TW201136695A - Laser cutting method for bulk amorphous alloy - Google Patents

Laser cutting method for bulk amorphous alloy Download PDF

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TW201136695A
TW201136695A TW99112433A TW99112433A TW201136695A TW 201136695 A TW201136695 A TW 201136695A TW 99112433 A TW99112433 A TW 99112433A TW 99112433 A TW99112433 A TW 99112433A TW 201136695 A TW201136695 A TW 201136695A
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Taiwan
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pulsed laser
amorphous alloy
cutting method
cutting
bulk amorphous
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TW99112433A
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Chinese (zh)
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TWI417161B (en
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Xiao-Bo Yuan
Yi-Min Jiang
Yang-Yong Li
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Hon Hai Prec Ind Co Ltd
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Abstract

A cutting method for a bulk amorphous alloy having a critical cooling rate and a glass transition temperature, includes: positioning a cutting portion of the bulk metallic glass in an atmosphere of a cooling inert gas; cutting the cutting portion of the bulk metallic glass to form a cutting surface via a plus laser, the cutting step including heating the cutting portion to a temperature above the melt point during a period of a high level of one cycle, and cooling the cutting portion to a temperature below the glass transition temperature with a cooling rate exceeding the critical cooling rate during a period of a low level of the cycle; and finally removing the burr produced during the cutting step.

Description

201136695 六、發明說明: 【發明所屬之技術領域】 [0001] 本發明涉及一種非晶合金之切割方法,尤其涉及一種塊 體非晶合金之脈衝雷射切割方法。 【先前技術】 [0002] 於足夠高之冷卻速度下,液態合金可避免通常之結晶過 程,而過冷至某一溫度(一般稱為玻璃態轉化溫度Glass Transition Temperature)以下時,其内部原子珠結 於液態時所處之位置附近,從而形成非晶合金 (Amorphous Alloy,or Metallic Glass)。塊體非 晶合金(Bulk metallic glass)通常係指最小合成厚度 或直徑大於等於1毫米之非晶合金。塊體非晶合金以其較 高之強度、韌性、耐磨性' 耐蝕性、優良之軟磁性與超 導特性等特點,於電子、機械、化工等行業已得到廣泛 應用。 [0003] 於製造結構較為複雜之塊體非晶合金產品時,通常需先 藉由洗鑄或壓鑄等方式製造出預成品,然後藉由切割之 方式將預成品加工成產品。常見之切割方法有如下幾種 :(1)使用刀具或砂輪進行機械切割;(2〇線切割;(3) 雷射切割。惟,由於非晶合金硬度較高,採用機械切割 之方法加工時刀具磨損情況十分嚴重,且加工精度較低 ,難以達到微米級。線切割之缺點係切割表面品質粗糙 ,有明顯之切割紋路;且加工速度較慢,不適合大規模 批量生產。 [0004] 請參閱圖11,所示為使用傳統之雷射切割方法對塊體非 099112433 表單編號A0101 第4頁/共23頁 0992022035-0 201136695 [0005] [0006] Ο Q [0007] [0008] [0009] 晶合金樣品進行切割後樣品切割面之照片。由圖η可知 ’由於雷射之能量較高’於加卫過程中易於產品局部產 生…、效應,導致切割面產生晶化變性、濺污以及毛刺等 缺,極大影響切割後產品之機械性能及外觀品質。 【發明内容】 有鑒於此,有必要提供一種使塊體非晶合金切割後仍保 持非晶態之切割方法。 一種塊體非晶合金之脈衝雷射切割方法,該塊體非晶合 金具有臨界冷卻速度與玻璃態轉化溫度,其包括以下步 驟.將塊體非晶合金之待切割部位置於冷卻保護氣體氛 圍令;採用脈衝雷射切割該塊體非晶合金之待切割部位 ,以形成切割面,其中於一雷射脈衝週期之高電平之時 間内,加熱塊體非晶合金之待切割部位至熔點之上;於 該雷射脈衝週期之低電平之時間内,以高於臨界冷卻速 度之速度冷卻切割面至玻璃態轉北溫度以下;及去除切 割面上於切割時產生之毛刺。 上述塊體非晶合金之切割方法探用脈衝雷射,其每—脈 衝週期内具有_段冷卻時間,可於該冷卻時間内利於冷 部保道感對切割面進行高於臨界冷卻速度之冷卻散熱 ,以使切割面仍保持非晶態。 【實施方式】 下面將結合附圖及實施方式對本發明之塊體非晶合金之 脈衝雷射切割方法作進一步詳細說明。 明參閱圖1 ’本發明實施方式之塊體非晶合金之脈衝雷射 099112433 表單編號A0101 第5頁/共23頁 0992022035-0 201136695 切割方法包括以下步驟: [0010] [0011] 步驟S1,請一併參閱圖2,提供一薄板狀塊體非晶合金樣 品10,並將該樣品1〇置於冷卻保護氣體輸出設備30之下 方。樣。〇10之材質為錯-銅_紹_錄系合金、锆-銅_紹_錄 -鈦系合金、錯-銅-紹-錄_銳系合金、結_銅_錄—欽_鍵 系合金、鍅-銅-鋁-鎳-鈹系合金及鍅_銅_鋁_鈦_鈹系合 金等塊體非晶合金中之—種。樣品10具有玻璃態轉化溫 度(Tg)及臨界冷卻速度(Rc),其厚度為〇 2毫米至1〇毫 米。開啟冷卻保護氣體輸出設備30,使冷卻保護氣體吹 向樣品10之待切割部位,由此該待切割部位置於冷卻保 護氣體氛圍中。 ... .:·. 