TW201121782A - Housing of electronic device and method for making the housing - Google Patents

Housing of electronic device and method for making the housing Download PDF

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Publication number
TW201121782A
TW201121782A TW98143604A TW98143604A TW201121782A TW 201121782 A TW201121782 A TW 201121782A TW 98143604 A TW98143604 A TW 98143604A TW 98143604 A TW98143604 A TW 98143604A TW 201121782 A TW201121782 A TW 201121782A
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TW
Taiwan
Prior art keywords
antenna
electronic device
layer
device housing
substrate
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Application number
TW98143604A
Other languages
Chinese (zh)
Inventor
Ye Xiong
wei-dong Hao
Original Assignee
Fih Hong Kong Ltd
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Application filed by Fih Hong Kong Ltd filed Critical Fih Hong Kong Ltd
Priority to TW98143604A priority Critical patent/TW201121782A/en
Publication of TW201121782A publication Critical patent/TW201121782A/en

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Abstract

The present disclosure provides a housing of electronic device and a method for making the housing. The housing includes a transparent or translucent film and a substrate. The housing further includes an antenna set between the film and the substrate. The antenna is a conductive coating and present a pattern appearance. The antenna is defined with electric contacts. The substrate is formed by molding melted plastic onto the antenna. The method for making the housing comprises: providing a transparent or translucent film; forming a conductive coating having a pattern appearance on a portion surface of the film to get an antenna, the antenna being defined with electric contacts thereon; placing the film with the antenna in an interior of a mould to mold a substrate onto the antenna.

