TW201137914A - Protective device and electronic device - Google Patents

Protective device and electronic device Download PDF

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Publication number
TW201137914A
TW201137914A TW99111958A TW99111958A TW201137914A TW 201137914 A TW201137914 A TW 201137914A TW 99111958 A TW99111958 A TW 99111958A TW 99111958 A TW99111958 A TW 99111958A TW 201137914 A TW201137914 A TW 201137914A
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Taiwan
Prior art keywords
electrode
sub
substrate
metal block
disposed
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TW99111958A
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Chinese (zh)
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TWI452592B (en
Inventor
Chung-Hsiung Wang
Hung-Ming Lin
Wen-Shiang Luo
Chun-Tiao Liu
Kuo-Shu Chen
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Cyntec Co Ltd
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Application filed by Cyntec Co Ltd filed Critical Cyntec Co Ltd
Priority to TW099111958A priority Critical patent/TWI452592B/en
Priority to JP2010198242A priority patent/JP5192524B2/en
Priority to US12/875,771 priority patent/US9129769B2/en
Priority to KR1020110034765A priority patent/KR101354096B1/en
Publication of TW201137914A publication Critical patent/TW201137914A/en
Priority to US13/962,837 priority patent/US9336978B2/en
Application granted granted Critical
Publication of TWI452592B publication Critical patent/TWI452592B/en

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Abstract

A protective device includes a substrate, an upper electrode, a lower electrode, an end electrode, a heater, a metal block and at least a bridge line. The substrate has a first surface and an opposite second surface. The upper electrode is disposed on the first surface of the substrate and includes a first sub-electrode, a third sub-electrode and a fourth sub-electrode. The lower electrode is disposed on the second surface of the substrate. The end electrode connects the upper electrode and the lower electrode. The heater is disposed on the substrate and electrically connects to the first sub-electrode. The metal block is disposed on the first surface of the substrate and connects the third sub-electrode and the fourth sub-electrode. The bridge line is disposed above the metal block and partly connects to the metal block. A first end of the bridge line is fixed on the first sub-electrode. The bridge line and the first sub-electrode are overlapped with at least a portion in their orthogonal projections on the first surface.

