201131238 六、發明說明： 【發明戶斤屬之技術領成j 發明領域 本發明係有關於一種將間隔物散布在業已形成於基板 之電極圖案的間隔物散布裝置、間隔物散布方法及使用該 間隔物散布裝置之製造液晶面板之方法。 c先前技術3 發明背景 於液晶面板之製造中，為了保持液晶面板間之間隔’ 會有將被稱作間隔物之金屬微粒子、合成樹脂微粒子、無 機微粒子等配置在業已形成於基板之電極圖案上的間隔物 散布程序。間隔物之散布方法之一包括：將間隔物與壓縮 空氣一同喷霧至基板的間隔物散布方法。於該間隔物散布 程序中’若由品質上的觀點來看，則必須使間隔物均一地 配置於基板上，目前揭示有各種用以均一地散布間隔物之 方法。 第7圖係顯示習知間隔物散布程序中所使用的間隔物 散布裳置之一例之圖。間隔物散布裝置係於構成密閉或接 近密閉之狀態的容器90a之上端部設置可散布間隔物91之 嘴90b ’且於噴嘴9〇b下配置桌台9〇c，該桌台9〇c係吸附 保持間隔物散布對象之基板92 。若開始間隔物散布程序， 則基板92係藉由搬送裝置搬送至容器9Ga内，並配置於桌台 八人’與壓縮空氣一同通過配管9〇d而搬送之間隔 物91係' 自喷嘴9%朝基板92散布。間隔物91在藉由壓縮空氣 201131238 等於配管90d内搬送時’會帶正電或負電，由於各間隔物91 呈同極性帶電，因此’彼此會相互地排斥，並且較為均一 地散布。此時，若散布間隔物91之基板92的電極電位相同， 則可將間隔物91均一地散布在基板92上。然而，在將間隔 物散布在表面具有電極之基板時，若電極間產生電位差， 則間隔物之散布狀癌在電極間會不同。故，目前揭示有以 下方法’即：在業已形成於基板上之複數電極施加與間隔 物之帶電極性呈同極性之電壓，並利用作用於間隔物之斥 力來散布間隔物(例如參照專利文獻1或專利文獻2)。 先行技術文獻 專利文獻 〔專利文獻1〕日本專利公開公報特開2002-258316號 公報 〔專利文獻2〕國際公開第00/31580號 C發明内容3 發明欲解決之課題 近年來，液晶面板亦要求輕量化、薄型化，取代使用 玻璃基板之液晶面板，使用樹脂製基板之液晶面板係發展 普及。然而，習知間隔物散布裝置係以玻璃基板為前提， 若直接應用在樹脂製基板，則會有難以均一地散布間隔物 之問題。 舉例言之，樹脂製基板(特別是薄膜基板)一般會比玻璃 基板更容易帶電，且由於剛性亦低，因此，於第7圖之例中， 容易產生與桌台90c間之摩擦，且藉由因摩擦所產生的靜 201131238 電’會有難以均一地配置間隔物91之問題。 又，樹脂製基板係由於可薄型化或柔軟性高之特徵， 因此’亦包括於長型輥狀之薄型原料基板接連形成複數電 極圖案者。於使用此種形狀之樹脂製基板的液晶面板之製 造程序中，依序地饋送被捲繞在滾輪的處理前之樹脂製基 板’並搬送至間隔物散布裝置内而散布間隔物91，且藉由 捲繞側之滾輪，捲繞業已結束散布之樹脂製基板。於此種 構造中，散布間隔物91時之樹脂製基板僅藉由饋送側之滾 輪與捲繞側之滾輪之力來固定位置。另，在途中設置導引 滾輪時亦相同，樹脂製基板之位置係藉由導引滚輪來固 定。故，舉例言之，會產生樹脂製基板藉由與間隔物91一 同放出的壓縮空氣之風壓朝上下方向移動之問題。此時， 位於下面之桌台90c之桌台面與樹脂製基板會相擦而產生 摩擦，並產生因摩擦所造成的靜電，且藉由該靜電之影響， 會有帶電之間隔物無法均一地散布在樹脂製基板上之虞。 又’在搬送樹脂製基板時’由於樹脂製基板亦於桌台9〇c上 通過，因此會產生相同之問題。 有鑑於此點，本發明之目的係提供一種可將間隔物配 置在容易因間隔物散布時之風壓等與周圍摩擦並產生靜電 的樹脂製基板而無不均之間隔物散布裝置、間隔物散布方 法及製造液晶面板之方法。 用以欲解決課題之手段 為了解決前述課題’本發明係提供一種間隔物散布裝 置’該間隔物散布裝置包含有按壓機構部及控制部，且將 201131238 間隔物散布在業已形成於基板之電極圖案。按壓機構部係 具有按壓件，並依據指示切換第1狀態與第2狀態，且前述 按壓件係當以預定間隔接連形成有複數電極圖案之樹脂製 基板於間隔物散布裝置之容器内被朝電極圖案之接連方向 搬送，並進行間隔物之散布時，用以抑制在間隔物散布裝 置之容器内的樹脂製基板之活動者；而前述第1狀態係使按 壓件離開樹脂製基板者，前述第2狀態係將按壓件配置於樹 脂製基板上。控制部係於搬送樹脂製基板時，對按壓機構 部指示第1狀態而使樹脂製基板可搬送。又，於樹脂製基板 上的散布對象之電極圖案到達預定位置並於該散布對象之 電極圖案進行間隔物之散布時，對按壓機構部指示第2狀態 而抑制樹脂製基板之活動。 又，為了解決前述課題，亦提供一種進行與前述相同 之處理順序的間隔物散布方法及製造液晶面板之方法。 發明效果 依據所揭示間隔物散布裝置、間隔物散布方法及製造 液晶面板之方法，對於容易因間隔物散布時之風壓等與周 圍摩擦並產生靜電的樹脂製基板’可藉由於間隔物散布時 利用按壓機構部來抑制樹脂製基板之活動，防止因與周圍 間之摩擦所造成的靜電。又，藉由防止該靜電之產生，可 將間隔物配置在樹脂製基板而無不均。 圖式簡單說明 第1圖係顯示實施形態之間隔物散布裝置之構造例之圖。 第2圖係顯示間隔物散布系統之全體構造之一例之圖。 201131238 第3圖係顯示控制裝置之硬體構造例之方塊· 第4(Α)、4(·係顯*於_物散布程序S間隔物散 布裝置之狀態圖。 第5圖係顯示與電極圖案接觸之短路固定物領域圖。 第6圖係顯示利用控制裝置之間隔物散布處理順序之 流程圖之一例。 第7圖係顯示習知間隔物散布程序中所使用的間隔物 散布裝置之一例之圖。 I：實施方式】 用以實施發明之形態 以下，參照圖式’說明本發明之實施形態。 第1圖係顯示實施形態之間隔物散布裝置之構造例之圖。 間隔物散布裝置係對薄膜基板20進行間隔物散布程 序，且該薄膜基板20係於薄膜狀之薄型樹脂製基板上接連 形成獨立之電極圖案。間隔物散布裝置包含有：外殼之容 器11 ;將間隔物30搬送至容器11内之配管12 ;散布間隔物 30之喷嘴13 ;按壓薄膜基板20之按壓機構部14a、按壓機構 部14b;載置薄膜基板20之桌台16;及移動桌台16之電動機 17及控制部18。 容器11係間隔物散布裝置之外殼，且可將間隔物散布 裝置内作成密閉或接近密閉之狀態。於下部設置有排氣口 11a ’且該排氣口 lia係將與間隔物30—同朝容器11内放出 之壓縮空氣排出。於第1圖之例中，排氣口 11a亦兼作將薄 膜基板20搬送至間隔物散布裝置内之搬送口。該等亦可分 201131238 別設置。 配管12係與配置於容器丨丨上端之喷嘴13連接，並將間 隔物30與壓縮空氣一同朝喷嘴13送出。喷嘴13係將經由配 官12而流過來的間隔物3〇與壓縮空氣一同朝配置於喷嘴13 下的電極圖案21a散布。 按壓機構部14a、按壓機構部14b係分別配置於兼作搬 送薄膜基板20之搬送口的排氣口 ila附近之容器丨丨側面。設 置於容器11内側之按壓機構部14a、按壓機構部14b係分別 具有依據指示作動之按壓件15a、按壓件15t>。該按壓件 15a、按壓件15b係具有以下形狀，即：於配置在薄膜基板 20上之狀態下，可堵塞排氣口 11a，並將容器11内作成密閉 或接近密閉之狀態。又，第1圖例之按壓件15a'按壓件15b 可將與按壓機構部14a、按壓機構部14b本體之連接點(旋轉 軸)作為中心而旋轉。將按壓件15a、按壓件15b離開薄膜基 板20之方向稱作上方向（於第丨圖中，按壓件15a係逆時針旋 轉’按壓件15b係順時針旋轉），將配置於薄膜基板2〇上之 方向稱作下方向（於第1圖中，按壓件15a係順時針旋轉，按 壓件15b係逆時針旋轉）。又，使按壓件15a、按壓件15b朝 上方向旋轉並離開薄膜基板2 〇之狀態係稱作第1狀態或開 放狀態。於第1狀態（開放狀態）中，按壓件15a、按壓件15b 係離開薄膜基板20 ’並構成排氣口 lla開放之狀態。薄膜基 板20朝搬送方向之移動亦可自由地進行。另一方面，使按 壓件15a、按壓件15)3朝下方向（靠近薄膜基板2〇之方向）旋 轉’且配置於薄膜基板2〇上並壓下薄膜基板之狀態係稱作 201131238 第2狀態或抑止活動狀態。於第2狀態（抑止活動狀態）中，按 壓件15a、按壓件15b係配置於薄膜基板2〇上，並抑制薄膜 基板20之活動。於第1圖之例中，藉由配置於薄膜基板2〇下 側之桌台16面對溥膜基板2〇的桌台面與按壓件i5a、按壓件 15b夾持薄膜基板20，並抑制桌台面上的薄膜基板2〇之活 動。藉此，可防止間隔物散布時薄膜基板2〇與桌台面摩擦 而產生之靜電。另，第1狀態（開放狀態）及第2狀態（抑止活 動狀態）之切換係藉由控制部18之指示來實行。又，於第j 圖之例中，按壓件15a、按壓件15b係作成朝上方向或下方 向旋轉，然而，亦可作成朝垂直方向上升或下降。 桌台16係配置於容器丨丨之下部，並具有自下側支撐薄 膜基板20之桌台面。又，具有上下動作機構，且該上下動 作機構係藉由電動機17所產生的驅動力，將桌台面之位置 朝上下移動。上下動作機構可適當地使用—般已知的機 構，舉例言之’包含有滑動機構，且該滑動機構係將與電 動機17之連接部分作為巾心並使桌台啦體朝上下方向 滑動。 控制部18係與按壓機構部丨4 a、按壓機構部丨4 b及電動 機Π連接，並依據間隔物散布程序之處理順序，賦予按壓 機構部14a、按壓機構部14b及電動機17動作指示。在此， 搬送薄膜基板2〇’且散布料之電簡案仏猶嘴嘴町 的預定位置，並於進行間隔物3〇之散布時停止搬送，且對 桌台16指示上升，並對按壓機構部14a、按壓機構部指 示抑止活動狀態，且使桌台16朝上方向動作，使按壓= 201131238 15a、按壓件15b朝下方向動作。藉此，薄膜基板2〇係下側 夾持於桌台16，上側炎持於按壓件i5a、按壓件，且於 散布間隔物30之期間壓抑其活動。在將薄膜基板2〇朝搬送 方向搬送時，對桌台16指示下降，並對按壓機構部i4a、按 壓機構部14b指示開放狀態，且使桌台16朝下方向動作，使 按壓件15a、按壓件15b朝上方向動作。藉此，於薄膜基板 20之上方向及下方向產生空間，且薄膜基板2〇可朝搬送方 向移動。 薄膜基板20係樹脂製基板，且該樹脂製基板係具有業 已形成於輥狀原料薄膜基板之電極圖案2ia、電極圖案 21b、電極圖案21c。舉例言之，原料薄膜基板包括：pet(聚 對本一曱酸乙二自旨，Polyethylene Terephthalate)、PEN(聚蔡 一甲酸乙二醋’ Polyethylene Naphthalate)等。於原料薄膜 基板上形成蒸鍍ΓΓ〇(銦錫氧化物，Indium Tin Oxide ;透明 電極膜）而進行預定之圖案成型後所構成的電極圖案21a、 電極圖案21b、電極圖案21c。電極圖案21a、電極圖案21b、 電極圖案21c係隔著預定間隔而接連配置於薄膜基板20之 其中一面。在此，相對於搬送方向，作成電極圖案21a、電 極圖案21b、電極圖案21c係配置成一列。又，於以下說明 中，在無須特別地特定電極圖案21a、電極圖案21b、電極 圖案21c時’標記成電極圖案21。 說明此種構造之間隔物散布裝置之動作及間隔物散布 方法。 於第1圖所示之薄膜基板2〇之上面，以一定之間隔形成 10 201131238 電極圖案21a、電極圖案21b'電極圖宏9^ 口案21c。缚膜基板2〇係 朝搬送方向（於第1圖中自左至右）依序地搬送。以下，將電 極圖案21 a作成散布對象來說明。 目前，散布對象之電極圖案叫係作成到達喷嘴Η下的 預定位置而停止之狀態。控制部18係、驅動㈣機17，並對 位於離開薄膜基板20之位置（下方）的桌台16指示上升且對 按壓機構部14a、按壓機構部14b指神卩止叫狀態，並使 按壓件15a、按壓件15b朝下方向動作。藉由電動機17之驅 動力，位於離開薄膜基板20之位置（下方）的桌台16會上升， 並於桌台面構成薄膜基板20之正下方之位置停止。又按 壓機構部14a、按壓機構部Mb會使各自之按壓件15&、按壓 件15b朝下方向旋轉，且按壓件15a、按壓件15b係於與薄膜 基板20接觸之位置(按壓薄膜之狀態）停止。藉此，薄膜基板 20係於散布對象之電極圖案21a之搬送方向中在前後之位 置，藉由桌台16與按壓件I5a、按壓件i5b夾入，並抑制活 動。特別是前後夾持於按壓件15a、按壓件15b之電極圖案 2U與其周圍係固定於桌台16之桌台面。又，此時，藉由按 壓件15a、按壓件15b，堵塞排氣口 11a，且於該狀態下，自 喷嘴13散布間隔物3〇。由於電極圖案21a與其周圍係藉由按 壓件15a、按壓件15b及桌台16來抑制活動，因此’即使噴 霧壓縮空氣亦不易活動，且不易產生原因為薄膜基板20與 周圍摩擦之靜電。藉此，可將間隔物30均一地配置於電極 圖案21a上。 在結束朝電極圖案2la之間隔物散布後，控制部18係驅 201131238 動電動機17，並對桌台16指示下降，且對按壓機構部14a、 按壓機構部14b指示開放狀態，並使按壓件15a、按壓件15b 朝上方向旋轉《藉此，薄膜基板20係自過去按壓散布對象 之電極圖案21a的按壓件15a、按壓件15b與桌台16開放， 又’此時，藉由按壓件15a、按壓件15b來堵塞的排氣口 lla 亦開放。另’為了防止無用之間隔物30附著於周圍之電極 圖案21b、電極圖案21c，在排出未配置於電極圖案21a之容 器11内的間隔物30後，宜將按壓件15a、按壓件15b作成開 放狀態。依此’過去夾持薄膜基板20的按壓件15a、按壓件 15b及桌台16係離開薄膜基板2〇，且薄膜基板2〇可朝搬送方 向移動。又’將薄膜基板2〇朝搬送方向移動，並將業已結 束散布處理之電極圖案21 a朝容器11外搬出。此時，下一個 散布對象之電極圖案21c係進入容器η中，且於該電極圖案 21c到達喷嘴13下的預定位置時，停止薄膜基板2〇之搬送， 並將電極圖案21c作成散布對象而反覆與前述相同之順序。 