TWI701426B - Temperature measuring device - Google Patents
Temperature measuring device Download PDFInfo
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- TWI701426B TWI701426B TW108119238A TW108119238A TWI701426B TW I701426 B TWI701426 B TW I701426B TW 108119238 A TW108119238 A TW 108119238A TW 108119238 A TW108119238 A TW 108119238A TW I701426 B TWI701426 B TW I701426B
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Abstract
一種溫度傳感器,其包含:至少一支承構件;以及至少一溫度感測構件,溫度感測構件包括一平衡桿、一感測件及一彈性件,平衡桿以一支點連接支承構件而設置於支承構件的下方,平衡桿的一端連接彈性件,平衡桿的另一端連接感測件,其中感測件的端部常態性高於支承構件,於感測件相對支點受一力矩時,彈性件儲存一彈性位能;於力矩解除時,彈性件釋放彈性位能而使感測件回復原位。經由本發明的溫度量測裝置,可執行全自動、即時的溫度監控,並減少溫度測量的多種變因。A temperature sensor comprising: at least one supporting member; and at least one temperature sensing member. The temperature sensing member includes a balance bar, a sensing member and an elastic member. The balance bar is connected to the support member at a single point and is arranged on the support Below the member, one end of the balance bar is connected to the elastic member, and the other end of the balance bar is connected to the sensing member. The end of the sensing member is more normal than the supporting member. When the sensing member is subjected to a torque relative to the fulcrum, the elastic member is stored An elastic potential energy; when the torque is released, the elastic member releases the elastic potential energy to make the sensing member return to its original position. Through the temperature measuring device of the present invention, fully automatic and real-time temperature monitoring can be performed, and various variables of temperature measurement can be reduced.
Description
本發明係關於一種溫度量測裝置,更特別的是關於一種即時監控的溫度量測裝置。The invention relates to a temperature measuring device, and more particularly to a temperature measuring device for real-time monitoring.
在進行熱製程的時候,對熱處理物的溫度監控往往不是即時的。傳統作法是取一片待測樣品,在待測樣品的表面以人工方式黏覆溫度感測件,將待測樣品送進熱製程設備中,將測得的溫度數據推估為實際熱製程的數據。此作法不僅費時耗力,溫測點也會因人工黏覆可能的偏移而喪失精準。最重要的是,推估的數據都不能取代實際製程的溫度數據,這表示真正在生產時的熱處理物缺乏即時的溫度監控。During the thermal process, the temperature monitoring of the heat-treated object is often not instantaneous. The traditional method is to take a piece of sample to be tested, manually glue the temperature sensor on the surface of the sample to be tested, send the sample to be tested into the thermal process equipment, and estimate the measured temperature data as the actual thermal process data . This method is not only time-consuming and labor-intensive, the temperature measurement point will also lose accuracy due to the possible offset of the artificial adhesion. The most important thing is that the estimated data cannot replace the temperature data of the actual process, which means that the heat-treated products in production lack real-time temperature monitoring.
因此,為解決習知溫度量測裝置的種種問題,本發明提出一種即時監控的溫度量測裝置。Therefore, in order to solve the various problems of the conventional temperature measuring device, the present invention proposes a temperature measuring device for real-time monitoring.
為達上述目的及其他目的,本發明提出一種溫度量測裝置,其包含:至少一支承構件;以及至少一溫度感測構件,包括一平衡桿、一感測件及一彈性件,該平衡桿以一支點連接該支承構件而設置於該支承構件的下方,該平衡桿的一端連接該彈性件,該平衡桿的另一端連接該感測件,其中該感測件的端部常態性高於該支承構件,於該感測件相對該支點受一力矩時,該彈性件儲存一彈性位能;於該力矩解除時,該彈性件釋放該彈性位能而使該感測件回復原位。In order to achieve the above and other objectives, the present invention provides a temperature measuring device, which includes: at least one supporting member; and at least one temperature sensing member, including a balance bar, a sensing member and an elastic member, the balance bar The support member is connected with a fulcrum and is arranged below the support member, one end of the balance rod is connected to the elastic member, and the other end of the balance rod is connected to the sensing member, wherein the end of the sensing member is more normal than For the supporting member, when the sensing element is subjected to a torque relative to the fulcrum, the elastic element stores an elastic potential energy; when the torque is released, the elastic element releases the elastic potential energy to make the sensing element return to its original position.
