TW201116075A - Flat speaker structure - Google Patents

Flat speaker structure Download PDF

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Publication number
TW201116075A
TW201116075A TW98135270A TW98135270A TW201116075A TW 201116075 A TW201116075 A TW 201116075A TW 98135270 A TW98135270 A TW 98135270A TW 98135270 A TW98135270 A TW 98135270A TW 201116075 A TW201116075 A TW 201116075A
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TW
Taiwan
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speaker
substrate
group
supports
support
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TW98135270A
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Chinese (zh)
Inventor
Wei-Chung Lee
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Ind Tech Res Inst
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Priority to TW98135270A priority Critical patent/TW201116075A/en
Publication of TW201116075A publication Critical patent/TW201116075A/en

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Abstract

A speaker structure introduced herein includes a vibrating film, a porous electrode, a substrate having many holes, a frame supporting member which is used to fixate the vibrating film and the substrate at two opposite sides, and at least a set of supporting members disposed on the substrate and between the substrate and the vibrating film. Each of the sets of supporting members may include at least two strip-like elements, and the area between strip-like elements of the same set of supporting member does not overlap with the holes. Alternatively, each of the sets of supporting members may include a dot-like element and at least one strip-like element, and the area between the dot-like element and the strip-like elements of the same set of supporting member does not overlap with the holes.

