201127032 六、發明說明： 【發明所屬之技術領域】 [0001] 本發明係有關於一種影像感測模組，尤指一種薄型化影 像感測模組。 [0002] 【先前技術】 配合參閱第一圖，為習知之影像感測模組之剖視圖。該 影像感測模組包含有一電路板100、一影像感測晶片102 、複數個金屬引線104、一支撐座106以及一鏡片組108 〇 ❹ [0003] 該影像感測晶片102係設置於該電路板100之一上表面， 並透過該等金屬引線104電連接於該電路板100，以提供 該影像感測晶片102電力及訊號的傳輸。該鏡片組108係 設置於該支撐座106内，該支撐座106係設置於該影像感 測晶片102上，並且使該鏡片組108與該影像感測晶片 102得以位於最小光轴偏移量的位置。 [0004] 由於該影像感測晶片102係直接設置於該電路板100上， 且該鏡片組108需經由該支撐座106以固定於該影像感測 晶片102上，因而整體影像感測模組的高度極難以縮減。 然而，筆記型電腦及電腦螢幕的厚度係隨著市場需求而 降低，設置於其内的影像感測模組的高度也日漸嚴苛， 因而如何有效地降低整體影像感測模組之高度成為封裝 廠商亟欲解決的問題。 [0005] 【發明内容】 鑒於先前技術所述，本發明之一目的，在於提供一種薄 型化影像感測模組。 099102582 表單編號A0101 第3頁/共26頁 0992005003-0 201127032 [0006] 本發明之另一目的，在於提供一種上述薄型化影像感測 模組之封裝方法。 [0007] 為達上述目的，本發明提供一種影像感測模組，該影像 感測器包含有一電路板、一基板、一影像感測晶片、複 數個金屬引線、一鏡片組以及一膠材。 [0008] 該電路板上係設置有·—窗口，該基板係設置於該電路板 之一下表面並密封該窗口；該影像感測晶片係透過該窗 口設置於該基板上，並且該影像感測晶片係包含有一感 光區。該鏡片組係設置於該影像感測晶片上，且該鏡片 組之一焦點係位於該影像感測晶片上；該膠材係設置於 該鏡片組與該電路板間，用以將該鏡片組固定於該影像 感測晶片上。 [0009] 另外，本發明更提供一種影像感測模組封裝方法，包含 下列步驟：首先，提供一電路板，並於該電路板上沖壓出 一窗口；設置一基板於該電路板之一下表面並密封該窗 口；提供一影像感測晶片，係經由該窗口設置於該基板 上。最後，將一鏡片組定位於該影像感測晶片上，並且 使得該鏡片組與該影像感測晶片位於最小光軸偏移量的 位置，再點注一膠材於該電路板與該鏡片組周圍，用以 將鏡片組固定於該影像感測晶片上。 [0010] 此外，本發明更提供另一種影像感測模組，該影像感測 模組包含有一電路板、一基板、一影像感測晶片、一支 撐座及一鏡片組。 [0011] 該電路板上係設置有一窗口該基板係設置於該電路板 099102582 表單編號A0101 第4頁/共26頁 0992005003-0 201127032 之一下表面並密封該窗口；级影像感測晶片係透過該窗 口設置於該基板上，該影像感測晶片係包含有一感光區 。該支撐座係跨設於該電路板上且具有一貫通孔，該貫 通孔係連通至該窗口；該鏡片組，係設置於該貫通孔内 ，且該鏡片組之一焦點係位於該影像感測晶片上。 [0012] Ο [0013] [0014] Ο 099102582 本發明透過該具有窗口之電路板搭配一設置於該電路板 下表面之基板，構成一供影像感測晶片擺設之容置區， 如此可有效的降低整體模組之高度，以適用於薄型化的 筆記型電腦或電腦螢幕。 【實施方式】 參閱第二圖，為本發明第一貪施例之影像感測模組之剖 視圖。該影像感測模組包含有一電路板200，一基板21〇 、一影像感測晶片220、複數個金屬引線23〇、一鏡片組 240、一透明蓋片25〇以及一膠材260。 配合參閱第·=圖，為本發明之.影像感測模組之電路板與 基板組合結構之立體圖。該電路板2 〇〇上係設置有一窗口 202，以及鄰近於該窗口 202之複數個連接塾2〇4，藉由 該窗口 202之設置’可在該電路板200上提供一貫穿之開 口區域。此外，該等連接墊204包含有兩種不同的設置方 式，其一係將該等連接塾204全數設置於該電路板2〇〇之 一上表面’其二係將該等連接墊2〇4全數設置於該電路板 200之一下表面。其中該電路板200係為聚雙醯胺疊氮樹 脂（Bismaleimide Triazine, ΒΤ)製板、玻璃纖維板 、对高溫印刷電路板、聚醜亞胺（P〇lyimide，PI)板或 陶篆（c e r a id ic)電路板。 表單編號A0101 第5頁/共26頁 0992005003-0 201127032 [0015] 該基板21 0係設置於電路板200之該下表面，並且具有足 夠之面積以密封該窗口 202 ;該基板210包含有複數個外 接墊212以及複數個第一焊墊214，該等外接墊212係利 用錫膏、異方性導電膠（ACF)或其他導電膠與該電路板 200上之連接墊204電性連接’提供一電力及訊號的傳輸 路徑。 [0016] 復參見第二圖，該影像感測晶片220係透過該窗口 2〇2設 置於該基板210上，該影像感測晶片220包含有—感光區 222，以及複數個環繞於該感光區222設置之第二焊塾 224，其中該影像感測晶片220係為電荷耦合元件 (Charge Coupled Device, CCD)或互補性氧化金屬半 導體（Complementary Metal-Oxide Semiconductor, CMOS) 或其他具有光電轉換特性之元件。 [0017] 該等金屬引線230係跨設於該基板220之第一焊墊214與 該影像感測晶片220上之第二焊墊224 ’用以做為該影像 感測晶片220操作時之電力以及訊號的傳輸路徑，其中該 金屬引線230為金、銀、銅、鉬或錯等金屬製成。 [0018] 該鏡片組240係設置於該影像感測晶片220上’且該鏡片 組240之一焦點需位於該影像感測晶片220上’其中該鏡 片組240係包含有一鏡筒242，以及複數個嵌固於該鏡筒 242内部之光學鏡片244。 [0019] 該透明蓋片250係大致平行地設置於該影像感測晶片220 與該鏡片組240之間’主要用以阻隔空氣中的微粉塵附著 於該影像感測晶片220上，影響成像品質。其中該透明蓋 099102582 表單編號A0101 第6頁/共26頁 0992005003-° 201127032 片 250係為抗反射玻璃（ant i~ref iecti〇n coating glass, AR glass)、光學低濾波片（〇ptical 1〇w_ pass filter glass，〇LPF glass)、素玻璃或透明塑 膠件或用以使光波長400nm〜650nm通過而濾除紅外線之 抗紅外線穿透片（infra-red filter，IR filter)e [0020] 該膠材260係設置於該鏡片組24〇與該電路板2〇〇間，用 以密該等金屬引線230並將該鏡片組24〇固定於該影像感 ❹ [0021] 測晶片220上方，其中該膠材26〇係為紫外光固化膠或熱 固化膠。 . ..... . .：... ： - ： . . 配合參閱第四圖，為本發明第一實施例之影像感測模組 封裝製程之流程圖。步驟S400(配合參閱第五圖（3))， 提供一電路板200，並於該電路板2〇〇上仲壓出一窗口 2〇2 ’該電路板200上係設置有複數個鄰近於該窗口 2〇2 之連接藝2 0 4。 [0022] Ο 步驟S402(配合參閱第五圖（b))，提供一基板21〇，該基 板210係設置在該電路板200之一下表面，並密封該窗口 202。該基板210上係包含有複數個>卜接墊212以及複數 個第一焊墊214，該外接墊212係用以與該電路板2〇0上 之連接墊204電性連接，用以提供電力與訊號的傳輸路徑 ’其中該連接墊204與該外接墊212係使用錫膏、異方性 導電膠（ACF)、或導電膠作為電連接之材料。 步驟S404(配合參閱第五圖（c))，於基板21〇上設置一影 像感測晶片2 2 0，且該影像感測晶片2 2 0係位在該窗口 202中。