TW201134629A - Monitoring device for the wire of a wire saw device and method for operating the same - Google Patents

Abstract

A wire monitoring device for a wire saw device, a wire saw device and a method of monitoring a wire saw device are described. The wire monitoring device includes at least two sensors, adapted to provide a change of a sensor output signal in dependence of the presence of a wire adjacent to a sensor, wherein the sensors are adapted to be each provided adjacent to a wire of the wire saw device.

Description

201134629 VI. Description of the Invention: TECHNICAL FIELD Embodiments of the present invention relate to a device for monitoring a wire of a wire saw device, a method of operating the device, and a wire saw device including the same. More specifically, 'the present invention relates to a device for detecting defects or fractures of a wire of a wire ore device'. The wire ore device is used for cutting or cutting a hard material such as a stone or quartz block, for example, for Cutting silicon wafers, for squarers (sqUarer), for choppers (cr〇pper), etc. . [Prior Art] A line ore device is used to seal a piece of hard material (such as a block, a monument or a sheet, such as a semiconductor wafer. In such devices, the wire is fed by a bobbin and guided by a wire guide (4) Tighten the 1 (four) (four) line - generally with abrasive material. One of the choices is 'grinding material is provided in the form of slurry. This can be done online in contact with the material to be cut not long ago. Thereby, the abrasive is used to cut the material to the cutting line Location - Alternatively, the abrasive is supplied to a coated wire, such as a diamond wire. For example, diamond particles can be provided to a coated metal wire in which the diamond particles (4) are in-line coating. The wire is tightly connected to the wire. The wire is guided and tensioned by the wire guide. The wire guide is usually covered with a synthetic resin layer and the wire of the grooved m-wire guide of the shape and size of the material is formed into a net or a wire mesh. During the cutting process, the wire moves at a relatively fast speed. The mesh produces a branch perpendicular to the support gamma (4) or the branch member 3 201134629: the force in the forward direction. During the silver cut, the mineral moves through the wire mesh," The speed of movement determines the cut Speed and, or the effective cutting area that can be sawed in a specific time 'for example, within an hour. - Generally speaking, it tends to use thin lines to reduce the thickness of the cut, thus reducing material waste. The diamond line is also used. Thin lines and diamond lines are usually easier. Damage is 'and under high stress' the line is more susceptible to breakage. The cutting speed is increased in the future to increase the output of the line device. The maximum speed at which the object moves through the net and the maximum effective cutting area at a given time are limited by several factors. , including line speed, hardness of the material to be sawed, disturbance effect, expected accuracy, etc. When the speed is increased, the stress on the line usually increases. Therefore, the above problem of avoiding damage or disconnection becomes high at high sawing speed. More critical. 'The advantages of diamond wire (such as achieving higher sawing speed) are associated with shortcomings such as poor resistance to breakage and expensive per unit length. When using diamond wire, measurement can be made to ensure a tendency to break. There will be no production loss due to downtime. If the line breaks during the sawing process, it will detect the break as soon as possible after the break and immediately stop the line movement. At the same time, during the sawing process, the detection line has a tendency to break at one or more locations along its length. If a break occurs, it may cause undue consequences. The loose end of the wire may be in an uncontrolled manner. It is swayed around the machine, damaging the wire guiding system or other parts of the machine. In addition, if the wire breaks and then moves again, it will pull away the object to be sawed. Traditionally, the above problem is caused by applying ink to the wire. To deal with. In the case of a break, the 'loose wire end will then touch the machine casing or other zero 201134629 pieces' and thus the debt can be generated on the casing voltage, additionally, applied to the line

Voltage, that is, a broken wire is detected.

Can state, regardless of the location of the fracture. SUMMARY OF THE INVENTION In view of the above, it is provided that the item is independent of the scope of the patent application.

