201112991 六、發明說明： 【發明所屬之技術領域】 本發明是有關於一種傳導墊，特別是指一種適用於一 電磁源上’以使各式材料之容器均能接受電磁源的加教之 傳導墊。 ^ 【先前技術】 -般電磁爐的加熱原理主要是利用一橋式整流器將一 般插座的父机電轉變成直流電，再藉由功率晶體將直流電 • #變成高週波電流，流經陶兗面板下的磁熱線圈，利用高 週波電流有規律地改變電流方向，使得磁熱線圈所產生的 磁力線隨之不斷地改變方向以形成磁感應，容器底部受到 該磁感應作用而產生感應電流，同時透過自身的電阻關係 而產生熱量。 由於電磁爐疋藉磁感應使炊具產生熱，所以不是所有 的容器都適用，容器底部必須能吸住磁鐵才行。目前適合 放在電磁爐上的容器包括由不鏽鋼製成之器具、平底鍋、 • 彩色鍋，不適用者則為由陶瓷製成之器具、耐熱玻璃鍋、 鋁製器具。 有業者為使玻璃製谷器也能置於電磁爐上加熱，遂於 玻璃製容器的底面塗佈或燒結一金屬粉末層，做為導磁材 料’但是此種導磁材料的使用壽命不長，且易脫落而失效 ’同時也會造成容器製造業者的製造成本提高。 如何設計出一種產品能辅助不同材料的容器均能適合 置於電磁爐上進行加熱，成為本發明所欲解決的主要課題 201112991 【發明内容】 因此，本發明之目的，即在 P在知供一種適用範圍廇泛， 仁可置於一電磁源上，以使i— ' 磁·s 使各式材料之鍋具均能接受電 之加熱，還可做為一般隔熱用途之傳導墊。 於是，本發明傳導墊，包括有： 一包覆層，是由耐熱材料所製成； 二專導層，是由具導磁效果之金屬材料所製成，且設 置於S亥包覆層内；及 —集熱層，設置於該包覆層内且位於該包覆層與該傳 導層之間。 本發明之功效在於可置於一電磁源上，做為—導熱媒 介’使各式材料之容器均能透過該傳導墊而接受電磁源之 加熱，另外’未置於電磁源上時，還可做為隔熱用途。 【實施方式】 有關本發明之前述及其他技術内容、特點與功效，在 以下配合參考圖式之九個較佳實施例的詳細說明中，將可 清楚的呈現。 在本發明被詳細描述之前，要注意的是，在以下的說 明内容中，類似的元件是以相同的編號來表示。 參閱圖1’本發明傳導墊2第一較佳實施例包含有一包 覆層21、一設置於該包覆層21内並鄰近其頂緣之傳導層 22’以及一設置於該包覆層21内且位於該傳導層22下方 之集熱層23。其中包覆層21是由耐熱材料所製成，此耐熱 201112991 材料是選自下列群組之一：矽膠、矽橡膠材料、耐高溫樹 脂’在本實施例中是以矽膠做說明。值得一提的是，石夕膠 材料具有極佳的溫度穩定性’在-65 °C至3〇〇°C溫度内能穩 定使用而不變質。而傳導層22則是由高阻抗金屬材料所製 成’所述高阻抗金屬材料是選自下列群組之一：鐵、钻、 鎳、鎢、不銹鋼’在本實施例中是以不銹鋼做說明。另外 ，該高阻抗金屬材料之形態是選自下列群組之一：粉末、201112991 VI. Description of the Invention: [Technical Field] The present invention relates to a conductive pad, and more particularly to a conductive pad suitable for use on an electromagnetic source to enable a container of various materials to receive an electromagnetic source. . ^ [Prior Art] - The heating principle of the induction cooker is mainly to convert the parent electromechanical of the general socket into direct current by a bridge rectifier, and then convert the direct current into a high frequency current through the power crystal, and flow through the magnet under the ceramic panel. The hot coil uses a high-cycle current to regularly change the direction of the current, so that the magnetic lines generated by the magnetocaloric coil continuously change direction to form magnetic induction, and the bottom of the container is subjected to the magnetic induction to generate an induced current while transmitting its own resistance relationship. Produce heat. Since the induction cooker uses magnetic induction to generate heat in the cookware, not all containers are suitable, and the bottom of the container must be able to hold the magnet. Containers currently suitable for use in induction cookers include appliances made of stainless steel, pans, and colored pots, and those that are not suitable are ceramics, heat-resistant glass pots, and aluminum appliances. In order to make the glass granulator can also be placed on the induction cooker, the metal powder layer is coated or sintered on the bottom surface of the glass container as a magnetic conductive material, but the service life of the magnetic conductive material is not long. And it is easy to fall off and fail', and it also causes the manufacturing cost of the container manufacturer to increase. How to design a product that can assist different containers of materials to be placed on an induction cooker for heating is a major problem to be solved by the present invention. 201112991 [Invention] Therefore, the object of the present invention is to provide a suitable application in P. The range is wide, and the kernel can be placed on an electromagnetic source so that the i-'magnetic s can make the pots of various materials can be heated by electricity, and can also be used as a conductive pad for general heat insulation purposes. Therefore, the conductive pad of the present invention comprises: a cladding layer made of a heat-resistant material; and a second conductive layer made of a metal material having a magnetic conductive effect