步驟S2,使用脈衝雷射器20所產生之高能量密度之脈衝 雷射,於冷卻保護氣體之配合下切割樣品1〇之待切割部 位,以形成切割面11。其中,脈衝雷射器20可為c〇型雷 射器或Nd:YAG型雷射器,脈衝雷射發射之方向與冷卻保 護氣體流動之方向相同。具體來說,於單一脈衝週期内 ,首先於高電平之時間内,將樣品10之待切割部位之加 熱至熔點之上,並使熔融材料於一定壓力之冷卻保護氣 體之作用下吹向切割面11 一侧邊緣,冷卻形成毛刺12 ; 然後於低電平之時間内,於冷卻保護氣體之作用下,將 切割面11冷卻至樣品1 〇之玻璃態轉化溫度以下,且冷卻 速度應大於樣品10之臨界冷卻速度。本實施方式中脈 衝雷射峰值功率為0. 2千瓦至5千瓦;脈衝雷射之頻率為 100赫茲至300赫茲;脈衝雷射之脈衝寬度為〇. 2微秒至 1. 5微秒;切割速度大於3毫米/秒。冷卻保護氣體為氬氣 099112433 表單編號A0101 第6頁/共23頁 0992022035-0 201136695 氦氣及氮氣等冷卻氣體。 [0012] 步驟S3,去除毛刺12,以得到光滑、平整之切割面11。 可使用機械方式或電化學法來去除毛刺12。 [0013] 以下藉由具體實施方式來對本發明作進一步說明。 Ο [0014] 實施方式1至7為材質完全相同之塊體非晶合金樣品(組成 為:錯-銅-錄-銳-铭),使用如表1所示之不同工藝參數 進行切割。實施方式1至7之切割面之外觀照片如圖3至圖 9所示。切割完畢後,藉由檢測切割面之表面光潔情況及 毛刺情況以評價切割品質。其中:切割面品質等級係根 據樣品切割面豎直痕跡粗細,粗糙程度確定,共1-5級, 等級越高,豎直條紋越細,表面越平滑。毛刺等級係根 據樣品單位切割面長度上毛刺數量與毛刺平均長度量化 後確定,共1-5級,等級越高,毛刺數量越少且長度較短 [0015] 表1不同工藝參數對塊體非晶合金樣品所產生之影響 工藝 參數 實施 方式1 實施 方式2 實施 方式3 實施 方式4 實施 方式5 實施 方式6 實施 方式7 樣品 厚度 (ram) 0.2 0.2 0.2 5 5 10 10 峰值 功率 (KW) 0.2 0.2 0.2 3 3 3 5 切割 32 20 10 20 20 20 20 表單編號A0101 第7頁/共23頁 0992022035-0 [0016] 099112433 201136695201136695 VI. Description of the Invention: [Technical Field] The present invention relates to a method of cutting an amorphous alloy, and more particularly to a method of pulsed laser cutting of a bulk amorphous alloy. [Prior Art] [0002] At a sufficiently high cooling rate, the liquid alloy can avoid the usual crystallization process, and when it is subcooled to a certain temperature (generally called Glass Transition Temperature), its internal atomic beads Amorphous alloy (or Metallic Glass) is formed near the position where it is in a liquid state. Bulk metallic glass generally refers to an amorphous alloy having a minimum synthetic thickness or a diameter of 1 mm or more. Bulk amorphous alloys have been widely used in electronics, machinery, and chemical industries due to their high strength, toughness, wear resistance, corrosion resistance, excellent soft magnetic properties and superconducting properties. [0003] In the manufacture of a bulk amorphous alloy product having a relatively complicated structure, it is usually necessary to manufacture a pre-finished product by means of die-casting or die-casting, and then to process the pre-finished product into a product by cutting. Common cutting methods are as follows: (1) mechanical cutting with a cutter or a grinding wheel; (2 〇 line cutting; (3) laser cutting. However, due to the high hardness of the amorphous alloy, it is processed by mechanical cutting. Tool wear is very serious, and the machining accuracy is low, which is difficult to reach the micron level. The shortcomings of wire cutting are rough cutting surface quality, obvious cutting lines, and slow processing speed, which is not suitable for mass production. [0004] Figure 11, which shows the use of a conventional laser cutting method for a block other than 099112433 Form No. A0101 Page 4 / Total 23 Page 0992022035-0 201136695 [0005] [0006] Ο Q [0007] [0008] [0009] Crystal Photograph of the cut surface of the sample after cutting the alloy sample. It can be seen from the figure η that 'high energy due to laser' is easy to produce locally in the process of curing, and the effect is to cause crystallized denaturation, spatter and burr on the cut surface. The lack of, greatly affects the mechanical properties and appearance quality of the product after cutting. SUMMARY