201122584 六、發明說明： 【發明所屬之技術領域】 本發明是”採用H光學印刷電路板及一種製 造該光學印刷電路板之方法。 【先前技術】 印刷電路板為使各種器件能夠安裝於其上或藉由將金屬 線整合於其中使該等器件能夠電性互連的電子組件。隨著技術 進步，已製造出具有各種功能及形式的印刷電路板。 由於快速之資訊技術的進步，信號之傳播速度已被視為例 如攜帶型終端機、筆記型電腦等之電子設備中的重要參數。因 為藉由在銅包層壓板上形成電路圖案而形成之印刷電路板使 用電線作為信號傳播媒體’且該等電線主要由例如鋼及其類似 物之導電金屬形成’所以在傳播極大量之資料時會受到限制。 近來’已開發出一種一光波導形成於一絕緣部件上的光學 印刷電路板技術。為在光學印刷電路板中實現使光穿過之光波 導，使用聚合物及玻璃纖維之光纖已經開始被運用。 【發明内容】 【技術問題】 實施例提供一種具有發明性結構之光學印刷電路板及一 種製造該印刷電路板之方法。 實施例亦提供一種薄濟之光學印刷電路板及一種製造該 印刷電路板之方法。 實施例亦提供一種可經由一簡單製程製造之光學印刷電 201122584 路板及-種製造該印刷電路板之 【_解決方案】 去。 在貝硃例中，一種光學印刷恭改妬句括. 一^纖，料纽魏 該光 端部分;及至少，部件，其具傷一轉接至’】暴 纖之該翻對末端部分且導服光纖之彎曲的導引部分。 方法=:1施Γ，一種製造一光學印刷電路板之方法，該 及輕接==絕緣部件上形成—光纖安置區；將該光纖 ”至糾纖之相對末端㈣—支撐部件及第二支 安裝於該光纖安置區中；及一 牙。 區。 弟一、，，邑緣邛件覆盍該光纖安置 二或多個實施例之細節陳述於附圖及下文之描述中。將自 “描述及㈣且自巾請專利範__看出其他特徵。 【有利效果】 一該等實施例提供-種具有發明性結構之光學印刷電路板 及一種製造該印刷電路板之方法。 該等實施例亦提供-種薄型之光學印刷電路板及一種製 造該印刷電路板之方法。 該等實施例亦提供i可經由—簡單製妙造之光學印 刷電路板及一種製造該印刷電路板之方法。 201122584 【實施方式】 【發明模式】 、在以下描述中，應理解，在一層（或膜）被稱為在另一層 或基板「上」時’其可直接在另—層或基板上，或亦可存在介 入層。另外，應理解，在一層被稱為在另一層「下」時，其可 直接在另-廣下，且亦可存在一或多個介入層。另外，亦應理201122584 VI. Description of the Invention: [Technical Field] The present invention is an "optical printed circuit board using H" and a method of manufacturing the optical printed circuit board. [Prior Art] A printed circuit board is provided for mounting various devices thereon. Or by integrating metal wires into electronic components in which the devices can be electrically interconnected. As technology advances, printed circuit boards having various functions and forms have been manufactured. Due to advances in rapid information technology, signals The propagation speed has been regarded as an important parameter in electronic devices such as portable terminals, notebook computers, etc., because a printed circuit board formed by forming a circuit pattern on a copper clad laminate uses an electric wire as a signal propagation medium' and These wires are mainly formed of a conductive metal such as steel and the like, so they are limited in the propagation of a very large amount of data. Recently, an optical printed circuit board technology in which an optical waveguide is formed on an insulating member has been developed. In order to realize optical waveguides for passing light through optical printed circuit boards, polymers and glass fibers are used. [Technical Problem] The embodiment provides an optical printed circuit board having the inventive structure and a method of manufacturing the printed circuit board. The embodiment also provides a thin printed optical printed circuit board. And a method of manufacturing the printed circuit board. The embodiment also provides an optical printing electrical 201122584 road board which can be manufactured through a simple process and a [_solution] for manufacturing the printed circuit board. An optical printing is modified by a haiku. A fiber, the light-end portion of the material, and at least the component, which has a wound and is transferred to the end portion of the fiber-optic fiber and the bending of the guiding fiber. Guide part: Method =: 1 Γ, a method of manufacturing an optical printed circuit board, and the light connection == formed on the insulating member - the fiber placement area; the optical fiber "to the opposite end of the fiber (four) - support member And the second branch is installed in the fiber placement area; and a tooth. Area. The details of the two or