method. Other advantages, features, aspects and details will be apparent from the 'Description' and the schema. According to an embodiment, a wire monitoring device for a wire saw device is provided. The line monitoring device includes at least two sensors adapted to provide a sensor output signal change that is dependent on the presence of a line adjacent the sensor, wherein the sensor is adapted to be a line that is each disposed adjacent to the wire saw device. According to another embodiment, a wire saw device with a wire monitoring device is provided. The line monitoring device includes at least one sensor adapted to provide a sensor output signal change dependent on the presence of a line adjacent the sensor, wherein the sensor is adapted to be disposed adjacent to the line of the wire saw device. According to yet another embodiment, a method of monitoring a wire saw device is provided. Method package 5 201134629 includes providing a line monitoring device that is adapted to provide a sensor-dependent output signal change that is dependent on the line of the adjacent sensor, and to monitor the physical condition of the line through the monitoring unit. Embodiments of the present invention are directed to apparatus for performing the method, and include apparatus components for performing the various method steps. The method steps can be performed by a hardware component, a computer programmed with a suitable software. Or in any other way. Additionally, embodiments in accordance with the present invention are also related to methods by which the device is operated. It includes method steps for performing the functions of each device. [Embodiment] Reference will now be made in detail to the embodiments of the invention, In the following description of the drawings, the same reference numerals are used to refer to the like parts. Roughly, only the differences of the individual embodiments are described. Each of the examples is provided for illustrative purposes only and is not intended to limit the invention. In addition, some of the features mentioned in one embodiment may result in other embodiments being applied or in combination with other embodiments. The instructions are intended to include these modifications and changes only. Further, in the following description, a control unit should be understood as a device that substantially electrically controls all functions of the wire saw device, such as a cutter, a squarer or a wafer-cut wire saw. Typically, the parameters of the machine operation and sawing process are controlled. The electric motor device, its moving line. The device' receives the command and reports the saw unit to connect the sensor to monitor its connection to the actuator and manipulate it to also include the process state for interacting with the person. In some embodiments 201134629, the '_ unit is also connected to an employee or automated system (such as a computer network controlled directly or by the terminal). According to embodiments described herein, the method of operating the wire mining device can utilize = brain program, Software, computer software products and related controllers are implemented, and generally have a central processing unit s (cpu), memory, user interface, input and output devices of the corresponding components of the two communication connection line mining devices. These components can be - One of the components: motor, disconnection_unit, line tracking device, etc., which will be described in detail later. In addition, in the following description, the line management unit will be understood as supplying the wire to the cutting area or working area of the wire saw device. Processing device, such as a breaker, squarer or wafer cutting wire saw. Typically, the wire saw includes wire guides for conveying and guiding the turns in the direction of line movement, while the line management unit provides wire tension control. The line provided by the management unit forms a net in the cutting area. Typically, the net will be considered a net formed by a single line management unit. It should be understood that the net may contain more than one work area. , which is defined as the area where the wire sawing process is performed. Thus, according to some embodiments described herein, the wire mesh may have multiple regions 'which are composed of wires from different wire management units. In one embodiment, it may be combined Other embodiments provide a line monitoring device for a wire saw device. The wire monitoring device includes at least two sensors 'which are typically inductive sensors and are typically arranged in an array on the support. Sensors Located in the line portion adjacent to the wire saw device. The inductive sensor generates an inductive field and detects any field changes induced in the presence/absence of the line and the line density in front of the sensor. If the line breaks, the wire ends Passing through the sensor causes the sensor output signal to change. Control unit 7 201134629 (generally the control unit of the wire saw device) continuously monitors the sensor signal and detects the break, which will stop the wire saw device from operating. For modern wire saw devices such as cut-offs, squares or wire saws, high-speed cutting of hard materials, such as semiconductor materials such as tantalum, quartz, etc. Line speed, ie the line moves through the wire saw The speed of the device, the line management unit and the material to be sawed is, for example, 10 meters per second (m/s) or more. Typically, the line speed is 15 to 20 m/s. However, there are also 25 m/s or 3 〇m/ The speed of s can be practiced under certain conditions. The bobbin rotates at speeds of up to several thousand revolutions per minute to release the line from the desired speed. For example, '1' to 2〇〇〇rprn can be used to loosen the line. In embodiments in which the other embodiments may be combined, the wires have different diameters depending on the type of device. In the embodiment relating to the squarer, the wire diameter is from about 300 microns (μπχ) to about 4 μμπι, such as 31. 