and disposed in the S-cover layer. And a heat collecting layer disposed in the cladding layer and located between the cladding layer and the conductive layer. The effect of the invention is that it can be placed on an electromagnetic source, as a heat-conducting medium, so that the containers of various materials can receive the heating of the electromagnetic source through the conductive pad, and the other is not when placed on the electromagnetic source. Used for insulation purposes. The above and other technical contents, features and effects of the present invention will be apparent from the following detailed description of the preferred embodiments of the accompanying drawings. Before the present invention is described in detail, it is noted that in the following description, similar elements are denoted by the same reference numerals. Referring to FIG. 1 , a first preferred embodiment of the conductive pad 2 of the present invention comprises a cladding layer 21 , a conductive layer 22 ′ disposed in the cladding layer 21 adjacent to the top edge thereof, and a cladding layer 21 disposed on the cladding layer 21 . The heat collecting layer 23 is located inside the conductive layer 22. The covering layer 21 is made of a heat-resistant material, and the heat-resistant 201112991 material is one selected from the group consisting of silicone rubber, enamel rubber material, and high-temperature resistant resin, which are described in the present embodiment by silicone rubber. It is worth mentioning that the Shixi gum material has excellent temperature stability and can be stably used without deterioration in the temperature range of -65 °C to 3 °C. The conductive layer 22 is made of a high-resistance metal material. The high-impedance metal material is one selected from the group consisting of iron, diamond, nickel, tungsten, and stainless steel. . In addition, the form of the high-resistance metal material is selected from one of the following groups: powder,
網狀、片狀 '圓環狀、渦旋狀、編織狀所製成，在本實施 例中是以片狀做說明。至於該集熱層23是選自下列群組之 一：岩棉、玻璃纖維、非石棉層、玻璃棉。其中該非石棉 層是選自下列群組之一：矽酸鈣、石夕酸鎂、二氧化妙本 實施例則是以矽酸鈣做說明。 參閱圖2,在使用上，可將傳導墊2置放於—電磁源3 上，在本例中’電磁源3是以電磁爐做說明，但並不以此 為[藉此電磁爐3所產生之電磁波穿透該集熱層23並進 而”傳導層22產生分子震動，以達到導熱仙。特別說明 的是該集熱層23之材f特性具有保溫效果，因此可封㈣ 能並產生雜絲，亦即可使該錄層23下方的溫度小於 該集熱層23上方的溫声，w料 叼/皿度以對置於傳導墊2上之容器41 :行加熱。由於容器41不-定需要能產生磁感應電流之材 料，因此任何材料的容器41均能置於傳導塾2上 電磁爐3的加熱》 & 2第二較佳實施例，本 不同處是在於傳導墊2 參閱圖3、4，是本發明傳導墊 實施例與第-較佳實施例大致相同， 201112991 之包覆層21定義有-承載面211，及—相反於該承載面2ιι 之接觸面212，傳導層22是由不錄鋼網所製成，且設置於 該包覆層21内並顯露於其頂緣，藉此除了能具有與第一較 佳實施例相同之功效外，網狀傳導層22更能提供止滑之效 果。 參閱圖5、6 ’是本發明傳導塾2第三較佳實施例，本 實施例與第-較佳實施例大致相同，不同處是在於包覆層 21具有一承載面211，及一相反於該承载面2n之接觸面 212 ’接觸面212上間隔凸設有多數個凸出體213，在本實 施例中’該凸出體213是以呈凸粒形態做說明。如此傳導籲 墊2除了仍可如第一較佳實施例般作為導熱媒介之外，還 可將離開電磁源3(參見圖2)之傳導墊2直接置於一桌面5 上藉。亥等凸出體213間隔地接觸桌面5，而能提供良好的 隔熱、散熱作用，避免高溫容器41燙損桌面5。 參閱圖7,是本發明傳導墊2第四較佳實施例，本實施 例與第二較佳實施例大致相同，差異處是在於傳導墊2之 接觸面212上的該等凸出體213是呈間隔凸出之環圈態樣 。藉此同樣能做為導熱媒介，使各式材料之容器均能透過魯 該傳導墊2而接受電磁源之加熱，以及移離電磁源後，還 可用為隔熱、散熱之用。 參閱圖8 ’是本發明傳導墊2第五較佳實施例，本實施 例與第四較佳實施例大致相同，差異處是在於傳導墊2之 接觸面212上的該等凸出體213是呈渦旋狀。藉此同樣能 做為導熱媒介，使各式材料之容器均能透過該傳導墊2而 6 201112991 接受電磁源之加熱，以及移離電磁源後，還可用為隔熱、 散熱之用。 參閱圖9,是本發明傳導墊2第六較佳實施例，本實施 例與第二較佳實施例大致相同，差異處是在於該等凸出體 213是呈交又凸條態樣，當然也可以是多數平行的凸條但 不以此為限。該等凸出體213並顯露於該包覆層21之承載 面211，且該等交又凸條之間界定有多數個凹槽214，該等 凹槽214内並填置有與包覆層21相同之耐熱材料，藉此提 • 供產品之多樣變化，且同樣能達到與第二較佳實施例相同 之功效。 參閱圖10,是本發明傳導墊2第七較佳實施例，本實 施例與第一較佳實施例大致相同’差異處是在於傳導塾2 載面211疋呈凹弧態樣，藉此能方便底部呈弧狀之容器 42可以更為穩定地與貼置於該承載面211上，以接受電磁 源的加熱作用。 參閱圖11，是本發明傳導墊2第八較佳實施例，本實 籲 & U _、七較佳實施例大致相同，不同的地方是在於 該德壤爲 ΟΔ b 疋金屬粉末形態而與耐熱材料所製成之包覆層 21混合製成一體，其内部同樣設置有一集熱層23，且包覆 之承載面211亦呈凹弧態樣，藉此能達到與第三、七 較佳實施例相同之功效。 吞^閱目12、13，是本發明傳導塾2第九較佳實施例， Λ &例與第八較佳實施例大致相同’不同的地方是在於 呈凹弧態樣之居讲 载面211形成有多數個浮凸體215，且該等 201112991 浮凸體215的高度是由承載面211中央朝外圍漸增，藉此底 部呈弧狀之另一容器43可穩定地坐置於呈凹弧態樣之承载 面211上，且該容器43的重量並會壓迫該等浮凸體形 變而更服貼於該容器43的底面，如此，同樣能方便底部呈" 弧狀之另一容器43可以更為穩定地與貼置於該承載面211 上，達到與第八較佳實施例相同之功效。 