TW201116366A - Grinding tool trimmer with protection film and its protection film formation method - Google Patents

Grinding tool trimmer with protection film and its protection film formation method Download PDF

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Publication number
TW201116366A
TW201116366A TW98138551A TW98138551A TW201116366A TW 201116366 A TW201116366 A TW 201116366A TW 98138551 A TW98138551 A TW 98138551A TW 98138551 A TW98138551 A TW 98138551A TW 201116366 A TW201116366 A TW 201116366A
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Taiwan
Prior art keywords
protective film
dresser
abrasive
tool
amorphous
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TW98138551A
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Chinese (zh)
Inventor
Rong-Fang Chen
Guang-Ren Ma
Chong-Li Zhao
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Rong-Fang Chen
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Priority to TW98138551A priority Critical patent/TW201116366A/en
Publication of TW201116366A publication Critical patent/TW201116366A/en

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Abstract

A grinding tool trimmer with a protection film and its protection film formation method are provided. The grinding tool trimmer with a protection film comprises a substrate and an amorphous oxide film. The substrate has a main body, a plurality grinding particles and at least a combination layer. The combination layer is coated on the surface of the main body. The grinding particles have a first part and a second part, wherein the first part is exposed to the combination layer surface, and the second part is embedded into the combination layer. The amorphous oxide film is covered on the surfaces of the substrate, grinding particles and combination layer. The amorphous oxide film is coated and deposited on the surface of the grinding tool trimmer by the sol-gel technique to form a protection film on the surface of the grinding tool trimmer, such that the grinding tool trimmer can be resistant to acid or base corrosion, thereby increasing the service life of the grinding tool trimmer.

Description

201116366 ·· 六、發明說明: 【發明所屬之技術領域】 一種具保護膜之研磨工具修整器及其保護膜成形方法,尤指 -種於研磨工絲整n表面批覆_層抗雜之保频及批覆該保 護膜於研磨工具修整器之保護膜成形之方法。 【先前技術】 按現行於半導體各項製程中係使用各類不同之酸鹼溶液,尤 • 其以化學機械研磨(CMP)製程當中研磨各類材質之晶圓如陶瓷、 梦玻璃、石吳及金屬等材料必須添加化學研磨漿搭配研磨墊進 行研磨之作業,所述研磨墊於研磨作業進行過程當中,所述研磨 墊表面係會卡固前述搭配研磨作業使用之研磨漿内之研磨粒子及 前述晶圓所研磨所切削之材料粒子,故需使用修整器將所述研磨 墊進行清理’所述修整器與研磨墊相互作用時,所述研磨墊中仍 具有酸或鹼之物質或溶液,所述酸或鹼之物質及溶液係將會腐蝕 φ 該修整器,令其使用哥命大幅降低,故該項技術之人士係以化學 氣相沈積(Chemical Vapor Deposition,CVD)於該修整器表面 批覆一層疏水性保濩膜,該保護膜係主要用以保護該修整器之表 面避免遭受酸性及鹼性物質腐蝕,所述化學氣相沈積(Chemical Vapor Deposition ’ CVD)是一種用來產生純度高、性能好的固態 材料的化學技術。 半導體產業使用前述化學氣相沈積(Chemical Vap〇r Deposition’CVD)技術來成長薄膜;典型的CVD製程是將晶圓(基 201116366 底)暴露在一種或多種不同的前驅物下,在基底表面發生化學反 應或/及化學分解來產生欲沉積的薄膜;反應過程中通常也會伴隨 地產生不同的副產品,但大多會會隨著氣流被帶著,而不會留在 反應腔中。 微製程大都使用化學氣相沈積(Chemical Vapor Deposition,CVD)技術來沉積不同形式的材料,包括單晶、多晶、 非晶及磊晶材料,這些材料有矽、碳纖維、碳奈米纖維、奈米線、 奈米碳管、Si〇2、矽鍺、鎢、矽碳、氮化矽、氮氧化矽及各種不同 的high-k介質等材料,化學氣相沈積(Chemical Vap〇r Deposition ’ CVD)製程也常用來生成合成鑽石。 前述之化學氣相沈積(Chemical Vapor Deposition,CVD) 製程並非無缺點’於進行化學氣相沈前㈣需雛室中達到高 溫及高壓之氣氛,並且需將腔室⑽真空;故相對提高製造之 成本及工作效率,且化魏相沈龍可於欲鍍絲面進行鑛層批 覆’孔隙間並無法批覆,工作物受限於化學氣相沈積機具之腔體 大小及沈積薄膜時間長亦同樣為化學氣相沈積之缺點 :故習知技 術具有下列缺點: 1. 