〇μπι to 34〇μιη. In the embodiment related to the wafer dicing saw, the wire diameter is about 6 〇μηι to 180 μηη, more usually 80 μιη to 160 μιη. For all the previous examples, the 'wire twisting may increase the break. The risk of wire or damage to the coating is preferably a twist-free operation. The use of diamond threads can increase production by a factor of two or more. The increasingly popular diamond wire has some advantages over conventional steel wires, such as higher sawing speeds. The speed at which the material to be saw moves relative to the moving line is called the material feed rate. In the embodiments described herein, the feed rate for the wafer dicing saw is from about 2 pm/s to about 12 pm/s, more typically from about 6 pm/s to about ιμηη/s. The feed rate for the embodiment with respect to the squarer is from about 20 pm/s to 40 pm/s, more usually from about 28 pm/s to 36 pm/s. For other line mines 8 201134629 The type of line catch, feed rate, wire diameter and other information is known to those skilled in the art and will not be detailed. Figure 1 shows a schematic front view of a wire saw device 100, which includes a line monitoring device 1. The line monitoring device 1 includes a sensor 20 mounted on a support member 3, and the sensor 20 is disposed adjacent to a line portion 2A of the wire mesh. The sensor is coupled to control unit 25' which, in some embodiments, is the control element of the wire saw device. The sensor 20 is for illustrative purposes only, and the dimensions on the drawings do not necessarily reflect the actual sensor size'. This applies to all other figures in this document. The line ore device 100 has a wire guiding device 110 that includes four wire guides 112, II4, II6, II8. The line management unit i3 turns the line to the wire guides 112, 114, 116, 118. The line management unit 130 includes a supply coil 134 on which a line hopper is disposed, which typically accommodates hundreds of kilometers of wire. The new line 230 is fed from the supply coil 134 to the wire guiding device 11A. In addition, the line management unit 130 includes a take-up spool 138 that rewinds the old wire 24 turns onto the take-up spool 138. In the embodiment illustrated in Figure i, the axes of rotation of supply coil 134 and take-up spool 138 are parallel to the axes of rotation of wire guides 112, 114, 116, 118. Therefore, there is no need for a deflection pulley or the like to feed the wire to the wire guide 11 turns. Since the line is at a zero angle, the risk of disconnection can be reduced. Typically, line management unit 13A includes other means for adjusting line tension, such as inertia pulleys (not shown) and tension arms (not depicted in some embodiments, the digital encoder is placed on the tension arm. Figure 2 shows the line A schematic top view of the saw device 1A includes a line monitoring device i having a support 30 and a sensor 20. The device is connected to the control unit 25 via a line w, which is typically the 201134629 control unit of the wire saw device (10). The wire 210 is spirally wound around the wire guides 112, 114 and forms a parallel line layer 200 between the two wire guides. This layer is commonly referred to as the wire mesh 2. The different parallel lines of the line 210 (constituting the wire mesh) and the line It is itself indicated below by the symbol 210. Typically, the wire guides 112, 114, 116, Π8 cover the synthetic resin layer 'and are engraved with grooves of very precise geometry and dimensions. The distance between the grooves or the grooves The pitch determines the spacing D1 of the adjacent string or line of the line 2 1 0. The distance D1 also determines the maximum thickness of the slice of the line ore device. However, the use of the slurry The case of the third medium is an example, cut It is thinner than the distance D1 by about 1 〇μιη to 40μιη. Usually, the line thickness is ΐ2〇μπι to Ι40μιη, and the distance D1 is from 120μιη to 300μηη, generally 200μιη to 250μηι. For example, the pitch or distance of the trench is less than 300μιη The thickness of the line is the same as the distance d 1 . According to some embodiments, in combination with the other embodiments, the pitch or distance of the grooves causes the spacing of adjacent lines to be about 12 〇 μηη to 200 μηη, generally 160 μm or less. In view of the above, the embodiments described herein provide a large cutting area and a fast cutting rate. According to various embodiments, which may be combined with the other embodiments, the pitch (ie the distance between the grooves) 225μηη to 400μηη, for example 300μηι or less; the distance between adjacent lines 210 is 12〇pm to 300μπι, such as 200μηη to 250μηη, or even 220μηη or below; and/or the thickness of the formed wafer is ΙΟΟμηι to 250μηι, such as ΐ8〇 Ηηι to 22〇μιη, or even 200μηη or below. It should be noted that the groove pitch and groove geometry are usually adapted to the line thickness and line. Class 'and fits the wafer thickness. Therefore, the wire saw device including the grooved wire guide is adapted to the groove pitch and groove geometry to fit the thickness and wire diameter of the 201134629. The values of the distance, the thickness of the wire, and/or the thickness of the wafer may be predetermined from the configuration of the wire saw device. In addition, each wire guide 112, 114, 116, 118 is coupled to the motor 122, I24, I26, 128 (as shown in Figure 1). In the embodiment shown in Figures ! and 2, the wire guides 112, 114, 116, 118 are directly driven by motors 122, 124, 126, 128. As shown in Fig. 2, each of the wire guides ι 2, 11·4 can be directly mounted on the shafts 123, 125 of the corresponding motors 122, 124. In some embodiments, the one or more motors are water cooled. During operation, as during the sawing process, the motors 122, 124, 126, 128 drive the wire guides 112, 114' 116, 118 to rotate the wire guide about its longitudinal axis. Thereby, the wires in the wire net 200 are conveyed to the wire conveying directions 215, 225. In some embodiments, the wire transport speed is relatively fast, for example up to 20 m/s. In one embodiment, one of the motors (e.g., motor 122) acts as the main motor and the remaining motors 124, 126, 128 act as slave motors. In other words, the main motor 122 controls the operation of the driven motors 124, 126, 128, resulting in a driven motor! 