TW201108923A - Heat dispensing system - Google Patents

Heat dispensing system Download PDF

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Publication number
TW201108923A
TW201108923A TW98128653A TW98128653A TW201108923A TW 201108923 A TW201108923 A TW 201108923A TW 98128653 A TW98128653 A TW 98128653A TW 98128653 A TW98128653 A TW 98128653A TW 201108923 A TW201108923 A TW 201108923A
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Taiwan
Prior art keywords
heat dissipation
fan wheel
dissipation system
air flow
air inlet
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TW98128653A
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Chinese (zh)
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TWI384938B (en
Inventor
Alex Horng
Ming-Tsung Li
Chao-Hsun Lee
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Sunonwealth Electr Mach Ind Co
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Publication of TWI384938B publication Critical patent/TWI384938B/en

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  • Structures Of Non-Positive Displacement Pumps (AREA)

Abstract

A heat dispensing system has a inner space and a separating plate having a hole, the separating plate divides the inner space into two receiving spaces, and the two receiving spaces communicate with each other through the hole. In addition, the heat dispensing system comprises a driving unit, a first impeller and a second impeller, the driving unit is provided in one of the two receiving spaces and combines with the first impeller and the second impeller. Otherwise, the driving unit and the first impeller are mounted in the same receiving space, and the second impeller is mounted in another receiving space. Consequently, the first impeller and second impeller can be rotated by the driving unit respectively in the two receiving spaces at the time, and generating airflow to cool the electronic elements received in the two receiving space respectively, thereby the entire elements of the heat dispensing system can be simplified.

Description

201108923 六、發明說明: 【發明所屬之技術領域】 本發明係關於一種散熱系統,尤 個相鄰空間進行散熱的散熱系統。 了门夺對數 【先前技術】 統的產品效能的快速提升,造成電子產品内部系 内升高’ _為了維持電子產品 内。Μ統的堵多構件(例如:微處理器或晶 持在適當的運作溫度下正常作 $ b °、·’ 的散熱設計進行散熱動作 構件大都利用相對應 計大的散熱設 爭盔二’、*用散熱風扇對電子元件進行驅風降溫,其中 ^ W遍的方式鑛應錢子耕上分射接設有-散熱 I貝更可配合高導熱金屬材質製成的散熱籍片對 覆於電子兀件—側’以個別對不同的電子元件進行散 ㈣ί到降溫的目的。如此一來,將導致在電子產品内部 風扇數量過多,容易造成驅獅音過大、過度耗費 能量、構件成本過高及構件數量無法簡化而不利於產品忾 型化等缺點。 醫^微 又如美國專利公告第Μ87,〇76號之「散熱鰭片模组 ^C〇mpact Heat Sink M〇dule)」發明專利案,為了有效減 J散熱風扇的設置數量’習用散熱系統在數個發熱元件之 置散熱風扇,藉由該散熱風扇同時對該發熱元件進 订驅風散熱,以便降低該發熱元件的作業溫度,藉此減少 201108923 政熱風扇數量過多的問題。 然而’由於習用散熱系統之散熱風扇僅具有水平徑向 勺單向送風能力,使得各該發熱元件僅能設置在該散熱風 羽勺Jc平公向位置上;而且,必須與該散熱風扇位於相同 的空間内’以致若該部分發熱元件受到其他較大型構件(例 如·電路板)的阻隔而位於不同的空間時,將造成該散熱 風扇然去對位於不同空間内的構件進行散熱,導致電子產 σσ茜對應不同空間内的發熱元件設置至少二個以上的散熱 風扇’才能針對位於不同空間内的發熱元件進行散熱,由 ^可知習用散熱系統實質上無法有效減少電子產品内部之 散熱^扇數量,因此仍存有噪音過大、耗費能量、構件成 本過同及構件數量無法簡化而不利於產品微型化等疑慮。 基於上述原因,前述f•用散熱系統確實有加以改善之必要。 【發明内容】 本發明係提供一種散熱系統,其可針對相鄰空間内之 維行驅風散熱’並控制相鄰空間之間的溫差 、’ 、k田乾圍内,為本發明之發明目的。 本發明係提供—種散熱系統,係經由單一驅動 對不同处間進行驅風散熱,以達到簡化構: 及降低成本,為本發明之另-發明目的。 本發^储供—種散㈣統,顧由單―驅動單 數個扇_不_空間進行驅 少能源耗費’為本發明之再—發明目的。降I曰及減 為達到前述發明目的,本發明所運用之技術手段及藉 201108923 由該技術手段所能達到之功效包含有: 一種散熱系統,其具有一内部空間,且該内部空間被 一隔板分隔成二個相鄰之驅風流道;該隔板具有一通孔, 該其中一驅風流道經由該通孔與該另一驅風流道相連通。 該散熱糸統包含一驅動單元、一第一扇輪及一第二扇輪, 該驅動單元設置於該其中一驅風流道内,該驅動單元具有 一轉動轴,邊轉動軸之一端穿過該通孔延伸至該另一驅風 流道。遺第一扇輪係結合於該轉動軸,且與該驅動單元設 置於該同一驅風流道内,並與該通孔相對位。該第二扇輪 亦結合於該轉動轴,且設置於不同於該第一扇輪的該另一 驅風流道内,並與該通孔相對位。藉由該單一驅動單元同 動位於二個相鄰驅風流道内的二個扇輪旋動,以同時 對該二相鄰驅風流道内的電子元件進行散熱,並簡化整體 系統構件。 