成本過而; 2. 工作效率低; 3. 無法大量生產; 4·僅可於工作物表面鍍膜; 5.設備昂貴。 201116366 f發明内容】 器。本發明之主要目的在提供—種具有保護膜之研磨工具修整 膜的ft的在提供—種於研磨工具_表面被附保護 為達到上述之目的本發明係提供 整器,所述研虹具修整雜構,係研磨工具修 質氧化物薄臈,該紐且右士 ’、匕3·一基材及至少-非晶 所述結合概·該本體表面 及—結合層, -笛1人…姑 等研磨顆粒具有一第一部分及 八wH〃—縣外露於㈣結合層絲,所述第-部 分彼入别述結合層内;所述非晶質氧 =第一# 等研磨顆粒與結合層表面。 相覆^絲材及該 為達到上目的本翻储供 具修整器之保制成形方法,心人 ,、保》之研磨工 具觸,购^=膠=^驟:細一研磨工 s 對所柄磨工具修整ϋ表面塗佈 化物薄膜,再者,對所述研磨工具修整器整體進 灯餘處理’冑後賴麵紅具雜錄 膜f進行燒結’以確保前述非晶質氧化物_可穩=著= 研磨工具修整器之表面。 【實施方式】 本發明之上述目的及其結構與功能上的特性,將依據所附圖 式之較佳實施例予以說明。 請參閱第;l、la、lb圖,係為本發明之實施例之研磨工具修 整器之剖面示賴及觸放賴,本發明之研缸具修整器i結 201116366 構’係包含:一基材11、一非晶質氧化物薄膜12。 該基材11具有一本體111及複數研磨顆粒112及一結合層 Π3 ’所述結合層ι13披附於該本體⑴表面,該等研磨顆粒 具有一第一部分1121及一第二部分H22,所述第一部分1121外 露於前述結合層113表面,所述第二部分1122嵌入前述結合層113 内。 前述研磨顆粒112係選自於鑽石、多晶鑽石、立方氮化硼、 多晶立方氮化硼及其組合所組成之群組。 所述本體111係可選擇為金屬及塑膠及陶瓷及玻璃及石墨其 中任一。 所述結合層113係可選擇為金屬及塑膠及陶瓷及玻璃及石墨 其中任一。 所述非晶質氧化物薄膜12覆蓋前述基材η及該等研磨顆粒 112與結合層Π3表面; 所述非晶質氧化物薄膜12係包含複數顆粒12丨,該等顆粒121 係選自於Ah〇3 (氧化鋁)及Si〇2 (氧化矽)及Zr〇2 (氧化锆)及 Ca〇(氧化辦)及K2〇(氧化卸)及Ti〇2(氧化鈦)所組成之群組。 所述非晶質氧化物薄膜12係可為單層或複數層,並可由單一 材質或由複數材質相互重疊披附所組成(如第lb圖所示)。 請參閱第2、3圖,係為本發明之具保護膜之研磨工具修整器 之保護膜成形方法之流程圖及披附薄膜示意圖,所述研磨工具修 整器之保護膜成形方法係包含下列步驟: ^ 步驟S1 ··提供一研磨工具修整器; 準備-研磨工具修整器卜係可先將表面做清潔處理,例如 201116366 •’可職研磨工具健n 1放置純水中再置於超音波清洗機(圖中 未表示)中震盛’將表面之不清潔物去除。 步驟S2 :以溶膠郷法對所述研磨工具修整器表面塗佈至少 一非晶質氧化物薄膜; 所述溶膠凝膠法係選自於前述祕(氧化銘)及·(氧化 矽)及Zr〇2 (氧化錯)及Ca0(氧化辦)及K2〇(氧化卸)及Ή〇2(氧化 鈦)顆粒所組成之群組之顆粒121浸泡於水溶液2中,並令所述水 φ溶液2及前述任-材質顆粒注入一槽體3内均句混合,其後將前 述研磨工具雜器1浸泡於前述槽體3之水溶液中,並將該研磨 工具修整器1#置,最後再將該研磨工具修磐器丨從水溶液2中 榜出或將水溶液2全數由槽體3中漏除,令前述顆粒121附著於 該研磨工具修整器1表面。 本實施例之溶膠凝膠法更包含下列步驟: 田研磨工具修整器1以i⑻〜2〇〇mm/min速度浸入水溶液2内,當 研磨工具修整器1下緣接觸液面時,要暫停2〜5秒。 研磨工具修整器1完全浸入液面後,要暫停10~30秒。 研磨工具修整器1拉出液面時,拉昇速度為40〜120mni/min,當 基材11完全拉出液面後,要暫停3〇〜6〇秒。 所述溶膠凝膠法之方式可選自於浸泡式及构淋式及描塗式及喷 霧式及旋轉塗佈式其中任一。 步驟S3 :對所述研磨工具修整器整體進行乾燥處理; 將刖述進行完沈積非晶質氧化物薄膜12之研磨工具修整器J 表面進行乾燥處理,當進行乾燥處理時係可將研磨工具修整器1 置於室溫下進行,或將研磨工具修整器1置放於高溫烤箱(圖中 201116366 未表不)+進仃乾縣理,並將高溫烤箱之溫度設定界於 度’乾燥溫度越騎可驗乾燥作業之時間。 /本實施例之乾祕辦料待研磨工具修整器 1表面水紋消 失後再取下m烤’其之棋烤溫度腕/:1小時或nc/20 分鐘。 工具修整器塗佈有非晶質薄膜之處進行 步驟S4 :將前述研磨 燒結。 —為了 7研磨卫具修整||丨表面的非晶質氧化物薄膜丨2可穩固 附著於挪磨工具修整||丨表面,故需進行燒結作業將所述研 L具fm 1置放於燒結爐(圖巾未表示)内,並將燒結溫度 «又定於200 800度並持續一段時間,最後將研磨工具修整器1由 燒結爐内取H步驟係可令該研磨工具修整器丨表面之非晶 質氧化物薄膜12緊密貼合於該表面。 =述較佳之燒結條件為55(rc/2()分鐘或75叱/5分鐘。 。請參閱第4圖,如圖所示,於進行步驟S4將前述研磨工具修 整^ 1塗佈有非晶質(am()rphQUS)氧錄細12之處進行燒结 之前,更可包含-步驟S5將該研磨工具修整器i表面之研磨粒° 112大端處之非晶質氧化物薄膜12移除(如第5圖所示)。 本發明實施例中各製造方法步驟中所使用之材料係為忠信科 技顧問公司(台灣)職供之奈総縣面預處理劑,產 A-⑽’其主要成分為氧化鋁奈米粒子,粒徑剔卿,含量】/· 請f品特性:比重L咖.⑽,閃火點〉靴’外觀無色透明〇 ’ pH 值 7. 〇±〇. 5。 ^ n 之另一材料係為忠 本發明實施例中各製造方法步驟中所使用 201116366 .信科技(台灣)所提供之奈綠縣面碱_,產品編 號T-80 ’其主要成分為二氧化鈦奈米粒子及界面活性劑粒徑^ 10nm ’含量〇. 8% ;產品特性: 比重1. 〇1±〇. 〇3 ’閃火點>i〇〇〇c,外觀金黃色透明液體,油 值7. 0±0· 5 ;燥作溫度3〇±5t:。 需陳明者,以上所麵為本案之雛實關,麟用以限制 本發明,若縣侧之縣所作之改變,在魏離本發明精神範 圍内’例如:對於構形或佈置型態加以變換,對於各觀化,修 飾”應用’所產生等效作用,均應包含於本案之權利範圍内,人 予陳明。 σ 綜上所述,本發明之具保護膜之研磨工具修整器及其保護膜 j形方法於使㈣’為確魏_其功效及目的,故本發明誠為 實用性優異之創作,為符合發明專利之申請要件麦依法提出 申明’盼料早日賜准本案,以保障發明人之辛苦創作,偏若 狗局審委有任何稽疑,請不絲函指示,創作人定當竭力配合, 實感德便。 【圖式簡單說明】 第1圖係為本發明之實施例之研缸具修魏之剖面示意圖; 第la圖係為本發明之實施例之研磨工具健器之剖面局部放大示 意圖; ^ lb圖係為本發明之實施例另—研紅具修整器之結構示意圖; 2圖係為本發明之實施例之研磨工具修整器之保護膜成形方法 之流程圖; 第3圖係為本發明之實施例之批覆雜示意圖; 201116366 第4圖係為本發明$ s .+ 另一實施例之研磨工具修整器之保護膜成形 方法之流程圖; 第5圖係為本發明之實施例 【主要元件符號說明】磨構不思圖。 