24, 126, and 丨 28 follow the main motor 122. As a result, the synchronism of the operation of the motors 122, 124, 126, 128 can be improved and maintained during the sawing process. According to some embodiments, in combination with the other embodiments, two or more spools are provided to form at least one wire web. For example, use two or three or even four spools to provide the line. According to various embodiments, a method of sawing a thin wafer (e.g., 10 (1 to 170 μm)) is provided. Typically, a thin wafer can also be sawed by high catches, for example, at a feed rate of 2 μm to approximately 7 pm/s. 201134629 Compared to single-wire systems, using two or more spools and two or more wires reduces the amount of load on each line. Usually for single-wire networks, the surface area of the wafer is increased due to the surface area of the wire. The load is larger than that of the two-wire network. The increase in the weight will result in a lower cutting speed. Therefore, the use of two or more lines can increase the cutting speed, for example, the effective cutting area or the cutting area rate of 12 square meters / hour or more. According to still another embodiment, it may be combined with other embodiments, using a thin line having a line thickness of, for example, 8 〇Mm to ι 2 〇μηη, while increasing the cutting area. When the line is used, the line thickness is usually reduced. When a single wire is used for a large cutting area, the wire will become thinner until the wire breaks. Therefore, the use of two wires to construct a wire mesh, such as a continuous I mesh, can reduce the load on the wire, thereby allowing a faster cutting speed. another Aspects can use thin wires 'with smaller wire pitch and larger cutting area. Figure 3 shows a front view of an embodiment of a wire monitoring device for a wire saw device. The device includes at least two sensing! g 2G 'It is normally connected to the control unit 25 (which may be the control unit of the wire saw device) β sensor 汕 is adapted to be placed adjacent to the line portion 210 of the wire saw device. For ease of illustration, the line in front of the device is illustrated in Figure 3 The monitoring unit is adapted to detect the change of the physical condition of the line by analyzing the sensor signal. If the line 2ι〇 breaks, the broken end passes through the sensor, and the control unit detects the sense. The detector signal changes and usually stops the operation of the wire saw device. The "physical condition" here mainly involves exploring whether the wire is intact, ie not broken. In addition, the wire structure change is related to physical structural changes, such as whether the wire contains any type of Defects, small cracks, cracks, changes in their molecular structure, etc. 12 201134629 The sensor is usually connected via a line 15 to a control unit 25, which is generally a control unit of the wire saw device and which is suitable for The ability of the sensor signal will be further described below. The sensor is described as an inductive sensor, but embodiments may also include an optical sensor, or any type of sensor suitable for the above purposes. Inductive sensors are used because they are cheaper and provide their own induction field. Contrary to broken wires or large cracks, some types of defects are not necessarily seen. (4) Hope (but not necessarily) can also be measured A sensor type of small or intangible defect 'for example, a substantially viable inductive sensor. By this, it is also possible to detect small defects or line condition changes by analyzing the sensor signal. In another implementation, use a capacitor In some embodiments, an external electromagnetic or other field source is required. 'The warp section 21〇 is modified and detected by the sensor.” Other types of sensor applications are also considered to be in this case. Within the scope of protection of the invention. In one embodiment, radiation (not limited examples: neon, cx particle light, electron particle radiation, eigen, neutron) is directed to the line, and then the wire pair is measured using a suitable sensor. Reflection or absorption. In this special case, special safety measures are required to prevent personnel from being affected by harmful shots. In a further embodiment, the reflection or absorption of the ultrasonic waves applied to the wire is measured using a sensor. The sound generation mechanism can also be incorporated into the sensor. In another embodiment, an optical sensor is used. It can be a form of application for a light sensor or a charge coupled device (CCD) sensor that is adapted to provide a line image to a monitoring unit. The sensor is typically placed adjacent to the line to be monitored or supervised. In the above-mentioned line device using a wire net, the sensors are usually arranged adjacent to the line portions which are parallel to each other, as shown in Fig. 2. In the embodiment, the sensor 20 is mounted to a support member 30, typically a surface, solid or outer casing of the board, and may be plastic, metal or any other suitable material. Since metal may affect the sensing characteristics of inductive sensors, based on this consideration, materials are usually (but not necessarily) plastic. In the embodiment shown in Fig. 3, the four sensors 2 are substantially arranged in a row. If the spacing of the parallel lines is small, such as some wire saw devices for semiconductor processing, the physical dimensions of the