201113969 六、發明說明： 【發明所屬之技術領域】 ί=ΓΓ 一擺臂的變形量，並產生一對應的感測數值，告 感測數值達到-門楹值時，該點測系統即停 田 避免該待職糾—點騎釘壓力麵轉顧容is以 本發明係關於—種能控制點_力之點測系統，主要是利用 該感測數值達到-門楹值時，該點測系統即停止推 【先前技術】 按’在半導體產業巾’所謂晶圓是指製切 所用之梦晶片，由於其形狀為圓形，故將其通稱為晶圓。晶2 材質為梦，晶圓的主要製作方式，是先以還原等處理程序，從地 =面的砂石（含有二氧切）中萃取刺粗晶體後，再利用純 化處理，製作出純化多晶發之石夕晶棒，再經過研磨、拋光、切片 後，即可製作出晶圓。由於整片晶圓是單4整的晶體，故又稱 為單晶體。根據相關統計數據顯示，半導體產業的晶圓總出貨面 積，估從2009年的70億平方英吸增加至細年的82億平 方英吸，年成長率估計可達η· 4%，其成長趨糾此可見一斑。 日日圓包括有1C β日圓、led晶圓等種類，在本發明說明書中， 係將LED晶圓統稱為晶圓，合先陳明。製造薇商為確保晶圓的出 廠品質’-般會在製作出晶圓後，以—點測裝置對晶圓進行檢測， 主要的方式疋使電流通過晶圓上的LED晶粒，並測量該LED晶粒 所發出的紐特性（如：波長、發光強度、顏色等），以確認晶圓 的品質。 承上，以下兹針對習知之關裝置的結構及缺點，進行說明。 201113969 請參閱第1圖所示’點測裝置！主要是由—座體u、—擺臂i2 =一點測針13所組成，在第1圖中，該座體11的左端上表面凸 权有-第-導電接點lu，此外，該座體u的左端頂部固定有一 彈簧112 ’亦即，該彈簧112的上端固定在該座體u上。此外， 該擺臂12的右端樞接在該座體u上，使職臂12可沿其樞接位 置上下擺動’且該擺们2的右端無座體u形成電氣連接。另 -方面’該點測針13係透過一夾針座14，裝設於該擺臂12的左 端上’該擺臂12的左端底側凸設有一第二導電接•點12〇，隨著該 擺臂12的擺動’該第一 '第二導電接點⑴、12〇即能相互分離 或相互接觸。由於該擺臂12 _側受_彈簧112 壓，故該 第-、第二導電接點lu、12〇將保持在互相接觸狀態，當該點測 針13抵壓在待測晶圓i 5時，該點測針i 3即被反作用力肖上推動， 使該擺臂12克服該彈簧112的彈力，並向上移動，此時，該第一、 第二導電接點1U、12Q即相互分離，使電流通職座體11、擺臂 12、該夾針座14及該點測針13,並傳送至晶圓15上的LEj)晶粒， 使得該LED晶粒因接收到電流而發光，其後，該晶圓15上方的積 分球（integratingsphere) 16接收晶圓15上的光線，經過測量 6十异後碟s*忍該晶圓15的品質。 在上述習知的點測裝置丨中，該點測針13對該晶圓15的下 愿力直必須受到精準的控制，以避免晶圓15被該點測針以壓損， 由於點測裝置1係、_該彈簧112的彈力，來決定該點測針13對 該晶圓15的下壓力量…般業者是透過霞郷簧112的鬆緊程 度’以控制該點測針13的下壓力量，然而，此一調校工作是以人 工方式完成’因此，常會因人為誤差的緣故，導致該點測針13的 201113969 下壓力量超出晶圓15的荷重容忍範圍，造成該晶圓15的表面損 壞’非常不理想。檢測的目的本來是在於碟認晶圓15的品質，卻 反倒在檢測的過程中，造成更多不良產品，不僅大幅降低檢測的 準確度，更大幅增加晶圓的生產成本，對製造廠商相當不利。 因此’如何改善習知點測裝置，設計出能精準控制下壓力量 的點測系統’以避免晶圓在檢測的過程中損壞，並據以提升檢測 的準確性，即為本發明在此欲探討的一重要課題。 【發明内容】 有鑑於習知點測裝置的諸多問題，發明人經過長久努力研究 與實驗’終於開發設計$本發明之紐娜纖力之點測系統， 期此精準控概啦統對鋼物的下壓力量，避免制物受力超 出其荷重容忍範圍’並提高點嶋制檢測準確性。 本發明之-目的’係提供—種能舖關壓力之點測系統， 包括一擺臂、-感測元件、—升降馬達及—控制單元，其中該擺 臂的-端裝設有-夾針座，且該夾針座上夾持固定有一點測針； 該升降馬達上設有-承載盤，該承載盤係用以承載—待測物，使 該待測物能藉由該承载盤之升降，而在該闕針的下方進行上下 移動’賴騎能在接_嶋_時，對該制物進行檢 測;該感測元件能制該射的變，且產生對應於該變形量 的感測數值，·馳制單元係分職該_元件及該升降馬達相連 f，該控制單元驅動該升降馬達，使該升降馬達推動該承载盤上 -且此㈣感測元件接收該感測數值，當該控制單元判 201113969 斷該感測触翻朗榼值時，該控鮮元㈣該⑩馬達送出 ir止訊號使該升降馬達停止升高該承載盤，以避免該待測物 的表面受__針過度觀，有餘錢待_的表面被舰 損壞。藉由本發明之技術特徵，檢測人員即可根據該待測物的荷 重特性，贱在雜鮮元中奴關健，料馬達能於 該感測數值達職簡值時，停止推升該制物，以避免該點測 針對該制物的下壓力量超岐制_荷重奴翻，如此， 不僅能避免制物紐’更駄賭昇繼_、_檢測靈敏度 及準確度。 本發明之目的’騎該制數值達_門雛的一定比 例時，該控鮮元即對該升降馬達送出―減速訊號，使該升降馬 達降低推_承麵的速率’以保_細物*受損壞。 為便胃審查委員能對本發明之目的、結構及其功效，做更 進-步之認識與瞭解，轉實關配合圖式，詳細說明如下： 【實施方式】 發明人在長期從事晶圓檢賴！I的研發巾，發現習知的點測 裝置係以人工的方式調整彈簧，以設定晶圓於檢測中所受的荷 重’然而’卻常因為人為誤差或疏失等原因，導致許多晶圓在檢 測中被點測針壓損。目前雖有部分業者投人研發，欲尋求上述問 題的改善方案，但尚未尋找到完善的解決方案。有鑑於此，發明 人乃思及以一感測元件偵測擺臂的變形量，並以設定門檻值的方 式，以達成調整荷重的效果。 本發明係一種能控制點測壓力之點測系統，在本發明之第一 201113969 較佳貝％例中’赫閱第2圖所示，該點測系統2包括_擺臂2〇、 感測元件21、-升降馬達22及一控制單元23，其中該擺臂2〇 的-端敎有-失針座.且該夾針座咖上鱗岐有一點測 針201。另外，該升降馬達22上設有一承載盤22〇，該承載盤⑽ 係用以承載-待測物221，在本較佳實施例中，該待測物221為一 =。該升降馬達22可推動升降該承健220，使該待測物221 月t*藉由該承載盤220之升降，而在該點測針2〇1的下方進行上下 擊移動。在第-較佳實施例中，該感測元件21係一應變規（s㈣η Gage)其係_金屬導線的電阻值之變化，來量測―物體的應變 置’主要綱是由於電阻值與金屬導線的長度成正比，故當一物 體被拉伸或彎折變形時，該長度變化將使應變規的電阻值發生相 對應的變化，藉此即可量測物體的變形量（應變量）。因此，該感 測元件21能偵測該擺臂2〇的變形量，且產生對應於該變形量的 感測數值（電阻值）。需特別一提的是，該感測元件21並不限為 應變規，製造廠商亦得以-光學應變計（〇ptical strain Gage)， _作為該感測元件21，以侧該擺臂2〇的變形量。或者，製造廠商 亦可使用其他測量裝置，其係藉由物體的變形量，產生相對應的 電容、電感或電阻變化，使該測量裝置能根據上述變化發出一訊 號，以作為該感測數值，同樣能達成上述偵測擺臂2〇變形量的效 .果。此外，在第一較佳實施例中係以一電腦作為該控制單元23， 本發明並不以此為限，製造廠商在根據本發明所揭露的内容， 設計製造點測系統2時，亦可以一控制電路作為該控制單元23 , 同樣能達成相同的效果，凡本技術領域之人士所能輕易聯想之變 化’均應屬本案所欲保護之範圍。 201113969 件2圖所示’該控制單元23分別與該感測元 件21及該升降馬達22相連接，當檢測 測該待測_時，__ 達22，使該侧物咖承_ 22=23^該=" 221即可逐漸接近該點測針2〇卜 _ _該m 221接觸到該點測針加，且降=3圖所示，當該待測物 上升時，鋪勒===== :::::該，_ (該承載盤22〇)的向上推擠力，逐漸 減二而特別一提的是’為便審查委員瞭解本發明之技 術特徵，故在第3圖中以較為誇張的方式簡該擺臂20的彎曲變 2惟，實際上該擺臂2G的彎曲變形量相#小，並不容易以肉眼 =識’但由於應變規等類型的感測元件21十分靈敏，故仍可以精 確地侧卿擺臂2G _形量，並鍋目對應之感測數值。 