f 【實施方式】 為讓本發明之上述及其他目的、特徵及優點能更明顯 易懂,下文特舉本發明之較佳實施例,並配合所附圖式, 作詳細說明如下: 睛參照第1及2圖所示,本發明第一實施例之散熱系 統主要係用以聽個電子元件9 (例如:微處理器、晶片 組或被動元件等)進行散熱,其包含_殼體卜—隔板2、 二驅動單元3、—第—扇輪4及-第二扇輪5,該殼體1 形成有一内部空間丨卜該内部空間丨丨用以容置各該電子 兀件9,且該隔板2、驅動單元3、第一扇輪4及第二扇輪 201108923 • 5亦容設於該内部空間11内。該第一扇輪4及第二扇輪5 分別結合於該驅動單元3上’以藉由該驅動單元3帶動該 第一扇輪4及第二扇輪5對該電子元件9進行散熱。 請參照第2圖所示,本實施例之内部空間11係被界定 於該殼體1之一第一側板12及一第二側板13之間’且該 内部空間11亦被該隔板2分隔成一第一驅風流道111及一 第二驅風流道112,其中該第一驅風流道ill形成於該第 二側板13與該隔板2之間’該第二驅風流道Π2則形成於 • 該第一側板I2與該隔板2之間。 該隔板2係為一般習用印刷電路板或塑性絕緣板等板 件,本實施例之隔板2為印刷電路板,該數個電子元件9 係設ϊ於該隔板2上’各該電子元件9則分佈於該第一驅 風流道111及第二驅風流道112内。該隔板2具有一通孔 21,該第〆驅風流道111可經由該通孔21與該第二驅風流 道112相連通。 請與參照第2圖所示,該驅動單元3設置於該第一驅 • 風流道111内’其較佳選自—馬達,該馬達包含有軸座及 定子等耩袢’與一般習用馬達構造大致相同’且該馬達内 部的.細 部構件亦非本發明之技術雜,故於此不再贅述。 - 該驅動# 3設有—轉動轴31,該轉動軸31自該第一驅 風流遘丨1〗、’二由°亥通孔21延伸至該第二驅風流道m内。 该第扇幸明4 °又置於该第一驅風流道111内,且與該 轉動神31相Ί ’該第二扇輪5則設置於該第二驅風流道 112,真亦緒合f該轉動轴31。該第-扇輪4及第二扇輪5 可選#為’拍流式扇輪或一鼓風式扇輪 ’本實施例之第一 201108923 扇輪4係選自一鼓風式扇輪’而該第二扇輪$則選自一車由 流式扇輪;該第一扇輪4及第二扇輪5分別具有一輪穀 41、51及數個扇葉42、52,該扇葉42、52係個別環設於 該輪轂41、51之外周面。另外,該第一扇輪4及第二扇輪 5之軸心係對位於該通孔21之中心,且該通孔21之孔徑 大於該第一扇輪4之輪轂41的外徑,該通孔21之孔徑亦 不小於該第二扇輪5之最大外徑。 請參照第3圖所示’本發明第一實施例若欲對該内部 空間11中之數個電子元件9進行散熱,係利用該單一驅動 單元3經由該轉動軸31同時帶動該第一扇輪4及第二扇輪 5旋動,由於該第二扇輪5為轴流式扇輪,故該第二扇輪$ 會持續從該第一驅風流道112徑向吸入空氣,並將·^第一 驅風流道112内之空氣經由該通孔21朝該第一扇輪4軸向 送出;又,該第一扇輪4為鼓風式扇輪,因此可持續透過 該通孔21轴向吸入該第二扇輪5輸出之空氣,並徑向送入 該第一驅風流道m内,藉此形成從該第二驅風流道112 内朝該第一驅風流道111持續流動之循環氣流,透過空氣 的流動循環增加該電子元件9的熱交換效率,以便對位於 位於該第一驅風流道111及第二驅風流道112内之電子元 件9進行散熱,使該電子元件9 _在適當的運作溫度。 本發明主要係利用該單—驅動單元3來帶動位於二個 相郴空間(第一驅風流道Ul及第二驅風流道 112)内的 二個扇輪4、5同時旋動,即可驅使該二相鄰空間内的空氣 開始揭環流動,提升該二4目鄰空間⑽散熱效率,相較於 白用散熱祕本發明僅需透過—個軸單元3即可同時對 201108923 該二相鄰空間内的電子元件9進行散熱,確實可有效減少 • 肖驅動單元3的數量,進—步達到減少風扇運轉喝音量、 節省能源、降低成本及簡化系統構件而有利於產品微型化 的目的。 另外,由於本實施例之通孔21孔徑不小於該第二扇 輪5之最大外徑,故軸流式扇輪之該第二扇輪$所輸出的 . t流可糊_向通過該通孔21,並配合騎孔21之孔 ㈣大於該第一扇輪4之輪轂41外徑,使得通過該通孔 零21之軸向氣流可順利的被鼓風式扇輪之該第一扇輪4所吸 入’進而轉換成徑向氣流送入該第一驅風流道ιη内,藉 此可f效提升空氣流動的順暢度,進而提升驅風效率,‘ 使該第-驅風流道U1及第二驅風流道112之間的溫度維 持在=近均溫的狀態,避免該二相鄰空間之間的溫差過大。 五睛參照第4及5圖所示,其揭示本發明第二實施例之 政…、系統。相車父於第一實施例,第二實施例之第二扇輪 • ,,為風式扇輪,且設置於該驅動單元3之轉動軸31 立而》亥第一扇輪5’具有一輪轂51,及數個扇葉52,;另外, 該"又體1之第一側板12設有-第-進風口 121,該第-進 ίΓ分別與該通孔21及第二扇輪5’之軸心相對位, Ί第—賴流道112相連通,該第—進風口 121及通 孔21的孔徑均大於該輪轂51,之外徑。 田本貫施例之單-驅動單元3同時帶動該第—扇輪4 扇輪5,旋動時,由於該第二扇輪5,為鼓風式扇輪, /ίΓ4輪5,會持續經由該第—進風口 121從外界軸向 入工氣,並將部分吸人的空氣轉換成徑向氣流送入該第 201108923 二驅風流道112;又,由於該第一扇輪4相較該第二扇輪5, 為另一個尺寸較大之鼓風式•,故另—部份吸入的空氣 則會軸向通過該通孔21被該第一扇輪4吸入,並徑向送入 。亥第驅風流道ill内’ H此本實闕係透過吸引外界空 氣至該第-賴流道m及第二職流道112⑽行熱交 換,以便對位於位於該第1區風流道⑴及第二驅風流道 112内之電子元件9進行散熱’進而提升本發明之散熱效 率。 -月參知、第6圖所不’其揭示本發明第三實施例之散熱 系統。相較於第二實施例,第三實補之第二條13設有 -第:進風口 131 ’該第二進風口 131係與該第一扇輪4 之扇某42相對位設置’且與該第—驅風流道⑴相連通, 藉此當本實施例之單一驅動單元3同時帶動該第一扇輪4 及第二扇輪5,旋動時,該第-扇輪4除了可從該通孔21 進氣外’還可同時經由該第二進風口 131從外界軸向吸入 空氣’進-步增加賴量,有效提升本發雜體散熱效率。 ,此外本實施例第一扇輪4的尺寸大於該第二扇 “ 5的尺寸,但該第一扇輪4及第二扇輪5,亦可選擇為相 同尺寸,該第—扇輪4及第二扇輪y的尺寸大小不受本實 施例所侷限。 ' 、,然本發明已利用上述較佳實施觸示,然其並非用 以,疋本發明’任何熟習此技藝者在不脫離本發明之精神 和範圍之内’相對上述實關進行各種更動與修改仍屬本 發月所保叙技職•,因此本發明之賴範圍當視後附 之申睛專利範圍所界定者為準。 201108923 【圖式簡單說明】 - 第1圖:本發明散熱系統之第一實施例之局部立體分解 圖。 第2圖:本發明散熱系統之第一實施例之局部組合剖視 圖。 第3圖:本發明散熱系統之第一實施例之氣流流向示意 . 圖。 第4圖:本發明散熱系統之第二實施例之局部立體分解 # 圖。 第5圖:本發明散熱系統之第二實施例之局部組合剖視 及氣流流向示意圖。 第6圖:本發明散熱系統之第三實施例之局部組合剖視 及氣流流向示意圖。 