Description

201121782 formed by molding melted plastic onto the antenna. The method for making the housing comprises: providing a transparent or translucent film; forming a conductive coating having a pattern appearance on a portion surface of the film to get an antenna, the antenna being defined with electric contacts thereon; placing the film with the antenna in an interior of a mould to mold a substrate onto the antenna. 四、指定代表圖: (一) 本案指定代表圖為:第(1 )圖。 (二) 本代表圖之元件符號簡單說明: 殼體 10 薄膜層 11 天線 13 保護層 15 基體 17 五右有化學式時,請揭示最能顯示發明特徵之化 学式: 六、發明說明: 【發明所屬之技術領域】 一本發明涉及一種電子裝置殼體及其製作方法,尤其涉 及一種集成有天線的電子裝置殼體及該電子裝置殼體的製 作方法。 201121782 【先前技術】 隨著資訊科技的迅速發展,可攜式電子裝置如移動電 . 話、個人數位助理等應用日益普遍。這些電子裝置殼體的 外觀造型是否新穎、重量是否輕便、是否便於攜帶的特性 也越來越受到人們的關注與重視。另外,該可攜式電子裝 置的信號收發效果亦為消費者所十分注重的。而天線的設 置係決定可攜式電子裝置信號收發效果的重要因素。因 此,如何兼顧天線的信號收發效果及配合可攜式電子裝置 B 外觀曰趨輕薄短小的趨勢,為開發天線結構的重要考量因 素。若將天線製作成圖形或商標,使天線同時具有收發馆 號及增強殼體外觀的功能,則更能吸引消費者的眼球。 為此,人們將製作天線的金屬發射片直接設計成圖形 .或商標,設置於殼體的外表面形成天線,使天線不佔據殻 體的内部空間,便於可攜式電子裝置的輕薄短小化’又使 該天線具有觀賞性。然而將天線設置於殼體的外表面存在 天線容易脫落及被磨損的缺陷’從而影響到天線的信號收 φ 發功能。 【發明内容】 鑒於此,有必要提供一種電子裝置殼體’該電子裝置 殼體集成有天線,該天線佔據的空間小且具有觀賞性’在 且該天線在使用過程中不會被磨損。 另外,還有必要提供一種上述電子裝置殼體的製作方 法。 一種電子裝置殼體,其包括一透明或半透明的薄膜層 及一基體,該電子裝置殼體還包括一設置於薄膜層與基體 201121782 之間的天線,該天線為-導電層且具有預定的圖案, ^置有電性觸點,所述基體以注_方式結合於天線的 - 表面。 • —種電子衫殼體的製作方法,其包括如下步驟: 提供一透明或半透明的薄膜層; 在該薄膜層一表面的部分區域設置一具有預定圖案的 導電層以形成一天線,該天線上設置有電性觸點; 將形成有所述天線的薄膜層置於一成型模具中,注塑 φ 塑膠於該天線的表面形成一基體。 相較於習知技術,本發明電子裝置殼體的天線設置於 透明或半透明的薄膜層與基體之間,消費者可從薄膜層的 外表面看到天線的圖案,使天線具有觀賞作用。該天線佔 據的空間小,且基體以注塑的方式結合於天線的表面,可 使天線牢固的附著於殼體中而保證天線穩定的信號收發功 能。且由於天線未暴露於殼體表面,不會被磨損,從而使 得本發明電子裝置殼體更具吸引力,提升了電子裝置的附 鲁加價值。 【實施方式】 請參閱圖1所示,本發明一較佳實施方式的電子裝置 殼體10包括一透明或半透明的薄膜層11、形成於薄膜層 11 一表面的天線13、形成於天線13及薄膜層11表面的保 護層15、以及形成於保護層15表面的基體17。 薄膜層11可為一塑膠層。該塑膠可選自為透明或半透 明的聚丙烯(PP)、聚醯胺(PA)、聚碳酸酯(pc)、聚對 苯二曱酸乙二酯(PET)及聚曱基丙烯酸甲酯(PMMA)中 201121782 的任 '—種。 天線13可為一導電層,如導電油墨層。所述導電油墨 _層可以絲網印刷的方式形成。印刷該導電油墨層所用的導 • 電油墨中包含有導電成分,如銀粉或銅粉等。該導電油墨 還包含有樹脂、硬化劑、溶劑及添加劑。該樹脂可為一般 油墨常用的樹脂。該添加劑包括有顏料、表面調整劑、流 動調整劑、增量劑等。所述顏料可根據天線13顏色的需要 而選擇。所述天、線13 #有預定的圖案,其形成於薄膜層 • 11的部分表面。該預定的圖案可以係產品的商標或具有美 感的圖案,該圖案的形狀可依據電子裝置的頻率特性而設 β十。天線13上還被設置有電性觸點(圖未示)。 保護層15可為-印刷油墨層,其形成於天線13的表 面及薄膜層11未形成有天線13的區域。印刷該保護層15 的油墨可為紫外光固化油墨。該保護層15可以為透明的, 也可以為不透明的,其具有與天線13不同的顏色優選為 具有與天線13具有較強對比效果的顏色,以使天線13具 φ 有更好的觀賞效果。 八 基體17為-塑膠層,其以注塑的方式形成於保護層 15的表面。注塑基體17的塑膠可為常用的熱塑性塑 熱固性塑膠。 可以理解的,所述保護層15可以省略,即基體17直 接結合於天線13的表面及薄膜層u未形成有天線13的區 域。 可以理解的,所述天線13亦可為以真空蒸鑛的方式形 成的導電層。 201121782 可以理解的,職天線13亦可以為以薄的金屬發射片 枯貼於薄膜層11的表面而形成的導電層。 . 純於f知技術,本發日㈣子裝置殼體K)的天線13 .設置於透明或半透__層u與基體17之間,消費者 可從薄膜層11的外表面看到天線13的圖案使天線13具 有觀賞作用。該天線13佔據的空間小,且基體17以注塑 的方式結合於天線13的表面,可使天線13㈣的附著於 電子裝置殼體财而保證天線敎的信號收發功能。且由 _於天線13未暴硌於電子裝置殼體10的表面,不會被磨損, 從而使得本發明電子裝置殼體1()更具吸引力,提升了電子 裝置的附加價值。 本發明一較佳方式的製作所述電子裝置殼體10的方 法包括如下步驟: 提供—透明或半透明的薄膜層11。該薄膜層η可為-塑膠層。該塑膠可選自為透明或半透明的聚丙烯(則、聚 醯胺(ΡΑ)、聚碳酸酉旨(PC)、聚對苯二甲酸乙二醋(ρΕτ) ❿及聚甲基丙烯酸甲酯(ΡΜΜΑ)中的任一種。 在該薄膜層11 一表面的部分區域設置一具有預定圖 案的導電層以形敍線13。該導電層可為以印刷導電油 墨、真空蒸鍍或粘貼金屬發射片的方式形成。所述天線13 的圖案可以係產品的商標或具有美感的圖案,該圖案的形 狀可依據電子裝置的頻率特性而設計。天線13上還被設置 有電性觸點。 在所述天線13的表面及薄膜層11未形成有天線13的 區域印刷-保護層15 ’以保護所述天線13在後續注塑基 201121782 體17時不被損壞。該保護層15 其具有較好的耐高溫性能。Μ ^卜光固化油墨層’ 將形成有所述保護層15_mMu 中:挪於該保護層15的 體=塑 基體17㈣膠可為相的熱紐_祕祕塑膠。 可乂理解的所述保濩層15亦可以省略,即基體η 直接注塑結合於天線13的表面及薄膜層11未形成有天線 13的區域。The method for making the housing comprises: providing a transparent or translucent film; forming a conductive coating having a pattern appearance on a portion surface of the film to get an antenna, the antenna defined with Electric contact; placing the film with the antenna in an interior of a mould to mold a substrate onto the antenna. 4. The designated representative map: (1) The representative representative map of the case is: (1). (2) Brief description of the components of the representative figure: Shell 10 Thin film layer 11 Antenna 13 Protective layer 15 Base 17 When there is a chemical formula in the right, please disclose the chemical formula that best shows the characteristics of the invention: 6. Description of the invention: BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an electronic device housing and a method of fabricating the same, and more particularly to an electronic device housing integrated with an antenna and a method of fabricating the same. 201121782 [Prior Art] With the rapid development of information technology, portable electronic devices such as mobile phones and personal digital assistants are becoming more and more popular. Whether the appearance of these electronic device housings is novel, whether the weight is light, and