TW201126582A - Apparatus for forming protective tape on compact camera chips and method of the same - Google Patents

Abstract

The present invention provides a method for forming a protective tape on compact camera chips. The method includes providing a support plate for carrying a chip tray to fix position of the chip tray with a plurality of chips formed thereon. A housing is provided for fixing the support plate. A protective tape is attached on the surface of the housing. A press plate is applied to the protective tape such that the protective film patterns on the protective tape are transferred to the chips.

Description

201126582 «

II. Description of the Invention: [Technical Field of the Invention] The present invention relates to a miniature imaging chip, θ 士 a 仏 疋 疋 疋 疋 吕 吕 吕 吕 疋 疋 疋 疋 疋 疋 吕 吕 吕 吕 吕 形成 形成 形成 形成 形成 形成 形成 形成 形成 形成 形成 形成 形成 形成 形成 形成Prior Art] / ° A semi-sensor has been widely used as an image sensor, and its polar body can be used as a photoelectric conversion element. At present, there are two types of ==: detectors, one of which is a charge-matching semiconductor image sensing device (CCD) for detecting light and transmitting photoelectric w. The electric body-like shirt-like sensor has a complementary transmission first charge. Complementary Gold Oxygen The above applications mainly utilize the dynamic diencephalic array of photodiode elements or image sensing into digital data. Fj π incident image light energy conversion shadow silly., witnessed the ten commissions 1 Meng milk +% effect crystal and other Yang, can improve the image quality of image capture devices (such as · digital mobile phones and digital cameras, etc.) . Shadow ..., to detect object information and convert it into 1. , ', kind of ^ oa t -. Two electronic shirt like signal components. Brother; silly feeling 7 pieces can include - photo 1 dry image such as well ^ kg solid state image sensor. Camera tube 疋 Pilot S, lead oxide tube or selenium arsenic detector is, for example, a complementary squint image S, and a resent image-sensing metal wafer semiconductor or charge-component. The electrical coupling element and the complementary gold nii M ja a , can be used as a dust mites wafer. Miniature imaging chip 4 Mamur image s day film has low power consumption, small size, small weight, LSj 3 201126582; r short exposure time and no need to preheat the portable image scanning device to get the seat, in the A-speed image Input and to integrate with scanning, faxing, and "/useless applications. The miniature imaging chip can be used in a transmissive transaction machine. It is the dirt of the Particles, and the brakes are “injury, static electricity, or the quality of the image. Even the electrical I times, the uncle dyeing will affect the π”, and the failure will be in the miniature camera f Κ u u > Into a protective plaque to prevent dust pollution