於本發明之一實施例中,該支承構件包括一架體及一支承體,該架體的上方承載該支承體,該架體的下方連接該支點。In an embodiment of the present invention, the supporting member includes a frame body and a supporting body, the upper part of the frame body carries the supporting body, and the lower part of the frame body is connected to the fulcrum.
於本發明之一實施例中,更包括一調整構件,連接該彈性件,該調整構件相對該支點施與一調整力矩而調整該感測件的高度。In an embodiment of the present invention, it further includes an adjusting member connected to the elastic member, and the adjusting member applies an adjusting torque to the fulcrum to adjust the height of the sensing member.
於本發明之一實施例中,具有二個該支承構件以及四個該溫度感測構件,該等支承構件呈長條狀且彼此平行設置,每個該等支承構件的二端分別設有該溫度感測構件。In an embodiment of the present invention, there are two supporting members and four temperature sensing members. The supporting members are elongated and arranged parallel to each other. The two ends of each of the supporting members are respectively provided with the Temperature sensing component.
於本發明之一實施例中,更包括一溫度記錄模組,連接該溫度感測構件。In an embodiment of the present invention, it further includes a temperature recording module connected to the temperature sensing component.
藉此,本發明的溫度量測裝置可供執行全自動、即時的溫度監控,並減少溫度測量的多種變因。In this way, the temperature measurement device of the present invention can be used to perform fully automatic and real-time temperature monitoring and reduce various variables of temperature measurement.
為充分瞭解本發明,茲藉由下述具體之實施例,並配合所附之圖式,對本發明做一詳細說明。本領域技術人員可由本說明書所公開的內容瞭解本發明的目的、特徵及功效。須注意的是,本發明可透過其他不同的具體實施例加以施行或應用,本說明書中的各項細節亦可基於不同觀點與應用,在不悖離本發明的精神下進行各種修飾與變更。以下的實施方式將進一步詳細說明本發明的相關技術內容,但所公開的內容並非用以限制本發明的申請專利範圍。說明如後:In order to fully understand the present invention, a detailed description of the present invention is given with the following specific embodiments and accompanying drawings. Those skilled in the art can understand the purpose, features and effects of the present invention from the content disclosed in this specification. It should be noted that the present invention can be implemented or applied through other different specific embodiments, and various details in this specification can also be based on different viewpoints and applications, and various modifications and changes can be made without departing from the spirit of the present invention. The following embodiments will further describe the related technical content of the present invention in detail, but the disclosed content is not intended to limit the scope of patent application of the present invention. The description is as follows:
如圖1至圖3所示,本發明實施例之溫度量測裝置100,其包含: 至少一支承構件1及至少一溫度感測構件2。As shown in FIGS. 1 to 3, the temperature measuring
支承構件1用以支承一待測物S,支承構件1與待測物S之間可以是點接觸或線接觸。較佳地,待測物S為片狀的玻璃片或矽基板,然而本發明不限於此。The
溫度感測構件2包括一平衡桿21、一感測件22及一彈性件23。平衡桿21以一支點211連接支承構件1而設置於支承構件1的下方。平衡桿21的一端連接彈性件23,平衡桿21的另一端連接感測件22。如圖1所示,感測件22的端部221常態性(即支承構件1未支承任何待測物S的情況下)略高於支承構件1一點。The
如圖2所示,當支承構件1支承待測物S,端部221因此被下壓以確保接觸待測物S而感測待測物S的溫度,此時,感測件22相對支點211受一力矩,因此使彈性件23儲存一彈性位能。而於該力矩被解除時(移除待測物S),彈性件23釋放該彈性位能而使感測件22回復原位。此時端部221又回復到比支承構件1略高,以備下一次的溫度感測。As shown in FIG. 2, when the supporting
經由本發明的溫度量測裝置100,當待測物S以全自動的方式(利用機械手臂等)送進熱製程設備中的支承構件1之上,就可直接藉由溫度感測構件2全程記錄實時溫度監控。過程中無須透過人工,即可執行全自動、即時的溫度監控,並減少溫度測量的多種變因。With the temperature measuring
進一步地,在一個實施例中,支承構件1包括一架體11及一支承體12,架體11的上方承載支承體12,架體11的下方連接支點211。如圖2所示,支承體12的形狀可與待測物S達成最小面積接觸。Further, in one embodiment, the supporting
進一步地,在一個實施例中,如圖1及圖2所示,溫度量測裝置100更包括一調整構件3。調整構件3連接彈性件23,並相對支點211施與一調整力矩而調整感測件22的高度。舉例來說,調整構件3可以包括一螺栓,以螺栓下旋的深度而改變調整力矩,並對應改變感測件22的高度。Further, in one embodiment, as shown in FIGS. 1 and 2, the
