201126656 六、發明說明： 【發明所屬之技術領域】 本發明係有關於一種封裝結構及發光二極體封裳結 構’尤指一種用於增加結構強度及減緩外界水氣入侵置曰 區域之封裝結構及發光二極體封裝結構。 【先前技術】 發光二極體（led)與傳統光源相比較，發光二極體 擁有體積小、省電、發光效率佳、壽命長、操作反應速度 快、且無熱輻射與水銀等有毒物質的污染等優點，因此= 幾年來，發光二極體的應用面已極為廣泛。雖然過去發光 一極體之亮度還無法取代傳統之照明光源，但隨著技術領 域之不斷提升，目前已研發出高照明輝度之高功率發光二 極體’其足以取代傳統之照明光源。 另外，由於高功率發光二極體會產生較高的熱量，因 此還需要配合較大面積及厚度的散熱塊（slug)來使用。 然而，當封裝膠體（塑膠材料）要與散熱塊結合時，由於 塊通常為金屬材料所製成，封裝膠體與散熱塊之間的 結合力（結構強度）並不佳。此外，封裝膠體與散熱塊之 間常會有細縫的產生，所以外界的水氣常由此細縫^侵至 發光一極體晶片的置晶區域，而造成發光二極體晶片的置 晶區域產生銹蝕的現象。 緣疋，本發明人有感上述缺失之可改善，悉心觀察且 n並配合學理之勒，—種設計合理且有致 改善上述缺失之本發明。 【發明内容】 本發明所要解決的技術問題，在於提供一種封裝結構 4/20 201126656 其可用於增加結構強度及減緩外 及發光二極體封裝結構， 界水氣入侵置晶區域。 為了解决上述技術問題，根據本發明之且中— 案，提供一種縣結構，其包括：一基座單元二-接腳^ 錢-殼體單元。基座單元具有—承載件及至少一 1201126656 VI. Description of the Invention: [Technical Field] The present invention relates to a package structure and a light-emitting diode package structure, particularly a package structure for increasing structural strength and mitigating external water vapor intrusion And LED package structure. [Prior Art] Compared with a conventional light source, a light-emitting diode has a small volume, power saving, good luminous efficiency, long life, fast operation response, and no toxic substances such as heat radiation and mercury. The advantages of pollution, etc., therefore, the application of light-emitting diodes has been extremely extensive for several years. Although the brightness of the past one is not a substitute for the traditional illumination source, with the continuous improvement of the technical field, high-power LEDs with high illumination brightness have been developed, which is sufficient to replace the traditional illumination source. In addition, since the high-power light-emitting diode generates high heat, it is also required to be used with a large area and a thickness of a slug. However, when the encapsulant (plastic material) is to be combined with the heat slug, since the block is usually made of a metal material, the bonding force (structural strength) between the encapsulant and the heat slug is not good. In addition, there is often a crevice between the encapsulant and the heat dissipating block, so the external moisture often invades the crystallization region of the illuminating monopole wafer, thereby causing the crystallization region of the illuminating diode chip. Corrosion occurs. In the meantime, the present inventors have felt that the above-mentioned deficiency can be improved, and that the invention is properly observed and n is compatible with the theory, and the present invention is reasonable in design and has the above-mentioned defects. SUMMARY OF THE INVENTION The technical problem to be solved by the present invention is to provide a package structure 4/20 201126656 which can be used to increase the structural strength and slow down the outer and light emitting diode package structure, and the boundary water vapor invades the crystallized area. In order to solve the above technical problems, according to the present invention, there is provided a county structure comprising: a base unit two-pin ^ money-shell unit. The base unit has a carrier and at least one
