201109443 六、發明說明： 【發明所屬之技術領域】 圃本發明涉及—㈣衫置及應祕縣裝置之料斗，尤 t [0002] f% 其涉及-種便於裝卸料之還原裝置及應用於該還原裝置 之料斗。 【先前技術】 先則工業生產中’為提煉某種材料，常通過在一還原裝 置中進行還原反應來實現，如目前工業上常採用之皮江 法提練金屬。 [0003] 採用皮江法提煉金屬之方法具體包括：-，將含有給定 金屬元素之礦料和還原劑粉末混合壓制成原料球，之後 將該原料球置入真空還原罐中；二，於高溫真空狀態下 ，使原料球發生金屬還原反應生成金屬蒸汽；三，金屬 蒸汽在設置於還原罐σ之結晶筒内凝結為固態金屬^先 前之還原罐均為圓筒狀結構，原料球裝入到還原罐中進 行加熱升溫時，熱量之傳導通過還原罐罐壁向原料球傳 ❹ 遞。由於原料球具有較低之熱傳導率，顯然，與還原罐 内壁接觸之原料球溫度提升快，而與之相隔之原料球則 要通過與其相鄰之熱傳導率低之原料球進行熱量傳遞， 故’溫度提升緩慢’要達到反應溫度所需要之時間較長 。先前之還原罐巾，從加料_原反應基本完成，所f 要之時間-般於8〜12個小時之間，可見，先前之還 原罐對原料球進行加熱’存在達到還原反應之溫度所需 時間長，單位時間之生產效率低等缺陷。此外，先前還 原罐不易經常移動’從而導致原料球之裝人和還原反應 098129471 表單編號A0101 第3頁/共24頁 0982050551-0 201109443 結束後廢渣之排出較為困難° [0004] 於2006年7月17日中請’於2008年1月23日公開之一件公 開號為CN1011 〇9044A之中國公開專利申請揭示一種具有 導熱體之金屬還原罐’該導熱體與金屬還原罐之内壁相 連接，該導熱體具有較高之導熱性能’可有效提升與還 原罐内壁不相接觸之原料球之溫度提升速度’從而進一 步加快還原反應之速度。然而’該具有導熱體之還原罐 仍無法解決原料球之裝入和還原反應結束後廢渣排出較 為困難之問題。 【發明内容】 [0005] 有鑒於此，提供一種可提升原料之導熱速度’且易於原 料裝入及反應結束後廢渣排出之還原裝置及應用於該還 原裝置之料斗實為必要。 [0006] 一種還原裝置，其具有一腔體，其中，該還原裝置進一 步包括一滑動裝設於所述腔體内之一料斗。 [0007] —種用於還原裝置之辨斗，其中，該料斗具有一擋板及 一與該擋板相連且自該擋板周緣延伸設置之側板，所述 擋板與側板共同圍成一容置空間，複數個導熱元件設置 於該容置空間内。 [0008] 相較於先前技術，本發明提供之還原裝置具有以下優點 :本發明之還原裝置所採用之料斗可用於裝載還原物料 ，於反應過程中無需將該料斗取出，從而使裝卸料更加 方便’且人工勞動強度較小，耗時較短；由於本發明之 還原裝置具有複數個導熱元件，故可加快原料之導熱速 098129471 表單編號A0101 第4頁/共24頁 0982050551-0 201109443 度，進而加快原料之反應速度；由於本發明之還原物料 /、所述還原裝置之腔體通過所述料斗間隔設置，故不易 於腔體形成結渣，延長了該還原裝置之使用壽命。 【實施方式】 [0009]以下將結合附圖詳細說明本發明實施例所提供之還原裝 置及應用於該還原裝置之料斗。 [0010] Ο 凊參閱圖1及圖2，本發明第一實施例提供一種還原裝置 ，該還原裝置10包括一還原罐12及裝設於所述還原罐 12内之一料斗14 〇 "：： ；' ：.·'；. " '： ' [0011] 所述還原罐12具有一上方開口之腔體127，該腔體127呈 中空之圓柱狀。該還原罐12冬括一設置於肢體127内且靠 近所述開口之防火裝置122、一設置於防火裝置i 22上之 收集器123、一圍設於還原罐12外部且對應於收集器123 位置處之冷卻裝置12 4及一蓋置於所述腔體12 7開口之蓋 板 126。 3 … [0012] 所述還原罐12之腔體127由一圓形之底壁128及與底壁 128相連且向遠離該底壁128之方向延伸設置之侧壁121 共同圍成，可以理解地’本發明之還原罐12之腔體127可 以為其他形狀例如立方體或圓臺狀等，不限於圓柱形。 所述還原罐12之底壁128和側壁121之材料為具有較好導 熱性且耐高溫之材料’如耐熱鋼、碳化矽或氮化石夕等， 本實施例中，該還原罐腔體127之材料為耐熱鋼。 [0013] 所述防火裝置122設置於所述腔體127内，並與所述還原 罐側壁121接觸設置’且該防火裝置122與所述料斗14間 098129471 表單編號A0101 第5頁/共24頁 0982050551-0 201109443 隔一定距離設置，該防火裝置122用於防止於還原反應過 程或結束後物料於高溫環境下與空氣發生反應而引起燃 燒之現象，該防火裝置122可以為先前之防火板等裝置， 可以理解，該防火裝置122為本發明之可選裝置。本實施 例中，該防火裝置122呈板狀設置。 [0014] 所述收集器123呈中空圓柱狀，其設置於所述腔體127内 且與所述防火裝置122遠離所述料斗14之表面相抵靠，該 收集器123用於收集經過還原反應所形成之蒸汽。 [0015] 所述冷卻裝置124呈圓環套筒狀，其設置於與該收集器 123相鄰之部分還原罐側壁121外，該冷卻裝置124用於 冷卻所述收集器123，使該收集器123收集之蒸汽凝固， 從而形成最終被還原之產物。該冷卻裝置124可以為散熱 鰭片，水冷散熱裝置或其他用以散熱之裝置。 [0016] 所述蓋板126呈板狀結構設置，其蓋置於所述還原罐12之 腔體127之開口上，用於將所述料斗14、收集器123及防 火裝置122共同封裝於所述還原罐12内。 [0017] 此外，該還原罐12還進一步包括一抽真空管125，該抽真 空管125設置於與所述開口相鄰之還原罐側壁121處，用 於對整個還原罐12進行抽真空處理。 [0018] 所述料斗14滑動設置於所述還原罐12之腔體127内且置於 所述防火裝置122之下方。該料斗14之形狀不限，優選地 ，該料斗14之形狀與該腔體127之形狀相似且該料斗14與 ’ 該腔體127相互配合。 [0019] [0019] 請參考圖2，所述料斗14具有一容置空間143，其包括 098129471 表單編號A0101 第6頁/共24頁 0982050551-0 201109443 設置於該容置空間143内之導熱結構146。所述容置空間 143由一擋板142及一與該擋板142相連且自該於板m2周 緣延伸設置之侧板144共同圍成。具體地，所述播板14@ 與所述還原罐12之底壁128相對且可相互抵靠。所述側板 144與所述還原罐12之侧壁121相互配合。本實施例中， 所述導熱結構146設置於所述侧板144且從該侧板144向 所述容置空間143内延伸。 [0020] Ο 所述料斗14之形狀及大小依據所述還原罐丨2之腔體127之 形狀及大小設定。該還原罐12可容置一個或複數個料斗 14，當其可容置複數個料斗14時，該複數個料斗14之總 長度應略小於所述還原罐12之腔體127之有效長度，即去 除所述防火裝置122、收集器123、冷卻裝置〗24及蓋板 126所占腔體127之體積後剩餘腔體127部分之長度。本 實施例中，所述還原罐12容置一個料斗14。 [0021] Ο 本實施例中，該料斗14之擋板142為一圓缺形之平板鍺構 ’所述側板144從所述‘板142之圓孤形邊緣向垂直於該 擋板142之方向延伸，從而形成所攀容置空間143。所述 料斗14之材料具有較好之導熱性，其熔點高於於該還原 裝置10中進行還原反應之反應物所需達到之溫度，且其 具有較好之強度及剛度。具體地，所述料斗14之材料玎 選用耐熱鋼、碳化矽或氮化矽等，其材料可以與所述還 原罐12之腔體127之材料相同或不同，本實施例中，所述 料斗14與所述還原罐12之材料相同，即所述料斗14之材 料選用耐熱鋼。 · 098129471 所述料斗14中之擋板142和側板144之厚度可以任意設定 表單編號A0101 第7頁/共24頁 0982050551-0 [0022] 201109443 ，為節省成本，於滿足一定剛度和強度之前提下，即當 進行還原反應之物料被裝入該料斗14後，該料斗14不致 被壓變形或者破裂，該擋板142和侧板144之厚度可儘量 小。本實施例中’該擋板142和侧板144之厚度為2毫米 ~ 10毫米。 [0023] 所述擋板142之圓弧所對之圓心角之範圍不限，優選為 270度〜300度。該圓心角之大小會影響裝料之多少，當該 圓心角較大時’所述擋板142和側板144共同構成之容置 空間143較大’從而可以裝更多物料。所述擋板142及側 板14 4共同形成一間口，於裝料之過程中，物料可從該開 口裝入該容置空間143中。 [0024] 所述擋板142或側板144可進一步設有複數個開孔145， 該複數個開孔145均勻分佈於所述擋板142或側板144上 ，該開孔145之大小依據進行還原反應之物料之粒徑大小 設定’即該開孔145之直徑要小於物料之粒徑大小，從而 避免物料從料斗14中漏出’同時’該開孔145之形狀不限 。該侧板144或擋板142上之開孔率為30%〜70%，即每平 方米之侧板144或擋板142上之開孔145所占面積為〇. 3平 方米〜0. 7平方米。本實施例中，該開孔145為圓形開孔， 其直徑為15 mm~25mm，該側板144上之開孔率為50%， 即每平方米之侧板144上開孔145所占面積為0.5平方米 «該開孔145之設置可進一步節省材料、降低成本並減小 整個料斗14之重量’同時’該還原反應過程中產生之蒸 汽可從該開孔145通過，從而加快蒸汽之擴散速度。 [0025]所述導熱結構I46包括複數個均句分佈於所述側板144並 098129471 表單編號A0101 第8頁/共24頁 0982050551-0 201109443 Ο 朝所述容置空間143延#之導熱元件146〇，所述導熱元件 1460可以為任意形狀，如平板狀導熱元件、柱狀導熱元 件。所述平板狀導熱元件之截面積可以為任意形狀，如 矩形、三角形或五邊形等，所述杈狀導熱元件之截面積 可以為任意形狀，如圓形、二角形或五邊形等。所述導 熱元件1 460可與所述侧板144 —體成形，也可通過焊接等 方式設置於所述侧板144之内壁上。所述導熱結構146之 總體積占還原罐12之腔體127體積之〇. 5%〜2〇%，優選為 u〜ιο%。本實施例中，所述導熱元件146〇呈柱狀設置， 其圓形截面之直控為10mm〜35mm ’該每個導熱元件146〇 沿其設置於側板144之位置之法線方向延伸，並均勻分佈 於該侧板144上。具體地，由於該侧板:144從所述擋板 142之圓弧形邊緣向垂直於該擋裣142之方向延伸，故該 側板144所形成之表面為一圓柱面之部分表面，該導熱元 件1460可垂直該侧板144所於圓才主面上之一螺線均勻’分佈 於該侧板144之表面。可㈣解，所述導熱元件146〇也可 〇 [0026] 設置於所述料斗14之擋板142上，即該導熱元们偏可 設置於所述料斗14之任意内壁上。 當物料於所i««置U)中進行還原反應時，還原㈣ 之熱量可通過該還原罐12之側壁121和底壁128迅速傳遞 至與該側壁121和底壁128直接接觸之物料，而該還原裝 置10争沒有與側壁121和底壁128直接接觸之物料則可通 過所述具有較好導熱性能之導熱結構146迅速加熱，故該 導熱結構146之設置可增加整個還原裝置10之導熱面積， 降低導熱體與還原物料之導熱距離，從而使所述物料更 098129471 表單編號A0101 第9頁/共24頁 〇982〇5〇551-〇 201109443 快更均勻地被加熱到反應溫度。 [0027] 進一步地，所述料斗14可進一步包括一端板147，所述端 板147設置於所述侧板144遠離所述擋板142—端之邊緣 ，其分別與所述收集器123和所述擋板142相對且間隔設 置。其可以為任意形狀，本實施例中，該端板147與所述 擋板142之形狀相同，即為圓缺形，且與該擋板142平行 。該端板147之厚度不限，本實施例中，其厚度為 3mm~6mm。該端板147之設置可固定物料，從而避免物料 撒漏於料斗14之外侧。此外，該端板147可進一步包括複 數個開孔（圖未示），該開孔之輋徑應小於物料之直徑 ，以避免物料從該開孔漏出。該單位面積之端板147中， 開孔面積所占比例為30%〜70%。由於談端板447與所述收 集器123相對設置，故，該開孔之存於可以使於反應過程 中產生之蒸汽迅速從該開孔通過，從而加快整個還原反 應之速度。進一步地，該料斗14還可包括一設置於所述 端板I47表面之拉環I48，慧拉環U8脅與該端板U7一體 成形，也可通過焊接尊方式焊接於所述端板147面向所述 收集器123之表面。通過該拉環148可以將所述料斗14從 所述還原罐12中拉出。該拉環148可以為任意形狀，其形 狀之設計僅需滿足便於將所述還原罐12拉出即可。 [0028] 在組裝及使㈣程巾，㈣反應之物卿认所述料斗14 並推入所述還原賴之㈣127巾；依切所述防火裝置 、置入腔體127中再將冷卻襄置124安裝於 腔體127外壁與收集器123對應之位置處；賴述蓋板 126將所㈣原罐12封住；通過所熟真空管125將所述 098129471 表單編號A0101 第10頁/共24頁 0982050551-0 201109443 還原裝置10抽真空；採用一加熱裝置對該還原裝置10進 行加熱以達到進行還原反應所需溫度；待反應結束之後 ，打開還原罐12之蓋板126，並依次將收集器123、防火 裝置122及料斗14從還原罐12中取出。 [0029] 上述裝料過程為，於還原罐12外將所需物料裝入所述料 斗14中，並將該料斗14直接推入所述還原罐12中即可， 該料斗14於物料進行還原反應之整個過程中無需取出。 當反應結束之後’反應物之殘渣依然容置於該料斗14中 ^ ，故，卸除殘渣時，僅需將上述敎:集器123、防火裝置及 〇 ^ 蓋板126等依次取出’將料斗14拉出，並將殘渣直接從料 斗14倒出即可，從而避免了因還雇罐12體積較大，裝料 過程需用一裝載工具反復多次勝物料向還原罐12中裝入 .... ： ，或卸料過程用一卸載工具反復將殘渣取出而導致勞動 強度較大、耗費時間較長之缺點可見，採用該料斗14 使裝卸料更方便’勞動強度較小，耗時較短。另，向料 斗14中裝料，將料斗Η推入還原罐Γ2，反應後將料斗14 Q 拖出之過程可通過機械自動化實現，從而擺脫了人力裝 卸料之低效率勞動。此外’該料斗14也可避免物料與還 原罐側壁121直接接觸’從而進一步避免了高溫還原結束 後，因還原罐側壁121形成結渣而清洗困難之缺點’即本 發明之物料不會直接與還原罐側壁121之内壁接觸，而係 與料斗14接觸’故於反應過程中不易於還原罐侧壁121之 内壁直接形成結潰’而若於料斗丨4上形成結渣，由於料 斗14重量較輕，方便移動，故其清洗結渣之過程也較為 方便。 098129471 表單編號Α0101 第11頁/共24頁 0982050551-0 201109443 [0030] 本發明還提供一第二實施例之還原裝置，該還原裝置包 括與第一實施例具有相同結構之還原罐及裝設於該還原 罐中之料斗14a。還原罐具體結構參前描述及圖1，這裏 不再贅述。請參閱圖3，該料斗14a之結構除導熱結構 14 6 a不同於第一實施例之導熱結構14 6之外，其他結構均 與第一實施例相同。其具體區別在於’本實施例之料斗 14a之導熱結構146a包括複數個截面積為圓缺形之平板狀 導熱元件1460a，該複數個導熱元件1460a之形狀及面積 與所述擋板142之形狀及面積相同，且與該擋板142相互 平行間隔設置。本實施例中’該複數個導熱元件1460a等 間隔設置，從雨將容置空間143分隔成複數個大小相等之 區間。可以理解，該複數個導熱元件1460a也可不等間隔 設置。該導熱元件1460a之厚度為2mm〜15mm。該複數個 導熱元件1460a可通過焊接等方式設置於所述側板144， 也可於所述侧板144上設置卡槽’將所述導熱元件i46〇a 嵌於該卡槽中，從而達到固定之目的。本實施例中，該 複數個導熱元件1460a也可邊一步支撐所述料斗14a，使 該具有較薄厚度之料斗14a之強度有所提高，從而延長了 該料斗14a之使用壽命。 [0031] 本發明還提供一第三實施例之還原裝置，該還原襄置包 括與第一實施例具有相同結構之還原罐及裝設於該還原 罐中之料斗14b，還原罐具體結構參前描述及圖1這裏不 再贅述。請參閱圖4,該料斗14b之擋板142b，侧板144b 及端板147b之形狀構造不同於第一實施例中之擋板142， 側板144及端板147，本實施例中導熱結構146之形狀同 098129471 表單編號A0101 第12頁/共24頁 0982050551-0 201109443 Ο [0032] 第一實施例相同。具體地，本實施例料斗14b之擋板142b 為圓形之平板結構’所述侧板1441)從所述擋板142b之圓 弧形邊緣向垂直於該擋板142b之方向延伸，從而形成一 圓筒形之容置空間143b。且所述端板147b之形狀與所述 擋板142b之形狀相同，即為圓形平板結構，該端板147b 活動設置於所述側板144b，如通過一卡鉤與所述側板 144b相連接。當於裝卸料之過程中，該端板147b可打開 ，以將所需物料裝入或者卸出。本實施例中，所述料斗 14b由於具有一圓筒形之容置空間143b而可以容置較多之 反應物料。 此外，本實施例可進一步包括一與所述容置空間143b相 連通之開口 149，該開口 149設置於所述側板144b上該 開口 149之面積大小和形狀不限，本f施例中該開口 149 之面積為整個側板14413面積之四分之〆，該開口 149可以 方便裝卸料，即所需物料既可以通過打開上述端板147裝 入或卸出，也可以直接從該開口 149装八咸卸出。 G [酬 本發明還提供一第|替施例之還原裝裏，該還原裝置包 括與第-實施例具有相同結構之朗#絲設於該還原 罐中之料斗14c，還原罐具體結構參前描述及圖1，这裏 不再贅述。請參閱圖5 ,該料斗14c之結構除導熱結構 146c不同於第三實施例之外，其他錄構均與第三實施例 相同。其具體區別於於，本實施例之導熱結構146c包括 複數個矩形平板狀導熱元件146〇c，該導熱元件H60c均 勻且垂直分佈於所述側板14413上。该導熱凡件1460〇所 於之平面垂直於所述擋板142b所於J面’且該導熱疋 098129471 表單編號A0101 第13頁/共24頁 0982050551-0 201109443 件1 460C之長度方向從所述擋板丨42b延伸至所述端板 147b ’同時，該導熱元件1460c之寬度方向從所述侧板 144b向所述容置空間143b内延伸，該延伸方向即為其於 所述侧板144b位置處之法線方向。 [0034] 本發明還提供一第五實施例之還原裝置，該還原裝置包 括一還原罐及一料斗14d。請參閱圖6，本實施例之還原 罐除腔體與第一實施例不同外，其他結構與第一實施例 均相同’具體為’該還原罐具有一立方體形筒狀結構之 腔體。該還原罐之其他結構於此不再贅述。此外，本實 施例之料斗14d之外形與本實施例之還原罐之腔體形狀對 應，即均為立方體形，導熱_146$形狀與第一實施例 相同’其他結構之具體區別於於，所述料斗14d之擋板 “2d為一矩形平板狀結構，所述側板I44d從該擂板I42d 之其中三條直邊邊緣向垂直於該擋板142d之方向延伸。 [0035] 此外，本發明還原裝置之腔體、料斗及導熱元件等之結 構及形狀不限於上述實施例中所描述之具體結構及形狀 ’本領域技術人員於本發明精神範圍之内作相應之變化 均屬本發明之保護範圍。 [0036] 本發明提供之還原裝置具有以下優點：本發明之還原裝 置所採用之料斗可用於裝載還原物料，其厚度較薄，重 量較輕，便於移動，在反應過程中無需將該料斗取出’ 從而使裝卸料更加方便，且人工勞動強度較小，耗時較 短；由於本發明之還原物料與所述還原罐通過所述料斗 間隔設置，故不易於還原罐形成結渣，延長了該還原罐 之使用壽命；所述料斗還包括一導熱結構，該導熱結構 098129471 表單編號A0101 第14頁/共24頁 0982050551-0 201109443 增加了整個還原裝置之導熱面積，可使處於中間位置之 勿料迅速被加熱，從而加快反應速度，減少能耗；所述 料斗具有複數個開孔，該開孔可節省材料，降低整個料 斗之重量，同時為反應過程中所產生之蒸汽提供複數個 擴散通道，從而加快了反應速度。 [0037] Ο [0038] [003¾] [0040] Ο [0041] [0042] [0043] 098129471 鉍上所述，本發明確已符合發明專利之要件，遂依法提 出專利申請。惟，以上所述者僅為本發明之較佳實施方 式，自不能以此限制本案之申請專利範圍。舉凡熟悉本 案技藝之人士援依本發明之精神所作之等效修飾或變化 ，皆應涵蓋於以下申請專利範圍内。 【圖式簡單綱】 圖1為本發明第一實施例提供之還原裝置結構示意圖。 圖2為本發明第一實施例提供之還原裝置中之料斗結構示 意圖。 圖3為本發明第二實施例提供之還原裝置中之料斗結構示 意圖。 圖4為本發明第三實施例提供之還原裝置中之料斗結構示 意圖。 圖5為本發明第四實細·例提供之還原裝置中之料斗結構示 意圖。 圖6為本發明第五實細·例提供之還原裝置中之料斗結構示 意圖。 【主要元件符號說明】 0982050551-0 表單編號Α0101 第15頁/共24頁 201109443 [0044] 還原裝置 10 還原罐 12 側壁 121 防火裝置 122 收集器 123 冷卻裝置 124 抽真空管 125 蓋板 126 腔體 127 底壁 128 料斗 14，14a，14b，14c，14d 擋板 142，142b，142d 容置空間 143 ， 143b 侧板 144 ， 144b ， 144d 開孔 145 導熱結構 146 ， 146a ， 146c 導熱元件 1460 ， 1460a ， 1460c 端板 147 ， 147b 拉環 148 開口 149 098129471 表單編號A0101 第16頁/共24頁 0982050551-0201109443 VI. Description of the invention: [Technical field to which the invention pertains] The present invention relates to (4) hoppers for hoods and equipments of Yingsui County, especially t [0002] f% relates to a reduction device for loading and unloading materials and The hopper of the reduction device. [Prior Art] In the industrial production, in order to refine a certain material, it is often achieved by a reduction reaction in a reduction apparatus, such as the Pijiang method currently used in