藉由實行以上處理順序，於間隔物散布時，藉由利用 按壓機構部14a、按壓機構部14b及桌台16來夾持薄膜基板 20，可抑制散布對象之電極圖案21與其周圍之活動，並防 止靜電，故，可將間隔物3〇均一地散布在電極圖案2卜又， 於薄膜基板20之搬送時’藉由將按壓機構部14a、按壓機構 414b及桌台16離開薄膜基板2〇，薄膜基板2〇會開放，且可 使薄膜基板20自由地移動。 另’於則述說明中’作成桌台16係配合按壓機構部 14a、按壓機構部14b之動作而上升或下降，然而，即使作 12 201131238 成固疋桌台16，並僅藉由按壓機構部14a、按壓機構部Ub 之動作來抑制薄膜基板20之活動，亦可取得相同之效果。 其-欠，說明使用間隔物散布裝置之間隔物散布程序。 首先，說明實行間隔物散布程序之間隔物散布系統之全體 構造。 第2圖係顯示間隔物散布系統之全體構造之—例之 圖。間隔物散布系統包含有：第丨圖所示之間隔物散布裝 置，及溥膜捲繞滾輪40a、薄膜捲繞滾輪4〇b、間隔物供給 裝置50及控制裝置60。 構成間隔物散布裝置之容器丨1、配管12、喷嘴π、按 壓機構部14a、按壓機構部14b、桌台16及電動機17係與第1 圖所示符號之相同構成要素相同。第1圖所示之控制部18在 第2圖之構造中會裝入控制裝置60。 進行間隔物散布程序前之薄膜基板2 〇係捲繞在薄膜捲 繞滾輪40a，業已施行間隔物散布處理之薄膜基板2〇則捲繞 在薄膜捲繞滚輪40b。薄膜捲繞滾輪4〇a、薄膜捲繞滾輪40b 係依據控制裝置60之指示間歇動作，並將薄膜基板2〇自薄 膜捲繞滾輪40a朝薄膜捲繞滾輪4〇b搬送。將此時的薄膜基 板20前進之方向作成搬送方向。 間隔物供給裝置50係依據來自控制裝置6〇之指示，將 間隔物30與壓縮空氣(Air或氮(N2))—同朝配管12放出。間 隔物30在通過配管12時，一樣會帶正電(+)或負電（—）。以 下，作成帶正電（+)來說明。 控制裝置60係具有與控制部18相同之機能，同時控制 13 201131238 薄膜捲繞滚輪40a、薄膜捲繞滚輪4〇b及間隔物供給裝置 50，並管理間隔物散布程序全體。 在此’說明控制裝置60之硬體構造。第3圖係顯示控制 裝置之硬體構造例之方塊圖。 控制裝置60係藉由cpu(中央處理單元，Central Processing Unit)601來控制裝置全體。透過匯流排607，於 CPU601連接RAM(隨機存取記憶體，Rand〇m Access Memory)602、硬磁碟驅動機(hDd : Hard Disk Drive)603、 繪圖處理裝置604、輸入介面6〇5及通信介面6〇6。 由CPU601貫行的(作業系統，Operating System)之程 式或應用程式之至少一部分係暫時地收納於rAM6〇2,又， 利用CPU601之處理所必須的各種資料係收納RAM6〇2。〇s 或應用之程式係收納於HDD603。於繪圖處理裝置604連接 監視器608，並依據來自CPU6〇1之命令，使影像顯示於監 視器608之晝面。於輸入介面6〇5連接鍵盤6〇9a或滑鼠 609b ’並透過匯流排607，將傳送自鍵盤6〇9a或滑鼠6〇9b之 信號發送至CPU601。通信介面6〇6係透過通信路，與按壓 機構部14a、按壓機構部14b、電動機17、薄膜捲繞滾輪4〇a、 薄膜捲繞滾輪40b及間隔物供給裝置5〇等連接，並發送接收 自CPU6G1之動作指示。X，接受來自各部之反應，並透過 匯流排607發送至CPU601。 藉由此種硬體構造，可實現控制裝置60之處理機能。 其次，說明間隔物散布程序。第4圖係顯示於間隔物散 布程序中關隔物散布裝置之狀態圖，第4(A)圖係顯示薄 14 201131238 膜基板搬送時之狀態，第4(B)圖係顯示間隔物散布時之狀態。 (A) 於薄膜基板搬送時，依據控制裝置之指示’薄膜 基板20下側之桌台16會下降，且按壓機構部14a、按壓機構 部14b之按壓件15a、按壓件15b會朝上方向移動，又，排氣 口 11a亦開放。於該狀態時，薄膜基板2〇可朝搬送方向移 動。控制裝置60係使薄膜捲繞滾輪4〇a、薄膜捲繞滾輪4〇b 動作，且直到下一個對象之電極圖案21c到達喷嘴13下的預 定位置為止，使薄膜基板20移動。 (B) 於間隔物散布時’依據控制裝置6〇之指示，薄膜基 板20下側之桌台16會上升至薄膜基板2〇正下方，且按壓機 構部14a、按壓機構部14b之按壓件15a、按壓件15b會下降 至薄膜基板20上，又，排氣口 ua係藉由按壓件15a、按壓 件15b而堵塞。於該狀態下，薄膜基板2〇係散布對象之電極 圖案21c之前後藉由桌台16之表面與按壓件15a、按壓件15b 來夾持，因此，可抑制薄膜基板2〇之活動，並防止構成間 隔物30均一散布之阻礙的因桌台面與薄膜基板20之摩擦所 k成的靜電。又，由於排氣口 lla會堵塞，因此，不會有未 附著於電極圖案21a之間隔物30與壓縮空氣一同自排氣口 U a排出之虞。藉此，可防止與壓縮空氣一同自排氣口"a 排氣的間隔物30散布至電極圖案21c前後之電極圖案213、 電極圖案21d。 不過，於前述構造中，作成於間隔物散布時藉由按壓 機構部14a、按壓機構部14b與桌台16來夾持薄膜基板加， 且藉由抑制薄膜基板20之活動而防止靜電。除此之外，藉 15 201131238 由將圖案間之帶電狀態均一化’可更進一步地構成無不均 之間隔物散布。如第4(B)圖間隔物散布時所示，於間隔物 散布時，按壓件15a、按壓件15b係與散布對象之電極圖案 21 a周圍的薄膜基板2 0接觸。在此’設置短路固定物，且該 短路固定物係於按壓件15a、按壓件15b朝下方向動作而與 薄膜基板20接觸時，使散布對象之電極圖案21短路。舉例 言之，於按壓件15a、按壓件15b與薄膜基板2〇接觸之接觸 面，形成與電極圖案21電連接並使電極圖案21短路之圖案。 第5圖係顯示與電極圖案接觸之短路固定物領域圖。電 極圖案21係顯示形成於薄膜基板2〇之電極圖案之一例。短 _定物領域15U、短路固定物領域⑽係顯示在按壓件 5:她5b配置於薄膜基板2。上時與薄膜基板2。重疊 之項域。短路固定物領域151 電極圖案物領域咖係與 薄膜美相9而。且於按料…、按壓件⑽按壓 相基板2〇時，與形成於短路固定 午15刚 於電極圖案21側與短路 -電連接。另’ 1训重疊之領域，舉制丄/ 7員域15U、短路固定物領域 機能電極作成同電位之;擬=備^能=連接且可將 之間隔物3。的配置更加均上化’可使配置於電極圖案21 二物散布 流程圖之—例。 ^置之間隔物散布處理順序之 16 201131238 接連形成電極圖案之薄膜基板20係安裝於薄膜捲繞滾 輪40a、薄膜捲繞滾輪40b，並開始間隔物散布程序。 〔步驟S01〕控制裝置60係啟動薄膜捲繞滾輪40a、薄 膜捲繞滾輪40b，並使薄膜基板20朝搬送方向移動。又，指 示薄膜捲繞滾輪40a、薄膜捲繞滾輪40b，以使薄膜基板20 移動，直到形成有間隔物散布處理對象之電極圖案21之部 分到達喷嘴13下的預定位置為止。藉由薄膜捲繞滾輪40a、 薄膜捲繞滾輪4〇b之動作，搬送薄膜基板20，且散布對象之 電極圖案21到達噴嘴13下。此時，業已結束間隔物散布程 序之電極圖案21係同時地搬送至容器11外。 〔步驟S02〕控制裝置60係調查間隔物3〇之散布對象之 電極圖案21之有無。亦可作成直接查明電極圖案21之有 無’且亦可作成預先登錄對象之電極圖案21之個數，並將 其於每次結束散布時扣除而檢測最後之電極圖案21。有散 布對象之電極圖案21時，使處理前進至步驟S03，沒有散布 對象之電極圖案21時，則結束間隔物散布程序。 〔步驟S03〕有散布對象之電極圖案21時，控制裝置6〇 係使薄膜捲繞滾輪40a、薄膜捲繞滾輪4〇b停止，並開始間 隔物散布程序。與驅動電動機17同時地對桌台16指示上 升’並使桌台16之桌台面移動至薄膜基板2〇正下方之預定 位置，藉此，固定薄膜基板2〇下側之位置。 〔步驟S04〕控制裝置6〇係對按壓機構部14a、按壓機 構部14b指示抑止活動狀態，並使各自之按壓件15a、按壓 件15b朝下方向旋轉。按壓件15a、按壓件15b係於按壓薄膜 17 201131238 基板20之狀態下停止，並固定薄膜基板2〇上側之位置。又 谷益11之排氣口 11a會堵塞。 〔步驟S05〕控制裝置6〇係於藉由桌台16與按廢機構部 1如、按Μ構部Mb騎薄職板歡活動之狀態下，於 制間隔物供給裝置5G及喷嘴13，並將間隔物增塵縮钱 -同自喷嘴3G散布。另，於結束間隔物散布之時間點容 益11内會存在有未g&置於散布對象之電極圖案21的間隔物 3〇。在打開排氣口 lla時，將殘留於容㈣内之間隔物_ 出，以使该間隔物30不會附著於前後之電極圖案21。 〔步驟S06〕在結束利用步驟奶之間隔物散布處理 後’控制裝置6G係對按壓機構部14a、按壓機構部⑽指示 開放狀態’並使各自之按壓件15a、按壓件⑼朝上方向旋 轉，藉此，解除薄膜基板20上側位置之固定。又，容器u 之排氣口 11a會打開。 〔步驟S07〕控制裝置60係指示電動機17，並使桌台16 下降，藉此，解除薄膜基板20下側位置之固定，且使薄膜 基板20可搬送。在此，回到步驟s〇1，並實行起自薄膜基板 20之搬送的處理。 另，前述處理順序可由電腦來實行，此時，提供記述 有控制裝置應有機能之處理内容之程式。藉由利用電腦來 實行該程式，前述處理順序可藉由電腦來實行。記述有處 理内容之程式可記錄在能利用電腦來讀取的記錄媒體。 使程式流通時，舉例言之，販賣業已記錄該程式之 DVD(數位多功光碟，Digital Versatile Disc)、CD-ROM(光 201131238 碟唯讀記憶體，Compact Disc Read 〇nly Mem〇ry)等可搬型 記錄媒體。又，亦可將程式收納於伺服器電腦之記憶裝置， 並透過網路，將該程式自伺服器電腦轉送至其他電腦。 實行程式之電腦係例如將記錄在可搬型記錄媒體之程 式或轉送自祠服器電腦之程式收納於自己的記憶裝置， 又’電腦會從自己的記憶裝置讀取程式，並實行依據程式 之處理。另，電腦亦可自可搬型記錄媒體直接讀取程式， 並貫行依據該程式之處理。又’電腦亦可在每次自祠服器 電腦轉送程式時，逐次地實行依據所接收程式之處理。 C圖式簡單説明】 第1圖係顯示實施形態之間隔物散布裝置之構造例之圖。 第2圖係顯示間隔物散布系統之全體構造之一例之圖。 第3圖係顯示控制裝置之硬體構造例之方塊圖。 第4(A)、4(B)圖係顯示於間隔物散布程序中的間隔物散 布裝置之狀態圖。 第5圖係顯示與電極圖案接觸之短路固定物領域圖。 第6圖係顯示利用控制裝置之間隔物散布處理順序之 流程圖之一例。 第7圖係顯示習知間隔物散布程序中所使用的間隔物 散布裝置之一例之圖。 【主要元件符號說明】 11，90a.··容器 13, 90b...噴嘴 11a...排氣口 (搬送口） 14a，14b...按壓機構部 I2,90d.··配管 15a, 15b·..按壓件 19 201131238 16，90c···桌台 17.. .電動機 18.. .控制部 20.. .薄膜基板 21，21a, 21b，21c，21d...電極圖案 30，91...間隔物 40a，40b·.·薄膜捲繞滾輪 50.. .間隔物供給裝置 60.. .控制裝置 92.. .基板 151a, 151b...短路固定物領域 601…中央處理單元(CPU) 602.. .隨機存取記憶體(RAM) 603.. .硬磁碟驅動機(HDD) 604.. .繪圖處理裝置 605.. .輸入介面 606.. .通信介面 607.. .匯流排 608.. .監視器 609a...鍵盤 60%...滑鼠 S01-S07...步驟 20BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a spacer spreading device for distributing a spacer to an electrode pattern which has been formed on a substrate, a spacer scattering method, and a method for using the spacer A method of manufacturing a liquid crystal panel of a material spreading device. c. Prior art 3 Background of the Invention In the manufacture of a liquid crystal panel, in order to maintain the interval between the liquid crystal panels, metal fine particles, synthetic resin fine particles, inorganic fine particles, and the like, which are referred to as spacers, are disposed on the electrode patterns which have been formed on the substrate. Spacer spread program. One of the methods of dispersing the spacer includes a spacer scattering method of spraying the spacer together with the compressed air to the substrate. In the spacer spreading procedure, the spacer must be uniformly disposed on the substrate from the viewpoint of quality, and various methods for uniformly spreading the spacer have been disclosed. Fig. 7 is a view showing an example of spacer