A method of forming a protective film on the wafer, and a conventional microphotograph (P: by piece) attaches the protective film to the wafer. This method also accurately aligns a single protective film to the crystal grain, and it is easy to produce a white film, and it has a lot of time for a large number of miniature cameras. The invention relates to a method for forming a protective film attached to a micro-imaging wafer. The present invention provides a method for attaching a conventional protective film to a micro-imaging film to overcome the above disadvantages. . SUMMARY OF THE INVENTION In view of the above, the main object of the present invention is to provide a device for a type of imaging chip and a method for forming the same, which are used to improve the adhesion efficiency and assembly accuracy of the protective film. Another object of the present invention is to provide a method for forming a protective film on a micro-image wafer, which can easily attach a protective film to a micro-imaging wafer to uniformly adhere the protective film to the micro-imaging wafer. A further object of the present invention is to provide a method of forming a protective film on a 胄-type image-capturing wafer, which allows the protective film to be placed in a grouped manner, 4, 201126582. Another object of the present invention is to form a method for forming a wafer, using a lower protective film on a micro-image-image wafer, to save the cost of the product, and to protect the film on the micro-camera. A method for forming a micro-imaging wafer of the present invention, the package = two" - a protective film in the film =, the position of the fixed wafer disk - a plurality of on the wafer plate = upper use - outer cover to fix the support plate; attached - The protective sheet is mounted on the outer cover and pressurized on a pressing plate to make the protective sheet on the plurality of wafers. The T-shaped skin support plate includes a receiving space, a plurality of and a second blink, and the receiving space is transmitted. A blinking L-loaded wafer disc. The outer cover includes a plurality of m two blinks and a recess. The second pick is used to engage the second two recesses to accommodate a plurality of wafers. The upper cover includes a fourth U-shaped solid material. The fourth blinking eye is used to join the first third and third falling eyes. The protective sheet further comprises a cymbal patch: the slab is fixed on an upper cover. / Further, in the example, the protective film of the present invention is applied to the micro imaging wafer. The forming method further includes lifting the upper cover and the outer cover to separate the crystal The disc and the support plate 0. In a practical example, the method of the present invention further comprises attaching a embossing member to the surface of the outer cover and then pressing the pressing plate over the embossing member to make the protective film more closely attached to the wafer. Dezhi, 狡 L Λ Λ , , 俊 俊 俊 , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , 俊 , , 俊 , , , , , , , , , , Separating from the wafer and the support plate according to another aspect of the present invention. According to another aspect of the present invention, the method of forming a protective film on a micro-photographing wafer includes a method of capturing and capturing a support plate for use. In the position of carrying a 曰 S 曰 ' ' 晶片 晶片 晶片 晶片 晶片 晶片 晶片 晶片 晶片 晶片 晶片 晶片 晶片 晶片 晶片 晶片 晶片 晶片 晶片 晶片 晶片 晶片 晶片 晶片 晶片 晶片 晶片 晶片 晶片 晶片 晶片 晶片 晶片 晶片 晶片 晶片 晶片 晶片 晶片 晶片 晶片 晶片 晶片 晶片'The protection across the protective sheet ί: In the area; pressurize a strip on the transfer belt, so that the protective film is transferred to the transfer:: belt: upper; remove the protective sheet on the outer cover, then attach Protective film: Transfer π to the cover, so that the protective film is attached to the plural On the surface of the wafer; and removing the transfer belt. In one embodiment, the method of the present invention further includes securing the outer cover with an upper cover to lift the bonded upper cover and the outer cover to separate from the wafer disk and the plate. According to still another aspect of the present invention, a method for forming a protective film on a micro-imaging wafer is provided, which includes: providing a support plate for carrying a wafer disk to set a position of the wafer disk; a plurality of wafers are disposed on the wafer disk; Using a cover to fix the support plate; attaching a protective sheet to the surface of the cover; t and a protective film on the pressure protection sheet, so that the protective film pattern is attached to the upper surface of the plurality of wafers, and then the protective sheet is removed. To transfer the protective film pattern to the upper surface of the plurality of wafers. A device for forming a protective film on a wafer, comprising: a floor slab for carrying a wafer tray to fix the position of the wafer tray, the wafer tray Having a plurality of wafers disposed thereon; a cover for fixing the support plate; a protective sheet for attaching to the surface of the cover; and a pressure plate for pressurizing the protector 201126582 The protective film is transferred onto a plurality of wafers, and the platen is fixed on the upper cover. The method and apparatus for forming a protective film of the present invention on a micro-imaging wafer do not overcome the disadvantages of the prior art, and can effectively increase the efficiency and reliability of the formation method of the protective film on the micro-imaging wafer, and can greatly reduce the cost. [Embodiment] The present invention will be described in detail with reference to the preferred embodiments thereof and the accompanying drawings. It should be understood that all of the preferred embodiments of the present invention are for illustrative purposes only, and spring is not intended to be limiting. Therefore, the present invention is also widely applicable to other embodiments except for the preferred embodiments. The present invention is not limited to any embodiment, and should be determined by the scope of the appended claims and their equivalents. Hereinafter, preferred embodiments in accordance with the present invention will be described in detail with reference to the accompanying drawings. Further views and advantages of the novel concepts of the present invention will be set forth in the following description, and the <RTIgt; The present invention provides a method of forming a protective film on a miniature imaging chip, which can be applied to a miniature camera module (C0mpact Camera)