the industry. [0003] The method for extracting metal by using the Pijiang method specifically comprises: - mixing a mineral material containing a given metal element and a reducing agent powder into a raw material ball, and then placing the raw material ball into a vacuum reduction tank; In the high-temperature vacuum state, the metal ball is subjected to metal reduction reaction to form metal vapor; third, the metal vapor is condensed into a solid metal in a crystal cylinder disposed in the reduction tank σ. The previous reduction tanks are all cylindrical structures, and the raw material balls are loaded. When the temperature is raised to the reduction tank, the conduction of heat is transferred to the material ball through the wall of the reduction tank. Since the raw material ball has a low thermal conductivity, it is obvious that the temperature of the raw material ball in contact with the inner wall of the reduction tank is increased rapidly, and the raw material ball separated from it is subjected to heat transfer through the adjacent raw material ball having a low thermal conductivity, so that ' Slow temperature rise 'The time required to reach the reaction temperature is longer. The previous reduction cans were basically completed from the feed_original reaction, and the time required was generally between 8 and 12 hours. It can be seen that the previous reduction tank heats the raw material ball, which is required to reach the temperature of the reduction reaction. Long time, low production efficiency per unit time and other defects. In addition, the previous reduction tank is not easy to move frequently', which leads to the loading and reduction reaction of the raw material ball 098129471 Form No. A0101 Page 3 / Total 24 page 0982050551-0 201109443 It is difficult to discharge the waste residue after the end [0004] in July 2006 In the Japanese Patent Application Publication No. CN1011 〇 9044A, which discloses a metal reduction tank having a heat conductor, which is connected to the inner wall of the metal reduction tank, The thermal conductor has a higher thermal conductivity, which can effectively increase the temperature increase rate of the raw material ball which is not in contact with the inner wall of the reduction tank, thereby further accelerating the reduction reaction. However, the reduction tank having a heat conductor cannot solve the problem that the discharge of the raw material ball and the discharge of the residue after the completion of the reduction reaction are difficult. SUMMARY OF THE INVENTION [0005] In view of the above, it is necessary to provide a reducing apparatus which can increase the heat transfer rate of a raw material and which is easy to be charged in the raw material and discharged after the completion of the reaction, and a hopper applied to the reducing apparatus. A reduction device having a cavity, wherein the reduction device further includes a hopper that is slidably mounted in the cavity. [0007] A rifle for a reduction device, wherein the hopper has a baffle and a side plate connected to the baffle and extending from a periphery of the baffle, the baffle and the side plate together form a cavity A plurality of heat conducting elements are disposed in the accommodating space. Compared with the prior art, the reduction device provided by the present invention has the following advantages: the hopper used in the reduction device of the present invention can be used for loading the reducing material, and the hopper is not required to be taken out during the reaction, thereby making the loading and unloading more convenient. 'And the labor intensity is small and the time is short; since the reduction device of the invention has a plurality of heat conduction elements, the heat conduction speed of the raw material can be accelerated 098129471 Form No. A0101 Page 4 / Total 24 page 0982050551-0 201109443 degrees, The reaction speed of the raw materials is accelerated; since the reducing material of the present invention/the cavity of the reducing device is disposed through the hopper, the slag formation is not easily formed in the cavity, and the service life of the reducing device is prolonged. [Embodiment] Hereinafter, a reducing device and a hopper applied to the reducing device according to an embodiment of the present invention will be described in detail with reference to the accompanying drawings. [0010] Referring to FIG. 1 and FIG. 2, a first embodiment of the present invention provides a reduction device 10 including a reduction tank 12 and a hopper 14 installed in the reduction tank 12 〇": [0011] The reduction tank 12 has a cavity 127 that is open at the top, and the cavity 127 has a hollow cylindrical shape. The reduction tank 12 includes a fire prevention device 122 disposed in the limb 127 and adjacent to the opening, a collector 123 disposed on the fire prevention device i22, and a periphery of the reduction tank 12 and corresponding to the collector 123. The cooling device 12 4 and a cover 126 are placed on the opening of the cavity 12 7 . 