研磨工具修整器1 基材11 本體111 研磨顆粒112 第一部分1121 第二部分1122 結合層113 非晶質氧化物薄膜12 顆粒121 水溶液2 槽體3201116366 ················································································ And a method of coating the protective film on the protective film of the polishing tool dresser. [Prior Art] Various types of acid-base solutions are used in various semiconductor processes. In particular, they use a chemical mechanical polishing (CMP) process to polish wafers of various materials such as ceramics, dream glass, and stone. The material such as metal must be added with a chemical polishing slurry and a polishing pad for grinding. The polishing pad is used to fix the abrasive particles in the slurry used in the polishing operation and the foregoing. The wafer is ground to cut the material particles, so the polishing pad needs to be cleaned using a dresser. When the dresser interacts with the polishing pad, the polishing pad still has an acid or alkali substance or solution. The acid or alkali substance and solution will corrode φ the dresser, so that the use of the life is greatly reduced, so the person of this technology is chemical vapor deposition (CVD) on the surface of the dresser a layer of hydrophobic film, the protective film is mainly used to protect the surface of the dresser from corrosion by acidic and alkaline substances, the chemical vapor deposition Chemical Vapor Deposition (CVD) is a chemical technique used to produce high purity, high performance solid materials. The semiconductor industry uses the aforementioned Chemical Vap〇r Deposition'CVD technology to grow thin films; a typical CVD process exposes wafers (base 201116366) to one or more different precursors, which occur on the surface of the substrate. Chemical reactions or/and chemical decomposition to produce a film to be deposited; different by-products are usually produced concomitantly during the reaction, but most of them will be carried along with the gas stream and will not remain in the reaction chamber. Most of the micro-processes use Chemical Vapor Deposition (CVD) to deposit different forms of materials, including single crystal, polycrystalline, amorphous and epitaxial materials. These materials are tantalum, carbon fiber, carbon nanofiber, and nai. Rice, nanocarbon, Si〇2, tantalum, tungsten, tantalum carbon, tantalum nitride, niobium oxynitride and various high-k media, chemical vapor deposition (Chemical Vap〇r Deposition ' CVD Processes are also commonly used to generate synthetic diamonds. The aforementioned chemical vapor deposition (CVD) process is not without defects. Before the chemical vapor deposition (IV), the atmosphere of high temperature and high pressure is required in the embryonic chamber, and the chamber (10) needs to be vacuumed; Cost and work efficiency, and Wei Xiang Shen Long can apply for the mineral layer to be coated on the plated surface. The pores cannot be overlapped. The size of the workpiece limited by the chemical vapor deposition machine and the length of the deposited film are also the same. Disadvantages of chemical vapor deposition: The prior art has the following disadvantages: 1. Cost is too low; 2. Low work efficiency; 3. Unable to mass production; 4. Can only be coated on the surface of the work; 5. The equipment is expensive. 