貫穿孔，貫穿孔的内表面形成至少-環狀結構，而 设體早=具有—用於環繞地包覆承載件的—部分且連择 ί接=元之環形殼體，環形殼體的—部分填充於上述Ϊ 1一貝穿孔内以覆蓋上述至少—環狀結構。根據上述結 構:本發明可以增加承餅與環形殼體之卩⑽結合力，^ 減緩外界水氣入侵。 此外，本發g収提供—種發光二極體封裝結構，其 在封裝結構巾加人—發光單元以及—封裝單元，發光單 兀t有多個設置於該承載件上且被該環形殼體所環繞 之么光二極體晶粒，而每—個發光二極體晶粒電性連接 =意兩個導電接腳之間。封裝單元具有—用於覆蓋該 二發光二極體晶粒且被該環形殼體所環繞之透光封裝 因此’本發明的有益效果在於：增加承载件與環形殼 -之間的結合力’且減緩外界水氣通過承載件與環形殼體 士1的,、.田縫而人&置晶區域，進而增加產品的可靠度及使 用壽命。 、為使能更進-步瞭解本發明之雜及技術内容，請參 閱以下有關本發明之詳細制與關，然·彳關式僅提 供參考與說日㈣，並_練本剌加錄制者。 【實施方式】 5/20 201126656 第一A圖至第—D圖為本發明第一實施例之一種封 f結構’其包括：—基座單itl、-接腳單元2及-殼體 單元3。 n 如第一A圖所示，其為本發明第一實施例之封裝結構 中的基座單元1和接腳單元2的相對位置之立體示意 圖’其中第—Affil中標號A所圈選的範圍進行側視剖^ 後’可得到如第-B圖所示的側制面示意圖。 其中，基座單元1具有一承載件工〇及至少—貫穿承 載件之貫穿孔11，承載件10通常由具高導熱係數的金 屬材料所製成’承載件10的上方形成-置晶區域丄0 0，^貫穿孔11的内表面形成至少一環狀結構11〇。 在本貫施例中’承餅1时為一體成型之散熱元件。而 承載件10可為至少兩件式結構，例如 表載件1 〇具有1載體（圖未示）及—由承 面延伸至承載體的下表面之散熱層（®未示）。 、 水戟仵1〇具有多個預備被殼體單元3所覆蓋之 =1 二;:=說;本實施例的承載件 設置於承載以=面面T0a" 意兩相反側面上、任意三個側面上或面士、 ΐ其他實施例中，亦可不設置側上上;= =、，3亦可更換為多個側面凹槽土: 凹槽(圖未示2二:以面周圍之環型側， 換言之’設計者可依據不同的設:;需:面未示) 或多個側面凹槽(圖未示)二用：: 6/20 201126656 承戴件側面凹槽（圖未示）可選擇性地設置於 凹槽(圖未示叉ί:側:二若是採用至少-環型側面 至少-側面凸塊（圖未示）的話， 未干）目:"I凹槽（圖未示）或至少一環型侧面凸塊（圖 未不;）則環繞承載件1◦的整個側面。 Ρ苔々Γ件1 Q的上表面具有多個預備被殼體單元3所 凹槽1在其他實施例中，亦可不 2i^=1Qb’或者上述多個表面凹槽亦可 需长二，凸塊（圖未示）。另外，依據不同的設計 ;在另一貫施例中’承載件10的下表面亦可設置多 ==元3所覆蓋之表面凹槽(圖未示)或表面 外Q具有多個預備被殼體單元3所包覆且向 元Ί所~ ,之^外切結構1 Q e及多個預備被殼體單 構1 η ^且相對應該些聯外支撐結構1 0 c之凸出結 個料支躲構1 G c的末端具有 〇 二卜之，外切割面1 ◦ ◦ c ’且每-個凸出結構1 二卜支禮結構1Qc且從承載件1〇的 體單元3 ^接以用於增加承載件1 ◦側邊接觸於殼Through-holes, the inner surface of the through-hole forms an at least-annular structure, and the body is provided as early as - having a portion for wrapping the carrier--and optionally connecting the ring-shaped element, the annular casing- Partially filled in the above-mentioned Ϊ 1 - shell perforations to cover the at least-annular structure. According to the above structure, the present invention can increase the bonding force between the gusset and the annular shell (10), and reduce the intrusion of outside water and gas. In addition, the present invention provides a light-emitting diode package structure, which is provided in a package structure-light-emitting unit and a package unit, and a plurality of light-emitting units are disposed on the carrier and are provided by the annular housing. The light-emitting diode crystals are surrounded, and each of the light-emitting diodes is electrically connected to the ground between the two conductive pins. The package unit has a light-transmissive package for covering the two-light-emitting diode die and surrounded by the annular casing. Therefore, the present invention has the beneficial effects of: increasing the bonding force between the carrier and the annular casing - and The external water vapor is slowed down through the bearing member and the annular shell, and the field is filled with the human & crystallized area, thereby increasing the reliability and service life of the product. In order to make it possible to further understand the various technical and technical contents of the present invention, please refer to the following detailed system and system related to the present invention. However, the Shaoguan type only provides reference and saying day (4), and _ practicing this plus recording . [Embodiment] 5/20 201126656 The first A to the D-D are a structure of the first embodiment of the present invention, which includes: a base single itl, a pin unit 2, and a housing unit 3. . n is a perspective view showing the relative positions of the base unit 1 and the pin unit 2 in the package structure according to the first embodiment of the present invention as shown in FIG. 1A, wherein the range of the circle A in the first-Affil is circled. A side view of the side view can be obtained by performing a side view. The base unit 1 has a bearing member and at least a through hole 11 extending through the carrier. The carrier 10 is usually made