進一步地,在一個實施例中,如圖1及圖2所示,溫度量測裝置100更包括一溫度記錄模組4,連接溫度感測構件2以分析、記錄溫度感測構件2所測得的溫度數據。Further, in one embodiment, as shown in FIGS. 1 and 2, the
一個支承構件1及一個溫度感測構件2即可構成一組溫度量測裝置100,然而本發明不限於此。如圖3所示,在一個較佳的態樣中,溫度量測裝置100具有二個支承構件1以及四個溫度感測構件2,這些支承構件1呈長條狀且彼此平行設置,每個支承構件1的二端分別設有溫度感測構件2。當待測物S放置於支承構件1之上的時候,溫度感測構件2可分別感測待測物S的四個待測點。然而本發明不限於此,溫度量測裝置100可包含更多組的支承構件1及溫度感測構件2,且溫度感測構件2的位置亦可以隨意變化。One supporting
本發明在上文中已以實施例揭露,然熟習本項技術者應理解的是,該實施例僅用於描繪本發明,而不應解讀為限制本發明之範圍。應注意的是,舉凡與該實施例等效之變化與置換,均應設為涵蓋於本發明之範疇內。因此,本發明之保護範圍當以申請專利範圍所界定者為準。The present invention has been disclosed in the above embodiments. However, those skilled in the art should understand that the embodiments are only used to describe the present invention and should not be interpreted as limiting the scope of the present invention. It should be noted that all changes and substitutions equivalent to this embodiment should be included in the scope of the present invention. Therefore, the protection scope of the present invention should be defined by the scope of the patent application.
100:溫度量測裝置 1:支承構件 11:架體 12:支承體 2:溫度感測構件 21:平衡桿 211:支點 22:感測件 221:端部 23:彈性件 3:調整構件 4:溫度記錄模組 S:待測物100: Temperature measuring device 1: supporting member 11: Frame 12: Support 2: Temperature sensing component 21: Balance bar 211: Fulcrum 22: sensor 221: End 23: Elastic 3: adjust components 4: Temperature recording module S: DUT
圖1係為根據本發明實施例之溫度量測裝置之非支承狀態示意圖。 圖2係為根據本發明實施例之溫度量測裝置之支承狀態示意圖。 圖3係為根據本發明實施例之溫度量測裝置之立體示意圖。 FIG. 1 is a schematic diagram of the unsupported state of the temperature measuring device according to the embodiment of the present invention. 2 is a schematic diagram of the supporting state of the temperature measuring device according to the embodiment of the present invention. FIG. 3 is a three-dimensional schematic diagram of a temperature measuring device according to an embodiment of the present invention.
100:溫度量測裝置 100: Temperature measuring device
1:支承構件 1: supporting member
11:架體 11: Frame
12:支承體 12: Support
2:溫度感測構件 2: Temperature sensing component
21:平衡桿 21: Balance bar
211:支點 211: Fulcrum
22:感測件 22: sensor
221:端部 221: End
23:彈性件 23: Elastic
3:調整構件 3: adjust components
4:溫度記錄模組 4: Temperature recording module
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Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
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US4764026A (en) * | 1986-07-07 | 1988-08-16 | Varian Associates, Inc. | Semiconductor wafer temperature measuring device and method |
JPH1114468A (en) * | 1997-06-23 | 1999-01-22 | Nikon Corp | Cantilever and scanning temperature distribution measuring instrument using it |
US5929438A (en) * | 1994-08-12 | 1999-07-27 | Nikon Corporation | Cantilever and measuring apparatus using it |
US7604401B2 (en) * | 2004-07-01 | 2009-10-20 | Ul Vac, Inc. | Substrate temperature measurement apparatus and processing apparatus |
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2019
- 2019-06-03 TW TW108119238A patent/TWI701426B/en active
Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4764026A (en) * | 1986-07-07 | 1988-08-16 | Varian Associates, Inc. | Semiconductor wafer temperature measuring device and method |
US5929438A (en) * | 1994-08-12 | 1999-07-27 | Nikon Corporation | Cantilever and measuring apparatus using it |
JPH1114468A (en) * | 1997-06-23 | 1999-01-22 | Nikon Corp | Cantilever and scanning temperature distribution measuring instrument using it |
US7604401B2 (en) * | 2004-07-01 | 2009-10-20 | Ul Vac, Inc. | Substrate temperature measurement apparatus and processing apparatus |
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