Description

201116075 P51980017TW 31772twf.doc/n 六、發明說明: 【發明所屬之技術領域】 本發明是關於一種平面式揚聲器,且特別是關於一 種具有支撐體結構的平面式靜電揚聲器。 【先前技術】 現今視覺與聽覺是人類最直接的兩種感官反應,因 此長久以來,科學家們極力的發展各種可再生視覺與聽覺 相關系統。目前包括揚聲器的再生方式,其主要仍是由動 圈^揚聲器來主宰整個市場。但是隨著近幾年來人們對於 感官品質的日益要求,以及3C產品(c〇mputer、 日umCati〇n、consumer dectr〇nics)在追求短小輕薄 聲Π二種省€ '輕L人體工學需求設計的揚 的i機:2配大尺寸的平面揚聲11 ’還是小到隨身聽 =幾丄,的手機,在可以預見的明天,此方面的技 術將有大1的需要與應用的發展。 而㈣目前電聲揚聲11分類主要分為直接、間接輕射型, °方式大概分為動圈式、壓電式及靜電式揚聲器φ, 圈式揚聲器目前使用最卢, 弋%ί盗。動 構的缺點,」 帛 成沾,不過由於其先天架 ^ 亚…法將體積扁平化,使得面對3C產η#* 越小及f庭劇院扁平化的趨勢,將不符需求。產扣越來 壓電式揚聲器利用電壓材料的壓 電場於壓電_所造成材料變形- 知是鱗然結構爲平微小化,值於聲音品質上有 201116075 P51980017TW3l772twf.d〇c/n 所限制 機純靜電揚聲11目料市場主要為觀(Hi_end)的耳 11 y,傳統靜電式揚聲器的作用原理是 固定電極挾持慕雷扭描# # 疋肝两片開孔的 、、化厭、, 電 成一種電容器,藉由供給振膜直 2B 1及給予兩個固定電極音頻的交流電壓,利用正倉 =====帶動導電振膜振動並將聲音轄射出 I㈣ίΐ靜電式%聲器的偏壓需達數百至上千伏特,需 要卜接^價及魔大體積的擴大機,因此無法普及。 聲11製作’其設計方式够制單—單體的 °又祌生產方式,如美國第3,894,199號專利内容。 關於靜電式揚聲H ’如美國第3,894,199號專利,主 要是揭露-種電聲轉翻(Eleetn)a_tie t_d_)結 構’如圖1所示,包括置於兩側的固定電極⑺二 electrodes) 11〇與12〇。此固定電極11〇與12〇具有多個 開孔可散佈所產生的聲音。而—振膜(Vibfatingmm) 13〇 則配置在固定電極110與12〇之間。而固定結構14〇則為 絕緣材料所構成,並用以固定所述的固定電極110、12〇 以及振膜130。固定電極11〇與12〇分別經由變壓器15〇 連接到一父流電壓源16〇<5當交流信號傳送到固定電極 與120時,電位將會交替地改變而使振膜13〇受到兩側電 位的差異產生震動,藉以產生對應的聲音。然而,上述配 置的方式需增強聲壓輸出,因此需格外的功率元件配合驅 動,如此一來,不但裝置體積龐大,且使用元件較多:成 本亦較高。另外,由於固定結構14〇必須固定所述的固定 201116075 P51980017TW 31772twf.doc/n 電極110、120以及振膜130,因此,這樣的電聲轉換考妹 構無法達到可撓曲的特性。 另外,傳統的技術於量產上需以逐一完成個別單 體,且揚聲基本都有一固定大小或外型的限制,因此無 ,有效大量製造與降低成本,並且在外觀上無法達到軟= 薄、低驅動電壓及可撓曲等特性。 Φ 【發明内容】 在一實施範例中,提供一種聲器結構。此揚聲器結 構具有軟、薄、低驅動電壓及可撓曲等特性,且包括振膜、 開孔電極具有夕個開孔的基底、用以固定振膜與基底於 對應兩側的框架支撐體、以及至少一組配置於基底之上以 及於基底與振膜之間支撐體。其中,每一組支撐體可以由 至少兩個條狀元件所構成,且同一組支撐體的條狀元件之 間的區域不會與開孔重疊;或者,每一組支撐體可以由一 雜70件與至少—個條狀元件所構成,且同—組支樓體的 9 , 點狀元件與條狀元件之間的區域不會與開孔重疊。 透過上述的基底與支撐體之配置方式Γ可節省材 料:在使用印刷方法製作支撐體時可使材料易於固化、且 可以使在支撐體上黏膠與貼合的製程易於執行此 體的製程與上黏膠的製程之困難二進而 提升揚聲态出聲品質。 為讓本發明之上述特徵和優點能更明顯易懂, 特牛較佳貫施例,並配合所附圖式,作詳細說明如下。 201116075 P51980017TW 31772twf.doc/n 【實施方式】 依據本發明之一實施例,揚聲器裝置可包括基底、 位於基底上方之振膜、位於振膜上方之電極、多個第一支 撐體以及多個第二支撐體。尤其,第一或在較高的腔室 (Chamber)被包圍在電極與振膜之間,而第二或較低的 腔室則被包圍在振膜與基底之間。在較高腔室的空間中提 供第一支撐體’而在較低腔室的空間中提供第二支撐體, 這些可以稱為音室(Sound chamber )。 在某些實施例中,支撐體可具有不同的配置圖案或 向度’這些可依照不同的應用或規格而變化。可將音室会士 構放置在對應於揚聲器的傳聲孔(S〇niferous hole)區域對 面之空間’也就是較高的腔室’並且第—支撐體的位置與 第二支撐體的位置可以是對稱的。在各種實施例中,根^ 各種設計需求或考量,第一支撐體的數目可大於、等於咬 小於第二支撐體的數目。 在部分實施例中’平面靜電揚聲器的音室結構可經 由整合現有製造平面靜電揚聲器的製程予以製造,因此; 合大量生產。. 、 當振膜受到外部電壓激勵時,平面靜電揚聲器可根 據振膜的表面依照振膜材料的電荷特性與靜電力而^形^ 原理操作。振膜的變形驅動圍繞振膜的空氣以致產^乘 音。根據靜電力公式及能量定律可導出或估計施加在振= 上的力。舉例來說,此力可以是整個揚聲界 、 部的電場及輸人電壓一般而言,施加在振膜上的力/大内 201116075 P51980017TW 31772twf.doc/n 聲音輸出變得越大。 靜電揚聲器可設計成輕、薄及/或可撓曲。在某些實 施例中,具有輕、薄及/或可橈曲的特徵之音室結構可放置 在位於揚聲器的傳聲孔區域對面之空間。音室結構可包括 位於基底之上之多個適當的支撐體,這些支撐體可以是第 二支樓體。音室支撐體與支撐體可分別予以製造或形成於 基底或振膜電極之上。支撐體可使用或不使用黏著劑 (Adhesive)’而放置在電極、基底或振膜之上。而這些音 室支撐體也可以事先製造完成,並接著放置在振膜與基底 之間。支稽體的佈局(Layout)可依照一項或多項設計考 量而變化,例如振膜的靜電效應、其頻率響應等等。 支撐體的佈置設計可根據音頻特性以不同的圖案或 高度來設計位於支撐體對面的平面靜電揚聲器空間内的支 撐體,這些支撐體可以是第一支撐體。在一實施例中,音 室可包含能增強音場(Sound field)的遠場效應(Far-field effect)及/或全向效應(Omni-directivity effect)之吸音材 料。 在一實施例中,平面靜電揚聲器的音室結構設計可 包括音室空間内的支撐體。可根據例如聽覺的頻率需要、 頻率響應或其他的聽覺或結構的因素之設計考量來調整或 最佳化支撐體的設計。上述設計變化至少可包括支撐體的 放置方式及高度之變化。舉例來說,支撐體可具有點狀、 網狀、十字形、任何其他的形狀、或兩種或更多種形狀的 組合。在不同的設計考量下公式化設計也可包括根據聽覺 201116075 P51980017TW 31772twf.doc/n 的頻率需要、頻率響應或其他的聽覺或結構的考量來調整 任兩個相鄰的支撐體之間的距離。 利用轉印(Transfer printing)、轉貼(Decaling)或 例如噴印(Inkjet printing)或網版印刷(Screenprinting) 之直接印刷(Directprinting)在基底之上以便製造支撐體。 在另貝加例之中’可精由直接黏者(Direct adhesion )來 製造支撐體。舉例來說,可事先製造支撐體,接著將事先 製造的支撐體放置於開孔電極與振膜之間或於基底與振膜 之間。利用直接黏著或不直接黏著至下面的振膜、基底或 開孔電極可將支撐體放置於振膜、基底或開孔電極之上。 在其他的實施例中’可利用蝕刻(Etching)、光微影 (Photolithography )及/或黏著劑配料 (Adhesive-dispensing)技術來製造支撐體。 參照圖2,對於位在任兩層相鄰的支撐體之間的振膜 210,揚聲器200可具有幾個工作區。振膜21〇的兩邊能以 相同方式定義或以不同方式定義其工作區。所綠示之音室 結構可具有兩個腔室空間,以便產生揚聲器的共鳴音場或 效應’其中一個位於振膜210的上方且一個位^其下方。 揚聲器200可具有多個支撐體,這些支撐體可設計成具有 特定的形狀且放置在較高及較低腔室空間之内。在一實施 例中’圖2之較高腔室空間可以是傳聲孔區域,並且在傳 聲孔區域對面的圖2之較低腔室空間可以是音室結構 272。位於基底260與振膜210之間的較低腔室的空間可經 由位於任兩個相鄰的音室支撐體之間的多個振膜工作區來 201116075 P51980017TW 31772twf.doc/n 產生揚聲器200的共鳴音場。 揚聲器單元200可包括振膜210、開孔電極220、框 架支撐體(Frame supporting member) 230以及位於電極 220與振膜210之間的多個支標體240。在位於電極層220 對面的振膜210 —側,具有可被基底260及位於振膜210 與基底260之間的多個支撐體270包圍或部分包圍之音室 結構272。基底260、支撐體270、以及其包圍的音室結構 φ 272是選擇性的’亦即揚聲器結構可以不包括基底260、支 撐體270、以及其包圍的音室結構272。振膜21〇可包括駐 極體層212及金屬薄膜電極214。在某些實施例中,駐極 體層212的上表面212a可電耦合框架支撐體230及支撐體 240,並且駐極體層212的下表面212b可電耦合上述金屬 薄膜電極214。絕緣層216可夾在駐極體層212與電極214 之間。 開孔電極220可由金屬所構成。在一實施例中,開 孔電極22〇亦可由例如紙或一種極薄(Extremely thin )不 鲁 冑電的材料上’鑛上-層金屬薄膜在上述紙或不導電的材 料上。 “虽開孔電極220由鍍上一層金屬薄膜層之不導電的 材料層所構成時,此不導電的材料可以是塑膠、橡膠、紙、 不導電的布(棉纖維或聚合物纖維)或其他的不導電的材 料;並且此金屬薄膜可以是鋁、金、銀、銅、鎳/金雙金屬、 氧化銦錫(Indium tin oxide,IT0 )、氧化銦鋅(];ndium zinc oxide ; IZO )、大分子導電材料聚二氧乙烯噻吩 201116075 P51980017TW 31772twf.doc/n (Polyethylenedioxythiophene ; PEDOX)等等·、人 或者所列示之材料或其等效材料的任何組合。當 220使用導電的材料時,此導電的材料可以是^ = 銅=或其合金導電的布(金屬纖維、氧化物金乂維、、 石反纖維或石墨纖維)等等,或者這些材料或其他材料的 何組合。 ’此材料可予以處理 或充電而保留靜電荷達-段時間或—個延伸的時間區間, 並且在充電之後於此材料内具有駐電效應或靜電效應。駐 極體層m可具有一層或多層介電層。介電材料的例子包 括聚全氟乙丙烯(Fluorinated hylenepropylene ; FEp)、聚 四氟乙烯(Polytetrafluoethylene ; PTFE )、聚偏二氟乙烯 (Polyvinylidene fluoride ; PVDF)、氟聚合物材料或其他 的適當材料。上述介電質材料可包括具有微米等級或奈米 等級直徑的孔洞。因為駐極體層212可保留靜電荷達一延 伸時間區間之久,並且可在接受充電處理之後具有壓電特 性,所以在振膜内的孔洞可增進傳輸且增強此材料的壓電 特性。在一實施例中,在電暈充電(c〇r〇na charging)之 後可產生雙極性電荷(Dipolar charges )且保留於介電質材 料内以產生駐電效應或靜電效應。 、 為了提供振膜210的良好張力及/或振動效應,金屬 薄膜電極214可以是很薄的金屬薄膜電極。舉例來說,其 厚度可以在0.2微米與〇·8微米之間或〇.2微米與0.4微米 之間。在某些實施例中可以是大約0.3微米。所繪示之尺 201116075 P51980017TW 31772twf.d〇c/n 度範圍通常視為「超薄」。 舉具有負電荷的駐極體層212為例,當供應輸入音 ,訊號給具有孔洞的開孔電極22〇及金屬薄膜電極214 牯,輸入訊號之正電壓可對振膜的負電荷產生吸引力,並 且輸入訊號之負電壓可對此單元的負電荷產生排斥力,因 而使振膜210以一方向移動。相對地,當輸入音源訊號的 電壓相位改變時’同樣地正電壓可對振膜的負電荷產生吸 • 引力,並且負電壓可對此單元的負電荷產生排斥力,因而 使振膜210以前段所述方向之反方向移動。振膜可重複地 來回移動且振動壓縮周圍空氣,以經由不同的方向之不同 的力之互動來產生聲音。 在一實施例中,薄膜250可覆蓋揚聲器單元20〇的 一邊或兩邊。薄膜250可以是透氣但防水的,例如由包含 膨體聚四敗乙烯(Expanded polytetrafluoroethyiene ; ePTFE)等等之G0RE-TEX®薄膜所構成。gore-TEX®或 類似的材料能預防水及氧的效應,因而避免駐極體層212 _ 漏失其電荷及降低其駐電效應。 振膜210的多個工作區可形成於任兩個相鄰的支撐 體240之間以及上述開孔電極220與振膜21〇之間。較高 腔室242的這些工作區可用以產生揚聲器2〇〇的共鳴音 %。振膜210的多個工作區可形成於任兩個相鄰的支撐體 270之間以及基底260與振膜210之間。較低腔室272的 這些工作區也可用以產生揚聲器2〇〇的共鳴音場。可調整 支撐體240及支撐體270兩者的室中位置、高度以及形狀 11 201116075 P519800l7TW31772twf.doc/n 作為揚聲态設計的一部分。此外,支撐體27〇的數目可大 於等於或小於支撐體240的數目,並且可直接製造支撐 體240或支撐體270於開孔電極220或基底260之上或其 上方° 音^室結構接近振膜210的金屬薄膜電極214的表 面,可藉由考量揚聲器的音頻特性或其他的聽覺或結構的 予以設計。音室可包括吸音材料;並且支撐體或音室 茅體可設計成各種形狀。框架支撐體23〇所形成的室空 =在框架支撐體謂之中具有音孔,以便釋放所產生= 聲曰的壓力,並且在某些例子中產生較好的音場效應。 H為了提高上述揚聲器低頻響應的音質表現,可以提 撐體的高度。但是,在利用印刷技術提高支 ==製程中’隨著支撐體高度的增加,除了印刷膠 困難用里而大量增加外,膠材的固化(Curing)也將越加 此支種具有支撐體結_平面式揚聲器。 省材料’且使用印刷方法製作支撐體時 二r進與上黏膠的製 -種揚3a至3f ’其各為朗本㈣之—實施例之 302A且耳有^基底與支撐體的示意圖。圖3A中的基底 A有夕個開孔3〇6A,且具有至少一組支撐體配於 土- 2A上以及於基底302A與振膜(未繪示)之間,其 12 201116075 P51980017TW 31772twf.doc/n 中每一組支撐體由至少兩個條狀元件304A所構成,且同 組支撐體的條狀元件之間形成凹陷區域,該凹陷區域可 為溝槽或間隔區域或凹部,且凹陷區域不會與開孔重疊。如 圖3A所示,此些組支撐體將基底3〇2A分割成多個區域。 在本實施例中’此些區域為矩形,但也可以為其他形狀, 例如環形、其他任意形狀、或以上之任意組合。此外,請 參照圖3B,在此實施例中,基底3〇2B以及條狀元件3〇4B • 的配置與在圖3A中十分類似,不同之處在於基底3〇2B上 的開孔306B的數量可以更多,或隨著設計需求進行調整。 請參照圖3C,在此實施例中,基底302C上的支撐體也是 具有4本狀元件304C,只是支撐體以不同於圖3A中的配置 方式,將基底302C分割成多個區域,其中主要差異在於支 撐體交叉處之形式不一樣如圖3B與3C所示。例如,在支樓 體的條狀元件304B所構成的結構中,條狀元件於十字交叉 處相父,且於十子父叉處構成凹陷區域;在支撐體的條狀元 件304C所構成的結構中,條狀元件於十字交叉處互不相 父 '而疋其所形成的長條狀凹陷區域相交。在圖3d至3F 中,更可以在基底302D、302E與302F週邊設置至少一組 週邊支撐體,此些週邊支撐體是由條狀元件3〇8D、3〇8E 與308F所構成。在圖3D至3F中,條狀元件3〇4D、304E 與304F以及開孔3〇6D、306E與306F則分別與在圖3A 至3C中的配置相似。此外,值得注意的是,在上述圖3a 至3F中,基底302A至302F可以為開孔電極,亦即上述 的支撐體為配置於振膜與開孔電極之間。 13 201116075 P51980017TW31772twf.d〇c/n 透過上述的基底與支撐體之配置方式,可節省材 料、在使用印刷方法製作支撐體時可使材料易於固化、且 可以使在支撐體上黏膠與貼合的製程易於執行。藉此,可 以降低製作支撐體的製程與上黏膠的製程之困難度,進而 提升揚聲器出聲品質。此外,透過上述的配置方式,支撐 體可以具有導膠功能,增加貼附能力。 士此外,請參照圖4’其為依照本發明之一實施例之一 種私聲益之基底與支撐體的示意圖。相較於圖3a至3J?, 圖4中的基底402為圓形,具有多個開孔,且具有至 φ 少一組支撐體配置於基底402上以及於基底4〇2與振膜(未 繪不)之間,其中每一組支撐體由至少兩個條狀元件4〇4 所構成,且同一組支撐體的條狀元件之間形成凹陷區域, 該凹陷區域可為溝槽或間隔區域或凹部等,且凹陷區域不 會與開孔重疊。如圖4所示,此些組支撐體將基底4〇2分 割成多個區域。在本實施例中,此些區域為環形,但也可 以為其他形狀,例如矩形、其他任意形狀、或以上之任意 組合。此外,更可以在基底402週邊設置至少一組週邊I 撐體’此些週邊支撐體是由條狀元件408所構成。值得注 意的是,在圖4中,基底402可以為開孔電極,亦即上述 的支撐體為配置於振膜與開孔電極之間。 接著’請參照圖5A至5D,其各為依照本發明之一 貫施例之一種%聲益'之基底與支撐體的示意圖。