of a metal material having a high thermal conductivity. The upper portion of the carrier 10 is formed and the crystal region is formed. The inner surface of the through hole 11 forms at least one annular structure 11〇. In the present embodiment, when the cake 1 is used, it is an integrally formed heat dissipating member. The carrier member 10 can be of at least two-piece construction, for example, the carrier member 1 has a carrier (not shown) and a heat dissipation layer (not shown) extending from the carrier surface to the lower surface of the carrier. , the water raft 1 〇 has a plurality of preparations covered by the casing unit 3 = 2;; = said; the carrier of the embodiment is placed on the opposite side of the load bearing surface T0a " On the side or in the other aspects, in the other embodiments, the side may not be provided; ==, 3 may be replaced with a plurality of side groove soils: grooves (not shown in Fig. 2: ring shape around the surface) Side, in other words 'designer can be based on different settings:; need: face not shown) or multiple side grooves (not shown) for two purposes: 6/20 201126656 wear side groove (not shown) Selectively set in the groove (the figure does not show the fork ί: side: two if at least - ring type side at least - side bumps (not shown), not dry) head: "I groove (not shown Or at least one annular side bump (not shown;) surrounds the entire side of the carrier 1◦. The upper surface of the moss cover member 1 Q has a plurality of grooves 1 which are prepared by the casing unit 3 in other embodiments, or may not be 2i^=1Qb' or the plurality of surface grooves may need to be long and convex. Block (not shown). In addition, according to different designs; in another embodiment, the lower surface of the carrier 10 may also be provided with a surface groove (not shown) covered by multiple == element 3 or the outer surface Q has a plurality of preliminary housings. The unit 3 is covered with a tangential structure 1 Q e and a plurality of unilateral structures 1 η ^ which are prepared by the shell and correspondingly protruded from the outer support structure 10 c The end of the hiding 1 G c has a bismuth, the outer cutting surface 1 ◦ ◦ c 'and each bulge structure 1 2b support structure 1Qc and is connected from the body unit 3 of the carrier 1 用于 for additional load Piece 1 ◦ side contact with the shell
個聯=構ίΓ例的承載件1〇具有四個側面、四 圖所_ 構1◦c及四個凸出結構1 ◦d (如第-A 於承上^四個聯外支撐結構1 〇 C兩兩分別設置 所一载件1 0的其中一組兩相反側面上（因此如第一 c圖 :==1 ^的其_—組兩相反側面上會分別裸露出 個聯外切割面1〇Qc)，且上述四個凸出結構1〇d 7/20 201126656 兩兩分別設置於承載件 向外延伸而出，以使得牛每 d連接成形結構。當然在另外:實 =:=一一位置處上:上 此外’接腳單元2具有多個設置於承載件工 =2:舉例來說，該些導電接腳2 〇可設 = ' 旁、或者可等分地分別設置於承載件Γ 0的兩相反側面旁。以本實施例所舉的例子而言（如第一 A圖所不）’ a個導電接腳2 Q #分地設置於基座單 =減^，（承载件i Q的每—邊有四個導電接腳2 母叫電接腳2 0具有至少一預備被殼體單元3 所覆蓋之内側接腳貫穿孔2〇a(當然本發明亦可不設置 内側接腳貫穿孔2 〇 a )，且每一個導電接腳2 〇具有至 沙一預備被叙體單元3所覆蓋之接腳凹槽2 〇 〇。在本實 施例中’每-導電接腳2〇的上表面設置有兩個接腳凹槽 200。當然，在其他實施例中亦可在導電接腳2〇的上 表面、下表面或側表面設置一個或多個類似凹槽的結構 (圖未示）。當然，本發明亦可不設置接腳凹槽2 〇 〇， 或者此接腳凹槽2 0 〇亦可更換為接腳凸塊（圖未示）。 另外，每一個導電接腳2 0具有至少一外側接腳貫穿孔2 0 b ° 如第一B圖所示，其為本發明第一A圖之八部分的側 視剖面示意圖。在本實施例中，上述至少一環狀結構丄工 8/20 201126656 為内部凸塊，亦即此内部凸塊 孔11的内表面上，而在剖面中形成一工:=於 其财施例中，上述内部凸塊亦可更換㈣ 因此貫穿孔i !之剖面將呈現類似十二 如第一c圖所示，其為本發明第— 的立體示意圖；如第__D圖所示，其為本結構 之封裝結構的部分立體刮面示意圖。盘二 例 - C圖及第-D圖增加一殼體單元3:二 單元;L和接腳單元2。 覆住基座 :中，殼體單元3通常由塑膠材料所 2=材料)。殼體單元3具有-用於環繞地3 承载件1 0的一部分且連結至接腳 後 〇，環形殼體3 〇的一部分填充於上述至少一 第-Β二示上1〇(如第-八圖及 琿繞和η «體3◦有—環繞承載件10之 〇 a及至少兩個從環繞殼體3 〇 a的内表面 3 0 0向承載件1Q延伸以覆蓋承载件1Q的上表面之 2=3 Q b。舉例來說，環形殼體3 〇環繞承載 〇關圍而包覆承載件i㈣—部分，以使得承載件 上表面及—部分下表面裸露在外。