201128646 六、發明說明： 【發明所屬之技術領域】 [0001] 本發明係有關一種燒錄裝置，特別係有關一種使用USB介 面以進行資料線上燒錄之介面裝置。 【先前技術】 [0002] 在以往晶片IC的生產與測試過程中，藉由I /0介面可對晶 片1C内之記憶體進行程式/資料之線上燒錄 ISP(In-System Prog ramming)/線上測試 IST(In-System Test)。然，當廠商將所有零件與晶片 1C焊接於電路板PCB (printed circuit board)而成 為1C產品後，就無法再以I/O介面連接ISP/IST單元進入 晶片1C之燒錄/測試模式。主要原因在於進入1C產品之後 ，此時晶片1C的I/O介面已經被設定在一般模式下，同時 連接在電路板PCB上之外部零件會干擾晶片1C内的MCU微 控制器與ISP/ 1ST介面之間的溝通。所以當晶片1C焊接 在電路板PCB上之後，就無法藉由ISP/IST單元以改變晶 片1C内記憶體之程式或資料。 [0003] 為了解決以上問題，習知之解決方式係透過USB介面以連 接電腦系統PC與單晶片1C，透過USB介面之資料傳輸 方式，使得晶片1C之MCU微控制器在工作狀態下直接與電 腦系統PC溝通，以對晶片1C内之記憶體進行線上程式/資 料之燒錄。不過對於少量的資料燒錄，需大費周章開啟 電腦系統PC藉由USB介面以對晶片1C進行程式/資料燒 錄，實有「殺雞焉用牛刀」之感。換言之，這樣作法效 率不彰且耗費時間。因此，如何改善目前IC的設計架構 099103114 表單編號A0101 第4頁/共16頁 0992005859-0 201128646 ’以更有效率之方式線上燒錄晶片1C之程式/資料，實為 本發明所欲解決之問題。 【發明内容】 [0004] Ο Q [0005] 為了解決上述先前技術之問題與缺失，本發明提供一種 使用USB介面之燒錄裝置’包含有欲進行線上燒錄之單晶 片與外部燒錄單元，而此欲燒錄之單晶片包含：USB介面 控制模組、線上燒錄測試模組、記憶器模組、資料輸出 入介面模組及MCU微控制模組，其中此USB介面控制模組 係根據M C U微控制模組進入開機重置狀態之短暫時間内， 以決定此欲燒錄之單晶片係進入資料燒錄模式或u s Β資料 傳輸模式。而此線上燒錄測試模組係連接此USB介面控制 模組以進行資料之燒錄與測試。此外部燒錄單元藉由一 USB介面連接該欲燒錄之單晶片之USB介面控制模組，而 在一預設時間送出一不同於USB時脈資料之燒錄時脈資料 至此USB介面控制模組，以確保此欲燒錄之單晶片進入一 資料燒錄模式。 因此’本發明气主要目的為提供一種使用USB介面之燒錄 裝置，藉由將外部燒錄單元串接在電腦系統pc以連接至 此欲燒錄之單晶片，可在不需要啟動MCU微控制模組在工 作的狀態下，使得外部燒錄單元可與單晶片内之線上燒 錄測試模組直麟通，以對記,(ftn模組之資料/程式進行 線上燒錄。因此可避免MCU微控制模組在工作的狀態下， 造成線上燒錄測試模組與記憶器模組之間的燒錄作動變 得缓慢，據此大幅提高3之資料/程式線上燒錄的效率 099103114 表單編號A0101 第5頁/共16頁 0992005859-0 201128646 [0006] [0007] [0008] ^發明之次要目的為提供-種使用咖介面之燒錄裝置， ^選擇脫離電腦系統PG而使得外部燒錄單元單獨 上landalGne)串接在此單晶片，以進行此單晶片之線 植 免電腦糸統PC涉入，而造成線上 堤錄測試模組與記憶器 模組之間的的燒錄作動變得緩慢 據此大幅提馬晶片之杳伞立/ 4 <貝枓/私式線上燒錄的效率。 【實施方式】BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a burning device, and more particularly to an interface device using a USB interface for data line burning. [Prior Art] [0002] In the production and testing of wafer ICs in the past, the I/O interface can be used to program ISP (In-System Prog ramming)/line on the memory of the memory in the chip 1C. Test IST (In-System Test). However, when the manufacturer solders all the parts and the chip 1C to the printed circuit board as a 1C product, it is no longer possible to connect the ISP/IST unit to the programming/test mode of the chip 1C by the I/O interface. The main reason is that after entering the 1C product, the I/O interface of the chip 1C has been set in the normal mode, and the external components connected to the PCB of the circuit board will interfere with the MCU microcontroller and the ISP/1ST interface in the chip 1C. Communication between. Therefore, after the wafer 1C is soldered on the circuit board PCB, the program or data of the memory in the wafer 1C cannot be changed by the ISP/IST unit. [0003] In order to solve the above problem, the conventional solution is to connect the computer system PC and the single chip 1C through the USB interface, and the data transmission mode of the USB interface is used to make the MCU microcontroller of the chip 1C directly work with the computer system under the working state. The PC communicates to program the online program/data for the memory in the chip 1C. However, for a small amount of data burning, it is necessary to open a large amount of money. The computer system PC uses the USB interface to program/data the wafer 1C, which has the