Module. CCM) and Wafer Level Module (WLM) products. As shown in the first figure, it shows a distraction of the support plate according to the first embodiment of the present invention. A support plate 100 includes an accommodation space ιοί, a plurality of boring heads 102, a mortise 103, and a mortise 1 〇4. It is noted that the support plate 1 of the present invention includes the accommodating space 101 in a central (heart) region, such as a support plate cavity 101' to facilitate carrying the wafer disk, and to fix the position of the wafer disk 201126582 «. In this embodiment, the boring head 102, the cymbal cymbal 103 and the mortise 104 are located in the lower left and right sides of the slab 1 , to facilitate the joining of the subsequent fittings. Referring to the second figure, the wafer 胄1〇5 includes a plurality of pits therein to facilitate the embedding of a plurality of micro-imaging wafers 106, such as image sensors 1〇6. The image sensor comprises an electrode 塾, the upper surface of which has a sensing area for receiving the image beam, and the electrode 为 is the sensing area for outputting (into) the signal to the (self) interface. The micro imaging wafers 106 are arranged in an array on the wafer trays 1 to 5. The wafer tray 1 〇 5 is aligning the support plate cavity 1G1 to facilitate placement on the support plate _ upper two. Then, the wafer tray 105 is placed in the cavity 1 〇 1 of the support slab 1 with reference to the third figure. An outer cover (h〇Using) 107, which includes an alignment mark iu, a small convex (1〇9a and 1〇9b, a boring head 108a, a mortise 108, and a recess 11〇, with reference to the fourth figure cover 1 〇7 The configuration is changed for different products, which is used to limit the position of the miniature imaging chip and the protective sheet. The alignment mark (1), for example, a circular mark (may also be other shapes, depending on the use), is located on the upper left Square corners (other positions may be used depending on the use) to facilitate alignment. The small protrusions (7) and 109a are respectively located on the lower two sides of the outer cover 1〇7 to facilitate the alignment and engagement of the subsequent protective film, blinking (10) The left and right sides of the outer cover are placed in the middle of the outer cover 1〇7. Then, the outer cover W is placed and fixed on the support plate 1GG and the crystal U 105, and the tread 108a is embedded to engage The rod eye 1〇4' lattice pit is a pair of two micro-image wafer traces. This lattice-shaped recess (4) essentially needs to be aligned with the ^ wafer 106. The depth of the recess 11 can make the miniature camera