sensors do not allow the sensors to be aligned in a row like parallel lines. In the embodiments described herein, the distance between the lines is from 120 μΐη to 300 μπι. The diameter of a typical inductive sensor is, for example, 4 mm to 15 mm, for example 8 mm. It is apparent that several such sensors cannot be arranged in a row such that the sensors are adjacent to only one line because the lines are much farther apart from each other than the diameter of the sensor. Several possible measurement methods have been proposed to overcome this limitation. First of all, in the embodiment shown in Figure 3, each sensor is provided to monitor a plurality of adjacent line portions 2 1 〇, which are typically 4 to 1 平行 parallel lines, more often 20 to 50 Line department. As a non-limiting example, if the parallel line portions are arranged at a distance of 〇·2ίηπι from each other and the sensor diameter is 8 mm, each sensor is provided to supervise about 40 parallel lines. In the exemplary embodiment, 'each sensor 2' covers 4 line portions 2 10 . Compared to the 40 line portions of the above example, the number of options is selected here for ease of explanation. Depending on the factors other than the diameter of the sensor, the distance between the centers of the sensors arranged in a row is 2mm to 30mm', which is usually 5mm to 20mm. 201134629 Figure 4 shows a perspective side view of the embodiment of Figure 3. The sensing distance D2 between the sensor and the line portion 210 depends on a plurality of factors, such as the type of sensor used, its technical specifications, the type and thickness of the line, etc., in which the implementation of the inductive sensor is employed. In the example, D2 is usually 〇 to 5 mm', which is usually 〇5 mm to 3 mm. Depending on the type of sensor, it is also possible to take significantly larger values. Fig. 5 shows another embodiment in which another distance sensor is placed on the support member 30 to supervise the distance D2 between the sensor 2's and the line portion 21''. The signal from the sensor 35 is also generally monitored by the control unit 25. If the control unit 25 detects that the distance D2 is changed, the actuator 45 mounted on the fixed part of the wire saw device and adapted to move the support member 3 is activated to re-adjust the sensor 2 and the line portion 21 the distance. The distance sensor 35 is also typically an inductive sensor, and the actuator 乜 can be an electric motor, such as a stepper motor, adapted to vary the distance D2 between the sensor 2 〇 and the line 21 。. Thereby, the optimal sensing distance D2 of the sensor 2〇 can be provided and controlled. Those skilled in the art are aware of methods and suitable devices for implementing the distance adjustment mechanism. In still another embodiment, as shown in Fig. 6, the sensors 2 are arranged in at least two substantially parallel columns. The columns are staggered from each other such that a sensor 20 of the first column is provided for the first line portion 21A and a second sensor 2 of the second column provides the line portion 210 for the side of the first line portion. The spacing of the parallel columns (measured from the center of each sensor) can range from 3 to 4 inches, more often - to 2 inches. The misalignment or displacement between adjacent parallel columns can be 15 mm, more typically 3 mm to 8 mm. In this way, the physical size of each sensor is hardly taken care of, and the monitoring device can supervise a plurality of line portions separated by short distances. It can be seen from Fig. 6 that the following sensors do not fit the space between the sensors in the upper row, so it is not possible to place the same number of sensors in only one column. This sensor arrangement can also be referred to as an array, or with an oblique matrix appearance. In the embodiments described herein, the number of parallel columns is from 2 to 8, more specifically from 3 to 5. Each parallel column can contain from 3 to 30 sensors, typically 4 to 8 sensors. The connecting line 15 connecting the sensor to the control unit (not shown) is usually combined with a cable that leads to the control unit, but other variants can be employed, i.e., bus bar type connections using industry standard equipment. Further, as can be seen from the embodiment shown in Fig. 6, the area overlap (indicated by D3) due to sensor coverage of different columns in the horizontal direction, the first line is monitored by one or more sensors. In Fig. 6, that is, the third and fourth line portions (dashed lines) from the left side are adjacent to the upper column and the leftmost sensor 20 below. Defects in one of these line sections will cause a sensor signal change in the two sensors. By providing separate shoulder and computer programs suitable for the control unit, which are standard operations for those skilled in the art, the control unit can locate defective lines by considering and/or comparing signal changes of the two sensors. . Fig. 7 shows another exemplary embodiment in which the area overlap D3 is smaller than the sixth figure. In this example, the fourth line falls within the range of the above and the following sensors at the same time. In some embodiments, as shown in Fig. 8, depending on the type of sight saw device and the gossip factor, it is desirable for each sensor to cover a small number of lines, such as only one line. However, a large number of sensors are required, so that it faces the sensor spacing problem caused by the narrowness of the above-mentioned line 16 201134629. This solution uses a plurality of parallel columns in which the sensors are arranged to be shifted from each other. However, a large number of sensors are also cost factors, so it is desirable to weigh the pros and cons of the position detection accuracy I sensor number. For the sake of clarity, the connection line 15 and the control unit 25 are not shown in FIG. The signal of the sensor 20 is directed through the connection