圖5A中 的基底502A具有多個開孔506A,且具有至少一組支樓體 配置於基底502A上以及於基底502A與振膜(未繪示)之 14 201116075 間’其中每—組支樓體由至少兩個條狀元件綱A所構成 且同一組支撑體的條狀元件之間形成 ι_1ϊ —ιοί- rr·^ Έττ- -201116075 P51980017TW 31772twf.doc/n VI. Description of the Invention: [Technical Field] The present invention relates to a planar speaker, and more particularly to a planar electrostatic speaker having a support structure. [Prior Art] Nowadays, vision and hearing are the two most direct sensory responses of human beings. Therefore, scientists have been developing various regenerative visual and auditory related systems for a long time. At present, the way of regenerating the speaker is mainly dominated by the moving coils to dominate the entire market. However, with the increasing demands on sensory quality in recent years, and 3C products (c〇mputer, umCati〇n, consumer dectr〇nics) in the pursuit of short and light and soothing two provinces 'light L ergonomic needs design Yang's i-machine: 2 with large-sized flat speakers 11 'still small to the Walkman = a few 丄, the phone, in the foreseeable tomorrow, this aspect of the technology will have a big need for the development of the application. (4) At present, the classification of electroacoustic sounds is mainly divided into direct and indirect light-emitting types. The ° method is roughly divided into moving coil type, piezoelectric type and electrostatic type speaker φ. The ring type speaker is currently used the most lucrative, 弋%ί thief. The shortcomings of the fascination, " 帛 沾 , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , The piezoelectric speaker of the piezoelectric speaker uses the piezoelectric field of the voltage material to deform the material caused by the piezoelectric material. It is known that the scale structure is flat and the value is limited by the sound quality of 201116075 P51980017TW3l772twf.d〇c/n. The machine pure electrostatic speaker 11 mesh material market is mainly for the view (Hi_end) ear 11 y, the traditional electrostatic speaker is based on the principle of fixed electrode holding Murray twisted # # 疋 liver two pieces of open, 厌,,, Electron into a capacitor, by supplying the diaphragm straight 2B 1 and giving the AC voltage of the two fixed electrode audio, using the positive bin ===== to drive the vibrating diaphragm of the conductive diaphragm and igniting the sound out of the I (four) ΐ electrostatic EMF The pressure needs to be hundreds to thousands of volts, and it is necessary to expand the size of the machine and the size of the magic machine, so it cannot be popularized. Acoustic 11 is made in a way that is designed to produce a single-unit, and is produced in the form of a patent, such as U.S. Patent No. 3,894,199. Regarding the electrostatic type H', as in the US Patent No. 3,894,199, it is mainly disclosed that the structure of the electro-acoustic turn (Eleetn) a_tie t_d_) is as shown in Fig. 1, including the fixed electrodes (7) placed on both sides. ) 11〇 and 12〇. The fixed electrodes 11A and 12A have a plurality of openings for distributing the sound generated. The diaphragm (Vibfatingmm) 13〇 is disposed between the fixed electrodes 110 and 12〇. The fixed structure 14A is made of an insulating material and is used to fix the fixed electrodes 110, 12A and the diaphragm 130. The fixed electrodes 11〇 and 12〇 are respectively connected to a parent voltage source 16 via the transformer 15〇<5. When the alternating current signal is transmitted to the fixed electrode and 120, the potential will be alternately changed to cause the diaphragm 13 to be subjected to both sides. The difference in potential produces a shock, which produces a corresponding sound. However, the above configuration requires enhanced sound pressure output, so that extra power components are required to be driven together, so that the device is bulky and uses more components: the cost is also higher. In addition, since the fixed structure 14A must fix the fixed electrodes 110160, 120, 120 and the diaphragm 130, such an electroacoustic conversion test structure cannot achieve the flexible characteristics. In addition, the traditional technology needs to complete individual monomers one by one in mass production, and the sound has basically a fixed size or shape limitation, so no, effective mass production and cost reduction, and can not achieve soft = thin in appearance Low drive voltage and flexibility. Φ [Summary of the Invention] In an embodiment, a sounder structure is provided. The speaker structure has the characteristics of softness, thinness, low driving voltage and flexibility, and includes a diaphragm, a perforated electrode having a base with an opening, a frame support for fixing the diaphragm and the base on the corresponding sides, And at least one set of supports disposed on the substrate and between the substrate and the diaphragm. Wherein, each set of support body may be composed of at least two strip-shaped elements, and the area between the strip-shaped elements of the same set of support bodies does not overlap with the openings; or each set of support bodies may be composed of a miscellaneous 70 The member is formed of at least one strip-like member, and the region between the point-like member and the strip-like member is not overlapped with the opening. Through the above-mentioned arrangement of the substrate and the support, the material can be saved: the material can be easily cured when the support is produced by the printing method, and the process of bonding and bonding on the support can be easily performed. The difficulty of the process of the upper glue further enhances the sound quality of the sound state. In order to make the above features and advantages of the present invention more comprehensible, the detailed description of the present invention will be described in detail with reference to the accompanying drawings. 201116075 P51980017TW 31772twf.doc/n [Embodiment] According to an embodiment of the present invention, a speaker device may include a substrate, a diaphragm located above the substrate, an electrode above the diaphragm, a plurality of first supports, and a plurality of second Support body. In particular, the first or higher chamber is enclosed between the electrode and the diaphragm, and the second or lower chamber is enclosed between the diaphragm and the substrate. The first support body is provided in the space of the higher chamber and the second support body is provided in the space of the lower chamber, which may be referred to as a sound chamber. In some embodiments, the support can have a different configuration pattern or orientation' which can vary depending on the application or specification. The chamber chamber can be placed in a space corresponding to the speaker's S〇niferous hole area, that is, a higher chamber, and the position of the first support and the position of the second support can be It is symmetrical. In various embodiments, the number of first supports may be greater than, equal to, the number of bites being less than the number of second supports. In some embodiments, the sound chamber structure of a 'flat-type electrostatic speaker can be manufactured by a process of integrating existing manufacturing of a planar electrostatic speaker, and thus, mass production. When the diaphragm is excited by an external voltage, the planar electrostatic speaker can operate according to the surface of the diaphragm according to the charge characteristics of the diaphragm material and the electrostatic force. The deformation of the diaphragm drives the air surrounding the diaphragm to produce a sound. The force applied to the vibration = can be derived or estimated according to the electrostatic force formula and the energy law. For example, the force can be the entire sounding field, the electric field of the part, and the input voltage. Generally speaking, the force applied to the diaphragm/large inside 201116075 P51980017TW 31772twf.doc/n The sound output becomes larger. The electrostatic speaker can be designed to be light, thin and/or flexible. In some embodiments, a sound chamber structure having