3 [0012] The cavity 127 of the reduction tank 12 is surrounded by a circular bottom wall 128 and a side wall 121 connected to the bottom wall 128 and extending away from the bottom wall 128, as can be understood The cavity 127 of the reduction can 12 of the present invention may have other shapes such as a cube or a truncated cone shape, etc., and is not limited to a cylindrical shape. The material of the bottom wall 128 and the side wall 121 of the reduction tank 12 is a material having good thermal conductivity and high temperature resistance, such as heat resistant steel, tantalum carbide or nitriding stone, etc. In this embodiment, the reduction tank cavity 127 The material is heat resistant steel. [0013] The fire prevention device 122 is disposed in the cavity 127 and is disposed in contact with the reduction can sidewall 121 and the fire protection device 122 and the hopper 14 are 098129471. Form No. A0101 Page 5 of 24 0982050551-0 201109443 The fire prevention device 122 is used to prevent the phenomenon that the material reacts with the air in a high temperature environment to cause combustion after the reduction reaction process or the end, and the fire prevention device 122 can be a device such as a fireproof board. It can be understood that the fire protection device 122 is an optional device of the present invention. In this embodiment, the fire prevention device 122 is provided in a plate shape. [0014] The collector 123 has a hollow cylindrical shape, and is disposed in the cavity 127 and abuts against the surface of the fire prevention device 122 away from the hopper 14. The collector 123 is used for collecting and reducing the reaction. Formed steam. [0015] The cooling device 124 has a circular sleeve shape disposed outside a portion of the reduction tank sidewall 121 adjacent to the collector 123, and the cooling device 124 is configured to cool the collector 123 to make the collector The vapor collected by 123 solidifies to form the final reduced product. The cooling device 124 can be a heat sink fin, a water cooled heat sink or other means for dissipating heat. [0016] The cover plate 126 is disposed in a plate-like structure, and the cover is placed on the opening of the cavity 127 of the reduction can 12 for packaging the hopper 14, the collector 123 and the fire prevention device 122 together. The reduction tank 12 is described. Further, the reduction tank 12 further includes an evacuation tube 125 disposed at the reduction tank side wall 121 adjacent to the opening for vacuuming the entire reduction tank 12. [0018] The hopper 14 is slidably disposed in the cavity 127 of the reduction tank 12 and disposed under the fire protection device 122. The shape of the hopper 14 is not limited. Preferably, the shape of the hopper 14 is similar to the shape of the cavity 127 and the hopper 14 and the cavity 127 are fitted to each other. [0019] Please refer to FIG. 2, the hopper 14 has an accommodating space 143, which includes 098129471. Form No. A0101 Page 6 / Total 24 pages 0992050551-0 201109443 Thermally conductive structure disposed in the accommodating space 143 146. The accommodating space 143 is surrounded by a baffle 142 and a side plate 144 connected to the baffle 142 and extending from the periphery of the plate m2. Specifically, the playing board 14@ is opposite to the bottom wall 128 of the reduction tank 12 and can abut each other. The side plates 144 and the side walls 121 of the reduction tank 12 cooperate with each other. In this embodiment, the heat conducting structure 146 is disposed on the side plate 144 and extends from the side plate 144 into the accommodating space 143. [0020] The shape and size of the hopper 14 are set according to the shape and size of the cavity 127 of the reduction can 2 . The reduction tank 12 can accommodate one or more hoppers 14. When it can accommodate a plurality of hoppers 14, the total length of the plurality of hoppers 14 should be slightly smaller than the effective length of the cavity 127 of the reduction tank 12, that is, The length of the portion of the remaining cavity 127 after removing the volume of the cavity 127 occupied by the fire prevention device 122, the collector 123, the cooling device 24, and the cover plate 126 is removed. In the embodiment, the reduction tank 12 houses a hopper 14. [0021] In the present embodiment, the baffle 142 of the hopper 14 is a round-shaped flat plate. The side plate 144 extends from the rounded edge of the 'plate 142 toward the direction perpendicular to the baffle 142. , thereby forming a climbing accommodation space 143. The material of the hopper 14 has a good thermal conductivity, and its melting point is higher than the temperature required