環形殼體3 0 衣％承载件1 〇的朋且包覆每—料電接腳2 部^ ’以使得每—個導電接腳2 Q的—第—末端部2 〇 裸路在外，且使縣-料電_2 Q的 〇4的上表面裸露在外，上述第二末端部2〇二= 9/20 201126656 即成為後續用來電性連接之打線區域。 因此，當承載件10被環形殼體3 0所包覆後，承載 件之該些側面凸塊10a、該些表面凹槽1〇b^ ΐ:7 C及該些凸出結構1 〇 d皆被環形 成-0所〇覆’，、中聯外切割面丄Q Q c則裸露在外。 此外，當每-個導電接腳2 〇被環形殼體3 〇包覆後，每 :電接腳20之内側接腳貫穿孔2〇a及接腳凹槽 〇 〇，形殼體3 〇所包覆，且每一個外側接腳貫穿 匕2 =被區分成—靠近基座單元i之第—貫穿部2〇 。第-貫穿部2Qi連通之第二貫穿部2〇2，盆 =1 導電接腳2 0之第—貫穿部2 〇1被環形殼體 邻2 0 9 分所填滿’而每—個導電接腳20之第二貫穿 J 2 0 2則裸露在外。 貝牙 j本發明第—實施·難結構可祕封裝任何 ί晶片（例如發光二極體晶片)。舉例來說，請 如krr其為本發明第—實施例之-種發光二極 極體立τ示意圖。第一實施例之發光二 不同處僅在於匕二:::單:5。與第-D圖之 條導線W。 ®更加从先早凡4、封裳單元5及兩 毛光單元4具有多個設置於承载件 (第二= 粒例性連二〇::電子 一個發光二__4G可相至/兩每 10/20 201126656 連接於任思兩個導電接腳2〇之間，因此使用上述至少兩 條導線W以導人電流給發光二極體晶粒4◦之電流路禋 用承載件1 Q以驅散發光二極體晶粒4 〇所產生的 =量之散熱路徑不同。換言之，上述發光二極體晶粒4 〇 =水平晶# (h°riz°ntalehip)形式之發光二極體晶粒， 其可，過熱電練’’的方絲達料電及導熱的效果。 扩田然，本發明第一實施例之發光二極體晶粒4〇亦可 ，用垂直‘晶片（vertiealehip)形式之發光二極體晶粒，其 :透過熱電合一的方式來達到導電及導熱的效果。換 =本發明第—實施例亦可將其中—條導線w電性連接 導線與其卜導電接聊2 Q之間，且將另外一條 電接腳？ η讀連接於發光m粒4 Q與另外一導 =接之間，透過上述“熱電合―”的電性連接方 ^2 0：：：^^^ 4 0依計需求’若是使用多個發光二極體晶粒 的方式電性極體晶粒4〇可選擇性以串聯或並聯 發光二極體曰？於任意兩個導電接腳20之間，當然該些 行紐連串聯及並聯的方式進 體晶粒40且裝早疋5具有—用於覆蓋該些發光二極 如透4=:==30所環繞之透先封裝膠體（例 - 所述’本發明至少具有下例幾項特點. 穿孔的一部分填充於上述至少一貫 結合 201126656 1 0與環形殼體3 0之間的細縫而入侵置晶區域1 〇〇。另外，由於“貫穿孔11的内表面形成至少一 環狀結構11〇的設計’更能夠特別強化上述的結 合力及減缓水氣入侵的能力。 二、 由於承載件1 〇側邊之側面凸塊1 q a ”的設 計，以增加承載件10側邊與環形殼體3 〇之間的結 合力，且更可減緩外界水氣通過承載件1〇底部與環 形殼體3 0之間的細縫而入侵置晶區域1〇 〇。 三、 由於“承載件10之表面凹槽10 b”的設計，以增 加承載件10上表面及/或下表面與環形殼體3 〇 之間的結合力’且更可減緩外界水氣通過承載件丄〇 底部與環形殼體3 0之間的細縫而入侵置晶區域1 0 0° 四、 由於“多個被殼體單元3所包覆且相對應該些聯外 支撐結構10c之凸出結構1〇d”的設計，以減緩 外界水氣通過承載件1 0的聯外支撐結構1 〇 c與 環形殼體3 0之間的細縫而入侵置晶區域1 〇 〇。 五、 由於“每一個導電接腳2 0之第一貫穿部2 〇工被 一部分设體早元3所填滿，且每一個導電接腳2 〇之 第一貝穿部202裸露在外的設計，以減少環形殼 體3 0與每一個導電接腳2 0之間的結合界面，進= 減缓外界水氣通過每一個導電接腳2 〇與環形殼體 3 0之間的細縫而入侵置晶區域1〇 〇。 六、 由於“至少兩個從環繞殼體3 〇 a的内表面3 〇 〇 向承載件1 0延伸以覆蓋承載件i.O的上表面之延 伸殼體3 0 b”的設計，以增加承载件丄〇的上表面 12/20 201126656 與環形殼體3〇之間的μ 〇從承餅降=形殼體3 5 〇與承載件} 〇的__與減^、透光封裝膠體 5 0因與金屬結a性 積以降低透光封裝夥體 請參閱第三A‘第:=離的可能性。 二實施例之發光二極體 0 τ ’其分別為本發明第 示意圖。本發明亦可提各種打線方式之上視 發光二極體封褒結構。第揭^個導電接腳2 0之 粒4 0電性連接於每兩圖揭路母一個發光二極體晶 2 0之間。第三β圖揭露每目一個導電接腳 二連接相對“導趙二= ]第一c圖揭露兩個發朵_雕曰 u之 ::個相對稱或不相對稱同ί性= 揭路母兩個發光二極體晶粒4 〇串聯電=二D圖 對稱或不相對稱的導電接腳2 0之間。第三個相 發光二極體晶粒40電性連接於兩個相;=路-個 ，腳20之間。第三觸露兩個發光=稱 電性：：對稱或不相對稱的導電接腳= 平晶轉 極體晶粒的上表面具有兩 ^ ^光- 二極體晶粒的上表面及下表面則分別具有==之發光 述打線方式(如第三八圖至第口圖所示而前 二極體晶粒4 〇即屬於水平晶片形式。然而在另〜二發光 二=二，4〇為垂直晶片形式，如= ”早—發光二極體晶粒4◦作說明，僅需將ΐ性 13/20 201126656 連接於導電接腳2 Q與發光二極體晶粒4 ^之間的I中 一導線w改為電輯駿導、雜〇與承載件i 〇之 間，透過此種方式亦可使得發光二極體晶粒4 0達到電性 導通的效果。 此外，在其他實施例，在配置多個發光二極體晶粒4 日、’亦可同時獅水平^形式和垂直以形式的發光 一極肢晶粒。另外，上述發光二極體晶粒4 Q電性連接於 =導電接腳2 〇之間的方式只是用來舉例而已，而並非 =^本發明。換言之，設計者可隨著不_設計需 ^來選用不同數量及形式的發光二極體晶粒4〇(例如 早用水平晶片形式或垂直晶片形式的發光二極體晶 ;曰立’或可混搭水平晶片形式㈣直日日日片形式的發光二極體 並决疋該些發光二極體晶粒4 〇要採用串聯、並 葬或串聯加並聯的方式來達成電性連接。 以上所祕為本發明讀佳可行實闕，非因此侷限 路I明，專利範圍，故舉凡運用本發明說明書及圖示内容 為之等效技術變化，均包含於本發明之範圍内。 【圖式簡單說明】 第A圖為本發明第一實施例之封袭結構的基座單元與 ★ 接腳單元的相對位置之立體示意圖； 圖為本發明第—a圖之A部分的側視剖面示意圖； 圖為本發明第—實施例之域結構之立體示意圖； 〇圖為本發明第-實補之封1纟#構之部分立體剖 面示意圖； 第二圖為本發明第-實施例之發光二極體封裝結構之部 分立體剖面示意圖； 14/20 201126656 第三A圖為本發明第二實施例之發光二極體封裝結構的 第一種打線方式之上視示意圖； 第三B圖為本發明第二實施例之發光二極體封裝結構的 第二種打線方式之上視示意圖； 第三C圖為本發明第二實施例之發光二極體封裝結構的 第三種打線方式之上視示意圖； 第三D圖為本發明第二實施例之發光二極體封裝結構的 苐四種打線方式之上視不意圖， 第三E圖為本發明第二實施例之發光二極體封裝結構的 第五種打線方式之上視示意圖；以及 第三F圖為本發明第二實施例之發光二極體封裝結構的 第六種打線方式之上視示意圖。 