feeling of "killing the chicken and using the knife." In other words, such an approach is inefficient and time consuming. Therefore, how to improve the current IC design architecture 099103114 Form No. A0101 Page 4 / Total 16 Pages 0992005859-0 201128646 'The program/data of the chip 1C is burned online in a more efficient way, which is the problem to be solved by the invention. . SUMMARY OF THE INVENTION [0004] In order to solve the above problems and deficiencies of the prior art, the present invention provides a single-chip and external programming unit for performing online programming using a USB interface burning device. The single chip to be burned includes: a USB interface control module, an online programming test module, a memory module, a data input and output interface module, and an MCU micro control module, wherein the USB interface control module is based on The MCU micro-control module enters the power-on reset state for a short period of time to determine whether the single chip to be burned enters the data burning mode or the us Β data transmission mode. The online burning test module is connected to the USB interface control module for data burning and testing. The external programming unit connects the USB interface control module of the single chip to be burned by a USB interface, and sends a programming clock data different from the USB clock data to the USB interface control module at a preset time. Group to ensure that the single chip to be burned enters a data burning mode. Therefore, the main purpose of the present invention is to provide a programming device using a USB interface. By connecting an external programming unit in series with the computer system pc to connect to the single chip to be burned, it is not necessary to start the MCU micro control mode. In the working state, the external programming unit can be directly connected to the online burning test module in the single chip, so as to record, (the ftn module data/program is burned online. Therefore, the MCU micro can be avoided. When the control module is in operation, the programming between the online programming test module and the memory module becomes slow, thereby greatly improving the efficiency of the data/programming on the line 099103114 Form No. A0101 5 pages / total 16 pages 0992005859-0 201128646 [0006] [0007] [0008] The second purpose of the invention is to provide a device for burning the interface, ^ choose to leave the computer system PG and make the external programming unit separate The groundGne) is serially connected to the single chip, so that the single-chip line is free from the computer-based PC, and the burning operation between the online test module and the memory module becomes slow. This greatly raises the horse Yao Li sheet of umbrella / 4 < efficiency shell Tu / private line type of programming. [Embodiment]
;本發明係揭露-種使·SB介面之燒錄測試裝置，其 利用U S B資料傳輪與資料緣錄測試之基本原理 ，已為相 ^mm m m ^ ίΛΎΧ^^ 明，不再作完整描述。同時，以下文中所對照之圖式， 係表達與本發明特徵有關之結構*意，並未亦不需要依 據實際尺寸完整繪製’合先敘明。The invention discloses a burning test device for the SB interface, which utilizes the basic principle of the U S B data transfer wheel and the data margin record test, which has been the phase ^mm m m ^ ΛΎΧ ^^^, and will not be fully described. At the same time, the drawings referred to in the following text express the structure * meanings relating to the features of the present invention, and do not need to be completely drawn according to the actual size.
