JP2005334351A - Pan for electromagnetic induction cooker - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a pan for an electromagnetic induction cooker which can be applied to the electromagnetic induction cooker of different voltage. <P>SOLUTION: At the center position of the heating layer 4 of a casserole 1, a thick layer part 4A whose thickness is increased more than that of its peripheral area is provided. In the case of using the casserole 1 for an IH cooker 10 for 100V power source, a sufficient calorific value is secured by the thick layer part, so that heating power for actual use can be obtained. In the case of using the casserole 1 for an IH cooker 10 for 200V power source, even when the cooker heats an empty, an overheating prevention sensor 13 provided for the IH cooker 10 operates before reaching a dangerous state such as becoming red-hot of the heating layer 4, so that safety is secured. The casserole 1 can be used well for the IH cooker 10 of either for 100V power source or for 200V power source like this. <P>COPYRIGHT: (C)2006,JPO&NCIPI

Description

  The present invention relates to a pan for an electromagnetic induction heating cooker.

  In order to perform cooking using an electromagnetic induction heating type cooking device (IH cooking device), it is usually necessary to use a metal pan having conductivity. This is because eddy current is passed through the pan by electromagnetic induction and the pan itself is used as a heating element. However, in cooking, it may be preferable to use a pot made of a non-conductive material such as a clay pot in terms of flavor and heat retention.

Then, the thing of patent document 1 is proposed as a clay pot which can be used for an IH cooking device, for example. This is a product in which a thin metal film layer is formed on the bottom of a clay pot, and heating is performed when this film layer generates heat.
Utility Model Registration No. 3096191

  By the way, there are two types of IH cookers, one using a 100V power supply and the other using a 200V power supply, and it is recommended to use a dedicated pan suitable for each. That is, as a 100V pan corresponding to a cooking device for a 100V power source, a thick film layer is used to obtain a high heating power at a low voltage. On the other hand, as a 200V pan corresponding to a cooker for a 200V power source, one having a film layer thinner than a 100V pan is used in order to prevent overheating when emptying. However, it is troublesome for consumers to use different pots according to the types of cookers they own.

  In addition, if a customer accidentally uses a 100V pan in a cooker for 200V power supply and cooks it empty, there is a risk of overheating, which improves safety. It was sought after.

  This invention is made | formed in view of an above-described situation, The objective is to provide the pan for electromagnetic induction heating cooking appliances applicable to the electromagnetic induction heating cooking appliances from which voltage differs.

  A pan for an electromagnetic induction heating cooker according to the invention of claim 1 for solving the above-described problem is an electromagnetic induction in which a conductive heat generating layer is provided on the bottom of the outer wall of a pan body formed of a non-conductive material. In the cooking pan, a thick layer portion having a thickness larger than that of the peripheral region is provided at a central position of the heat generating layer.

  Invention of Claim 2 is a pan for electromagnetic induction heating cooking appliances of Claim 1, Comprising: The ratio of the thickness of the said thick layer part with respect to the thickness of the said surrounding area is 1.3 or more and 2.5 or less It is characterized by being inside.

  According to the present invention, in the pan for the electromagnetic induction heating cooker, the thick layer portion having a thickness larger than that of the peripheral region is provided at the center position of the heat generating layer.

  Here, when a conventional 200V pan is mistakenly used in a 100V cooker, a sufficient heating power cannot be obtained because the heat generating layer is thin. On the other hand, the pan of the present invention is provided with a thick layer portion having a large thickness, and a sufficient calorific value can be secured by this thick layer portion, so that a heating power that can be practically used can be obtained. . On the other hand, if a conventional 100V pan is used in a cooker for a 200V power source and is cooked empty, overheating may occur. On the other hand, when the pan of the present invention is used, the overheat prevention sensor provided in the cooking device works faster than when the conventional 100V pan is misused, so that safety can be ensured. . The reason for this is not necessarily clear, but the thin area around the heat generation layer suppresses abnormal heat generation as a whole layer, while the thick layer portion is heated more quickly, and this heat is detected by the overheat prevention sensor. It is thought that it may be communicated promptly.