Description

201137914 3^98jtwf.doc/n 六、發明說明: 【發明所屬之技術領域】 本發明是有關於-種應用於電子裝置中的 70 件,且特別疋有關於-種可防止過電流及過電壓的保 # ° 【先前技術】 _近年來’資訊科技突飛猛進,舉凡手機 灯動助理等資訊產品隨處可見,藉由它們的幫助,提 人們在生活上食、衣、住、行、育、樂各方面的了 使人們對資訊產品之依賴性與曰倶增。然而 時^ =於手機等可攜式電子產品的電池在充放電的過二 ^聞。因此,業界開始加強電池在充放電 的 ::以防止電池在充放電的過程中因過電壓或過電: 習知技術提出的防護元件的防護方式 中的溫度保險絲與電池的電路串聯,且使 度保險絲與加熱輯性連接至場效電晶 ^ β加熱以炫斷溫度保險絲,進而使電池的 敗口…、 態而達到過電屋保護。此外,當過電流時,大ί =的狀 經溫度保險絲會使溫度保險絲加熱而溶斷流 私路呈斷路的狀態過電流保護。 、的 201137914 1 -TW 33983twf.doc/n 圖1為習知之一種溫度保險絲封裴體的剖面示意圖。 請參考圖1,習知之溫度保險絲封裝體100具有二基板 110、一加熱器120、一絕緣層130、_金屬層14〇以及一 =焊劑ISO。加熱器m配置於基板11〇上電連接兩加熱 器電極125 ’絕緣層130覆蓋加熱器12〇和加熱器電極 12=金屬層140配置於絕緣層13〇上,且助焊劑'完全 覆盍於金屬層140。如此一來,加熱器12〇加熱可直接熔 融金屬層140,以使金屬層14G炫融而向加熱器、12〇兩側 的電極層160和中間電極165流動。 然而,由於金屬層M0表面容易產生氧化,若助焊劑 ISO沒有完全包覆金屬層⑽,縣的金屬層⑽會在兩側 電極層160與中間電極165間產生拉弧現象(fuse arcing), 恶法確保有魏斷之過電壓髓要求。料,為減少拉弧 =象之產生、提高過電壓保護之穩定性,還f控制金屬層 140之截面積、與中間電極165之面積的大小、電極層16〇 與中間電極165之間的間距或金屬層14()與 等參數’造成產品尺寸縮小設計之限制:過^ 溶斷可罪度下降等問題。 【發明内容】 本I月提供-種保瘦元件,可有效防止過電流與過電 本發明提供一種電子裝 可有效防止過電流與過電壓 置’其具有上述之保護元件, 201137914 KJj-uyyuui-TW 33983twf.doc/n 本發明提出-種保護元件,其包括一基板、一上電 極、-下電極、-端電極、-加熱器、一金屬塊以及至少 一橋接線。基板具有彼此相對的—第一表面與一第二表 面。上電極配置於基板的第-表面上。上電極包括一^ 子電極及彼此相對的-第三子電極與一第四子電極。下電 極配置於基板的第二表面上。端電極連接上電極與下電 極。加熱器配置於基板上,且電性連接第一子電極。、金屬 塊配置於基板的第-表面上,且連接第三子電極與第四子 電極。橋接線配置於金屬塊的上方並部分接觸於 且具有彼此相對的一第一端及一第二端。橋接線的第一端 固定於第一子電極上。橋接線在基板之第一表面上的正投 影與第一子電極在基板之第一表面上的正投影至少部份重 疊。 本發明還提出一種保護元件,其包括一基板、一上電 極、一下電極、一端電極、一加熱器、一金屬塊、至少一 橋接線以及一輔助介質。基板具有彼此相對的—第一表面 與一第一表面。上電極配置於基板的第一表面上。上電極 包括一第一子電極及彼此相對的一第三子電極與一第四子 電極。下電極配置於基板的第二表面上。端電極連接上電 極與下電極。加熱器配置於基板上,且電性連接第一子電 極。金屬塊配置於基板的第一表面上,且連接第三子電極 與第四子電極。橋接線配置於金屬塊的上方,且具有彼此 相對的一第一端及一第二端。橋接線的第一端固定於第一 子電極上。橋接線在基板之第一表面上的正投影與第一子 201137914 ^-υ^ϋΟΙ-TW 33983twf.doc/n ^極在基板n面上的正投 質配置於橋接線與金屬塊之間。y邙知重$。輔助介 本發明還提出一種電子裝置,苴 護元件、-電池以及—_ =括如上述所述之保 偵測控抑祕絲護元絲護元件。 -過電壓狀態時,偵測控制器會提供到 而熱器通電發熱’《炫斷金屬r ;器加熱而使金屬塊呈現⑽夂=:屬此:: =力?毛細現象的緣故而往所接觸的橋接== 弟一延伸部流動,如此一來’可達 達成有效防止過電壓或過電流。 ^為讓本發明之上述特徵和優點能更明顯易懂,下文 舉實施例,並配合所附圖式作詳細說明如下。 , 【實施方式】 圖2Α為本發明之一實施例之一種保護元件的俯視示 意圖。圖2Β繪示為圖2Α之保護元件的仰視示意圖。圖 2C綠示為圖2Α之保護元件沿線μι的剖面示意圖。圖m 繪示為圖2A之保護元件沿線〗^的剖面示意圖。請同時 參考圖2A、圖2B、圖2C以及圖2D ’在本實施例中,保 護元件200a包括一基板210、一上電極22〇、一下電極 230、一端電極240、一加熱器250、一第一助溶劑260、 金屬塊270以及至少一橋接線280(圖2A中僅示意地緣 201137914 33983twf.doc/n 示一條)。 詳細而言,基板210具有彼此相對的一第一表面212 與一第二表面214以及連接第一表面212與第二表面214 的一側表面216。在本實施例中,基板210的材質包括陶 究(例如氧化鋁)、塑膠薄膜(plastic fllm)、玻璃環氧 樹脂、二氧化鍅(Zr〇2)、氮化矽(Si3N4)、氮化鋁(a1N)、 氮化蝴(BN)或是其他無機材料。 上電極220配置於基板210的第一表面212上’且具 有彼此相對的一第一子電極222與一第二子電極224以及 彼此相對的一第三子電極226與第四子電極228。需注 意的是,於其他實施例中,上電極22〇也可不包含第二子 ,極224,且不影響過電流及過電壓保護效果。較佳地, 第一子電極222更具有一本體部222a以及一與本體部 22=相連接的第一延伸部222b,其中第一延伸部222b位 於第二子電極226與第四子電極228之間。 下電極230配置於基板210的第二表面214上。端電 ^ 240連接上電極220與下電極23〇,且覆蓋基板21〇的 邛二側表面216。在本實施例中,上電極22〇、下電極23〇 ^電極240的材質例如為銀膠、錄和金的多層堆疊結 ’此外也可以賴合金、鎳合金、銅、錫等導電性質良 好的材料來替代。 、 在本實施例中,加熱器25〇配置於基板21〇的第二表 沾21二上,且連接下電極230。下電極230具有彼此相對 、第五子電極232與-第六子電極234卩及彼此相對的 201137914 33983twf.doc/n 一第七子電極236與一第八子電極238。第五子電極232、 第六子電極234、第七子電極236、第八子電極238依序對 應第一子電極222、第二子電極224、第三子電極226以及 第四子電極228配置。第五子電極232具有一第二延伸部 232a,第六子電極234具有一第三延伸部234a。第二延伸 部232a與第三延伸部234a位於第七子電極236與第八子 電極238之間並彼此平行且不重疊,而加熱器25〇連接於 鲁第二延伸部232a與第三延伸部234a之間。 然而,於其他實施例中,加熱器250也可直接連接於 第五子電極232和第六子電極234之間,而不需有第二延 伸部232a與第三延伸部234a。更甚,於再一實施例中, 加熱态250也可配置於基板210的第一表面212上,且連 接於上電極220的第一子電極222和第二子電極224之間 (未圖示)。此外,在本實施例中,加熱器25〇的材質包括 一氧化釕(Ru〇2)、ί炭黑(可摻雜於水玻璃等無機系黏著 劑中或是熱硬化樹脂等有機系黏著劑中)、銅、鈦、鎳鉻 合金與鎳銅合金等,可分別利用厚膜印刷、濺鍍、壓合貼 合或薄膜微影製程等形成。再者,為保護加熱器25〇不受 外界環境的污染或氧化,可在加熱器25〇上覆蓋一絕緣層 294 ’其材質包括玻璃膠或環氧樹脂(ep〇xy resin)等。 第一助熔劑260配置於基板210的第一表面212上, 並位於第一延伸部222b與第三子電極226之間,以及位於 第一延伸部222b與第四子電極228之間。在本實施例中, 弟助溶劑260是由松脂(rosin)、軟化劑、活性劑(active 201137914 ^ * 一丁 W j:983twf.doc/n agent)以及合成橡膠(synthetic rubber)所組成。 金屬塊270配置於基板210的第一表面212上,且連 接第三子電極226、第一延伸部222b與第四子電極228。201137914 3^98jtwf.doc/n VI. Description of the Invention: [Technical Field] The present invention relates to a 70-piece application in an electronic device, and particularly relates to preventing overcurrent and overvoltage保保# ° [Previous technology] _ In recent years, 'information technology has advanced by leaps and bounds. Information products such as mobile phone assistants can be seen everywhere. With their help, people can eat, clothing, live, travel, education and music in their lives. In terms of the dependence and increase of people's dependence on information products. However, when the battery of a portable electronic product such as a mobile phone is charged and discharged, it is too much. Therefore, the industry began to strengthen the battery charging and discharging: to prevent the battery from overvoltage or over-charging during charging and discharging: The thermal fuse in the protection mode of the protective element proposed by the prior art is connected in series with the circuit of the battery, and The fuse and the heating are connected to the field effect crystal ^ β heating to sever the temperature fuse, so that the battery is defeated, and the state is protected by the electric house. In addition, when an overcurrent occurs, a large ί = temperature fuse will heat the temperature fuse and dissolve the flow. The private circuit is in an open state. 201137914 1 - TW 33983twf.doc / n Figure 1 is a schematic cross-sectional view of a conventional thermal fuse package. Referring to FIG. 1, a conventional thermal fuse package 100 has two substrates 110, a heater 120, an insulating layer 130, a metal layer 14A, and a = solder ISO. The heater m is disposed on the substrate 11 and electrically connects the two heater electrodes 125. The insulating layer 130 covers the heater 12 and the heater electrode 12 = the metal layer 140 is disposed on the insulating layer 13 , and the flux 'is completely covered Metal layer 140. In this manner, the heater 12 is heated to directly melt the metal layer 140 so that the metal layer 14G is condensed and flows toward the heater, the electrode layer 160 on both sides of the 12 和, and the intermediate electrode 165. However, since the surface of the metal layer M0 is easily oxidized, if the flux ISO is not completely covered with the metal layer (10), the metal layer (10) of the county may cause a phenomenon arcing between the electrode layers 160 and the intermediate electrode 165, which is evil. The method ensures that there is a requirement for the voltage drop of the Wei. In order to reduce the arcing=image generation and improve the stability of the overvoltage protection, f also controls the cross-sectional area of the metal layer 140, the size of the area of the intermediate electrode 165, and the spacing between the electrode layer 16〇 and the intermediate electrode 165. Or the metal layer 14 () and the equivalent parameters 'cause the product size reduction design restrictions: over ^ dissolution and guilty decline and other issues. SUMMARY OF THE INVENTION This I month provides a kind of thin-skinning component, which can effectively prevent overcurrent and over-current. The invention provides an electronic device capable of effectively preventing overcurrent and overvoltage. It has the above-mentioned protection component, 201137914 KJj-uyyuui- TW 33983 twf.doc/n The invention proposes a protective element comprising a substrate, an upper electrode, a lower electrode, a terminal electrode, a heater, a metal block and at least one bridge wire. The substrate has a first surface and a second surface opposite to each other. The upper electrode is disposed on the first surface of the substrate. The upper electrode includes a sub-electrode and a third sub-electrode and a fourth sub-electrode opposite to each other. The lower electrode is disposed on the second surface of the substrate. The terminal electrode is connected to the upper electrode and the lower electrode. The heater is disposed on the substrate and electrically connected to the first sub-electrode. And the metal block is disposed on the first surface of the substrate, and connects the third sub-electrode and the fourth sub-electrode. The bridge wire is disposed above the metal block and partially in contact with and has a first end and a second end opposite to each other. The first end of the bridge wire is fixed to the first sub-electrode. The positive projection of the bridge wire on the first surface of the substrate at least partially overlaps the orthographic projection of the first sub-electrode on the first surface of the substrate. The present invention also provides a protective component comprising a substrate, an upper electrode, a lower electrode, an end electrode, a heater, a metal block, at least one bridge wire, and an auxiliary medium. The substrate has a first surface and a first surface opposite to each other. The upper electrode is disposed on the first surface of the substrate. The upper electrode includes a first sub-electrode and a third sub-electrode and a fourth sub-electrode opposite to each other. The lower electrode is disposed on the second surface of the substrate. The terminal electrode is connected to the upper electrode and the lower electrode. The heater is disposed on the substrate and electrically connected to the first sub-electrode. The metal block is disposed on the first surface of the substrate and connects the third sub-electrode and the fourth sub-electrode. The bridge wire is disposed above the metal block and has a first end and a second end opposite to each other. The first end of the bridge wire is fixed to the first sub-electrode. The orthographic projection of the bridge wire on the first surface of the substrate and the positive input of the first sub-surface of the substrate on the substrate n are disposed between the bridge wire and the metal block. y邙 knows $. Auxiliary media The present invention also provides an electronic device, a protective component, a battery, and a __ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ - When the voltage is over-voltage, the detection controller will provide the heater and the heater will be energized. 'Hard the metal r; the heater heats up and the metal block appears. (10) 夂 =: This is: : = force? Capillary phenomenon The bridging of the contact == the extension of the extension of the brother, so that the reach can be effectively prevented from overvoltage or overcurrent. The above described features and advantages of the present invention will become more apparent from the following description. [Embodiment] Fig. 2A is a plan view showing a protective element according to an embodiment of the present invention. 2A is a bottom view of the protection element of FIG. 2A. Figure 2C is a cross-sectional view of the protective element of Figure 2 along the line μ. Figure m is a cross-sectional view of the protection element of Figure 2A along the line. Referring to FIG. 2A, FIG. 2B, FIG. 2C and FIG. 2D, in the embodiment, the protection component 200a includes a substrate 210, an upper electrode 22, a lower electrode 230, an end electrode 240, a heater 250, and a first A co-solvent 260, a metal block 270, and at least one bridge wire 280 (only one of the schematic edges 201137914 33983 twf.doc/n is shown in Figure 2A). In detail, the substrate 210 has a first surface 212 and a second surface 214 opposite to each other and a side surface 216 connecting the first surface 212 and the second surface 214. In this embodiment, the material of the substrate 210 includes ceramics (such as alumina), plastic fllom, glass epoxy, cerium oxide (Zr〇2), tantalum nitride (Si3N4), aluminum nitride. (a1N), nitrided butterfly (BN) or other inorganic materials. The upper electrode 220 is disposed on the first surface 212 of the substrate 210 and has a first sub-electrode 222 and a second sub-electrode 224 opposite to each other and a third sub-electrode 226 and a fourth sub-electrode 228 opposite to each other. It should be noted that in other embodiments, the upper electrode 22〇 may not include the second sub-pole 224 and does not affect the overcurrent and over-voltage protection effects. Preferably, the first sub-electrode 222 further has a body portion 222a and a first extension portion 222b connected to the body portion 22, wherein the first extension portion 222b is located at the second sub-electrode 226 and the fourth sub-electrode 228. between. The lower electrode 230 is disposed on the second surface 214 of the substrate 210. The terminal electrode 240 is connected to the upper electrode 220 and the lower electrode 23, and covers the two side surfaces 216 of the substrate 21A. In this embodiment, the material of the upper electrode 22 〇 and the lower electrode 23 电极 ^ electrode 240 is, for example, a silver paste, a multilayer stack of gold and gold, and may also have good electrical conductivity, such as alloy, nickel alloy, copper, tin, etc. Material to replace. In the present embodiment, the heater 25 is disposed on the second surface 21 of the substrate 21, and is connected to the lower electrode 230. The lower electrode 230 has a seventh sub-electrode 236 and a sixth sub-electrode 236 opposite to each other, a fifth sub-electrode 232 and a sixth sub-electrode 234, and opposite to each other. The fifth sub-electrode 232, the sixth sub-electrode 234, the seventh sub-electrode 236, and the eighth sub-electrode 238 are sequentially disposed corresponding to the first sub-electrode 222, the second sub-electrode 224, the third sub-electrode 226, and the fourth sub-electrode 228. . The fifth sub-electrode 232 has a second extension 232a, and the sixth sub-electrode 234 has a third extension 234a. The second extension portion 232a and the third extension portion 234a are located between the seventh sub-electrode 236 and the eighth sub-electrode 238 and are parallel to each other and do not overlap, and the heater 25 is connected to the second extension portion 232a and the third extension portion. Between 234a. However, in other embodiments, the heater 250 can also be directly connected between the fifth sub-electrode 232 and the sixth sub-electrode 234 without the second extension 232a and the third extension 234a. In still another embodiment, the heating state 250 can also be disposed on the first surface 212 of the substrate 210 and connected between the first sub-electrode 222 and the second sub-electrode 224 of the upper electrode 220 (not shown). ). Further, in the present embodiment, the material of the heater 25A includes ruthenium oxide (Ru〇2), ίcarbon black (which may be doped with an inorganic adhesive such as water glass or an organic adhesive such as a thermosetting resin). Medium), copper, titanium, nickel-chromium alloy and nickel-copper alloy can be formed by thick film printing, sputtering, press-fitting or thin film lithography, respectively. Further, in order to protect the heater 25 from contamination or oxidation by the external environment, the heater 25 may be covered with an insulating layer 294' which is made of glass paste or epoxy resin. The first flux 260 is disposed on the first surface 212 of the substrate 210 and between the first extension portion 222b and the third sub-electrode 226, and between the first extension portion 222b and the fourth sub-electrode 228. In the present embodiment, the young solvent 260 is composed of rosin, a softener, an active agent (active 201137914 ^ * a W j: 983 twf. doc/n agent), and a synthetic rubber. The metal block 270 is disposed on the first surface 212 of the substrate 210 and is connected to the third sub-electrode 226, the first extension portion 222b and the fourth sub-electrode 228.