再者，該影像感測晶片220係包含有一感光區 099102582 表單蝙號A0101 第7買/共26頁 0992005003-0 [0023] 201127032 222以及圍繞於該感光區222之複數的第二焊墊224。 [0024] [0025] [0026] 099102582 步驟S406C復參閱第五圖（C))，提供複數個金屬引線230 ，該等金屬引線230係跨設於該基板21〇上之第一焊塾 214與該影像感測晶片220上之第二焊墊224，以提供該 影像感測晶片220一電力與訊號的傳輸路徑。 步驟S408，（配合參閱第五圖（d)) ’提供一鏡片組240， 並且將該鏡片組240定位於該影像感測晶片220上，該鏡 片組240係包含有一鏡筒242以及複數個嵌固於該鏡筒 242内部之光學鏡片244。為使得外界影像能精確的成像 〇201127032 VI. Description of the Invention: [Technical Field] [0001] The present invention relates to an image sensing module, and more particularly to a thinned image sensing module. [0002] [Prior Art] Referring to the first figure, it is a cross-sectional view of a conventional image sensing module. The image sensing module includes a circuit board 100, an image sensing chip 102, a plurality of metal leads 104, a support base 106, and a lens set 108. [0003] The image sensing chip 102 is disposed on the circuit. An upper surface of the board 100 is electrically connected to the circuit board 100 through the metal leads 104 to provide power and signal transmission of the image sensing chip 102. The lens assembly 108 is disposed in the support base 106. The support base 106 is disposed on the image sensing wafer 102, and the lens assembly 108 and the image sensing wafer 102 are positioned at a minimum optical axis offset. position. The image sensing chip 102 is directly disposed on the circuit board 100, and the lens group 108 is fixed to the image sensing chip 102 via the support base 106. Therefore, the overall image sensing module is The height is extremely difficult to reduce. However, the thickness of the notebook computer and the computer screen decreases with the market demand, and the height of the image sensing module disposed therein is also increasingly severe, so how to effectively reduce the height of the overall image sensing module becomes a package. The problem that the manufacturer wants to solve. SUMMARY OF THE INVENTION In view of the foregoing, it is an object of the present invention to provide a thinned image sensing module. 099102582 Form No. A0101 Page 3 of 26 0992005003-0 201127032 Another object of the present invention is to provide a method of packaging the above-described thinned image sensing module. In order to achieve the above object, the present invention provides an image sensing module, which includes a circuit board, a substrate, an image sensing chip, a plurality of metal leads, a lens group, and a glue. [0008] The circuit board is provided with a window, the substrate is disposed on a lower surface of the circuit board and seals the window; the image sensing chip is disposed on the substrate through the window, and the image sensing The wafer system includes a photosensitive region. The lens assembly is disposed on the image sensing wafer, and a focus of the lens group is located on the image sensing wafer; the glue is disposed between the lens group and the circuit board for the lens group Fixed on the image sensing wafer. [0009] In addition, the present invention further provides an image sensing module packaging method, comprising the following steps: first, providing a circuit board, and punching a window on the circuit board; and setting a substrate on a lower surface of the circuit board And sealing the window; providing an image sensing chip disposed on the substrate via the window. Finally, a lens group is positioned on the image sensing wafer, and the lens