsulant. Specifically, the edge retaining member 230 is, for example, an epoxy molding compound. That is, the protective member 230 is formed by a packaging process. The image sensing wafer 210 can be protected and the optical module 220 can be more firmly fixed to the front surface 211 of the image sensing wafer 210. In addition, the cylindrical body 222 has a top surface 223 ' and the protective member 230 can extend more than the cylindrical body. Part 223 of the top surface 223, ringing In order to improve the bonding strength between the protection member 230 and the barrel 222, a gap is formed between the protection member=〇 and the barrel 222. In addition, the protection member 23〇 may extend over the plurality of side surfaces 213 of the image sensing wafer 210. The image sensing device 200 can be more fully protected. The image sensing device 200 can further include a substrate 24 , and the image sensing wafer 210 is disposed on the carrying surface 242 of the substrate 240 and electrically connected to The substrate 240. In addition, the image sensing wafer 21A may have a plurality of through-silicon vias 215, and the image sensing wafers 21 are electrically connected to the substrate 24 through the through-silicon vias. The image sensing device f 200 can be provided with a plurality of electrical connecting portions 246 (such as solder balls). Through the electrical connection portion 246, the circuit board is electrically connected to an electronic product (such as a mobile phone, a notebook computer, a digital camera, etc.). In the image sensing device 2 of the embodiment, the optical module 22 is 〇 is directly set to image sensing The front surface 211 of the sheet 210 can be omitted, and the spacer and the protective glass used in the prior art can be omitted. Therefore, the image sensing device 200 of the present embodiment has a thinner thickness than the conventional image sensing device. ^ 201138445 The thickness of the electronic product of the image sensing device 200 can also be thinned. Moreover, since the image sensing device 200 of the present embodiment omits the spacers and the protective glass, the flatness of the spacers and the protective glass can be avoided. This causes a problem that the image sensing quality is lowered. Further, in the present embodiment, since the cover glass is omitted, the light loss caused by the cover glass can be avoided, and the light use efficiency of the image sensing device 2 can be improved. Fig. 4 is a cross-sectional view showing an image sensing apparatus according to another embodiment of the present invention. Referring to FIG. 4, the image sensing device 200 of the present embodiment is similar to the image sensing device 200 described above, and the difference lies in the protective member. In more detail, the protective member 230' of the image sensing device 200' of the present embodiment is, for example, a preformed protective ring. That is to say, the 'protective member 230' is sleeved on the cylindrical body 222 after molding. ^ The guard 230' can be coupled to the barrel 222 in a tight fit. In an embodiment, in order to make the protection member 230' and the cylinder 222 more firmly combined, and to prevent a gap between the Z protection member 230' and the front surface 211 of the image sensing wafer 210, the security member 230' is transparent. The colloid (not shown) adheres to the cylinder 222 and the image of the jellyfish. ~0曰 The material of the protective member 230' can be metal, plastic, Tao Jing or other material of a suitable φ. In addition, the 'protective member 230' is shaped to extend beyond the outer surface of the optical module 220 and surround the outer portion of the optical module 220, and the shape of the retaining 230' can be extended to cover a portion of the top surface of the cylindrical body 222. 223°. In another embodiment, the shape of the protective member 230' can also be designed to extend over the side 213 of the shadow sensing wafer 210. The image sensing device 200' of the present embodiment is similar to the above-described image sensing device 2', and will not be repeated here. The present invention has been disclosed in the preferred embodiments as described above, but it is not intended to be used in the present invention. Any one skilled in the art can make some changes and refinements without departing from the spirit of the present invention. Therefore, the scope of the invention is defined by the scope of the appended claims. BRIEF DESCRIPTION OF THE DRAWINGS FIG. 1 is a schematic cross-sectional view of a conventional image sensing device. 2 is a schematic diagram of a wafer including a plurality of image sensing devices of FIG. 1. Fig. 3 is a cross-sectional view showing an image sensing apparatus according to an embodiment of the present invention. Fig. 4 is a cross-sectional view showing an image sensing apparatus according to another embodiment of the present invention. [Main component symbol description] 50: Wafer 100, 200, 200': image sensing device 110, 210: image sensing wafer 111, 211: front surface 120: spacer 130: protective glass 140: lens module 112, 212 : image sensing areas 114, 214: photosensitive cells 116, 216: color filter patterns 118, 218: microlens 213: side 215: through through twinned holes 220: optical module 222: cylinder 223: top surface 201138445 224: Light-transmitting member 230, 230': protective member 240: substrate 242: bearing surface 244: back surface 246: electrical connection portion A A2, A3: area