201131341 六、發明說明： 【發明所屬之技術領域】 本創作係有關於晶片散熱結構，尤其有關於一種一體成型 而高速導熱散熱的散熱器結構。 【先前技術】201131341 VI. Description of the invention: [Technical field to which the invention pertains] The present invention relates to a heat dissipation structure for a wafer, and more particularly to a heat sink structure that is integrally formed and thermally dissipated at a high speed. [Prior Art]
凊參閱「圖1」所示，習知散熱器結構包含一散熱片i與一盾 扇2’該散熱片μ於接觸一基板3上的—晶片4，以藉由該散索 片1的高導熱快速帶走熱量，再藉該風扇2吹拂該散熱片i，使索 量快速發散，避免熱量累積而產生高溫，而對晶片4造成損害。 然此種構造，其風扇2會隨著時間逐漸老化，而有轉速降低、嗓 音等問題產生’甚至當風扇2故障，散熱片丨會因為效率不良， 而產生高溫導致晶片4的損壞，難以對晶片4形成完善的保護。 閱圖2」、「圖3」與「圖4」所示，另一習知散熱器舞 構’為台灣公告第綱147號專利，其捨棄了風扇2的使用，以 避免風扇2老化帶來的困擾，其包含—散熱則組5、 與三熱管7，紅歸7具健的導紐，且鑲膽摩板6 =員露於:導熱板6的表面’該導熱板6 一邊接觸該散細 片、，且5,另一邊則供接觸一基板3上的一晶片4。 f此由該晶片4產生的熱量傳遞至該三熱管7時 輪量導離該；4，再_散_組5 大罝的將熱量發散出去，以避免該晶片4產生高溫。 4 料結構，該散_片組5與鱗熱板 S] 合在一起，其加，繁複，且該散二 與料熱板6之間’難免會有縫隙產生，其會導致熱量售 3 201131341 6,而無法快速傳導至該散細片經5,因此， =…板6所畜積的熱量會明顯高於該散_片組5 執 熱·鰭片組5，以充分利用該散_片組5來 【發 ㈣致其絲效㈣料足需求。 滿足=的：之主要目的在於提供一高致率的散熱結構，以 本創作為-種散熱器結構，其包含一散熱鰭片底板盘至少一 熱管，其中該散賴片底板具有位於相對兩側的— 及熱面與一散 熱面’該散熱面設有-體成型連接於該散熱鰭片底板上的複數^ 熱·鳍片，該吸熱面設有至少1槽，且該_與賴管的數量為 ，對應’該至少-凹槽供對應鎮嵌該至少―熱管，並該至少一熱 管的表面與該吸熱面等高形成一接觸面。 據此，該接觸面供與一會散發出高熱的晶片接觸，藉而透 過該熱管的快速導熱，快速將熱量擴散開來導離該晶片處，又 熱量可快速無阻礙的傳遞至一體成型連接於該散熱鰭片底板 上的複數散熱鰭片，以藉該複數散熱鰭片的大面積快速散熱， 而具極佳的散熱效果。 【實施方式】 為使貴委員對本創作之特徵、目的及功效，有更加深入之 瞭解與認同，茲列舉較佳實施例並配合圖式說明如后： 凊參閱「圖5」與「圖6」所示，本發明為一種散熱器、结構’ 其包含一散熱鰭片底板10與至少一熱管2〇，該散熱鰭片底板1〇 具有位於相對兩側的一吸熱面11與一散熱面12，該散熱面12气s 201131341 有-體成型連接於該散熱鰭片底板10上的複數散熱，鰭片3〇，且該 複數健則30可各自相隔40且制錄該散熱面12 上’並該複數散熱則30可各自挖設複數開槽41，以增加散埶效 果。 ”、、 δ玄吸熱面11 S史有至少一凹槽13，且該凹槽13與該熱管沉 的數量為補應，且該至少1槽13為供對應鑲賴至;一熱管 20 ’並該至少-熱管20的表面與該吸熱面u等高形成一接觸面 15。如本實施例中，該熱管20與該凹槽13具有三個，且該三凹 槽13並排設於該吸熱面11上，而該熱管2〇亦呈相對位置設置。 又該散熱鰭>1底板1G可以為選自於紹、銅、紹合金與、銅合 金與銅銘合金等導熱的任-種，且該散熱鰭片底板1〇可於該吸熱 面11上凸設複數定位柱14，並該定位柱丨4可設有一穿孔ι41。 、另本發明可更包含複數螺柱50,該螺柱5〇相對兩侧具有一螺帽端 51與-螺紋端52 ’該螺柱50 f過該散熱轉片底板1〇，如讓該螺 柱50穿過§亥穿孔141 ’並於該螺帽端51與該散熱韓片底板1〇之 #間穿套-彈簧53 ’且該螺柱5〇於該螺帽端η與該散熱鰭片底板 10之間套設一 c型扣54。 、4再參閱「圖7」、「圖8」與「圖9」所示，該螺柱5〇可供螺 鎖於一基板80上，以讓該接觸面15與一會散發出高熱的晶片6〇 接觸，因此晶片60產生的咼熱會透過該熱管的高導熱性，以 散熱路彳生70傳遞，而快速的擴散開來導離晶片6〇處，並被該散 熱‘鰭片底板10所接收，又熱量可快速無阻礙的沿散熱路徑7〇由 忒政熱鰭片底板10傳遞至一體成型連接於該散熱鰭片底板1〇上 的複數散熱鰭片30 ’即可藉該複數散熱鰭片3〇的大面積，快速的5 5 201131341 ，發散熱量進人空氣巾，因而具紐的散熱效果。 如上所述，本發明藉由該至少-熱管20的快速導熱，與—體 成型連接於該散熱則底板1Q上的複數散熱則3G的大面積散 熱’熱ϊ可無阻礙的快速傳遞至該複數散綱片3G，並藉該複數 散熱.鰭片30快速的發散熱量進入空氣中，因此其具極佳的散熱效 果’可免除風扇的使用，避免風扇的老化造成的困擾。 細上所述僅為本創作的較佳實施例而已，並非用來限定本 創狀實施範圍’即凡依本創作申請專利範圍之内容所為的等 _效變化與修飾，皆應為本創作之技術範疇。 【圖式簡單說明】 圖1，係習知散熱器結構圖。 圖2，係另一習知散熱器結構分解圖。 圖3，係另一習知散熱器散熱示意圖一。 圖4，係另一習知散熱器散熱示意圖二。 圖5 ’係本發明散熱器結構分解圖。 鲁 圖6 ’係本發明散熱器結構組合剖視圖。 圖7 ’係本發明散熱器結構使用示意圖。 圖8 ’係本發明熱管傳遞熱量示意圖。 圖9，係本發明散熱器結構另一角度熱量傳遞示意圖。 【主要元件符號說明】 習知 1 :散熱片 2 :風扇 3 :基板 6 201131341 4 .晶片 5 :散熱鰭片組 6 :導熱板 7 =熱管 本發明 10 :散熱鰭片底板 11 :吸熱面 12 :散熱面 13:凹槽 14 :定位柱 141 :穿孔 15:接觸面 20 :熱管 30 :散熱鰭片 40 :間隙 41:開槽 50:螺柱 51:螺帽端 52:螺紋端 53:彈簧 54: C型扣 60:晶片 7〇 :散熱路徑 80 :基板Referring to FIG. 1 , the conventional heat sink structure includes a heat sink i and a shield fan 2 ′ that are in contact with the wafer 4 on a substrate 3 to be high by the loose film 1 . The heat conduction quickly removes the heat, and the fan 2 blows the heat sink i, so that the amount of the wire is quickly diverged, and heat is accumulated to avoid high temperature, which causes damage to the wafer 4. However, in this configuration, the fan 2 gradually ages with time, and there are problems such as a decrease in the number of revolutions, a click, and the like. [Even when the fan 2 fails, the heat sink may be damaged due to poor efficiency, resulting in damage to the wafer 4, which is difficult to The wafer 4 forms a perfect protection. As shown in Figure 2", "Figure 3" and "Figure 4", another conventional radiator dance "is a Taiwanese publication No. 147 patent, which abandons the use of the fan 2 to