OF THE INVENTION In view of this, it is necessary to provide a bulk amorphous alloy that remains amorphous after being cut. Cutting method. A pulsed laser cutting method for a bulk amorphous alloy, the bulk amorphous alloy having a critical cooling rate and a glass transition temperature, comprising the following steps: cooling the portion to be cut of the bulk amorphous alloy Protecting the gas atmosphere; cutting the portion to be cut of the bulk amorphous alloy by pulse laser to form a cutting surface, wherein the bulk amorphous alloy is to be cut during a high period of a laser pulse period a portion above the melting point; at a low level of the laser pulse period, cooling the cut surface to a temperature below the glass transition temperature at a speed higher than the critical cooling rate; and removing burrs generated on the cut surface during cutting The cutting method of the bulk amorphous alloy described above uses a pulsed laser, which has a cooling period of _ segment per pulse period, which can facilitate the cold portion to maintain the sense of cold on the cutting surface above the critical cooling rate. Cooling heat dissipation so that the cut surface remains amorphous. [Embodiment] Pulsed laser cutting of the bulk amorphous alloy of the present invention will be described below with reference to the accompanying drawings and embodiments. The method is further described in detail. Referring to Figure 1 'Pulse laser of bulk amorphous alloy according to an embodiment of the present invention 099112433 Form No. A0101 Page 5 of 23 0992022035-0 201136695 The cutting method comprises the following steps: [0010] 0011] Step S1, please refer to FIG. 2 together to provide a thin plate-shaped bulk amorphous alloy sample 10, and place the sample 1〇 under the cooling shielding gas output device 30. The material of the 〇10 is wrong- Copper_绍_recorded alloy, zirconium-copper_绍_record-titanium alloy, wrong-copper-sho-record_ sharp alloy, knot_copper_record_chin_key alloy, bismuth-copper-aluminum- Nickel-lanthanum alloy and a kind of bulk amorphous alloy such as 鍅_copper_aluminum_titanium_lanthanum alloy. Sample 10 has a glass transition temperature (Tg) and a critical cooling rate (Rc) having a thickness of from 2 mm to 1 mm. The cooling shielding gas output device 30 is turned on to blow the cooling shielding gas toward the portion to be cut of the sample 10, whereby the portion to be cut is placed in a cooling and protecting gas atmosphere. Step: S2, using the high-energy density pulsed laser generated by the pulsed laser 20, the sample to be cut is cut with the cooperation of the cooling shielding gas to form the cutting surface 11. The pulse laser 20 can be a c〇 type laser or a Nd:YAG type laser, and the direction of the pulsed laser emission is the same as the direction in which the cooling protection gas flows. Specifically, in a single pulse period, first, the portion to be cut of the sample 10 is heated above the melting point in a high-level period, and the molten material is blown to the cutting under the action of a cooling protective gas of a certain pressure. One side of the surface 11 is cooled to form a burr 12; then, under a low level of time, under the action of the cooling shielding gas, the cutting surface 11 is cooled to below the glass transition temperature of the sample 1 ,, and the cooling rate should be greater than the sample 10 critical cooling rate. 5微米之间的切割。 