201122345 六、發明說明： 【發明所屬之技術領威】 [0001] 本發明涉及一種照明裝置’尤其是涉及一種可具有較佳 散熱效能的固態光源室内照明裝置。 C先前技術] [0002] 固態光源包括發光二極體（LED，Light Emitting Di-〇de)是一種固態的半導體元件，利用電子電洞對的相互 結合將能量以光的形式釋發’可將電流轉換成特定波長 範圍的光，屬冷光發光’具有體積小、壽命長、耗電量 低、反應速率快、耐震性特佳等優點’為各種電器、資 訊看板、通訊產品等的發光元件。發光二極體以其亮度 高、工作電壓低、功耗小、易與積體電路匹配、驅動簡 單、壽命長等優點，從而可作為光源而廣泛應用於照明 領域，相關資料具體可參見Joseph Bielecki等人在文 獻2007 IEEE，23rd IEEE SEMI-THERM Symposium中 的Thermal Considerations for LED Components in an Automotive Lamp— X ° [0003] 目前發光二極體已廣泛的被使用在各種燈具上，固態光 源作為發光源具有高效益的特性，其作為照明工具，與 白熾燈、螢光燈相比，節電效率可以達到90%以上。現有 技術中的固態光源作為光源在應用方面還有一些問題需 要解決’尤其是在散熱方面。功率、亮度越大的發光二 極體或其模組產生的熱量越大，且在體積相對較小的發 光二極體燈具内熱量難於散發出去。所以目前使用固態 光源為照明的產品皆有「散熱」的問題，進而使固態光 098146430 表單編號A0101 第4頁/共18頁 0982079154-0 201122345 [0004] Ο [0005] [0006] 〇 [0007] 098146430 源在產品應用上受到局限。所以如何有效的解決固態光 源散熱問題為目前亟重要課題。尤其是應用於一般室内 照明的Τ-BAR燈具，其使用固態光源替換原本的螢光燈管 所產生的散熱問題就更不容輕視。 【發明内容】 由於固態光源轉換效率低，在發光過程中會產生大量的 熱能，須設置適當的散熱裝置，以避免對晶片效率及壽 命造成損傷因而影響整個照明裝置的效能或是造成損壞 〇 有鑒於此，有必要提供一種可以有效達成較佳散熱效能 的固態光源室内照明裝置。本發明針對上述的問題，提 出一種具高效率散熱結構與設計的照明裝置，以有效克 服上述的缺失。 本發明提出一種固態光源照明裝置，包括電源模組、載 具以及至少一固態光源模組，所述固態光源模組包括基 板以及至少一固態光源。所述基板上設置有電路，所述 固態光源設置於所述基板上，所述固態光源的電極與所 述基板上的電路電性連接。所述基板及所述載具進一步 包含有特殊的散熱結構與設計。本發明的固態光源照明 裝置採用特殊的散熱結構與設計，從而改變其散熱性能 ，以實現所述照明裝置不會因散熱不佳而影響效能或甚 而造成故障的目的。 目前，固態光源的產品多為集中在一個照明裝置裏面， 不易散熱，所以，本發明的一目的是提供一具有特殊散 熱結構與設計的照明裝置，本發明的室内照明τ-BAR燈具 表單編號A0101 第5頁/共18頁 0982079154-0 201122345 的固態光源照明裝置的特點是其載具的底座上，於所述 基板正投影區域内具有上下貫穿的孔洞構造，使其方便 與外部空氣流通，因而可產生較佳的散熱效果。在此， 所述散熱孔洞的尺寸大小、排列方式與形狀並沒有特別 的限定，只要其可與外部空氣流通並進行熱交換即可。 優選地，所述散熱孔洞的半徑尺寸大小為1公釐至25公釐 的範圍内。更加優選地，所述散熱孔洞的半徑尺寸大小 為5公釐至10公釐的範圍内。其中，優選地，所述散熱孔 洞的排列方式為陣列的形式。更加優選地，所述散熱孔 洞的排列方式是為錯位間隔的形式。甚者，優選地，所 述散熱孔洞的形狀為圓形。 [0008] 此外，根據本發明的另一目的所提供的一具有特殊散熱 結構與設計的照明裝置，其使用的固態光源基板係為以 固定支撐元件固定安裝於所述照明裝置的載具底座上， 使所述固態光源基板與所述照明裝置的載具底座之間具 有一立體空間而有方便空氣流通的作用，使其可產生較 佳的散熱效果。再者，所述固態光源基板亦可遮住所述 載具底座上的散熱孔洞，依據固態光源發光的方向性與 反射作用，可使其不會產生漏光的效果。此外，所述固 態光源基板與所述照明裝置的載具底座之間具有一立體 空間亦具有電性絕緣的效果。其中，所述固態光源基板 與所述照明裝置的載具底座之間的一立體空間並沒有尺 寸大小的限制，只要其是設置於所述照明裝置的載具内 即可。優選地，所述固態光源基板與所述照明裝置的載 具底座之間的立體空間其高度為1公釐至50公釐的範圍内 098146430 表單編號A0101 第6頁/共18頁 0982079154-0 201122345 [0009] Ο Ο [0010] [0011] [0012] 。更加優選地，所述立體空間的高度為15公釐至30公釐 的範圍内。更進一步的，所述固態光源基板上下雙面皆 鍍有金屬層，其亦有幫助散熱的效果。優選地，所述固 態光源基板所鍍上的金屬層材質為金、銀或銅。其中， 優選地，所述基板的顏色為白色。 再者，根據本發明的再一目的所提供的一具有特殊散熱 結構與設計的照明裝置，其使用的固態光源基板係為具 有上下貫穿的孔洞構造，可有方便空氣流通的空間，使 其可產生較佳的散熱效果。在此，所述散熱孔洞的尺寸 大小、排列方式與形狀並沒有特別的限定，只要其能方 便空氣流通即可。優選地，所述散熱孔洞的半徑尺寸大 小為0. 1公釐至5公釐的範圍内。更加優選地，所述散熱 孔洞的半徑尺寸大小為0.5公釐至1公釐的範圍内。其中 ，優選地，所述散熱孔洞的排列方式為陣列的形式。更 加優選地，所述散熱孔洞的排列方式為錯位間隔的形式 。進一步優選地，所述散熱孔洞的形狀為圓形。 本發明是關於一種固態光源照明裝置的散熱結構與設計 ，其具有的功效如下所示。 1. 照明裝置載具的底座具有上下貫穿的孔洞構造，可方 便與外部空氣流通，使其可產生較佳的散熱效果。 2. 照明裝置載具的底座上具有支撐元件，以便固定支撐 固態光源基板，使其與底座產生一立體空間，而具有方 便空氣流通的作用，使其可產生較佳的散熱效果。 3. 固態光源基板上具有上下貫穿的孔洞構造，可方便空 098146430 表單編號Α0101 第7頁/共18頁 0982079154-0 [0013] 201122345 氣/;'L同而產生散熱效果，且所述基板的上下雙面亦鍍有 金屬層以幫助散熱。 [0014] [0015] [0016] 與現有技術相比，所述固態光源照明裝置採用不同的散 熱結構與設計來提升固態光源模組的散熱效能，從而改 變整個固態光源照明裝置散熱效能。本發明的固態光源 照明裝置可以根據不同環境的狀況運用不同的散熱結構 與設計，因而產生所需要的散熱效果，從而可以適應不 同環境的需求，並且節省了照明裝置的製造成本與維修 成本以及提两產品的效能 【實施方式】 請參閱圖1，本發明第一實施例提供的照明裝置i包括— 電源模組（圖未示），至少一固態光源模組11及一載具12 〇 請參閱圖2與圖3,所述固態光源模組11包括一基板lu以 及至少一固態光源112。所述基板1〗1上設置有電路，所 述至少一固態光源H.:2:設置於基板上。所述至少一固態光 源112的電極與所述基板1 ] 1上的電路電性連接。所·述基 板111是通過固定支撐元件122固定安裝於所述照明裝置 的載具底座121上，由此使得所述基板in與所述照明裝 置的載具底座121之間具有一立體空間而方便空氣的流通 ’使所述照明裝置有較佳散熱效果。