line 15 to the control unit. Based on economic considerations, it is usually the control unit of the wire saw device, but it can also be a stand-alone device. The control unit is adapted to monitor and analyze signals from a plurality of sensors during operation of the wire saw device. Algorithms suitable for this purpose and their manner of implementation are known to those skilled in the art. If the line is broken and thus the signal of one or more sensors changes, the control unit detects the change and triggers the reaction. In one embodiment, once a line defect is detected, the control unit immediately stops the operation of the line device to prevent the wire defect from remaining further operating and causing undue consequences, as described above. In another embodiment, the control unit may additionally issue an alarm signal upon detecting a change in the sensor signal during the monitoring process t. The alarm signal is typically an audible notification, such as by using a caller, an alarm whistle or a speaker, and can also be illuminated by optical means using a illuminating device. The unit can also send signals to external devices via a computer network or the like. Embodiments described herein relate to a line ore device selected from the group consisting of a wire saw, a multiple wire saw, a squarer, and a cutter. To enable quick and easy viewing of the broken position, in one embodiment, the control unit can be adapted to display a non-breaking position on the display device. Display device can be the control of the wire saw device, 彳曰 ^ J蛩眷 but can also be any other screen or display

17 S 201134629 Display, for example located on a remote computer. A light-emitting diode or the like can also be configured as a display device. Usually, the fracture position calculated by the control unit from the sensed data is reproduced by a wire mesh pattern including a plurality of line portions. In many cases, the location of the fracture is not accurately determined and is limited to some of the lines that may be affected; in one embodiment, the number of individual lines is indicated or marked on the screen. In another embodiment, the method of using a sensor is combined with another method of detecting cracks. This other method may include applying a voltage to the first portion of the line' and using a sensor connected to the control unit to monitor whether another voltage of the line occurs. If the line breaks somewhere between the first part and the second part, the voltage will not be measured in the second part and the control unit will stop the operation of the wire saw device. Alternatively or in addition, it is possible to monitor whether the electric wire applied to the wire appears on the machine part other than the wire. In this case, the control unit will also cease to operate, assuming the line breaks and contacts the machine parts. In yet another embodiment, the control unit can be manually switched by the switch or automatically switched by the control unit of the wire saw device, or switched from the remote end of the computer network to a teach-in mode. In the teaching mode, the control unit detects the sensor signal 'and if a special sawing operation is performed due to the use of a small wire mesh (ie, a small number of parallel lines), so that no wires are present at one or more sensors 'The control unit then automatically adjusts its operation so that the inside of the sensor without the line is marked as an additional state' means that no line exists next to each sensor. The control unit stores information about whether there is a line next to each sensor until it is turned off, reset, or until the teach mode is activated again. Typically, the control unit has a reset switch or function that, when activated, causes the unit to enter a predetermined state 18 201134629. The terms "supervision" or "monitoring" should be read as follows. In operation, the electrical control unit continuously analyzes the signals of the various sensors. The manner in which the control unit is actually implemented for the intended purpose is known to those skilled in the art. During the sawing process, the wire moves adjacent to the sensor at a relatively fast rate. For example, if the sensor is an inductive sensor, the electric field induced by the line of the adjacent sensor changes from the metal material of the wire. As long as the line is intact and has a homogeneous structure, the amount of electric field change is constant with time, so the output signal of the sense is also fixed. As soon as the line portion with the characteristic flaw is passed through the sensor, the amount of electric field change changes immediately. The amount of change depends on the size of the defect, that is, the larger the defect, the larger the sensor signal changes. The biggest change in the sensor signal is due to the sudden disappearance of the line, ie the line just breaks and the loose end passes through the sensor. By analyzing the change of the sensor signal over time, the control unit can detect the change of the sensor signal, and thereby analyze that each line portion passing through each sensor necessarily presents a certain defect. During the operation of a typical wire saw device, in most cases, the defect is completely broken leaving two loose ends. As mentioned above, a sensor typically supervises a plurality of lines, as shown in Figures 2, 3, 6, 7, and 8. Therefore, if one of the wires 21 is defective or broken, the signal of the sensor changes. Since any line next to a sensor (as in Figure 3, each sensor includes 4 lines), the signal of each sensor will change, and the control unit cannot detect it. Which line part causes the signal to change, so it is impossible to accurately determine the defective line. This is usually not a problem, as the exact defect location can also be viewed by a person after the machine has stopped. 