scattering used in the conventional spacer scattering procedure. The spacer spreading device is provided with a mouth 90b' through which the spacer 91 can be disposed at the upper end of the container 90a which is in a sealed or nearly closed state, and a table 9〇c is disposed under the nozzle 9〇b, and the table 9〇c is disposed The substrate 92 that adsorbs and holds the spacers is dispersed. When the spacer scattering program is started, the substrate 92 is transported into the container 9Ga by the transport device, and is placed on the table eight people's spacers 91 that are transported together with the compressed air through the pipe 9〇d. Spread toward the substrate 92. The spacer 91 is positively or negatively charged when it is transported by the compressed air 201131238 equal to the inside of the pipe 90d. Since the spacers 91 are charged in the same polarity, the mutually repelled each other and are more uniformly dispersed. At this time, if the electrode potentials of the substrates 92 on which the spacers 91 are dispersed are the same, the spacers 91 can be uniformly spread on the substrate 92. However, when the spacer is spread on the substrate having the electrode on the surface, if a potential difference occurs between the electrodes, the scattered cancer of the spacer differs between the electrodes. Therefore, there has been disclosed a method in which a plurality of electrodes which have been formed on a substrate are applied with a voltage having the same polarity as that of the spacer, and a spacer is scattered by a repulsive force acting on the spacer (for example, refer to the patent document) 1 or patent document 2). [Patent Document 1] Japanese Laid-Open Patent Publication No. 2002-258316 (Patent Document 2) International Publication No. 00/31580 C Disclosure of the Invention 3 Problems to be Solved by the Invention In recent years, liquid crystal panels are also required to be light. In order to reduce the thickness and thickness, a liquid crystal panel using a resin substrate has been popularized instead of a liquid crystal panel using a glass substrate. However, the conventional spacer spreading device is based on a glass substrate, and if it is directly applied to a resin substrate, there is a problem that it is difficult to uniformly spread the spacer. For example, a resin substrate (especially a film substrate) is generally more easily charged than a glass substrate, and since the rigidity is also low, in the example of Fig. 7, the friction with the table 90c is easily generated, and The static 201131238 electricity generated by friction has a problem that it is difficult to uniformly arrange the spacer 91. Further, since the resin substrate is characterized in that it can be made thinner or has higher flexibility, it is also included in the case of forming a plurality of electrode patterns in a thin roll-shaped raw material substrate. In the manufacturing procedure of the liquid crystal panel using the resin substrate having such a shape, the resin substrate 'before being processed before being wound around the roller is sequentially fed and conveyed into the spacer scattering device to spread the spacer 91, and borrowed The resin-made substrate on which the winding has been completed is wound by the roller on the winding side. In such a configuration, the resin substrate in which the spacer 91 is dispersed is fixed only by the force of the roller on the feed side and the roller on the winding side. Further, the same is true when the guide roller is disposed on the way, and the position of the resin substrate is fixed by the guide roller. Therefore, for example, there is a problem in that the resin substrate is moved in the vertical direction by the wind pressure of the compressed air discharged together with the spacer 91. At this time, the table top of the table 90c located below is rubbed against the resin substrate to generate friction, and static electricity is generated due to friction, and by the influence of the static electricity, the charged spacers cannot be uniformly distributed. The crucible on the resin substrate. Further, when the resin substrate is transferred, the resin substrate is also passed over the table 9〇c, so that the same problem occurs. In view of the above, it is an object of the present invention to provide a spacer substrate and a spacer which can be disposed on a resin substrate which is easy to be rubbed by the wind pressure or the like and which generates static electricity when the spacer is dispersed. Dispersion method and method of manufacturing a liquid crystal panel. In order to solve the above problems, the present invention provides a spacer spreading device that includes a pressing mechanism portion and a control portion, and spreads the 201131238 spacer on an electrode pattern that has been formed on the substrate. . The pressing mechanism portion has a pressing member, and switches between the first state and the second state in accordance with the instruction, and the pressing member is a resin substrate in which a plurality of electrode patterns are successively formed at predetermined intervals in the container of the spacer distributing device toward the electrode When the pattern is conveyed in the same direction, and the spacer is dispersed, the movable member for suppressing the resin substrate in the container of the spacer scattering device; and the first state is such that the pressing member is separated from the resin substrate, the first In the 2 state, the pusher is placed on the resin substrate. When the resin substrate is transferred, the control unit instructs the pressing mechanism unit to instruct the first state to transport the resin substrate. Further, when the electrode pattern of the scattering target on the resin substrate reaches a predetermined position and the spacer is spread in the electrode pattern of the scattering target, the second state