综上所述，本發明傳導墊2藉由上述構造設計，可直 接置於-電磁源、3上而作為—導熱媒介，使各式材料之容 器均能透過傳導塾而接受電磁源3之加熱，另外’未置 於電磁源3上時，傳㈣2還可藉其底部之該等凸出體⑴ 之設計提供良好的隔熱及散熱，故確實能達成本發明之目 惟以上所述者，僅為本發明之較佳實施例而已，當不 =以此限定本發明實施之範圍，即大凡依本發心請:利 乾圍及發明說明内容所作簡 间早的等效變化與修飾， 屬本發明專利涵蓋之範圍内。 【圖式簡單說明】 圖 1是一剖視圖’說明本新型傳導塾第-較佳實施例 便用狀態圖 ^ 呪明該第一較佳實施例之傳導 塾置於電磁爐上的使用上態樣； 将等 ，其中傳導墊之傳導層是由不錄鋼網所製成’ ·實施例 圖4是-側視圖，輔助說明該第二較佳實施例； 201112991 圖5是一俯視立體圖，說明本新型傳導墊第三較佳實 施例之傳導塾底面間隔設有多數個呈凸粒形態之凸出體； 圖6是一使用狀態圖，說明該第三較佳實施例之傳導 藝置於一桌面的使用上態樣； 圖7是一俯視圖，說明本新型傳導墊第四較佳實施例 之傳導墊底面上的該等凸出體是呈環圈態樣； 圖8是一俯視圖，說明本新型傳導墊第五較佳實施例 之傳導墊底面上的該等凸出體是呈渦旋狀；The mesh shape and the sheet shape are formed by 'ring shape, spiral shape, and braid shape, and are described in the form of sheets in this embodiment. As for the heat accumulating layer 23, it is one selected from the group consisting of rock wool, glass fiber, non-asbestos layer, and glass wool. Wherein the non-asbestos layer is selected from one of the group consisting of calcium citrate, magnesium alumite, and a oxidizing solution. The embodiment is illustrated by calcium citrate. Referring to FIG. 2, in use, the conductive pad 2 can be placed on the electromagnetic source 3. In this example, the electromagnetic source 3 is described by an induction cooker, but this is not the case [by the induction cooker 3 The electromagnetic wave penetrates the heat collecting layer 23 and further the "conducting layer 22 generates molecular vibration to achieve the heat conduction. In particular, the material f characteristic of the heat collecting layer 23 has a heat insulating effect, so that the (4) energy can be generated and the hybrid yarn can be produced. Alternatively, the temperature below the recording layer 23 can be made smaller than the warm sound above the heat collecting layer 23, and the w/draw can be heated by the container 41 placed on the conductive pad 2. Since the container 41 is not required A material capable of generating a magnetic induction current, so that the container 41 of any material can be placed on the conductive crucible 2 and the heating of the induction cooker 3 is the second preferred embodiment. The difference lies in the conductive pad 2, see Figs. 3 and 4. The embodiment of the conductive pad of the present invention is substantially the same as the first preferred embodiment. The cladding layer 21 of 201112991 defines a bearing surface 211, and - opposite the contact surface 212 of the bearing surface 2, the conductive layer 22 is not recorded. a steel mesh is formed and disposed in the cladding layer 21 and exposed on the top edge thereof. In addition to the same effect as the first preferred embodiment, the mesh conductive layer 22 can provide a non-slip effect. Referring to Figures 5 and 6 ' is a third preferred embodiment of the conductive crucible 2 of the present invention, the present embodiment The example is substantially the same as the first preferred embodiment, except that the cladding layer 21 has a bearing surface 211, and a contact surface 212 opposite to the bearing surface 2n is provided with a plurality of protrusions on the contact surface 212. The body 213, in the present embodiment, 'the protrusion 213 is illustrated in a convex shape. Thus, the conductive pad 2 can be used as a heat conduction medium as in the first preferred embodiment, and can also leave the electromagnetic The conductive pad 2 of the source 3 (see FIG. 2) is directly placed on a table 5. The protrusions 213 and the like are spaced apart from the table top 5 to provide good heat insulation and heat dissipation, and prevent the high temperature container 41 from scalding the table top. 5. Referring to Figure 7, there is shown a fourth preferred embodiment of the conductive pad 2 of the present invention. This embodiment is substantially identical to the second preferred embodiment except that the projections are on the contact surface 212 of the conductive pad 2. 