【主要元件符號說明】 承載件 1 0 置晶區域 1 0 0 側面凸塊 1 0 a 表面凹槽 1 0 b 聯外支撐結構 1 0 c 聯外切割面 1 0 0 凸出結構 1 0 d 貫穿孔 1 1 環狀結構 1 1 0 導電接腳 2 0 内側接腳貫穿孔 2 0 a 外側接腳貫穿孔 2 0 b 接腳凹槽 2 0 0 基座單元 1 接腳單元 2 15/20 201126656 第一貫穿部 2 0 1 第二:貫穿部 2 0 2 第一末端部 2 0 3 第·一末端部 2 0 4 殼體單元 3 環形殼體 3 0 環繞殼體 3 0a 内表面 3 0 0 延伸殼體 3 0b 發光單元 4 發光二極體晶粒 4 0 導線 W 封裝單元 5The carrier 1〇 of the 联 = 构 〇 〇 〇 〇 〇 〇 〇 〇 〇 〇 〇 〇 〇 〇 〇 ( ( ( ( ( ( ( ( ( ( ( ( ( ( ( ( ( ( ( ( ( ( ( ( ( ( ( ( ( ( ( C two and two respectively set one of the two opposite sides of one of the carriers 10 (so as the first c picture: = = 1 ^, the opposite side of the group will expose a separate outer cutting surface 1 〇Qc), and the above four protruding structures 1〇d 7/20 201126656 are respectively disposed on the support member to extend outwardly, so that the cows are connected to the forming structure every d. Of course, in addition: real =:= one by one At the position: the upper part of the 'pin unit 2 has a plurality of mountings on the carrier=2: for example, the conductive pins 2 can be set to be 'side or aliquoted separately on the carrier Γ Next to the opposite sides of 0. In the example given in this embodiment (as shown in Figure A), a conductive pin 2 Q is placed on the base single = minus ^, (carrier i There are four conductive pins 2 on each side of the Q. The female electrical pins 20 have at least one inner pin through hole 2〇a which is prepared to be covered by the housing unit 3 (of course, the present invention may not be provided inside. The foot through hole 2 〇 a ), and each of the conductive pins 2 〇 has a pin groove 2 至 covered by the sand-prepared body unit 3. In the present embodiment, 'per-conductive pin 2 〇 The upper surface is provided with two pin grooves 200. Of course, in other embodiments, one or more groove-like structures may be disposed on the upper surface, the lower surface or the side surface of the conductive pin 2〇 (Fig. Of course, the present invention may not be provided with the pin groove 2 〇〇, or the pin groove 20 〇 may be replaced with a pin bump (not shown). In addition, each of the conductive pins 20 Having at least one outer pin through hole 2 0 b ° as shown in FIG. B, which is a side cross-sectional view of the eighth part of the first A drawing of the present invention. In the embodiment, the at least one ring structure 丄8/20 201126656 is an inner bump, that is, on the inner surface of the inner bump hole 11, and a work is formed in the cross section: in the case of the financial embodiment, the inner bump can also be replaced (four), thus the through hole The cross section of i! will be similar to twelve as shown in the first c-figure, which is a perspective view of the first embodiment of the present invention; __D diagram shows a part of the three-dimensional scraping surface of the package structure of the structure. The two cases of the disk - C and D - add a housing unit 3: two units; L and the pin unit 2. Seat: Medium, housing unit 3 is typically made of plastic material 2 = material. The housing unit 3 has a portion for surrounding the carrier 3 and is attached to the rear heel, part of the annular housing 3 Filled in at least one of the above-mentioned first - Β 示 〇 〇 〇 〇 〇 〇 〇 〇 〇 〇 〇 〇 〇 〇 〇 〇 〇 〇 〇 〇 〇 〇 〇 〇 〇 〇 〇 〇 〇 〇 〇 〇 〇 〇 〇 〇 〇 〇 〇 〇 〇 The surface 300 extends toward the carrier 1Q to cover 2 = 3 Q b of the upper surface of the carrier 1Q. For example, the annular casing 3 is wrapped around the load-bearing surround to cover the carrier i (four)-portion such that the upper surface of the carrier and a portion of the lower surface are exposed. The ring-shaped housing 30 has a carrier member 1 and covers each of the electrical pins 2 so that the first end portion 2 of each of the conductive pins 2 Q is outside the bare line, and The upper surface of the 〇4 of the county-material _2 Q is exposed, and the second end