19 201134629 In the usual application order, the control unit was designed to distinguish between different defect levels. This means that the control unit can analyze and identify slight variations in the sensor signal, which are not caused by breaks but by minor damage to the line, such as small cracks. This can then inform the control unit that it is an exception. In this embodiment, the control unit of the device is adapted to determine whether the sensor signal change is severe enough to suspend operation, or whether an alarm signal is sent to inform the person to control the operation or to perform a similar action. The ability of the system to detect small defects in the line is closely related to the type of monitoring machine, the use of the line 'and especially the type of sensor. Note that in wireline devices that move the wire quickly (1 〇 to 20 m/s), such as some of the wire saw devices used for semiconductor processing, the effectiveness of the sensing system may be too low to detect small defects. In this case, the detection is reliable only if it is completely disconnected. However, this problem is closely related to the individual system, the use of the line, the type of sensor used, and the nature of the algorithm applied to the control unit. As described above, a plurality of embodiments are provided. According to an embodiment, a line monitoring device for a wire saw device is provided. The line monitoring device includes at least two sensors adapted to provide sensor output signal variations that are dependent on the presence of a line adjacent the sensor, wherein the sensors are adapted to be respectively disposed adjacent to the line of the wire saw device. According to an exemplary embodiment, the sensor is selected from the group consisting of an inductive sensor and a capacitive sensor. According to yet another embodiment, which may be combined with the other embodiments, the sensors are arranged in such a way that each sensor abuts a plurality of different portions of the line' so that the portions substantially protrude parallel to each other. Typically, in accordance with yet another alternative or alternative modification, the sensor is mounted to the support in a row or at least two columns. As an alternative embodiment, the centers of adjacent sensors arranged in a row are arranged

The distance of S 20 201134629 is 2 mm to 30 mm; the columns are substantially parallel; and/or the parallel columns are staggered by ' and the distance between the columns is 3 mm to 40 mm. According to another embodiment, which may be combined with the other embodiments, the line monitoring skirt further includes: a distance sensor disposed on the support, and a fixed part of the actuator 'actuator mounted to the wire saw device And adapted to change the distance between the sensor and the line; and/or comprise a control unit (25) adapted to perform the teaching method and including a check to check if there is a line next to each sensor. As a further exemplary embodiment, the control unit may be adapted to store information about the presence or absence of a line next to each sensor, and/or to be adapted to detect a change in the sensor signal during monitoring. Alarm signal. According to yet another embodiment, a wire saw device having a wire monitoring device according to any of the embodiments is provided. Typically, the wire saw device is an element selected from the group consisting of a wire saw, a multiple wire saw, a squarer, and a breaker. In addition, the distance between the sensor and the wire portion is typically 〇. 2 mm to 5 mm; and/or the sensor can be connected to the control unit of the wire mining device. According to another embodiment, a method of monitoring a wire saw device is provided. The method includes monitoring sensor output signal changes that are dependent on the presence of adjacent line or line structures and monitoring the physical conditions of the line through the I-view unit. It typically involves supervising changes in physical conditions, including changes in the density of lines adjacent to the sensor, such as the Bean Φ W, which includes a analytic sensor signal. According to yet another embodiment, in conjunction with the other embodiments, the method can be combined with another method of detecting breaks, and monitoring another portion of the line in which a voltage is applied to Whether this voltage appears in the first part of the line, and / or monitors 21 201134629 whether the voltage appears in the wire saw device parts other than the line. Another exemplary alternative or additional embodiment further includes fulfillment teaching in which the control unit checks whether each of the connection sensors 'is wired next to the sensor. While the present invention has been described in its preferred embodiments, the present invention is not intended to limit the invention, and it is intended that the invention may be modified and modified in various ways without departing from the spirit and scope of the invention. The scope of the invention is defined by the scope of the appended claims. BRIEF DESCRIPTION OF THE DRAWINGS In order to make the above-described features of the present invention more apparent and understandable, it can be explained in conjunction with the reference embodiment, and a part thereof has been summarized as above. The drawings are related to the embodiments of the present invention and are described below. Figure 1 shows a schematic perspective view of a wire saw device in accordance with an embodiment. Figure 2 shows a schematic perspective top view of a wire saw device in accordance with an embodiment. Figure 3 shows a schematic perspective front view of a monitoring device in accordance with an embodiment. Fig. 4 is a schematic side view showing the monitoring apparatus according to the embodiment of Fig. 3. Figure 5 shows a schematic side view of a monitoring device in accordance with another embodiment. Fig. 6 shows a schematic front view of a monitoring apparatus according to still another embodiment.