avoid the aging of the fan 2. Trouble, it consists of - heat dissipation group 5, and three heat pipes 7, red return to 7 healthy guides, and the inlaid gallbladder 6 = member exposed: the surface of the heat conducting plate 6 'the heat conducting plate 6 touches the side The thin piece, and 5, is on the other side for contacting a wafer 4 on a substrate 3. f. When the heat generated by the wafer 4 is transferred to the three heat pipes 7, the amount of light is led away; 4, the heat is dissipated from the group 5 to avoid the high temperature of the wafer 4. 4 material structure, the scattered _ film group 5 and the scale hot plate S] together, its addition, complicated, and between the two and the hot plate 6 'inevitably there will be gaps, which will lead to heat sales 3 201131341 6, can not be quickly transmitted to the fine film by 5, therefore, the heat accumulated in the plate 6 will be significantly higher than the heat_foil group 5 heat-fixing fin group 5, in order to make full use of the scattered film Group 5 to [four (four) to its silk effect (four) material needs. The main purpose of satisfying = is to provide a high-efficiency heat dissipation structure. The present invention is a heat sink structure comprising at least one heat pipe of a heat sink fin substrate, wherein the loose substrate has opposite sides And a heat surface and a heat dissipating surface, wherein the heat dissipating surface is provided with a plurality of heat fins integrally connected to the heat sink fin bottom plate, the heat absorbing surface is provided with at least one groove, and the heat sinking surface is provided with at least one groove The quantity is corresponding to 'the at least one groove is correspondingly embedded with the at least one heat pipe, and the surface of the at least one heat pipe forms a contact surface with the heat absorption surface. Accordingly, the contact surface is in contact with a wafer which emits high heat, whereby the rapid heat conduction of the heat pipe rapidly spreads heat away from the wafer, and the heat can be quickly and unimpededly transferred to the integrally formed connection. The plurality of heat-dissipating fins on the heat-dissipating fin bottom plate can quickly dissipate heat through the large area of the plurality of heat-dissipating fins, and have excellent heat dissipation effect. [Embodiment] In order to give your members a deeper understanding and recognition of the features, purposes and effects of this creation, the preferred embodiment is illustrated with the following description: 凊 Refer to Figure 5 and Figure 6 As shown in the figure, the present invention is a heat sink having a heat dissipating fin substrate 10 and at least one heat pipe 2〇 having a heat absorbing surface 11 and a heat dissipating surface 12 on opposite sides. The heat dissipating surface 12 gas s 201131341 has a body-shaped plurality of heat-dissipating heat-dissipating fins 3, and the plurality of fins 30 can be separated by 40 and recorded on the heat-dissipating surface 12' In the case of multiple heat dissipation, 30 can be dug each of the plurality of slots 41 to increase the effect of dilation. ”, δ 玄 吸 吸 11 S 有 有 有 有 有 有 有 有 有 有 有 有 有 有 有 有 δ δ δ δ δ δ δ δ δ δ δ δ δ δ δ δ δ δ δ δ δ δ δ δ δ δ δ δ δ The surface of the at least one heat pipe 20 and the heat absorbing surface u are formed to form a contact surface 15. As in the embodiment, the heat pipe 20 and the groove 13 have three, and the three grooves 13 are arranged side by side on the heat absorbing surface. 