SI 8 201126582 f \ The wafer 丄 06 is able to pass through it, refer to the fifth figure. The fault-protecting 2 piece 112' is, for example, a protective tape 112, which includes a plurality of months, (5) 114, and the upper and lower corners of the protective sheet 112 include openings 113a' to facilitate the small convex S i 〇 9a on the outer cover 1 and Positional match: the second two ^ &quot; test the sixth picture. In one embodiment, the protective sheet 112 is composed of a layer of a material layer (for example, the first layer is a polyimide film layer factory) having a plurality of protective film patterns ι 4 thereon; the second layer is a gasket ( It is called 'polyimide protection 貘 pattern ιΐ4 adhesive pad. After that, 2 through openings U3a and 113b and small (10) position and urn's alignment patch 5 'protective sheet 112 fits on the surface of the outer cover 1〇7 Each of the protective Γ Γ Γ Γ Γ Γ Γ Γ Γ Γ Γ 五 五 五 五 五 五 五 五 五 五 五 五 五 五 五 # # # # # # # # # # # # # # # # # # # # # # # # # # # # In the eighth embodiment, in the present embodiment, the - (under the surface below the surface of the P-Shi 〇 ^ 5), the pressure W30 has a raised portion 131 in which the array is formed, and the pressing plate 13 〇 utilizes a fastening member 132 is fixed under the upper cover i15. The upper cover 115 can change its configuration for different products, which is used to carry the pressure plate 130, by the alignment mark of the outer cover can be more accurately = the same 'the pressure plate 130 can be different The product changes its structure, so that the protective film (adhesive tape) is tightly attached to the micro imaging chip. For example, the upper cover 115 fish cup ηη_τ, /, the pressure plate 13 〇 can be made according to the integrally formed side 1. The 艮 艮 U7 is located in the upper two sides of the upper cover 115, and the fastening members are located at the upper cover 115 The corner is made to facilitate the engagement with the slab _ and the hood 1 〇 7. Then 'embedded into the rod eye (10) through the fastening member ι 6 , S1 201126582 * \ , the eye is engaged with the hoe 102, and the upper cover 115 is placed and fixed on the support Above the 1G7 cover, the money is applied downwards to the upper cover (1) reference = Fig. Before the step of applying the downward force 118 to the upper cover 115, the micro imaging wafer 1G6 is slightly aligned and fitted with the groove Then, the appropriate application 2 is performed so that the micro-imaging wafer 1 () 6 is embedded in the groove, and the protective film pattern 1H is then transferred (applied/attached) onto the micro-imaging wafer (10) = For example, the size of the groove is approximately equal to the size of the protective film pattern: the arrangement of the plurality of grooves corresponds to the plurality of protection patterns 114. Then, the force is applied upwards to lift up Cover (10), ^ test chart below the tenth figure. Based on the combination of the upper cover ιΐ5 and outside After the cover 1〇7, the micro-line image wafer Η6 is separated from the upper cover 115, the upper cover ΐ5 and the outer cover ι〇7 silly ^ Η 曰曰 曰曰 I I I 置 置 置 置 置 置 置 置 , , , , , , , , , , , The protective film pattern U4 is adhered thereto on the day 106, as shown in the wide drawing, referring to the eleventh figure. In this embodiment, the protective film pattern is: smashed down, the upper cover 115 and the outer cover 1〇7 are separated, and removed ( The protective film 112' on the protective film 112 is peeled off onto the micro-imaging wafer 1〇6 at this time, so that the original protective film pattern position on the protective sheet (1) leaves a gap (opening) Referring to the twelfth figure, the outer cover 107 is located on the wafer tray 〇5 and the support plate _, refer to Fig. The outer cover 107 described above is placed and incorporated in the fourteenth drawing. Cardiac tea =, selectively attaching a component m, such as a rubber film (10), d, to the surface of the outer I 107, and the rubber film 120 is attached to the protective film pattern 114 on the micro imaging wafer 106 in the cymbal disk 105. ,; .201126582

I I test the fifteenth map. Similarly, the upper cover 115 is aligned with the support plate 100 and the outer cover 1〇7, refer to the sixteenth figure. The upper cover 115 is placed downward and fixed on the support plate 1〇〇 and the outer cover 1〇7, and is appropriately applied to the upper cover 115 downwardly, and is pressed by the rubber film 12 so that the protective film 114 is tightly attached. The micro imaging chip 1〇6, refer to the seventeenth figure. Thereafter, the combined upper cover 115 is lifted, leaving the cover ι 7 [the wafer disk 105 and the support plate 100, and the rubber film on the cover 1 〇 7 is removed. Refer to Fig. 18. After the rubber film m is removed, the upper cover 115 is placed in the lower position and fixed to the support plate 1 and the material 107, and the alignment and fixing manner are as described above, cf. Figs. 19 and 20. (4) Lifting up the combined upper jaw 115 and the outer cover 1 () 7 to leave the wafer tray 1〇5 placed on the support plate_, refer to the twenty-first and twenty-second figures. The next step is to separate the wafer tray 1〇5 from the support plate 1〇〇, at this time, the micro