S 22 201134629 Figure 7 shows a schematic front view of a monitoring device according to another embodiment. Fig. 8 is a schematic front elevational view showing a monitoring apparatus according to still another embodiment. [Main component symbol description] 1 line monitoring device 15 line 20 sensor 25 control unit 30 support 35 distance sensor 45 actuator 100 wire saw device 110 wire guiding device 112, 114, 116, 118 wire guide 122 , 124 ' 126 ' 128 Motor 123 , 125 shaft 130 line management unit 134 Supply coil 138 spool 200 line / net 210 line (part) 215 , 225 conveying direction 230 , 240 line D1 spacing D2 distance D3 overlapping area

S 23

Claims (1)

201134629 VII. Patent application scope: 1. A line monitoring device (1) for a wire saw device, comprising at least: at least two sensors (20) adapted to provide a line with each of the adjacent sensors (2 10) Dependent-sensor output signal change, wherein the sensors (20) are adapted to be respectively disposed adjacent to a line (210) 〇2 of the wire saw device. The line monitoring device, wherein the sensors (20) are inductive sensors. 3. The line monitoring device of claim 1, wherein the sensors (20) are capacitive sensors. 4. A line monitoring device according to any of the preceding claims, wherein the sensors (20) are arranged in such a way that each sensor abuts a plurality of different portions of the line (210), This causes the portions to protrude substantially parallel to each other. 5. The line monitoring device of claim 1, wherein the sensors (20) are mounted on a support member (3 turns) in at least one column. 6. The line monitoring device of claim 5, wherein the distance between the centers of the adjacent sensors (20) arranged in a row is 2 mm 24 201134629 (mm) to 30 mm. 7. The line monitoring device of claim 5, wherein if the sensors are mounted in at least two columns, the columns are substantially parallel to each other. The wire monitoring device of any one of claims 6 or 7, wherein the parallel rows are offset from each other, and the distance between the columns is from 3 millimeters (mm) to 40 mm. 9. The wire monitoring device of any one of claims 1-3, further comprising: a distance sensor (35) 'on a support member (3 turns); and an actuator (45) mounted on a fixed part of the wire saw device and adapted to change a distance between the sensors (20) and the wire (21〇). 10. The line monitoring device of claim 2, further comprising a control unit (25) adapted to perform a teaching method and including a check to check whether each sensor is next to each sensor There is a line. U. The line monitoring device of claim 1, wherein the control unit (25) is adapted to store information about whether a line exists next to each sensor. 25 201134629 12·If the scope of the invention is as described in the control unit, the line monitor element (25) according to any one of the sensor signal changes 10 or 11 is suitable for monitoring, An alert signal is sent. </ RTI> <RTIgt; </ RTI> <RTIgt; </ RTI> <RTIgt; </ RTI> <RTIgt; </ RTI> <RTIgt; An element of a group consisting of a multiple wire saw, a squarer, and a cutoff. 15. The wire ore device according to any one of the preceding claims, wherein the distance between the sensor (20) and the line portion is 〇 2 mm (mm) to 5 mm. 16. A method for monitoring a first-line ore device, the method comprising the steps of: providing a line monitoring device (1) as described in the scope of the patent application; and supervising a line (21〇) through the monitoring device Whether the physical conditions have changed. 17. The method of claim 16, wherein the step of supervising the change in the physical condition further comprises supervising a change in density of the line 26 201134629 (2 10) of the abutment-sensor (10). The supervising step 18·, as described in claim 1 of the patent application, further includes the following steps: analyzing a sensor signal. 19. For example, please ask the patent (4)! The method of any of the preceding claims, wherein the method is combined with another method of detecting a fracture, wherein the another method of applying a voltage to the first portion of the line (2) And monitoring whether another portion of the line (210) exhibits the voltage, and/or monitoring whether the voltage is present at a portion of the wire saw device other than the line. 20. As claimed in any of claims 16-18. The method further includes the step of performing a teaching, wherein the control unit checks, for each connected sensor (20), whether a line (21 〇) is present next to the sensor. 27