【主要元件符號說明】 〔本發明〕 1 殼體 .111第一驅風流道 12 第一侧板 13 第二側板 2 隔板 3 驅動單元 4 第一扇輪 42扇葉 5 第二扇輪 11 内部空間 112第二驅風流道 121第一進風口 131第二進風口 21 通孔 31 轉動轴 41 輪轂 51 輪轂 201108923 52 扇葉 5, 51, 輪穀 52, 9 電子元件 第二扇輪 扇葉 —12 —201108923 VI. Description of the Invention: [Technical Field of the Invention] The present invention relates to a heat dissipation system, and particularly a heat dissipation system for dissipating heat in an adjacent space. The logarithm of the door [Previous technology] The rapid improvement of the performance of the system has led to an increase in the internals of electronic products. _ In order to maintain electronic products. Μ 的 多 ( ( ( ( ( ( ( ( ( ( ( ( ( ( ( ( ( ( ( ( ( ( ( ( ( ( ( ( ( ( ( ( ( ( ( ( ( ( 微处理器 微处理器 微处理器 微处理器 微处理器 微处理器 微处理器 微处理器 微处理器* Use the cooling fan to drive the air to cool down the electronic components, in which the way of the mine should be arable and arable. The heat sink I can be combined with the heat-dissipating metal material made of high-heat-conducting metal to cover the electrons. The component-side's purpose is to separate the different electronic components to cool down. This will result in too many fans inside the electronic product, which may cause excessive lion-sounding, excessive energy consumption, and high component cost. The number of components cannot be simplified, which is not conducive to the shortcomings of the product type. The medical patent is also invented, as in the US Patent Publication No. 87, No. 76, "Thermal Fin Module ^C〇mpact Heat Sink M〇dule". In order to effectively reduce the number of J heat-dissipating fans, the conventional heat-dissipating system is provided with a plurality of heat-dissipating components, and the heat-dissipating fan simultaneously heats the heat-dissipating components to reduce the heat. The operating temperature of the component, thereby reducing the problem of excessive number of thermal fans in 201108923. However, since the cooling fan of the conventional heat dissipation system only has the horizontal radial scooping one-way air supply capability, each of the heating elements can only be disposed at the Jc flat male position of the heat dissipation feather spoon; and, it must be located at the same position as the cooling fan. In the space, if the part of the heating element is blocked by other large-sized components (such as a circuit board) and is located in different spaces, the heat-dissipating fan will heat the components located in different spaces, resulting in electronic production σσ设置 At least two or more cooling fans are provided for the heating elements in different spaces to dissipate heat from the heating elements located in different spaces. It is known that the conventional heat dissipation system cannot effectively reduce the number of heat dissipation fans inside the electronic product. There are still doubts such as excessive noise, energy consumption, excessive component cost, and the inability to simplify the number of components, which is not conducive to product miniaturization. For the above reasons, the aforementioned f•heat dissipation system does have to be improved. SUMMARY OF THE INVENTION The present invention provides a heat dissipation system that can dissipate heat in an adjacent space and control the temperature difference between adjacent spaces, and the inside of the k-field is the object of the invention. . The present invention provides a heat dissipating system for dissipating heat between different places via a single drive to achieve a simplified structure and cost reduction, which is another object of the present invention. The present invention is a storage-supply-distribution (four) system, and the single-drive single-segment fan_no_space to drive less energy consumption' is the re-invention purpose of the present invention. The technical means utilized by the present invention and the efficiencies achievable by the technical means by the method of the method of the present