A clean protective film pattern 114 is adhered to the image forming film 106 to protect it from particle contamination. Refer to Figure 23. It is noted that the steps of alignment, bonding and separation between the above devices of the present invention can be accomplished manually or automatically. As shown in Fig. 24, there is shown a schematic view of a support plate in accordance with a second embodiment of the present invention. The sound support + support plate 200 includes an accommodation space, a plurality of hoes 202 and a mortise 2 〇 3 . The accommodating space 2〇1 is located in the central 2 area, for example, the support plate cavity 2〇1 to facilitate carrying the wafer tray. In ::: 1, Shantou 202 and Blink 2〇3 are respectively located on one side of the support plate to facilitate the joining of subsequent accessories. Referring to the twenty-fifth diagram, S] 201126582 b cymbal disk 204, which includes a plurality of pits for facilitating a plurality of micro-imaging, in which the film /05 is embedded, and the micro-imaging wafer 2 〇 5 is, for example, an image sensor. The micro imaging wafers 205 are arranged in an array on the wafer trays 2 to 4. The wafer tray 204 is aligned with the support plate cavity 2〇1 to facilitate placement on the support plate 200. The wafer tray 204 is placed in the cavity 2〇1 of the support plate 200, with reference to the twenty-fifth diagram. A mask 206 having a configuration similar or identical to that of the fourth figure, including an alignment mark 207, a small projection application, a hammer (similar to the head 108a), a blink 2〇9, and a recess 2〇9a , refer to the twenty-sixth figure. The alignment mark 207' is, for example, a circular mark located at the upper left corner to facilitate alignment: the small protrusions 208a and 208b are respectively located on the lower side of the outer | 2〇6 to facilitate the alignment and engagement of the subsequent protective film, The left and right positions of the 209-position outer cover 206 are in the middle of the outer cover 2〇6. Then, the cover is moved over the support plate 200 and the wafer tray 2〇4, and the (like the head l8a) is embedded to engage the rod eye 2〇3, and the recessed grade is matched with the miniature imaging chip 205. Hole 2 = ... degrees can make a miniature camera = to be worn out, refer to the twenty-sixth figure. The m2 guard 21G' is constructed similarly or identically to the sixth figure, such as A stay 3 knee strap 210' including A plurality of protective film diagrams f 211, protection: 210 upper and lower sides have openings to facilitate the alignment with the outer cover 2: and the eagle b, refer to the twenty-seventh figure. The protective sheet 2H) is composed of two layers of material: a polyimine film layer having a plurality of protective film patterns thereon, and a second layer 12 S3 201126582

1 I is a lining • liner ‘polyimide protective film pattern i 14 is adhered to the spacer. Thereafter, through the alignment and bonding of the opening and the small protrusions 2〇8a and 208b, the protection sheet 210 is adhered to the surface of the outer cover 2〇6, wherein each protective film pattern 211 is aligned in the alignment hole For each micro imaging chip 2〇5, refer to the twenty-seventh figure. / A transfer tape 212 is attached to the outer cover 206, and spans the area where the protective film pattern 211 (polyimine film layer) of the protective layer X 210 is located. The transfer belt 212 is disposed approximately perpendicularly to the protective sheet 21〇, and the transfer belt must ensure that all areas of the protective film pattern 211 are completely covered, as in the twenty-eighth figure. Then, a presser 213 is placed on the surface of the transfer belt as shown in Fig. 29. The transfer film 212 is lifted after the application of the protective film pattern 2 ιι, and the protective film pattern 211 is transferred onto the transfer belt 212 as shown in Fig. 30. Thereafter, the spacer of the protective sheet 2 on the outer cover 206 is removed, as shown in FIG. Subsequently, a protective film is applied to the cover 206, and the protective film pattern 211 is attached to the surface of the micro-imaging wafer 205, as shown in the thirty-second figure. Shown. Then, the wish bar 213 is removed, as shown in the thirty-third figure. Thereafter, the mortise 209 is inserted through the fastening member ^ 榫 榫 217 217 to engage the hoe, and the upper cover 215 is placed and fixed on the support plate 200 and the outer eagle, _, and the lower cover is applied to the upper cover, = protective film pattern 21! Tightly adhere to the miniature imaging chip 2〇5, as shown in Figure 24. Remove the cover on the cover 2〇6 as shown in the thirty-fifth circle. After that, tear up the transfer belt 212 three, 201126582 • 4 six figures. After the transfer belt 212 is torn off, the support plate 2 and the cover 2〇6 are left, and the protective film pattern 211 is adhered to the micro-imaging wafer 2〇5 as shown in FIG. Next, the mortise 2 〇 9 is inserted through the fastening member 216, and the mortise 217 engages the boring head 202, and the upper cover 215 is placed on the support plate 2 〇〇 and the outer cover 2 〇 6 as shown in the thirty-eighth. Then, the upper cover 215 is pressed down as shown in Fig. IX. The cover 206 is lifted up with the upper cover 215, and the protective film pattern 2 is adhered thereto as shown in Fig. 4, 5a. After the outer cover 2〇6 and the upper cover 215 are removed, the support plate 200 and the outer cover 206 are left as shown in the 41st. " Similarly, the wafer tray 2 is picked up to be separated from the support plate 2, and at this time, a clean protective film pattern 2]i is adhered to the micro-imaging wafer 2G5 to protect it from particle contamination.