group and the image sensing chip are located at a position of a minimum optical axis offset, and a glue is applied to the circuit board and the lens group. Surrounding for fixing the lens group to the image sensing wafer. In addition, the present invention further provides another image sensing module. The image sensing module includes a circuit board, a substrate, an image sensing chip, a support, and a lens group. [0011] The circuit board is provided with a window, the substrate is disposed on the lower surface of the circuit board 099102582 Form No. A0101, page 4 / 26 pages 0992005003-0 201127032, and the window is sealed; the level image sensing chip passes through the window The window is disposed on the substrate, and the image sensing chip comprises a photosensitive region. The support base is disposed on the circuit board and has a through hole, the through hole is connected to the window; the lens group is disposed in the through hole, and a focus of the lens group is located in the image sense On the test wafer. [0012] Ο 099102582 The present invention is configured to provide a accommodating area for image sensing wafer placement by using a circuit board having a window and a substrate disposed on a lower surface of the circuit board. Reduce the height of the overall module for thin-film notebooks or computer screens. [Embodiment] Referring to the second figure, a cross-sectional view of an image sensing module according to a first embodiment of the present invention is shown. The image sensing module comprises a circuit board 200, a substrate 21, an image sensing chip 220, a plurality of metal leads 23A, a lens group 240, a transparent cover sheet 25A, and a glue 260. Referring to the figure, the figure is a perspective view of the circuit board and the substrate combination structure of the image sensing module of the present invention. The circuit board 2 is provided with a window 202 and a plurality of ports 〇2〇4 adjacent to the window 202. The setting of the window 202 provides a through-opening area on the circuit board 200. In addition, the connection pads 204 include two different arrangements, one of which is to set the connection ports 204 on one of the upper surfaces of the circuit board 2', and the other is the connection pads 2〇4 All of them are disposed on the lower surface of one of the circuit boards 200. The circuit board 200 is made of Bismetimide Triazine (Bismaleimide Triazine), glass fiber board, high temperature printed circuit board, P〇lyimide (PI) board or ceramic pot (cera id Ic) Board. Form No. A0101 Page 5 / Total 26 Pages 0992005003-0 201127032 [0015] The substrate 210 is disposed on the lower surface of the circuit board 200 and has a sufficient area to seal the window 202; the substrate 210 includes a plurality of The external pad 212 and the plurality of first pads 214 are electrically connected to the connection pads 204 on the circuit board 200 by using solder paste, anisotropic conductive adhesive (ACF) or other conductive adhesive. Power and signal transmission path. [0016] Referring to the second figure, the image sensing wafer 220 is disposed on the substrate 210 through the window 2〇2, the image sensing wafer 220 includes a photosensitive region 222, and a plurality of surrounding photosensitive regions. The second solder fillet 224 is disposed at 222, wherein the image sensing wafer 220 is a charge