、在上述較佳實施例中，請參閲第3圖所示，該控制單元23自 該感測7L件21接收該感測數值’且該控制單元23中預設有一門 播值’該門植值-般是由檢測人員預先根據該待測物的性質，在 經過縝料算後所奴者。又，當該猶2Q持續受力發生變形時， 該感測το件21即不斷地產生相對應之感測數值，使該控制單元23 不斷地接收到新的感測數值。當該控制單元23判斷該感測數值達 到該門植值時，該控制單元23即對該升降馬達22送出一停止訊 號’使該升降馬達22停止升高該承載盤220，此時，該待測物221 表面文到的荷重便不再增加，以避免該待測物221的表面受到該 點測針201過度壓迫’有效防止該待測物221的表面被壓迫損壞。 藉由上述較佳實施例之技術特徵，檢測人員即可根據該待測 201113969 物221的荷重特性，例如：根據該待測物221的荷重容忍範圍， 預先在該控制單元23中設定該門檻值，使該升降馬達22能於該 感測數值制朗檻辦，停止推升該侧物221，㈣免該點測 針201對該待測物221的下壓力量超出該待測物221的荷重容忍 範圍如此’不僅此避免待測物221損壞，更能大幅提昇該點測 系統2的檢測靈敏度及準確度。 此外，在上述較佳實施例争，請參閱第3所示，為避免該升 _降馬達22緊急停止時，該待測物221與該點測針2〇1間發生瞬間 推擠力’發a月人乃思及一減速機制，當該控制單元23綱該感測 數值達到該門楹值的-定比例（如：8〇%)時，該控制單元23即 對該升降馬達22紐峨’舰料馬達22減少推動該 承載盤220的速率，以保護該待測物221不受損壞。惟，本發明 並不以此為限’上述比例並不限於嶋，製造薇商或檢測人員亦 可根據實際檢測需求，或根據待測物的特性，調整上述比例，例 如：將比例調整^ 70%或·，凡本技術領域之人士所能輕易聯 •想之變化，均應涵蓋在本發明的權利範圍中。 除了上述第一較佳實施例的技術特徵外，在本發明之第二較 ，實施例中’請參閱第4圖所示，主要是以—組非接觸式影像測 置儀作為感測元件41 ’以取代第-較佳實施例的應變規（感測元 件21)。在本較佳實施例中，係選用英國艾美創公司（膽麵） 所開發生產之非接觸式影像測量儀，該感測元件41 (非接觸式影 像測量儀）係由-攝影機410及-影像分析裝置411所構成，至 於其他70件均與上述第一較佳實施例相同，故於第4圖中繼續沿 用相同的70件編號，合先陳明《該攝影機制以拍攝該擺臂 201113969 20，並將影像傳送至該影像分析裝置411。該影像分析裝置4ιι 針對連續取得的影像，進行比對分析，當影像發生變化時，該影 像分析裝置411即可據此判斷該擺臂2〇發生變形，且能由影 變化情況’計算出該擺臂20的變形量，並產生相對應之感測^值， 且將該感測數值傳送至該控制單元23。如此，當該控制單元23 判斷該感測數值達到該門檻值時，即可對該升降馬達22送出一停 止訊號’使該升降馬達22停止升高該承載盤22〇，令該待測物221 上的荷重停止增加，藉此保護該待測物221的表面。 需補充-提的是’除了以攝影機及影像分析裝置4ιι測 量該擺臂20㈣形量外，製造廠商或檢測人員亦可採用其他非接 觸式的測量方式’包括雷射測量及光柵測量等方式，來檢測擺臂 20的變形量’使本發明之點啦統2能_防止荷重過大的效果。 按以上所述，僅為本發明之若干較佳實施例，惟本發明之 技術特徵並不舰於此，脑何熟悉本技術賴之人士，在本發 明之技術領域内，可輕易从的變化或修飾，皆應涵蓋在以下本 發明的申請專利範圍中。 【圖式簡單說明】 第1圖係習知點測裝置之示意圖； 第2圖係本發明之第—較佳實施例之示意圖； 第3圖係本發明之第一較佳實施例之另-示意圖；及 第4圖係本翻之第二較佳實闕之示意圖。 【主要元件符號說明】 201113969 點測系統 ............2 擺臂 ............20 夾針座 ............200 點測針 ............201 感測元件 ............21、41 升降馬達 ............22 承載盤 ............220 待測物 ............221 控制單元 ............23 攝影機 ............410 影像分析裝置............411201113969 VI. Description of the invention: [Technical field of invention] ί=ΓΓ The amount of deformation of a swing arm and a corresponding sensed value. When the sensed value reaches the threshold value, the spot measurement system is stopped. Avoiding the waiting for correction - point riding nail pressure surface turn to the capacity of the system according to the invention - the ability to control the point _ force point measurement system, mainly using the sensed value to reach the - threshold value, the point measurement system That is, the push is stopped [Prior Art] The so-called wafer in the 'semiconductor industry towel' refers to the dream wafer used for the cutting, and since it has a circular shape, it is generally referred to as a wafer. The crystal 2 material is a dream. The main production method of the wafer is to firstly extract the coarse crystals from the sand (including dioxo) of the ground surface by using a reduction process, and then use the purification treatment to produce a purified product. After the crystal is polished, polished and sliced, the wafer can be fabricated. Since the entire wafer is a single crystal, it is also called a single crystal. According to relevant statistics, the total wafer shipment area of the semiconductor industry is estimated to increase from 7 billion square feet in 2009 to 8.2 billion square feet in fine years, and the annual growth rate is estimated