213 is a ring-like pattern that is spaced apart, thereby also serving as a heat conducting medium. The container of various materials can be heated by the electromagnetic source through the conductive pad 2, and can be used for heat insulation and heat dissipation after being removed from the electromagnetic source. Referring to Fig. 8 'is the fifth of the conductive pad 2 of the present invention. In the preferred embodiment, the present embodiment is substantially the same as the fourth preferred embodiment. The difference is that the protrusions 213 on the contact surface 212 of the conductive pad 2 are in a spiral shape. The medium enables the containers of various materials to pass through the conductive pad 2 and is heated by the electromagnetic source and removed from the electromagnetic source, and can also be used for heat insulation and heat dissipation. Referring to Fig. 9, the conductive pad of the present invention is used. In the sixth preferred embodiment, the present embodiment is substantially the same as the second preferred embodiment. The difference is that the protrusions 213 are in the form of intersections and ridges, and of course, they may be mostly parallel ridges. Not limited to this. The protrusions 213 are exposed on the bearing surface 211 of the cladding layer 21, and a plurality of grooves 214 are defined between the intersecting ridges. The grooves 214 are filled with a coating layer. 21 the same heat-resistant material, thereby providing various changes in the product, and also achieving the same effects as the second preferred embodiment. Referring to FIG. 10, which is a seventh preferred embodiment of the conductive pad 2 of the present invention, the present embodiment is substantially the same as the first preferred embodiment. The difference is that the conductive 塾2 carrier surface 211 is concavely curved. The container 42 which is convenient for the bottom of the arc can be more stably attached to the bearing surface 211 to receive the heating effect of the electromagnetic source. Referring to Figure 11, there is shown a eighth preferred embodiment of the conductive pad 2 of the present invention. The preferred embodiments of the present invention are substantially the same, except that the German soil is in the form of a ΟΔb 疋 metal powder. The coating layer 21 made of the heat-resistant material is mixed and integrated, and a heat collecting layer 23 is also disposed inside, and the covering bearing surface 211 is also in a concave arc state, thereby achieving better comparison with the third and seventh. The same effect as the examples. The ninth preferred embodiment of the conductive cymbal 2 of the present invention is substantially the same as the eighth preferred embodiment. The difference is that the surface of the conductive surface is in a concave arc state. 211 is formed with a plurality of embossed bodies 215, and the height of the 201112991 embossed bodies 215 is gradually increased from the center of the bearing surface 211 toward the periphery, whereby the other container 43 having an arc at the bottom can be stably placed in a concave shape. On the bearing surface 211 of the arc-like shape, and the weight of the container 43 is pressed to deform the embossing body and is more conformed to the bottom surface of the container 43, thus, it is also convenient to make another container with a curved bottom. 