此外，所述基板lu 與所述照明裝置的載具底座121之間具有一立體空間亦可 使所述基板111與所述照明裝置的載具底座121之間具有 電性絕緣的效果。其中，所述固態光源基板與所述照明 裝置的載具底座之間的一立體空間並沒有尺寸大小的限 098146430 表單編號A0101 第8頁/共18頁 0982079154-0 201122345 制，只要其是設置於所述照明裝置的載具内即可。優選 地，所述固態光源基板與所述照明裝置的載具底座之間 的立體空間其高度為1公釐裘50公釐的範圍内。更加優選 地，所述立體空間的高度爲15公釐至30公釐的範圍内。 [0017] Ο 根據需要，所述固態光源模·组11還可以進一步包括至少 一光學元件（圖未示），所述光學元件可以是光學透鏡、 擴散片、導光板或者反射罩，用於調整所述固態光源112 的光場分佈。若所述光學元件為透鏡，所述透鏡可設置 於所述固態光源112的出光面，所述固態光源112所發出 的光線通過透鏡出剞，光線通過透鏡後其出射角度將會 改變。若所述光學元件為反射罩’所述反射罩可設置於 所述固態光源112的出光側，用於反射所述固態光源112 所發出的光線，從而改變所述固態光源模組11的配光曲 線0 [0018] Ο 請參閱圖3，所述载具12包括底座121和支撐組件122以 及載具通孔123 ’所述底座121頂面與支撐元件122固定 連接’所述支揮悉件】22用於支撐並固定所述基板ill。 所述載具的底座121上，於所述基板ln正投影區域内具 有上下貫穿的孔洞構造之載具通孔123，使其方便與外部 空氣流通，因而可產生較麵散熱效果。再者，所述基 板⑴亦可遮住載具底座121上的載具通孔123 ，依據固 態光源112發光的方向性與反射作用，可使其不會產生漏 光的問題在此’所述料通孔⑻的尺寸大,】、、排列方 式與形狀並沒有特別的限定 限又’只要其可與外部空氣流通 並進行熱交換即可。得雄丄 復遇地’所述載具通孔123的半徑尺 098146430 表單編號A0101 0982079154-0 第9頁/共18頁 201122345 寸大j在1公釐至25公釐的範圍内。更加優選地，所述載 具通孔123的半徑尺寸大小在5公楚至10公麓的範圍内。 其中’優選地’所述載具通孔123的排列方式為陣列的形 式。更加優選地’所述祕通孔123的排财式為錯位間 隔的形式。進—步優選地，所述⑽通孔123_狀為圓 形。 [0019] 咕參閱圖4與圖5，所述固態光源模組丨丨的基板11丨具有至 ^上下貫穿的孔洞構造之基板孔洞丨。所述至少一 上下貫穿的孔洞構造之基板孔洞lm係垂直貫穿所述基 板111的頂、底二面，可有方便空氣流通的空間，使其可 產生較佳的散熱效果。在此’所述之基板孔洞1111的尺 寸大小、排列方式與形狀並沒有特別的限定，只要其能 方便空氣流通即可。優選地，所述之基板孔洞nll的半 徑尺寸大小為〇. 1公釐至5公釐的範圍内^更加優選地， 所述之基板孔洞1111的半徑尺寸大小為〇. 5公釐至丨公釐 的範圍内。其中，優選地，所述之基板孔洞1111的排列 方式為陣列的形秀。更加優選地，所述之基板孔洞1111 的排列方式為錯位間隔的形式。進一步優選地，所述之 基板孔洞1111的形狀是為圓形。其中，所述固態光源丨】2 下方塾片的寬度為4公釐（L1)，其可視同所述固態光源 Π2的寬度（或直徑’當固態光源112為圓形結構）為4公 董’所述至少一上下貫穿的孔洞構造之基板孔洞丨丨^與 所述固態光源112在所述寬度方向上距所述固態光源η 2 下方塾片相鄰邊緣的的最遠距離為5. 5公釐（L2)。其中， 所述L2的長度與所述li的長度比為大於或等於1。此外， 098146430 表單編號Α0101 第1〇頁/共18頁 0982079.154-0 201122345 所述基板111上下雙面皆鍍有金屬層，因而有幫助散熱的 效果。優選地，所述固態光源基板111所鍍上的金屬層材 質為金、銀或銅。其中，優選地，所述基板111的顏色為 白色。 [0020] 應該指出，上述實施方式僅為本發明的較佳實施方式， 本領域技術人員還可在本發明精神内做其他變化。這些 依據本發明精神所做的變化，都應包含在本發明所要求 保護的範圍之内。 【圖式簡單說明】 [0021] 圖1是本發明第一實施例的照明裝置的立體示意圖。 [0022] 圖2是本發明第一實施例的照明裝置區域11的局部放大示 意圖。 [0023] 圖3是本發明第一實施例的照明裝置的載具結構示意圖。 [0024] 圖4是本發明第一實施例的照明裝置的基板結構示意圖。 [0025] 圖5是本發明第一實施例的照明裝置的基板結構區域V的 〇 局部放大示意圖。 【主要元件符號說明】 [0026] 1照明裝置 [0027] 11 固態光源模組 [0028] 111 基板 [0029] 112 固態光源 [0030] 1111基板孔洞 表單編號A0101 098146430 第11頁/共18頁 0982079154-0 201122345 [0031] 12載具 [0032] 121底座 [0033] 122支撐組件 [0034] 123載具通孔 098146430 表單編號A0101 第12頁/共18頁 0982079154-0201122345 VI. Description of the Invention: [Technical Leadership of the Invention] [0001] The present invention relates to a lighting device', and more particularly to a solid-state light source indoor lighting device which can have better heat dissipation performance. C prior art] [0002] Solid-state light source, including LED (Light Emitting Diode), is a solid-state semiconductor component that utilizes the combination of electron-hole pairs to release energy in the form of light. The current is converted into light of a specific wavelength range, which is a kind of light-emitting element that has small volume, long life, low power consumption, fast reaction rate, and excellent shock resistance. It is a light-emitting element for various electrical appliances, information boards, communication products, and the like. Light-emitting diodes are widely used in the field of illumination because of their high brightness, low operating voltage, low power consumption, easy to match with integrated