具體來說’金屬塊270覆蓋部分第三子電極226、第一助 熔劑260、第一延伸部222b與第四子電極228。當加熱器 250加熱而使第一助熔劑260與金屬塊270皆處於熔融狀 態時,因第一助熔劑260可避免金屬塊27〇受熱熔融開始 流動之表面在放置或一般電流通過時產生氧化薄膜,因此 可以提高確保金屬塊270熔斷的效果。此外,本實施例之 金屬塊270的材質包括錫鉛合金、錫銀鉛合金、錫銦鉍鉛 合金、錫録合金、錫銀銅合金等低溶點合金。Specifically, the metal block 270 covers a portion of the third sub-electrode 226, the first flux 260, the first extension 222b, and the fourth sub-electrode 228. When the heater 250 is heated to cause the first flux 260 and the metal block 270 to be in a molten state, the first flux 260 can prevent the surface of the metal block 27 from being heated and melted to generate an oxide film when placed or generally passed through. Therefore, it is possible to improve the effect of ensuring that the metal block 270 is blown. In addition, the material of the metal block 270 of the present embodiment includes a low melting point alloy such as a tin-lead alloy, a tin-silver-lead alloy, a tin-indium-bismuth-lead alloy, a tin-recorded alloy, or a tin-silver-copper alloy.

本貝知例之保護元件2〇〇a包括橋接線280,其中橋招 線280配置於金屬塊no的上方並部分接觸於金屬场 270,且具有彼此相對的一第一端及一第二端勘〇 特別是,橋接線280的第一端282a固定於第一子電極22: 的本祖4 222a上’然並不以此為限,橋接線28〇的第一端 282a也可固定於第—子電極222的第一延伸部222b與本 體部施連接之—端。此外,橋接線280在基板210之第 -表面212上的正投影與第—延伸部222b在基板21〇之第 表面212上的正投影至少部份重疊。換言之,本實施例 接線28〇跨接在金屬塊挪的上方,且橋接線·的 形狀例如是弧形。 μ ϋ來% ’在本實_中,為了讓橋接線280發揮 卓父仏的效能,較佳地,3 地疋將橋接線280的第二端282b固 10 201137914 —,,001-TW 33983twf.doc/n Π二子電極222的第—延伸部222b遠離本體部222a的 ^八。也就是說,橋接線的第—端282a與第二端 例^ ^定於第一子電極222的本體部❿與第一延 申邓22^上,且橋接線28〇所呈現的形狀例如是拱形。 奴旦值得Γ提的是’本發明並不限定橋接線的形狀、 ^ ^態’雖然此處所提及的橋接線28〇的形狀具體化 為弧形或拱形,且具體化為—條The protective element 2〇〇a of the present invention includes a bridge wire 280, wherein the bridge wire 280 is disposed above the metal block no and partially contacts the metal field 270, and has a first end and a second end opposite to each other. In particular, the first end 282a of the bridge wire 280 is fixed to the ancestor 4 222a of the first sub-electrode 22: However, the first end 282a of the bridge wire 28〇 can also be fixed to the first The first extension 222b of the sub-electrode 222 is connected to the end of the body portion. In addition, the orthographic projection of the bridge wire 280 on the first surface 212 of the substrate 210 at least partially overlaps the orthographic projection of the first extension portion 222b on the first surface 212 of the substrate 21. In other words, the wiring 28 of the present embodiment is bridged over the metal block, and the shape of the bridge wire is, for example, curved. μ ϋ来 % ' In this _, in order to make the bridge 280 play the performance of the father, preferably, the 3 mantle will fix the second end 282b of the bridge 280 10 201137914 —,, 001-TW 33983twf. The first extension 222b of the doc/n second sub-electrode 222 is away from the body portion 222a. That is to say, the first end 282a and the second end of the bridge wire are fixed on the body portion 第一 of the first sub-electrode 222 and the first extension, and the shape of the bridge wire 28 is, for example, Arched. It is worth mentioning that the invention does not limit the shape of the bridge wire, the state of the bridge wire. Although the shape of the bridge wire 28〇 mentioned here is embodied as an arc or an arch, and is embodied as a strip

:’請參她,保護元件綱b之橋接線:::; 亦可為彎折狀,例如是帽子形或其他適當的形狀; 護元件島可具有二或二條以上之橋接線 m橋接線是由許多條絞線(未繪示)所捲 曲所構成’仍屬於本發明可採㈣技術方案,不脫離本發 明所欲保護的範圍。 在本實施例中,由於橋接線280與金屬塊27〇之間僅 =部分接觸’且橋接線的最高點與金屬塊⑽之遠離 基板210的—側表面相隔一間隔距離D,例: 'Please refer to her, the bridge of the protection component class b:::; can also be bent, for example, hat shape or other suitable shape; the protection element island can have two or more bridge wires m bridge wire is It is a technical solution of the present invention to be constructed by the crimping of a plurality of strands (not shown) without departing from the scope of the invention. In the present embodiment, since the bridge wire 280 and the metal block 27A are only partially in contact with each other and the highest point of the bridge wire is spaced apart from the side surface of the metal block (10) away from the substrate 210 by a distance D,