is instructed to the pressing mechanism portion to suppress the movement of the resin substrate. Further, in order to solve the above problems, a spacer scattering method and a method of manufacturing a liquid crystal panel in the same processing order as described above are also provided. According to the disclosed spacer scattering device, the spacer scattering method, and the method for manufacturing the liquid crystal panel, the resin substrate "which is likely to generate static electricity due to wind pressure or the like when the spacer is dispersed and generated by the spacer can be dispersed by the spacer. The pressing mechanism portion suppresses the movement of the resin substrate and prevents static electricity caused by friction with the surroundings. Further, by preventing the generation of the static electricity, the spacer can be disposed on the resin substrate without unevenness. BRIEF DESCRIPTION OF THE DRAWINGS Fig. 1 is a view showing a configuration example of a spacer spreading device according to an embodiment. Fig. 2 is a view showing an example of the entire structure of the spacer scattering system. 201131238 Fig. 3 is a block diagram showing a hardware structure example of the control device. The state diagram of the fourth (Α), 4 (······················ Fig. 6 is a view showing an example of a flow chart of a spacer dispersion processing procedure by a control device. Fig. 7 is a view showing an example of a spacer scattering device used in a conventional spacer scattering program. [Embodiment] Embodiments of the present invention will be described below with reference to the drawings. Fig. 1 is a view showing a structural example of a spacer spreading device according to an embodiment. The film substrate 20 is subjected to a spacer scattering process, and the film substrate 20 is formed by successively forming a separate electrode pattern on a film-shaped thin resin substrate. The spacer scattering device includes a container 11 of the outer casing; and the spacer 30 is transported to the container. The pipe 12 in the 11; the nozzle 13 in which the spacer 30 is scattered; the pressing mechanism portion 14a and the pressing mechanism portion 14b of the film substrate 20; the table 16 on which the film substrate 20 is placed; and the moving table 16 The motor 17 and the control unit 18. The container 11 is a housing of the spacer spreading device, and the spacer distributing device can be sealed or nearly sealed. The lower portion is provided with an exhaust port 11a' and the exhaust port lia is The compressed air discharged into the container 11 together with the spacer 30 is discharged. In the example of Fig. 1, the exhaust port 11a also serves as a transfer port for transporting the film substrate 20 into the spacer scattering device. The pipe 12 is connected to the nozzle 13 disposed at the upper end of the container, and the spacer 30 is sent together with the compressed air toward the nozzle 13. The nozzle 13 is a spacer that flows through the valve 12 The electrode pattern 21a disposed under the nozzle 13 is dispersed together with the compressed air. The pressing mechanism portion 14a and the pressing mechanism portion 14b are respectively disposed on the side surface of the container 附近 in the vicinity of the exhaust port ila which serves as the transfer port of the transport film substrate 20. The pressing mechanism portion 14a and the pressing mechanism portion 14b on the inside of the container 11 respectively have a pressing member 15a and a pressing member 15t which are activated according to the instruction. The pressing member 15a and the pressing member 15b have the following In a state in which it is disposed on the film substrate 20, the exhaust port 11a can be blocked, and the inside of the container 11 can be sealed or nearly closed. Further, the pressing member 15a' of the first example can be pressed. The connection point (rotation axis) of the pressing mechanism portion 14a and the pressing mechanism portion 14b is rotated as a center. The direction in which the pressing member 15a and the pressing member 15b are separated from the film substrate 20 is referred to as an upward direction (in the figure, the pressing member) 15a rotates counterclockwise, 'the pusher 15b rotates clockwise,' and the direction arrange|positioned on the film substrate 2 turns into the downward direction (The 1st figure is the rotation of the presser 15a clockwise, and the presser 15b is counterclockwise. Rotate). Further, the state in which the pusher 15a and the pusher 15b are rotated upward and separated from the film substrate 2 is referred to as a first state or an open state. In the first state (open state), the pusher 15a and the pusher 15b are separated from the film substrate 20' and the exhaust port 11a is opened. The movement of the film substrate 20 in the transport direction can also be performed freely. On the other hand, the state in which the pusher 15a and the presser 15) 3 are rotated in the downward direction (the direction close to the film substrate 2) and disposed on the film substrate 2A and the film substrate is pressed down is called 201131238 second state. Or suppress the activity status. In the second state (suppressed state), the pressing member 15a and the pressing member 15b are disposed on the film substrate 2, and the movement of the film substrate 20 is suppressed. In the example of Fig. 1, the table substrate 16 disposed on the lower surface of the film substrate 2 is placed facing the substrate surface of the enamel substrate 2, and the pressing member i5a and the pressing member 15b sandwich the film substrate 20, and the table top is suppressed. The activity of the upper film substrate 2 is performed. Thereby, it is possible to prevent static electricity generated by the friction between the film substrate 2 and the table top when the spacer is dispersed. The switching between