portion 2 〇 2 = 9/20 201126656 becomes the wiring area for subsequent electrical connection. Therefore, after the carrier 10 is covered by the annular casing 30, the side protrusions 10a of the carrier, the surface grooves 1〇b^ΐ: 7 C and the protruding structures 1 〇d are It is covered by a ring of -0, and the outer surface of the joint is 裸QQ c exposed. In addition, after each of the conductive pins 2 is covered by the annular casing 3, each of the inner pins of the electric pin 20 has a through hole 2〇a and a pin groove 〇〇, and the casing 3 is Wrapped, and each outer leg runs through 匕 2 = is divided into - near the first through portion 2 of the base unit i. The second through portion 2〇2 of the first through portion 2Qi is connected, and the first through portion 2 〇1 of the conductive pin 20 is filled by the annular casing adjacent to each other, and each of the conductive contacts The second of the foot 20 runs through J 2 0 2 and is exposed. The present invention is the first implementation of the invention. It is difficult to structure any ί wafer (such as a light-emitting diode wafer). For example, please use krr as a schematic diagram of a light-emitting diode pole τ according to the first embodiment of the present invention. The illumination of the first embodiment differs only in the second::: single: 5. A wire W with the -D diagram. ® more from the first 4, the cover unit 5 and the two hair unit 4 have multiple settings on the carrier (second = granules of the second 〇:: one illuminating two __4G can be phased to / two per 10 /20 201126656 is connected between the two conductive pins 2〇, so the above-mentioned at least two wires W are used to conduct the current to the light-emitting diode die 4◦ to drive the carrier 1 Q to dissipate the light. The amount of heat generated by the diodes of the diodes is different. In other words, the light-emitting diodes of the above-mentioned light-emitting diodes are in the form of horizontal crystals (h°riz°ntalehip), which can be , the effect of the electric wire and heat conduction of the superheated electrician'. The expansion diode, the light-emitting diode of the first embodiment of the present invention can also be used, and the vertical 'waferalehip type of light-emitting two A polar body grain, which has the effect of conducting electricity and heat conduction by means of thermoelectric integration. In the first embodiment of the present invention, the wire can be electrically connected to the wire and the wire is electrically connected. And connecting another electric pin? η reading between the light-emitting m-particle 4 Q and another guide-conducting The electrical connection of "thermo-electricity" is ^2 0:::^^^ 4 0 according to the demand. 'If a plurality of light-emitting diode grains are used, the electric polar body grain 4〇 can be selectively The series or parallel light-emitting diodes are disposed between any two conductive pins 20, of course, the rows are connected in series and in parallel to form the die 40 and the early die 5 has a cover for covering the light-emitting diodes Extremely as a through-package colloid surrounded by 4=:==30 (Example - the 'the invention has at least several features of the following example. A part of the perforation is filled in the above-mentioned at least consistently combined with 201126656 1 0 and the annular casing 3 0 The sipe between them invades the crystallized region 1 另外. In addition, since the