首先明參考第1圖’為本發明提出之第一較佳實施例，為 —種使用USB介面之燒錄裝置，包含有：欲燒錄之單晶片 10、外部燒錄單元18及PC電腦系統19。而此欲燒錄之單 a曰片10主要含有usi介面控制模組u、線上燒錄測試模組 12、記憶器模組13、資料輸出入介面模組微控 制模組15。其中外部燒錄單元18之USB介面180係對應PC 電腦系統之19之USB介面190以將外部燒錄單元18與PC電 腦系統19彼此連接。同樣地，單晶片1〇之USB介面110係 對應外部燒錄單元18之USB介面181以將單晶片1 〇與外部 燒錄單元18彼此連接。而上述USB介面之硬體線路係由一 電源端（Vcc)、一對差分正負訊號端（DP，DM)以及一接 地端（GND)所共同組成。在此單晶片1〇之内部結構中，線 0992005859-0 099103114 表單編號A0101 第6頁/共16頁 201128646 ❹ 上燒錄測試模組1 2係電性連接U S Β介面控制模組11與記憶 器模組1 3以線上進行内存此記憶器模組1 3之資料或程式 燒錄。此外，記憶器模組13進一步電性連接上述微控制 模組15，使得微控制模組15可掌握欲線上燒錄之資料或 程式在記憶器模組13所在位址與記憶器模組13之容量大 小等相關規格。資料輸出入介面模組14係以符合一般10 介面標準而連接此單晶片10外部之外部記憶裝置16與週 邊裝置17。此外，MCU微控制模組15係電性連接上述USB 介面控制模組11、記憶器模組13與資料輸出入介面模組 14以處理這些模組間的協調溝通。此外，記憶器模組13 可以是快閃記憶器模組（flash ROM)、閃存記憶器模組 (EEPR0M)與一次燒錄記憶器模組（OTP ROM)等其中任一 種。 [0009] 〇 請參考第3圖，在上述第一較佳實施例中，當PC電腦系統 19之電源一開啟後，欲燒錄之單晶片10藉由其USB介面 110之電源端（Vcc)接收到5伏特之供電後，使得單晶片 10之M C ϋ微控制模組15在時間11開始進入短暫的開機重 置（Power On Reset)狀態，也就是MCU微控制模組15進 入短暫的不工作狀態。此時，USB介面控制模組11開始介 入以進行USB介面110之模式偵測，並可在一預設時間約 200微秒（T1)，也就是在時間t2開始接受到來自外部燒 錄單元18送出不同於一般USB時脈頻率（約百萬赫茲級數） 之燒錄時脈頻率（約數萬赫茲級數），以決定此欲燒錄之 單晶片10進入一資料燒錄模式。換言之，USB介面控制模 組11在其USB介面110之兩個差分正負訊號端（DP，DM) 099103114 表單編號A0101 第7頁/共16頁 0992005859-0 201128646 分別接收到來自外部燒錄單元18所送㈣次Hi-Lo變化 ^脈波資料與22別丨七變化之脈波資料，形成約赫 效之特S燒錄4脈頻率，而此燒錄時脈頻率之資料必須 在8〇0微t(T2)内完成，也就是在時間t3完成。因此USB 介面控制模組11才有足賊衝時間將單晶>1 1G内之訊號 端·G的訊號從L。拉到Hi，因此謂介面控制模組听 U個單晶片1〇進人資料燒錄模式。經過6毫秒⑺）之 後也就疋在時間七斗，此時單晶片1〇内之訊號端rst的訊 號從Lo拉到Hi ’因此mcu微控制模組15又重新回復到工 作狀態。MCU微控制模粗卿訊號端pR〇G的訊號目前為 Hi得知整個單晶片1Q進入資料燒錄模式而非—般刪資料 傳輸模式，目此不再涉人料祕單元18、線上燒錄測 試模組12與記憶器模組13之間的線上燒人工作。因此可 有效避免MCU微控㈣組15在：作狀態下，造成線上燒錄 測試模組12與記憶器模組丨3之間的燒錄作動變得緩慢， 據此大幅提高晶片之資料/餐式線上燒錄(的效率。 [0010] 請參考第2圖’為本發明提出之第二較佳實施例，為另一 種使用USB介面之燒錄裝置，包含有欲燒錄之單晶片20及 外部燒錄單元28，而此欲燒錄之單晶片2〇進一步包含有 USB介面控制模組21、線上燒錄測試模組22、記憶器模組 23、資料輸出入介面模組24及MCU微控制模組25。其中 外部燒錄單元28之USB介面280係對應單晶片2〇之USB介 面210以將外部燒錄單元28連接單晶片2〇。而上述USB介 面之硬體線路主要係由—電源端（Vcc)、—對差分正負訊 號端（DP, DM)以及一接地端（GNd)所共同組成。在此單 099103114 表單編號A0101 第8頁/共16頁 0992005859-0 201128646 θ 曰日片20之内部結構中，線上燒錄測試模組22係電性連接 USB "面控制模組21與記憶器模組23以線上進行内存此記 憶器模組23之資料絲式燒錄。此外，記憶賴組23進 一步電性連接上述微控制模組25，使得微控制模組25可 掌握欲線上燒錄之資料或程式在記憶器模組23所在位址 與記憶器模組23之容量大小等相關規格。資料輸出入介 面模組24係以符合一般1〇介面標準而連接此單晶片2〇外 部之外部記憶裝置26與週邊裝置27。此外，MCU微控制模 組25係電性連接上述USB介面控制模組21、記憶器模組 23與資料輸出入介面_組24以處理這些模組間的協調溝 通。此外，記憶器模組23可以是快閃記憶器模組（flash ROM)、閃存記憶器模組（EEPROM)與一次燒錄記憶器模組 (OTP ROM)等其中任一種。 [0011] 〇 清再參考第3圖，在上述第二較佳實施例中，當欲燒錄之 單晶片20之USB介面210插八外部燒錄單元28之USB介面 280後，藉由其USB介面210之電源端（Vcc)接收到來自外 部燒錄單元28所供應之5伏特之供電後，使得單晶片2〇之 MCU微控制模組25在時間11開始進入短暫的開機重置 (Power On Reset)狀態，也就是Mcu微控制模組25進入 短暫的不工作狀態。此時，USB介面控制模組21開始介入 以進行USB介面210之模式偵測，並可在一預設時間約 200微秒（T1)，也就是在時間t2開始接受到來自外部燒 錄單元28送出不同於一般USB時脈頻率（約百萬赫茲級數） 之燒錄時脈頻率（約數萬赫茲級數），以決定此欲燒錄之 單晶片20進入一資料燒錄模式。換言之，USB介面控制模 099103114 表單編號A0101 第9頁/共16頁 0992005859-0 201128646 組21在其USB介面21G之兩個差分正負訊號端（Dp，dm) 分別接收到來自夕卜部燒錄單元28所送出26^Κ〇變化 之脈波資料與22次Hi-Lo變化之脈诚杳社 夂及胍疚貝枓，形成約60K赫 茲之特定燒錄時脈頻率，而此燒錄時脈頻率之資料必須 在800微秒（T2)内完成，也就是在時間七3完成。因此_ 介面控制模組21才有足夠緩衝時間將單晶片別内之訊號 端PROG的訊號從Lo拉到Hi，因此USB介面控制模組21可 確認整個單晶片20進入資料燒錄模式。經過6毫秒（Τ3)之 後，也就是在時間U，此時單晶片20内之訊號端m的訊 號從Lo拉到Hi，因此M0U櫚t控制模組25又重新回復到工 作狀態。