light, thin, and/or distorted features can be placed in a space opposite the sound hole area of the speaker. The sound chamber structure can include a plurality of suitable supports on the substrate, which can be the second building. The chamber support and the support may be fabricated separately or formed on the substrate or diaphragm electrode. The support can be placed over the electrode, substrate or diaphragm with or without an adhesive. These chamber supports can also be fabricated in advance and then placed between the diaphragm and the substrate. The layout of the body can vary depending on one or more design considerations, such as the electrostatic effect of the diaphragm, its frequency response, and so on. The arrangement of the support may be designed in a different pattern or height depending on the audio characteristics of the support in the plane of the planar electrostatic speaker opposite the support, which may be the first support. In one embodiment, the chamber may comprise a sound absorbing material that enhances the far field effect and/or the Omni-directivity effect of the sound field. In one embodiment, the sound chamber structure design of the planar electrostatic speaker can include a support within the sound chamber space. The design of the support can be adjusted or optimized based on design considerations such as auditory frequency requirements, frequency response, or other auditory or structural factors. The above design changes may include at least a change in the placement and height of the support. For example, the support may have a dot shape, a mesh shape, a cross shape, any other shape, or a combination of two or more shapes. Formulating the design under different design considerations may also include adjusting the distance between any two adjacent supports based on the frequency requirements, frequency response, or other auditory or structural considerations of auditory 201116075 P51980017TW 31772twf.doc/n. Transfer printing, decaling or direct printing such as Inkjet printing or screen printing is applied over the substrate to produce a support. In the other Bega example, the support can be made by direct adhesion. For example, the support can be fabricated in advance, and then the previously produced support is placed between the apertured electrode and the diaphragm or between the substrate and the diaphragm. The support can be placed over the diaphragm, substrate or apertured electrode using a diaphragm, substrate or aperture electrode that is directly or not directly adhered to the underlying membrane. In other embodiments, the support can be fabricated using Etching, Photolithography, and/or Adhesive-dispensing techniques. Referring to Figure 2, for a diaphragm 210 positioned between any two adjacent supports, the speaker 200 can have several working areas. Both sides of the diaphragm 21 can define or define their working areas in the same manner in different ways. The green sound chamber structure can have two chamber spaces to create a resonant sound field or effect of the speaker' one of which is above the diaphragm 210 and below one of the diaphragms. The speaker 200 can have a plurality of supports that can be designed to have a particular shape and placed within the upper and lower chamber spaces. In one embodiment, the higher chamber space of Figure 2 can be a sound hole area, and the lower chamber space of Figure 2 opposite the sound hole area can be a sound chamber structure 272. The space of the lower chamber between the substrate 260 and the diaphragm 210 can be produced by the plurality of diaphragm working areas between any two adjacent chamber supports 201116075 P51980017TW 31772twf.doc/n Resonate the sound field. The speaker unit 200 may include a diaphragm 210, a perforated electrode 220, a frame supporting member 230, and a plurality of subscripts 240 positioned between the electrode 220 and the diaphragm 210. On the side of the diaphragm 210 opposite the electrode layer 220, there is a sound chamber structure 272 which is surrounded or partially surrounded by the substrate 260 and a plurality of supports 270 located between the diaphragm 210 and the substrate 260. The substrate 260, the support 270, and the chamber structure φ 272 it surrounds are selective 'that is, the speaker structure may not include the substrate 260, the support 270, and the sound chamber structure 272 enclosed thereby. The diaphragm 21A may include a body layer 212 and a metal film electrode 214. In some embodiments, the upper surface 212a of the electret layer 212 can electrically couple the frame support 230 and the support 240, and the lower surface 212b of the electret layer 212 can electrically couple the metal thin film electrode 214 described above. The insulating layer 216 can be sandwiched between the electret layer 212 and the electrode 214. The aperture electrode 220 may be composed of metal. In one embodiment, the aperture electrode 22 can also be formed on the paper or non-conductive material by, for example, paper or an extremely thin, non-lubricated material. "When the aperture electrode 220 is composed of a layer of non-conductive material coated with a metal film layer, the non-conductive material may be plastic, rubber, paper, non-conductive cloth (cotton fiber or polymer fiber) or other Non-conductive material; and the metal film may be aluminum, gold, silver, copper, nickel/gold bimetal, indium tin oxide (IT0), indium zinc oxide (], ndium zinc oxide; IZO), Macromolecular conductive material polydioxyethylene thiophene 201116075 P51980017TW 31772twf.doc/n (Polyethylenedioxythiophene; PEDOX), etc., human or any combination of listed materials or their equivalent materials. When 220 uses conductive materials, this The conductive material may be ^ = copper = or its alloy conductive cloth (metal fiber, oxide gold 、, stone fiber or graphite fiber), etc., or any combination of these materials or other materials. Treated or charged to retain static charge for a period of time or an extended time interval, and have a resident or electrostatic effect in the material after charging. The electret layer m can have There are one or more dielectric layers. Examples of dielectric materials include Fluorinated hylene propylene (FEp), Polytetrafluoroethylene (PTFE), Polyvinylidene fluoride (PVDF), and fluorine polymerization. Materials or other suitable materials. The above dielectric materials may include holes having a micron or nanometer diameter. Because the electret layer 212 can retain static charge for an extended time interval and can be subjected to charging treatment It has piezoelectric properties, so holes in the diaphragm enhance transmission and enhance the piezoelectric properties of the material. In one embodiment, bipolar charges can be generated after corona charging (Dipolar) Charges) and remain in the dielectric material to create a resident or electrostatic effect. To provide good tension and/or vibration effects of the diaphragm 210, the metal film electrode 214 can be a very thin metal film electrode. The thickness may be between 0.2 microns and 8 microns or between 2 microns and 0.4 microns. In some embodiments it may be approximately 0.3 μm. The scale shown is 201116075 P51980017TW 31772twf.d〇c/n The range is usually considered to be “ultra-thin”. Taking the electret layer 212 having a negative charge as an example, when an input sound is supplied and the signal is applied to the aperture electrode 22 and the metal thin film electrode 214 having the holes, the positive voltage of the input signal can attract the negative charge of the diaphragm. And the negative voltage of the input signal can generate a repulsive force to the negative charge of the unit, thereby causing the diaphragm 210 to move in one direction. In contrast, when the voltage phase of the input sound source signal