more embodiments of the fiber arrangement are set forth in the accompanying drawings and the following description. Other features will be apparent from "Description and (4) and from the patent specification. [Advantageous Effects] One such embodiment provides an optical printed circuit board having the inventive structure and a method of manufacturing the printed circuit board. The embodiments also provide a thin optical printed circuit board and a method of manufacturing the printed circuit board. The embodiments also provide an optical printed circuit board that can be manufactured by a simple method and a printed circuit board. 201122584 [Embodiment] [Invention Mode] In the following description, it should be understood that when one layer (or film) is referred to as being "on" another layer or substrate, it may be directly on another layer or substrate. Or there may be an intervention layer. In addition, it will be understood that when a layer is referred to as "under" another layer, it can In addition, it should also be reasonable
解，在-層被稱為在兩個層「之間」時，其可為該兩個層之間 的唯一層，或亦可存在—或多個介入層。 在各圖中’為說明之清楚起見，誇示層及區之尺寸。相似 參考數字在全文中指代相似元件。 現將詳細地參考本發明之實施例，其實例說明於附圖中。 圖1為根據-實施例之光學印刷電路板之橫戴面圖。 參看圖1，包括-絕緣部件110、安置於該絕緣部件11〇 中之光纖12〇及支撐該光纖120之相對末端部分的第一支撐部 件130及第二支撐部件14〇。 該絕緣縣U〇可由含有玻璃纖維之環氧樹脂或紛樹脂 所形成。該光纖12〇可形成於該絕緣部件11〇上。一由導電金 層（例如：⑷形成之電路圖115G亦可形成於該絕緣部件 110上。該絕緣部件11G可由各自具有—電路圖_之複數 個層形成。 另外，該絕緣部件110具備用於形成於不同層上之電路圖 請之間的電連接的通孔151。導電金屬塗佈於該等通孔⑸ 之内表面上。 201122584 該光纖120為用於傳輸光信號之薄纖維。該光纖丨2〇具有 0.02燜〜0.05泖之直徑。一束光纖120可安置於該絕緣部件 110 中。 圖2為說明圖1之光纖的視圖。 一束光纖120安置於該絕緣部件no中。然而’在除了圖 2外之其他圖式中，為便於描述，僅描述一個光纖12〇。Solution, when a layer is referred to as being "between" two layers, it can be a single layer between the two layers, or can also be-- or multiple intervening layers. In the figures, the dimensions of layers and regions are exaggerated for clarity of illustration. Like reference numerals refer to like elements throughout. Reference will now be made in detail to the embodiments of the invention, 1 is a cross-sectional view of an optical printed circuit board according to an embodiment. Referring to Fig. 1, there is provided an insulating member 110, an optical fiber 12 安置 disposed in the insulating member 11A, and a first supporting member 130 and a second supporting member 14A supporting opposite end portions of the optical fiber 120. The insulating county U can be formed of an epoxy resin containing a glass fiber or a resin. The optical fiber 12A can be formed on the insulating member 11A. A circuit pattern 115G formed of a conductive gold layer (for example, (4) may be formed on the insulating member 110. The insulating member 11G may be formed of a plurality of layers each having a circuit pattern. Further, the insulating member 110 is provided for forming The electrical connection between the circuit diagrams on the different layers is 151. The conductive metal is coated on the inner surface of the through holes (5). 201122584 The optical fiber 120 is a thin fiber for transmitting optical signals. There is a diameter of 0.02 焖 to 0.05 。. A bundle of optical fibers 120 can be placed in the insulating member 110. Fig. 2 is a view illustrating the optical fiber of Fig. 1. A bundle of optical fibers 120 is disposed in the insulating member no. In the other figures except 2, for the convenience of description, only one optical fiber 12 描述 is described.