MCU微控制模組25自訊號端pR0G的訊號目前為 Hi得知整個單晶片20進入資料燒錄模式而非一般USB資料 傳輸模式，因此不再涉入外部燒錄單元28、線上燒錄測 試模組22與記憶器模組23之間的線上燒.入工作。因此可 有效避免MCU微控制模組25在工作狀態下，造成線上燒錄 測試模組22與記憶器模組23之間的燒錄雜動變得緩慢， 據此大幅提高晶片之資料/程式線上燒錄的效率。此外， 由於第二較佳實施例係選擇脫離電腦系統pC而使得外部 燒錄單元28單獨（stand alone)串接在此單晶片20，以 進行此單晶片20之線上資料燒錄。因此可避免電腦系統 PC涉入，而造成線上燒錄測試模組22與記憶器模組23之 間的的燒錄作動變得緩慢，進一步大幅提高晶片之資料/ 程式線上燒錄的效率。 [0012] 以上所述僅為本發明之較佳實施例，並非用以限定本發 明之申請專利權利；同時以上的描述，對於熟知本技術 099103114 表單編號A0101 第10頁/共16頁 0992005859-0 201128646 [0013] [0014] Ο [0015] [0016] [0017] Ο [0018] [0019] [0020] [0021] [0022] [0023] [0024] 領域之專門人士應可明瞭及實施，因此其他未脱離本發 明所揭示之精神下所完成的等效改變或修飾，均應包含 在申請專利範圍中。 【圖式簡單說明】 第1圖為第一較佳實施例之方塊圖，為一種使用USB介面 之燒錄裝置，其中外部燒錄單元係串接電腦系統PC以連 接至欲線上燒錄之單晶片。 第2圖為第二較佳實施例之方塊圖，為另一種使用USB介 面之燒錄裝置，其中外部燒錄單元係真接連接至欲線上 燒錄之單晶片' 第3圖為根據上述較佳實施例之時狐資料，用以繪示欲線 上燒錄之單晶片如何進入資料燒錄模式之作動機制。 【主要元件符號說明】 欲燒錄之單晶片10、20 USB介面控制模組11、21 - 線上燒錄測試敬組12、22 記憶器模組13、23 資料輸出入介面模組14、24 MCU微控制模組15、25 外部記憶裝置16、26 週邊裝置17、27 外部燒錄單元18、28 099103114 表單編號Α0101 第11頁/共16頁 0992005859-0 201128646 [0025] PC電腦系統19 [0026] USB介面 110、180、181、190、210、280 099103114 表單編號A0101 第12頁/共16頁First, referring to FIG. 1 , a first preferred embodiment of the present invention is a recording device using a USB interface, including: a single chip 10 to be burned, an external programming unit 18, and a PC computer system. 19. The single-chip 10 mainly includes a usi interface control module u, an online burning test module 12, a memory module 13, and a data input-in interface module micro-control module 15. The USB interface 180 of the external programming unit 18 corresponds to the USB interface 190 of the PC system 19 to connect the external programming unit 18 and the PC computer system 19 to each other. Similarly, the USB interface 110 of the single chip corresponds to the USB interface 181 of the external programming unit 18 to connect the single chip 1 and the external programming unit 18 to each other. The hardware circuit of the USB interface is composed of a power supply terminal (Vcc), a pair of differential positive and negative signal terminals (DP, DM), and a ground terminal (GND). In the internal structure of the single-chip 1〇, line 0992005859-0 099103114 Form No. A0101 Page 6 / Total 16 Pages 201128646 上 Burning Test Module 1 2 Series Electrical Connection US Β Interface Control Module 11 and Memory The module 1 3 performs the data or program burning of the memory module 13 in the memory. In addition, the memory module 13 is further electrically connected to the micro control module 15 so that the micro control module 15 can grasp the data or program to be burned on the line at the address of the memory module 13 and the memory module 13 Related specifications such as capacity. The data input/output interface module 14 is connected to the external memory device 16 and the peripheral device 17 outside the single wafer 10 in accordance with the general 10-interface standard. In addition, the MCU micro control module 15 is electrically connected to the USB interface control module 11, the memory module 13, and the data input/output interface module 14 to handle coordinated communication between the modules. In addition, the memory module 13 can be any one of a flash memory module, a flash memory module (EEPR0M), and a once-in-time