coupled device (CCD) or a complementary metal-oxide semiconductor (CMOS) or other photoelectric conversion characteristic. element. [0017] The metal leads 230 are used to straddle the first pads 214 of the substrate 220 and the second pads 224 ′ of the image sensing wafer 220 for operation of the image sensing wafer 220. And a transmission path of the signal, wherein the metal lead 230 is made of metal such as gold, silver, copper, molybdenum or wrong. [0018] The lens group 240 is disposed on the image sensing wafer 220 and the focus of the lens group 240 is located on the image sensing wafer 220. The lens group 240 includes a lens barrel 242, and a plurality of An optical lens 244 is embedded in the interior of the barrel 242. [0019] The transparent cover sheet 250 is disposed substantially in parallel between the image sensing wafer 220 and the lens group 240. The dust is mainly used to block the adhesion of fine dust in the air to the image sensing wafer 220, thereby affecting image quality. . The transparent cover 099102582 Form No. A0101 Page 6 / Total 26 Page 0992005003-° 201127032 The film 250 is an anti-reflective glass (ant i~ref iecti〇n coating glass, AR glass), optical low filter (〇ptical 1〇 W_pass filter glass, 〇LPF glass), plain glass or transparent plastic member or infra-red filter (IR filter) for filtering the wavelength of light from 400 nm to 650 nm to filter out infrared rays [0020] A glue material 260 is disposed between the lens group 24 and the circuit board 2 to seal the metal wires 230 and fix the lens group 24 to the image sensor 220. The glue 26 is an ultraviolet curing adhesive or a heat curing adhesive. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Step S400 (refer to FIG. 5 (3)), a circuit board 200 is provided, and a window 2 〇 2 is pressed on the circuit board 2 '. The circuit board 200 is provided with a plurality of adjacent ones. The connection art of window 2〇2 is 2 0 4 . [0022] Ο Step S402 (refer to FIG. 5(b)), a substrate 21 is provided, the substrate 210 is disposed on a lower surface of the circuit board 200, and the window 202 is sealed. The substrate 210 includes a plurality of pads 212 and a plurality of first pads 214. The external pads 212 are electrically connected to the connection pads 204 on the circuit board 〇0 for providing The transmission path of the power and the signal, wherein the connection pad 204 and the external pad 212 are made of solder paste, an anisotropic conductive paste (ACF), or a conductive paste as a material for electrical connection. In step S404 (refer to FIG. 5(c)), an image sensing wafer 220 is disposed on the substrate 21, and the image sensing wafer 220 is located in the window 202. Furthermore, the image sensing wafer 220 includes a photosensitive region 099102582, a form bat number A0101, a seventh purchase/a total of 26 pages, 0992005003-0 [0023] 201127032 222, and a plurality of second pads 224 surrounding the photosensitive region 222. [0025] [0025] 099102582 Step S406C Referring to FIG. 5(C)), a plurality of metal leads 230 are provided, and the metal leads 230 are spanned over the first pad 214 disposed on the substrate 21〇. The image senses the second pad 224 on the wafer 220 to provide a power and signal transmission path for the image sensing wafer 220. Step S408, (with reference to FIG. 5(d)) 'providing a lens group 240, and positioning the lens group 240 on the image sensing wafer 220, the lens group 240 includes a lens barrel 242 and a plurality of embedded An optical lens 244 is secured to the interior of the barrel 242. In order to enable accurate imaging of external images 〇