可小於等於〇.25随,錄地,可介於G_至Q lmm j D 因此’可於橋接線與金屬塊27〇之間配置第二麟劑 265 ’來做為引導縣之金屬塊27〇流動的媒介,第二助^ 劑265的材料除可使用與第一祕劑細才目 亦可為-焊料層或其組合。換言之,第一助溶劑^ ”弟-助溶劑265的材質可依使用需求而採用相同或不同 材料。此外,配置於橋接線28〇與金屬塊27〇之間的第二 助溶劑265亦具有避免金屬塊27〇氧化的效果。另外,橋 11 201137914 xw-^WJ-TW 33983twf.doc/n 接線280的第一端282a與第一子電極222的本體部222a 連接處以及橋接線280的第二端282b與第一子電極222 的第一延伸部222b的連接處亦可塗佈第二助熔劑265,可 避免橋接線280之第一端282a與第二端282b產生氧化, 以加強橋接線280的結構強度。 木由於本實施例之保護元件2〇〇a具有橋接線280,因此 虽加熱益250加熱而使金屬塊270呈現熔融狀態時,熔融 的金屬塊270會因表面張力與毛細現象的緣故而吸附於所 接觸的橋接線280上,且可進一步往第一延伸部222b流 動,來達到切斷電路而達成有效防止過電壓或過電流。也 就疋說,熔融的金屬塊270經由橋接線28〇的吸附,不易 導通第一延伸部222b與第三子電極226或第一延伸部 222b與第四子電極228 ’故可避免保護元件2〇〇&產生短路 的現象’使其具有較佳的可靠度。 值得一提的是,於其他實施例中,請參考圖3B,橋 接線285亦可不接觸金屬塊270。詳細來說,於圖之實 她例中’橋接線285的形狀例如是一门字型,其中橋接線 285與金屬塊270不接觸,且一輔助介質269位於橋接線 285胃與金屬塊270之間。在本實施例中,輔助介質269例 如疋:助溶劑或一焊料層。當加熱器25〇加熱而使金屬塊 270王現熔融狀態時,熔融的金屬塊27〇會因表面張力盥 毛細現象的緣故透過辅助介質269而吸附於的橋接線挪 上’來達到切斷電路而達成有效防止過電壓或過電流。 再者’由於金屬塊270的熔斷區域僅發生於金屬塊27〇 201137914 33983twf.d〇c/n 與橋接線280在基板210之第一表面212上之正投影相互 重疊的區域及其周圍,因此只需在金屬塊27〇與橋接線28〇 的之間配置第二助熔劑265來形成金屬塊270的表面抗氧 化層。如此一來,金屬塊270的表面無需完全塗佈第二助 熔劑265,可減少第二助熔劑265的使用量,以降低生產 成本。於另一方面,由於金屬塊270的熔化量減少,因此 可縮短本實施例之保護元件2〇〇a在過電壓保護作動所需 鲁時間,亦可降低熔融的金屬塊27〇導通第一延伸部22沘 與第三子電極226或第一延伸部222b與第四子電極228 而產生短路的現象,而使本實施例之保護元件2〇〇&且 佳的可靠度。 此外,在本實施例中,橋接線280的材質例如是一單 i屬、一雙層金屬或一合金,其中單一金屬例如是金、 銀、錫、鎳、鋁或銅,雙層金屬例如是由銀、金或錫包覆 鋼所組成,而合金例如是銅銀合金、銅鎳合金、鎳錫合金 瞻 或銅鎳錫合金,本發明並不以此為限。在此必須說明的是, 橋接線280之外表面需與熔融的金屬層27〇具有較佳的潤 濕性(Wetting)與吸附性(例如焊錫性(s〇lderabUity)), 因此橋接線280的材質亦可由具有良好焊錫性的外金屬層 和具有較佳熱傳導之内金屬層所組成,例如鋼鍍銀、銅鍍 鎳、銅鍍錫、鎳鍍錫、銅鍍金等材料。由於橋接線28〇的 材貝為金屬或合金’因此橋接線280具有散熱的功能,可 提高保護元件200a的散熱效果。 另外,在本實施例中’保護元件200a更包括一焊料 201137914 ........33983twf.doc/n 層292於第三子電極226、第¢3% 222b ^ 了第了申部222b之上,然並不以此為限,金 η :的其他焊接技術固定而沒有焊料層 貫施焊料層292的㈣可包減銀合金、 錫鉛合金等焊接材料。Can be less than or equal to 〇.25 with, recorded, can be between G_ to Q lmm j D Therefore 'can be placed between the bridge wiring and the metal block 27〇 second lining 265' as the guiding metal block 27 The flow medium, the second aid 265 material may be a solder layer or a combination thereof in addition to being used in combination with the first agent. In other words, the material of the first auxiliary solvent, the "co-solvent 265", may be the same or different materials depending on the use requirements. In addition, the second auxiliary solvent 265 disposed between the bridge wire 28 and the metal block 27 is also avoided. The effect of oxidation of the metal block 27. In addition, the bridge 11 201137914 xw-^WJ-TW 33983twf.doc/n the first end 282a of the wiring 280 is connected to the body portion 222a of the first sub-electrode 222 and the second of the bridge line 280 The junction of the end 282b and the first extension 222b of the first sub-electrode 222 may also be coated with a second flux 265 to prevent oxidation of the first end 282a and the second end 282b of the bridge 280 to strengthen the bridge 280. The structural strength of the wood. Since the protective element 2〇〇a of the present embodiment has the bridge wire 280, the molten metal block 270 may be due to surface tension and capillary phenomenon when the heating block 250 is heated to cause the metal block 270 to be in a molten state. For this reason, it is adsorbed on the bridge wire 280 that is in contact with it, and can further flow to the first extension portion 222b to achieve the cut-off circuit to achieve effective prevention of overvoltage or overcurrent. In other words, the molten metal block 270 is passed through Bridge wiring 28〇 Adsorption, it is difficult to conduct the first extension portion 222b and the third sub-electrode 226 or the first extension portion 222b and the fourth sub-electrode 228', so that the protection element 2〇〇& short-circuit phenomenon can be avoided to make it more reliable. It should be noted that in other embodiments, referring to FIG. 3B, the bridge wire 285 may also not contact the metal block 270. In detail, in the example of the figure, the shape of the bridge wire 285 is, for example, a door. The font, wherein the bridge wire 285 is not in contact with the metal block 270, and an auxiliary medium 269 is located between the stomach of the bridge wire 285 and the metal block 270. In the present embodiment, the auxiliary medium 269 is, for example, a co-solvent or a solder layer. When the heater 25 is heated to cause the metal block 270 to be in a molten state, the molten metal block 27 is transferred to the bridge wire which is adsorbed by the auxiliary medium 269 due to the surface tension and fineness. The road is effectively prevented from overvoltage or overcurrent. Further, since the fuse region of the metal block 270 only occurs on the metal block 27〇201137914 33983twf.d〇c/n and the bridge wire 280 on the first surface 212 of the substrate 210 Orthographic projection The overlapping regions and their surroundings, therefore, only need to be disposed between the metal block 27A and the bridge wire 28A to form a surface oxidation resistant layer of the metal block 270. Thus, the surface of the metal block 270 need not be By completely coating the second flux 265, the amount of the second flux 265 can be reduced to reduce the production cost. On the other hand, since the amount of melting of the metal block 270 is reduced, the protective member 2 of the present embodiment can be shortened. 〇a can reduce the time required for the overvoltage protection to act, and can also reduce the molten metal block 27, conducting the first extension 22 沘 and the third sub-electrode 226 or the first extension 222b and the fourth sub-electrode 228 to cause a short circuit. Phenomenon, and the protection element of the embodiment 2 is & and good reliability. In addition, in this embodiment, the material of the bridge wire 280 is, for example, a single genus, a double-layer metal or an alloy, wherein the single metal is, for example, gold, silver, tin, nickel, aluminum or copper, and the double-layer metal is, for example, It is composed of silver, gold or tin coated steel, and the alloy is, for example, a copper-silver alloy, a copper-nickel alloy, a nickel-tin alloy or a copper-nickel-tin alloy, and the invention is not limited thereto. It must be noted here that the outer surface of the bridge wire 280 needs to have better wettability and adsorptivity (for example, solderability) with the molten metal layer 27, thus the bridge wire 280 The material may also be composed of an outer metal layer having good solderability and an inner metal layer having better heat conduction, such as steel silver plating, copper nickel plating, copper tin plating, nickel tin plating, copper gold plating and the like. Since the material of the bridge wire 28 is a metal or an alloy, the bridge wire 280 has a function of dissipating heat, and the heat dissipation effect of the protection element 200a can be improved. In addition, in the present embodiment, the 'protective element 200a further includes a solder 201137914 . . . 33983 twf.doc/n layer 292 at the third sub-electrode 226, the third 222 222b ^ the first application portion 222b On the top, it is not limited to this. The other soldering techniques of gold η: fixed without the solder layer applied to the solder layer 292 (4) can be used to reduce the solder material such as silver alloy, tin-lead alloy.

為了更進-步確保炫融的金屬塊270可因表面張力盘 毛細現象的緣故而吸附於所接觸的橋接線上以及往第 =伸部222b流動,來達到_電路而達成有效防止過電 [或,電流’因此本實施例針對金屬塊謂、橋接線28〇 以及第-子電極222的第-延伸部222b之間的關係作實 驗。其中’第-延伸部222b所在的區域絲為—有效電極 面積,而金屬塊270於第一延伸部222b之延伸方向(此方 向與電流方向貫質上垂直)的長度乘上金屬塊謂的厚度 所得之乘積定義為一金屬塊截面積。In order to further ensure that the molten metal block 270 can be adsorbed on the contacted bridge wire and flow to the first extension portion 222b due to the capillary phenomenon of the surface tension disk, the circuit can be realized to effectively prevent over-current [or , Current 'The present embodiment is an experiment for the relationship between the metal block, the bridge wire 28〇, and the first extension 222b of the first-sub-electrode 222. Wherein the region where the first extension portion 222b is located is the effective electrode area, and the length of the metal block 270 in the direction in which the first extension portion 222b extends (the direction is perpendicular to the current direction) is multiplied by the thickness of the metal block. The resulting product is defined as the cross-sectional area of a metal block.

由表一可得知:當橋接線280之縱切面的面積與有效 電極面積的比值大於等於0.36,且橋接線28〇之縱切面之 面積與金屬塊截面積的比值大於等於26時,加熱器25〇 可確實熔斷金屬塊270。當橋接線280之縱切面的面積越 大時’其吸附熔融的金屬塊270的吸附量也越多。再者, 由於金屬塊270的尺寸決定金屬塊截面積,因此當金屬塊 270的尺寸越大時,保護元件2〇〇a所需的橋接線28〇尺寸 也需更大。 另外’由於熔融的焊料層292其潤溼性較佳,因此當 14 201137914 —.^01-TW 33983twf.doc/n 金屬塊270熔斷時,會聚集於熔融的焊料層292上,且熔 融的金屬塊27〇會因表面張力與毛細現象的緣故而吸附於 所接觸的橋接線280上以及往第一延伸部222b流動,可以 確,熔融的金屬不會讓第一延伸部222b與第三子電極226 或第四子電極228產生短路現象。如此一來,可進—步確 保金屬塊270可有效地被熔斷,而達成有效防止過^ 過電流。 • 簡言之,當橋接線280之縱切面的面積與有效電極面 積的比值大於等於0.36,且橋接線280之縱切面之面積與 金屬塊截面積的比值大於等於2.6時,可提高金屬塊2川 有效熔斷的可靠度。由於本實施例之橋接線28〇之縱切面 的面積與有效電極面積選用特定範圍之比值,且橋接線 280之縱切面之面積與金屬塊截面積選用特定範圍之比 值。因此,當保護元件200a為了搭配小尺寸之電子產品而 縮小其元件體積時,上電極22〇之第一子電極222的第一 延伸部222b亦能提供相應的電極面積且可透過選用適當 尺寸的.橋接線280來搭配,即可確保金屬塊27〇能迅速熔 斷。如此一來’除了可增加保護元件2〇〇a的應用範圍外, 亦可提高保護元件200a的可靠度。 表 實驗標號 1 2 3 4 5 6 7 8 橋接線的直徑(mm) 0.127 0.127 0.127 0.127 0.254 0.127 0.127 0.127 橋接線的長度(mm) 4.1 4.2 4.3 4.4 4.0 4.3 4.3 4 1 橋接線之縱切面的面積(mm2) 0.521 0.533 0.546 0.559 1.016 0.546 0.546 0.521 有效電極面積(mn^) 1.44 1.44 1.44 1.44 1.44 1.44 1.44 1.8 金屬塊截面積(mm2) 0.2 0.2 0.2 0.2 0.24 0.24 0.3 02 橋接線之縱切的面積與有效電極 0.362 0.370 0.379 0.388 0.706 0.379 0.379 0.289 15 201137914It can be known from Table 1 that when the ratio of the area of the longitudinal section of the bridge wire 280 to the effective electrode area is greater than or equal to 0.36, and the ratio of the area of the longitudinal section of the bridge wire 28 to the cross-sectional area of the metal block is greater than or equal to 26, the heater 25 〇 can surely melt the metal block 270. When the area of the longitudinal section of the bridge wire 280 is larger, the amount of adsorption of the molten metal block 270 is also increased. Moreover, since the size of the metal block 270 determines the cross-sectional area of the metal block, the size of the bridge wire 28 required for the protective element 2A is also required to be larger when the size of the metal block 270 is larger. In addition, since the molten solder layer 292 has better wettability, when the metal block 270 is melted, it will accumulate on the molten solder layer 292, and the molten metal The block 27〇 is adsorbed on the bridge wire 280 that is in contact and flows toward the first extension portion 222b due to surface tension and capillary phenomenon, and it is confirmed that the molten metal does not allow the first extension portion 222b and the third sub-electrode. The 226 or fourth sub-electrode 228 generates a short circuit phenomenon. In this way, it can be further ensured that the metal block 270 can be effectively blown to achieve effective prevention of overcurrent. • In short, when the ratio of the area of the longitudinal section of the bridge wire 280 to the effective electrode area is greater than or equal to 0.36, and the ratio of the area of the longitudinal section of the bridge wire 280 to the cross-sectional area of the metal block is greater than or equal to 2.6, the metal block 2 can be improved. The reliability of Sichuan's effective melting. Since the area of the longitudinal section of the bridge wire 28 of the present embodiment is selected from a specific range of the effective electrode area, and the ratio of the area of the longitudinal section of the bridge wire 280 to the sectional area of the metal block is selected to be a specific range. Therefore, when the protection element 200a is reduced in size for matching the small-sized electronic product, the first extension portion 222b of the first sub-electrode 222 of the upper electrode 22 can also provide a corresponding electrode area and can be appropriately selected. The bridge wire 280 is matched to ensure that the metal block 27 can be quickly blown. In this way, in addition to increasing the range of application of the protective element 2〇〇a, the reliability of the protective element 200a can also be improved. Table experiment number 1 2 3 4 5 6 7 8 Diameter of the bridge wire (mm) 0.127 0.127 0.127 0.127 0.254 0.127 0.127 0.127 Length of the bridge wire (mm) 4.1 4.2 4.3 4.4 4.0 4.3 4.3 4 1 Area of the longitudinal section of the bridge wire ( Mm2) 0.521 0.533 0.546 0.559 1.016 0.546 0.546 0.521 Effective electrode area (mn^) 1.44 1.44 1.44 1.44 1.44 1.44 1.44 1.8 Cross-sectional area of metal block (mm2) 0.2 0.2 0.2 0.2 0.24 0.24 0.3 02 Longitudinal area of the bridge wire and effective electrode 0.362 0.370 0.379 0.388 0.706 0.379 0.379 0.289 15 201137914