to be η·4%. This is evident from the trend. The Japanese yen includes a 1C β yen, a led wafer, and the like. In the present specification, the LED wafers are collectively referred to as wafers. In order to ensure the quality of the wafers, we will test the wafers after the wafers are produced. The main way is to pass the current through the LED dies on the wafer and measure the The characteristics of the LED die (such as wavelength, luminous intensity, color, etc.) to confirm the quality of the wafer. In the following, the structure and shortcomings of the conventional device will be described below. 201113969 Please refer to the 'dot measuring device' shown in Figure 1. The main body is composed of a seat body u, a swing arm i2 = a point stylus 13. In the first figure, the upper surface of the left end of the seat body 11 has a convex-first conductive contact lu, and further, the seat body A spring 112 is attached to the top of the left end of the u. That is, the upper end of the spring 112 is fixed to the base u. In addition, the right end of the swing arm 12 is pivotally connected to the base u, so that the arm 12 can swing up and down along its pivotal position, and the right end of the pendulum 2 has no seat u to form an electrical connection. In another aspect, the stylus 13 is disposed through a pin holder 14 and is disposed on the left end of the swing arm 12. A second conductive connection point 12〇 protrudes from a bottom side of the left end of the swing arm 12, The swinging 'the first' second conductive contacts (1), 12〇 of the swing arm 12 can be separated from each other or in contact with each other. Since the swing arm 12 _ side is pressed by the _ spring 112, the first and second conductive contacts lu, 12 〇 will remain in contact with each other when the stylus 13 is pressed against the wafer i 5 to be tested. The stylus i 3 is pushed by the reaction force, so that the swing arm 12 overcomes the elastic force of the spring 112 and moves upward. At this time, the first and second conductive contacts 1U, 12Q are separated from each other. Passing the current through the body 11, the swing arm 12, the pin holder 14 and the spot stylus 13 and transferring it to the LEj) die on the wafer 15, so that the LED die emits light due to the reception of current, Thereafter, an integrating sphere 16 above the wafer 15 receives the light on the wafer 15, and after measuring six times, the disc s* endures the quality of the wafer 15. In the above-mentioned conventional spot measuring device, the lower force of the spot stylus 13 on the wafer 15 must be precisely controlled to prevent the wafer 15 from being crushed by the stylus, due to the spot measuring device. The elastic force of the spring 112 is used to determine the amount of depression of the stylus 13 on the wafer 15 (the degree of tightness of the tamper spring 112 is controlled by the spring) to control the amount of depression of the stylus 13 at that point. However, this calibration work is done manually. Therefore, due to human error, the pressure under the 201113969 of the stylus 13 exceeds the load tolerance of the wafer 15, resulting in the surface of the wafer 15. Damage is 'very unsatisfactory. The purpose of the test is to discriminate the quality of the wafer 15, but in the process of detection, it causes more defective products, which