In the present embodiment, the peak power of the pulsed laser is 0. 2 kW to 5 kW; the frequency of the pulsed laser is 100 Hz to 300 Hz; the pulse width of the pulsed laser is 〇. 2 microseconds to 1.5 microseconds; Speed is greater than 3 mm / sec. The cooling shielding gas is argon 099112433 Form No. A0101 Page 6 of 23 0992022035-0 201136695 Cooling gas such as helium and nitrogen. [0012] Step S3, the burrs 12 are removed to obtain a smooth, flat cutting surface 11. Mechanical or electrochemical methods can be used to remove the burrs 12. [0013] The present invention will be further described below by way of specific embodiments. [0014] Embodiments 1 to 7 are bulk amorphous alloy samples of the same material (composition: wrong-copper-record-sharp-ming), and cutting was performed using different process parameters as shown in Table 1. Photographs of the appearance of the cut faces of Embodiments 1 to 7 are shown in Figs. 3 to 9 . After the cutting is completed, the cutting quality is evaluated by detecting the smoothness of the surface of the cut surface and the burr condition. Among them: the quality grade of the cut surface is determined according to the vertical trace thickness of the cut surface of the sample, and the roughness is determined. The total grade is 1-5. The higher the grade, the finer the vertical stripes and the smoother the surface. The burr rating is determined according to the number of burrs on the length of the cutting surface of the sample unit and the average length of the burr. A total of 1-5 grades, the higher the grade, the smaller the number of burrs and the shorter length [0015] Table 1 Different process parameters for the block Effect of crystal alloy sample on process parameters Embodiment 1 Embodiment 2 Embodiment 3 Embodiment 4 Embodiment 5 Embodiment 6 Embodiment 7 Sample thickness (ram) 0.2 0.2 0.2 5 5 10 10 Peak power (KW) 0.2 0.2 0.2 3 3 3 5 Cutting 32 20 10 20 20 20 20 Form No. A0101 Page 7 / Total 23 Page 0992022035-0 [0016] 099112433 201136695

由圖3至圖9及表1可^^ [0017] (1)於其他條件相同之情況下, 切割品質變差。 隨著切割速度之降低 [0018] [0019] ⑺於其他條件相同之情况下,隨著頻率之升高,切割品 質變好;但頻率過高會造成蝴增多。 (3)於其他條件相同之情況下,隨著功率之升高切割 时質變好’且毛刺細小而敏密,易於去除。 [0020] 請參閱圖10,所干么杳# + 所不為實施方式4之切割面之X射線衍射圖 片圖中才κ軸為衍射角度,縱轴為衍射波之強度。從圖 10可知:切割面之衍射圖樣無明顯衍射峰,全部為漫散 峰,楗明樣品10經過雷射切割後並未被晶化。 剛本發明之塊體非晶合金之切财法採用脈衝雷射每一 099112433 表單編號A0101 第8頁/共23頁 0992022035-0 201136695 [0022] Ο [0023] [0024]3 to 9 and Table 1 can be used. (1) When the other conditions are the same, the cutting quality is deteriorated. As the cutting speed decreases [0018] [719] Under the same conditions, the cutting quality becomes better as the frequency increases; however, if the frequency is too high, the butterfly will increase. (3) Under the same conditions, the quality becomes better as the power is increased. The burr is fine and sensitive, and is easy to remove. [0020] Referring to FIG. 10, in the X-ray diffraction pattern of the cut surface of Embodiment 4, the κ axis is the diffraction angle, and the vertical axis is the intensity of the diffraction wave. It can be seen from Fig. 10 that the diffraction pattern of the cut surface has no obvious diffraction peaks, and all of them are diffuse peaks, and the sample 10 is not crystallized after laser cutting. The cutting method of the bulk amorphous alloy of the present invention uses pulsed laser each 099112433 Form No. A0101 Page 8 of 23 0992022035-0 201136695 [0022] Ο [0024]