circuits, simple driving, and long life. For details, see Joseph Bielecki. Thermal Considerations for LED Components in an Automotive Lamp—X ° [0003] The current LEDs have been widely used in various lamps, solid-state light sources as illumination sources. It has high efficiency and can be used as a lighting tool. Compared with incandescent lamps and fluorescent lamps, the power saving efficiency can reach more than 90%. There are still some problems in the application of solid-state light sources in the prior art as light sources, especially in terms of heat dissipation. The greater the power and brightness, the greater the heat generated by the light-emitting diode or its module, and the heat is less likely to be emitted in a relatively small-volume light-emitting diode lamp. Therefore, the current products using solid-state light sources for illumination have the problem of "heat dissipation", and thus the solid-state light 098146430 Form No. A0101 Page 4 / 18 pages 0982079154-0 201122345 [0004] Ο [0005] [0006] 〇 [0007] The 098146430 source is limited in product applications. Therefore, how to effectively solve the problem of heat dissipation of solid-state light sources is an important issue at present. Especially for the 室内-BAR luminaires used in general indoor lighting, the heat dissipation problem caused by replacing the original fluorescent tubes with solid-state light sources is even more difficult. SUMMARY OF THE INVENTION Due to the low conversion efficiency of the solid-state light source, a large amount of heat energy is generated during the light-emitting process, and an appropriate heat sink device must be provided to avoid damage to the efficiency and life of the wafer and thus affect the performance of the entire lighting device or cause damage. In view of this, it is necessary to provide a solid-state light source indoor lighting device that can effectively achieve better heat dissipation performance. SUMMARY OF THE INVENTION The present invention has been made in view of the above problems, and provides a lighting device having a highly efficient heat dissipation structure and design to effectively overcome the above-mentioned deficiency. The invention provides a solid state light source illumination device comprising a power module, a carrier and at least one solid state light source module, the solid state light source module comprising a substrate and at least one solid state light source. A circuit is disposed on the substrate, and the solid state light source is disposed on the substrate, and an electrode of the solid state light source is electrically connected to a circuit on the substrate. The substrate and the carrier further include a special heat dissipation structure and design. The solid-state light source illumination device of the present invention adopts a special heat dissipation structure and design to change its heat dissipation performance, so as to achieve the purpose that the illumination device does not affect performance or even cause malfunction due to poor heat dissipation. At present, the products of the solid-state light source are mostly concentrated in one lighting device, and are not easy to dissipate