  Hereinafter, the embodiment which actualized the pan for electromagnetic induction heating cooking appliances of the present invention is described in detail, referring to FIGS.

  In FIG. 1, the earthenware pot 1 (it corresponds to the pan for electromagnetic induction heating cooking appliances of this invention) which actualized this invention is shown. The earthenware pot 1 is provided with a pot body 2 for putting a food, and a heat generating layer 4 provided on the bottom 2A of the outer wall of the pot body 2.

  The pan body 2 is formed in a bottomed container shape from a non-conductive material such as pottery. On the outer wall bottom surface 2A of the pan body 2, an annular leg portion 3 protruding downward is provided at a position slightly inside the peripheral edge portion.

  A heat generating layer 4 formed in a thin disk shape as a whole is provided in an inner region of the leg portion 3 on the bottom outer wall of the pan body 2. The heat generating layer 4 is formed of a conductive material that generates heat when an electric current flows, such as metal or carbon. In the heat generating layer 4, a circular thick layer portion 4A protruding downward is provided in the central region of the disk, whereby the thickness of the central region of the heat generating layer 4 is thicker than the peripheral region 4B. Has been. The diameter of the thick layer portion 4A may be appropriately determined according to the arrangement of the coils in the IH cooker to be used, and varies depending on the model of the IH cooker. A range of 0.75 is preferable.

  Further, the ratio T1 / T2 of the thickness T1 of the thick layer portion 4A to the thickness T2 of the peripheral region 4B is preferably in the range of 1.3 to 2.5, and is preferably 1.5 to 1.75. More preferably. Those having T1 / T2 of less than 1.3 are difficult to create and are not realistic. Moreover, when T1 / T2 is 2.5 or more, the thickness of the heat generating layer 4 as a whole becomes too large, which is not practical, and the peripheral region 4B is not easily heated, and the cooking efficiency is lowered, which is not preferable.

  Such a heat generating layer 4 can be formed, for example, by sticking a thin film previously formed in a desired shape to the bottom surface of the pan body 2 with a heat-resistant ceramic adhesive or the like. Moreover, it can also form directly on the bottom face of the pan body 2 by a screen printing method, a thermal spraying method, or the like, or a transfer printing method which is one of ceramic decoration techniques.

  When cooking using the earthenware pot 1, as shown in FIG. 3, the food is put into the earthenware pot 1 and set on the plate 11 of the IH cooker 10. When the switch of the IH cooker 10 is turned on, magnetic current lines are generated by passing a current through the heating coil 12 built in the IH cooker 10. And when this magnetic line of force flows through the inside of the heat generating layer 4 of the earthenware pot 1, an eddy current is generated and the heat generating layer 4 generates heat. When this heat is transmitted to the cooked food in the clay pot 1, the cooked food is heated.

  Here, generally, the heating power increases as the thickness of the heat generating layer 4 increases. Therefore, if the heat generating layer 4 is formed thick, a large heating power can be obtained even with a low voltage IH cooker 10 for a 100 V power source, but red heat of the heat generating layer 4 is likely to occur due to a rapid temperature rise. Become. On the other hand, if the heat generating layer 4 is formed thin, red heat or the like of the heat generating layer 4 is less likely to occur, but it is difficult to obtain sufficient heating power for cooking with the IH cooker 10 for a 100V power source having a low voltage.

For this reason, in the earthenware pot 1 of this embodiment, it decided to provide the thick layer part 4A larger in thickness than the peripheral region in the center position of the heat generating layer 4. According to such a configuration, when this earthenware pot 1 is used in an IH cooker 10 for a 100 V power source, a sufficient amount of heat generation can be ensured in the thick layer portion, so that a heating power that can withstand practical use is obtained. be able to. On the other hand, when this earthenware pot 1 is used for the IH cooker 10 for the 200V power source, even if it has been blown by any chance, before the heat generation layer 4 becomes in a dangerous state such as red heat, Since the overheat prevention sensor 13 provided in the IH cooker 10 works, safety can be ensured.
Thus, the earthenware pot 1 of this embodiment can be preferably used for both the 100 V power source and the 200 V power source IH cooker 10.