[0025] [0026] 099112433 脈衝週期内具有一段冷卻時間,可於該冷卻時間内充分 利於冷卻保護氣體對切割面進行高速之冷卻散熱,以使 切割面仍保持非晶態。由於採用高精度之雷射切割,本 發明之切割方法之切割精度可達(0. 1毫米之内,可滿足 精密工程設計之要求。另,本發明之切割方法之切割速 度較快,加工效率較高,非常適合大規模工業生產使用 〇 綜上所述,本發明確已符合發明專利之要件,遂依法提 出專利申請。惟,以上所述者僅為本發明之較佳實施方 式,自不能以此限制本案之申請專利範圍1舉凡熟悉本 案技藝之人士援依本發明之精神所作之等效修佛或變化 ,皆應涵盡於以下申清專利範圍内。 【圖式簡單說明】 圖1係採用本發明實施方式之方法對塊體非晶合金進行切 割之狀態示意圖。 圖2為本發明實施t式塊體非晶合金之_雷射切割方法 之流程圖。 圖3至圖9分別為採用本發明塊體非晶合金之脈衝雷射切 割方法實施方式1至實施方式7所獲得之塊體非晶合金切 割面之照片。 圖10為採用本發明塊體非晶合金之脈衝雷射切割方法實 施方式4所幾得之塊體非晶合金之切割面之X射線衍射圖 片。 圖11為使用傳統切财法對非晶合金進行切割後樣品切 表單編號A0101 第9頁/共23 0992022035-0 [0027] 201136695 割面之照片。 【主要元件符號說明】 [0028] 樣品 10 [0029] 切割面11 [0030] 毛刺 12 [0031] 脈衝雷射器20 [0032] 冷卻保護氣體輸出設備30 099112433 表單編號A0101 第10頁/共23頁 0992022035-0[0025] 099112433 has a cooling time in the pulse period, which can fully facilitate the cooling and cooling of the cutting surface by the cooling shielding gas during the cooling time, so that the cutting surface remains amorphous. Due to the high-precision laser cutting, the cutting precision of the cutting method of the invention can reach (0.1 mm, which can meet the requirements of precision engineering design. In addition, the cutting method of the invention has a faster cutting speed and processing efficiency. Higher, very suitable for large-scale industrial production use. In summary, the present invention has indeed met the requirements of the invention patent, and the patent application is filed according to law. However, the above is only a preferred embodiment of the present invention, To limit the scope of the patent application in this case, the equivalent modifications or changes made by those who are familiar with the art of the present invention in accordance with the spirit of the present invention shall be within the scope of the following patents. [Simplified illustration] Figure 1 A schematic diagram of a state in which a bulk amorphous alloy is cut by the method of the embodiment of the present invention. Fig. 2 is a flow chart of a laser cutting method for implementing a bulk amorphous alloy of the present invention. Figs. 3 to 9 are respectively Photograph of the cut surface of the bulk amorphous alloy obtained by the pulsed laser cutting method of the bulk amorphous alloy of the present invention from Embodiment 1 to Embodiment 7. Fig. 10 is a view showing the use of the present invention Pulsed laser cutting method for bulk amorphous alloy X-ray diffraction image of the cut surface of the bulk amorphous alloy obtained in Embodiment 4. Figure 11 is a sample cut form number after cutting the amorphous alloy using the conventional cut-off method A0101 Page 9/Total 23 0992022035-0 [0027] 201136695 Photograph of the cut surface. [Main component symbol description] [0028] Sample 10 [0029] Cutting surface 11 [0030] Burr 12 [0031] Pulsed laser 20 [ 0032] Cooling Protective Gas Output Device 30 099112433 Form No. A0101 Page 10 of 23 0992022035-0

Claims (1)