於該影像感測晶片220上，該巍片組240之一焦點必須落 於該影像感測晶片220之上，並且使該鏡片組240與該影 像感測晶片220位於最小光軸偏移:1的位置。為達上述目 的，該鏡片組240係透過一夾取治具300夾取之，使該鏡 片組240以具有一預定間隙的方式置於該影像感測晶片 220上◊該夾取治具300係透過外部程式的控制，進行X、 γ、Z三個方向的移動，並經由一外部測試系統，以確保 該鏡片組240炙焦點準確地定位於該影像感測晶片220上 U ，I使得該鏡片組240與該影像感測晶月220位於最小光 軸偏移量的位置’其中該鏡片組2 4 0與該影像感測晶片 2 2 〇有一預定間隙。 少驟S41〇(配合參閱第五圖（e))，當該鏡片組240完成定 位調整後，該失取治具300係將該鏡片組240固定於該影 像感測晶片220上，並將一膠材260點注於該鏡片組240 與該電路板200之間，用以密封該等金屬引線230並將該 鐃片組240固定於該影像感測晶片220之上。待該膠材 表單煸號A0101 第8頁/共26頁 0992005003-0 201127032 [0027] Ο [0028] [0029]Ο [0030] 260完全固化後，再將該夾取治具300組裝好之影像感測 模組移除。 此外，該影像感測模組封裝方法更包含設置一透明篕片 250於該影像感測晶片220與該鏡片組240之間。其〆方 式是在步驟S406完成金屬引線230的跨接後，將該透明蓋· 片250大致平行的設置於該影像感測晶片220上方’旅·$ 注一黏著劑以固定該透明蓋片250。其二方式是將該透明 蓋片250先行固定於該鏡片組240鄰近於影像感測晶片 220之一端，並於步驟S408進行鏡片組240對位後，利用 該膠材26 0將該鏡片組240連同該透明蓋片250固定於該 影像感測晶片220上方。 ' 配合參閱第六圖，為本發明第二實施例之影像感測器。 該影像感測器包含有一電路板200、一基板210、一影像 感測晶片220、複數個金屬引線230、一鏡片組240、一 透明蓋片250以及一支撐座500。 其中該電路板200、該基板210、該影像感測晶片220以 及該等金屬引線230之設置位置與敦;置方式皆與上述第一 實施例完全相同。其不同之處係敛述如下： 該支撐座500係設置於該電路板200上，且具有一貫通孔 ，該貫通孔係連通至該窗口 202。該鏡片組240係設置於 該貫通孔内，其中該鏡片組240包含一鏡筒242，以及複 數個嵌固於該鏡筒242内之光學鏡片244 ;該鏡片組240 底端係設置有該透明蓋片250，其中該透明蓋片250係為 抗紅外線穿透片、抗反射玻璃、光學低濾波片、素玻璃 099102582 表單編號Α0101 第9頁/共26頁 0992005003-0 201127032 或透明塑膠件。透過調整該支撐座500之位置，以確保該 鏡片組240之一焦點落於該影像感測晶片220上，並且使 該鏡片組240與該影像感測晶片220位於最小光軸偏移量 的位置。 [0031]配合參閱第七圖，為本發明第三實施例之影像感測器之 剖視圖。本實施例大致與第二實施例相同，其不同之處 在於該透明蓋片250係直接跨設於該電路板2〇〇之上表面 ’並密封開窗口 202。該支撐座500係設置於該電路板 200上’且具有一貫通孔’該鏡片組24〇係設置於該貫通 孔内。透過調整玆支撐座5〇〇之位置，使該鏡片組240之 一焦點透過該透明蓋片250並落於該影像感測晶片220上 ’並且該鏡片組240與該影像感測晶片220需位於最小光 軸偏移量之位置。 [0032] 乡示合以上所述，本發明係透過該具有窗口 2 〇 2之電路板 200搭配一設置於該電路板200下表面之基板21〇，構成 一供影像感測晶片220擺設之容粟區;由於該影像感測晶 片220係透過讓窗口 2〇2設置於該基板21〇上，因此，透 過控制。玄基板21 〇之厚度即可調整該影像感測模組的整體 尚度，以適用於薄型化的筆記型電腦或電腦螢幕；另外 透過孩夾持治具3 〇 〇進行該鏡片纟且£ 4 〇之對位，並於對 位完成後再進行點膠固定，使該鏡片組24〇得以精確的定 位於該影像感測晶片22Q上，可避免對焦完成之模組位置 偏移造成的模組報廢，提高整體良率。 [0033] 然以上所述者，僅為本發明之較佳實施例，當不能限定 099102582 本發明實施之範圍，即凡依本發明中請專利範 表單編號A_ 第10頁/共26頁 圍所作之 0992005003-0 201127032 [0034] 均等變化與修飾等，皆應仍屬本發明之專利涵蓋範圍意 圖保護之範疇。 【圖式簡單說明】 第一圖為習知之影像感測模組之剖視圖。 [0035] 第二圖為本發明第一實施例之影像感測模組之剖視圖。 [0036] 第三圖為本發明之影像感測模組之電路板與基板組合結 構之立體圖。 [0037] Ο 第四圖為本發明第一實施例之影像感測模組封裝製程之 流程圖。 [0038] 第五圖（a)〜（e)為本發明之影像感測模組對應第四圖各步 驟之示意圖。 [0039] 第六圖為本發明第二實施例之影像感測器之剖視圖。 [0040] 第七圖為本發明第三實施例之影像感測器之剖視圖。 [0041] %J 【主要元件符號說明】 〈先前技術〉 [0042] 100電路板 [0043] 102影像感測晶片 [0044] 104金屬引線 [0045] 106支撐座 [0046] 108鏡片組 [0047] 〈本發明〉 099102582 表單編號A0101 第11頁/共26頁 0992005003-0 201127032 [0048] 200 電路板 [0049] 202 窗口 [0050] 204 連接塾 [0051] 210 基板 [0052] 212 外接墊 [0053] 214 第一焊墊 [0054] 220 影像感測晶片 [0055] 222 感光區 [0056] 224 第二焊墊 [0057] 230 金屬引線 [0058] 240 鏡片組 [0059] 242 鏡筒 [0060] 244 光學鏡片 [0061] 250 透明蓋片 [0062] 260 膠材 [0063] 300 夾取治具 [0064] 500 支撐座 [0065] S400〜S410步驟 099102582 表單編號A0101 第12頁/共26頁 0992005003-0On the image sensing wafer 220, one of the focus groups 240 must fall on the image sensing wafer 220, and the lens group 240 and the image sensing wafer 220 are at a minimum optical axis offset: 1 s position. In order to achieve the above purpose, the lens group 240 is sandwiched by a clamping fixture 300, so that the lens group 240 is placed on the image sensing wafer 220 with a predetermined gap, and the clamping fixture 300 is attached. Through the control of the external program, the movement of the X, γ, and Z