201108879 六、發明說明： 【發明所屬之技術領域】 本發明是有關於一種線路板及其製造方法，且特別是 有關於一種具有空腔（cavity)的線路板及其製造方法。 【先前技術】 • 隨著科技的進步，手機的問世，讓人與人之間可以报 方便地通話，使得現代人能夠享受隨時通訊的便利生活， • 因此，手機已成為現代人不可或缺的重要工具。 手機通常包括一線路板與一揚聲器（Speaker，又稱喇 叭）。線路板具有彼此相對的上表面與下表面，而揚聲器裝 設於上表面。當手機透過揚聲器播放來電鈴聲或音樂時， 揚聲器會朝向遠離線路板的方向發出聲音。 由此可知，揚聲器的聲音是從上表面直接發出，而非 #從下表面直接發出。因此，揚聲器的聲音通常需要透過反 射來間接傳遞到下表面。 【發明内容】 本發明提供一種線路板，其具有可以用來傳遞聲音的 空腔。 本發明另提供一種線路板的製造方法，其用來製造上 述線路板。 本發明提出一種線路板，其具有一空腔與一外表面， 201108879 並包括至少一外層線路層、一核心基板以及至少一外層絕 緣層。空腔位於核心基板，且空腔的一腔壁存在多個開口。 外層絕緣層配置於核心基板與外層線路層之間，並具有至 少一裸露於外表面的貫孔。貫孔連通其中一個開口，而這 些開口與貫孔位於一流體傳聲路徑，其中流體傳聲路徑通 過線路板。 在本發明一實施例中，上述核心基板為一空白核心層 (blank core)或一線路基板。 在本發明一實施例中，上述線路基板包括一核心絕緣 層以及至少一第一線路層。空腔位於核心絕緣層，而第一 線路層配置於核心絕緣層與外層絕緣層之間。 在本發明一實施例中，上述核心基板更包括至少一位 於核心絕緣層中的第二線路層。 在本發明一實施例中，上述外層絕緣層為一黏合層 (adjective layer ) ° 在本發明一實施例中，上述外層絕緣層包括一介電層 與一黏合層，其中外層線路層配置於介電層上，而黏合層 黏合於核心基板與介電層之間。 在本發明一實施例中，上述貫孔具有一位於外表面的 洞口，而連通貫孔的開口與洞口部分重疊。 在本發明一實施例中’上述貫孔具有一位於外表面的 洞口，而連通貫孔的開口實質上與洞口完全重疊。 在本發明一實施例中，上述線路板更包括一配置於核 201108879 〜基板與外層絕緣層之間 的拉片（shutter)，其中擋片具有 遷通於貝孔與空腔之間的穿孔。 在本發明一實施例中， 在本發明-實施例中;4W為㈣或空白核心層。 的厚度。 上述空腔的高度小於核心基板 在本發明一實施例中， 心基板的厚度。 上述空腔的高度實質上等於核 在本發明一實施例中’ 相對於上表面的下表面以及上，表面包括-上表面、-的側表面，而上表面裸露h連接於上表面與下表面之間 在本發明一實施例中， 貫孔分別連通這些開σ，*述貫孔的數量為多個。這些 面裸露這些貫扎。 ，皆位於流體傳聲路徑，且上表 在本發明-實施例中，H 一個開口位於側表面。 個開口連通貫孔，而另 在本發明一實施例中， 貫孔，而這些貫孔分別連通這=層絕緣層具有至少-個 於上表面，而另—個貫孔裸露’其中-個貫孔裸露 在本發明一實施例中，上述二面。 而連通孔連通於其巾—朗㈣二基板具有—連通孔’ 本發明另搵+ 一稞路於下表面的貫孔。 本發月另k出-種線路板的製 溝槽於-核心基板。接著，形去。|先’形成- 基板上，其巾外層絕緣層t蓋 H外層絕緣層於核心 3 M使溝槽形成一空腔。 201108879 " 接著’形成至少一外層線路層於外層絕緣層上。在形成外 • 層線路層之後’形成至少一貫孔於外層絕緣層，其中貫孔 與空腔連通。 在本發明一實施例中，上述溝槽是利用雷射燒蝕（laser ablation)或銑割（r〇uting)而形成。 , 在本發明一實施例中，上述溝槽的深度小於核心基板 的厚度。 9 $ 在本發明一實施例中，上述溝槽的深度實質上等於核 心基板的厚度。 在本發明一實施例中，上述貫孔是一非電鍍貫孔 (Non-Plate Through Hole，NPTH)。 在本發明一實施例中，形成非電鍍貫孔的方法包括機 械鑽孔或雷射鑽孔（laser drilling)。 在本發明一實施例中，形成外層線路層的方法包括， 形成至少一導體層於外層絕緣層上。接著，圖案化導體層。 • 在本發明一實施例中，形成外層絕緣層與導體層的方 法包括壓合至少一背膠銅箔（Resin Coated Copper，RCC ) 於核心基板上。 在本發明一實施例中，形成外層絕緣層與導體層的方 法包括，利用一黏合層，壓合一基板於核心基板上，其中 基板包括一介電層與導體層’且導體層配置於介電層上。 黏合層黏合於介電層與核心基板之間。 在本發明一實施例中，上述形成外層線路層的方法包 201108879 括半力π成法 (semi-additive)。 在本發明一實施例中’上述形成外層線路層的方法包 括，在外層絕緣層上形成一凹刻圖案。接著，形成一導電 材料於凹刻圖案内。 在本發明實施例中，在形成外層絕緣層之前，更包 括元成〜擋片於核心基板上，其中擋片覆蓋溝槽。BACKGROUND OF THE INVENTION 1. Field of the Invention This invention relates to a circuit board and a method of fabricating the same, and more particularly to a circuit board having a cavity and a method of fabricating the same. [Prior Art] • With the advancement of technology, the advent of mobile phones allows people to easily talk to people, enabling modern people to enjoy the convenience of communication at any time. • Therefore, mobile phones have become indispensable for modern people. Important tool. A mobile phone usually includes a circuit board and a speaker (Speaker, also known as a horn). The wiring board has upper and lower surfaces opposed to each other, and the speaker is mounted on the upper surface. When the phone plays ringtones or music through the speaker, the speaker emits sound away from the board. It can be seen that the sound of the speaker is directly emitted from the upper surface instead of being directly emitted from the lower surface. Therefore, the sound of the speaker usually needs to be transmitted indirectly to the lower surface through reflection. SUMMARY OF THE INVENTION The present invention provides a wiring board having a cavity that can be used to transmit sound. The present invention further provides a method of manufacturing a wiring board for manufacturing the above wiring board. The present invention provides a wiring board having a cavity and an outer surface, 201108879 and including at least one outer wiring layer, a core substrate, and at least one outer insulating layer. The cavity is located on the core substrate and a plurality of openings exist in a cavity wall of the cavity. The outer insulating layer is disposed between the core substrate and the outer circuit layer and has at least one through hole exposed to the outer surface. The through holes communicate with one of the openings, and the openings and the through holes are located in a fluid sound path through which the fluid sound path passes. In an embodiment of the invention, the core substrate is a blank core or a circuit substrate. In an embodiment of the invention, the circuit substrate includes a core insulating layer and at least one first circuit layer. The cavity is located in the core insulating layer, and the first wiring layer is disposed between the core insulating layer and the outer insulating layer. In an embodiment of the invention, the core substrate further includes at least one second circuit layer in the core insulating layer. In an embodiment of the invention, the outer insulating layer is an adhesive layer. In an embodiment of the invention, the outer insulating layer comprises a dielectric layer and an adhesive layer, wherein the outer circuit layer is disposed in the dielectric layer. On the electrical layer, the adhesive layer is bonded between the core substrate and the dielectric layer. In an embodiment of the invention, the through hole has a hole in the outer surface, and the opening communicating the through hole partially overlaps the opening. In an embodiment of the invention, the through hole has a hole in the outer surface, and the opening communicating the through hole substantially completely overlaps the opening. In an embodiment of the invention, the circuit board further includes a shutter disposed between the core 201108879 and the substrate and the outer insulating layer, wherein the spacer has a through hole extending between the hole and the cavity. In an embodiment of the invention, in the present invention - an embodiment; 4W is a (four) or blank core layer. thickness of. The height of the cavity is smaller than the thickness of the core substrate in an embodiment of the invention. The height of the cavity is substantially equal to the core in one embodiment of the invention 'relative to the lower surface and upper surface of the upper surface, the surface includes the upper surface, the side surface of the surface, and the upper surface is exposed h to the upper surface and the lower surface In an embodiment of the invention, the through holes respectively connect the openings σ, and the number of the through holes is plural. These faces are barely covered. Both are located in the fluid sound path, and the above table In the present invention-embodiment, an opening of H is located on the side surface. The openings are connected to the through holes, and in another embodiment of the invention, the through holes are respectively connected to the insulating layer, the insulating layer has at least one upper surface, and the other through holes are exposed. The aperture is exposed in an embodiment of the invention, the two sides described above. The communication hole is connected to the towel-lang (four) two substrate and has a communication hole. The invention further comprises a through hole on the lower surface. This month, another type of circuit board is formed on the trench-core substrate. Then, shape it. The first layer is formed on the substrate, and the outer layer of the outer cover of the towel is covered with a cover layer. The outer layer of the outer layer 3M forms a cavity in the groove. 