As shown in the forty-second diagram, it is not intended to show a third embodiment in accordance with the present invention. After the protective sheet 112 is attached to the surface of the outer cover 1〇7 (as shown in FIG. 2), the core of the protective film pattern of the protective sheet 112 is directly applied (pressed) so that the core protective tape (belt) is tightly attached. Adhering to the miniature camera chip ι〇6 η and then removing the other protective sheet material, the core protective film will remain on: like the top surface of the wafer 106. The core protective film (the micro-imaging chip (10) is represented by the labeled leg, as shown in the figure. The protective film on the micro-image wafer has many kinds of protective films on the micro-camera. The formation method is superior to the method for forming a microfilm on a micro-imaging wafer, and has the effect that the formation method of the integrated protective film on the micro-photographing wafer 0 cannot be expected from the above. The protective film of the present invention is characterized by the following advantages: The device 1. The combination of a plurality of jigs can improve the adhesion efficiency and assembly accuracy of the protective film. With the assembly method of the jig, it is easy to form a protective film on the

The wafer is mounted on the wafer and the protective film is attached to the micro imaging wafer. 3. The protective film can be placed in a group-like manner instead of a conventional single protective tape placed on a single wafer. 4. Use a lower cost to assemble and protect the micro-camera wafers to save on product costs. For those skilled in the art of the U, the present invention is not limited to the spirit of the present invention by way of a preferred example. Modifications and similar configurations made without departing from the present invention should be included in the following = Shenqing patents, which should cover all similar modifications and similar structures and should be interpreted broadly. . BRIEF DESCRIPTION OF THE DRAWINGS The above-described elements, as well as other features and advantages of the present invention, will become more apparent after reading the embodiments and the drawings thereof. FIG. 1 is a support plate according to a first embodiment of the present invention. Illustrated second figure is a schematic diagram of the wafer disc alignment support of the present invention. The surface of the plate cavity t Si 15 201126582 • « » ·· Figure. The third figure is a schematic view of a wafer disc placed in a cavity of a cutting plate in accordance with the present invention. The fourth figure is intended to align the floor slab and the wafer platter according to the present invention. The fifth drawing is a schematic view of the outer cover fixed to the support plate and the wafer disk according to the present invention. Figure 6 is a schematic illustration of a protective sheet alignment cover in accordance with the present invention. The seventh drawing is a schematic view of the protective sheet according to the present invention attached to the outer cover. The eighth figure is a schematic view of the upper cover alignment cover according to the present invention. The ninth drawing is a schematic view of the outer cover and the support plate fixed by the upper cover according to the present invention. The tenth figure is a schematic view of the downward force application and the upward force according to the present invention to lift the outer cover. Fig. 11 is a schematic view showing the upper cover and the outer cover together according to the present invention. Fig. 11 is a schematic view showing the separation of the upper cover and the outer cover according to the present invention. The thirteenth figure is a fish diagram of the protective sheet on the removal cover according to the present invention. Fig. 14 is a schematic view showing the outer cover placed and bonded to the support plate according to the present invention. Fig. 15 is a schematic view showing the attachment of the embossed member to the surface of the outer cover according to the present invention. The sixteenth figure is an indication of the upper slab and the outer cover of the upper cover according to the