for the reactant for the reduction reaction in the reduction device 10, and it has good strength and rigidity. Specifically, the material of the hopper 14 is made of heat-resistant steel, tantalum carbide or tantalum nitride, etc., and the material thereof may be the same as or different from the material of the cavity 127 of the reduction tank 12. In the embodiment, the hopper 14 The material of the reduction tank 12 is the same, that is, the material of the hopper 14 is made of heat-resistant steel. · 098129471 The thickness of the baffle 142 and the side plate 144 in the hopper 14 can be arbitrarily set. Form No. A0101 Page 7 / Total 24 page 0982050551-0 [0022] 201109443, in order to save cost, before meeting certain rigidity and strength That is, after the material subjected to the reduction reaction is loaded into the hopper 14, the hopper 14 is not deformed or broken by pressure, and the thickness of the baffle 142 and the side plate 144 can be as small as possible. In the present embodiment, the thickness of the baffle 142 and the side plate 144 is 2 mm to 10 mm. [0023] The range of the central angle of the arc of the baffle 142 is not limited, and is preferably 270 to 300 degrees. The size of the central angle affects the amount of the charge. When the central angle is large, the baffle 142 and the side plate 144 together form a larger accommodation space 143 so that more material can be loaded. The baffle 142 and the side plates 14 4 together form a port from which material can be loaded into the accommodating space 143 during the charging process. [0024] The baffle 142 or the side plate 144 may further be provided with a plurality of openings 145, and the plurality of openings 145 are uniformly distributed on the baffle 142 or the side plate 144, and the size of the opening 145 is determined according to the reduction reaction. The particle size of the material is set to 'the diameter of the opening 145 is smaller than the particle size of the material, so as to prevent the material from leaking out of the hopper 14 while the shape of the opening 145 is not limited. The area of the opening 145 of the side plate 144 or the baffle 142 is 〇. 3 square meters to 0. 7 Square meters. In this embodiment, the opening 145 is a circular opening having a diameter of 15 mm to 25 mm, and the opening ratio of the side plate 144 is 50%, that is, the area occupied by the opening 145 of the side plate 144 per square meter. The arrangement of 0.5 square meters «the opening 145 can further save material, reduce the cost and reduce the weight of the entire hopper 14' while the steam generated during the reduction reaction can pass through the opening 145, thereby accelerating the diffusion of steam. speed. [0025] The heat conducting structure I46 includes a plurality of uniform sentences distributed on the side plate 144 and 098129471. Form No. A0101 Page 8 / Total 24 pages 0992050551-0 201109443 导热 Thermal conduction element 146 toward the accommodating space 143 The heat conducting element 1460 can be any shape, such as a flat heat conducting element or a columnar heat conducting element. The cross-sectional area of the flat heat conducting member may be any shape such as a rectangle, a triangle or a pentagon, and the cross-sectional area of the braided heat conducting member may be any shape such as a circle, a square or a pentagon. The heat conducting element 1 460 may be integrally formed with the side plate 144 or may be disposed on the inner wall of the side plate 144 by welding or the like. The total volume of the heat conducting structure 146 is 5% to 2%, preferably u~ιο%, of the volume of the cavity 127 of the reduction tank 12. In this embodiment, the heat conducting element 146 is arranged in a column shape, and the direct control of the circular cross section is 10 mm to 35 mm. The each heat conducting element 146 延伸 extends along the normal direction of the position where the side plate 144 is disposed, and It is evenly distributed on the side plate 144. Specifically, since the side plate: 144 extends from the arcuate edge of the baffle 142 to the direction perpendicular to the dam 142, the surface formed by the side plate 144 is a part of a cylindrical surface, and the heat conducting component 1460 can be perpendicular to the surface of the side plate 144 on the main surface of the circle evenly distributed on the surface of the side plate 144. In the fourth embodiment, the heat conducting element 146 can also be disposed on the baffle 142 of the hopper 14, that is, the heat conducting element can be disposed on any inner wall of the hopper 14. When the material is subjected to a reduction reaction in the i««U, the heat of the reduction (4) can be quickly transferred to the material in direct contact with the side wall 121 and the bottom wall 128 through the side wall 121 and the bottom wall 128 of the reduction tank 