201108879 "Next' forming at least one outer wiring layer on the outer insulating layer. After forming the outer layer wiring layer, at least a uniform hole is formed in the outer insulating layer, wherein the through hole communicates with the cavity. In an embodiment of the invention, the trench is formed by laser ablation or milling. In an embodiment of the invention, the depth of the trench is smaller than the thickness of the core substrate. In an embodiment of the invention, the depth of the trench is substantially equal to the thickness of the core substrate. In an embodiment of the invention, the through hole is a Non-Plate Through Hole (NPTH). In an embodiment of the invention, the method of forming the non-plated through holes includes mechanical drilling or laser drilling. In an embodiment of the invention, a method of forming an outer wiring layer includes forming at least one conductor layer on an outer insulating layer. Next, the conductor layer is patterned. • In an embodiment of the invention, the method of forming the outer insulating layer and the conductor layer comprises laminating at least one backing copper foil (RCC) on the core substrate. In an embodiment of the invention, the method for forming the outer layer of the insulating layer and the conductor layer comprises: pressing a substrate onto the core substrate by using an adhesive layer, wherein the substrate comprises a dielectric layer and a conductor layer and the conductor layer is disposed on the substrate On the electrical layer. The adhesive layer is bonded between the dielectric layer and the core substrate. In an embodiment of the invention, the method of forming the outer layer of the circuit package 201108879 includes a semi-additive method. In an embodiment of the invention, the method of forming the outer wiring layer includes forming an intaglio pattern on the outer insulating layer. Next, a conductive material is formed in the intaglio pattern. In the embodiment of the present invention, before forming the outer layer of the outer layer, the component is further included on the core substrate, wherein the spacer covers the trench.
在本發明一實施例中，當形成貫孔時，更包括形成一 於擋片’其中牙孔連通於貫孔與空腔之間。 在本發明一實施例中，形成穿孔的方法包括機械鑽孔 或雷射鑽孔。 一塘！本發明一實施例中’在形成貫孔之前，更包括形成 一覆蓋外層絕緣層的保護層。 在本發明-實施例中’上述保護層為—防焊層（s〇lder maSk)’而防焊層是利用印刷方式（printing)絲合方式 而形成。 在本發明-實_巾，在形成外層線路層之後 ，更包 括切割核心基板與外層絕緣層，以裸露出空腔。 #本發明-實_中’上述_核心基板與外層絕緣 層的方法包括V型切割或銑割。 由於外層絕緣層的多個貫孔能透過空腔而彼此相通， 的空氣可以在這些貫孔與空腔内流動因此這些貫 聲音’而本發明的線路板可應用於具有電 箄谀旎器的電子裝置。 201108879 下文特舉實施例’並配合所附圖式，作詳細說明如下。 【實施方式】 圖1A繪示本發明一實施例的線路板的剖面示意圖。 請參閱圖1A，線路板100可裝設在手機、個人數位助理器 (Personal Digital Assistant，PDA )、數位音訊播放器 (Digital Audio Player，DAP，其例如是 MP3 播放器）、掌 上型遊樂器（handheld game console )、筆記型電腦（laptop ) 或超級移動電腦（Ultra-Mobile PC，UMPC)等具有電聲換 能器（electro-acoustic transducers )的電子裝置内。 上述電聲換能器泛指能將電能轉換成聲能，或是將聲 能轉換成電能的換能器（transducers )，而電聲換能器例如 疋揚聲器（又稱味]。八）或是麥克風（microphone，又稱傳 聲器）。 線路板100具有一空腔C1與一外表面102，而外表面 1〇2包括一上表面si、一下表面S2以及一側表面S3，其 中下表面S2相對於上表面si，而侧表面S3連接於上表面 S1與下表面S2之間。此外，線路板100包括一核心基板 110、二層外層絕緣層120以及二層外層線路層130。 空腔C1位於核心基板11〇内，而空腔ci的腔壁wi 存在多個開口 HI’其中空腔ci的高度L1實質上等於核心 基板110的厚度L2 ’即空腔C1是貫穿核心基板11〇而形 成。不過’在其他實施例中，空腔C1的高度L1可小於核 。基板110的厚度L2。因此’圖1A所示的高度L1僅供舉 201108879 例說明’並非限制本發明的技術特徵。 核心基板110位於這些外層絕緣層120之間，而這些 外層線路層130分別配置於這些外層絕緣層12〇,其中各 層外層絕緣層120配置於核心基板11 〇與其中一層外層線 路層130之間。也就是說，核心基板11〇也位於這此外層 . 線路層130之間。 , 承上述，核心基板110可以是不具有任何走線（trace) 鲁與佈線（layout)的板材，其例如是由樹脂材料所製成的空 白核心層（blank core)等絕緣板材，或是表面已覆蓋絕緣 材料的金屬核心層（metal core layer )。 外層絕緣層120的材料可以是樹脂材料，並且可以是 黏合層，其中此黏合層例如是半固化膠片或樹脂等具有黏 性的膠材。因此，各層外層絕緣層120能黏合於核心基板 110與其中一層外層線路層130之間。 這些外層絕緣層120具有多個貫孔122，其中各層外 • 層絕緣層120可以具有至少一個貫孔122’而這些貫孔122 的孔徑可以疋實質上彼此相同。此外，這些貫孔122可以 皆為非電鍍貝孔，而這些非電鍵貫孔可以採用機械鑽孔或 雷射鑽孔的方法來形成。 這些貝孔122皆裸露於外表面1〇2，例如在圖1 a所示 的實施例中，其中二個貫孔122裸露於上表面S1，而另外 二個貫孔122裸4於下表面§2。這些貫孔122分別連通這 些開口 H1’因此所有貫孔122能通過空腔C1而彼此相通， 201108879 讓在這些貫孔122與空腔Cl中的流體形成可傳遞聲音的流 體傳聲路徑P卜其中流體可以是液體或氣體（例如空氣> 詳細而言’流體傳聲路徑P1乃是指由液體或氣體所形 成的聲音傳遞路徑，例如在本實施例中，流體傳聲路徑ρι 是由在貫孔122與空腔Cl +的空氣所形成’而這些貫孔 122與空腔C1的這些開口 H1皆位於流體傳聲路徑P1。外 界的空氣能在這些貫孔122與空腔C1内流動，即外界的空 氣可經由貫孔122與空腔C1而通過線路板100。也就是 说’流體傳聲路彳f P1會通過線路板1〇〇。 在本實施例中，至少一電聲換能器1〇可以組裝在線路 板100的外層線路層130上，並位於其中一個貫孔122處。 電聲換能器10具有一能接收或發出聲音的換能面 (transduction surface) 12,並可透過插孔、彈片（spring) 或焊接（soldering)的方式組裝於線路板1〇〇。 當電聲換能器10為揚聲器時，換能面12為發聲面， 並可朝向電聲換能器10所在處的貫孔122發出聲音，其中 揚聲器（也就是電聲換能器1〇)例如是微機電系統揚聲器 (Microelectromechanical Systems Speaker » MEMS Speaker)’而聲音能沿著流體傳聲路徑pi從貫孔122發出。 由此可知，電聲換能器1〇的聲音不僅可以從上表面 si直接發出’也可以經由空腔C1與這些貫孔122而從上 表面S1與下表面S2發出。另夕卜，在本實施例中，電聲換 能器ίο可以更包括-相對於換能面12而配置的遮罩14， 201108879 f 而遮罩14能讓聲音集中朝向貫孔122傳遽。 電聲換能器10除了可以是揚聲器之外’也可以是麥克 風，而換能面12可以是接收聲音的收聲面。詳細而言，當 電聲換能器10為麥克風，而外界的聲音傳遞至線路板100 時，換能面12能從這些貫孔122接收聲音，並將聲音轉換 成電能’讓電聲換能器10得以進行錄音。 . 承上述，在其他未繪示的實施例中，當電聲換能器10 鲁為麥克風時，對應換能面12的貫孔122可以透過空腔cn， 僅與另一個貫孔122連通。因此，麥克風類型的電聲換能 器10可以只從二個貫孔122與空腔ci所形成的流體傳聲 路經P1來接收聲音，以提升電聲換能器10所記錄的聲音 的品質。 值得一提的是，電聲換能器10的數量可以是多個，而 這些電聲換能器10可分別配置在這些貫孔122處，其中這 些電聲換能器1〇的種類不一定完全相同。舉例來說，這此 士 電聲換能器1〇可為高音喇叭與低音喇叭，而通過線路板 100的貫孔122與空腔C1，這些電聲換能器10能產生環繞 音響的聽覺效果，提供使用者更好的聽覺享受。此外，這 些電聲換能器1〇也可以是揚聲器與麥克風，即揚聲器與麥 克風皆可以組裝於同一塊線路板1〇〇。 另外’本實施例的線路板100只需要二個與空腔Cl 連通的貝孔122，即可讓外界的空氣通過線路板100，進而 使流體傳聲路徑P1通過線路板100。因此，雖然圖1A中 12 201108879 - 的貫孔122的數量為四個’但在其他未繪示的實施例中， • 線路板100所具有的貫孔122的數量可以是至少二個。 舉例來說，線路板100可具有二個裸露於同一表面（即 上表面S1或下表面S2)的貫孔122，或是二個分別裸露於 上表面S1與下表面S2的貫孔122。當然，貫孔122的數 量也可為三個或超過四個，且貫孔122亦可以裸露於側表 Λ 面S3。因此，圖1Α所示的貫孔122的數量及分布僅供舉 例說明，並非限制本發明的技術特徵。 鲁 必須說明的是，在圖1Α中’外層線路層13〇的數量 為二層，且這些外層線路層130分別位於上表面si與下表 面S2，所以圖1Α所示的線路板1〇〇為一種雙面線路板 (double-side wiring board)’但在其他實施例中，外層線 路層130的數里可只有一層’即線路板1〇〇可為單面線路 板（single-side wiring board)。因此，圖ία中的外層線路 層130的數量僅供舉例說明，並非限制本發明的技術特徵。 • 圖繪示圖1A中線路板的俯視示意圖，並繪示出裸 露於上表面S1的其中一個貫孔122。請參閱圖1B，由於 這些貫孔122皆裸露於外表面1〇2,例如圖iB中的貫孔^22 是裸露於上表面S1，因此各個貫孔122具有一位於外表面 102 的洞口 122a。 承上述，開口 H1會與其連通的貫孔122的洞口 122& 部分重@，其中開口 Η1為圖1B中的斜線區域，而洞口 1 為圖1B中粗線圍繞的區域。舉例而言，貫孔12 2的孔柄 13 201108879 R匕大於空腔u的寬度w’因此貫孔122的洞口咖不僅 暴路出π刀空腔c卜同時也暴露出空腔以外的部分核 基板110，以至於開口 H1與洞口 122a部分重疊。 必/員說明的是，雖然圖1B所示的洞口 位於上表 面S卜但是這些開口 H1亦可與位於下表面幻（請參考圖 .1A)的洞口 122a部分重疊，而本實施例並不限定開口钔 -只能與位於上表面S1的洞口 122a部分重疊。 • ^、他實施例中，開σ H1也可以實質上與其連通的 洞 h元王重f。也就是說，就外觀而言，開口 與 洞口 122a 一者的面積與形狀皆相同，且開口 hi與洞口 122a二者的邊緣全部重疊。舉例而言，請參閱圖1C，其繪 示本發明另一實施例的線路板的俯視示意圖，而圖ie所示 的外表面102可為上表面S1或下表面S2(請參考圖ία)。 在圖ic所示的實施例中，貫孔122，的孔徑R2小於空 腔ci的寬度w，以至於貫孔122，的洞口 122a，(圖1C 鲁中粗線圍繞的區域）只暴露出部分空腔C1，而不會如同圖 1B所示，暴露出空腔C1以外的部分核心基板11〇。因此， 連通空腔C1的開口 H1’（圖1C中的斜線區域）以及其連 通的洞口 122a’二者的邊緣在外觀上是全部重疊’即開口 ΗΓ實質上與洞口 122a’完全重疊。 值得一提的是，雖然圖1A所示的線路板100，其所具 有的貫孔皆為貫孔122，但是在其他未繪示的實施例中， 線路板100可以同時具有貫孔122與貫孔122,，即線路板 201108879 - 100同時具有與開口 HI部分重疊的洞口 122a，以及與開口 ΗΓ實質上完全重疊的洞口 122a’。當然，線路板100所具 有的貫孔也可以都是貫孔122’。因此，圖1A所示的這些 貫孔122僅供舉例說明，並非限制本發明的技術特徵。 圖2A至圖2E繪示圖1A中線路板的製造方法的流程 _ 剖面示意圖。請參閱圖2A與圖2B，關於線路板100的製 造方法，首先，形成一溝槽T1於一核心基板110，其中溝 槽T1是利用雷射燒蝕或銑割而形成，而溝槽T1的深度D1 實質上等於核心基板110的厚度L2。也就是說，溝槽T1 是貫穿核心基板110而形成。不過，在其他實施例中，溝 槽T1的深度D1可以小於核心基板110的厚度L2。 請參閱圖2B與圖2C，接著，形成二層外層絕緣層120 於核心基板110的相對二表面110a、110b。這些外層絕緣 層120覆蓋溝槽T1 (溝槽T1在圖2C中未標示），以使溝 槽T1形成空腔C1。詳細而言，在這些外層絕緣層120覆 • 蓋溝槽T1之後，溝槽T1會被這些外層絕緣層120與核心 基板110包圍而形成空腔C1。 接著，分別形成二層導體層130’於這些外層絕緣層120 上，其中各層外層絕緣層120配置於核心基板110與其中 一層導體層130’之間。也就是說，這些外層絕緣層120皆 位於這些導體層130’之間。此外，這些導體層130’可以是 金屬層，其例如是銅箔。 形成外層絕緣層120與導體層130’的方法有多種，而 15 201108879 ' 在本實施例中，形成外層絕緣層120與導體層130’的方法 • 可以是壓合二片背膠銅箔於核心基板I10上’其中這些背 膠銅箔是分別壓合於核心基板110的二表面110a、110b ’ 即這些背膠銅箔夾持並壓合於核心基板110。 詳細而言，每片背膠銅箔包括一銅箔與一黏合於銅箔 的黏膠。在壓合這些背膠銅箔之後，銅箔會形成導體層 uo’，而黏膠會形成外層絕緣層120。由此可知，位於核心 基板110的同一表面（即表面ll〇a或ll〇b)上的導體層 13〇’與外層絕緣層120可以同時形成。 背膠銅箔的黏膠，也就是外層絕緣層12〇，可以採用 現今線路板製造技術中常使用的低流動性膠片（1〇w fl〇w prepreg )或無流動性膠片（n〇n_£|〇w坪叩哪），因此當壓合背 夥銅時’低流動性膠片或無流動性膠片不會大量流入空腔 C1内，而空腔C1不易被膠材完全填滿。