201116366 f invention content] device. SUMMARY OF THE INVENTION The main object of the present invention is to provide a turret for a polishing tool having a protective film, and to provide a device for protecting the surface of the abrasive tool Hybrid, the grinding tool repairs the thin oxide oxide, the New York and the right, and the at least a non-amorphous combination of the body surface and the bonding layer, - flute 1 person... The abrasive particles have a first portion and eight wH〃-counter exposed to the (four) bonding layer filament, the first portion is incorporated into the other bonding layer; the amorphous oxygen = first # and other abrasive particles and the bonding layer surface . Covering the wire and the method of forming the shape of the trimmer for the purpose of the above-mentioned dumping and feeding device, the grinding tool of the heart, the guarantee, the purchase of ^= glue = ^ sudden: fine one grinder s The handle grinding tool trims the surface coating film, and further, the polishing tool trimmer is subjected to a lamp rest process, and the rear surface of the polishing device is sintered to ensure the aforementioned amorphous oxide. Steady = = = the surface of the abrasive tool dresser. [Embodiment] The above object of the present invention, as well as its structural and functional features, will be described in accordance with the preferred embodiments of the drawings. Please refer to the drawings; l, la, and lb, which are schematic diagrams of the abrasive tool dresser of the embodiment of the present invention, and the touch fixture of the present invention has a structure of: Material 11, an amorphous oxide film 12. The substrate 11 has a body 111 and a plurality of abrasive particles 112 and a bonding layer 3'. The bonding layer ι13 is attached to the surface of the body (1). The abrasive particles have a first portion 1121 and a second portion H22. The first portion 1121 is exposed on the surface of the aforementioned bonding layer 113, and the second portion 1122 is embedded in the bonding layer 113. The abrasive particles 112 are selected from the group consisting of diamonds, polycrystalline diamonds, cubic boron nitride, polycrystalline cubic boron nitride, and combinations thereof. The body 111 can be selected from the group consisting of metal and plastic and ceramic, and glass and graphite. The bonding layer 113 can be selected from the group consisting of metal and plastic and ceramic, and glass and graphite. The amorphous oxide film 12 covers the surface of the substrate η and the abrasive particles 112 and the bonding layer 3; the amorphous oxide film 12 comprises a plurality of particles 12, wherein the particles 121 are selected from Groups of Ah〇3 (alumina) and Si〇2 (yttria) and Zr〇2 (zirconia) and Ca〇 (oxidation) and K2〇 (oxidation) and Ti〇2 (titanium oxide) . The amorphous oxide film 12 may be a single layer or a plurality of layers, and may be composed of a single material or a plurality of materials overlapping each other (as shown in Fig. 1b). Please refer to FIG. 2 and FIG. 3 , which are a flow chart of a protective film forming method for a polishing tool dresser with a protective film according to the present invention, and a schematic diagram of a coated film. The protective film forming method of the polishing tool dresser comprises the following