11 and the heat pipe 2〇 is also disposed at a relative position. The heat sink fin>1 bottom plate 1G may be any one selected from the group consisting of heat conduction such as Shao, copper, Shao alloy, copper alloy and copper alloy, and A plurality of positioning posts 14 may be protruded from the heat sinking surface of the heat sinking surface 11 , and the positioning pillars 4 may be provided with a punching hole 41. The present invention may further comprise a plurality of studs 50, the studs 5〇 The opposite ends have a nut end 51 and a threaded end 52'. The stud 50 f passes through the heat dissipating plate bottom plate 1 , such as the stud 50 passes through the § through hole 141 ' and at the nut end 51 The heat-dissipating heat-insulating plate bottom plate has a c-shaped buckle 54 between the nut end η and the heat-dissipating fin bottom plate 10, and 4 Referring to FIG. 7 , FIG. 8 and FIG. 9 , the stud 5 can be screwed onto a substrate 80 to contact the contact surface 15 with a wafer 6 that emits high heat. Therefore, the heat generated by the wafer 60 is transmitted through the heat pipe through the high thermal conductivity of the heat pipe, and is rapidly diffused to be guided away from the wafer 6 and received by the heat sink 'fin sheet 10 The heat can be quickly and unimpeded along the heat dissipation path 7 〇 from the hot fin substrate 10 to the plurality of heat dissipation fins 30 ′ integrally connected to the heat dissipation fin substrate 1 ′. The large area of the cymbal, the fast 5 5 201131341, the heat dissipation into the air towel, thus the heat dissipation effect. As described above, the present invention can be quickly transferred to the plural by the rapid heat conduction of the at least heat pipe 20, and the heat dissipation on the bottom plate 1Q, and the large heat dissipation of the 3G heat transfer can be quickly and unimpeded. The 3G is scattered and the heat is dissipated by the plurality of fins. The fins 30 quickly dissipate heat into the air, so they have excellent heat dissipation effect, which can eliminate the use of the fan and avoid the trouble caused by the aging of the fan. The above description is only for the preferred embodiment of the present invention, and is not intended to limit the scope of the invention, that is, the changes and modifications of the content of the patent application scope of the present invention should be the creation of Technical category. BRIEF DESCRIPTION OF THE DRAWINGS Fig. 1 is a structural view of a conventional heat sink. Figure 2 is an exploded view of another conventional heat sink structure. FIG. 3 is another schematic diagram of heat dissipation of a conventional heat sink. FIG. 4 is another schematic diagram of heat dissipation of a conventional heat sink. Figure 5 is an exploded view of the heat sink structure of the present invention. Lutu 6' is a cross-sectional view of the heat sink structure of the present invention. Figure 7 is a schematic view showing the use of the heat sink structure of the present invention. Figure 8 is a schematic view showing the heat transfer of the heat pipe of the present invention. Figure 9 is a schematic view showing heat transfer at another angle of the heat sink structure of the present invention. [Main component symbol description] Convention 1: Heat sink 2: Fan 3: Substrate 6 201131341 4. Wafer 5: Heat sink fin group 6: Heat conductive plate 7 = Heat pipe Present invention 10: Heat sink fin bottom plate 11: Heat absorbing surface 12: Heat dissipation surface 13: groove 14: positioning post 141: perforation 15: contact surface 20: heat pipe 30: heat dissipation fin 40: gap 41: slot 50: stud 51: nut end 52: threaded end 53: spring 54: C-type buckle 60: wafer 7: heat dissipation path 80: substrate