the first state (open state) and the second state (suppressed active state) is performed by an instruction from the control unit 18. Further, in the example of Fig. j, the pusher 15a and the pusher 15b are rotated upward or downward, but may be raised or lowered in the vertical direction. The table 16 is disposed under the container , and has a table top that supports the film substrate 20 from the lower side. Further, the vertical movement mechanism is provided, and the vertical movement mechanism moves the position of the table top up and down by the driving force generated by the motor 17. The up-and-down motion mechanism can be suitably used as a generally known mechanism, and includes, for example, a slide mechanism which is a portion to which the motor 17 is connected and which slides the table body in the up-and-down direction. The control unit 18 is connected to the pressing mechanism unit 4a, the pressing mechanism unit 4b, and the motor unit, and gives an operation instruction to the pressing mechanism unit 14a, the pressing mechanism unit 14b, and the motor 17 in accordance with the processing procedure of the spacer spreading program. Here, the film substrate 2〇' is transported, and the electric pattern of the loose cloth is placed at a predetermined position in the mouth of the mouth of the mouth, and when the spacer 3 is spread, the conveyance is stopped, and the table 16 is instructed to rise, and the pressing mechanism is pressed. The portion 14a and the pressing mechanism portion instruct the operation state to be suppressed, and the table 16 is moved upward, so that the pressing = 201131238 15a and the pressing member 15b are moved downward. Thereby, the film substrate 2 is sandwiched between the lower side of the table 16 and the upper side is held by the pressing member i5a and the pressing member, and the movement of the spacer 30 is suppressed during the dispersion of the spacer 30. When the film substrate 2 is conveyed in the conveyance direction, the table 16 is instructed to descend, and the pressing mechanism portion i4a and the pressing mechanism portion 14b are in an open state, and the table 16 is moved downward to press the pressing member 15a and the pressing member 15a. The piece 15b moves in the upward direction. Thereby, a space is generated in the upper direction and the lower direction of the film substrate 20, and the film substrate 2 can be moved in the transport direction. The film substrate 20 is a resin substrate, and the resin substrate has an electrode pattern 2ia, an electrode pattern 21b, and an electrode pattern 21c which are formed on a roll-shaped raw material film substrate. For example, the raw material film substrate includes: pet (polyethylene terephthalate), PEN (polyethylene naphthalate), and the like. An electrode pattern 21a, an electrode pattern 21b, and an electrode pattern 21c which are formed by vapor deposition of tantalum (indium tin oxide, Indium Tin Oxide, transparent electrode film) on a raw material film substrate and predetermined patterning are formed. The electrode pattern 21a, the electrode pattern 21b, and the electrode pattern 21c are successively arranged on one surface of the film substrate 20 at predetermined intervals. Here, the electrode pattern 21a, the electrode pattern 21b, and the electrode pattern 21c are arranged in a line with respect to the transport direction. Further, in the following description, the electrode pattern 21 is marked as "the electrode pattern 21a, the electrode pattern 21b, and the electrode pattern 21c are not particularly specified". The action of the spacer spreading device of this configuration and the method of distributing the spacers will be described. On the upper surface of the film substrate 2 shown in Fig. 1, 10 201131238 electrode pattern 21a and electrode pattern 21b' electrode pattern macro 21^ are formed at regular intervals. The binder substrate 2 is sequentially conveyed in the transport direction (from left to right in Fig. 1). Hereinafter, the electrode pattern 21a will be described as a scattering object. At present, the electrode pattern of the scattering object is called to be in a state of being stopped at a predetermined position below the nozzle. The control unit 18 is configured to drive the (four) machine 17 to instruct the table 16 located at a position (below) away from the film substrate 20 to rise, and to indicate the pressing state of the pressing mechanism portion 14a and the pressing mechanism portion 14b, and to press the pressing member. 15a, the pressing member 15b operates in the downward direction. By the driving force of the motor 17, the table 16 located at a position (downward) from the film substrate 20 rises and stops at a position directly below the film substrate 20. Further, the pressing mechanism portion 14a and the pressing mechanism portion Mb rotate the respective pressing members 15& and the pressing member 15b in the downward direction, and the pressing members 15a and the pressing members 15b are in contact with the film substrate 20 (the state in which the film is pressed). stop. Thereby, the film substrate 20 is placed at the front and rear positions in the conveyance direction of the electrode pattern 21a to be spread, and the table 16 is sandwiched between the pressing member I5a and the pressing member i5b, and the movement is suppressed. In particular, the electrode pattern 2U that is clamped to the pressing member 15a and the pressing member 15b before and after is fixed to the table top of the table 16 in the vicinity thereof. At this time, the pressing port 11a is closed by the pressing member 15a and the pressing member 15b, and in this state, the spacer 3 is spread from the nozzle 13. Since the electrode pattern 21a and the periphery thereof are restrained by the pressing member 15a, the pressing member 15b, and the table 16, the ejection air is not easily moved even if it is