In an embodiment of the invention, when the through hole is formed, the method further includes forming a blocking piece, wherein the tooth hole communicates between the through hole and the cavity. In an embodiment of the invention, the method of forming the perforations includes mechanical drilling or laser drilling. One pond! In an embodiment of the invention, the formation of a protective layer covering the outer insulating layer is further included before the formation of the through holes. In the present invention - the embodiment "the protective layer is a solder resist layer" and the solder resist layer is formed by a printing stitching method. In the present invention, after forming the outer layer wiring layer, the core substrate and the outer layer insulating layer are further included to expose the cavity. The method of the present invention - the core substrate and the outer layer insulating layer includes V-cutting or milling. Since the plurality of through holes of the outer insulating layer can communicate with each other through the cavity, air can flow in the through holes and the cavity, so the sound of the present invention can be applied to the circuit board having the electric smasher. Electronic device. 201108879 The following specific embodiments are described in detail with reference to the accompanying drawings. Embodiment 1 FIG. 1A is a cross-sectional view showing a circuit board according to an embodiment of the present invention. Referring to FIG. 1A, the circuit board 100 can be installed in a mobile phone, a Personal Digital Assistant (PDA), a digital audio player (Digital Audio Player, DAP, which is, for example, an MP3 player), and a palm-type amusement instrument ( Handheld game console ), laptop or ultra-mobile PC (UMPC) and other electronic devices with electro-acoustic transducers. The above electroacoustic transducer generally refers to a transducer that can convert electrical energy into acoustic energy or convert acoustic energy into electrical energy, and an electroacoustic transducer such as a chirp speaker (also known as a taste). It is a microphone (also known as a microphone). The circuit board 100 has a cavity C1 and an outer surface 102, and the outer surface 1〇2 includes an upper surface si, a lower surface S2 and a side surface S3, wherein the lower surface S2 is opposite to the upper surface si, and the side surface S3 is connected to Between the upper surface S1 and the lower surface S2. In addition, the circuit board 100 includes a core substrate 110, two outer insulating layers 120, and two outer wiring layers 130. The cavity C1 is located in the core substrate 11A, and the cavity wall wi of the cavity ci has a plurality of openings HI', wherein the height L1 of the cavity ci is substantially equal to the thickness L2 of the core substrate 110, that is, the cavity C1 is penetrated through the core substrate 11. Formed by cockroaches. However, in other embodiments, the height L1 of the cavity C1 may be smaller than the core. The thickness of the substrate 110 is L2. Therefore, the height L1 shown in Fig. 1A is only for the purpose of explaining the example of the present invention, and does not limit the technical features of the present invention. The core substrate 110 is disposed between the outer insulating layers 120, and the outer wiring layers 130 are respectively disposed on the outer insulating layers 12, wherein the outer insulating layers 120 are disposed between the core substrate 11 and one of the outer layer layers 130. That is to say, the core substrate 11A is also located between the other layers and the circuit layer 130. In the above, the core substrate 110 may be a plate material which does not have any trace and layout, and is, for example, an insulating plate such as a blank core made of a resin material, or a surface. The metal core layer of the insulating material has been covered. The material of the outer insulating layer 120 may be a resin material, and may be an adhesive layer, wherein the adhesive layer is, for example, a viscous adhesive such as a semi-cured film or a resin. Therefore, each of the outer layer insulating layers 120 can be bonded between the core substrate 110 and one of the outer layer wiring layers 130. The outer insulating layer 120 has a plurality of through holes 122, wherein each of the outer insulating layers 120 may have at least one through hole 122' and the apertures of the through holes 122 may be substantially identical to each other. In addition, the through holes 122 may be non-electroplated holes, and these non-key holes may be formed by mechanical drilling or laser drilling. The bell holes 122 are exposed to the outer surface 1〇2, for example, in the embodiment shown in FIG. 1a, wherein the two through holes 122 are exposed on the upper surface S1, and the other two through holes 122 are bare on the lower surface. 2. The through holes 122 respectively communicate with the openings H1' so that all the through holes 122 can communicate with each other through the cavity C1, and 201108879 allows the fluid in the through holes 122 and the cavity C1 to form a sound transmitting path P for transmitting sound. The fluid may be a liquid or a gas (for example, air). In detail, the fluid sound path P1 refers to a sound transmission path formed by a liquid or a gas. For example, in the present embodiment, the fluid sound path ρι is The holes 122 are formed by the air of the cavity Cl + and the openings H1 of the through holes 122 and the cavity C1 are located in the fluid sound transmission path P1. The outside air can flow in the through holes 122 and the cavity C1, that is, The outside air can pass through the circuit board 100 through the through hole 122 and the cavity C1. That is, the 'fluid sound path 彳f P1 will pass through the circuit board 1 〇〇. In this embodiment, at least one electroacoustic transducer 1〇 can be assembled on the outer circuit layer 130 of the circuit board 100 and located at one of the through holes 122. The electroacoustic transducer 10 has a transduction surface 12 capable of receiving or emitting sound, and can be inserted through Hole, shrapnel (spr In the ing) or soldering manner, the circuit board 1 is assembled. When the electroacoustic transducer 10 is a speaker, the transducing surface 12 is a sound emitting surface and faces the through hole 122 where the electroacoustic transducer 10 is located. The sound is emitted, wherein the speaker (that is, the electro-acoustic transducer 1 〇) is, for example, a Microelectromechanical Systems Speaker (MEMS Speaker), and the sound can be emitted from the through-hole 122 along the fluid sound path pi. The sound of the electroacoustic transducer 1 不仅 can be emitted not only from the upper surface si but also from the upper surface S1 and the lower surface S2 via the cavity C1 and the through holes 122. In addition, in this embodiment, The electroacoustic transducer ίο may further include a mask 14 disposed with respect to the transducing surface 12, 201108879 f and the mask 14 allows the sound to be concentrated toward the through hole 122. The electroacoustic transducer 10 may be a speaker. The outside 'can also be a microphone, and the transducing surface 12 can be a sound receiving surface for receiving sound. In detail, when the electroacoustic transducer 10 is a microphone and the external sound is transmitted to the circuit board 100, the transducing surface 12 can Connected from these through holes 122 Sound, and the sound is converted into electrical energy', so that the electroacoustic transducer 10 can be recorded. In the other embodiments, in the other embodiments, when the electroacoustic transducer 10 is a microphone, the corresponding transducing surface 12 The through hole 122 can pass through the cavity cn and communicate with only the other through hole 122. Therefore, the microphone type electroacoustic transducer 10 can transmit sound only through the fluid formed by the two through holes 122 and the cavity ci. P1 receives the sound to improve the quality of the sound recorded by the electroacoustic