steps. : ^ Step S1 ·· Provide a grinding tool dresser; Preparation - Grinding tool dresser can first clean the surface, such as 201116366 • 'Available grinding tool n n placed in pure water and then placed in ultrasonic cleaning The machine (not shown) Zhong Zhensheng' removes the surface of the non-cleaning material. Step S2: coating at least one amorphous oxide film on the surface of the polishing tool dresser by a sol method; the sol-gel method is selected from the above-mentioned secrets (Oxidation) and (yttria) and Zr The particles 121 of the group consisting of 〇2 (oxidation error) and Ca0 (oxidation) and K2〇 (oxidation removal) and Ή〇2 (titanium oxide) particles are immersed in the aqueous solution 2, and the water φ solution 2 is And the above-mentioned any-material particles are injected into a tank body 3, and then the grinding tool 1 is immersed in the aqueous solution of the tank body 3, and the grinding tool dresser 1# is placed, and finally The abrasive tool repairer 榜 is listed from the aqueous solution 2 or the entire aqueous solution 2 is leaked from the tank body 3, so that the aforementioned particles 121 are attached to the surface of the abrasive tool conditioner 1. The sol-gel method of this embodiment further comprises the following steps: The field grinding tool dresser 1 is immersed in the aqueous solution 2 at a speed of i(8)~2〇〇mm/min, and is suspended when the lower edge of the grinding tool dresser 1 contacts the liquid surface. ~5 seconds. After the abrasive tool dresser 1 is completely immersed in the liquid level, it should be suspended for 10 to 30 seconds. When the abrasive tool dresser 1 pulls out the liquid surface, the pulling speed is 40 to 120 mni/min, and after the substrate 11 is completely pulled out of the liquid surface, it is suspended for 3 〇 6 6 seconds. The sol-gel method may be selected from the group consisting of a immersion type and a structure type and a draw type, and a spray type and a spin coat type. Step S3: drying the whole of the grinding tool dresser; drying the surface of the grinding tool dresser J on which the amorphous oxide film 12 is deposited, and trimming the grinding tool when performing the drying process 1 is placed at room temperature, or the abrasive tool trimmer 1 is placed in a high temperature oven (not shown in the figure 201116366) + into the dry county, and the temperature of the high temperature oven is set to the degree 'dry temperature Ride the time of the drying operation. / The dry material of this embodiment is to be grinded by the tool dresser. 1 After the surface water pattern is lost, remove the m-baked ‘the chess baking temperature wrist/: 1 hour or nc/20 minutes. Where the tool dresser is coated with the amorphous film, step S4: the aforementioned grinding is sintered. - For the 7-grinding fixture trimming||The amorphous oxide film 丨2 on the surface of the crucible can be firmly attached to the surface of the boring tool trimming||丨, so the sintering operation is required to place the slab of fm 1 on the sinter In the furnace (not shown), and the sintering temperature « is set at 200 800 degrees for a period of time, and finally the grinding tool dresser 1 is taken from the sintering