vu 1 -TW 33983twf.doc/n 面積的比值 橋接線之縱切面的面積與金屬塊 載面積的比值 2.604 2.667 2.731 2.794 4.233 2.275 1.820 2.604 是否溶斷 OK OK OK OK OK NG NG NG 以下將詳細介紹保護元件2〇〇a的製作方法。圖4a〜 圖4D繪示本發明一實施例之保護元件的製程俯視圖。在 圖4A〜圖4D中的元件名稱及標號與圖2人〜圖2D中的元 件名稱及標號相同者,其材質相同,故於此不再贅述。為 了方便說明起見’本實施例省略說明基板21〇之第二表面 214上的製程,僅於圖4A至圖4D中繪示於基板21〇之第 一表面212上的製程。 首先,請先參考圖4A,提供一基板210,並在基板 210的第一表面212上形成一上電極220。其中,上電極 220具有彼此相對的一第一子電極222與一第二子電極224 以及彼此相對的一第三子電極226與一第四子電極228。 需注意的是,於其他實施例中,上電極22〇也可不包含第 二子電極224 ’且不影響過電流及過電壓保護效果。第一 子電極222具有一本體部222a以及與本體部222a相連接 的一第一延伸部222b,其中第一延伸部222b位於第三子 電極226與第四子電極228之間。 接者,睛再參考圖4A,例如是以塗佈的方式在第三 子电極226、第四子電極228以及第一延伸部222b之間形 成一焊料層292。然後,例如是以塗佈的方式在第三子電 極226、第四子電極228以及第一延伸部222b之間的基板 210上形成一第一助溶劑260。在其他實施例中,當焊料層 292的材質包括一焊料合金與一助焊材料時,例如含 16 201137914 〜-v"J01-TW 33983twf_doc/n 10 15/。成第—助炫劑260的方法包括加熱嬋料層292 (例如120t以上),以使助焊材料軟化而流到第三子電 極226、第四電極228以及第一延伸部222b之間的基板21〇 上。 接著,4參考圖4B,將一金屬塊27〇配置於第三子 電極226、第四子電極.228以及第_延伸部2挪上,並焊 接金屬塊270與焊料層292,以將第一助溶劑·夹在金 屬塊280與基板210之間。如此一來,當基板21〇卞方的 加熱器250發熱時,基板210上方的第一助熔劑26〇可有 助於使其上的金屬塊270熔融。 然後,請參考圖4C,透過點焊機(未繪示)對橋接 線280進行焊接製程,以將橋接線28〇的第一端282&與第 二端282b分別固定於第一子電極222的本體部222&上以 及第一延伸部222b上。其中,焊接的方法可利用錫膏、電 弧焊接、超音波焊接、雷射焊接、熱壓焊接或熔接等方式。 當然,於其他未繪示的實施例中,亦可利用打線機(stud bump machine)形成一凸塊(意即形成橋接線28〇的第一 端282a)於第一子電極222之本體部222a上,並將打線 向上延伸一段距離,然後再轉向下拉線到第一子電極222 之第一延伸部222b上後(意即形成橋接線28〇的第二端 282b)扯線(stitch)抽離,而形成橋接線28〇。 最後,請參考圖4D,於金屬塊27〇與橋接線28〇之 間、橋接線280之第一端282a與第一子電極222之本體部 222a之間以及橋接線280之第二端282b與第一子電極222 17 201137914 ........-l'W 33983twf.doc/n 之第一延伸部222b之間填入第二助熔劑265,並經由加熱 (例如140 C以上)約30分鐘後冷卻5分鐘而完成保護元 件200a於基板210之第一表面212上的製程。 圖5A為本發明之另一實施例之一種保護元件的俯視 示意圖。圖5B繪示為圖5A之保護元件的仰視示意圖。圖 5C繪示為圖5A之保護元件沿線ΠΙ-ΙΙΙ的剖面示意圖。請 同時參考圖5A、圖5B以及圖5C,在本實施例中,圖5A 〜圖5C之保遵元件200c與圖2A〜圖2D之保護元件200a 相似,惟二者主要差異之處在於:圖5A〜圖5C之保護元 件200c的加熱器250、第二延伸部322c、第三延伸部324a 皆配置於基板210的第一表面212上,且保護元件2〇〇c 之上電極320的設計不同於前述實施例之上電極220的設 計。。 詳細而言,在本實施例中,上電極32〇的第一子電極 322更具有一第二延伸部322c以及一接合部323,其中接 合部323連接第一延伸部322b,且橋接線280的第二端 282b固定於接合部323上。第二子電極324具有一第三延 伸部324a。第二延伸部322c與第三延伸部324a配置於第 三子電極326與第四子電極328之間’而加熱器250位於 基板210的第一表面212上且連接第二延伸部322c與第三 延伸部324a。絕緣層294配置於第一延伸部322b與第二 延伸部322c及第三延伸部324a之間,意即第一延伸部 322b位於絕緣層294的一表面上,而第二延伸部322c及 第三延伸部324a位於絕緣層294的另一相對的表面上。特 18 201137914 ------ίϋΙ-TW 33983twf.doc/n 別是,第一延伸部322b、第二延伸部322c、第三延伸部 324a於絕緣層294上的正投影彼此不重疊。 此外,第一助熔劑260配置於絕緣層294上,且位於 第一延伸部322b與第三子電極326之間,以及位於第一延 伸部322b與第四子電極328之間。金屬塊27〇覆蓋部分的 第二子電極326、第一助熔劑260、第一延伸部322b與第 四子電極328,以使第一助熔劑260位於金屬層27〇與絕 緣層294之間。如此一來,當加熱器25〇加熱時,熱可透 過第一電極322的第一延伸部322b快速傳導到金屬塊 270,且藉由第一助熔劑26〇設置減少或除去金屬塊2川 在正常電流作動下產生的表面氧化層,以進一步提高與確 保金屬塊270快速溶融的可靠性。 值得注意的是’在本實施例中,保護元件200c之下 電極33〇具有依序對應第一子電極322、第二子電極324、 第二子電極326以及第四子電極328配置的一第五子電扭 332、一第六子電極334、一第七子電極336與一第八子帑 極、338。然於另—實施例中,下電極330亦可依設計需. 而’又有第五子電極332,以在基板21〇之第二表面2丨4 : 形成空腳位設計’提高保護元件組裝於電路板(未 之擺放方向正確度。 ) 立圖』6為本發明之另一實施例之一種保護元件的剖面厂 μ圖味麥考圖6 ,在本實施例中,圖6之保護元件2%、 與圖2Α〜圖2D之保護元件2〇〇a相似,惟二者主要差異 之處在於.® 6之保護元件200d包括-殼體296。詳乡田^ 19 201137914 一 _·1 W 33983twf.doc/n 言,殼體296配置於基板21〇的第一表面212上,且覆蓋 ^塊270’用以保護金屬塊27〇,且可避免溶融態^ 屬、第-助溶劑細 '第二助溶劑265以及焊料層292流 ^出來而發生電路干擾等問題。此外,殼體2%的材質包 呂、?二_咖EK)、尼龍(nyl〇n)、熱塑性樹脂、 务外光硬化树脂或盼甲趁樹脂等材料。 去故值付提的疋,上述之實施例僅為舉例說明,於其他 t:的SC ’本領域的技術人員當可參照前述實施例 到所需的技術效果。 運 _圖7繪示為本發明之一實施例之— 示意圖。請參考圖7,由上述者浐存丨邮、+、 乂 鬼 Γ弋n料这男、施例所述之的保護元件20〇a 上,兀件細b,0d)可以與一電池4 f ]器獨祕而組合成—電子裝置_。料來說I! ”40(3外接-電源供應器似日 ^二^ 電池410進行充放電料 ::于裝置400中的 至保ϋ此οππ 在本貫轭例中,電池410耦棬 ^邊το件20〇a。_控制器4 锋 其中偵測控制器430例如是—=蔓 屬氧化物場效電晶體(m〇sf (IC)日日片及一金 至保護科綱a,用i。^供應請軸 當偵測控制器430偵_二:, 器43 0會將此高電壓(未 包昼過南日寸’偵測控制 熱器250(請參考圖2D),、於保護兀件2G0a的力σ " ,以熔斷金屬塊270 (請參考_ 20 J01-TW 33983twf.doc/n 201137914 2D)。再者’當電源供應器52〇提供一過電流(未 通過保護元件2GGa時,賴元件鳥巾的金屬塊2日7〇备 因過電流通過而自動加熱_。由於,在本實施例中,; 子裝置_是_上述之紐元件贏(或保護^ 200b〜200d) ’因此除了可確實切斷電路而達成有效防止 卜。’:可避免保護元件鳥產生短路的現 象,使電子裴置4〇〇具有較佳的可靠度。 综上所述,本發明至少具有下列功效: 1. 本^明之保護元件具树接於金屬塊上方的橋 J,因此&加熱器加熱而使金屬塊呈現溶融狀態時, 的金屬塊會因表面張力與毛細現象 ^ 成有效防止過電ΐΐ過2 Μ咖斷電路而達 2. 由於本發明之金屬塊㈣魄域僅發生於 ==重疊的區域及其周圍’因此金屬塊的表“ 劑氧化層’可減少- 3. 由於本發明之金屬塊的熔化量 咖的金由屬塊導通延伸部㈣極而產生短路的現:降低 接缞且有本發明之橋接線的材質為金屬或合金,因此橋 '、有散熱的功能,可提高保護元 =積與有 配小尺:=Γ ,因此當保護元件為了搭 之電子產扣而縮小其元件體積時,其亦能提供相 21 201137914 •TW 33983twf.doc/n 應的有效電極面積並搭配適當的橋接線,可以確保金屬塊 能迅速熔斷’具有較佳的可靠度。 6. 本發明之保護元件的橋接線之縱切面的面積與金 屬塊截面積的比值大於等於2.6,可確保金屬塊有效熔斷 的可靠度。 7. 本發明之保護元件的設計可快速且確實地熔斷金 屬塊於第一子電極與橋接線在基板之第一表面上的正投影 至少部份重疊,以避免金屬塊其他的區域產生熔融而導致 電性短路的現象。 雖然本發明已以實施例揭露如上,然其並非用以限定 本發明’任何所屬技術領域中具有通常知識者,在不脫離 本發明之精神和範#可作些許之更動與潤飾,故本 發明之保護翻當視_之申請專利所界定者為準。 【圖式簡單說明】 圖1綠示習知的-種防護元件的剖面示意圖。 圖2A為本發明之一實施例之一種保護元件的俯視示 圖2BI會示為圖2八之保護元件的仰視示意圖。 圖2C繪示為圖从之保護元件 圖2D繪示為圖2八之保嘈_灿 』囟不思圖。Vu 1 -TW 33983twf.doc/n Area ratio The ratio of the area of the longitudinal section of the bridge to the area of the metal block 2.604 2.667 2.731 2.794 4.233 2.275 1.820 2.604 Whether to dissolve OK OK OK OK NG NG NG The protection will be described in detail below. How to make the component 2〇〇a. 4a to 4D are plan views showing the process of the protective element according to an embodiment of the present invention. The component names and reference numerals in FIGS. 4A to 4D are the same as those in FIG. 2 to FIG. 2D, and the materials are the same, and thus will not be described again. For the convenience of description, the process of the second surface 214 of the substrate 21 is omitted in the present embodiment, and the process on the first surface 212 of the substrate 21 is shown only in Figs. 4A to 4D. First, referring to FIG. 4A, a substrate 210 is provided, and an upper electrode 220 is formed on the first surface 212 of the substrate 210. The upper electrode 220 has a first sub-electrode 222 and a second sub-electrode 224 opposite to each other and a third sub-electrode 226 and a fourth sub-electrode 228 opposite to each other. It should be noted that in other embodiments, the upper electrode 22A may not include the second sub-electrode 224' and does not affect the overcurrent and overvoltage protection effects. The first sub-electrode 222 has a body portion 222a and a first extension portion 222b connected to the body portion 222a, wherein the first extension portion 222b is located between the third sub-electrode 226 and the fourth sub-electrode 228. Referring again to FIG. 4A, a solder layer 292 is formed between the third sub-electrode 226, the fourth sub-electrode 228, and the first extension 222b, for example, by coating. Then, a first helper solvent 260 is formed on the substrate 210 between the third sub-electrode 226, the fourth sub-electrode 228, and the first extension portion 222b, for example, by coating. In other embodiments, when the material of the solder layer 292 includes a solder alloy and a fluxing material, for example, 16 201137914~-v"J01-TW 33983twf_doc/n 10 15/. The method of forming the first lubricant 260 includes heating the tantalum layer 292 (eg, 120 t or more) to soften the flux material and flowing to the substrate between the third sub-electrode 226, the fourth electrode 228, and the first extension 222b. 21 〇. Next, referring to FIG. 4B, a metal block 27 is disposed on the third sub-electrode 226, the fourth sub-electrode .228, and the extension portion 2, and the metal block 270 and the solder layer 292 are soldered to be first. The cosolvent is sandwiched between the metal block 280 and the substrate 210. As a result, when the heater 250 of the substrate 21 is heated, the first flux 26 above the substrate 210 can help to melt the metal block 270 thereon. Then, referring to FIG. 4C, the soldering process is performed on the bridge wire 280 through a spot welding machine (not shown) to fix the first end 282 & and the second end 282 b of the bridge wire 28 to the first sub-electrode 222 respectively. The body portion 222 & and the first extension portion 222b. Among them, the soldering method can be performed by solder paste, arc welding, ultrasonic welding, laser welding, thermocompression bonding or welding. Of course, in other embodiments not shown, a bump can also be used to form a bump (that is, the first end 282a of the bridge wire 28 is formed) on the body portion 222a of the first sub-electrode 222. Up, and extending the wire upward for a distance, and then turning the pull-down line onto the first extension 222b of the first sub-electrode 222 (that is, forming the second end 282b of the bridge wire 28〇) is pulled away And the bridge wire 28〇 is formed. Finally, please refer to FIG. 4D, between the metal block 27〇 and the bridge line 28〇, between the first end 282a of the bridge line 280 and the body portion 222a of the first sub-electrode 222, and the second end 282b of the bridge line 280. The second flux 265 is filled between the first extensions 222b of the first sub-electrode 222 17 201137914 . . . -l'W 33983 twf.doc/n, and is heated (for example, 140 C or more). After 30 minutes, the process of protecting the component 200a on the first surface 212 of the substrate 210 is completed by cooling for 5 minutes. Figure 5A is a top plan view of a protective element in accordance with another embodiment of the present invention. FIG. 5B is a bottom view of the protection element