transducer 10. It is worth mentioning that the number of the electro-acoustic transducers 10 may be multiple, and the electro-acoustic transducers 10 may be respectively disposed at the through-holes 122, wherein the types of the electro-acoustic transducers 1 are not necessarily It's exactly the same. For example, the electroacoustic transducer 1 can be a tweeter and a woofer, and through the through hole 122 of the circuit board 100 and the cavity C1, these electroacoustic transducers 10 can produce a surround sound audible effect. To provide users with a better listening experience. In addition, these electroacoustic transducers 1 can also be a speaker and a microphone, that is, both the speaker and the microphone can be assembled on the same circuit board. Further, the circuit board 100 of the present embodiment requires only two bell holes 122 communicating with the cavity C1 to allow outside air to pass through the circuit board 100, thereby allowing the fluid sound path P1 to pass through the circuit board 100. Therefore, although the number of the through holes 122 of 12 201108879 - in Fig. 1A is four', but in other embodiments not shown, the number of the through holes 122 of the circuit board 100 may be at least two. For example, the circuit board 100 may have two through holes 122 exposed on the same surface (i.e., the upper surface S1 or the lower surface S2), or two through holes 122 exposed to the upper surface S1 and the lower surface S2, respectively. Of course, the number of the through holes 122 may also be three or more than four, and the through holes 122 may also be exposed to the side surface S3. Therefore, the number and distribution of the through holes 122 shown in Fig. 1B are for illustrative purposes only and are not intended to limit the technical features of the present invention. It must be noted that in FIG. 1A, the number of outer layer layers 13 is two, and the outer layer layers 130 are respectively located on the upper surface si and the lower surface S2, so that the circuit board shown in FIG. A double-side wiring board', but in other embodiments, only one layer of the outer circuit layer 130 may be a single-side wiring board. . Therefore, the number of outer wiring layers 130 in the figure ία is for illustrative purposes only and does not limit the technical features of the present invention. • A schematic top view of the circuit board of Figure 1A is shown, and one of the through holes 122 exposed to the upper surface S1 is illustrated. Referring to FIG. 1B, since the through holes 122 are exposed on the outer surface 1〇2, for example, the through holes 22 in FIG. iB are exposed on the upper surface S1, each of the through holes 122 has a hole 122a on the outer surface 102. In the above, the opening 122& portion of the through hole 122, to which the opening H1 communicates, is partially @, wherein the opening Η1 is the oblique line area in Fig. 1B, and the opening 1 is the area surrounded by the thick line in Fig. 1B. For example, the hole handle 13 of the through hole 12 2 201108879 R 匕 is larger than the width w ′ of the cavity u. Therefore, the hole of the through hole 122 not only violently exits the π knife cavity c but also exposes a part of the core other than the cavity. The substrate 110 is such that the opening H1 partially overlaps the opening 122a. It should be noted that although the opening shown in FIG. 1B is located on the upper surface Sb, these openings H1 may partially overlap the opening 122a located on the lower surface of the lower surface (please refer to FIG. 1A), and the embodiment is not limited thereto. The opening 钔 can only partially overlap the opening 122a of the upper surface S1. • ^, in his embodiment, the opening σ H1 can also be substantially connected to the hole h element king weight f. That is, in terms of appearance, the area and shape of the opening and the opening 122a are the same, and the edges of the opening hi and the opening 122a are all overlapped. For example, referring to FIG. 1C, a top view of a circuit board according to another embodiment of the present invention is shown, and the outer surface 102 shown in FIG. 1 can be an upper surface S1 or a lower surface S2 (please refer to FIG. In the embodiment shown in FIG. ic, the aperture R2 of the through hole 122 is smaller than the width w of the cavity ci, so that the opening 122a of the through hole 122, (the area surrounded by the thick line in FIG. 1C) only exposes a part. The cavity C1 does not expose a portion of the core substrate 11A other than the cavity C1 as shown in FIG. 1B. Therefore, the edges of both the opening H1' (the hatched area in Fig. 1C) communicating with the cavity C1 and the communicating opening 122a' thereof are all overlapped in appearance, i.e., the opening ΗΓ substantially completely overlaps the opening 122a'. It is to be noted that although the circuit board 100 shown in FIG. 1A has the through holes 122, the circuit board 100 can have the through holes 122 and the same in other embodiments not shown. The holes 122, that is, the wiring boards 201108879-100 have both the opening 122a partially overlapping the opening HI and the opening 122a' substantially overlapping the opening ΗΓ. Of course, the through holes of the circuit board 100 may also be the through holes 122'. Therefore, the through holes 122 shown in Fig. 1A are for illustrative purposes only and are not intended to limit the technical features of the present invention. 2A to 2E are schematic cross-sectional views showing a method of manufacturing the circuit board of FIG. 1A. Referring to FIG. 2A and FIG. 2B , with respect to the manufacturing method of the circuit board 100 , first, a trench T1 is formed on a core substrate 110 , wherein the trench T1 is formed by laser ablation or milling, and the trench T1 is formed. The depth D1 is substantially equal to the thickness L2 of the core substrate 110. That is, the trench T1 is formed through the core substrate 110. However, in other embodiments, the depth D1 of the trench T1 may be less than the thickness L2 of the core substrate 110. Referring to FIG. 2B and FIG. 2C, a second outer insulating layer 120 is formed on the opposite surfaces 110a, 110b of the core substrate 110. These outer insulating layers 120 cover the trench T1 (the trench T1 is not shown in Fig. 2C) so that the trench T1 forms the cavity C1. In detail, after the outer insulating layer 120 covers the trench T1, the trench T1 is surrounded by the outer insulating layer 120 and the core substrate 110 to form a cavity C1. Next, two layers of conductor layers 130' are formed on the outer insulating layers 120, wherein each of the outer layer insulating layers 120 is disposed between the core substrate 110 and one of the conductor layers 130'. That is, these outer insulating layers 120 are located between the conductor layers 130'. Further, these conductor layers 130' may be metal layers such as copper foil. There are various methods for forming the outer insulating layer 120 and the conductor layer 130', and 15 201108879 'in the present embodiment, the method of forming the outer insulating layer 120 and the conductor layer 130' can be press-bonded with two pieces of adhesive copper foil at the core On the substrate I10, the backing copper foils are respectively pressed onto the two surfaces 110a, 110b' of the core substrate 110, that is, the backing copper foils are sandwiched and pressed against the core substrate 110. In detail, each of the backing copper foil includes a copper foil and a glue adhered to the copper foil. After the backing of the backing copper foil, the copper foil forms a conductor layer uo', and the adhesive forms the outer insulating layer 120. It can be seen that the conductor layer 13'' on the same surface (i.e., the surface 11a or 11b) of the core substrate 110 and the outer insulating layer 120 can be simultaneously formed. The adhesive of the adhesive copper foil, that is, the outer insulating layer 12〇, can use the low-flow film (1〇w fl〇w prepreg) or the no-flow film (n〇n_£| commonly used in the current circuit board manufacturing technology. 〇W Ping 叩 )), so when pressing back the copper, 'low flow film or no flow film will not flow into the cavity C1, and the cavity C1 is not easily filled completely by the glue.