memory module (OTP ROM). [0009] Referring to FIG. 3, in the first preferred embodiment, after the power of the PC computer system 19 is turned on, the single chip 10 to be burned is powered by the power terminal (Vcc) of the USB interface 110. After receiving the power supply of 5 volts, the MC ϋ micro control module 15 of the single chip 10 starts to enter a short power on reset state at time 11, that is, the MCU micro control module 15 enters a short period of inactivity. status. At this time, the USB interface control module 11 starts to intervene to perform mode detection of the USB interface 110, and can receive the external programming unit 18 at a preset time of about 200 microseconds (T1), that is, at time t2. The programming clock frequency (approximately tens of thousands of hertz series) different from the general USB clock frequency (about megahertz series) is sent to determine that the single chip 10 to be burned enters a data burning mode. In other words, the USB interface control module 11 receives the two differential positive and negative signal terminals (DP, DM) 099103114 on the USB interface 110, form number A0101, page 7 / page 16 0992005859-0 201128646 respectively received from the external programming unit 18 Send (four) times of Hi-Lo change ^ pulse wave data and 22 different 变化 seven changes of pulse wave data, forming the X-effect frequency of the X-effect S burner, and the data of the burning clock frequency must be 8 〇 0 micro Completed within t(T2), that is, completed at time t3. Therefore, the USB interface control module 11 has a thief to rush the signal from the signal terminal G in the single crystal > 1 1G from L. Pulled to Hi, so the interface control module listens to U single-chip 1 into the data burning mode. After 6 milliseconds (7)), it is also in time. At this time, the signal of the signal terminal rst in the single chip is pulled from Lo to Hi', so the mcu micro control module 15 is returned to the working state again. The signal of the MCU micro-control module coarse-grained signal terminal pR〇G is currently Hi to know that the entire single-chip 1Q enters the data burning mode instead of the general data transmission mode, so that it is no longer involved in the secret unit 18, online burning The line between the test module 12 and the memory module 13 is burned. Therefore, the MCU micro-control (4) group 15 can be effectively avoided, causing the programming operation between the online burning test module 12 and the memory module 丨3 to be slow, thereby greatly improving the data/meal of the wafer. In-line programming (efficiency. [0010] Please refer to FIG. 2, a second preferred embodiment of the present invention, and another programming device using a USB interface, including a single chip 20 to be burned and The external programming unit 28 further includes a USB interface control module 21, an online burning test module 22, a memory module 23, a data input/output interface module 24, and an MCU micro The control module 25. The USB interface 280 of the external programming unit 28 corresponds to the USB interface 210 of the single chip 2 to connect the external programming unit 28 to the single chip 2. The hardware