directions is performed, and an external test system is used to ensure that the focus of the lens group 240 is accurately positioned on the image sensing wafer 220, U, I make the lens The group 240 is located at a position where the image sensing crystal 220 is at a minimum optical axis offset, wherein the lens group 240 has a predetermined gap with the image sensing wafer 2 2 . After the lens assembly 240 completes the positioning adjustment, the missing fixture 300 fixes the lens assembly 240 to the image sensing wafer 220, and a step S41 (refer to FIG. 5(e)). A glue 260 is injected between the lens set 240 and the circuit board 200 to seal the metal leads 230 and fix the set of the wafers 240 on the image sensing wafer 220. Wait for the glue form nickname A0101 Page 8 / Total 26 page 0992005003-0 201127032 00 [0028] [0029] 00 [0030] After the 260 is fully cured, the image of the clamp fixture 300 is assembled. The sensing module is removed. In addition, the image sensing module packaging method further includes disposing a transparent wafer 250 between the image sensing wafer 220 and the lens group 240. After the bridging of the metal lead 230 is completed in step S406, the transparent cover sheet 250 is disposed substantially parallel to the image sensing wafer 220. The adhesive covers the adhesive to fix the transparent cover sheet 250. . The second method is to fix the transparent cover sheet 250 to one end of the lens group 240 adjacent to the image sensing wafer 220, and after the lens group 240 is aligned in step S408, the lens group 240 is used by the glue material 260. The transparent cover sheet 250 is fixed to the image sensing wafer 220. Referring to the sixth figure, an image sensor according to a second embodiment of the present invention is shown. The image sensor includes a circuit board 200, a substrate 210, an image sensing chip 220, a plurality of metal leads 230, a lens group 240, a transparent cover sheet 250, and a support base 500. The arrangement position and arrangement of the circuit board 200, the substrate 210, the image sensing wafer 220, and the metal leads 230 are all the same as those of the first embodiment. The difference is as follows: The support base 500 is disposed on the circuit board 200 and has a through hole that communicates with the window 202. The lens assembly 240 is disposed in the through hole, wherein the lens assembly 240 includes a lens barrel 242 and a plurality of optical lenses 244 embedded in the lens barrel 242. The lens assembly 240 is provided with the transparent bottom end. The cover sheet 250, wherein the transparent cover sheet 250 is an anti-infrared penetrating sheet, an anti-reflective glass, an optical low-filter, a plain glass 099102582, a form number Α0101, a page 9 or a total of 26 pages 0992005003-0 201127032 or a transparent plastic part. Adjusting the position of the support base 500 to ensure that one of the focus groups of the lens set 240 falls on the image sensing wafer 220, and the lens group 240 and the image sensing wafer 220 are located at a minimum optical axis offset. . [0031] Referring to the seventh figure, a cross-sectional view of an image sensor according to a third embodiment of the present invention is shown. This embodiment is substantially the same as the second embodiment except that the transparent cover sheet 250 is directly spanned over the upper surface of