201136695 七、申請專利範圍: 1 . 一種塊體非晶合金之脈衝雷射切割方法,該塊體非晶合金 具有臨界冷卻速度與玻璃態轉化溫度,其包括以下步驟: 將該塊體非晶合金之待切割部位置於冷卻保護氣體氛圍中 , 採用脈衝雷射切割該塊體非晶合金之待切割部位,以形成 切割面,其中於一雷射脈衝週期之高電平之時間内,加熱 該塊體非晶合金之待切割部位至熔點之上;於該雷射脈衝 週期之低電平之時間内,以高於該臨界冷卻速度之速度冷 〇 卻該切割面至該玻璃態轉化溫度以下;及 去除該切割面上於切割時產生之毛刺。 2 .如申請專利範圍第1項所述之脈衝雷射切割方法,其中該 冷卻保護氣體沿與該脈衝雷射發射相同之方向吹向該塊體 非晶合金待切割部位,以使該毛刺形成於該切割面之邊緣 〇 3 .如申請專利範圍第1項所述之脈衝雷射切割方法,其中該 塊體非晶合金選自錯-銅-紹-錄系合金、錯-銅-銘-鎳-鈦 C1 ^ 系合金、锆-銅-鋁-鎳-鈮系合金、锆-銅-鎳-鈦-鈹系合 金、錯-銅-銘-錄-鈹系合金及錯-銅-紹-鈦-鈹系合金中 之一種。 4 .如申請專利範圍第3項所述之脈衝雷射切割方法,其中該 樣品之厚度為0. 2毫米至1 0毫米。 5 .如申請專利範圍第4項所述之脈衝雷射切割方法,其中該 脈衝雷射峰值功率為0. 2千瓦至5千瓦。 6 .如申請專利範圍第4項所述之脈衝雷射切割方法,其中切 099112433 表單編號A0101 第11頁/共23頁 0992022035-0 201136695 割速度大於3毫米/秒。 7 .如申請專利範圍第4項所述之脈衝雷射切割方法,其中該 脈衝雷射之頻率為100赫茲至300赫茲。 8 .如申請專利範圍第4項所述之脈衝雷射切割方法,其中該 脈衝雷射之脈衝寬度為0. 2微秒至1. 5微秒。 9 .如申請專利範圍第1項所述之脈衝雷射切割方法,其中該 冷卻保護氣體為氦氣、氬氣及氮氣中之一種。 10 .如申請專利範圍第1項所述之脈衝雷射切割方法,其中該 去除毛刺步驟為使用機械方式或電化學法去除毛刺。 099112433 表單編號A0101 第12頁/共23頁 0992022035-0201136695 VII. Patent application scope: 1. A pulsed laser cutting method for a bulk amorphous alloy, the bulk amorphous alloy having a critical cooling rate and a glass transition temperature, comprising the following steps: the bulk amorphous alloy The portion to be cut is placed in a cooling protective gas atmosphere, and the portion to be cut of the bulk amorphous alloy is cut by pulsed laser to form a cutting surface, wherein the high temperature of a laser pulse period is heated. a portion of the bulk amorphous alloy to be cut above the melting point; during the low period of the laser pulse period, the temperature is higher than the critical cooling rate, but the cutting surface is below the glass transition temperature And removing the burrs generated on the cutting surface during cutting. 2. The pulsed laser cutting method of claim 1, wherein the cooling shielding gas is blown in the same direction as the pulsed laser emission toward the portion of the bulk amorphous alloy to be cut to form the burr. The pulse laser cutting method according to the first aspect of the invention, wherein the bulk amorphous alloy is selected from the group consisting of a fault-copper-sau-recorded alloy, a fault-copper-ming- Nickel-titanium C1 ^ alloy, zirconium-copper-aluminum-nickel-lanthanum alloy, zirconium-copper-nickel-titanium-bismuth alloy, wrong-copper-ming-record-antimony alloy and wrong-copper-sau- One of titanium-bismuth alloys. 2毫米至1 0毫米。 The pulsed laser cutting method according to the third paragraph of the patent application, wherein the thickness of the sample is 0. 2 mm to 10 mm. 5. The pulsed laser cutting method according to the fourth aspect of the invention, wherein the peak power of the pulsed laser is from 0.2 kW to 5 kW. 6. A pulsed laser cutting method as described in claim 4, wherein the cut is 099112433 Form No. A0101 Page 11 of 23 0992022035-0 201136695 The cutting speed is greater than 3 mm/sec. 7. The pulsed laser cutting method of claim 4, wherein the pulsed laser has a frequency of from 100 Hz to 300 Hz. 5微米秒至1. 5微秒。 The pulsed laser cutting method according to the fourth embodiment of the present invention, wherein the pulse width of the pulse is 0. 2 microseconds to 1.5 microseconds. 9. The pulsed laser cutting method of claim 1, wherein the cooling shielding gas is one of helium, argon and nitrogen. 10. The pulsed laser cutting method of claim 1, wherein the step of removing the burr is to remove the burr by mechanical or electrochemical means. 099112433 Form No. A0101 Page 12 of 23 0992022035-0
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