sprayed, and the static electricity which is caused by the film substrate 20 rubbing against the periphery is less likely to occur. Thereby, the spacers 30 can be uniformly disposed on the electrode pattern 21a. After the completion of the dispersion of the spacers in the electrode pattern 21a, the control unit 18 drives the motor 31 at the 201131238, instructs the table 16 to descend, and instructs the pressing mechanism portion 14a and the pressing mechanism portion 14b to open, and causes the pressing member 15a. The pressing member 15b is rotated upward. Thereby, the film substrate 20 is pressed from the pressing member 15a of the electrode pattern 21a to be dispersed, and the pressing member 15b and the table 16 are opened, and at this time, by the pressing member 15a, The exhaust port 11a that is blocked by the pressing member 15b is also opened. In order to prevent the unnecessary spacer 30 from adhering to the surrounding electrode pattern 21b and the electrode pattern 21c, after the spacer 30 not disposed in the container 11 of the electrode pattern 21a is discharged, the pressing member 15a and the pressing member 15b should be opened. status. Accordingly, the pusher 15a, the pusher 15b, and the table 16 that hold the film substrate 20 are separated from the film substrate 2, and the film substrate 2 can be moved in the transport direction. Further, the film substrate 2 is moved in the conveyance direction, and the electrode pattern 21a which has been subjected to the dispersion treatment is carried out to the outside of the container 11. At this time, the electrode pattern 21c of the next scattering target enters the container η, and when the electrode pattern 21c reaches a predetermined position below the nozzle 13, the film substrate 2 is stopped, and the electrode pattern 21c is formed as a scattering object. The same order as described above. By performing the above processing procedure, when the spacer substrate 14a, the pressing mechanism portion 14b, and the table 16 are sandwiched between the spacers, the film substrate 21 can be prevented from being moved around the electrode pattern 21 and the surroundings thereof. Since the static electricity is prevented, the spacers 3 are uniformly dispersed in the electrode pattern 2, and when the film substrate 20 is transported, the pressing mechanism portion 14a, the pressing mechanism 414b, and the table 16 are separated from the film substrate 2, The film substrate 2 is opened, and the film substrate 20 can be freely moved. In addition, in the description, the table 16 is raised or lowered by the operation of the pressing mechanism unit 14a and the pressing mechanism unit 14b. However, even if the table is made up of 12 201131238, only the pressing mechanism unit is used. 14a, the operation of the pressing mechanism portion Ub suppresses the movement of the film substrate 20, and the same effect can be obtained. It is owed, indicating a spacer spreading procedure using a spacer spreading device. First, the overall configuration of the spacer spreading system that implements the spacer spreading procedure will be described. Fig. 2 is a view showing an example of the overall construction of the spacer scattering system. The spacer scattering system includes a spacer spreading device shown in Fig. 1, and a film winding roller 40a, a film winding roller 4〇b, a spacer supply device 50, and a control device 60. The container 丨1, the pipe 12, the nozzle π, the pressing mechanism portion 14a, the pressing mechanism portion 14b, the table 16 and the motor 17 which constitute the spacer spreading device are the same as the same components as those shown in the first figure. The control unit 18 shown in Fig. 1 is incorporated in the structure of Fig. 2 into the control unit 60. The film substrate 2 before the spacer scattering process is wound around the film winding roller 40a, and the film substrate 2 which has been subjected to the spacer scattering treatment is wound around the film winding roller 40b. The film winding roller 4A and the film winding roller 40b are intermittently operated in accordance with the instruction of the control device 60, and the film substrate 2 is conveyed from the film winding roller 40a toward the film winding roller 4b. The direction in which the film substrate 20 is advanced at this time is set as the conveyance direction. The spacer supply device 50 discharges the spacer 30 and the compressed air (Air or nitrogen (N2)) to the pipe 12 in accordance with an instruction from the control device 6A. When the spacer 30 passes through the pipe 12, it is positively charged (+) or negatively charged (-). The following is done with positive (+). The control device 60 has the same function as the control unit 18, and simultaneously controls 13 201131238 film winding roller 40a, film winding roller 4〇b, and spacer supply device 50, and manages the entire spacer spreading program. Here, the hardware configuration of the control device 60 will be described. Fig. 3 is a block diagram showing a hardware configuration example of the control device. The control device 60 controls the entire device by a CPU (Central Processing Unit) 601. Through the bus bar 607, a RAM (Rand〇m Access Memory) 602, a hard disk drive (hDd: Hard Disk Drive) 603, a graphics processing device 604, an input interface 6〇5, and communication are connected to the CPU 601. Interface 6〇6. At least a part of the program or the application of the operating system (CPU) is temporarily stored in the rAM6〇2, and the various data necessary for the processing of the CPU 601 is stored in the RAM6〇2. 