特別说明的是，雖然圖1A的線路板1〇〇是雙面線路 仁在其他未繪示的實施例中，線路板1〇〇可以是單面 :板因此，當形成導體層130,與外層絕緣層120時， 130可以只形成一層，所以圖2C中形成導體層130, 僅供料彳說明’並雜制本發明的技術特徵。 以形二閱圖2C與圖2D，接著，圖案化這些導體層130，， 的I法多層外層線路層130，其中圖案化這些導體層130, etch.、可以採用微影及蝕刻技術（lith〇graPhy and 〜，而上職刻技術可以是澄式钱刻技術。 201108879 以上圖2C至圖2D所示的外層線路層130的形成方法 •為減成法（subtractive)。然而，在其他未繪示的實施例中， 形成&些外層線路層130的方法亦可以是現今線路板製造 技術中所採用的半加成法。 另外’這些外層線路層130也可採用減成法與半加成法二 * 者乂外的其他方法來形成。詳細而言，在其他形成外層線路層 130的方法中，可以在外層絕緣層12〇上形成一凹刻圖案而 φ 凹刻圖案可包括多條溝渠（trench)，其中凹刻圖案可以利用 雷射燒蝕，或是微影及蝕刻技術來形成。 接著’形成-導電材料於凹刻圖案内，以形成這些外層線 路層130 ’其中這些外層線路層13〇内埋（⑽於外層In particular, although the circuit board 1A of FIG. 1A is a double-sided wiring unit, in other embodiments not shown, the wiring board 1〇〇 may be a single-sided: board. Therefore, when the conductor layer 130 is formed, the outer layer In the case of the insulating layer 120, 130 may be formed only in one layer, so that the conductor layer 130 is formed in Fig. 2C, and the technical features of the present invention are mixed. Referring to FIG. 2C and FIG. 2D, the I-layer multilayer outer layer 130 of the conductor layer 130 is patterned, wherein the conductor layers 130 are patterned, etch., and lithography and etching techniques can be used. graPhy and ~, and the above-mentioned technique can be a clear-cut technique. 201108879 The method of forming the outer layer layer 130 shown in Figures 2C to 2D above is a subtractive method. However, it is not shown otherwise. In the embodiment, the method of forming the & outer layer layers 130 may also be the semi-additive method used in the current circuit board manufacturing technology. In addition, the outer layer layers 130 may also adopt a subtractive method and a semi-additive method. In other methods of forming the outer wiring layer 130, in detail, an intaglio pattern may be formed on the outer insulating layer 12, and the φ intaglio pattern may include a plurality of trenches ( Trench), wherein the intaglio pattern can be formed by laser ablation, or lithography and etching techniques. Then 'forming-conducting material in the intaglio pattern to form the outer layer layer 130' Buried within 13〇 (outer layer ⑽
如此，外層線路層130亦可以形成。As such, the outer wiring layer 130 can also be formed.
請參閱圖2D與圖2E， 露這種· __來形成外層線 一，在形成這些外層線路層13〇 201108879 • 後，形成多個貫孔122於這些外層絕緣層120，其中至少 * 一個貫孔122形成於各層外層絕緣層120,且這些貫孔122 皆與空腔C1連通。至此，線路板1〇〇基本上已製造完成。 此外，这些貝孔122可以是非電鍍通孔，而形成非電鍍通 孔的方法包括機械鑽孔或雷射鑽孔。 ， 圖3繪不本發明另一實施例的線路板的剖面示意圖。 明參閱圖3 ’本實施例的線路板2G0具有-空腔C2以及一 φ外表面202，並包括—核心基板210、二層外層絕緣層220 以及二層外層線路層230,其中外表面202包括-上表面 S4、一下表面Ss扣 D與一側表面S6。下表面S5相對於上表面 S4，而侧表面 6連接於上表面S4與下表面S5之間。 空腔C2位於以 # 义核心基板210，而空腔C2的腔壁W2存 在多個開口 H2。括 β , 孩心基板210位於這些外層絕緣層22〇之 間，而這些外；始 —θ緣路層230分別配置於這些外層絕綾展 220,其中各層外展& ^ ^ θ絕緣層220配置於核心基板210與其中 琴-層外層線路層23〇之間。 、/、 kik外層絕緣層22()具有多個貫孔 222，其中各層外 層絕緣層220可η曰丄 ， 9 从具有至少一個貫孔222,而這些貫孔222 白裸路於外表面2〇2〇以圖3的實施例為例，其中—個母 孔222裸路於上表面S4，而另外二個貫孔222減於下表 面S5。此外’這些貫孔222可皆為非電鍵貫孔，而非 貫孔可採:機械鑽孔或雷射鑽孔的方法來形成。 " 各個貝孔222連通其中一個開口 Η2，因此所有貫孔 18 201108879 • 222能通過空腔C2而彼此相通’讓空氣可以在這些貫孔222 - 與空腔C2内流動。如此，在貫孔222與空腔C2中的流體 (例如空氣）能形成可傳遞聲音的流體傳聲路徑P2 ’而這 些貫孔222與開口 H2皆位於流體傳聲路徑P2 ’其中流體 傳聲路徑P2會通過線路板200。 另外，至少一電聲換能器10可組裝在線路板200的外 層線路層230上，並位於其中一個貫孔222處’其中電聲 換能器10可以是揚聲器或麥克風，而電聲換能器10與線 ® 路板200之間的組裴方式與前述實施例相同，故不再贅述。 基於上述，本實施例的線路板200在結構及功能方面 皆與前述實施例的線路板1〇〇相似’而以下將主要介紹線 路板200與前述實施例的線路板100二者的差異。 在本實施例中，空腔C2的腔壁W2不僅存在這些開口 H2，而且更存在一開口 H3。詳細而言，開口 H3位於側表 面S6,且沒有直接與貫孔222連通。開口 H3連通空腔C2’ • 因此開口 H3能透過空腔C2與所有貫孔222相通，而外界 的空氣可以從任一個貫孔222，並經由空腔C2而通過開口 H3。如此，開口 H3亦位於流體傳聲路徑P2。 其次，空腔C2的高度L3小於核心基板210的厚度 L4。也就是說’空腔C2並不是貫穿核心基板210而形成。 不過，在其他未繪示的實施例中，空腔C2亦可以如同圖 1A所示的空腔C1 一樣，是貫穿核心基板210而形成，即 空腔C2的高度L3可以實質上等於核心基板210的厚度 201108879 L4。因此’圖3所示的空腔C2的高度L3僅供舉例說明， 並非限制本發明的技術特徵。 另外’本實施例的核心基板210及外層絕緣層220二 者也與前述實施例有所不同。具體來說，核心基板21〇為 線路基板，並具有走線與佈線。詳細而言，線路基板，即 核心基板210，包括一核心絕緣層212與二層第一線路層 214。空腔C2位於核心絕緣層212，而核心絕緣層212配 置於這些第一線路層214之間，其中各層第一線路層214 配置於核心絕緣層212與外層絕緣層220之間。 承上述’核心絕緣層212可以是由樹脂材料所形成， 例如核心絕緣層212是由半固化膠片所形成；或者，核心 絕緣層212也可以是空白核心層。此外，第一線路層214 可以是圖案化的金屬層，其例如是圖案化後的銅金屬層。 核心基板210可以更包括多層第二線路層216與多個 導電連接結構218，而這些第二線路層216位於核心絕緣 層212中，且可埋設於核心絕緣層212中。導電連接結構 218 例如是導電盲孔結構（conductive blind via structure )， 並連接於第一線路層214與第二線路層216之間，以使第 一線路層214與第二線路層216二者電性連接。 值得一提的是，在其他未繪示的實施例中，核心基板 210可以不需要任何第二線路層216,且核心基板21〇所包 括的第一線路層214的數量不僅可為二層（如圖3所示）， 同時也可以只有一層。因此，圖3所示的核心基板21〇僅 20 201108879 供舉例說明’並非限制本發明的技衝特^支 • 另外，核心基板210可以具有> y 夕個連通孔219，而各 個連通孔219連通於其中一個開口兑 與裸露於下表面S5 的一個貫孔222。也就是說，裸露於 %下表面S5的貫孔222 是透過連通孔219而與空腔C2連诵 ^ ’而且位於下表面S5 * 的貫孔222的數量與連通孔219的數量相同。 • 夕卜層絕緣層220可以包括一介電層⑽以及-黏合層 • 226 ’其中外層線路層230配置於介電層224上，而黏合層 226黏合於核心基板210與介電層224之間。介電層224 可以是空白核心層，而黏合層226的材料與前述實施例的 外層絕緣層120 (請參閱圖ία)的材料相同，即黏合層226 可以是半固化膠片或樹脂等具有黏性的膠材。 須說明的是’外層絕緣層220所具有的貫孔222的數 1可以只有一個、二個或三個以上，而且這些貫孔222可 鲁 分別裸露於上表面S4與下表面S5，或是僅裸露於上表面 S4或下表面S5。換句話說，這些貫孔222可只裸露於線路 板200的其中一面，或分別裸露於線路板2〇〇的相對二面。 其次，由於位於下表面S5的貫孔222的數量與連通孔 219的數量相同，因此核心基板210可以只具有一個連通 孔219 ’或是不具有任何連通孔219。由此可知，圖3所示 的貫孔222與連通孔219二者的數量以及貫孔222的分布 僅供舉例說明，並非限制本發明的技術特徵。 另外’各個貫孔222具有一位於外表面202的洞口（圖 21 201108879 二3未標不），而本實施例可以與圖1B所示的實施例一樣， •即開π H2與貫孔222⑷同口部分重疊。#然，本實施例 也可以與圖ic所不的實施例一樣，即開口 H2實質上與貫 孔222的洞口完全重疊。 特別一提的是’線路板200可以更包括一配置於核心 ,基板210以及其中一層外層絕緣層220之間的擋片24〇。 擔片240具有至少一穿孔242，而穿孔242連通於貫孔222 及空腔C2之間，其中擋片240可以是銅箔或空白核心層。 此外，線路板200可以更包括至少一層覆蓋外層絕緣層22〇 與外層線路層230的保護層250 (圖3繪示二層），而這些 保護層250可以是利用印刷方式或壓合方式所形成的防焊 層，其中以壓合方式所形成的防焊層可以是一種防焊乾膜。 本實施例的線路板200的製造方法與前述實施例的線 路板100的製造方法相似，而以下將配合圖4A至圖4F， 介紹線路板200的製造方法。 # 圖4A至圖4F繪示圖3中線路板的製造方法的流程剖 面示意圖。請參閱圖4A，關於線路板200的製造方法，首 先，形成一溝槽T2於核心基板210，其中核心基板210可 以是線路基板，而溝槽T2是形成於核心基板210的核心絕 緣層212中。 溝槽T2的深度D2小於核心基板210的厚度L4,但是 在其他未繪示的實施例中，溝槽T2的深度D2可以實質上 等於核心基板210的厚度L4 °也就是說，溝槽T2可以是 22 201108879 . 貫穿核心基板210而形成。此外，溝槽T2可以是利用雷射 - 燒蝕或銑割而形成。 請參閱圖4Β，接著，形成一片擋片24〇於核心基板21 〇 上，其中擋片240覆蓋溝槽Τ2 ’且擋片240是全面性地覆 蓋溝槽Τ2，以及局部覆蓋核心絕緣層212。此外，擋片240 可以是銅箔或空白核心層。 請參閱圖4C與圖4D，接著，形成二層外層絕緣層220 於核心基板210的相對二表面210a、210b(如圖4D所示）’ 鲁其中位於表面210a上的外層絕緣層220覆蓋溝槽T2與擋 片240，以使溝槽T2形成空腔C2。 接著，分別形成二層導體層230’於這些外層絕緣層220 上，其中各層外層絕緣層220配置於核心基板210與其中 一層導體層230,之間。也就是說，這些外層絕緣層220皆 位於這些導體層230’之間。此外’這些導體層230’可以是 金屬層，其例如是銅羯。 • 形成外層絕緣層220與導體層230’的方法有多種，例 如壓合背膠銅箔，而在本實施例中，形成外層絕緣層220 與導體層230’的方法可以是利用黏合層226,壓合多個基 板300於核心基板210上（如圖4C所示），其中在進行壓 合時’核心基板210是位於這些基板300之間。 基板300可以是銅羯基板（Copper Clad Laminate， CCL)’且各個基板300可包括一介電層224與一導體層 230’ ’其中導體層230’配置於介電層224，而各層黏合層 23 201108879 226黏合於其中一層介電層224與核心基板21〇之間。黏 合層226可以是半固化膠片，而此半固化膠片可以是低流 動性膠片或無流動性膠片。 值得一提的是’在其他未繪示的實施例中，當形成導 體層230’與外層絕緣層220時，導體層230,可以只形成一 層，而外層絕緣層220也可只形成一層。因此，圖4c與圖 4D所示的導體層230’與外層絕緣層220二者的數量僅供舉 例說明’並非限制本發明的技術特徵。 另外，必須說明的是，在其他未繪示的實施例中，並 不須要形成擋片240，即這些外層絕緣層22〇與這些導體 層230’可以是在沒有擋片240的條件下而形成。因此，圖 3以及圖4C至圖4G所示的擋片240僅供舉例說明，並非 限制本發明的技術特徵。 δ月參閱圖4D與圖4E ’之後，圖案化這些導體層230’， 以形成多層外層線路層230，其中圖案化這些導體層23〇, 的方法可以採用微影及钱刻技術，而上述钱刻技術可以是 溼式蝕刻技術。 特別一提的是，以上圖4C至圖4Ε所示的形成外層線 路層230的方法為減成法，但是在其他未繪示的實施例 中’形成這些外層線路層230的方法亦可以是現今線路板 製造技術中所採用的半加成法。 另外’這些外層線路層230也可以採用減成法與半加成法 二者以外的其他方絲减。詳細Μ，在其他職外層線路 24 201108879 層230的方法中，可以在外層絕緣層220上形成一四刻圖案， 而凹亥!圖案可包括多條溝渠，其中凹刻圖案可以利用雷射燒 蝕或是微影及蝕刻技術來形成。 接著’形成一導電材料於凹刻圖案内，以形成這些外層線 路層230 ’其中這些外層線路層230内埋於絕緣層230中。導 電材料可利用有電電鍍或無電電鍍來形成；或者，導電材料可 、銅《銀膠或導電高分子材料，並且能填入於凹刻圖案 内。