  Hereinafter, the present invention will be described in more detail with reference to examples.

[Example group using IH cooker for 100V power supply]
<Example 1-1>
1) Equipment used, etc. As an IH cooking device, IHP-30VA manufactured by Toshiba Corporation that supports 100V power supply was used. This IH cooker includes a donut-shaped heating coil having an outer diameter of 180 mm and an inner diameter of 45 mm, and an overheat prevention sensor installed at the center position of the heating coil. As a pot, a ceramic earthen pot having an outer diameter of 270 mm, an inner diameter of 215 mm, a height of 70 mm, a thread tail height of 3 mm, and a bottom surface diameter of 190 mm was used.

2) Formation of heat generating layer A heat generating layer was formed on the bottom outer wall of the earthenware pot by the transfer printing method as follows.
(A) Using a silver paste, a circular thin film layer having a diameter of 180 mm was formed on a transfer sheet by screen printing. The thin film layer was dried at 50 ° C. for 2 hours.
(B) On the thin film layer formed in the above (A), a circular thin film layer having a diameter of 120 mm was laminated by screen printing so as to be concentric with the thin film layer. The thin film layer was dried at 50 ° C. for 2 hours.
(C) A resin cover coat was screen-printed so as to cover all the thin film layers formed in (A) and (B) above, and dried at 50 ° C. for 2 hours.
(D) The transfer (laminate of the thin film layer and the resin cover coat) formed in (C) was attached to the bottom outer wall of the earthenware pot and dried at 70 ° C. for 3 hours.
(E) The earthen pot with the transfer attached was baked at 880 ° C. for 3 hours, and this transfer was baked onto the earthen pot to obtain a heat generating layer having a thick layer portion at the center position. The thickness of the thick layer portion was 26.6 μm, and the thickness of the peripheral region was 20 μm (thickness ratio 1.33: 1).

3) Heating test 1.5 liters of water with a water temperature of 15 ° C. was placed in an earthen pot in which a heat generating layer was formed, and was heated in an IH cooker. The water temperature and the power consumption of the IH cooker were measured every predetermined time from the start of heating.

<Example 1-2>
The test was performed in the same manner as in Example 1-1 except that the thickness of the thick layer portion in the heat generating layer was 30 μm and the thickness of the peripheral region was 20 μm (thickness ratio 1.5: 1).

<Example 1-3>
The test was performed in the same manner as in Example 1-1 except that the thickness of the thick layer portion in the heat generating layer was 40 μm and the thickness of the peripheral region was 20 μm (thickness ratio 2: 1).

<Example 1-4>
The test was performed in the same manner as in Example 1-1 except that the thickness of the thick layer portion in the heat generating layer was 40 μm and the thickness of the peripheral region was 16 μm (thickness ratio 2.5: 1).

<Comparative Example 1-1>
The heat generating layer was a flat plate having no thick layer portion. That is, step (B) was omitted in “2) Formation of heat generation layer” in Example 1-1. The others were tested in the same manner as in Example 1-1. The thickness of the heat generating layer was 20 μm.

<Comparative Example 1-2>
The test was performed in the same manner as Comparative Example 1-1 except that the thickness of the heat generating layer was 40 μm.

<Result>
Tables 1 and 2 show changes in water temperature and power consumption from the start of heating to 20 minutes after the start of each example and comparative example.

  Here, the heating layer having no thick layer portion and having a thickness of 20 μm (Comparative Example 1-1) is equivalent to the conventional 200 V pan and having a thickness of 40 μm (Comparative Example). 1-2) is equivalent to a conventional 100V pan. From Table 1, in Comparative Example 1-2 having a thick heat generating layer, power of about 1300 to 1400 W was obtained, and the water temperature exceeded 90 ° C. 10 minutes after the start of heating, and sufficient heating power was obtained. . On the other hand, in Comparative Example 1-1 in which the heat generation layer is thin, only about 900 to 1000 W of power can be obtained, and sufficient heating power can be obtained, for example, the water temperature finally reaches 92 ° C. 14 minutes after the start of heating. You can see that it is not.