present invention. Fig. 17 is a schematic view showing the upper cover fixed to the support plate and the outer cover according to the present invention. Fig. 18 is a schematic view of the upper cover combined in accordance with the present invention. Fig. 19 is a schematic view of the rubber crucible on the removal cover according to the present invention. Fig. 20 is a schematic view showing the upper cover fixed to the support plate and the outer cover according to the present invention. The first figure is a schematic illustration of the combination of the upper cover and the outer cover in accordance with the present invention. The twenty-second figure is a schematic view of the wafer disc placed on the support plate according to the present invention. The twenty-third figure is a schematic view of the wafer tray being separated from the support plate in accordance with the present invention. The twenty-fourth embodiment is an indication of the support plate according to the second embodiment of the present invention. The twenty-fifth diagram is a schematic view of the wafer disc placed in the cavity of the support plate according to the present invention. The twenty-sixth drawing is a schematic view of the outer cover fixed to the support plate and the wafer disk according to the present invention. The twenty-seventh drawing is a schematic view of the protective sheet according to the present invention attached to the outer cover. The twenty-eighthth embodiment is a view in which the transfer belt according to the present invention is attached to the outer cover. [s] 17 201126582 4 The twenty-ninth figure is not intended to be placed on the surface of the transfer belt according to the present invention. Figure 30 is a schematic view of lifting a transfer belt in accordance with the present invention. The thirty-first drawing is an illustration of the removal of the protective sheet on the outer cover in accordance with the present invention. The twenty-second figure is a schematic view of attaching the transfer belt to the outer cover according to the present invention. A thirty-third figure is a schematic view of a stripping strip in accordance with the present invention. The thirty-fourth embodiment is a schematic view of the upper cover placed and fixed on the support plate and the outer cover according to the present invention. The thirty-fifth diagram is a schematic view of the removal of the upper cover in accordance with the present invention. Figure 36 is a schematic view of a tear-off transfer belt in accordance with the present invention. The twenty-seventh embodiment is a schematic view of the tear-off transfer belt according to the present invention leaving the support plate and the outer cover. The twenty-eighth figure is not intended to be placed on the support plate and the outer cover ^ according to the present invention. A twenty-ninth embodiment is a schematic view of a cover plate attached to a support plate and a cover according to the present invention. The fortieth diagram is a schematic view of the outer cover being lifted up together with the upper cover in accordance with the present invention. A forty-first drawing is a schematic view of a support plate and a cover according to the present invention. Figure 42 is a schematic view showing the adhesion of the core protective film of the present invention to the upper surface of the micro-imaging wafer. The forty-third figure is based on the core protective film of the invention I. Attached to the miniature camera i Si 18 201126582

〇 I ί &gt; Not intended for the top surface of the wafer. [Description of main component symbols] Supporting plates 100, 200 accommodating spaces 101, 201 boring heads 102, 108a, 202 榫 103, 104, 108, 117, 203, 209, 217 wafer platters 105, 204 micro imaging wafers 106, 205 Housing 107, 206 small projections 109a, 109b, 208a, 208b lattice recesses 110, 209a alignment marks 111, 207 protective sheets 112, 210 openings 113a, 113b protective film patterns 114, 211 upper covers 115, 215 * protective film Miniature imaging wafer 106a, 205a fastening member 116 downward biasing force 118 upward force 119 rubber film 120 pressure plate 130 convex portion 131 fastening member 132, 216 [S] 19 201126582 transfer belt 212 bead 213

Claims (1)