not only greatly reduces the accuracy of the detection, but also greatly increases the production cost of the wafer, which is quite unfavorable to the manufacturer. . Therefore, 'how to improve the conventional spot measuring device, design a spot measuring system that can accurately control the amount of pressure' to avoid damage to the wafer during the detection process, and to improve the accuracy of the detection, which is the present invention An important topic of discussion. SUMMARY OF THE INVENTION In view of the problems of the conventional spot measuring device, the inventor has long worked hard to study and experiment 'finally develop and design the Nina fiber point measuring system of the present invention, and the precise control system to the steel object The amount of downforce, avoiding the force of the material beyond its load tolerance range' and increasing the accuracy of the point detection. The object of the present invention is to provide a spotting system capable of paving pressure, comprising a swing arm, a sensing component, a lifting motor and a control unit, wherein the swing arm has a - pin a stylus is fixedly held on the pin holder; the hoisting motor is provided with a carrier tray for carrying the object to be tested, so that the object to be tested can be supported by the carrier Raising and lowering, and moving up and down under the boring needle, 'Lai Ran can detect the workpiece when it is connected to _ _ _; the sensing element can make the change of the ray and generate a sense corresponding to the amount of deformation Measured value, the mobile unit is divided into the _ component and the hoist motor is connected to f, the control unit drives the hoist motor to cause the hoist motor to push the carrier plate - and the (4) sensing component receives the sensed value, When the control unit judges 201113969 to break the sense of the touch threshold, the control unit (4) sends the ir stop signal to cause the lift motor to stop raising the carrier to prevent the surface of the object to be tested from being _ _ Needle over view, the surface with more money to be _ was damaged by the ship. According to the technical feature of the present invention, the detecting personnel can squat in the fresh and fresh elements according to the load characteristic of the object to be tested, and the motor can stop pushing the product when the sensing value reaches the job value. In order to avoid the point of pressure on the product, the amount of downforce is too much, so that it can not only avoid the smashing of the product, but also the detection sensitivity and accuracy. The object of the present invention is that when the value of the system reaches a certain proportion of the _ door chick, the control unit sends a “deceleration signal to the hoisting motor, so that the hoisting motor reduces the rate of the push-bearing surface” to ensure _ fine matter* Damaged. For the convenience review committee, we can make a further step-by-step understanding and understanding of the purpose, structure and efficacy of the present invention, and turn it into a detailed diagram as follows: [Embodiment] The inventor has been engaged in wafer inspection for a long time. ! I developed the towel and found that the conventional spotting device manually adjusts the spring to set the load