heat. Therefore, an object of the present invention is to provide a lighting device having a special heat dissipation structure and design, and the indoor lighting τ-BAR lamp form number A0101 of the present invention. The solid-state light source illumination device of the 5th/18th page 0982079154-0 201122345 is characterized in that the base of the carrier has a hole structure penetrating vertically in the orthographic projection area of the substrate, so that it is convenient to circulate with the outside air, thereby Can produce better heat dissipation. Here, the size, arrangement, and shape of the heat dissipation holes are not particularly limited as long as they can circulate with outside air and exchange heat. Preferably, the heat dissipation hole has a radius ranging from 1 mm to 25 mm. More preferably, the heat dissipation holes have a radius ranging from 5 mm to 10 mm. Wherein, preferably, the heat dissipation holes are arranged in the form of an array. More preferably, the arrangement of the heat dissipation holes is in the form of a misalignment interval. Moreover, preferably, the heat dissipation hole has a circular shape. In addition, according to another object of the present invention, a lighting device having a special heat dissipation structure and design uses a solid-state light source substrate fixedly mounted on a carrier base of the lighting device with a fixed supporting member. The solid-state light source substrate and the carrier base of the illumination device have a three-dimensional space and facilitate air circulation, so that a better heat dissipation effect can be produced. Furthermore, the solid-state light source substrate can also block the heat dissipation holes on the base of the carrier, and the light-emitting effect of the solid-state light source can be prevented from causing light leakage. In addition, a solid space between the solid state light source substrate and the carrier base of the illumination device has an electrical insulation effect. The three-dimensional space between the solid-state light source substrate and the carrier base of the illumination device is not limited in size, as long as it is disposed in the carrier of the illumination device. Preferably, the solid space between the solid-state light source substrate and the carrier base of the illumination device has a height ranging from 1 mm to 50 mm. 098146430 Form No. A0101 Page 6 of 18 pages 0982079154-0 201122345 [0009] [0012] [0012] [0012]. More preferably, the height of the solid space is in the range of 15 mm to 30 mm. Further, the solid-state light source substrate is plated with a metal layer on both the upper and lower sides, which also has the effect of helping to dissipate heat. Preferably, the metal layer plated on the solid state light source substrate is made of gold, silver or copper. Wherein, preferably, the color of the substrate is white. Furthermore, according to still another object of the present invention, a illuminating device having a special heat dissipation structure and design uses a solid-state light source substrate having a hole structure penetrating up and down, which can have a space for facilitating