43 can be placed more stably on the carrying surface 211 to achieve the same effect as the eighth preferred embodiment. In summary, the conductive pad 2 of the present invention can be directly placed on the electromagnetic source 3 as a heat-conducting medium, so that the containers of the various materials can receive the heating of the electromagnetic source 3 through the conductive crucible. In addition, when 'not placed on the electromagnetic source 3, the transmission (4) 2 can also provide good heat insulation and heat dissipation by the design of the protrusions (1) at the bottom thereof, so that it is indeed possible to achieve the present invention. It is only the preferred embodiment of the present invention, and does not limit the scope of the implementation of the present invention, that is, the equivalent of the present invention: the equivalent change and modification of the simplification and the description of the invention. The scope of the invention is covered. BRIEF DESCRIPTION OF THE DRAWINGS FIG. 1 is a cross-sectional view showing the state of use of the conductive ferrule-preferred embodiment of the present invention, illustrating the use of the conductive raft of the first preferred embodiment on an induction cooker; And the like, wherein the conductive layer of the conductive pad is made of a non-recorded steel mesh'. FIG. 4 is a side view to assist the second preferred embodiment; 201112991 FIG. 5 is a top perspective view illustrating the new type In the third preferred embodiment of the conductive pad, the bottom surface of the conductive crucible is provided with a plurality of protrusions in a convex shape; FIG. 6 is a state diagram showing the conduction of the third preferred embodiment on a table top. Figure 7 is a top plan view showing the projections on the bottom surface of the conductive pad of the fourth preferred embodiment of the novel conductive pad in a looped state; Figure 8 is a top view showing the novel conduction The protrusions on the bottom surface of the conductive pad of the fifth preferred embodiment of the pad are in a spiral shape;
圖9是一俯視立體圖，說明本新型傳導墊第六較佳實 施例之傳導墊底面上的該等凸出體是呈交又凸條態樣； 圖10疋一使用狀態圖，說明本新型傳導墊第七較佳實 施例之傳導墊的承載面是呈凹弧態樣； 圖η是-剖視圖’說明本新型傳導墊第人較佳實施例 之傳導墊的承載面是呈凹弧能择，；社她 u狐態樣，而接觸面則凸設有多數 個凸粒狀之凸出體； 圖12疋-剖視圖’說明本新型傳導墊第九較佳實施例 之傳導墊的承載面是呈凹孤能 樣且形成有多數個浮凸體； 及 圖13是一使用狀態圖 較佳實施例。 辅助說明該本新型傳導墊第九 201112991 【主要元件符號說明】 23..........集熱層 211…··…承載面 212 ........接觸面 213 ........凸出體 214 ........凹槽 215 ........浮凸體 2 ...........傳導墊 3 ...... ，·電磁爐 41、42、43 容器 5 ...........桌面 21..........包覆層 22、24…傳導層 10FIG. 9 is a top perspective view showing the convex body on the bottom surface of the conductive pad of the sixth preferred embodiment of the present conductive pad in a state of intersection and convexity; FIG. 10 is a state diagram showing the conduction of the novel. The bearing surface of the conductive pad of the seventh preferred embodiment of the pad is in a concave arc state; FIG. η is a cross-sectional view showing that the bearing surface of the conductive pad of the preferred embodiment of the novel conductive pad is concave arc. The contact surface is convexly provided with a plurality of convex-shaped convex bodies; FIG. 12 is a cross-sectional view showing the bearing surface of the conductive pad of the ninth preferred embodiment of the novel conductive pad. The concave orphan energy is formed with a plurality of embossed bodies; and FIG. 13 is a preferred embodiment of a state of use diagram. Auxiliary description of the novel conductive pad ninth 201112991 [main component symbol description] 23.......... heat collecting layer 211...··... bearing surface 212........ contact surface 213. ....... protruding body 214........ groove 215........ embossed body 2 ........... conductive pad 3 .. ...., · Induction Cooker 41, 42, 43 Container 5 ........... Desktop 21....... Coating Layer 22, 24... Conductive Layer 10