the circuit board 2 and seals the window 202. The support base 500 is disposed on the circuit board 200 and has a through hole. The lens set 24 is disposed in the through hole. The focus of the lens holder 240 is transmitted through the transparent cover sheet 250 and falls on the image sensing wafer 220, and the lens group 240 and the image sensing wafer 220 are located. The position of the minimum optical axis offset. [0032] In the above description, the present invention comprises a circuit board 200 having a window 2 〇 2 and a substrate 21 设置 disposed on a lower surface of the circuit board 200 to form a capacity for the image sensing chip 220. Since the image sensing wafer 220 is disposed on the substrate 21 by transmitting the window 2〇2, the transmission control is performed. The thickness of the stencil substrate 21 can adjust the overall degree of the image sensing module to be suitable for a thin notebook computer or a computer screen; and the lens is carried out through the child gripping tool 3 纟 and £ 4 After the alignment is completed, the dispensing is performed after the alignment is completed, so that the lens group 24 can be accurately positioned on the image sensing chip 22Q, and the module caused by the positional deviation of the focus-completed module can be avoided. Scrap, improve overall yield. [0033] However, the above description is only a preferred embodiment of the present invention, and the scope of the present invention cannot be limited to 099102582, that is, according to the invention, the patent form number A_ page 10/26 pages are made. 0992005003-0 201127032 [0034] Equivalent changes and modifications, etc., are still within the scope of the claimed scope of the invention. [Simple Description of the Drawings] The first figure is a cross-sectional view of a conventional image sensing module. 2 is a cross-sectional view of an image sensing module according to a first embodiment of the present invention. [0036] The third figure is a perspective view of a circuit board and a substrate combination structure of the image sensing module of the present invention. [0037] FIG. 4 is a flow chart showing a packaging process of the image sensing module according to the first embodiment of the present invention. [0038] The fifth (a) to (e) of the present invention are schematic diagrams corresponding to the steps of the fourth embodiment of the image sensing module of the present invention. 6 is a cross-sectional view of an image sensor according to a second embodiment of the present invention. [0040] FIG. 7 is a cross-sectional view of an image sensor according to a third embodiment of the present invention. %J [Major component symbol description] <Prior Art> [0042] 102 image sensing wafer [0044] 104 metal wiring [0045] 106 support base [0046] 108 lens group [0047] <Invention> 099102582 Form No. A0101 Page 11/26 Page 0992005003-0 201127032 [0048] 200 Circuit Board [0049] 202 Window [0050] 204 Connection [0051] 210 Substrate [0052] 212 External Pad [0053] 214 First Pad [0054] 220 Image Sensing Wafer [0055] 222 Photosensitive Area [0056] 224 Second Solder Pad [0057] 230 Metal Lead [0058] 240 Lens Set [0059] 242 Lens Tube [0060] 244 Optics Lens [0061] 250 Transparent Cover Sheet [0062] 260 Adhesive [0063] 300 Clamping Fixture [0064] 500 Support Base [0065] S400~S410 Step 099102582 Form No. A0101 Page 12 / Total 26 Page 0992005003-0