whether it is easy to carry is also attracting more and more attention. In addition, the signal transceiving effect of the portable electronic device is also highly valued by consumers. The setting of the antenna is an important factor in determining the signal transceiving effect of the portable electronic device. Therefore, how to balance the signal transmission and reception effect of the antenna and the tendency of the portable electronic device B to be light, thin and short is an important consideration for the development of the antenna structure. If the antenna is made into a graphic or trademark, the antenna has the function of transmitting and receiving the museum number and enhancing the appearance of the casing, which is more attractive to the consumer. To this end, the metal emitter of the antenna is directly designed into a graphic or trademark, and the antenna is disposed on the outer surface of the casing to form an antenna, so that the antenna does not occupy the internal space of the casing, thereby facilitating the lightness and thinness of the portable electronic device. Moreover, the antenna is ornamental. However, the antenna is disposed on the outer surface of the casing, and there is a defect that the antenna is easily detached and worn, thereby affecting the signal receiving function of the antenna. SUMMARY OF THE INVENTION In view of the above, it is necessary to provide an electronic device housing. The electronic device housing is integrated with an antenna which occupies a small space and is ornamental' and the antenna is not worn during use. In addition, it is also necessary to provide a method of fabricating the above-described electronic device housing. An electronic device housing comprising a transparent or translucent film layer and a substrate, the electronic device housing further comprising an antenna disposed between the film layer and the substrate 201121782, the antenna being a conductive layer and having a predetermined The pattern, ^ is provided with an electrical contact, and the substrate is bonded to the surface of the antenna in a manner. A method for fabricating an electronic shirt casing, comprising the steps of: providing a transparent or translucent film layer; and providing a conductive layer having a predetermined pattern in a portion of a surface of the film layer to form an antenna, the day An electrical contact is disposed on the wire; the film layer on which the antenna is formed is placed in a molding die, and the injection molding φ plastic forms a substrate on the surface of the antenna. Compared with the prior art, the antenna of the electronic device casing of the present invention is disposed between the transparent or translucent film layer and the substrate, and the consumer can see the pattern of the antenna from the outer surface of the film layer, so that the antenna has an ornamental effect. The space occupied by the antenna is small, and the substrate is bonded to the surface of the antenna by injection molding, so that the antenna can be firmly attached to the casing to ensure stable signal transmission and reception of the antenna. Moreover, since the antenna is not exposed to the surface of the casing, it is not worn, so that the casing of the electronic device of the present invention is more attractive, and the added value of the electronic device is enhanced. [Embodiment] Referring to FIG. 1 , an electronic device housing 10 according to a preferred embodiment of the present invention includes a transparent or translucent film layer 11 , an antenna 13 formed on a surface of the film layer 11 , and an antenna 13 . And a protective layer 15 on the surface of the thin film layer 11, and a substrate 17 formed on the surface of the protective layer 15. The film layer 11 can be a plastic layer. The plastic may be selected from transparent or translucent polypropylene (PP), polyamidamine (PA), polycarbonate (pc), polyethylene terephthalate (PET) and polymethyl methacrylate. (PMMA) in the '2011. Antenna 13 can be a conductive layer such as a conductive ink layer. The conductive ink layer can be formed by screen printing. The conductive ink used for printing the conductive ink layer contains a conductive component such as silver powder or copper powder. The conductive ink further contains a resin, a hardener, a solvent, and an