on the wafer during the test. However, many wafers are often detected due to human error or loss. The stylus is pressed in the middle. At present, although some operators have invested in research and development, they are seeking improvement solutions for the above problems, but have not yet found a perfect solution. In view of this, the inventor has thought of detecting the amount of deformation of the swing arm by a sensing element and setting the threshold value to achieve the effect of adjusting the load. The present invention is a point measurement system capable of controlling the pressure of the spot measurement. In the first example of the present invention, in the first example of 201113969, as shown in FIG. 2, the point measurement system 2 includes a swing arm 2〇, sensing The component 21, the lifting motor 22 and a control unit 23, wherein the end of the swing arm 2 has a missing pin holder, and the pin holder has a stylus 201 on the scale. In addition, the hoisting motor 22 is provided with a carrying tray 22, which is used to carry the object to be tested 221. In the preferred embodiment, the object to be tested 221 is a =. The hoisting motor 22 can push and lower the bearing 220 to cause the object to be tested to move up and down below the stylus 2〇1 by the lifting and lowering of the carrier 220. In the first preferred embodiment, the sensing element 21 is a strain gauge (s(4) η Gage) which is a change in the resistance value of the metal wire to measure the strain of the object. The main reason is due to the resistance value and the metal. The length of the wire is proportional, so when an object is stretched or bent and deformed, the length change will cause a corresponding change in the resistance value of the strain gauge, thereby measuring the deformation amount (strain) of the object. Therefore, the sensing element 21 can detect the amount of deformation of the swing arm 2〇 and generate a sensing value (resistance value) corresponding to the amount of deformation. It should be particularly noted that the sensing element 21 is not limited to a strain gauge, and the manufacturer can also use an optical strain gage, _ as the sensing element 21, and the side of the swing arm 2 The amount of deformation. Alternatively, the manufacturer may use other measuring devices that generate a corresponding change in capacitance, inductance, or resistance by the amount of deformation of the object, so that the measuring device can emit a signal according to the change as the sensing value. The effect of detecting the amount of deformation of the swing arm 2 can also be achieved. In addition, in the first preferred embodiment, a computer is used as the control unit 23, and the present invention is not limited thereto. When the manufacturer designs and manufactures the spot measurement system 2 according to the disclosure of the present invention, As a control circuit 23, a control circuit can achieve the same effect, and any change that can be easily associated with those skilled in the art should be within the scope of the present invention. 