201117905 六、發明說明： 【發明所屬之技術領域】 本發明係種雷射加卫裝置，尤指—種將时壓合電路她曲之 氣體和射出之雷射同方向垂直射向該電路板上之焊接部之雷射加工裝置。 【先前技術】 雷射加工裝置之基本顧主要是將雷射輸出之絲，糾並聚焦到焊 料的表面。聚焦後的雷射光束經焊料吸收後，使得溫度驟然昇高而溶化以 達到焊接物件的目的。 請參閱第！圖’第i圖係雷射頭1〇射出之雷射用於焊接軟性電路板Ο 和基板14之示意圖。傳統上，欲將軟性電路板㈣滿c⑽视瓜 之焊接部18焊翻基板14的連接部16，概魏板i2的焊接部a會先 對應放置於基板Η的連卿16上，之彳_铜高溫之雷射L會 照射在焊接部18上，使得軟性電路板12的焊接部Μ上的獅_ 化’-旦冷卻細生電路板12即可與基板14的連接部Μ蚊在一起。然 而’焊接部18無法平貼於基板14上，使得焊接部18和基板14之連接部 16上下間距過大，這容易使得焊接鋪錫不平均，導致焊點過大而造成谭接 作業的困難。 請參閱第2圓，第2圖係使用_ 2〇塵合軟性電路板12之焊接部μ 和基板Η之示意圖。為了改善上述問題，有一解決方案係採用石英或其他 透光性材料所製成賴頭2〇直合料部^和雜部ΐό，韻這樣的 方案仍有無法補錫的問題，而且壓頭2〇容易影響錫的鋪料範圍和厚度，導 201117905 致鋪料均一性不佳。 【發明内容】 有鑑於此’本發明之目的係提供一種同方向垂直將氣體和雷射射向該 電路板，以改善因電路板和基板之間有過大間距而不糾接之雷射加工裝 本發明提出-種將-電路板焊接於—基板上之雷射加1健。該雷射 加工裝置包含風管、雷射頭和外管。風管具有一出風口嗔出一氣體至 路板上之-焊接部上。該雷_緊鄰於該風管，用來發出—雷射光至該電 路板上之鱗接部上1風如及該騎獅大触於糾㈣，該外管 之一開口係朝向該電路板，餅自該出風口噴_氣體與以及自該雷射 碩射出之雷射從該開口以垂直的方向射向該電路板上之該坪接部。 :本發月之雷射加工裝置另包含—供氣裝置和—側^該供氣裝置用來產 生該氣體。該姆連接雜錄置並鳩於該料，时料該氣體至該 風管。 本發明之雷射加工裝«包含—痒料供給源，鄰近於該出風口。 在本發明之—實施例中，f射加工裝置更包含一外管，該風管以及該雷 —碩係大體位於該外管内，該外管具有—開口，該氣體、該焊科供給源之 '焊料以及該雷_所提供之—雷織铜雜由關σ射出。 在本發明之另一實施例中，雷射加工裝置更包含一外管，該風管以及 、雷射頭係讀位於該外㈣，該外管具有―開口，該氣體以及該雷射頭 201117905 所提供之一雷射光係同時經由該開口射出。 本發明編―_吨置。觸㈣嫩一風管以201117905 VI. Description of the invention: [Technical field to which the invention pertains] The invention relates to a laser-assisted device, in particular to a type of time-pressing circuit in which the gas of the curved and the emitted laser are directed perpendicularly to the circuit board. The laser processing device of the welding part. [Prior Art] The basic consideration of the laser processing apparatus is to focus and focus the laser output onto the surface of the solder. After the focused laser beam is absorbed by the solder, the temperature suddenly rises and dissolves to achieve the purpose of soldering the object. See the first! Fig. i is a schematic view of a laser beam emitted from a laser head 1 for soldering a flexible circuit board and a substrate 14. Conventionally, if the flexible circuit board (4) is full of c (10), the soldering portion 18 of the melon is turned over to the connecting portion 16 of the substrate 14, and the soldering portion a of the board i2 is first placed on the substrate 16 of the substrate, and then _ The copper high-temperature laser L is irradiated onto the soldering portion 18, so that the lion-on-heated thin circuit board 12 on the soldered portion of the flexible circuit board 12 can be connected to the substrate 14 at the connection portion. However, the soldering portion 18 cannot be flatly attached to the substrate 14, so that the upper and lower pitches of the connecting portion 16 of the solder portion 18 and the substrate 14 are too large, which tends to cause uneven soldering and soldering, which causes the solder joint to be too large and causes difficulty in the tan bonding operation. Please refer to the second circle. Fig. 2 is a schematic view showing the welding portion μ and the substrate _ of the _ 2 dust-bonded flexible circuit board 12. In order to improve the above problems, there is a solution that uses quartz or other light-transmissive materials to make the vertical joints and the miscellaneous parts of the 头 head, and the scheme of rhyme still has the problem of not being able to replenish tin, and the indenter 2 〇 It is easy to affect the paving range and thickness of tin, and the uniformity of paving materials is poor. SUMMARY OF THE INVENTION In view of the above, the object of the present invention is to provide a laser processing device that directs gas and laser in the same direction perpendicularly to the circuit board to improve the excessive spacing between the circuit board