furnace H step system to make the grinding tool dresser surface The amorphous oxide film 12 is in close contact with the surface. = The preferred sintering condition is 55 (rc/2 () minutes or 75 叱 / 5 minutes. Please refer to Figure 4, as shown in the figure, in the step S4, the aforementioned grinding tool is trimmed and coated with amorphous Before the sintering of the mass (am()rphQUS) oxygen recording 12, it may further comprise - step S5 to remove the amorphous oxide film 12 at the large end of the abrasive grain 112 of the surface of the abrasive tool conditioner i. (As shown in Fig. 5.) The materials used in the steps of the manufacturing methods in the embodiments of the present invention are the nephew pretreatment agents of the Zhongxin Science and Technology Consulting Company (Taiwan), which produces A-(10)' Ingredients: Alumina nanoparticles, particle size, content] / · Please f characteristics: specific gravity L. (10), flash point> boots 'appearance colorless transparent 〇' pH 7. 〇 ± 〇. 5. ^ The other material of n is the 201116366 used in the steps of the manufacturing method in the embodiment of the invention. The Naixiangxian base _ provided by Xin Technology (Taiwan) _, the product number T-80 'its main component is titanium dioxide nano Particle and surfactant particle size ^ 10nm 'content 〇. 8%; product characteristics: specific gravity 1. 〇1±〇. 〇3 'flash point &g t; i〇〇〇c, the appearance of golden yellow transparent liquid, oil value 7. 0 ± 0 · 5; dry work temperature 3 〇 ± 5t:. Need to be clear, the above is the case of the case, Lin In order to limit the present invention, if the change made by the county side of the county is within the scope of the spirit of the present invention, for example, the transformation of the configuration or arrangement type, the equivalent effect of the application of the modification, All of them should be included in the scope of the right in this case, and the person shall give it to Chen Ming. σ In summary, the abrasive tool dresser with protective film of the present invention and the protective film j-shaped method thereof enable (4) to be The purpose, therefore, the invention is a creation with excellent practicality. In order to meet the application requirements of the invention patent, Mai has affirmed that it is expected to grant the case as soon as possible to protect the inventor’s hard work. Please do not direct the letter, the creator will try his best to cooperate, and the real feelings are good. [Simplified illustration of the drawings] Fig. 1 is a schematic view of the cross section of the grinding cylinder of the embodiment of the present invention; The section of the grinding tool of the embodiment is partially enlarged Intentional; ^ lb diagram is a schematic diagram of the structure of the red dresser for the embodiment of the invention; 2 is a flow chart of the method for forming the protective film of the abrasive tool dresser of the embodiment of the invention; The schematic diagram of the batch coating according to the embodiment of the present invention; 201116366 FIG. 4 is a flow chart of the protective film forming method of the abrasive tool dresser of another embodiment of the present invention; FIG. 5 is the implementation of the present invention. Example [Main component symbol description] Grinding tool is not considered. Abrasive tool trimmer 1 Substrate 11 Body 111 Abrasive particles 112 First part 1121 Second part 1122 Bonding layer 113 Amorphous oxide film 12 Particle 121 Aqueous solution 2 Tank 3