.201126582 » . VII. Patent application scope: 1. The method for forming a protective film on a wafer comprises: providing a support plate for carrying a U disk to fix the position of the wafer disk ‘the platter is configurable a plurality of wafers, using a cover to fix the plurality of wafers and exposing the plurality of wafers; attaching a protective sheet to the plurality of wafers; and transferring a protective film on the plurality of wafers to the plurality of wafers Above. 2.==:::==, _ 3. If the formation of claim 1 is protected by the wafer, it includes a plurality of blinks. Method of the above, wherein the outer cover 4. The method of forming a protective film on a wafer according to claim 1, wherein the sheet comprises a spacer attached to the protective film. Wherein the protection 5. The formation of claim 1 protects the wafer from containing a layer of polyamidamine film. a method in which the protection is 6. a method wherein the transfer A method of forming a protective film on a wafer according to claim 6, wherein the upper plate includes at least one mortise and a fastening portion 8 as in the case of claim 7, and further includes a method at the transfer step With the support plate. And the method for separating the wafer cover film on the wafer, and further comprising pressing the protective film to adhere the 11 more tightly. a method of filming on a wafer at which the pressurization It is attached to an upper cover. 10. The formation of claim 9 ensures that the platen is on the embossed piece wafer.泫 [After the plate step, it is further included to remove the embossed part. 12. The method of forming a protective film on a wafer according to claim U, further comprising: securing the outer cover with the upper cover, and then separating the upper cover, the outer cover and the wafer tray and the support plate. 13. A method of forming a protective film on a wafer, comprising: providing a support plate for receiving a stencil, a gate-to-day disk to fix a position of the wafer, the wafer A plurality of wafers are disposed on the disk; [S] 22 201126582: A cover is used to secure the support plate, and a pair of attachment-protective sheets are placed on the plurality of wafers. a number of wafers after the hoist; attach a transfer belt on the outer cover of the 'area; ???, 5 ° wrapped protective film of the protective film on the transfer belt, so that the protection removes the cover w ^ Above the transfer belt, to the surface of the plurality of sheets, the surface of the protective film on the 卩 _ printing tape: on the surface, the protective film is attached to the plurality of the removal of the transfer band. 14. If the request item 13 is used as a smile... the method on the cymbal unit </ RTI> further includes a hood U cover, and then the separated upper cover is separated from the outer cover, the cymbal plate and the support plate. 15. A method of seeding a plurality of wafer protective films on a wafer, comprising: a support plate for carrying a wafer disk to fix the wafer disk, wherein the wafer disk is provided with a plurality of wafers; Fixing the support plate; attaching a protective sheet to the surface of the cover; and a protective film pattern on the 1 ° 濩 濩 , , , 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 16. The method of forming a protective film on a wafer according to claim 15 further comprising removing. a protective film pattern is transferred to the upper surface of the plurality of wafers [S] 23 201126582 upper surface 17. a device for forming a protective film on the wafer, comprising: a bit support for fixing the wafer disc The board 'for carrying a wafer tray, the wafer tray is provided with a plurality of wafers; an outer cover for fixing the support plate; a protective sheet for attaching the surface of the outer cover; and a pressure plate on the wafer And a device for pressurizing the protective film on the protective sheet to form a protective film on the wafer, wherein the support plate includes an accommodating space for carrying the wafer. 19. The method of claim 17, wherein the protective cover comprises a plurality of boring heads. A device for forming a protective film on a wafer, wherein the lens is attached to a fastening member. 21 ′, such as § 青, ^ ^, forming a protective film on the wafer device, wherein the protection further comprises a cymbal attached to the protective film. 2 2. A device for forming a protective film on a wafer, wherein the protective film comprises a layer of a poly-branched amine film. LSI 24 201126582 * « 23. The request plate 7 is fixed to the upper cover to form a protective film on the wafer, wherein the pressure further comprises a 24. forming a protective film on the wafer according to the item 17 The embossing member is attached to the surface of the outer cover. , S S] 25