and the substrate without being entangled. The present invention proposes a laser-on-board welding of a circuit board to a substrate. The laser processing apparatus includes a duct, a laser head, and an outer tube. The air duct has an air outlet that draws a gas onto the welded portion of the road plate. The lightning _ is adjacent to the air duct, and is used for emitting a laser light to the scaly portion of the circuit board, and if the lion is in contact with the thief (4), one of the outer tubes is open toward the circuit board. The cake is sprayed from the air outlet _ gas and the laser emitted from the laser beam from the opening in a vertical direction toward the lands of the circuit board. The laser processing apparatus of the present month further includes a gas supply device and a side gas supply device for generating the gas. The m is connected to the miscellaneous material and placed in the material, and the gas is supplied to the air duct. The laser processing apparatus of the present invention comprises a source of itch material adjacent to the air outlet. In an embodiment of the present invention, the f-ray processing device further includes an outer tube, the air tube and the lightning-system are generally located in the outer tube, the outer tube has an opening, the gas, the welding source supply source 'Solder and the thunder _ provided by the thunder woven copper is emitted by the off σ. In another embodiment of the present invention, the laser processing apparatus further includes an outer tube, the air duct and the laser head are located at the outer (four), the outer tube has an opening, the gas and the laser head 201117905 One of the laser light systems provided is simultaneously ejected through the opening. The invention is edited. Touch (four) tender one duct
及一雷射頭。該風管具有-出風口，垂直向B 1出乱體。該雷射頭，势 鄰於該風管，提供-雷射先料。 笼 為讓本發明之上述内容能更明顯易懂， 所附圖式，作詳細說明如下： 下文特舉較佳實施例， 並配合 【實施方式】 以下各實施例的說明是參考附加的圖式，用以例示本發明可用以實施 之特定實施例。本發明所提到的方向用語，例如「上」、「下」、「前」、卜 左」、「右」、「頂」、「底」、「水平」、「垂直」等’僅是參考附加圖式的方 向。因此’使用的方向用語是用以說明及理解本發明，而非用以限制本發 明。And a laser head. The air duct has an air outlet, and the vertical body is out of the B 1 . The laser head, adjacent to the duct, provides - laser first. The above description of the present invention will be more clearly understood, and the following description will be described in detail below: Preferred embodiments are described below, and in conjunction with the following embodiments, the description of the following embodiments refers to additional drawings. It is intended to illustrate specific embodiments in which the invention may be practiced. The directional terms mentioned in the present invention, such as "upper", "lower", "before", "b", "right", "top", "bottom", "horizontal", "vertical", etc. are only references. Attach the direction of the drawing. Therefore, the directional terminology is used to describe and understand the invention, and not to limit the invention.
請參閱第3圖和第4圖，第3圖係本發明之雷射加工裝置ι〇〇之示意 圖’第4圖係本發明之第—實施例之雷射加工裝置之雷射頭加產生 之雷射照射於電路板13〇之示_。雷射加卫裝置丨⑻包含縣114、焊料 供給源115、雷射頭116、外管118、導管152和供氣裝置12〇。此外，雷射 頭116的-部份舉例可位於風管114内，但並不用以偈限。供氣裝置 提供的氣體會經由側管⑽以及/或外管m導引並由風管114的出風口 146 送出。谭料供給源m肖來提供焊接所需使用的軟焊材料，例如錫或銀等 等。焊料供給源115提供的焊料會經由導管I52喷出。緊鄰於風管m的 201117905 雷射頭116用來發出一雷射光束L。外管⑽用來收納風管ιι4以及雷射頭 116，如此來，可以確保雷射光束[、供氣裝置產生的氣體和焊料供 給源115產生的焊料皆從同—方向自開口 144射出。 使用雷射加工裝置100將電路板13〇焊接於基板⑽的操作說明如下。 基板舉媽顯V面板，譬如驗晶顯示面板、電激發光顯示面板或微 機電顯示面板等等。當基板⑽之連接部⑷與電路板⑽之焊接部阳 對準排舰，風管114則自開σ 144喷出供錄置⑶提供之高速氣體至 電路板130之烊接部132上。因為開口 144喷出之該氣體與係以垂直的方 向射向電路板D0上之焊接部132’所以焊接部132會因為高速氣體產生之 壓力而，、基板140之連接部142平坦貼齊，而不會魅屈。