該等光纖120中之每一者包括：一核心121，其為用於傳 播光之媒體；及一包層122，其用於防止信號自一個光纖12〇 之核心121洩漏至另一光纖12〇之核心121的無線電干擾。該 核^ 121 "J由石英基玻璃、石夕石基玻璃或聚合化合物形成。該 包層122具有比該核心121低之折射率，且塗佈於該核心 之外圓周表面上。㈣保護該包層丨22免受 可額外塗佈於該包層122之外關表面上。 、如圖2所示，入射於該光纖12〇之第一末端上的光在該核 ^ 121與該包層122之間的邊界部分上連續地全反射 光纖120之第二末端。 5第支撐。卩件13〇及該第二支撐部件刚支撐該光纖 120之相對末端部分’以使得該光纖120之末端部分安置於該 絕緣部件110之表面上。 人π。丨仵130及該第二支撐部件140可安置於; =^絕緣部件110上之第一安裝凹槽130a及第二安裝丨 置以^吏^ 6)中。該第—部件13G及該第二部件140 % 于頂表面與該絕緣部件11〇之表面在同一平面上 201122584 該光纖120可安置成與該絕緣部件no之主表面平行且埋 入於該絕緣部件110中。該光纖12〇在其相對末端部分處以預 定角度彎曲。 一用於將光信號輸入至光纖120的傳輸器模組160安置於 該第一支撐部件130上方。一發出該光信號之光源的垂直共振 腔面射型雷射（Vertical-Cavity Surface-Emitting Laser，VCSEL )Each of the optical fibers 120 includes a core 121 that is a medium for propagating light, and a cladding 122 that prevents signals from leaking from the core 121 of one fiber 12 to another. The radio interference of the core 121. The core ^ 121 " J is formed of quartz-based glass, shishi-based glass or a polymeric compound. The cladding 122 has a lower refractive index than the core 121 and is applied to the outer circumferential surface of the core. (d) protecting the cladding 22 from additional coating on the outer surface of the cladding 122. As shown in FIG. 2, light incident on the first end of the optical fiber 12 is continuously and totally reflected at the second end of the optical fiber 120 at a boundary portion between the core 121 and the cladding 122. 5th support. The jaw member 13 and the second support member just support the opposite end portions ' of the optical fiber 120 such that the end portions of the optical fibers 120 are disposed on the surface of the insulating member 110. People π. The crucible 130 and the second supporting member 140 may be disposed on the first mounting recess 130a and the second mounting member on the insulating member 110. The first component 13G and the second component 140% are on the same plane as the surface of the insulating component 11〇. The optical fiber 120 may be disposed parallel to the main surface of the insulating component no and buried in the insulating component. 110. The optical fiber 12 is bent at a predetermined angle at its opposite end portions. A transmitter module 160 for inputting an optical signal to the optical fiber 120 is disposed above the first support member 130. A Vertical-Cavity Surface-Emitting Laser (VCSEL) that emits a light source
161裝5又於該傳輸器模組上。該垂直共振腔面射型雷射 為在雷射束發出至光纖120之通路中傳輸光信號的光源。 用於接收穿過該光纖120之光信號的接收模組裝設 於該第二支撐部件14〇上方。該接收模組17〇用以將自該光纖 i2〇傳輸之光信號轉換成電信號。一光偵側器i7i，即，用於 偵側光信號之器件，安裝於該接收模組17〇上。 來自該傳輸盗模组160之垂直共振腔面射型雷射的光 信號^過該光、纖120並到達該接收模組17〇之光偵側器171。 該光信號經全反射且穿域m。此處，絲纖12〇之相 對末端部分彎曲以在該絕緣部件11〇之頂表面上暴露。然而， 藉由該第-支撐料13G及該第二支撐料⑽使該光纖12〇 彎曲以實現全反射。 圖3為圖1之第—支標部件的透視圖，且圖4為光纖安^ 於其上ϋ撐部件及第二讀部件的橫截面圖。 >看圖3該第-支撐部件⑽經成形以對應於該3 撐部件130之第一安裝凹揭, 部件130可形成為長方體 I凹槽13Ga°如圖3所示，該第-支才 201122584 該第一支撐部件130包括一導引部分，該導引部分用於導 引該光纖ΠΟ在使光信號全反射之範圍内的彎曲。該導引部分 能以穿過該第一支撐部件130所形成之導孔131的形式來提 供。 該導孔131具備一相對於該絕緣部件11〇之主表面以預定 角度傾斜的傾斜表面132。在此實施例中，該導孔131形成為 上方部分之面積大於下方部分之面積的圓錐形狀。然而，本發 明不限於此。亦即，導孔131可形成為上方部分與下方部分具 有相同面積之圓柱形狀。 另外，該第二支撐部件14〇與該第一支撐部件13〇可形成 為相同之結構。因此，對該第二支撐部件14〇之描述將引用上 文對第一支撐部件130之描述。