changes, 'the same positive voltage can generate a suction force on the negative charge of the diaphragm, and the negative voltage can generate a repulsive force to the negative charge of the unit, thus causing the diaphragm 210 to be in the previous stage. The direction moves in the opposite direction. The diaphragm repeatedly moves back and forth and vibrates to compress the surrounding air to produce sound through interaction of different forces in different directions. In one embodiment, the film 250 may cover one or both sides of the speaker unit 20''. Film 250 may be breathable but water resistant, such as a G0RE-TEX® film comprising Expanded polytetrafluoroethyiene (ePTFE) or the like. Gore-TEX® or similar materials prevent the effects of water and oxygen, thus avoiding the electret layer 212 _ losing its charge and reducing its electrification effect. A plurality of working areas of the diaphragm 210 may be formed between any two adjacent supports 240 and between the aperture electrodes 220 and the diaphragm 21A. These working areas of the higher chamber 242 can be used to produce a resonance sound % of the speaker 2 。. A plurality of working areas of the diaphragm 210 may be formed between any two adjacent supports 270 and between the substrate 260 and the diaphragm 210. These working areas of the lower chamber 272 can also be used to create a resonant sound field of the speaker 2〇〇. The position, height and shape of the chamber of both the support body 240 and the support body 270 can be adjusted. 11 201116075 P519800l7TW31772twf.doc/n As part of the design of the sound state. In addition, the number of the support bodies 27〇 may be greater than or less than the number of the support bodies 240, and the support body 240 or the support body 270 may be directly fabricated on or above the aperture electrode 220 or the substrate 260. The surface of the metal film electrode 214 of the film 210 can be designed by considering the audio characteristics of the speaker or other hearing or structure. The sound chamber may include a sound absorbing material; and the support body or the sound chamber body may be designed in various shapes. The chamber space formed by the frame support body 23 has a sound hole in the frame support body to release the pressure generated by the sonar, and in some cases, produces a better sound field effect. In order to improve the sound quality of the above-mentioned speaker low frequency response, the height of the body can be improved. However, in the process of using printing technology to improve the support == process, as the height of the support increases, in addition to the difficulty in printing the plastic, the curing of the rubber will also increase the support. _ flat speaker. When the material is used and the support is produced by the printing method, the two-in-and-over-adhesive-types 3a to 3f' are each a Longben (four)--the embodiment of 302A and the ear has a schematic diagram of the substrate and the support. The substrate A in FIG. 3A has an opening 3〇6A, and has at least one set of support disposed on the soil-2A and between the substrate 302A and the diaphragm (not shown), 12 201116075 P51980017TW 31772twf.doc Each set of support members in /n is composed of at least two strip-shaped members 304A, and a recessed region is formed between the strip-like members of the same set of support members, and the recessed regions may be grooves or spaced regions or recesses, and the recessed regions Does not overlap with the opening. As shown in Fig. 3A, these sets of supports divide the substrate 3〇2A into a plurality of regions. In the present embodiment, the regions are rectangular, but may be other shapes such as a ring shape, any other shape, or any combination of the above. In addition, referring to FIG. 3B, in this embodiment, the configuration of the substrate 3〇2B and the strip-shaped member 3〇4B• is very similar to that in FIG. 3A, except that the number of the openings 306B on the substrate 3〇2B is different. Can be more or adjusted as the design needs. Referring to FIG. 3C, in this embodiment, the support on the substrate 302C also has a 4-shaped element 304C, except that the support is divided into a plurality of regions by a configuration different from that in FIG. 3A, wherein the main difference is The form at the intersection of the supports is different as shown in Figures 3B and 3C. For example, in the structure formed by the strip-shaped member 304B of the branch body, the strip-shaped member is the father at the intersection, and the concave portion is formed at the ten-legged parent fork; the structure formed by the strip-shaped member 304C of the support body In the middle, the strip-shaped elements are not in the same place at the intersection of the cross-sections, and the long strip-shaped recessed areas formed by them intersect. In Figs. 3d to 3F, at least one set of peripheral supports may be provided around the bases 302D, 302E and 302F, and the peripheral supports are constituted by strip members 3?8D, 3?8E and 308F. In Figs. 3D to 3F, the strip members 3〇4D, 304E and 304F and the openings 3〇6D, 306E and 306F are similar to the configurations in Figs. 3A to 3C, respectively. Further, it is to be noted that, in the above-mentioned Figs. 3a to 3F, the substrates 302A to 302F may be open-cell electrodes, that is, the above-mentioned support body is disposed between the diaphragm and the aperture electrode. 13 201116075 P51980017TW31772twf.d〇c/n Through the above-mentioned arrangement of the substrate and the support, the material can be saved, the material can be easily cured when the support is produced by the printing method, and the adhesive can be adhered to the support. The process is easy to implement. Thereby, the difficulty in the process of manufacturing the support and the process of the upper adhesive can be reduced, thereby improving the sound quality of the speaker. In addition, through the above configuration, the support body can have a glue guiding function to increase the attaching ability. Further, please refer to Fig. 4' which is a schematic view of a substrate and a support for a private sound according to an embodiment of the present invention. Compared to FIGS. 3a to 3J, the substrate 402 in FIG. 4 is circular, has a plurality of openings, and has a set of supports to φ disposed on the substrate 402 and on the substrate 4〇2 and the diaphragm (not Between the two, each set of supports is composed of at least two strip elements 4〇4, and a recessed area is formed between the strip elements of the same set of supports, and the recessed area may be a groove or a spaced area Or a recess or the like, and the recessed area does not overlap the opening. As shown in Fig. 4, these sets of supports divide the substrate 4〇2 into a plurality of regions. In this embodiment, the regions are annular, but may be other shapes, such as rectangular, any other shape, or any combination of the above. Further, at least one set of peripheral I struts may be disposed around the periphery of the substrate 402. The peripheral supports are formed of strip members 408. It is to be noted that in Fig. 4, the substrate 402 may be an apertured electrode, that is, the support is disposed between the diaphragm and the aperture electrode. Next, please refer to Figs. 5A to 5D, which are schematic views of a substrate and a support body of a % sound benefit according to one embodiment of the present invention. The substrate 502A in FIG. 5A has a plurality of openings 506A, and has at least one set of the column body disposed on the substrate 502A and between the substrate 502A and the diaphragm (not shown) 14 201116075 'where each group of the building body Ι_1ϊ—ιοί- rr·^ Έττ- is formed between at least two strip-shaped elements A and between strip-like elements of the same set of supports