additive. The resin can be a resin commonly used in general inks. The additive includes a pigment, a surface conditioner, a flow regulator, an extender, and the like. The pigment can be selected according to the needs of the color of the antenna 13. The day, line 13 # has a predetermined pattern which is formed on a part of the surface of the film layer 11 . The predetermined pattern may be a trademark of the product or a pattern having an aesthetic shape, and the shape of the pattern may be set to be ten according to the frequency characteristics of the electronic device. The antenna 13 is also provided with an electrical contact (not shown). The protective layer 15 may be a printing ink layer formed on the surface of the antenna 13 and the region where the film layer 11 is not formed with the antenna 13. The ink for printing the protective layer 15 may be an ultraviolet curable ink. The protective layer 15 may be transparent or opaque, and the color different from the antenna 13 preferably has a color having a strong contrast effect with the antenna 13 so that the antenna 13 has a better viewing effect. The octagonal body 17 is a plastic layer which is formed on the surface of the protective layer 15 by injection molding. The plastic of the injection molding substrate 17 can be a commonly used thermoplastic thermosetting plastic. It can be understood that the protective layer 15 can be omitted, that is, the substrate 17 is directly bonded to the surface of the antenna 13 and the region where the thin film layer u is not formed with the antenna 13. It can be understood that the antenna 13 can also be a conductive layer formed by vacuum distillation. 201121782 It can be understood that the job antenna 13 can also be a conductive layer formed by adhering a thin metal emitting sheet to the surface of the film layer 11. Purely known as the technology, the antenna 13 of the sub-device housing K) of the present day (four) is disposed between the transparent or semi-transparent layer _ layer u and the substrate 17, and the consumer can see the antenna from the outer surface of the film layer 11. The pattern of 13 gives the antenna 13 an ornamental effect. The space occupied by the antenna 13 is small, and the base body 17 is bonded to the surface of the antenna 13 by injection molding, so that the antenna 13 (4) can be attached to the electronic device casing to ensure the signal transmission and reception function of the antenna frame. Moreover, the antenna 13 is not violently exposed to the surface of the electronic device casing 10, and is not worn, so that the electronic device casing 1 () of the present invention is more attractive, and the added value of the electronic device is enhanced. A method of fabricating the electronic device housing 10 in accordance with a preferred embodiment of the present invention includes the steps of: providing a transparent or translucent film layer 11. The film layer η can be a plastic layer. The plastic may be selected from transparent or translucent polypropylene (then, polyamide (polyamide), polycarbonate (PC), polyethylene terephthalate (ρΕτ) oxime and polymethyl methacrylate. Any one of (ΡΜΜΑ). A conductive layer having a predetermined pattern is disposed in a partial region of a surface of the film layer 11 to shape the line 13. The conductive layer may be printed with conductive ink, vacuum evaporated or adhered to a metal emitting sheet. The pattern of the antenna 13 may be a trademark of the product or an aesthetically pleasing pattern, and the shape of the pattern may be designed according to the frequency characteristics of the electronic device. The antenna 13 is also provided with an electrical contact. The surface of the antenna 13 and the film layer 11 are not formed with the area print-protective layer 15' of the antenna 13 to protect the antenna 13 from damage when the subsequent injection molding base 201121782 body 17. The protective layer 15 has a good high temperature resistance. The performance of the 固化 卜 固化 固化 固化 固化 形成 形成 形成 形成 形成 形成 形成 形成 形成 形成 形成 形成 形成 形成 形成 形成 形成 形成 形成 形成 形成 形成 形成 形成 形成 形成 形成 形成 形成 形成 形成 形成 形成 形成 形成 形成 形成 形成 形成 形成 形成 形成 形成 形成 形成 形成 形成The protective layer 15 can also be omitted I.e. η base body 13 molded directly bonded to the surface of the antenna and the thin film layer 11 has an antenna region 13 is not formed.