Claims (1)

201116366 .. 七、申請專利範圍: 1. 一種具保護膜之研磨工具修整器,係包含: 一基材,具有一本體及複數研磨顆粒及一結合層,所述結合層 彼附於該本體表面,該等研磨顆粒具有一第一部分及一^ 一 部分,所述第一部分外露於前述結合層表面,所述第二部分 嵌入前述結合層内; 纟少一非晶質氧化物薄膜’覆蓋於前述基材及該等研磨顆粒與 結合層表面。 2. 如申請專利範圍第1項所述之具保護膜之研磨工具修整器,其 中所述非晶質氧化物薄膜係包含複數顆粒,該等顆粒係選自 於Ah〇3(氡化鋁)及Si〇2(氧化矽)及Zr〇2(氧化錯)及(氧 化鈣)及私0(氧化鉀)及Ti〇2(氧化鈦)所組成之群組。 3. 如申請專利範圍第1項所述之具保護膜之研紅絲整器,其 巾所述研細粒健自於鑽石及Μ鑽石及立域化棚及多 晶立方氮化删所組成之群組。 4. 如申請專利細第1項所述之具保護膜之研磨工具修整器,其 中所述基㈣可選擇為金屬及塑膠及喊及玻璃及石墨其中 任一。 5_如申明專利範圍第1項所述之具保護膜之研磨工具修整器,其 中所述結合層係可選擇為金屬及塑膠及陶究及玻璃及石墨其 中任一。 6·如申明專利_第1項所述之具保護膜之研磨卫具修整器其 201116366 中所述具保護膜之研磨工具修整器係為用以修整半導體晶圓 之CMP裝置中之研磨墊。 7. —種具保護膜之研磨工具修整器之保護膜成形方法,係包含下 列步驟: 提供一研磨工具修整器; 以溶膠凝膠法對所述研磨工具修整器表面塗佈至少一非晶質 (amorphous)氧化物薄膜; 對所述研磨工具修整器整體進行乾燥處理;及 · 將則述塗佈有非晶質(am〇rph〇us)氧化物薄膜之研磨工具修整 器進行燒結。 八/ 8.如申清專利範圍第7項所述之具保護膜之研磨工具修整器之保 護膜成形方法’其中所述非晶質氧化物薄膜係包含複數顆粒, 該等顆粒係選自於Ah〇3 (氧化鋁)及Si〇2 (氧化矽)及Zr〇2 (氧 化錯)及CaO(氧化紛及爾氧化鉀)及Ti〇2(氧化鈦)所組成之 群組。 9·如申請專·圍第7猶狀具賴膜之研磨工具修整器之保籲 護膜成形方法’其t所述乾燥處理之溫度係為5()_雇度。 10.如申請專雜圍第7稿狀具賴膜之研磨工具修整器之保 護膜成形方法,其中所述燒結溫度係為2〇〇_8〇〇度。 11·如申請專利範圍第7項所述之具保護膜之研磨工^修整器之保 護膜成形方法,其中乾燥處理係可至於常溫下進行處理。 12.如申請專利範圍第7項所述之具保護膜之研磨工具修整器之保 護膜成形方法,其中溶膠凝膠法塗佈方式可選自於浸泡纽构 淋式及描塗式及喷霧式及旋轉塗佈式其中任一。 12 201116366 利範圍第7項所述之具保護膜之研磨工具修整器之保 1成形方法’其中將前述塗佈有非晶質(a_h〇us)氧化 物:膜之研磨工具修整器進行燒結之步驟前,更包含將該研磨 整器表面研磨顆粒尖端處%^ (a_tos) H 物薄膜移除。 13201116366.. VII. Patent Application Range: 1. A polishing tool dresser with a protective film, comprising: a substrate having a body and a plurality of abrasive particles and a bonding layer, the bonding layer attached to the body surface The abrasive particles have a first portion and a portion, the first portion is exposed on the surface of the bonding layer, and the second portion is embedded in the bonding layer; the amorphous oxide film is reduced to cover the foregoing And the abrasive particles and the surface of the bonding layer. 2. The abrasive tool conditioner of claim 1, wherein the amorphous oxide film comprises a plurality of particles selected from the group consisting of Ah 3 (an aluminum telluride). And a group consisting of Si〇2 (yttria) and Zr〇2 (oxidation error) and (calcium oxide) and private 0 (potassium oxide) and Ti〇2 (titanium oxide). 3. In the case of applying the protective film of the red silk splicer as described in item 1 of the patent scope, the granules of the granules are composed of diamonds and enamel diamonds and the shed and polycrystalline cubic nitriding. Group of. 4. The abrasive tool conditioner according to claim 1, wherein the base (4) may be selected from the group consisting of metal and plastic, and shouting glass and graphite. 5_ The abrasive tool dresser having a protective film according to claim 1, wherein the bonding layer is selected from the group consisting of metal and plastic, ceramics, and glass and graphite. 6. The abrasive dresser having a protective film according to the above-mentioned claim _1, wherein the protective tool dresser according to the method of the present invention is a polishing pad in a CMP apparatus for trimming a semiconductor wafer. 