circuit of the USB interface is mainly composed of The power supply terminal (Vcc), which is composed of a differential positive and negative signal terminal (DP, DM) and a ground terminal (GNd). Here, the single 099103114 form number A0101 page 8 / total 16 pages 0992005859-0 201128646 θ 曰 片In the internal structure of 20, the online burning test module 22 is electrically Connecting the USB "face control module 21 and the memory module 23 to perform on-line memory programming of the memory module 23. Further, the memory group 23 is further electrically connected to the micro control module 25, so that The micro-control module 25 can grasp the specifications of the data or program to be burned on the address of the memory module 23 and the capacity of the memory module 23. The data input and output interface module 24 is consistent with the general one. The external standard memory device 26 and the peripheral device 27 are connected to the single chip 2. The MCU micro control module 25 is electrically connected to the USB interface control module 21, the memory module 23, and the data input interface. The group 24 handles the coordinated communication between the modules. In addition, the memory module 23 can be a flash memory module (flash ROM), a flash memory module (EEPROM), and a once-burning memory module ( OTP ROM) and the like. [0011] Referring again to FIG. 3, in the above second preferred embodiment, when the USB interface 210 of the single chip 20 to be burned is inserted into the USB of the external programming unit 28 After interface 280, through its USB interface 210 After the source (Vcc) receives the power supply from the external programming unit 28 and supplies 5 volts of power, the MCU micro control module 25 of the single chip 2 starts to enter a short power on reset state at time 11. That is, the Mcu micro control module 25 enters a short inactive state. At this time, the USB interface control module 21 starts to intervene to perform mode detection of the USB interface 210, and can be about 200 microseconds at a preset time (T1). ), that is, at time t2, the programming of the programming clock frequency (about tens of thousands of hertz series) from the external programming unit 28 is different from the general USB clock frequency (about tens of hertz series) to determine this. The single chip 20 to be burned enters a data burning mode. In other words, the USB interface control module 099103114 Form No. A0101 Page 9/16 pages 0992005859-0 201128646 Group 21 receives the two differential positive and negative signal terminals (Dp, dm) of its USB interface 21G, respectively, from the external flash unit 28. The pulse data of the 26^Κ〇 change and the pulse of the 22 Hi-Lo changes are made into the specific clock frequency of about 60K Hz, and the frequency of the burning clock is generated. The data must be completed in 800 microseconds (T2), which is completed at time 7.3. Therefore, the interface control module 21 has sufficient buffering time to pull the signal of the signal end PROG in the single chip from Lo to Hi, so the USB interface control module 21 can confirm that the entire single chip 20 enters the data burning mode. After 6 milliseconds (Τ3), that is, at time U, at this time, the signal of the signal terminal m in the single chip 20 is pulled from Lo to Hi, so the M0U control module 25 is returned to the working state again. The signal of the MCU micro-control module 25 from the signal terminal pR0G is currently Hi to know that the entire single-chip 20 enters the data burning mode instead of the general USB data transmission mode, so it is no longer involved in the external programming unit 28 and the online burning test mode. The line between the group 22 and the memory module 23 is burned into operation. Therefore, the MCU micro-control module 25 can be effectively prevented from causing slow programming of the programming noise between the online programming module 22 and the memory module 23, thereby greatly improving the data/program line of the chip. The efficiency of burning. In addition, since the second preferred embodiment is selected to be detached from the computer system pC, the external programming unit 28 is stand alone in series with the single wafer 20 to perform on-line data burning of the single wafer 20. Therefore, the computer system PC can be prevented from being involved, and the programming operation between the online burning test module 22 and the memory module 23 becomes slow, and the efficiency of programming data on the wafer/program line is further greatly improved. The above description is only a preferred embodiment of the present invention, and is not intended to limit the patent application rights of the present invention; at the same time, the above description is well known to the art 099103114 Form No. A0101 Page 10 / Total 16 Page 0992005859-0 [0014] [0014] [0016] [0016] [0017] [0019] [0020] [0024] [0024] [0024] [0024] Specialists in the field should be able to understand and implement, therefore Other equivalent changes or modifications made without departing from the spirit of the invention should be included in the scope of the claims. BRIEF DESCRIPTION OF THE DRAWINGS FIG. 1 is a block diagram of a first preferred embodiment, which is a programming device using a USB interface, wherein an external programming unit is connected in series with a computer system PC to connect to a single to be burned online. Wafer. 2 is a block diagram of a second preferred embodiment, which is another programming device using a USB interface, wherein the external programming unit is connected to the single chip to be burned online. FIG. 3 is based on the above comparison. The fox data of the preferred embodiment is used to describe how the single chip to be burned online enters the data burning mode. [Main component symbol description] Single chip 10, 20 USB interface control module 11 and 21 to be burned - Online burning test group 12, 22 Memory module 13, 23 Data input and output interface module 14, 24 MCU Micro-control module 15, 25 External memory device 16, 26 Peripheral device 17, 27 External programming unit 18, 28 099103114 Form number Α 0101 Page 11 / Total 16 page 0992005859-0 201128646 [0025] PC computer system 19 [0026] USB interface 110, 180, 181, 190, 210, 280 099103114 Form number A0101 Page 12 of 16
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