  On the other hand, in the case of Example 1-1 to Example 1-4 in which a thick layer portion was provided in the heat generating layer, the water temperature rose immediately after the start of heating, and in Comparative Example 1-2 equivalent to the conventional 100V pan Near heating power is obtained. In particular, in Example 3 and Example 4 in which the thick layer portion was 40 μm, both the water temperature and the power consumption were changed in substantially the same manner as in Comparative Example 1-2, and a heating power comparable to that of a conventional 100V pan was obtained. You can see that

[Example group using IH cooker with 200V power supply]
<Example 2-1>
As an IH cooker, HZ-HSW22A manufactured by Matsushita Electric Co., Ltd. that supports 200V power supply was used. This IH cooker includes a donut-shaped heating coil having an outer diameter of 180 mm and an inner diameter of 45 mm, and an overheat prevention sensor installed at the center position of the heating coil.
Similarly to Example 1-1, a heating test was performed in the same manner as in Example 1-1 using a clay pot in which a heat generating layer having a thickness of 26.6 μm in the thick layer portion and a thickness of 20 μm in the peripheral region was formed. .

<Example 2-2>
The test was performed in the same manner as in Example 2-1, except that the thickness of the thick layer portion in the heat generating layer was 30 μm and the thickness of the peripheral region was 20 μm.

<Example 2-3>
The test was performed in the same manner as in Example 2-1, except that the thickness of the thick layer portion in the heat generating layer was 40 μm and the thickness of the peripheral region was 20 μm.

<Example 2-4>
The test was performed in the same manner as in Example 2-1, except that the thickness of the thick layer portion in the heat generating layer was 40 μm and the thickness of the peripheral region was 16 μm.

<Comparative Example 2-1>
The test was performed in the same manner as in Example 2-1, except that the heat generating layer had a flat plate shape without a thick layer portion (step (B) was omitted in forming the heat generating layer). The thickness of the heat generating layer was 20 μm.

<Comparative Example 2-2>
The test was performed in the same manner as in Comparative Example 2-1, except that the thickness of the heat generating layer was 40 μm.

<Result>
Tables 3 and 4 show the changes in water temperature and power consumption from the start of heating to 9 minutes after the start of each example and comparative example.

  From Table 3 and Table 4, even when the IH cooker corresponding to 200V power supply is used similarly to the example group using the IH cooker corresponding to 100V power supply, Examples 2-1 to 2-4 provided with a thick layer portion As for the thing, it turned out that the heating power substantially comparable with the thing of the comparative example 2-2 equivalent to the conventional 100V pan is obtained.

[Example group using an IH cooker with 200V power supply and emptying]
<Example 3-1>
The same IH cooker as that used in Example 2-1 was used. As for the earthenware pan, one similar to Example 1-1 was used in which a heat generating layer having a thick layer portion thickness of 22.6 μm and a peripheral region thickness of 20 μm was formed.
A temperature sensor is attached to each of the three positions on the center position of the heat generating layer (R1 in FIG. 3), on the circumference of 100 mm in diameter (R2), and on the circumference of 160 mm in diameter (R3). It was.

  The earthenware pan was placed in an IH cooker with nothing inside, and was heated until the overheat prevention sensor (OHP) was activated and heating was stopped. The bottom surface temperature of the heat generating layer was measured by a temperature sensor every predetermined time from the start of heating. In addition, the power consumption of the cooker was also measured.

<Example 3-2>
The test was performed in the same manner as in Example 3-1, except that the thickness of the thick layer portion in the heat generating layer was 30 μm and the thickness of the peripheral region was 20 μm.

<Example 3-3>
The test was performed in the same manner as in Example 3-1, except that the thickness of the thick layer portion in the heat generating layer was 40 μm and the thickness of the peripheral region was 20 μm.

<Example 3-4>
The test was performed in the same manner as in Example 3-1, except that the thickness of the thick layer portion in the heat generating layer was 40 μm and the thickness of the peripheral region was 16 μm.

<Comparative Example 3-1>
The test was performed in the same manner as in Example 3-1, except that the heat generating layer had a flat plate shape without a thick layer portion (step (B) was omitted in forming the heat generating layer). The thickness of the heat generating layer was 20 μm.