The 161 is mounted on the transmitter module. The vertical cavity surface-emitting laser is a light source that transmits optical signals in a path from the laser beam to the optical fiber 120. A receiving die assembly for receiving an optical signal passing through the optical fiber 120 is disposed above the second support member 14A. The receiving module 17 is configured to convert an optical signal transmitted from the optical fiber i2 into an electrical signal. A photodetector i7i, that is, a device for detecting a side optical signal, is mounted on the receiving module 17A. The optical signal from the vertical cavity surface-emitting laser of the transmission pirate module 160 passes through the optical fiber 120 and reaches the optical detector 171 of the receiving module 17A. The optical signal is totally reflected and penetrates the domain m. Here, the opposite end portions of the filaments 12 are bent to be exposed on the top surface of the insulating member 11''. However, the optical fiber 12 is bent by the first support material 13G and the second support material (10) to achieve total reflection. 3 is a perspective view of the first-branch member of FIG. 1, and FIG. 4 is a cross-sectional view of the optical fiber mounted on the upper support member and the second read member. > Looking at Fig. 3, the first support member (10) is shaped to correspond to the first mounting recess of the 3-but member 130, and the member 130 can be formed as a rectangular parallelepiped groove 13Ga° as shown in Fig. 3, the first branch 201122584 The first support member 130 includes a guiding portion for guiding the bending of the fiber bundle in a range of totally reflecting the optical signal. The guiding portion can be provided in the form of a guide hole 131 formed through the first supporting member 130. The guide hole 131 is provided with an inclined surface 132 which is inclined at a predetermined angle with respect to the main surface of the insulating member 11A. In this embodiment, the guide hole 131 is formed in a conical shape in which the area of the upper portion is larger than the area of the lower portion. However, the present invention is not limited to this. That is, the guide hole 131 may be formed in a cylindrical shape having the same area as the upper portion and the lower portion. Further, the second support member 14A and the first support member 13A may be formed in the same structure. Therefore, the description of the second support member 14 will be described above with respect to the first support member 130.
參看圖4’該等光纖12〇{以束形式提供且插入至導孔⑶ 及H1中。該束光纖U0之相對末端部分可與該第一支撐部件 130及該第二支標部件刚之頂表面安置於大體上相同之平面 牛〇及該第一支撐部件140安裝於該喂缘 部件110上，以使得該走朵鏞f^色緣 束先纖120可位於該絕緣部件110中。 在此實施例之光學印刷電路板 崎览_ 伋甲因為該荨光纖120是由 該弟一支撐縣⑽麟第二切部件⑽裝 經由一簡單製程實現該束光纖120之裳設。 易 根據此實施例之光學印刷 件⑽及該第二支撐部件=因為藉由該第一支撐部 使該束光纖〗在可能實現全反 201122584 射之範圍崎向該傳輸賴組⑽及該接收模組m，所以可 經由該等光纖120穩定地傳輸光信號。 根據此實施例’因為該束光纖⑽固定地埋入於該絕緣部 件no中，所以不需要用於固定該束光纖㈣之結構。因此， 可實現較薄型之光學印刷電路板。亦即，可減小圖！之絕緣部 件之厚度A。 通系’在對該通孔151電鍍b夺，該通孔151之直徑對該絕 ，部件U0之厚度A的比（亦即，值（B/A))必須大於一預 疋參考值。該值（B/A)是藉由用於對該通孔⑸冑鍍之化學 材料或裝置確定。 因此，在該絕緣部件n〇之厚度A減小時，該通孔i5i 之直控B亦可減小’且因此安置於該絕緣部件iig之頂表面或 下表面上的電路圖案或電子ϋ件之整合度可增加。結果，可增 加設計電路之自由度。 下文將描述根據-實施例之製造光學印刷電路板的方法。 圖5至圖9為說明根據-實施例之製造光學印刷電路板之 方法的視圖。 首先參看圖5，在-第-絕緣部件ln上形成一光纖安置 區113。可藉由選擇性地钱刻形成為平板類型之第—絕緣部件 來形成該光纖安置區113。 參看圖6，在該光纖安置區ι13中形成用於安裝該第一支 撐部件130及該第二支撐部件140之第一安裝凹槽13加及第 一安裝凹槽140a。可經由光微影製程、蝕刻製程或鑽孔製程 201122584 來形成第-安裝凹槽13〇a及第二安裝凹槽购。 參看圖7,在該第-安裝凹槽13加及該第二安裝凹槽ΐ4〇& 中安裝搞接至該光纖12〇之第一支撐部件⑽及第二支樓部件 140。此處，藉由該第-支撐部件13〇及該第二支撐部件14〇 之導孔m及I4卜該光纖m之相對末端部分保持其彎曲狀 態。 參看圖8，以-第二絕緣部件112覆蓋該光纖安置區113。 鲁經由-按壓製程將該第二絕緣部件112堆疊於該第一絕緣部 件111上。在施加熱及壓力時，該第一絕緣部件U1及該第二 絕緣部件112熔㈣具有黏著力，且絲纖12G由於處於高溫 狀悲下的該第二絕緣部件H2的流動而自然地储其彎曲狀 態。 在使該第一絕緣部件m及該第二絕緣部件112冷卻並硬 化時，將該第二絕緣部件112穩固地黏著至該第一絕緣部件 m。此處’該第一絕緣部件U1與該第二絕緣部件112彼此 • 整合以形成上文參看圖1描述之絕緣部件no。在使該第一絕 緣4件111及該第一絕緣部件U2冷卻並硬化之製程中，將該 光纖120固定於該第一絕緣部件U1與該第二絕緣部件丨12之 間。 在如上所述將該光纖120埋入於該絕緣部件11〇中後，額 外地執行用於形成電路圖案丨5〇之製程、用於堆疊另一絕緣部 件之製程、用於安裝該傳輸器模組160及該接收模組17〇之製 程及用於形成通孔151之製程等等。 