201113969 Figure 2 shows that the control unit 23 is connected to the sensing element 21 and the lifting motor 22 respectively. When detecting the measured _, the __ reaches 22, so that the side is _ 22=23^ The =" 221 can gradually approach the point stylus 2 〇 _ _ the m 221 touches the stylus plus to the point, and the drop = 3 picture shows, when the object to be tested rises, the pluck === == ::::: This, _ (the carrier tray 22〇), the upward pushing force is gradually reduced by two, and in particular, 'for the reviewer to understand the technical features of the present invention, so in Figure 3 In a more exaggerated way, the bending of the swing arm 20 is changed. However, the bending deformation amount of the swing arm 2G is actually small, and it is not easy to be recognized by the naked eye. However, the sensing element 21 of the type such as the strain gauge is very Sensitive, so it is still possible to accurately align the arm 2G _ shape, and the corresponding value of the pot. In the above preferred embodiment, as shown in FIG. 3, the control unit 23 receives the sensed value ' from the sensing 7L member 21 and presets a gated value in the control unit 23'. The phytosanitary value is generally determined by the inspector based on the nature of the object to be tested and after the calculation. Moreover, when the J2 is continuously deformed by force, the sensing component 21 continuously generates a corresponding sensing value, so that the control unit 23 continuously receives the new sensing value. When the control unit 23 determines that the sensed value reaches the threshold value, the control unit 23 sends a stop signal to the lift motor 22 to stop the lift motor 22 from raising the tray 220. The load on the surface of the object 221 is no longer increased to prevent the surface of the object to be tested 221 from being excessively pressed by the spot stylus 201 'effectively preventing the surface of the object to be tested 221 from being damaged by compression. According to the technical features of the preferred embodiment, the detecting personnel can set the threshold value in the control unit 23 according to the load characteristic of the 201113969 object 221 to be tested, for example, according to the load tolerance range of the object to be tested 221. The lifting motor 22 can be operated by the sensing value to stop pushing the side object 221, and (4) the amount of depression of the measuring object 201 to the object to be tested 221 is beyond the load of the object to be tested 221 The tolerance range is such that not only the damage of the object to be tested 221 is avoided, but also the detection sensitivity and accuracy of the spotting system 2 can be greatly improved. In addition, in the above preferred embodiment, please refer to FIG. 3, in order to avoid the instantaneous pushing force between the object to be tested 221 and the point stylus 2〇1 when the lifting/lowering motor 22 is urgently stopped. a month of thinking and a deceleration mechanism, when the control unit 23 reaches the proportional value (for example, 8〇%) of the threshold value, the control unit 23 is the lifting motor 22 The stern motor 22 reduces the rate at which the carrier disk 220 is pushed to protect the object to be tested 221 from damage. However, the present invention is not limited thereto. The above ratio is not limited to 嶋, and the manufacturer or the inspector may adjust the ratio according to actual detection requirements or according to the characteristics of the object to be tested, for example, adjusting the ratio ^ 70 Any changes that can be easily made by those skilled in the art are intended to be included in the scope of the present invention. In addition to the technical features of the first preferred embodiment described above, in the second comparative embodiment of the present invention, please refer to FIG. 4, which is mainly a set of non-contact image measuring instruments as the sensing element 41. 