<Comparative Example 3-2>
The test was performed in the same manner as in Comparative Example 2-1, except that the thickness of the heat generating layer was 40 μm.

<Result>
Tables 5 and 6 show the bottom surface temperature of the heat generating layer, the change in power consumption of the cooker, and the time until the overheat prevention sensor (OHP) is activated for each example and comparative example after 6 minutes from the start of heating. Show.

  From Tables 5 and 6, it was found that, in any earthenware pot, the heat generation layer had the highest temperature on the circumference with a diameter of 100 mm. This indicates that the region immediately above the heating coil of the IH cooker formed in a donut shape generates the heat most. On the other hand, it can be seen that the temperature rise at the center position of the heat generating layer outside the heating coil is fairly slow.

  In the case of a heating layer of 20 μm equivalent to a conventional 200 V pan (Comparative Example 3-1), the bottom surface temperature of the heating layer reached about 400 ° C. in a heating time of 6 minutes and 30 seconds, and the overheat prevention sensor was activated. At this time, the temperature on the circumference having a diameter of 100 mm increased to 645 ° C. Moreover, in the thing of the heat generating layer 40micrometer equivalent to the conventional pan for 100V (Comparative Example 3-2), the temperature on the circumference of the diameter of 100 mm in a heat generating layer will rise to 810 degreeC in 4 minutes of heating time, Damaged. At this time, the bottom surface temperature at the center position in the heat generation layer was only 200 ° C., and the overheat prevention sensor did not operate. Thus, when the heat generating layer is made thick in order to obtain a high heating amount, it can be seen that overheating occurs locally in the region immediately above the heating coil when air-spreading.

  On the other hand, in Examples 3-1 to 3-4 in which a thick layer portion is provided at the center of the heat generating layer, compared to that in Comparative Example 3-2, the heat generating layer has a 160 mm diameter circumference, that is, a layer The temperature rise is slow in the thin peripheral region, and accordingly, the temperature rise is moderate even on the circumference of 100 mm in diameter. On the other hand, the temperature rose rapidly at the center position, and the overheat prevention sensor was activated 4 minutes 20 seconds to 5 minutes 35 seconds after the start of heating. At this time, the temperature on the circumference having a diameter of 100 mm remained at 660 to 700 ° C., and the pan was not damaged.

  In this way, in the case where the thick layer portion is provided in the center of the heat generating layer, even if the air layer is mistakenly blown, local overheating of the heat generating layer is unlikely to occur, and the overheat prevention sensor works at an early stage. It turned out to be expensive.

The technical scope of the present invention is not limited by the above-described embodiments, and, for example, those described below are also included in the technical scope of the present invention. In addition, the technical scope of the present invention extends to an equivalent range.
(1) In the above embodiment, the shape of the heat generating layer is a disc shape. However, according to the present invention, the shape of the heat generating layer is not particularly limited, and may be, for example, rectangular or polygonal.
(2) In the above embodiment, the pot is made of earthenware. However, according to the present invention, the pot is not particularly limited, and may be heat-resistant glass, for example.

The perspective view which looked at the earthenware pot of this embodiment from the bottom side Cross-sectional view of the clay pot of this embodiment Side sectional view which shows a mode that it cooks using the earthenware pot of this embodiment

Explanation of symbols

1 ... Earthen pot (pan for electromagnetic induction heating cooker)
2 ... Pan body 2A ... Outer wall bottom surface 4 ... Heat generation layer 4A ... Thick layer part

Claims (2)

A pan for an electromagnetic induction heating cooker in which a conductive heat generating layer is provided on the bottom of the outer wall of the pan body formed of a non-conductive material,
A pan for an electromagnetic induction heating cooker, wherein a thick layer portion having a thickness larger than that of a peripheral region is provided at a central position of the heat generating layer.   The ratio of the thickness of the said thick layer part with respect to the thickness of the said surrounding area exists in the range of 1.3 or more and 2.5 or less, The pan for electromagnetic induction heating cooking appliances of Claim 1 characterized by the above-mentioned.

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