air circulation, thereby making it possible Produces better heat dissipation. Here, the size, arrangement, and shape of the heat dissipation holes are not particularly limited as long as they are capable of air circulation. Preferably, the radius of the heat dissipation hole is in the range of 0.1 mm to 5 mm. More preferably, the heat dissipation holes have a radius size ranging from 0.5 mm to 1 mm. Wherein, preferably, the heat dissipation holes are arranged in the form of an array. More preferably, the arrangement of the heat dissipation holes is in the form of a misalignment interval. Further preferably, the heat dissipation hole has a circular shape. The invention relates to a heat dissipation structure and design of a solid-state light source illumination device, and the utility model thereof has the following advantages. 1. The base of the illuminator carrier has a hole structure that penetrates up and down, which can easily circulate with the outside air, so that it can produce better heat dissipation. 2. The base of the illuminating device carrier has supporting members for supporting and supporting the solid-state light source substrate to create a three-dimensional space with the base, and has the function of air circulation, so that a better heat dissipation effect can be obtained. 3. The solid-state light source substrate has a hole structure penetrating up and down, which is convenient for empty 098146430 Form No. 1010101 Page 7 / Total 18 Page 0982079154-0 [0013] 201122345 Gas /; 'L also produces heat dissipation effect, and the substrate The upper and lower sides are also plated with a metal layer to help dissipate heat. [0016] Compared with the prior art, the solid-state light source lighting device adopts different heat dissipation structures and designs to improve the heat dissipation performance of the solid-state light source module, thereby changing the heat dissipation performance of the entire solid-state light source lighting device. The solid-state light source lighting device of the invention can apply different heat dissipation structures and designs according to the conditions of different environments, thereby generating the required heat dissipation effect, thereby being able to adapt to the requirements of different environments, and saving the manufacturing cost and maintenance cost of the lighting device and The performance of the two products is as follows. Referring to FIG. 1 , a lighting device i according to a first embodiment of the present invention includes a power module (not shown), at least one solid state light source module 11 and a carrier 12 . 2 and 3, the solid state light source module 11 includes a substrate lu and at least one solid state light source 112. The substrate 1 is provided with a circuit, and the at least one solid-state light source H.:2 is disposed on the substrate. An electrode of the at least one solid state light source 112 is electrically connected to a circuit on the substrate 1]. The substrate 111 is fixedly mounted on the carrier base 121 of the illumination device by the fixed support member 122, thereby providing a three-dimensional space between the substrate in and the