【圖式簡單說明】 圖1係本發明一較佳實施方式電子裝置殼體的剖視示 意圖。 【主要元件符號說明】 殼體 10 薄膜層 11 天線 13 保護層 15 基體 17BRIEF DESCRIPTION OF THE DRAWINGS Fig. 1 is a cross-sectional view showing a housing of an electronic device according to a preferred embodiment of the present invention. [Description of main component symbols] Housing 10 Thin film layer 11 Antenna 13 Protective layer 15 Substrate 17

[S] 7[S] 7

Claims (1)

201121782 七、申請專利範圍: L 一種電子裝置殼體,其包括一透明或半透明的薄膜層 • 及一基體,其改良在於:該電子裝置殼體還包括一設 • 置於薄膜層與基體之間的天線,該天線為一導電層且 具有預定的圖案,天線上設置有電性觸點,所述基體 以注塑的方式結合於天線的表面。 2·如申請專利範圍第1項所述的電子裝置殼體,其中所 述天線為一導電油墨層,其以絲網印刷的方式形成於 φ 薄臈層的部分表面。 3. 如申請專利範圍第1項所述的電子裝置殼體,其中所 述天線為以真空蒸鍍的方式形成的導電層。 4. 如申請專利範圍第1項所述的電子裴置殼體,其中所 述天線為以金屬發射片粘貼於薄膜層的部分表面而 形成的導電層。 5. 如申請專利範圍第1項所述的電子裝置殼體,其中所 述基體為一熱塑性塑膠層或熱固性塑膠層。 • 6.⑹申請專利範圍第丄項所述的電子裝置殼體,其中所 述電子裝置殼體還包括一保護層,該保護層設置於天 線與基體之間,該基體與該保護層相結合。 7. 如申請專利範圍第ό項所述的電子裝置.殼體,其中所 述保護層為一印刷油墨層。 8. 如申請專利範圍第1項所述的電子裝置殼體,其中所 述薄膜層為一塑膠層,該塑膠選自為透明或半透明的 1丙埽、聚酿胺、聚碳酸酯、聚對笨二甲酸乙二酯及 聚甲基丙烯酸甲酯中的任一種。 201121782 9· 一種電子裝置殼體的製作方法,其包括如下步驟: 提供一透明或半透明的薄膜層; , 在該薄膜層一表面的部分區域設置一具有預定圖案 • 的導電層以形成一天線,該天線上設置有電性觸點; 將形成有所述天線的薄膜層置於一成型模具中,注 塑塑膠於該天線的表面形成一基體。 10·如申請專利範圍第9項所述的電子裝置殼體的製作方 法’其中設置所述天線的方法為印刷導電油墨、真空 _ 蒸鍍或粘貼金屬發射片。 U,如申請專利範圍第9項所述的電子裝置殼體的製作方 法’其中所述電子裝置殼體的製作方法還包括在注塑 基體前在天線的表面印刷一保護層的步驟。201121782 VII. Patent application scope: L An electronic device housing comprising a transparent or translucent film layer and a substrate, wherein the electronic device housing further comprises a device disposed on the film layer and the substrate An antenna is a conductive layer and has a predetermined pattern. The antenna is provided with an electrical contact, and the substrate is bonded to the surface of the antenna in an injection molding manner. 2. The electronic device housing of claim 1, wherein the antenna is a conductive ink layer formed by screen printing on a portion of the surface of the φ thin layer. 3. The electronic device housing of claim 1, wherein the antenna is a conductive layer formed by vacuum evaporation. 4. The electronic housing of claim 1, wherein the antenna is a conductive layer formed by attaching a metal emitting sheet to a surface of a portion of the film layer. 5. The electronic device housing of claim 1, wherein the substrate is a thermoplastic plastic layer or a thermosetting plastic layer. 6. The electronic device housing of claim 6 , wherein the electronic device housing further comprises a protective layer disposed between the antenna and the base, the base being combined with the protective layer . 7. The electronic device housing of claim 2, wherein the protective layer is a printing ink layer. 8. The electronic device casing of claim 1, wherein the film layer is a plastic layer selected from the group consisting of transparent or translucent 1 propylene, polyamine, polycarbonate, and poly. Any of diethyl benzoate and polymethyl methacrylate. 201121782 9. A method for fabricating an electronic device housing, comprising the steps of: providing a transparent or translucent film layer; and providing a conductive layer having a predetermined pattern in a portion of a surface of the film layer to form an antenna The antenna is provided with an electrical contact; the film layer on which the antenna is formed is placed in a molding die, and the injection molded plastic forms a substrate on the surface of the antenna. 10. The method of fabricating an electronic device housing according to claim 9, wherein the antenna is provided by printing a conductive ink, vacuum-evaporating or pasting a metal emitting sheet. U. The method of fabricating an electronic device housing according to claim 9, wherein the method of fabricating the electronic device housing further comprises the step of printing a protective layer on the surface of the antenna before the injection molding substrate.
TW98143604A 2009-12-18 2009-12-18 Housing of electronic device and method for making the housing TW201121782A (en)

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TW98143604A TW201121782A (en) 2009-12-18 2009-12-18 Housing of electronic device and method for making the housing

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