design of the inner surface of the through hole 11 forming at least one annular structure 11 ' can further strengthen the above-mentioned bonding force and slow the intrusion of water and gas. 2. The design of the side bump 1 qa ” of the side of the carrier 1 to increase the bonding force between the side of the carrier 10 and the annular casing 3 ,, and to further reduce the external moisture passing through the carrier The slit between the bottom and the annular casing 30 is invaded into the crystallized region 1〇〇. 3. Due to the design of the "surface groove 10b" of the carrier 10, the bonding force between the upper surface and/or the lower surface of the carrier 10 and the annular casing 3" is increased, and the external water and gas passing through is further relieved. The sipe between the bottom of the piece and the annular casing 30 invades the crystallized area 1 0 0°. 4. Because of the plurality of protrusions covered by the housing unit 3 and correspondingly protruding from the outer support structure 10c The structure 1 〇 d" is designed to slow the outside water vapor from entering the crystallized region 1 through the slit between the outer support structure 1 〇c of the carrier 10 and the annular casing 30. The first through portion 2 of each of the conductive pins 20 is completed by a portion of the device body 3, and the first shell member 202 of each of the conductive pins 2 is exposed to the outer design to reduce the annular shell. The bonding interface between the body 30 and each of the conductive pins 20, the inversion of the outside water vapor through the slit between each of the conductive pins 2 〇 and the annular casing 30 to invade the crystallized region 1〇 Hey. 6. Due to the design of at least two extension housings 3 0 b extending from the inner surface 3 of the casing 3 〇a toward the carrier 10 to cover the upper surface of the carrier iO to increase the carrier 丄The upper surface of the crucible 12/20 201126656 and the annular casing 3〇 μ 〇 from the bearing cake = the shape of the shell 3 5 〇 and the carrier} 〇 __ and minus ^, light-transmissive encapsulation 50 The metal junction a product to reduce the light-transmissive package body please refer to the third A':: possibility of separation. The light-emitting diodes 0 τ ' of the second embodiment are respectively the first schematic views of the present invention. The invention can also provide a top view light-emitting diode sealing structure for various wire bonding methods. The first layer of the conductive pin 20 is electrically connected to each of the two light-emitting diodes. The third β-graph reveals that each of the conductive pins is connected to each other. The first c-picture reveals two hairs _ 曰 之 u:: a relative or not symmetrical The two light-emitting diode crystals are electrically connected to the two phases; the third phase-emitting diode 40 is electrically connected to the two phases; Between the road and the foot 20. The third touches the two illuminators = the electrical properties: the symmetrical or non-correlated conductive pins = the upper surface of the flat crystal dies has two ^ - light - two poles The upper surface and the lower surface of the bulk crystal grains respectively have a illuminating pattern of == (as shown in the third to eighth figures), and the front diode dies 4 are in the form of horizontal wafers. Two illuminating two=two, four 〇 is a vertical wafer form, such as = "early-light-emitting