of FIG. 5A. Figure 5C is a cross-sectional view of the protective element of Figure 5A taken along line ΙΙΙ-ΙΙΙ. Referring to FIG. 5A, FIG. 5B and FIG. 5C simultaneously, in the present embodiment, the security component 200c of FIGS. 5A to 5C is similar to the protection component 200a of FIGS. 2A to 2D, but the main difference between the two is: The heater 250, the second extension portion 322c, and the third extension portion 324a of the protection element 200c of FIG. 5C are disposed on the first surface 212 of the substrate 210, and the design of the electrode 320 above the protection element 2〇〇c is different. The design of the electrode 220 above the previous embodiment. . In detail, in the embodiment, the first sub-electrode 322 of the upper electrode 32A further has a second extending portion 322c and a joint portion 323, wherein the joint portion 323 is connected to the first extending portion 322b, and the bridge wire 280 is The second end 282b is fixed to the joint portion 323. The second sub-electrode 324 has a third extension 324a. The second extension portion 322c and the third extension portion 324a are disposed between the third sub-electrode 326 and the fourth sub-electrode 328 ′ while the heater 250 is located on the first surface 212 of the substrate 210 and connects the second extension portion 322c and the third portion. Extension 324a. The insulating layer 294 is disposed between the first extending portion 322b and the second extending portion 322c and the third extending portion 324a, that is, the first extending portion 322b is located on a surface of the insulating layer 294, and the second extending portion 322c and the third portion The extensions 324a are located on the other opposing surface of the insulating layer 294. In particular, the orthographic projections of the first extension portion 322b, the second extension portion 322c, and the third extension portion 324a on the insulating layer 294 do not overlap each other. In addition, the first flux 260 is disposed on the insulating layer 294 and between the first extension portion 322b and the third sub-electrode 326, and between the first extension portion 322b and the fourth sub-electrode 328. The metal block 27 covers a portion of the second sub-electrode 326, the first flux 260, the first extension 322b, and the fourth sub-electrode 328 such that the first flux 260 is between the metal layer 27 and the insulating layer 294. In this way, when the heater 25 is heated, the heat can be quickly transmitted to the metal block 270 through the first extension portion 322b of the first electrode 322, and the metal block is reduced or removed by the first flux 26〇. The surface oxide layer produced under normal current operation further improves the reliability of ensuring rapid melting of the metal block 270. It should be noted that in the present embodiment, the lower electrode 33 of the protection element 200c has a first configuration corresponding to the first sub-electrode 322, the second sub-electrode 324, the second sub-electrode 326, and the fourth sub-electrode 328. The five sub-torques 332, a sixth sub-electrode 334, a seventh sub-electrode 336 and a eighth sub-drain, 338. However, in another embodiment, the lower electrode 330 may also be designed according to the design. And the fifth sub-electrode 332 has a second surface 2丨4 on the substrate 21〇: forming an empty design design to improve the protection component assembly. In the circuit board (the direction of the placement is not correct.) Figure 6 is a cross-section of the protective element of another embodiment of the present invention, the texture of the map, in the present embodiment, the protection of Figure 6 The element 2% is similar to the protection element 2A of FIG. 2A to FIG. 2D, but the main difference between the two is that the protection element 200d of the ® 6 includes a housing 296. Detailed description of the township ^ 19 201137914 a _ 1 W 33983twf.doc / n, the housing 296 is disposed on the first surface 212 of the substrate 21 ,, and covers the block 270 ′ to protect the metal block 27 〇, and can be avoided The molten state, the first-cosolvent fine 'second assist solvent 265, and the solder layer 292 flow out to cause circuit interference and the like. In addition, 2% of the material of the housing is covered with LV? 2 _ EK EK), nylon (nyl 〇 n), thermoplastic resin, external light curing resin or expectant enamel resin and other materials. The above embodiments are merely illustrative, and those skilled in the art of other t: SC's can refer to the foregoing embodiments to the desired technical effects. Figure 7 is a schematic view of an embodiment of the present invention. Please refer to FIG. 7 , which can be stored on the protection element 20〇a of the male and the embodiment, and the element b, 0d) can be combined with a battery 4 f. The device is uniquely combined into an electronic device. It is expected that I! ”40 (3 external connection - power supply like day ^ 2 ^ battery 410 for charging and discharging material:: in the device 400 to protect this οππ in the yoke example, the battery 410 coupled to the side Το件20〇a._Controller 4 front where the detection controller 430 is, for example, a - MOSFET oxide field effect transistor (m〇sf (IC) day film and a gold to protection class a, with i ^ Supply the axis when the detection controller 430 detects _ 2:, the device 43 0 will this high voltage (not included in the South Japan) detection control heater 250 (please refer to Figure 2D), in the protection 兀Piece 2G0a force σ " to blow metal block 270 (please refer to _ 20 J01-TW 33983twf.doc/n 201137914 2D). In addition, 'when the power supply 52 〇 provides an overcurrent (when the protection element 2GGa is not passed) The metal block of the bird's towel is automatically heated by the passage of current through the 2nd 7th. Since, in this embodiment, the sub-device_ is the above-mentioned key component win (or protection ^ 200b~200d)' Therefore, in addition to the fact that the circuit can be surely cut off, an effective prevention can be achieved. ': It can avoid the phenomenon that the protection element bird is short-circuited, and the electronic device 4 〇〇 has better reliability. In summary, the present invention has at least the following effects: 1. The protective element of the present invention is connected to the bridge J above the metal block, so that when the heater is heated to cause the metal block to be in a molten state, the metal block will Due to the surface tension and capillary phenomenon, it is effective to prevent the over-current from being over 2 Μ 断 而 2 2. 2. 2. 2. 2. 2. 2. 2. 2. The "oxidation layer of the agent" can be reduced - 3. Since the amount of melting of the metal block of the present invention is caused by the gold-based block conduction extension (four) pole, the short-circuit is present: the material of the bridge connection of the present invention is metal Or alloy, so the bridge', with the function of heat dissipation, can improve the protection element = product and the small ruler: = Γ, so when the protection component shrinks its component volume for the electronic production buckle, it can also provide phase 21 201137914 • TW 33983twf.doc/n The effective electrode area and the appropriate bridge wire can ensure that the metal block can be quickly blown' with better reliability. 6. The area of the longitudinal section of the bridge wire of the protection element of the invention With metal The ratio of the cross-sectional area is greater than or equal to 2.6, which ensures the reliability of the effective melting of the metal block. 7. The protective element of the present invention is designed to quickly and surely blow the metal block on the first sub-electrode and the bridge wire on the first surface of the substrate The orthographic projections are at least partially overlapped to avoid melting of the other regions of the metal block to cause electrical shorts. Although the invention has been disclosed in the above embodiments, it is not intended to limit the invention to any of the technical fields of the invention. Generally, those skilled in the art can make some modifications and refinements without departing from the spirit and scope of the present invention. Therefore, the protection of the present invention is defined by the patent application. BRIEF DESCRIPTION OF THE DRAWINGS Fig. 1 is a schematic cross-sectional view showing a conventional protective element. 2A is a top plan view of a protective element according to an embodiment of the present invention. FIG. 2B is a bottom view of the protective element of FIG. FIG. 2C is a diagram showing the protection component of FIG. 2D. FIG. 2D is a diagram of FIG.