如此，外層線路層230亦可以形成。 々δ兒明的是’雖然上述利用凹刻圖案來形成外層線路層 230的方法未繪示在圖式中，但是本發明所屬技術領域中具 有通#知識者能根據以上内容以及現今基本的線路板製造 技術，清楚地知道如何利用凹刻圖案來形成外層線路層 230因此，儘管圖式未繪示出導電材料與凹刻圖案，但是以 上内4確實财且充分揭露這制用㈣圖案來形成外層線 路層230的方法。 巧參閱圖4Ε與圖4F，在形成這些外層線路層23〇之 後，切割核心基板21〇與外層絕緣層22〇，以裸露出空腔 C2及形成開口 Η3，並形成與空腔C2連通的這些貫孔222 於外層絕緣層220。至此，線路板2〇〇基本上已製造完成。 此外，切割核心基板210與外層絕緣層22〇的方法可包括 v型切割或銳割，而這些貫孔222可為非電鐘通孔，其中 形成非電料㈣方法可包括機賴孔或雷射鑽孔。 另外，當形成這些貫孔222時，可形成至少一個穿孔 25 201108879 • 242於擋片240,以及形成至少一個連通孔219於核心基板 . 210,其中穿孔242與連通孔219皆連通於貫孔222與空腔 C2之間。穿孔242與連通孔219二者的形成方法可與貫孔 222的形成方法相同，即形成穿孔242與連通孔219的方 法可包括機械鑽孔或雷射鑽孔。 值得一提的是，在形成這些貫孔222以及切割核心基 板210與外層絕緣層220之前，更可以形成二層覆蓋外層 絕緣層220與外層線路層230的保護層250，以保護這些 • 外層線路層230，而在其他未繪示的實施例中，保護層250 可以只形成一層。這些保護層250可為防焊層，且例如是 利用印刷方式或壓合方式而形成，其中以壓合方式所形成 的防焊層可以防焊乾膜。。 由於保護層250是在形成貫孔222，以及切割核心基 板210與外層絕緣層220之前而形成的，因此當以印刷方 式來形成保護層250時，可避免防焊油墨等防焊材料滴入 • 空腔C2内，進而防止空腔C2損壞。此外，在前述實施例 中，保護層250也適用於圖1A的線路板100中，且保護 層250亦可在形成貫孔122以前，形成於外層絕緣層120。 综上所述，由於外層絕緣層的貫孔能透過空腔而彼此 相通，讓外界的空氣可以在這些貫孔與空腔内流動，使得 在這些貫孔與空腔中的流體（例如空氣）形成能傳遞聲音 的流體傳聲路徑。因此，電聲換能器所發出的聲音能透過 貫孔與空腔，從絕緣層外表面的任一處發出；或者電聲換 26 201108879 -能器也可以從貫孔與空腔來接收聲音。 .其次，本發明的線路板可同時安裝高音喇9\與低音喇 口八，而高音喇9\與低音喇。八二者所發出的聲音能從這些貫 孔與空腔發出，以產生環繞音響的聽覺效果，進而提供使 用者更好的聽覺享受。 雖然本發明以前述實施例揭露如上，然其並非用以限 定本發明，任何熟習相像技藝者，在不脫離本發明之精神 和範圍内，所作更動與潤飾之等效替換，仍為本發明之專 I利保護範圍内。 【圖式簡單說明】 圖1A繪示本發明一實施例的線路板的剖面示意圖。 圖1B繪不圖1A中線路板的俯視不意圖。 圖1C繪示本發明另一實施例的線路板的俯視示意圖。 圖2A至圖2E繪示圖1A中線路板的製造方法的流程剖面 # 示意圖。 圖3 繪示本發明另一實施例的線路板的剖面示意圖。 圖4A至圖4F繪示圖3中線路板的製造方法的流程剖面示 意圖。Referring to FIG. 2D and FIG. 2E, the outer layer is formed by forming the outer layer 1 . After the outer layer 13 13108108879 is formed, a plurality of through holes 122 are formed in the outer insulating layer 120, at least * one through The holes 122 are formed in the outer layer insulating layers 120, and the through holes 122 are in communication with the cavity C1. At this point, the circuit board 1 has basically been manufactured. Additionally, the vias 122 can be unplated vias, and the methods of forming the non-plated vias include mechanical or laser drilling. FIG. 3 is a cross-sectional view showing a circuit board according to another embodiment of the present invention. Referring to FIG. 3, the circuit board 2G0 of the present embodiment has a cavity C2 and a φ outer surface 202, and includes a core substrate 210, a two-layer outer insulating layer 220, and two outer layer circuit layers 230, wherein the outer surface 202 includes - upper surface S4, lower surface Ss buckle D and one side surface S6. The lower surface S5 is opposed to the upper surface S4, and the side surface 6 is connected between the upper surface S4 and the lower surface S5. The cavity C2 is located at the # core core substrate 210, and the cavity wall W2 of the cavity C2 is provided with a plurality of openings H2. Including β, the child substrate 210 is located between the outer insulating layers 22〇, and the outer; the θ-edge layer 230 is respectively disposed on the outer layers 220, wherein each layer is abducted & ^ ^ θ insulating layer 220 It is disposed between the core substrate 210 and the piano-layer outer layer layer 23〇. , /, kik outer insulating layer 22 () has a plurality of through holes 222, wherein each of the outer layer of insulating layer 220 can be η 曰丄, 9 from at least one through hole 222, and these through holes 222 white bare road on the outer surface 2 〇 2, the embodiment of FIG. 3 is taken as an example, in which one mother hole 222 is bare from the upper surface S4, and the other two through holes 222 are reduced to the lower surface S5. In addition, these through holes 222 can be non-keyed through holes, and non-through holes can be formed by mechanical drilling or laser drilling. " Each of the bell holes 222 communicates with one of the openings Η2, so that all of the through holes 18 201108879 • 222 can communicate with each other through the cavity C2 'allowing air to flow in the through holes 222 - and C2 . Thus, the fluid (for example, air) in the through hole 222 and the cavity C2 can form a sound transmitting path P2 ′ for transmitting sound, and the through holes 222 and H2 are located in the fluid sound path P2 'where the fluid sound path P2 will pass through the circuit board 200. In addition, at least one electroacoustic transducer 10 can be assembled on the outer circuit layer 230 of the circuit board 200 and located at one of the through holes 222 'where the electroacoustic transducer 10 can be a speaker or a microphone, and the electroacoustic transduction The stacking manner between the device 10 and the line® board 200 is the same as that of the previous embodiment, and therefore will not be described again. Based on the above, the circuit board 200 of the present embodiment is similar in structure and function to the wiring board 1 of the foregoing embodiment, and the difference between the circuit board 200 and the circuit board 100 of the foregoing embodiment will be mainly described below. In the present embodiment, the cavity wall W2 of the cavity C2 has not only these openings H2 but also an opening H3. In detail, the opening H3 is located on the side surface S6 and is not directly in communication with the through hole 222. The opening H3 communicates with the cavity C2'. • Therefore, the opening H3 can communicate with all of the through holes 222 through the cavity C2, and the outside air can pass from either of the through holes 222 and through the opening H3 via the cavity C2. Thus, the opening H3 is also located in the fluid sound path P2. Next, the height L3 of the cavity C2 is smaller than the thickness L4 of the core substrate 210. That is to say, the cavity C2 is not formed through the core substrate 210. However, in other embodiments not shown, the cavity C2 may be formed through the core substrate 210 like the cavity C1 shown in FIG. 1A, that is, the height L3 of the cavity C2 may be substantially equal to the core substrate 210. The thickness of 201108879 L4. Therefore, the height L3 of the cavity C2 shown in Fig. 3 is for illustrative purposes only and does not limit the technical features of the present invention. Further, both the core substrate 210 and the outer insulating layer 220 of the present embodiment are different from the foregoing embodiments. Specifically, the core substrate 21 is a circuit substrate and has wiring and wiring. In detail, the circuit substrate, that is, the core substrate 210, includes a core insulating layer 212 and two first wiring layers 214. The cavity C2 is located between the core insulating layer 212 and the core insulating layer 212 is disposed between the first circuit layers 214, wherein each of the first circuit layers 214 is disposed between the core insulating layer 212 and the outer insulating layer 220. The core insulating layer 212 may be formed of a resin material, for example, the core insulating layer 212 is formed of a prepreg; or the core insulating layer 212 may be a blank core layer. Additionally, the first circuit layer 214 can be a patterned metal layer, such as a patterned copper metal layer. The core substrate 210 may further include a plurality of second wiring layers 216 and a plurality of conductive connection structures 218, and the second wiring layers 216 are located in the core insulating layer 212 and may be buried in the core insulating layer 212. The conductive connection structure 218 is, for example, a conductive blind via structure, and is connected between the first circuit layer 214 and the second circuit layer 216 to electrically connect the first circuit layer 214 and the second circuit layer 216. Sexual connection. It should be noted that in other