7. A protective film forming method for a polishing tool dresser comprising a protective film, comprising the steps of: providing a grinding tool dresser; coating at least one amorphous material on the surface of the grinding tool dresser by a sol-gel method (amorphous) an oxide film; drying the entire polishing tool dresser; and sintering the abrasive tool dresser coated with an amorphous (am〇rph〇us) oxide film. 8. The protective film forming method of the abrasive tool dresser with a protective film according to claim 7, wherein the amorphous oxide film comprises a plurality of particles selected from the group consisting of Ah〇3 (alumina) and Si〇2 (yttria) and Zr〇2 (oxidation) and CaO (oxidized potassium oxide) and Ti〇2 (titanium oxide). 9. If you apply for a special tool, the method of forming the film is as follows: The temperature of the drying process is 5 () _ employment. 10. The method for forming a protective film of an abrasive tool dresser of the seventh embodiment of the present invention, wherein the sintering temperature is 2 〇〇 8 〇〇. 11. The method for forming a protective film of a polishing machine with a protective film according to claim 7, wherein the drying treatment can be carried out at room temperature. 12. The method for forming a protective film of a polishing tool dresser having a protective film according to claim 7, wherein the sol-gel coating method is selected from the group consisting of a soaking neoform shower and a spray coating and a spray. Any of the formulas and spin coating. 12 201116366 The method for forming a polishing tool dresser with a protective film according to item 7 of the present invention, wherein the above-mentioned abrasive tool dresser coated with an amorphous (a_h〇us) oxide: film is sintered. Before the step, the film of the %^(a_tos) H at the tip of the abrasive particle on the surface of the polishing device is further removed. 13
TW98138551A 2009-11-13 2009-11-13 Grinding tool trimmer with protection film and its protection film formation method TW201116366A (en)

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Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN104084884A (en) * 2014-07-03 2014-10-08 南京三超金刚石工具有限公司 CMP flake grinding trimmer and production method thereof
US9651434B2 (en) 2014-10-03 2017-05-16 Industrial Technology Research Institute Pressure array sensor module and manufacturing method thereof and monitoring system and monitoring method using the same
TWI604001B (en) * 2016-08-05 2017-11-01 三芳化學工業股份有限公司 Polishing pad, polishing apparatus and method for manufacturing polishing pad

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN104084884A (en) * 2014-07-03 2014-10-08 南京三超金刚石工具有限公司 CMP flake grinding trimmer and production method thereof
US9651434B2 (en) 2014-10-03 2017-05-16 Industrial Technology Research Institute Pressure array sensor module and manufacturing method thereof and monitoring system and monitoring method using the same
TWI604001B (en) * 2016-08-05 2017-11-01 三芳化學工業股份有限公司 Polishing pad, polishing apparatus and method for manufacturing polishing pad

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