任意組合。對於圖5A的實施例, 亦可如圖5B所示,增加 v成凹陷區域,該凹陷區 陷區域不會與開孔重 • ㈤孔506B的數量’或隨著設計需求進行調整。在圖冗盥 5D中,更可以在基底502C與5〇2D週邊設置至少一組週 邊支撐體,此些週邊支樓體是由條狀元件5〇8c與5〇8〇所 構成。在圖5C與5D中,條狀元件5〇4c與5〇4D以及開 孔>506C與506D則分別與在圖5入與53中的配置相似, 也就是圖5D增加了許多的開孔506D。值得注意的是,在 上述圖5A至5D中,基底502A至502D可以為開孔電極, 亦即上述的支撐體為配置於振膜與開孔電極之間。 明參照圖6A與6B ’其各為依照本發明之一實施例 _ 之一種揚聲器之基底與支撐體的示意圖。圖6A中的基底 602A具有多個開孔606A,且具有至少一組支撐體配置於 基底602A上以及於基底602A與振膜(未繪示)之間,其 中每一組支撐體由至少兩個條狀元件604A所構成,且同 組支撐體的條狀元件之間形成凹陷區域,該凹陷區域可 為溝槽或間隔區域或凹部等,且凹陷區域不會與開孔重 疊。如圖6A所示,此些組支撐體分散分佈於該基底6〇2A 之上。在本實施例中’此些組支撐體為環形,但也可以為 15 201116075 P51980017TW 31772twf.doc/n 其他形狀,例如矩形、十字型、其他任意形狀、或以上之 任意組合。此外,圖6B中,更可以在基底6〇2B週邊設置 至少一組週邊支撐體,此些週邊支撐體是由條狀元件6〇8B 所構成。在圖6B中’條狀元件604B以及開孔6〇6B則與 在圖6A中的配置相似。值得注意的是,在上述圖6A與 6B中,基底602A與602B可以為開孔電極,亦即上述的 支撐體為配置於振膜與開孔電極之間。 接著’請參照圖7A與7B,其各為依照本發明之一 實施例之一種揚聲器之基底與支撐體的示意圖。圖7A中 的基底702A具有多個開孔706A,且具有至少—組支撐體 配置於基底702A上以及於基底702A與振膜(未纟會示)之 間’其中支撐體由條狀元件704A-1與704A-2所構成,且 一部分支擇體將基底分割成多個區域,且另外一部分支撐 體分散分佈於該基底之上。此外,圖7B中,更可以在基 底702B週邊設置至少一組週邊支撐體,此些週邊支撐體 疋由條狀元件708B所構成。在圖7B中,條狀元件7〇4B-l 與704B-2以及開孔706B則與在圖7A中的配置相似。值 得注意的是’在上述圖7A與7B中,基底702A與702B 可以為開孔電極,亦即上述的支撐體為配置於振膜與開孔 電極之間。 請參照圖8A與8B,其各為依照本發明之一實施例 之一種杨聲益之基底與支樓體的示意圖。圖8a中的基底 802A具有多個開孔806A,且具有至少一組支撐體配置於 基底802A上以及於基底802A與振膜(未繪示)之間,其 16 201116075 P51980017TW 31772twf.doc/n 中每一組支撐體由至少一個條狀元件804A-1與一點狀元 件804A-2所構成’且同一組支撐體的點狀元件與條狀元 件之間形成凹陷區域’該凹陷區域可為溝槽或間隔區域或凹 部等’且凹陷區域不會與開孔806A重疊。如圖8A所示, 此些組支撐體分散分佈於該基底802A之上。在本實施例 中’此些條狀元件804A-1為環形’但也可以為其他形狀,random combination. For the embodiment of Fig. 5A, as shown in Fig. 5B, v may be added to the recessed area, which does not overlap with the opening number of (5) holes 506B or may be adjusted as design requirements. In Fig. 5D, at least one set of peripheral supports may be provided around the bases 502C and 5〇2D, and the peripheral support bodies are constituted by strip members 5〇8c and 5〇8〇. In Figs. 5C and 5D, the strip members 5〇4c and 5〇4D and the openings > 506C and 506D are similar to those in Figs. 5 and 53, respectively, that is, Fig. 5D has a plurality of openings 506D added. . It should be noted that in the above-mentioned FIGS. 5A to 5D, the substrates 502A to 502D may be apertured electrodes, that is, the above-mentioned support body is disposed between the diaphragm and the aperture electrode. 6A and 6B' are schematic views of a base and a support of a speaker according to an embodiment of the present invention. The substrate 602A in FIG. 6A has a plurality of openings 606A, and has at least one set of supports disposed on the substrate 602A and between the substrate 602A and the diaphragm (not shown), wherein each set of supports is composed of at least two The strip element 604A is formed, and a recessed area is formed between the strip elements of the same set of support bodies, and the recessed area may be a groove or a spacer area or a recess or the like, and the recessed area does not overlap with the opening. As shown in FIG. 6A, the group of support members are dispersedly distributed over the substrate 6〇2A. In this embodiment, the group of supports is annular, but may be 15 201116075 P51980017TW 31772twf.doc/n other shapes, such as a rectangle, a cross, any other shape, or any combination of the above. Further, in Fig. 6B, at least one set of peripheral supports may be provided around the periphery of the substrate 6〇2B, and these peripheral supports are constituted by strip-like members 6〇8B. The strip element 604B and the opening 6〇6B in Fig. 6B are similar to the configuration in Fig. 6A. It should be noted that in the above-mentioned Figs. 6A and 6B, the substrates 602A and 602B may be apertured electrodes, that is, the above-mentioned support body is disposed between the diaphragm and the aperture electrode. Next, please refer to Figs. 7A and 7B, which are schematic views of a base and a support of a speaker according to an embodiment of the present invention. The substrate 702A in FIG. 7A has a plurality of openings 706A and has at least one set of support disposed on the substrate 702A and between the substrate 702A and the diaphragm (not shown) where the support is comprised of strip elements 704A- 1 and 704A-2, and a part of the support body divides the substrate into a plurality of regions, and another part of the support is dispersedly distributed on the substrate. Further, in Fig. 7B, at least one set of peripheral supports may be provided around the base 702B, and the peripheral support bodies are constituted by strip members 708B. In Fig. 7B, the strip members 7A4B-1 and 704B-2 and the opening 706B are similar to the configuration in Fig. 7A. It is to be noted that in the above-mentioned Figs. 7A and 7B, the substrates 702A and 702B may be open-cell electrodes, that is, the above-mentioned support body is disposed between the diaphragm and the aperture electrode. Referring to Figures 8A and 8B, each is a schematic view of a substrate and a building body of a Yang Shengyi according to an embodiment of the present invention. The substrate 802A in FIG. 8a has a plurality of openings 806A, and has at least one set of supports disposed on the substrate 802A and between the substrate 802A and the diaphragm (not shown), which is in the group of 2011. Each set of support body is formed by at least one strip element 804A-1 and a point element 804A-2 and a recessed area is formed between the point element and the strip element of the same set of support. The recessed area may be a groove Or a spacer region or a recess or the like 'and the recessed region does not overlap the opening 806A. As shown in FIG. 8A, such group supports are dispersedly distributed over the substrate 802A. In the present embodiment, the strip elements 804A-1 are annular, but may be other shapes.