embodiments not shown, the core substrate 210 may not require any second circuit layer 216, and the number of the first circuit layers 214 included in the core substrate 21〇 may be not only two layers ( As shown in Figure 3, there can be only one layer at the same time. Therefore, the core substrate 21 shown in FIG. 3 is only 20 201108879 for exemplification 'not limiting the technical scope of the present invention. · In addition, the core substrate 210 may have > a communication hole 219, and each of the communication holes 219 One of the openings is connected to a through hole 222 exposed to the lower surface S5. That is, the through hole 222 exposed to the % lower surface S5 is connected to the cavity C2 through the communication hole 219 and the number of the through holes 222 located on the lower surface S5* is the same as the number of the communication holes 219. The insulating layer 220 may include a dielectric layer (10) and an adhesive layer 226' wherein the outer wiring layer 230 is disposed on the dielectric layer 224, and the bonding layer 226 is bonded between the core substrate 210 and the dielectric layer 224. . The dielectric layer 224 may be a blank core layer, and the material of the adhesive layer 226 is the same as that of the outer insulating layer 120 of the foregoing embodiment (see FIG. ία), that is, the adhesive layer 226 may be viscous such as semi-cured film or resin. The glue. It should be noted that the outer insulating layer 220 may have only one, two or more of the number 1 of the through holes 222, and the through holes 222 may be exposed to the upper surface S4 and the lower surface S5, respectively, or only Exposed to the upper surface S4 or the lower surface S5. In other words, the through holes 222 may be bare only on one side of the circuit board 200 or barely exposed on opposite sides of the circuit board 2''. Second, since the number of the through holes 222 located on the lower surface S5 is the same as the number of the communication holes 219, the core substrate 210 may have only one communication hole 219' or no communication hole 219. It can be seen that the number of the through holes 222 and the communication holes 219 shown in Fig. 3 and the distribution of the through holes 222 are merely illustrative and do not limit the technical features of the present invention. In addition, each of the through holes 222 has a hole at the outer surface 202 (Fig. 21 201108879 ii 3 is not labeled), and the embodiment can be the same as the embodiment shown in Fig. 1B, that is, the opening π H2 is the same as the through hole 222 (4). The mouth overlaps partially. #然, this embodiment can also be the same as the embodiment of Figure ic, that is, the opening H2 substantially completely overlaps the opening of the through hole 222. In particular, the circuit board 200 may further include a shutter 24 disposed between the core, the substrate 210, and one of the outer insulating layers 220. The support sheet 240 has at least one through hole 242, and the through hole 242 is communicated between the through hole 222 and the cavity C2, wherein the blocking piece 240 may be a copper foil or a blank core layer. In addition, the circuit board 200 may further include at least one protective layer 250 covering the outer insulating layer 22 and the outer circuit layer 230 (two layers are shown in FIG. 3), and the protective layers 250 may be formed by printing or pressing. The solder resist layer, wherein the solder resist layer formed by pressing, may be a solder resist dry film. The manufacturing method of the wiring board 200 of the present embodiment is similar to the manufacturing method of the wiring board 100 of the foregoing embodiment, and a method of manufacturing the wiring board 200 will be described below with reference to Figs. 4A to 4F. 4A to 4F are schematic cross-sectional views showing the manufacturing method of the circuit board of Fig. 3. Referring to FIG. 4A , regarding the manufacturing method of the circuit board 200 , first, a trench T2 is formed on the core substrate 210 , wherein the core substrate 210 may be a circuit substrate, and the trench T2 is formed in the core insulating layer 212 of the core substrate 210 . . The depth D2 of the trench T2 is smaller than the thickness L4 of the core substrate 210, but in other embodiments not shown, the depth D2 of the trench T2 may be substantially equal to the thickness L4 of the core substrate 210. That is, the trench T2 may It is 22 201108879 . It is formed through the core substrate 210. Further, the trench T2 may be formed using laser-ablative or milling. Referring to FIG. 4A, a plurality of baffles 24 are formed on the core substrate 21A, wherein the baffles 240 cover the trenches 2' and the baffles 240 cover the trenches 2 in a comprehensive manner and partially cover the core insulating layer 212. Additionally, the flap 240 can be a copper foil or a blank core layer. Referring to FIG. 4C and FIG. 4D, a second outer insulating layer 220 is formed on the opposite surfaces 210a, 210b of the core substrate 210 (as shown in FIG. 4D). The outer insulating layer 220 on the surface 210a covers the trench. T2 and the baffle 240 are such that the trench T2 forms a cavity C2. Next, a two-layered conductor layer 230' is formed on the outer insulating layer 220, wherein each of the outer layer insulating layers 220 is disposed between the core substrate 210 and one of the conductor layers 230. That is, these outer insulating layers 220 are located between the conductor layers 230'. Further, these conductor layers 230' may be metal layers, such as copper beryllium. There are various methods for forming the outer insulating layer 220 and the conductive layer 230', such as pressing the backing copper foil. In the embodiment, the method of forming the outer insulating layer 220 and the conductive layer 230' may be by using the adhesive layer 226. A plurality of substrates 300 are press-bonded onto the core substrate 210 (as shown in FIG. 4C), wherein the core substrate 210 is located between the substrates 300 when the bonding is performed. The substrate 300 may be a Copper Clad Laminate (CCL)' and each of the substrates 300 may include a dielectric layer 224 and a conductor layer 230'. wherein the conductor layer 230' is disposed on the dielectric layer 224, and each layer of the bonding layer 23 201108879 226 is bonded between one of the dielectric layers 224 and the core substrate 21A. The adhesive layer 226 can be a semi-cured film, and the pre-cured film can be a low flow film or a non-flow film. It is worth mentioning that in other embodiments not shown, when the conductor layer 230' and the outer insulating layer 220 are formed, the conductor layer 230 may be formed only by one layer, and the outer insulating layer 220 may be formed only by one layer. Therefore, the number of both the conductor layer 230' and the outer insulating layer 220 shown in Figs. 4c and 4D is for illustrative purposes only and does not limit the technical features of the present invention. In addition, it must be noted that, in other embodiments not shown, it is not necessary to form the baffle 240, that is, the outer insulating layer 22 and the conductor layer 230' may be formed without the baffle 240. . Therefore, the flap 240 shown in Fig. 3 and Figs. 4C to 4G is for illustrative purposes only and does not limit the technical features of the present invention. After referring to FIG. 4D and FIG. 4E', the conductor layers 230' are patterned to form a plurality of outer wiring layers 