隨後，雷射振盈 器m射出之雷射光束L射入雷射頭116之透鏡㈣122後，會經由該透 鏡m在喷嘴m之下方之焦轉光而垂直照射於電路板13〇之焊接部132 上’使得電路板j3〇的焊接部132上的谭料熔化。一旦冷卻後電路板13〇 即可與基板140的連接部142固定在一起。 請參閲第5圖，第5圖係本發明之第二實施例之雷射加工裝置测之 示意圖。為了簡化說明，在第5圖中凡是與第4圖所示之树具有相同編 號者具有相_功能，在此不再贅述^同於第4圖之雷射加工裝置⑽， 雷射加工裝置200中用來連接焊料供給源m的導管252未位於外管⑽ 之内’換言之，僅風管114以及雷射頭116位於外管118内。但是導管况 的位置仍然鄰近外管m，-但嬋料噴出至焊接部m後，外管ιΐ8仍可將 雷射光束以及供氣裝置U0提供的氣體從同一方向射出，以達到非接觸式 201117905 的方式來達到壓合電路板130與基板14〇的目的。 在本實施例中，焊接部132所使用的軟焊材料，其材質可如：錫(§幻、 s 翁 b)、臟(Ag)、s_(Cu)、s，/Ag、s•㈣、sn/銦⑽、銅 塗劑、銀塗劑、導電性樹脂等。 相較於先前技術，本發明之雷射加工裝置將雷射頭11δ與風t叫緊鄰 放置’且兩者射出雷射與氣體的方式皆垂直於電路板13〇，所以在雷射照射 在電路板130之焊接部132讀’風管叫灿氣體所產生之局部風紐 會使電路板m之焊接部m與基板⑽之連接部⑷貼合，減小間距。 此外，因為風管m是採用喷出氣體的方式達到非接觸式的方式壓合電路 板no與基板⑽，所以不會影響電路板130之線路間焊料流動。而且電路 板130的膠材部份亦可利用風壓冷卻，所以不易燒燬。 雖然本發明已用較佳實施例揭露如上，然其並非用以限定本發明，任 何熟習此技藝者，在不脫離本發明之精神和範圍内，當可作各種之更動與 籲修改，因此本發明之保護範圍當視後附之申請專利範圍所界定者為準。 【圖式簡單說明】 第1圖係雷射s貞射$之雷細於焊接軟性電路板和基板之示意圖。 第2圖係使職麵合軟性電路板之焊接部和基板之示意圖。 第3 ®係本發明之飾泣裝置之示意圖。 第4圖係本發明之第—實補之#射加卫裝置之雷綱產生之雷射照 射於電路板之示意圖。 第5圖係本發明之第二實施例之雷射加工裝置之雷綱產生之雷射照 射於電路板之示意圖。 201117905 【主要元件符號說明】 10 雷射頭 12 軟性電路板 14 基板 16 連接部 18 焊接部 100 雷射加工裝置 112 雷射振盪器 114 風管 116 雷射頭 118 外管 120 供氣裝置 130 電路板 112 雷射振盪器 122 透鏡 124 噴嘴 132 焊接部 140 基板 142 連接部 144 開口 146 出風口 150 側管 152'252 導管 115 焊料供給源Please refer to FIG. 3 and FIG. 4, FIG. 3 is a schematic view of a laser processing apparatus according to the present invention. FIG. 4 is a perspective view of a laser processing apparatus according to a first embodiment of the present invention. The laser is illuminated on the circuit board 13 _. The laser security device (8) includes a county 114, a solder supply source 115, a laser head 116, an outer tube 118, a conduit 152, and a gas supply device 12A. In addition, the portion of the laser head 116 may be located within the duct 114, but is not intended to be limited. The gas supplied from the gas supply means is guided through the side pipe (10) and/or the outer pipe m and sent out by the air outlet 146 of the air duct 114. Tan material supply source Xiao Xiao provides the soldering materials required for soldering, such as tin or silver. The solder supplied from the solder supply source 115 is ejected through the conduit I52. The 201117905 laser head 116, which is adjacent to the duct m, is used to emit a laser beam L. The outer tube (10) is for accommodating the air duct ι4 and the laser head 116, so that it is ensured that the laser beam [, the gas generated by the air supply means, and the solder generated by the solder supply source 115 are emitted from the opening 144 from the same direction. The operation of soldering the circuit board 13 to the substrate (10) using the laser processing apparatus 100 will be described below. The substrate is a V-panel, such as a crystal display panel, an electroluminescent display panel, or a MEMS display panel. When the connecting portion (4) of the substrate (10) is aligned with the soldering portion of the circuit board (10), the air duct 114 is ejected from the opening σ 144 for recording the high-speed gas supplied from the (3) to the nip portion 132 of the circuit board 130. Because the gas ejected from the opening 144 is directed to the soldering portion 132' on the circuit board D0 in a vertical direction, the soldering portion 132 is flat and the connecting portion 142 of the substrate 140 is flat due to the pressure generated by the high-speed gas. Will not charm. Then, after the laser beam L emitted from the laser vibrator m is incident on the lens (four) 122 of the laser head 116, it is vertically irradiated to the soldering portion of the circuit board 13 by the focal rotation of the lens m under the nozzle m. The upper portion of 132 causes the tan on the soldering portion 