例如矩形、十字型、其他任意形狀、或以上之任意組合; 此些點狀元件804A-2為圓點,但其也可為方點或其他任 意形狀。此外,圖8B中,更可以在基底8〇2B週邊設置至 少一組週邊支撐體,此些週邊支撐體是由條狀元件8〇8B 所構成。在圖8B中,條狀元件804A-1、點狀元件804A-2 =及開孔806B則與在圖8A中的配置相似。值得注意的 疋’在上述圖8A與8B中,基底802A與802B可以為開 孔電極,亦即上述的支撐體為配置於振膜與開孔電極之間。 請參照圖9A與9B,其各是依照本發明之一實施例 之種揚聲益之基底與支撐體的剖面示意圖。在圖中, 設置於基底902A上的每一組支撐體9〇4A包括元件 904A-1與904A-2,其分別為如同上述任一實施例中的條 狀元件或點狀元件。元件904A-1與904A-2之間形成凹陷 區域’且元件904M與904A_2頂端一側各包括一倒角 A以便在支撐體上進行黏膠與貼合的製程時,使得膠 水易於流人凹陷區域,以降低製程_難度。其中倒角 905A可以位於兀件9G4A1與9G4a_2上遠離基底的一側, 且兩兩相對。參照圖9B ’設置於基底9_上的每一組支 201116075 P51980017TW 31772twf.doc/n 撐體904B也可以為—體成型。 狀元件與點狀元件之間的距 Λ所有以上的貫施例中’條狀元件之間的距離或條 維可以一致或不一致,而支撐 ^製作方式可以為彻轉印或轉_方式製作 ,或可以 [ 式製作,例如噴墨印刷、網板印刷、孔板印 二或刻板印化的方式製作。或者,也可以湘點膠的方 式製作或直雜基紐賴花㈣作。此外,也可以使用 ,刻的方式製作切體,例如利用光阻曝光顯·刻的方 式。 —雖然本發明已以實施例揭露如上,然其並非用以限 f本發明,任何所屬技術領域中具有通常知識者,在不脫 ,本發明之精神和範#可作些許之更動與潤飾,故 本發明之保護範圍當視後附之申料㈣圍所界定 〇 *' 【圖式簡單說明】 在此加上附圖以提供本發明的進—步理解,並且予 以=入本發明而構成本說明書的—部分。附圖緣示本發明 的貫施例且連同其說明用以解釋本發明的原理。 圖1是習知之一種電聲換能器的結構圖。 圖2是依照本發明之—實施例之—種揚聲器 圖。 〇〇圖3Α至邛各是依照本發明之一實施例之一種揚聲 益之基底與支撐體的示意圖。 201116075 r j 117TW 31772twf.doc/n 圖4是依照本發明之一實施例之一種揚聲器之基底 與支樓體的示意圖。 圖5A至5D各是依照本發明之一實施例之一種揚聲 器之基底與支撐體的示意圖。 圖6A與6B各是依照本發明之一實施例之一種揚聲 器之基底與支撐體的示意圖。 圖7A與7B各是依照本發明之一實施例之一種揚聲 器之基底與支撐體的示意圖。 圖8A與8B各是依照本發明之一實施例之一種揚聲 器之基底與支撑體的不意圖。 圖9A與9B各是依照本發明之一實施例之一種揚聲 器之基底與支撐體的剖面示意圖。 【主要元件符號說明】 110、120 :電極 130、210 :振膜 150 :變壓器 160 :電源 200 :揚聲器 212 :駐極體層 212a :駐極體層的上表面 212b :駐極體層的下表面 214 :金屬薄膜電極 216 :絕緣層 19 201116075 P51980017TW 31772twf.doc/n 220。電極層 230 :框架支撐體 240、270、904A、904B :支標體 242 :較高腔室 250 :薄膜 260、302A、302B、302C、302D、302E、302F、402、 502A、502B、502C、502D、602A、602B、702A、702B、 802A、802B、902A、902B :基底 272 :音室結構 304A、304B、304C、304D、304E、304F、308D、 308E、308F、404、408、504A、504B、504C、504D、508C、 508D、604A、604B、608B、704A-1、704A-2、704B-1、 704B-2、708B、804A-;l、804B-卜 808B :條狀元件 306A、306B、306C、306D、306E、306F、406、506A、 506B、506C、506D、606A、606B、706A、706B、806A、 806B :開孔 804A-2、804B-2 :點狀元件For example, a rectangle, a cross, any other shape, or any combination of the above; such dot elements 804A-2 are dots, but they may also be square dots or any other shape. Further, in Fig. 8B, at least one peripheral support body may be provided around the periphery of the substrate 8A2B, and these peripheral support members are constituted by the strip members 8?8B. In Fig. 8B, the strip element 804A-1, the dot element 804A-2 = and the opening 806B are similar to the configuration in Fig. 8A. Note that in the above-mentioned Figs. 8A and 8B, the substrates 802A and 802B may be open-cell electrodes, that is, the above-mentioned support body is disposed between the diaphragm and the aperture electrode. Referring to Figures 9A and 9B, each of which is a schematic cross-sectional view of a substrate and a support for raising sounds in accordance with an embodiment of the present invention. In the figure, each set of support bodies 9A4A provided on the substrate 902A includes elements 904A-1 and 904A-2, which are respectively strip-like elements or dot-like elements as in any of the above embodiments. When the elements 904A-1 and 904A-2 form a recessed area 'and the top ends of the elements 904M and 904A_2 each include a chamfer A for the process of bonding and bonding on the support body, the glue is easy to flow into the recessed area. To reduce the process _ difficulty. The chamfer 905A may be located on the side of the jaw members 9G4A1 and 9G4a_2 away from the substrate, and opposite each other. Referring to Fig. 9B', each set of branches disposed on the substrate 9_ 201116075 P51980017TW 31772twf.doc/n support 904B may also be formed into a body. The distance between the element and the point element may be the same or different from the distance or strip dimension of the 'strip element in all the above embodiments, and the support ^ can be made by the transfer or transfer method. Or it can be made by, for example, inkjet printing, screen printing, orifice printing or stereolithography. Alternatively, it can also be made in the form of Xiangjiao or in the form of a straight hybrid. In addition, it is also possible to use a cutting method to produce a cut body, for example, by means of a photoresist exposure. The present invention has been disclosed in the above embodiments, but it is not intended to limit the invention, and any one of ordinary skill in the art may, without departing, the spirit and scope of the present invention may be modified and retouched. The scope of protection of the present invention is defined by the appended claims (4) 〇*' [Simple Description of the Drawings] The accompanying drawings are hereby provided to provide a further understanding of the invention, and Part of the manual. BRIEF DESCRIPTION OF THE DRAWINGS The accompanying drawings illustrate the embodiments of the invention 1 is a structural view of a conventional electroacoustic transducer. 2 is a diagram of a speaker in accordance with an embodiment of the present invention. 3A to 3D are schematic views of a substrate and a support for sound reinforcement according to an embodiment of the present invention. 201116075 r j 117TW 31772twf.doc/n Figure 4 is a schematic illustration of a base and a building body of a loudspeaker in accordance with an embodiment of the present invention. 5A through 5D are each a schematic view of a base and a support of a speaker in accordance with an embodiment of the present invention. 6A and 6B are each a schematic view of a base and a support of a speaker in accordance with an embodiment of the present invention. 7A and 7B are each a schematic view of a base and a support of a speaker in accordance with an embodiment of the present invention. 8A and 8B are each a schematic view of a base and a support of a speaker in accordance with an embodiment of the present invention. 9A and 9B are each a schematic cross-sectional view of a base and a support of a speaker in accordance with an embodiment of the present invention. [Main component symbol description] 110, 120: Electrode 130, 210: Diaphragm 150: Transformer 160: Power supply 200: Speaker 212: Electret layer 212a: Upper surface 212b of electret layer: Lower surface 214 of electret layer: Metal Thin film electrode 216: insulating layer 19 201116075 P51980017TW 31772twf.doc/n 220. Electrode layer 230: frame support 240, 270, 904A, 904B: support 242: higher chamber 250: film 260, 302A, 302B, 302C, 302D, 302E, 302F, 402, 502A, 502B, 502C, 502D, 602A, 602B, 702A, 702B, 802A, 802B, 902A, 902B: substrate 272: sound chamber structures 304A, 304B, 304C, 304D, 304E, 304F, 308D, 308E, 308F, 404, 408, 504A, 504B, 504C, 504D, 508C, 508D, 604A, 604B, 608B, 704A-1, 704A-2, 704B-1, 704B-2, 708B, 804A-; 1, 804B-Bu 808B: strip elements 306A, 306B, 306C, 306D , 306E, 306F, 406, 506A, 506B, 506C, 506D, 606A, 606B, 706A, 706B, 806A, 806B: opening 804A-2, 804B-2: point component