carrier base 121 of the illumination device. The circulation of air makes the lighting device have a better heat dissipation effect. In addition, a three-dimensional space between the substrate lu and the carrier base 121 of the illumination device can also electrically insulate the substrate 111 from the carrier base 121 of the illumination device. Wherein, a solid space between the solid-state light source substrate and the carrier base of the illumination device has no size limit 098146430, form number A0101, page 8 / total 18 pages 0982079154-0 201122345, as long as it is set The illuminating device can be inside the carrier. Preferably, the solid space between the solid state light source substrate and the carrier base of the illumination device has a height in the range of 1 mm 裘 50 mm. More preferably, the height of the solid space is in the range of 15 mm to 30 mm. [0017] 固态 The solid-state light source module 11 may further include at least one optical component (not shown), which may be an optical lens, a diffusion sheet, a light guide plate or a reflector for adjusting The light field distribution of the solid state light source 112. If the optical component is a lens, the lens may be disposed on a light exiting surface of the solid state light source 112. The light emitted by the solid state light source 112 passes through the lens, and the exit angle of the light will change after passing through the lens. If the optical component is a reflector, the reflector can be disposed on the light-emitting side of the solid-state light source 112 for reflecting light emitted by the solid-state light source 112, thereby changing the light distribution of the solid-state light source module 11. Curve 0 [0018] Referring to FIG. 3, the carrier 12 includes a base 121 and a support assembly 122 and a carrier through hole 123'. The top surface of the base 121 is fixedly connected to the support member 122. 22 is used to support and fix the substrate ill. The base 121 of the carrier has a carrier through hole 123 having a hole structure penetrating vertically in the front projection area of the substrate ln, so that it is convenient to circulate with the outside air, thereby generating a surface heat dissipation effect. Furthermore, the substrate (1) can also block the carrier through hole 123 on the carrier base 121, and the light source can be prevented from leaking according to the directivity and reflection of the solid-state light source 112. The size of the through hole (8) is large, and the arrangement and shape are not particularly limited, and 'as long as it can circulate with the outside air and exchange heat. The radius of the vehicle through hole 123 is 098146430 Form No. A0101 0982079154-0 Page 9 of 18 201122345 Inch J is in the range of 1 mm to 25 mm. More preferably, the radius of the carrier through hole 123 is in the range of 5 to 10 mm. Wherein the carrier vias 123 are preferably arranged in an array. More preferably, the decanting pattern of the secret passage hole 123 is in the form of a misalignment interval. Preferably, the (10) through hole 123_ is circular. [0019] Referring to FIG. 4 and FIG. 5, the substrate 11A of the solid-state