〇s or the application program is stored in HDD603. The display processing unit 604 is connected to the monitor 608, and the image is displayed behind the monitor 608 in accordance with a command from the CPU 6〇1. A keyboard 6〇9a or a mouse 609b' is connected to the input interface 6〇5 and transmits a signal transmitted from the keyboard 6〇9a or the mouse 6〇9b to the CPU 601 through the bus bar 607. The communication interface 6〇6 is connected to the pressing mechanism unit 14a, the pressing mechanism unit 14b, the motor 17, the film winding roller 4〇a, the film winding roller 40b, the spacer supply device 5〇, etc. through the communication path, and is transmitted and received. Action indication from CPU6G1. X, accepts the response from each part, and transmits it to the CPU 601 through the bus 607. With such a hardware configuration, the processing function of the control device 60 can be achieved. Next, the spacer scattering procedure will be explained. Fig. 4 is a state diagram showing the spacer scattering device in the spacer scattering program, and Fig. 4(A) shows the state of the thin film 14 201131238 when the film substrate is conveyed, and the fourth (B) shows the spacer scattering. State. (A) When the film substrate is conveyed, the table 16 on the lower side of the film substrate 20 is lowered according to the instruction of the control device, and the pressing mechanism portion 14a and the pressing member 15a and the pressing member 15b of the pressing mechanism portion 14b are moved upward. Further, the exhaust port 11a is also open. In this state, the film substrate 2 can be moved in the transport direction. The control device 60 operates the film winding roller 4〇a and the film winding roller 4〇b, and moves the film substrate 20 until the electrode pattern 21c of the next object reaches a predetermined position below the nozzle 13. (B) When the spacer is dispersed, the table 16 on the lower side of the film substrate 20 rises to the lower side of the film substrate 2〇, and the pressing mechanism portion 14a and the pressing member 15a of the pressing mechanism portion 14b are pressed in accordance with the instruction of the control device 6〇. The pressing member 15b is lowered onto the film substrate 20, and the exhaust port ua is blocked by the pressing member 15a and the pressing member 15b. In this state, the film substrate 21 is entangled by the surface of the table 16 and the pressing member 15a and the pressing member 15b before and after the electrode substrate 21 is dispersed, so that the movement of the film substrate 2 can be suppressed and prevented. The static electricity formed by the friction between the table top and the film substrate 20 which is hindered by the uniform dispersion of the spacers 30 is formed. Further, since the exhaust port 11a is clogged, there is no possibility that the spacer 30 which is not attached to the electrode pattern 21a is discharged from the exhaust port Ua together with the compressed air. Thereby, it is possible to prevent the electrode pattern 213 and the electrode pattern 21d from being scattered from the exhaust port " a exhaust gas to the electrode pattern 213 and the electrode pattern 21d before and after the electrode pattern 21c together with the compressed air. However, in the above-described structure, the film substrate is sandwiched by the pressing mechanism portion 14a, the pressing mechanism portion 14b, and the table 16 when the spacer is dispersed, and the static electricity is prevented by suppressing the movement of the film substrate 20. In addition, by the uniformization of the charged state between the patterns by 15 201131238, the spacer dispersion without unevenness can be further formed. As shown in Fig. 4(B), when the spacer is dispersed, the pusher 15a and the pusher 15b are in contact with the film substrate 20 around the electrode pattern 21a of the scattering object. Here, when the short-circuit fixing material is provided and the pressing member 15a and the pressing member 15b are moved in the downward direction to come into contact with the film substrate 20, the electrode pattern 21 to be spread is short-circuited. For example, in the contact surface where the pressing member 15a and the pressing member 15b are in contact with the film substrate 2, a pattern which is electrically connected to the electrode pattern 21 and short-circuits the electrode pattern 21 is formed. Fig. 5 is a view showing a field of short-circuit fixings in contact with an electrode pattern. The electrode pattern 21 is an example of an electrode pattern formed on the film substrate 2A. The short-fixed area 15U and the short-circuit fixed object area (10) are shown on the pressing member 5: her 5b is disposed on the film substrate 2. The film substrate 2 is on top. The overlapping item field. Short-circuit fixture area 151 The electrode pattern field is the same as the film. When the pressing member (10) presses the phase substrate 2, it is connected to the short-circuit-fixed noon 15 just to the side of the electrode pattern 21 to be short-circuit-electrically connected. In the field of '1 training overlap, the 丄/7-member domain 15U, the short-circuit fixture area, the functional electrode is made to have the same potential; the ==备^ can be connected and the spacer 3 can be placed. The configuration is more uniform, and the arrangement of the electrode patterns 21 can be spread. The arrangement of the spacer dispersion processing is carried out. 16 201131238 The film substrate 20 in which the electrode patterns are successively formed is attached to the film winding roller 40a and the film winding roller 40b, and a spacer scattering process is started. [Step S01] The control device 60 activates the film winding roller 40a and the film winding roller 40b, and moves the film substrate 20 in the conveying direction. Further, the film winding roller 40a and the film winding roller 40b are instructed to move the film substrate 20 until the portion of the electrode pattern 21 on which the spacer dispersion processing is formed reaches a predetermined position below the nozzle 13. The film substrate 20 is conveyed by the operation of the film winding roller 40a and the film winding roller 