diode die 4", only need to connect the 1313/20 201126656 to the conductive pin 2 Q and the light-emitting diode In the middle of the die 4 ^, a wire w is changed between the electric relay, the hybrid, and the carrier i , , and in this way, the light-emitting diode 40 can be electrically connected. In addition, in other embodiments, the plurality of light-emitting diode crystal grains are arranged for 4 days, and the light-emitting diode crystal grains may be simultaneously formed in the form of a lion horizontally and vertically. The way in which the grain 4 Q is electrically connected to the = conductive pin 2 只是 is only used as an example, and is not the invention. In other words, the designer can select different numbers and forms of illuminating with the need of design. Diode grain 4〇 (for example, a light-emitting diode crystal in the form of a horizontal wafer or a vertical wafer; a light-emitting diode in the form of a vertical wafer or a mashable horizontal wafer) The light-emitting diode crystals 4 are connected in series, burial or series-parallel to achieve electrical connection. The above secrets are good for the present invention, and therefore are not limited to the scope of the patent, so The equivalent technical changes of the present specification and the illustrated contents are all included in the scope of the present invention. [A Brief Description of the Drawings] FIG. A is a base unit of a sealed structure according to a first embodiment of the present invention. ★ Relative position of the pin unit BRIEF DESCRIPTION OF THE DRAWINGS FIG. 3 is a side cross-sectional view showing a portion A of the first embodiment of the present invention; FIG. 3 is a perspective view showing the domain structure of the first embodiment of the present invention; BRIEF DESCRIPTION OF THE DRAWINGS FIG. 2 is a partial perspective cross-sectional view showing a light emitting diode package structure according to a first embodiment of the present invention; 14/20 201126656 FIG. 3A is a light emitting diode according to a second embodiment of the present invention; FIG. 3B is a top view showing a second type of wiring pattern of the LED package structure according to the second embodiment of the present invention; The third wire drawing mode of the light emitting diode package structure of the second embodiment is a top view; the third D figure is the top of the four wire bonding modes of the light emitting diode package structure of the second embodiment of the present invention. The third E is a top view of the fifth wiring method of the LED package structure according to the second embodiment of the present invention; and the third F is the LED package structure of the second embodiment of the present invention. Sixth On-line view of FIG. [Description of main component symbols] Carrier 1 0 Crystallized area 1 0 0 Side bump 1 0 a Surface groove 1 0 b Joint external support structure 1 0 c Joint outer cutting surface 1 0 0 Projection structure 1 0 d Through hole 1 1 Ring structure 1 1 0 Conductor pin 2 0 Inner pin through hole 2 0 a Outer pin through hole 2 0 b Pin groove 2 0 0 Base unit 1 Pin unit 2 15/20 201126656 First Penetration 2 0 1 2nd: Penetration section 2 0 2 First end section 2 0 3 1st end section 2 0 4 Housing unit 3 Annular housing 3 0 Surrounding housing 3 0a Inner surface 3 0 0 Extension housing 3 0b Light-emitting unit 4 Light-emitting diode die 40 Wire W Package unit 5
16/2016/20