'In place of the strain gauge (sensing element 21) of the first preferred embodiment. In the preferred embodiment, a non-contact image measuring instrument developed by Amy Chuangye Co., Ltd. is used. The sensing component 41 (non-contact image measuring instrument) is a camera 410 and The image analysis device 411 is configured. As for the other 70 pieces, which are the same as the first preferred embodiment, the same 70-piece number is continued in FIG. 4, and the photographic mechanism is used to capture the swing arm 201113969. 20. The image is transmitted to the image analyzing device 411. The image analyzing device 4ιι performs a comparison analysis on the continuously acquired images. When the image changes, the image analyzing device 411 can determine that the swing arm 2〇 is deformed, and can calculate the change from the shadow change condition. The amount of deformation of the swing arm 20 is generated, and a corresponding sensed value is generated, and the sensed value is transmitted to the control unit 23. In this way, when the control unit 23 determines that the sensed value reaches the threshold value, the hoist motor 22 can send a stop signal 'to stop the hoist motor 22 from raising the carrier tray 22 〇, so that the object to be tested 221 The load on the upper side stops increasing, thereby protecting the surface of the object to be tested 221. Need to add - mention that 'in addition to the camera and image analysis device 4 ιι measurement of the swing arm 20 (four) shape, manufacturers or testers can also use other non-contact measurement methods 'including laser measurement and grating measurement, etc. In order to detect the amount of deformation of the swing arm 20, the effect of the present invention can be prevented from being excessively large. In view of the above, it is only a few preferred embodiments of the present invention, but the technical features of the present invention are not in this category, and those who are familiar with the technology in the field can easily change from the technical field of the present invention. Or, modifications are intended to be included in the scope of the claims of the invention below. BRIEF DESCRIPTION OF THE DRAWINGS Fig. 1 is a schematic view of a conventional spotting device; Fig. 2 is a schematic view of a first preferred embodiment of the present invention; and Fig. 3 is a further embodiment of the first preferred embodiment of the present invention - Schematic diagram; and Fig. 4 is a schematic diagram of the second preferred embodiment of the present invention. [Main component symbol description] 201113969 Spot measurement system............2 Swing arm............20 Clip holder......... ...200 stylus............201 Sensing components............21,41 Lifting motor.......... ..22 Carrier disk............220 DUT.........221 Control unit............23 Camera ............410 Image Analysis Device............411
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