invention include: a heat dissipation system having an internal space, and the internal space is separated by The plate is divided into two adjacent air flow passages; the partition has a through hole through which one of the air flow passages communicates with the other air flow passage. The heat dissipation system includes a driving unit, a first fan wheel and a second fan wheel. The driving unit is disposed in one of the driving air flow channels, and the driving unit has a rotating shaft, and one end of the rotating shaft passes through the through hole The hole extends to the other drive flow path. The first wheel train is coupled to the rotating shaft, and is disposed in the same air flow passage and opposite to the through hole. The second fan wheel is also coupled to the rotating shaft and disposed in the other air flow passage different from the first fan wheel and opposite to the through hole. The single driving unit is synchronously rotated by two fan wheels located in two adjacent air flow passages to simultaneously dissipate heat from the electronic components in the two adjacent air flow passages and to simplify the overall system components. The above and other objects, features, and advantages of the present invention will become more apparent from the aspects of the invention. As shown in FIGS. 1 and 2, the heat dissipation system of the first embodiment of the present invention is mainly used for listening to an electronic component 9 (for example, a microprocessor, a chipset or a passive component, etc.) for heat dissipation, which includes a housing. The plate 2, the second driving unit 3, the first-fan wheel 4 and the second fan wheel 5, the housing 1 is formed with an internal space for receiving the electronic components 9, and the housing The partition 2, the driving unit 3, the first fan wheel 4, and the second fan wheel 201108923 • 5 are also accommodated in the internal space 11. The first fan wheel 4 and the second fan wheel 5 are coupled to the driving unit 3 respectively to drive the first fan wheel 4 and the second fan wheel 5 to dissipate the electronic component 9 by the driving unit 3. Referring to FIG. 2 , the internal space 11 of the present embodiment is defined between the first side panel 12 and the second side panel 13 of the housing 1 and the internal space 11 is also separated by the partition 2 . Forming a first air flow passage 111 and a second air flow passage 112, wherein the first air flow passage ill is formed between the second side plate 13 and the partition 2. The second air flow passage 2 is formed in the The first side plate I2 is spaced between the partition plate 2. The spacer 2 is a board member such as a conventional printed circuit board or a plastic insulating board. The spacer 2 of the embodiment is a printed circuit board, and the plurality of electronic components 9 are disposed on the spacer 2 The element 9 is distributed in the first and second air flow passages 111 and 112. The partition 2 has a through hole 21 through which the second air flow passage 111 can communicate with the second air flow passage 112. Referring to FIG. 2, the driving unit 3 is disposed in the first drive airflow path 111. Preferably, the drive unit 3 is selected from a motor including a shaft base and a stator, etc., and a conventional motor structure. The details of the internal components of the motor are not the same as those of the present invention, and thus will not