12, and The material of the reducing device 10 that is not in direct contact with the sidewall 121 and the bottom wall 128 can be rapidly heated by the heat conducting structure 146 having better thermal conductivity, so that the arrangement of the heat conducting structure 146 can increase the heat conducting area of the entire reducing device 10. , reducing the thermal conduction distance between the heat conductor and the reducing material, so that the material is more 098129471 Form No. A0101 Page 9 / 24 pages 〇 982 〇 5 〇 〇 〇 〇 094 094 094 094 094 094 094 094 094 094 094 094 094 094 094 094 094 094 094 094 094 094 〇 094 094 094 094 〇 〇 [0027] Further, the hopper 14 may further include an end plate 147 disposed at an edge of the side plate 144 away from the end of the baffle 142, respectively, and the collector 123 and the The baffles 142 are opposite and spaced apart. It may be of any shape. In this embodiment, the end plate 147 has the same shape as the baffle 142, that is, is rounded and parallel to the baffle 142. The thickness of the end plate 147 is not limited. In the embodiment, the thickness is 3 mm to 6 mm. The end plate 147 is configured to secure the material to prevent material from escaping to the outside of the hopper 14. In addition, the end plate 147 may further include a plurality of openings (not shown) having a diameter smaller than the diameter of the material to prevent material from leaking out of the opening. In the end plate 147 of the unit area, the proportion of the opening area is 30% to 70%. Since the end plate 447 is disposed opposite to the collector 123, the opening is provided so that steam generated during the reaction can be quickly passed through the opening, thereby accelerating the speed of the entire reduction reaction. Further, the hopper 14 may further include a pull ring I48 disposed on the surface of the end plate I47. The zipper ring U8 is integrally formed with the end plate U7, and may also be welded to the end plate 147 by welding. The surface of the collector 123. The hopper 14 can be pulled out of the reduction tank 12 by the tab 148. The tab 148 may be of any shape, and the shape of the tab 148 is only required to facilitate the pulling of the reduction can 12 . [0028] In assembling and making (4) a towel, (4) the reaction object recognizes the hopper 14 and pushes it into the reduced (4) 127 towel; according to the fire prevention device, the cavity 127 is placed in the cooling chamber 124 is installed at a position corresponding to the outer wall of the cavity 127 and the collector 123; the cover plate 126 seals the (four) original can 12; the 098129471 form number A0101 through the cooked vacuum tube 125 page 10 / total 24 page 0982050551 -0 201109443 The reducing device 10 is evacuated; the reducing device 10 is heated by a heating device to reach the temperature required for the reduction reaction; after the reaction is completed, the cover plate 126 of the reduction tank 12 is opened, and the collector 123 is sequentially The fire prevention device 122 and the hopper 14 are taken out from the reduction tank 12. [0029] The charging process is such that the required material is loaded into the hopper 14 outside the reduction tank 12, and the hopper 14 is directly pushed into the reduction tank 12, and the hopper 14 is reduced in materials. No removal is required throughout the reaction. When the reaction is completed, the residue of the reactant is still contained in the hopper 14 . Therefore, when the residue is removed, the above-mentioned crucible: the collector 123, the fire prevention device, and the cover 126 are sequentially taken out. 14 pull out, and the residue can be directly poured out from the hopper 14, thereby avoiding the large volume of the canister 12, the loading process needs to use a loading tool to repeatedly win the material into the reduction tank 12. .. : , or the unloading process repeatedly removes the residue with an unloading tool, resulting in a labor intensive and long-term disadvantage. The hopper 14 is more convenient to load and unload. 'The labor intensity is small and the time is short. . In addition, the hopper 14 is charged to push the hopper into the reduction tank ,2, and the process of dragging the hopper 14 Q after the reaction can be realized by mechanical automation, thereby eliminating the inefficient labor of the manual loading and unloading. In addition, the hopper 14 can also avoid direct contact between the material and the side wall 121 of the reduction tank, thereby further avoiding the disadvantage that the cleaning of the side wall 121 of the reduction tank is difficult to clean after the high temperature reduction is completed, that is, the material of the present invention is not directly and restored. The inner wall of the can side wall 121 is in contact with the hopper 14 so that it does not easily form a collapse at the inner wall of the can side wall 121 during the reaction. If the slag is formed on the hopper 4, the hopper 14 is light in weight. It is convenient to move, so the process of cleaning and slagging is also more convenient. 