曰丁㈣2A之保護讀沿線π_π的剖面示意 示意圖 ,从為本發明之另一實施例之—種保護元件的剖面 201137914 xvjL-/-uy^001 -TW 339S3twf.doc/n 圖3B為本發明之又一實施例之一種保護元件的剖面 示意圖。 圖4A〜圖4D繪示本發明一實施例之保護元件的製程 俯視圖。 圖5A為本發明之另一實施例之一種保護元件的俯視 示意圖。 圖5B繪示為圖5A之保護元件的仰視示意圖。 圖5C繪示為圖5A之保護元件沿線III-III的剖面示意 圖。 圖6為本發明之另一實施例之一種保護元件的剖面示 意圖。 圖7繪示為本發明之一實施例之一種電子裝置的方塊 示意圖。 【主要元件符號說明】 100 :溫度保險絲封裝體 110 :基板 120 :加熱器 125 :加熱器電極 130 :絕緣層 140 :金屬層 150 :助焊劑 160 :電極層 165 :中間電極 201137914 jtu^-ui/yuui-TW 33983twf.doc/n 200a、200b、200b’、200c、200d :保護元件 210 :基板 212 :第一表面 214 :第二表面 216 :側表面 220、320 :上電極 222、322 :第一子電極 222a、322a :本體部 222b、322b :第一延伸部 222c :第二延伸部 224、324 :第二子電極 224a :第三延伸部 226、326 :第三子電極 228、328 :第四子電極 230、330 :下電極 232、332 :第五子電極 232a、322c :第二延伸部 234、334 :第六子電極’ 234a、324a :第三延伸部 236、336 :第七子電極 238、338 :第八子電極 240、340 :端電極 250 :加熱器 260 :第一助熔劑 201137914Schematic diagram of the cross section of the protective read along the line π_π of the (丁(4) 2A, from the cross section of the protective element of another embodiment of the present invention 201137914 xvjL-/-uy^001 - TW 339S3twf.doc/n FIG. 3B is the present invention A cross-sectional view of a protective element of yet another embodiment. 4A to 4D are plan views showing a process of a protective element according to an embodiment of the present invention. Figure 5A is a top plan view of a protective element in accordance with another embodiment of the present invention. FIG. 5B is a bottom view of the protection element of FIG. 5A. Figure 5C is a cross-sectional view of the protective element of Figure 5A taken along line III-III. Figure 6 is a cross-sectional view of a protective element in accordance with another embodiment of the present invention. FIG. 7 is a block diagram of an electronic device according to an embodiment of the invention. [Description of Main Components] 100: Thermal Fuse Package 110: Substrate 120: Heater 125: Heater Electrode 130: Insulation Layer 140: Metal Layer 150: Flux 160: Electrode Layer 165: Intermediate Electrode 201137914 jtu^-ui/ yuui-TW 33983twf.doc/n 200a, 200b, 200b', 200c, 200d: protection element 210: substrate 212: first surface 214: second surface 216: side surface 220, 320: upper electrode 222, 322: first Sub-electrodes 222a, 322a: body portions 222b, 322b: first extensions 222c: second extensions 224, 324: second sub-electrodes 224a: third extensions 226, 326: third sub-electrodes 228, 328: fourth Sub-electrodes 230, 330: lower electrodes 232, 332: fifth sub-electrodes 232a, 322c: second extensions 234, 334: sixth sub-electrodes '234a, 324a: third extensions 236, 336: seventh sub-electrode 238 338: eighth sub-electrode 240, 340: terminal electrode 250: heater 260: first flux 201137914