be described herein. - The drive #3 is provided with a rotary shaft 31 extending from the first drive air flow path 1 to the second through air passage hole 21 into the second air flow passage m. The first fan 4 is again placed in the first wind flow passage 111, and is opposite to the rotating god 31. The second fan wheel 5 is disposed in the second wind flow passage 112, which is true. The shaft 31 is rotated. The first-fan wheel 4 and the second fan-wheel 5 are selectable as 'a flapping fan wheel or a blasting fan wheel'. The first 201108923 of the embodiment is a fan wheel 4 selected from a blasting fan wheel. The second fan wheel $ is selected from a car by a flow fan wheel; the first fan wheel 4 and the second fan wheel 5 respectively have a wheel valley 41, 51 and a plurality of blades 42, 52, the blade 42 The 52 series of individual rings are provided on the outer circumferential surfaces of the hubs 41 and 51. In addition, the axial center of the first fan wheel 4 and the second fan wheel 5 are located at the center of the through hole 21, and the diameter of the through hole 21 is larger than the outer diameter of the hub 41 of the first fan wheel 4. The aperture of the aperture 21 is also not less than the largest outer diameter of the second fan wheel 5. Referring to FIG. 3, in the first embodiment of the present invention, if the plurality of electronic components 9 in the internal space 11 are to be dissipated, the single driving unit 3 is used to simultaneously drive the first fan wheel via the rotating shaft 31. 4 and the second fan wheel 5 is rotated. Since the second fan wheel 5 is an axial fan wheel, the second fan wheel $ continues to draw air radially from the first wind channel 112, and The air in the first air flow passage 112 is axially sent to the first fan wheel 4 via the through hole 21; further, the first fan wheel 4 is a blower type fan wheel, and thus can continuously pass through the through hole 21 in the axial direction. The air output from the second fan wheel 5 is sucked into the first air flow passage m, thereby forming a circulating airflow continuously flowing from the second air flow passage 112 toward the first air flow passage 111. The heat exchange efficiency of the electronic component 9 is increased by the flow cycle of the air to dissipate heat from the electronic component 9 located in the first and second air flow passages 111 and 112, so that the electronic component 9_ Operating temperature. The present invention mainly utilizes the single-drive unit 3 to drive the two fan wheels 4, 5 located in the two opposing air spaces (the first air flow path U1 and the second air flow path 112) to simultaneously rotate, thereby driving The air in the two adjacent spaces begins to uncover the loop flow, and the heat dissipation efficiency of the two 4 mesh adjacent spaces (10) is improved. Compared with the white heat dissipation secret, the invention only needs to pass through the shaft unit 3 to simultaneously contact the 201108923. The heat dissipation of the electronic component 9 in the space can effectively reduce the number of the Xiao drive unit 3, and further reduce the fan operation and drink volume, save energy, reduce cost, and simplify system components, thereby facilitating product miniaturization. In addition, since the aperture of the through hole 21 of the embodiment is not less than the maximum outer diameter of the second fan wheel 5, the flow of the second