light source module has a substrate hole 至 of a hole structure that penetrates up and down. The substrate holes lm of the at least one upper and lower through hole structure vertically penetrate the top and bottom surfaces of the substrate 111, and have a space for facilitating air circulation, so that a better heat dissipation effect can be obtained. The size, arrangement, and shape of the substrate hole 1111 described herein are not particularly limited as long as it can facilitate air circulation. 5厘米至丨公。 The radius of the substrate hole 1111 is preferably in the range of 公. 1 mm to 5 mm. More preferably, the radius of the substrate hole 1111 is 〇. 5 mm to 丨Within the range of PCT. Preferably, the arrangement of the substrate holes 1111 is an array of patterns. More preferably, the arrangement of the substrate holes 1111 is in the form of a misalignment interval. Further preferably, the shape of the substrate hole 1111 is circular. Wherein, the solid-state light source 2 2 has a width of 4 mm (L1), which can be regarded as the width of the solid-state light source Π 2 (or the diameter 'when the solid-state light source 112 has a circular structure) is 4 dong' 5 公。 The maximum distance of the edge of the slab of the slab of the slab of the slab of the slab PCT (L2). Wherein, the ratio of the length of the L2 to the length of the li is greater than or equal to 1. In addition, 098146430 Form No. Α0101 Page 1 of 18 0982079.154-0 201122345 The substrate 111 is coated with a metal layer on both the upper and lower sides, thus helping to dissipate heat. Preferably, the metal layer material plated by the solid-state light source substrate 111 is gold, silver or copper. Preferably, the color of the substrate 111 is white. [0020] It should be noted that the above-described embodiments are merely preferred embodiments of the present invention, and those skilled in the art may make other changes within the spirit of the present invention. All changes made in accordance with the spirit of the invention are intended to be included within the scope of the invention. BRIEF DESCRIPTION OF THE DRAWINGS [0021] FIG. 1 is a perspective view of a lighting device according to a first embodiment of the present invention. 2 is a partially enlarged schematic view of a lighting device region 11 of the first embodiment of the present invention. 3 is a schematic structural view of a carrier of a lighting device according to a first embodiment of the present invention. 4 is a schematic structural view of a substrate of a lighting device according to a first embodiment of the present invention. 5 is a partially enlarged schematic view showing a substrate structure region V of the illumination device according to the first embodiment of the present invention. [Description of main component symbols] [0026] 1 Illumination device [0027] 11 Solid-state light source module [0028] 111 Substrate [0029] 112 Solid-state light source [0030] 1111 Substrate hole form number A0101 098146430 Page 11 of 18 0982079154- 0 201122345 [0031] 12 carrier [0032] 121 base [0033] 122 support assembly [0034] 123 carrier through hole 098146430 Form No. A0101 Page 12 / Total 18 Page 0982079154-0