132 of the board j3 to melt. Once cooled, the circuit board 13A can be secured to the connection portion 142 of the substrate 140. Referring to Figure 5, there is shown a schematic view of a laser processing apparatus according to a second embodiment of the present invention. In order to simplify the description, in FIG. 5, the same number as the tree shown in FIG. 4 has the same function, and the laser processing apparatus (10) of the laser processing apparatus (10), the laser processing apparatus 200, will not be described herein. The conduit 252 used to connect the solder supply source m is not located within the outer tube (10). In other words, only the duct 114 and the laser head 116 are located within the outer tube 118. However, the position of the duct condition is still adjacent to the outer tube m, but after the spout is ejected to the welded portion m, the outer tube ι 8 can still emit the laser beam and the gas supplied from the air supply device U0 from the same direction to achieve the non-contact type 201117905. The way to achieve the purpose of pressing the circuit board 130 and the substrate 14 turns. In the present embodiment, the soldering material used in the soldering portion 132 may be made of tin (§ 幻, s 翁 b), dirty (Ag), s_(Cu), s, /Ag, s•(4), Sn/indium (10), copper coating agent, silver coating agent, conductive resin, and the like. Compared with the prior art, the laser processing apparatus of the present invention places the laser head 11δ and the wind t in close proximity, and both of them emit laser and gas perpendicular to the circuit board 13〇, so the laser is irradiated on the circuit. The welded portion 132 of the plate 130 reads the local wind generated by the wind pipe called the gas, and the welded portion m of the circuit board m is bonded to the connecting portion (4) of the substrate (10) to reduce the pitch. Further, since the duct m is pressed in a non-contact manner to press the circuit board no and the substrate (10) by means of ejecting gas, the solder flow between the lines of the circuit board 130 is not affected. Moreover, the glue portion of the circuit board 130 can also be cooled by wind pressure, so it is not easy to burn. While the present invention has been described in its preferred embodiments, the present invention is not intended to limit the invention, and various modifications and changes may be made without departing from the spirit and scope of the invention. The scope of the invention is defined by the scope of the appended claims. [Simple description of the diagram] The first figure is a schematic diagram of the laser s-shot of the soldering flexible circuit board and the substrate. Figure 2 is a schematic view of the soldering portion and the substrate of the functional board. The third ® is a schematic view of the weeping device of the present invention. Fig. 4 is a schematic view showing a laser beam generated by a laser beam of the first embodiment of the present invention. Fig. 5 is a view showing a laser generated by a laser of a laser processing apparatus according to a second embodiment of the present invention, which is irradiated onto a circuit board. 201117905 [Explanation of main component symbols] 10 Laser head 12 Flexible circuit board 14 Substrate 16 Connection part 18 Welded part 100 Laser processing apparatus 112 Laser oscillator 114 Duct 116 Laser head 118 Outer tube 120 Air supply unit 130 Circuit board 112 Laser Oscillator 122 Lens 124 Nozzle 132 Weld 140 140 Substrate 142 Connection 144 Opening 146 Air outlet 150 Side tube 152'252 Conduit 115 Solder supply