fan wheel $ of the axial flow fan can be pasted through the passage. The hole 21, and the hole (4) of the riding hole 21 is larger than the outer diameter of the hub 41 of the first fan wheel 4, so that the axial airflow passing through the through hole zero 21 can be smoothly performed by the first fan wheel of the blasting fan wheel 4 inhaled' and then converted into a radial airflow into the first airflow channel i n, thereby improving the smoothness of the air flow, thereby improving the efficiency of the driving, 'making the first-drive airflow U1 and the first The temperature between the two-wheel airflow passages 112 is maintained at a state of near-average temperature, and the temperature difference between the two adjacent spaces is prevented from being excessive. The fifth eye is shown in Figures 4 and 5, which disclose the policy and system of the second embodiment of the present invention. In the first embodiment, the second fan wheel of the second embodiment is a wind fan wheel, and the rotating shaft 31 of the driving unit 3 is set up and the first fan wheel 5' has a a hub 51 and a plurality of blades 52; and, in addition, the first side panel 12 of the body 1 is provided with a first air inlet 121, and the first and second pulleys are respectively associated with the through hole 21 and the second fan wheel 5 The axis of the 'opposite position is connected to the first channel, and the apertures of the first air inlet 121 and the through hole 21 are larger than the outer diameter of the hub 51. The single-drive unit 3 of the Tian Benshi example simultaneously drives the first-fan wheel 4, the fan wheel 5, and when the second fan wheel 5 is a blast-type fan wheel, /ίΓ4 wheel 5, will continue through the first - the air inlet 121 axially enters the working air from the outside, and converts part of the inhaled air into a radial airflow to be fed into the second-drive airflow passage 112 of the 201108923; and, since the first fan 4 is compared with the second fan The wheel 5 is another blast type that is larger in size, so that the other partially sucked air is axially drawn through the through hole 21 by the first fan wheel 4 and is fed radially. The Hurricane Airflow Channel ill is a heat exchanger that draws outside air to the D-Lay flow channel m and the second job channel 112 (10) to facilitate the presence of the wind tunnel (1) and the first zone. The electronic component 9 in the second-drive airflow path 112 performs heat dissipation to further improve the heat dissipation efficiency of the present invention. - The monthly reference, the sixth figure does not disclose the heat dissipation system of the third embodiment of the present invention. Compared with the second embodiment, the second strip 13 of the third solid complement is provided with a -first: air inlet 131'. The second air inlet 131 is disposed opposite to the fan 42 of the first fan wheel 4 and The first air flow passage (1) is connected to the first fan unit 4 and the second fan wheel 5 at the same time. When the single driving unit 3 drives the first fan wheel 4 and the second fan wheel 5 simultaneously, the first fan wheel 4 can be The through hole 21 outside the intake air can also simultaneously draw air from the outside through the second air inlet 131 to increase the amount of the air, thereby effectively improving the heat dissipation efficiency of the present hybrid body. In addition, the size of the first fan wheel 4 of