098129471 Form No. 1010101 Page 11/24 pages 0992050551-0 201109443 [0030] The present invention also provides a reduction device according to a second embodiment, the reduction device comprising a reduction can having the same structure as the first embodiment and being mounted on The hopper 14a in the reduction tank. The specific structure of the reduction tank is described in the previous section and Fig. 1, and will not be described again here. Referring to Fig. 3, the structure of the hopper 14a is the same as that of the first embodiment except that the heat conducting structure 14 6 a is different from the heat conducting structure 14 6 of the first embodiment. The specific difference is that the heat conducting structure 146a of the hopper 14a of the present embodiment includes a plurality of flat heat conducting elements 1460a having a circular cross-sectional area, the shape and area of the plurality of heat conducting elements 1460a and the shape of the baffle 142 and The areas are the same and are spaced apart from the baffle 142 in parallel with each other. In the present embodiment, the plurality of heat conducting elements 1460a are disposed at equal intervals, and the accommodating space 143 is partitioned from the rain into a plurality of equal-sized sections. It will be appreciated that the plurality of thermally conductive elements 1460a may also be arranged at unequal intervals. The heat conducting element 1460a has a thickness of 2 mm to 15 mm. The plurality of heat conducting elements 1460a may be disposed on the side plate 144 by soldering or the like, or a card slot may be disposed on the side plate 144 to embed the heat conducting element i46〇a in the card slot, thereby achieving a fixed position. purpose. In this embodiment, the plurality of heat conducting elements 1460a can also support the hopper 14a in one step, so that the strength of the hopper 14a having a relatively thin thickness is improved, thereby prolonging the service life of the hopper 14a. [0031] The present invention also provides a reduction device according to a third embodiment, the reduction device comprising a reduction can having the same structure as the first embodiment, and a hopper 14b installed in the reduction can, the specific structure of the reduction can Description and Figure 1 will not be repeated here. Referring to FIG. 4, the shape of the baffle 142b, the side plate 144b and the end plate 147b of the hopper 14b is different from that of the baffle 142, the side plate 144 and the end plate 147 of the first embodiment. Shape is the same as 098129471 Form No. A0101 Page 12/24 pages 0992050551-0 201109443 Ο [0032] The first embodiment is the same. Specifically, the baffle plate 142b of the hopper 14b of the present embodiment has a circular flat plate structure 'the side plate 1441' extending from the arcuate edge of the baffle plate 142b toward the direction perpendicular to the baffle plate 142b, thereby forming a circle. The cylindrical accommodation space 143b. The shape of the end plate 147b is the same as that of the baffle plate 142b, that is, a circular flat plate structure. The end plate 147b is movably disposed on the side plate 144b, and is connected to the side plate 144b by a hook. The end plate 147b can be opened during loading and unloading to load or unload the desired material. In this embodiment, the hopper 14b can accommodate a large amount of reaction materials because it has a cylindrical receiving space 143b. In addition, the embodiment may further include an opening 149 communicating with the accommodating space 143b. The opening 149 is disposed on the side plate 144b. The size and shape of the opening 149 are not limited. The area of 149 is four quarters of the area of the entire side plate 14413. The opening 149 can be easily loaded and unloaded, that is, the required material can be loaded or unloaded by opening the end plate 147, or can be directly loaded from the opening 149. Unload. G [Reward of the invention also provides a reduction apparatus of the embodiment], the reduction apparatus comprises a hopper 14c having the same structure as that of the first embodiment, and a hopper 14c disposed in the reduction tank, the specific structure of the reduction tank Description and Figure 1, no further details here. Referring to Fig. 5, the structure of the hopper 14c is the same as that of the third embodiment except that the heat conducting structure 146c is different from the third embodiment. Specifically, the heat conducting structure 146c of the embodiment includes a plurality of rectangular flat heat conducting elements 146c, and the heat conducting elements