…J01-TW 33983twf.doc/n 265 :第二助熔劑 269 :輔助介質 270 :金屬塊 280、280a、285 :橋接線 282a :第一端 282b :第二端 292 :焊料層 294 :絕緣層 296 :殼體 323 :接合部 400 :電子裝置 410 :電池 430 :偵測控制器 520 :電源供應器 D、D1 :間隔距離... J01-TW 33983twf.doc/n 265: second flux 269: auxiliary medium 270: metal block 280, 280a, 285: bridge wire 282a: first end 282b: second end 292: solder layer 294: insulating layer 296 : housing 323 : joint portion 400 : electronic device 410 : battery 430 : detection controller 520 : power supply D, D1 : separation distance

2525

Claims (1)

201137914 33983twf.doc/n 七、申請專利範圍: 1. 一種保護元件,包括: •端電極 加熱器 一基板,具有彼此相對的一第一表面與—第二表面; 一上電極,配置於該基板的該第一表面上,包括一第 一子電極及彼此相對的一第三子電極與一第四子電極; 下電極,配置於該基板的該第二表面上; 連接該上電極與該下電極·, 配置於該基板上,且電性連接該第一子電 極; —一金屬塊,配置於該基板的該第一表面上,且連接該 第三子電極與該第四子電極;以及 ^至少一橋接線,配置於該金屬塊的上方並部分接觸於 該金屬塊,且具有彼此相對的一第一端及一第二端,其中 f橋接線的該第定於該第—子電極上,且該橋接線 f該基板之該第-表面上的正投影與該第—子電極在該基 板之該第一表面上的正投影至少部份重疊。 2. 如申4專利範圍第丨項所述之保護元件,其中該第 子電極具有-本财以及與該本體部相連接的—第一延 伸部,且該第-延伸部位於該第三子電極與該第四子電極 之間。 3. 如申請專觸圍第2項所述之保護締,其中該松 接線的該第二端固定於該第—延伸部上。 σ 4. 如申清專利乾圍第2項所述之保護元件,其令該择 接線的該第-顧定魏本體部上,該第二端岐於該^ 26 .001-TW 33983twf.doc/n 201137914 一延伸部上。 5. 如申請專利範圍第2項所述之保護元件,盆中 -延伸部所在的區域㈣為—有效電極面積,而該橋接 1 =切面的©積與該有效電極面積之面積的比值大於等於 6. 如申請專利範圍第2項所述之保護元件,_ ,,第-延伸部之延伸方向的長度乘上該金屬塊的^ 2件之乘義為—金屬塊截面積,而該橋接線之縱切 、面積與該金屬塊截面積的比值大於等於2 6。 7. 如申請專鄕圍第2項所述之保護元件,1中 伸:延伸至該加熱器的上方,且該橋接線在該基板之 Ϊίΐ面上的正投影與該第—延伸部在該基板之該第一 表面上的正投影至少部份重疊。 接轉請專利範圍第1項所述之保護元件,其中該橋 ㈣點與該金屬塊遠離該基板的—側表面相隔一間 ^距離’該間隔距離介於〇 mm至。.25軸之間。 9·如巾凊專利範圍第丨項所述之保護元件,更包含一 炫〔彳’配置於該基板的該第—表面上,並位於該第 —電極以及該第四子電極之間。 — π10· *申請專利範圍第1項所述之保護元件,更包含 弟一助熔劑配置於該橋接線與該金屬塊之間。 11·如申睛專利範圍第丨項所述之保護元丈中該 橋接線的觀為__或—彎折狀。 ,、 12.如申请專利範圍第丨項所述之保護元件,其中該 27 201137914 ινιν-υ^7υυι-Τ\ν 33983twf.doc/n 加熱器位於該基板的該第二表面上,且連接該下電極。 下電極具= 該 上電:更第1項所述之保護元件,其中該 上且連接該第第器位於該第-表面201137914 33983twf.doc/n VII. Patent Application Range: 1. A protective component comprising: • a terminal electrode heater, a substrate having a first surface and a second surface opposite to each other; an upper electrode disposed on the substrate The first surface includes a first sub-electrode and a third sub-electrode and a fourth sub-electrode opposite to each other; a lower electrode disposed on the second surface of the substrate; connecting the upper electrode and the lower surface An electrode is disposed on the substrate and electrically connected to the first sub-electrode; a metal block disposed on the first surface of the substrate and connecting the third sub-electrode and the fourth sub-electrode; At least one bridge wire is disposed above the metal block and partially in contact with the metal block, and has a first end and a second end opposite to each other, wherein the f-bridge wire is disposed on the first sub-electrode And the bridge projection f the orthographic projection on the first surface of the substrate at least partially overlaps the orthographic projection of the first sub-electrode on the first surface of the substrate. 2. The protection element of claim 4, wherein the first sub-electrode has a first extension connected to the body portion, and the first extension is located in the third sub-portion Between the electrode and the fourth sub-electrode. 3. If the application is specifically directed to the protection described in item 2, the second end of the loose connection is fixed to the first extension. σ 4. If the protection element described in item 2 of the patent stipulations is applied, the second end of the singularity of the singularity of the singularity of the singularity of the singularity of the singularity /n 201137914 On an extension. 5. As claimed in claim 2, the region (4) in which the basin-extension portion is located is the effective electrode area, and the ratio of the product of the bridge 1 = section to the area of the effective electrode area is greater than or equal to 6. As claimed in claim 2, the length of the extension direction of the first extension portion multiplied by the length of the metal block is - the cross-sectional area of the metal block, and the bridge wire The ratio of the longitudinal section and the area to the cross-sectional area of the metal block is greater than or equal to 26. 7. If the application is specifically for the protection element described in item 2, the extension of 1 is extended above the heater, and the orthographic projection of the bridge on the Ϊ ΐ surface of the substrate and the first extension are The orthographic projections on the first surface of the substrate at least partially overlap. The protection component of claim 1, wherein the bridge (four) point is spaced apart from the side surface of the metal block by a distance ^ ’ mm to. Between the .25 axes. 9. The protective element of claim 2, further comprising a 彳 彳 disposed on the first surface of the substrate between the first electrode and the fourth sub-electrode. — π10· * The protective element described in claim 1 of the patent application, further comprising a flux disposed between the bridge wire and the metal block. 11. The view of the bridge connection in the protection of the Yuanzhang as stated in the scope of the patent scope is __ or - bent. 12. The protective element of claim 2, wherein the 27 201137914 ινιν-υ^7υυι-Τ\ν 33983twf.doc/n heater is located on the second surface of the substrate and is connected Lower electrode. Lower electrode member = the power-on: the protection element according to the item 1, wherein the first device is connected to the first surface 15·如U利範圍帛1項所述之賴元件勺 一絕緣層.,覆蓋該加熱器。 0括 16.如申請專利範圍第i項所述之保護元件 成版’配置於該基板的該第—表面上,且覆蓋該金屬塊 —種保護元件,包括: 一基板,具有彼此相對的一第一表面與一第二表面. —上電極,配置於該基板的該第一表面上,包第 子電極及彼此相對的一第三子電極與—第四子電極;15. Cover the heater with an insulating layer as described in Section 1-5 of the U. 0. The protective element forming plate as described in claim i is disposed on the first surface of the substrate, and covers the metal block-protective element, comprising: a substrate having one opposite to each other a first surface and a second surface. The upper electrode is disposed on the first surface of the substrate, including a first sub-electrode and a third sub-electrode and a fourth sub-electrode opposite to each other; 一下電極,配置於該基板的該第二表面上; , 一端電極,連接該上電極與該下電極; —加熱态,配置於該基板上,且電性連接該第—子電 且連接該 一金屬塊,配置於該基板的該第一表面上, 弟二子電極與該第四子電極; 至少一橋接線,配置於該金屬塊的上方,且具有彼此 相對的一第一端及一第二端,其中該橋接線的該第—端固 28 201137914 KU-uyy〇01-TW 33983twf.doc/n 子電極上,J'該橋接線在該基板之該第-表面 、正技影與該第一子電極在該基板 ^ 投影至少部份重疊;以及 就’表面上的正 一辅助介質’配置於該橋接線與該金屬塊之間。 R如申請專利範圍第17項所述之保護元件, 自助介質為一助溶劑或一焊料層。 〃〜 19.—種電子裝置,包括: 如申請專利範圍第1項或第17項所述之保護元件; 一電池,耦接至該保護元件;以及 ’ 、一偵測控制器,耦接至該保護元件與該電池,其中者 2測控制器偵測到__過電壓狀態時,該偵測控制器會二 ς電壓至該保護元件,而驅動該保護元件的該加熱器 4熱’赠斷該金屬塊。 、°° C 29a lower electrode is disposed on the second surface of the substrate; an one end electrode is connected to the upper electrode and the lower electrode; a heating state is disposed on the substrate, and electrically connected to the first sub-electricity and connected to the first electrode a metal block disposed on the first surface of the substrate, the second sub-electrode and the fourth sub-electrode; at least one bridge wire disposed above the metal block and having a first end and a second end opposite to each other , wherein the first end of the bridge wire is 28 201137914 KU-uyy〇01-TW 33983 twf.doc/n on the sub-electrode, J' the bridge is on the first surface of the substrate, the positive shadow and the first The sub-electrodes are at least partially overlapped on the substrate ^; and a positive-assisted medium on the surface is disposed between the bridge and the metal block. R. The protective element according to claim 17, wherein the self-service medium is a co-solvent or a solder layer. 〃~ 19.-Electronic device, comprising: a protection component as described in claim 1 or 17; a battery coupled to the protection component; and a detection controller coupled to The protection component and the battery, wherein the detection controller detects the __overvoltage state, the detection controller will apply voltage to the protection component, and the heater 4 driving the protection component is hot Break the metal block. ,°° C 29
TW099111958A 2009-09-04 2010-04-16 Protective device and electronic device TWI452592B (en)

Priority Applications (5)

Application Number Priority Date Filing Date Title
TW099111958A TWI452592B (en) 2010-04-16 2010-04-16 Protective device and electronic device
JP2010198242A JP5192524B2 (en) 2009-09-04 2010-09-03 Protective device
US12/875,771 US9129769B2 (en) 2009-09-04 2010-09-03 Protective device
KR1020110034765A KR101354096B1 (en) 2010-04-16 2011-04-14 Protective device
US13/962,837 US9336978B2 (en) 2009-09-04 2013-08-08 Protective device

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TWI484520B (en) * 2013-07-17 2015-05-11 Cyntec Co Ltd Protective element and overcurrent/overvoltage protective module
CN105340042A (en) * 2013-05-02 2016-02-17 迪睿合株式会社 Protective element

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JP2001325869A (en) * 2000-05-17 2001-11-22 Sony Chem Corp Protective element
JP4207877B2 (en) * 2004-10-04 2009-01-14 ソニーケミカル&インフォメーションデバイス株式会社 Protection circuit
TW200926239A (en) * 2007-12-12 2009-06-16 hong-zhi Qiu Microchip fuse structure and its manufacturing method
JP5072796B2 (en) * 2008-05-23 2012-11-14 ソニーケミカル&インフォメーションデバイス株式会社 Protection element and secondary battery device

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Publication number Priority date Publication date Assignee Title
CN105340042A (en) * 2013-05-02 2016-02-17 迪睿合株式会社 Protective element
TWI681702B (en) * 2013-05-02 2020-01-01 日商迪睿合股份有限公司 Protection element
TWI484520B (en) * 2013-07-17 2015-05-11 Cyntec Co Ltd Protective element and overcurrent/overvoltage protective module

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