4〇b, and the electrode pattern 21 to be spread reaches the nozzle 13. At this time, the electrode pattern 21 in which the spacer scattering process has been completed is simultaneously conveyed to the outside of the container 11. [Step S02] The control device 60 checks the presence or absence of the electrode pattern 21 of the scattering object 3〇. It is also possible to directly determine the presence or absence of the electrode pattern 21 and also to set the number of electrode patterns 21 to be registered in advance, and to deduct it every time the dispersion is completed, and to detect the last electrode pattern 21. When the electrode pattern 21 of the object is scattered, the process proceeds to step S03, and when the electrode pattern 21 of the object is not scattered, the spacer spreading program is ended. [Step S03] When the electrode pattern 21 to be spread is dispersed, the control device 6 stops the film winding roller 40a and the film winding roller 4〇b, and starts the spacer scattering program. At the same time as the drive motor 17, the table 16 is instructed to rise and the table top of the table 16 is moved to a predetermined position directly below the film substrate 2, whereby the position of the lower side of the film substrate 2 is fixed. [Step S04] The control device 6 instructs the pressing mechanism portion 14a and the pressing mechanism portion 14b to suppress the active state, and rotates the respective pressing members 15a and 15b in the downward direction. The pressing member 15a and the pressing member 15b are stopped in a state where the film 17 is pressed, and the upper side of the film substrate 2 is fixed. Also, the exhaust port 11 of Guyi 11 will be blocked. [Step S05] The control device 6 is configured to manufacture the spacer supply device 5G and the nozzle 13 in a state in which the table 16 and the waste mechanism unit 1 are in the state of riding the thin board member. The spacer is dusted and shredded - it is spread from the nozzle 3G. Further, at the time point 11 in which the spacer is dispersed, there is a spacer 3〇 which is not placed in the electrode pattern 21 of the scattering object. When the exhaust port 11a is opened, the spacers remaining in the capacitor (4) are discharged so that the spacers 30 do not adhere to the front and rear electrode patterns 21. [Step S06] After the completion of the spacer dispersion processing by the step milk, the control device 6G instructs the pressing mechanism portion 14a and the pressing mechanism portion (10) to open the state, and rotates the pusher 15a and the pusher (9) upward. Thereby, the fixing of the upper side position of the film substrate 20 is released. Further, the exhaust port 11a of the container u is opened. [Step S07] The control device 60 instructs the motor 17 to lower the table 16, thereby releasing the fixing of the lower position of the film substrate 20 and allowing the film substrate 20 to be conveyed. Here, the process returns to step s1, and the process of transporting from the film substrate 20 is carried out. Further, the above-described processing sequence can be executed by a computer, and at this time, a program for describing the processing contents in which the control device should be organic can be provided. The program can be executed by a computer by using a computer to execute the program. The program describing the processed content can be recorded on a recording medium that can be read by a computer. When the program is distributed, for example, the DVD (Digital Versatile Disc) and CD-ROM (Compact Disc Read 〇nly Mem〇ry) of the program have been recorded. Moving recording media. In addition, the program can be stored in the memory device of the server computer, and the program can be transferred from the server computer to other computers through the network. For example, the computer that implements the program stores the program recorded on the portable recording medium or the program transferred from the server to its own memory device, and the computer reads the program from its own memory device and executes the processing according to the program. . In addition, the computer can also directly read the program from the portable recording medium and follow the processing of the program. In addition, the computer can also perform the processing according to the received program one by one each time the computer transfers the program. BRIEF DESCRIPTION OF THE DRAWINGS Fig. 1 is a view showing a configuration example of a spacer spreading device of an embodiment. Fig. 2 is a view showing an example of the entire structure of the spacer scattering system. Fig. 3 is a block diagram showing a hardware configuration example of the control device. Figures 4(A) and 4(B) are diagrams showing the state of the spacer scattering device in the spacer spreading program. Fig. 5 is a view showing a field of short-circuit fixings in contact with an electrode pattern. Fig. 6 is a view showing an example of a flow chart of the processing procedure of the spacer dispersion by the control means. Fig. 7 is a view showing an example of a spacer scattering device used in a conventional spacer scattering procedure. [Description of main component symbols] 11, 90a.·· Container 13, 90b... Nozzle 11a... Exhaust port (transport port) 14a, 14b... Pressing mechanism unit I2, 90d.··Pipe 15a, 15b ·..Pressing member 19 201131238 16,90c···Table 17:. Motor 18.. Control unit 20.. Film substrate 21, 21a, 21b, 21c, 21d... Electrode pattern 30, 91. .. spacers 40a, 40b·.·film winding roller 50.. spacer supply device 60.. control device 92.. substrate 151a, 151b... short-circuit fixed object area 601... central processing unit (CPU 602.. . Random Access Memory (RAM) 603.. . Hard Disk Drive (HDD) 604.. . Drawing Processing Device 605.. Input Interface 606.. Communication Interface 607.. . Bus Bar 608.. monitor 609a... keyboard 60%... mouse S01-S07... step 20