201122584 雖然參考實施例之許多說明性實施例來描述實施例，但應 理解，熟習此項技術者可想出將落入本發明之原理的精神及範 疇内的眾多其他修改及實施例。更特定言之，在本發明、圖式 及所附申請專利範圍之範疇内，所主張組合配置之零部件及/ 或配置的各種變化及修改為可能的。對於熟習此項技術者而 S，除了零部件及/或配置之變化及修改外，替代用途亦將顯 而易見。 【產業利用性】 該等實施例可應用於光學印刷電路板領域及製造光學 刷電路板之方法。 【圖式簡單說明】Referring to Figure 4', the fibers 12 are provided in bundle form and inserted into the vias (3) and H1. The opposite end portions of the bundle of optical fibers U0 may be disposed on substantially the same plane as the top surface of the first support member 130 and the second support member, and the first support member 140 is mounted to the feed edge member 110. The upper fiber 120 can be located in the insulating member 110. In the optical printed circuit board of this embodiment, the armor fiber 120 is installed by the younger support county (10) Lin second cutting member (10) through a simple process to realize the skirting of the bundle of optical fibers 120. The optical printing member (10) and the second supporting member according to the embodiment are as follows: because the first supporting portion causes the bundle of optical fibers to reach the transmission group (10) and the receiving mode in a range in which it is possible to achieve the full anti-201122584 range. Group m, so that optical signals can be stably transmitted via the optical fibers 120. According to this embodiment, since the bundle of optical fibers (10) is fixedly embedded in the insulating member no, a structure for fixing the bundle of optical fibers (4) is not required. Therefore, a thinner optical printed circuit board can be realized. That is, you can reduce the map! The thickness A of the insulating member. The through-hole is plated to the via hole 151, and the ratio of the diameter of the through hole 151 to the thickness A of the member U0 (i.e., the value (B/A)) must be greater than a predetermined reference value. This value (B/A) is determined by the chemical material or device used to plate the via (5). Therefore, when the thickness A of the insulating member n is reduced, the direct control B of the through hole i5i can also be reduced 'and thus the circuit pattern or the electronic component disposed on the top or lower surface of the insulating member iig Integration can increase. As a result, the degree of freedom in designing the circuit can be increased. A method of manufacturing an optical printed circuit board according to the embodiment will be described below. 5 to 9 are views for explaining a method of manufacturing an optical printed circuit board according to an embodiment. Referring first to Fig. 5, a fiber placement region 113 is formed on the -first insulating member ln. The fiber placement region 113 can be formed by selectively forming a first insulating member of the flat type. Referring to Fig. 6, a first mounting recess 13 for mounting the first support member 130 and the second support member 140 is formed in the optical fiber mounting region ι13, and a first mounting recess 140a is formed. The first mounting groove 13A and the second mounting groove may be formed through a photolithography process, an etching process, or a drilling process 201122584. Referring to Fig. 7, a first support member (10) and a second branch member 140 that are attached to the optical fiber 12A are mounted in the first mounting recess 13 and the second mounting recess ΐ4〇&. Here, the opposite end portions of the optical fibers m are maintained in a curved state by the guide holes m and I4 of the first support member 13 and the second support member 14A. Referring to FIG. 8, the fiber