the embodiment is larger than the size of the second fan 5, but the first fan wheel 4 and the second fan wheel 5 may also be selected to have the same size, and the first fan wheel 4 and The size of the second fan wheel y is not limited by the embodiment. The invention has been utilized in the above preferred embodiment, but it is not intended to be used in the present invention. Within the spirit and scope of the invention, the various changes and modifications to the above-mentioned actual conditions are still covered by the technical functions of this month. Therefore, the scope of the present invention is subject to the definition of the scope of the patent application. 201108923 [Simplified illustration of the drawings] - Fig. 1 is a partial exploded perspective view of the first embodiment of the heat dissipation system of the present invention. Fig. 2 is a partial sectional view of the first embodiment of the heat dissipation system of the present invention. The flow of the first embodiment of the heat dissipation system of the invention is schematically illustrated. Fig. 4 is a partial perspective exploded view of the second embodiment of the heat dissipation system of the present invention. Fig. 5 is a partial view of a second embodiment of the heat dissipation system of the present invention. Combined cross-section and airflow direction Fig. 6 is a partial sectional view and flow direction diagram of a third embodiment of the heat dissipation system of the present invention. [Main component symbol description] [Invention] 1 Housing. 111 First air flow passage 12 First side plate 13 Second side panel 2 Separator 3 Drive unit 4 First fan wheel 42 Blade 5 Second fan wheel 11 Internal space 112 Second air flow channel 121 First air inlet 131 Second air inlet 21 Through hole 31 Rotary shaft 41 Hub 51 Hub 201108923 52 Fan blade 5, 51, Valley 52, 9 Electronic component second fan blade - 12 —

Claims (1)

201108923 七、申請專利範圍: 1、 一種散熱系統,其包含: 一殼體,具有一内部空間,一隔板將該内部空間分隔成 一第一驅風流道及一第二驅風流道,該隔板具有〜通 孔,該第一驅風流道經由該通孔與該第二驅風流道相連 - 通; 、 一驅動單元,設置於該第一驅風流道内,該驅動單元具 Φ 有一轉動轴,該轉動軸之一端穿過該通孔延伸至該第二 驅風流道; 一第一扇輪,結合於該轉動軸,該第一扇輪與該驅動單 元叹置於該第一驅風流道,且與該通孔相對位;及 一第二扇輪,結合於該轉動軸,該第二扇輪設置於該第 二驅風流道,且與該通孔相對位。 2、 依申請專利範圍第!項所述之散熱系统,其中該殼體具 有一第一側板及一第二側板,該内部空間被界定於該第 • ㈣板及第二侧板之間,且該第-驅風流道形成於該第 二侧板與該隔板之間,該第二驅風流道形成於該第一側 板與該隔板之間。 • 依申明專利範圍第2項所述之散熱系統,其中該隔板係 為印刷電路板,且該隔板設有數個電子元件,且各該 電子凡件分別分佈於該第一驅風流道及第二驅風流道 内。 :申二專利軌圍第3項所述之散熱系統,其中該第一扇 *及弟—扇輪分黯有―輪轂及數個輕,且該扇葉環 —13 — 201108923 設於該輪轂之外周面。 5、 依申請專利範圍第4項所述之散熱系統,其中該通孔之 孔徑大於該第一扇輪之輪轂外徑。 6、 依申請專利範圍第3或5項所述之散熱系統,其中該通 孔之孔徑不小於該第二扇輪之最大外徑。 7、 依申請專利範圍第5項所述之散熱系統,其中該通孔之 孔徑大於該第二扇輪之輪轂外徑。 8、 依申請專利範圍第4、5或7項所述之散熱系統,其中 該第一側板設有一第一進風口,該第一進風口與該第二 驅風流道相連通。 9、 依申請專利範圍第6項所述之散熱系統,其中該第一側 板設有一第一進風口,該第一進風口與該第二驅風流道 相連通。 10、 依申請專利範圍第8項所述之散熱系統,其中該第一進 風口的孔徑大於該第二扇輪之輪轂外徑。 11、 依申請專利範圍第8項所述之散熱系統,其中該第二側 板設有一第二進風口 ’該第二進風口係與該第一驅風流 道相連通。 12、 依申請專利範圍第9項所述之散熱系統,其中該第二側 板設有一第二進風口,該第二進風口係與該第一驅風流 道相連通。 13、 依申請專利範圍第10項所述之散熱系統,其中該第二 侧板設有一第二進風口,該第二進風口係與該第一驅風 流道相連通。 —14 —201108923 VII. Patent application scope: 1. A heat dissipation system comprising: a casing having an inner space, a partition dividing the inner space into a first drive flow passage and a second drive flow passage, the partition And a through hole, the first air flow channel is connected to the second air flow channel through the through hole; a driving unit is disposed in the first air flow channel, the driving unit has a rotating axis, and the driving unit has a rotating shaft One end of the rotating shaft extends through the through hole to the second air flow passage; a first fan wheel is coupled to the rotating shaft, the first fan wheel and the driving unit are slanted to the first wind flow passage, and And a second fan wheel is coupled to the rotating shaft, and the second fan wheel is disposed on the second air flow channel and is opposite to the through hole. 2. According to the scope of application for patents! The heat dissipation system of the present invention, wherein the housing has a first side plate and a second side plate, the inner space is defined between the fourth plate and the second side plate, and the first air flow passage is formed on Between the second side plate and the partition plate, the second air flow passage is formed between the first side plate and the partition plate. The heat dissipation system of claim 2, wherein the spacer is a printed circuit board, and the spacer is provided with a plurality of electronic components, and each of the electronic components is respectively disposed on the first wind flow channel and Inside the second wind tunnel. : The heat dissipation system according to item 3 of the second patent track of the second application, wherein the first fan and the younger-fan wheel have a hub and a plurality of light, and the fan blade ring 13 - 201108923 is disposed at the hub The outer perimeter. 5. The heat dissipation system of claim 4, wherein the through hole has a larger diameter than the outer diameter of the first fan wheel. 6. The heat dissipation system of claim 3, wherein the aperture of the through hole is not less than a maximum outer diameter of the second fan wheel. 7. The heat dissipation system of claim 5, wherein the through hole has a larger diameter than the outer diameter of the second fan wheel. 8. The heat dissipation system of claim 4, 5 or 7, wherein the first side panel is provided with a first air inlet, and the first air inlet is in communication with the second air flow channel. 9. The heat dissipation system according to claim 6, wherein the first side plate is provided with a first air inlet, and the first air inlet is in communication with the second air flow channel. 10. The heat dissipation system of claim 8, wherein the aperture of the first air inlet is larger than the outer diameter of the hub of the second fan wheel. 11. The heat dissipation system of claim 8, wherein the second side panel is provided with a second air inlet port. The second air inlet port is in communication with the first air flow channel. 12. The heat dissipation system of claim 9, wherein the second side panel is provided with a second air inlet, and the second air inlet is in communication with the first air flow passage. 13. The heat dissipation system of claim 10, wherein the second side panel is provided with a second air inlet, and the second air inlet is in communication with the first air flow passage. —14 —
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TWI512442B (en) * 2013-02-21 2015-12-11 Sunonwealth Electr Mach Ind Co A cooling system of hand-held electronic device

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TWM283494U (en) * 2005-07-21 2005-12-11 Dynaeon Ind Co Ltd Structure of cooling fans for computers

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI512442B (en) * 2013-02-21 2015-12-11 Sunonwealth Electr Mach Ind Co A cooling system of hand-held electronic device

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