230, wherein the method of patterning the conductor layers 23 can be performed by using lithography and money engraving techniques. The engraving technique can be a wet etching technique. In particular, the method of forming the outer wiring layer 230 shown in FIG. 4C to FIG. 4B above is a subtractive method, but in other embodiments not shown, the method of forming the outer wiring layer 230 may be nowadays. The semi-additive method used in circuit board manufacturing technology. Further, these outer wiring layers 230 may be reduced by other squares than the subtractive method and the semi-additive method. In detail, in the method of the outer layer 24 201108879 layer 230, a four-cut pattern may be formed on the outer insulating layer 220, and the recessed! pattern may include a plurality of trenches, wherein the intaglio pattern may utilize laser ablation Or lithography and etching techniques to form. Next, a conductive material is formed in the intaglio pattern to form the outer layer wiring layers 230, wherein the outer wiring layers 230 are buried in the insulating layer 230. The conductive material can be formed by electroplating or electroless plating; alternatively, the conductive material can be copper "silver glue or conductive polymer material" and can be filled in the intaglio pattern. As such, the outer wiring layer 230 can also be formed. 々 δ 儿 ming is 'Although the above method of forming the outer layer wiring layer 230 by using the intaglio pattern is not shown in the drawings, but the knowledgeable person in the technical field of the present invention can according to the above content and the current basic line The board manufacturing technology clearly knows how to form the outer layer layer 230 by using the intaglio pattern. Therefore, although the pattern does not show the conductive material and the intaglio pattern, the above 4 is indeed sufficient to expose the pattern (4) to form The method of outer wiring layer 230. Referring to FIG. 4A and FIG. 4F, after forming the outer wiring layer 23, the core substrate 21 and the outer insulating layer 22 are cut to expose the cavity C2 and form the opening Η3, and form the communication with the cavity C2. The through hole 222 is in the outer insulating layer 220. At this point, the circuit board 2 has basically been manufactured. In addition, the method of cutting the core substrate 210 and the outer insulating layer 22 can include a v-cut or a sharp cut, and the through holes 222 can be non-electrical clock through holes, wherein the method of forming a non-electric material (4) can include a machine hole or a mine Drill holes. In addition, when the through holes 222 are formed, at least one through hole 25 201108879 • 242 may be formed on the blocking piece 240, and at least one communication hole 219 is formed in the core substrate 210. The through hole 242 and the communication hole 219 are both connected to the through hole 222. Between the cavity C2 and the cavity. Both the through hole 242 and the communication hole 219 may be formed in the same manner as the through hole 222, that is, the method of forming the through hole 242 and the communication hole 219 may include mechanical drilling or laser drilling. It is worth mentioning that before forming the through holes 222 and cutting the core substrate 210 and the outer insulating layer 220, two protective layers 250 covering the outer insulating layer 220 and the outer wiring layer 230 may be formed to protect the outer layers. Layer 230, while in other embodiments not shown, protective layer 250 may form only one layer. These protective layers 250 may be solder resist layers and formed, for example, by printing or press-fitting, wherein the solder resist layer formed by press-bonding may be solder-proof dry film. . Since the protective layer 250 is formed before the through holes 222 are formed, and before the core substrate 210 and the outer insulating layer 220 are cut, when the protective layer 250 is formed by printing, solder resist ink such as solder resist ink can be prevented from dripping. Inside the cavity C2, the cavity C2 is prevented from being damaged. Further, in the foregoing embodiment, the protective layer 250 is also applicable to the wiring board 100 of Fig. 1A, and the protective layer 250 may be formed on the outer insulating layer 120 before the through holes 122 are formed. In summary, since the through holes of the outer insulating layer can communicate with each other through the cavity, the outside air can flow in the through holes and the cavity, so that the fluid (such as air) in the through holes and the cavity. Forming a fluid sound path that can transmit sound. Therefore, the sound emitted by the electroacoustic transducer can be transmitted through the through hole and the cavity from any part of the outer surface of the insulating layer; or the electroacoustic exchange 26 201108879 - the energy can also receive sound from the through hole and the cavity . Secondly, the circuit board of the present invention can simultaneously mount the treble la 9 and the bass bar eight, while the treble bar 9\ and the bass bar. The sounds emitted by the two can be emitted from the through holes and the cavity to produce an audible effect of the surround sound, thereby providing a better hearing enjoyment for the user. While the present invention has been described above in the foregoing embodiments, it is not intended to limit the invention, and the equivalents of the modifications and retouchings are still in the present invention without departing from the spirit and scope of the invention. Specialized within the scope of protection. BRIEF DESCRIPTION OF THE DRAWINGS FIG. 1A is a schematic cross-sectional view showing a circuit board according to an embodiment of the present invention. FIG. 1B depicts a top view of the circuit board of FIG. 1A. FIG. 1C is a schematic top view of a circuit board according to another embodiment of the present invention. 2A to 2E are schematic cross-sectional views showing the manufacturing method of the circuit board of FIG. 1A. 3 is a cross-sectional view showing a circuit board according to another embodiment of the present invention. 4A to 4F are schematic cross-sectional views showing a method of manufacturing the wiring board of Fig. 3.
27 20110887927 201108879
【主要元件符號說明】 10 電聲換能器 12 換能面 14 遮罩 100 、 200 線路板 102 、 202 外表面 110 、 210 核心基板 110a、110b、210a、210b 表面 120 、 220 外層絕緣層 122 、 122, 、 222 貫孔 122a 、 122a’ 洞口 130 > 230 外層線路層 130, 、 230， 導體層 212 核心絕緣層 214 第一線路層 216 第二線路層 218 導電連接結構 219 連通孔 224 介電層 226 黏合層 240 擋片 242 穿孔 250 保護層 28 201108879 300 基板 Cl、C2 空腔 D1、D2 深度 HI、HI’、H2、H3 開口 LI、L3 高度 L2、L4 厚度 PI ' P2 流體傳聲路徑 R1、R2 孔徑 SI、S4 上表面 S2、S5 下表面 S3、S6 側表面 ΤΙ、T2 溝槽 W 寬度 W1、W2 腔壁 29[Main component symbol description] 10 electroacoustic transducer 12 transducing surface 14 mask 100, 200 circuit board 102, 202 outer surface 110, 210 core substrate 110a, 110b, 210a, 210b surface 120, 220 outer insulating layer 122, 122 , 222 through hole 122a, 122a' hole 130 > 230 outer circuit layer 130, 230, conductor layer 212 core insulating layer 214 first circuit layer 216 second circuit layer 218 conductive connection structure 219 communication hole 224 dielectric layer 226 Adhesive layer 240 baffle 242 perforation 250 protective layer 28 201108879 300 substrate Cl, C2 cavity D1, D2 depth HI, HI', H2, H3 opening LI, L3 height L2, L4 thickness PI ' P2 fluid sound path R1, R2 Apertures SI, S4 Upper surface S2, S5 Lower surface S3, S6 Side surface ΤΙ, T2 Groove W Width W1, W2 Cavity wall 29