placement region 113 is covered with a second insulating member 112. The second insulating member 112 is stacked on the first insulating member 111 via a press-press process. When heat and pressure are applied, the first insulating member U1 and the second insulating member 112 are fused (four) to have an adhesive force, and the filament 12G naturally stores the second insulating member H2 due to the high temperature. Bending state. When the first insulating member m and the second insulating member 112 are cooled and hardened, the second insulating member 112 is firmly adhered to the first insulating member m. Here, the first insulating member U1 and the second insulating member 112 are integrated with each other to form the insulating member no described above with reference to FIG. The optical fiber 120 is fixed between the first insulating member U1 and the second insulating member 12 in a process of cooling and hardening the first insulating member 111 and the first insulating member U2. After the optical fiber 120 is buried in the insulating member 11A as described above, a process for forming the circuit pattern 、5〇, a process for stacking another insulating member, and a method for mounting the transmitter mold are additionally performed. The process of group 160 and the receiving module 17 and the process for forming the via 151 and the like. While the embodiments have been described with reference to the embodiments of the embodiments of the embodiments of the present invention, it is understood that many modifications and embodiments may be devised in the spirit and scope of the invention. More particularly, various variations and modifications are possible in the component parts and/or arrangements of the claimed combinations. For those skilled in the art, S, in addition to changes and modifications to parts and / or configurations, alternative uses will also be apparent. [Industrial Applicability] These embodiments are applicable to the field of optical printed circuit boards and methods of manufacturing optical brush circuit boards. [Simple description of the map]
圖1為根據-實關之光學印刷電路板之橫截面圖。 圖2為說明圖1之光纖的視圖。 圖3為圖1之第—支撐部件的透視圖。 圖4為光纖絲於其上H撐部件及第 截面圖。 二支撐部件的橫 只施例之製造光學印刷電路板之方法 圖5至圖9為說明根據— 的視圖。 【主要元件符號說明】 110 絕緣部件 111 第一絕緣部件 201122584BRIEF DESCRIPTION OF THE DRAWINGS Figure 1 is a cross-sectional view of an optical printed circuit board according to the actual. Figure 2 is a view illustrating the optical fiber of Figure 1. Figure 3 is a perspective view of the first support member of Figure 1. Fig. 4 is a cross-sectional view showing the H-support member and the optical fiber yarn thereon. The method of manufacturing an optical printed circuit board of the two supporting members is shown in Fig. 5 to Fig. 9 to illustrate a view according to -. [Main component symbol description] 110 Insulation part 111 First insulation part 201122584
112 第二絕緣部件 113 光^安置區 120 光纖 121 核心 122 包層 130 第一支撐部件 130a 第一安裝凹槽 131 導孔 132 傾斜表面 140 第二支撐部件 140a 第二安裝凹槽 141 導孔 150 電路圖案 151 通孔 160 傳輸器模組 161 垂直共振腔面射型雷射 170 接收模組 171 光偵側器 A 絕緣部件之厚度 B 通孔之直徑 12112 second insulating member 113 optical installation area 120 optical fiber 121 core 122 cladding 130 first support member 130a first mounting groove 131 guide hole 132 inclined surface 140 second support member 140a second mounting groove 141 guide hole 150 circuit Pattern 151 Through hole 160 Transmitter module 161 Vertical cavity surface type laser 170 Receiver module 171 Photodetector A Thickness of insulating part B Diameter of through hole 12