H60c are evenly and vertically distributed on the side plates 14413. The plane of the heat conduction member 1460 is perpendicular to the J-face ' of the baffle 142b and the heat conduction 疋 098129471 Form No. A0101 Page 13 / Total 24 page 0982050551-0 201109443 Piece 1 460C from the length direction The baffle plate 42b extends to the end plate 147b'. The width direction of the heat conducting element 1460c extends from the side plate 144b into the accommodating space 143b, and the extending direction is the position of the side plate 144b. The normal direction of the place. [0034] The present invention also provides a reduction device according to a fifth embodiment, the reduction device comprising a reduction tank and a hopper 14d. Referring to Fig. 6, the reduction canister of the present embodiment has the same structure as the first embodiment except that the cavity is different from that of the first embodiment. Specifically, the reduction can has a cavity having a cubic cylindrical structure. Other structures of the reduction tank will not be described herein. In addition, the shape of the hopper 14d of the present embodiment corresponds to the shape of the cavity of the reduction can of the present embodiment, that is, it is a cubic shape, and the shape of the heat conduction _146$ is the same as that of the first embodiment. The baffle "2d" of the hopper 14d is a rectangular flat plate-like structure, and the side plate I44d extends from three straight side edges of the sill plate I42d toward the direction perpendicular to the baffle 142d. [0035] Further, the reducing device of the present invention The structure and shape of the cavity, the hopper, the heat-conducting element, and the like are not limited to the specific structures and shapes described in the above embodiments. It is within the scope of the present invention to make corresponding changes to those skilled in the art within the scope of the invention. The reducing device provided by the invention has the following advantages: the hopper used in the reducing device of the invention can be used for loading the reducing material, the thickness thereof is thin, the weight is light, the movement is convenient, and the hopper is not required to be taken out during the reaction process. Therefore, the loading and unloading material is more convenient, and the labor intensity is small, and the time consumption is short; since the reducing material of the present invention and the reduction tank pass between the hoppers It is not easy to form the slagging of the reduction tank, which prolongs the service life of the reduction tank; the hopper also includes a heat-conducting structure, the heat-conducting structure 098129471 Form No. A0101 Page 14 / Total 24 page 0982050551-0 201109443 Added the whole The heat-conducting area of the reducing device can be quickly heated in the intermediate position, thereby speeding up the reaction and reducing the energy consumption; the hopper has a plurality of openings, which can save material and reduce the weight of the entire hopper, and at the same time A plurality of diffusion channels are provided for the steam generated during the reaction, thereby accelerating the reaction speed. [0037] [0040] [0040] [0043] [0043] 098129471 It is clear that it has met the requirements of the invention patent, and the patent application is filed according to law. However, the above is only the preferred embodiment of the present invention, and it is not possible to limit the scope of the patent application in this case. Those who are familiar with the skill of the case Equivalent modifications or variations of the spirit of the present invention are intended to be included in the scope of the following claims. Figure 2 is a schematic view showing the structure of a hopper in a reduction device according to a first embodiment of the present invention. Figure 3 is a schematic view showing the structure of a hopper in a reduction device according to a second embodiment of the present invention. FIG. 5 is a schematic view showing the structure of a hopper in a reduction device according to a fourth embodiment of the present invention. FIG. 6 is a fifth embodiment of the present invention. Schematic diagram of the hopper in the reduction device. [Main component symbol description] 0982050551-0 Form No. Α0101 Page 15 / Total 24 pages 201109443 [0044] Reduction device 10 Reduction tank 12 Side wall 121 Fire protection device 122 Collector 123 Cooling device 124 Vacuum tube 125 cover plate 126 cavity 127 bottom wall 128 hopper 14, 14a, 14b, 14c, 14d baffle 142, 142b, 142d accommodating space 143, 143b side plates 144, 144b, 144d opening 145 heat conducting structure 146, 146a, 146c Thermal Conductive Element 1460, 1460a, 1460c End Plate 147, 147b Pull Ring 148 Opening 149 098129471 Form No. A0101 No. 16 Page / Total 24 pages 0982050551-0