基底902ASubstrate 902A

基底902BSubstrate 902B

支撐體904ASupport body 904A

支撐體904B 904A-1、904A-2 :元件Support body 904B 904A-1, 904A-2: component

倒角905AChamfer 905A

Claims (1)

201116075 P3iysu017TW 31772twf.doc/n 七、申請專利範圍: 1. 一揚聲器結構,包括: 一振膜; 一基底,具有多個開孔; 一框架支撐體, 側;以及 用以固定該振膜與該基底於對應兩201116075 P3iysu017TW 31772twf.doc/n VII. Patent application scope: 1. A speaker structure comprising: a diaphragm; a substrate having a plurality of openings; a frame support, a side; and a fixing for the diaphragm and the Base corresponding to two 至少一組支撐體,配置於該基底之上以及於該 =振膜之間,其中每—組支樓體由至少兩個條狀H斤 構成’且同—組支撐體的條^件之_成—凹陷區域, 且該些凹陷區域不與該些開孔重疊。 2.如申請專利範圍第1項所述之揚聲器結構,其中 該基底為一開孔電極。 八 3·如申請專利範圍第1項所述之揚聲器結構,其中 該些組支撐體將基底分割成多個區域。 4.如申請專利範圍第3項所述之揚聲器結構,其中 該些區域為矩形、環形、其他任意形狀、或以上之任意龟 合。 … 5. 如申請專利範圍第1項所述之揚聲器結構,其中 該些紐'支撐體分散分佈於該基底之上。 6. 如申請專利範圍第1項所述之揚聲器結構,其中 一部分該些組·支撐體將基底分割成多個區域,且另外一部 分該些組支撐體分散分佈於該基底之上。 7. 如申請專利範圍第3、5、或6項所述之揚聲器結 構’更包括至少一組位於基底週邊的週邊支撐體。At least one set of supports disposed on the substrate and between the diaphragms, wherein each of the sets of the building body is composed of at least two strips of H-jin and the same group of supports Forming a recessed area, and the recessed areas do not overlap with the openings. 2. The speaker structure of claim 1, wherein the substrate is an apertured electrode. The speaker structure of claim 1, wherein the group of supports divides the substrate into a plurality of regions. 4. The loudspeaker structure of claim 3, wherein the regions are rectangular, toroidal, any other shape, or any of the above. 5. The speaker structure of claim 1, wherein the neo-supports are distributed over the substrate. 6. The speaker structure according to claim 1, wherein a part of the group of supports divides the substrate into a plurality of regions, and another portion of the group of supports is dispersedly distributed on the substrate. 7. The speaker structure as described in claim 3, 5, or 6 further includes at least one set of peripheral supports located at the periphery of the substrate. 21 201116075 P51980017TW 31772twf.doc/n 8·如申請專利範圍第1項所述之揚聲料構,里中 該些組9支、十字型、或任意形狀的組合。 .申β專彳關第1項所述之揚聲器A構,苴中 該些組支禮體為利用轉印或轉貼的方式製作。 ’、 10.如申5月專利叙圍第i項所述之揚 該些組支樓體的條狀元件之間的距離一致或不二致。,、 η·如申請專利範圍第1項所述之揚聲器結構,其中 該些組支撐體為利用喷暮g ’、 刻板印花的方式製刷、網板_、孔板印刷、或 !2•如申請專利範圍第1項所 該些組支撲體為利用點膠的方式製作。構,、中 士 =申口月專利範圍第1項所述之揚聲器結構,其中 該些組支撐縣1:接將縣底進行壓花而製作。’、 該些組支#編fI揚聲11結構,其中 二方 述之_結構,其 ❿ e申請專利範圍第1項所述之揚聲器結構,其中 該K木狀兀件頂端—側各包括一倒角。 17. 一揚聲器結構,包括: 一振膜; 一基底,具有多個開孔; m框咖體1 基底於對應兩 22 〇17TW3l772twf.doc/n 201116075 與該振:間組i!體’配置於該基底之上以及於該基底 件轉f ’簡—組支舰的點航件與條狀元 重叠。4 Π3陷區域,且該些凹陷區域不會與該些開孔 中兮其請專利範圍第17項所述之揚聲11結構,其 孩基底為—開孔電極。 中兮此 如申請專利範圍第17項所述之揚聲器結構,立 Μ二條狀元件包圍該點狀元件。 /、 中如ΐ如 =#專概圍第17項所述之揚聲器結構,其 W狀兀件為圓點、方點、或任意形狀。 中兮此2:.+如’請專利範圍f 17項所述之揚聲器結構,其 該些組切體分散分佈於該基底之上。 包如巾請專利範圍第21項所述之揚聲器結構,更 &gt; 一紕位於基底週邊的週邊支撐體。 中兮2如申請專利範圍第17項所述之揚聲器結構,其 合,、、且支撐體為矩形、環形、十字型、或任意形狀的組 中^24’如申5月專利範圍第17項所述之揚聲器結構,其 k二組支撐體為利用轉印或轉貼的方式製作。 25.如申印專利範圍第17項所述之揚聲器結構,其 μ些組支撐體的條狀元件之間的距離一致或不一致。 26·如申印專利範圍第17項所述之揚聲器結構’其 該些組支撐體為彻噴墨印刷、網板印刷、孔板印刷、 201116075 P51980017TW 31772twf.doc/n 或刻板印花的方式製作。 27.如巾料财1γ項所述之揚聲器 中該些組支撐體為利用點膠的方式製作。 —霉其 28_如申請專利範圍第1?項所述之揚聲器結 中該些組支撐體為直接將該基底進行壓花而製作。,、 29. 如申請專利範圍第17項所述之揚聲器姓 中該些組支撐體為利用蝕刻的方式製作。 ° ^再,其 30. 如申請專利範圍第μ項所述之揚聲器結 中該餘刻的方式為光阻曝光顯影餘刻。 /、 31. 如申請專利範圍第17項所述之揚聲器結 中該些條狀元件頂端一側各包括一倒角。 /、21 201116075 P51980017TW 31772twf.doc/n 8. The combination of the nine-piece, cross-shaped, or arbitrary shape of the group of claim 1 in the invention. Shen β specializes in the speaker A structure described in item 1, which is made by transfer or reposting. </ br> 10. The distance between the strip elements of the group of buildings is the same as or equal to that stated in the item i of the May patent. , η · The speaker structure according to claim 1, wherein the group of supports is made by sneezing g ', stencil printing, stencil _, orifice printing, or! The group of the batt of the first application of the patent application range is made by means of dispensing. Structure, Sergeant = The speaker structure described in item 1 of the patent scope of Shenkou, wherein the groups support the county 1: the bottling of the county is carried out. ', these group support #编fI扬11 structure, the two of which are described in the structure, the 扬声器 e application patent scope of the speaker structure of the first item, wherein the K-wood element top-side includes one Chamfering. 17. A speaker structure comprising: a diaphragm; a substrate having a plurality of openings; a m-frame body 1 base corresponding to the two 22 〇 17TW3l772wf.doc/n 201116075 and the vibration: the group i! body 'configured in the The point navigator above the base and on the base member to the f'Jane-group ship overlaps with the strip element. 4 Π3 trapping area, and the recessed areas do not overlap with the opening 11 in the speaker 11 structure described in the patent scope, and the substrate is an open-cell electrode. For example, in the speaker structure described in claim 17, the two-shaped element surrounds the dot-like element. /, 中如ΐ如 =#Specially for the speaker structure described in item 17, the W-shaped element is a dot, a square point, or an arbitrary shape. In the speaker structure described in the '61 patent range, the group of cut bodies is dispersedly distributed on the substrate. For example, please refer to the speaker structure described in the scope of the patent, and further, a peripheral support body located at the periphery of the substrate. The middle of the speaker 2 is as claimed in claim 17 of the scope of the speaker structure, the combination, and the support body is rectangular, circular, cross-shaped, or any shape of the group ^ 24 ' as claimed in the May patent range 17 In the speaker structure, the two sets of support bodies are made by transfer or transfer. 25. The speaker structure of claim 17, wherein the distance between the strip elements of the plurality of sets of supports is uniform or inconsistent. 26. The speaker structure as described in claim 17 of the patent application, wherein the group of supports are produced by inkjet printing, screen printing, orifice printing, 201116075 P51980017TW 31772twf.doc/n or stereolithography. 27. In the speaker described in the item 1γ, the group of supports is made by dispensing. - Mildew 28_ As in the speaker set described in the scope of claim 1, the group of supports is produced by directly embossing the substrate. , 29. The speaker name as described in item 17 of the patent application is made by etching. ° ^ Further, 30. The manner in which the remainder of the speaker is described in the scope of the patent application is the photoresist exposure development. /, 31. In the speaker set of claim 17, the top side of the strip elements includes a chamfer. /, 24twenty four
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Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI483623B (en) * 2012-09-14 2015-05-01 Fortune Grand Technology Inc Speaker unit
CN110858945A (en) * 2018-08-22 2020-03-03 Dsp集团有限公司 Electrostatic loudspeaker and method for generating an acoustic signal

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI483623B (en) * 2012-09-14 2015-05-01 Fortune Grand Technology Inc Speaker unit
CN110858945A (en) * 2018-08-22 2020-03-03 Dsp集团有限公司 Electrostatic loudspeaker and method for generating an acoustic signal

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