201108263 六、發明說明： 【發明所屬之技術領域】 [ίχκη] 本發明係有關於一種海底電纜、半導電性防水充填 組成物及其製造方法，特別是指利用矽油、鈦白粉及導 電性碳黑依-定之重量百分比’混合而成—具有耐熱性 、防水性、不會殘留水氣及避免銅線變黑之半導電性防 水充填組成物及海底電續^ 【先前技術】 [0002] 目前一般對於離島之供電，通常需要藉由海底電纜 > 崎傳輸，由於海底電境深埋海中’故必需具有極佳的 防水性，才能使電力之供輪穩定。； 但由於電纜線之製造通常係橡趣數條鋼線互相絞接 而成一纜芯，再於縵芯之周緣以三童一次押出方式，將 内半導電層、絕緣層及外半導電層包覆於纜芯的外緣， 藉以達到防止半導電層吸濕，並能免除押出過程中雜質 附著，絕緣層與内、外半導電層間之密著良好無氣孔發 > 生。但是由於纜芯在絞接的過程中，而銅線之間雖經纏 繞絞接仍然會留存有間隙，並蓄積空氣於其中，所以在 進仃二重一次押出成型的過程中，會產生15〇<>(：以上的高 溫，而使各銅線之間的空氣因受熱而轉變成水氣，而留 存於電纜内部，日後將會將成銅線氧化鏽蝕，使其導電 性變差，並因阻抗過大而發熱，以致於短路發生危險， 同時各個銅線也會因受到150X：以上的高溫影響，而使其 表面顏色變深或變黑，以致於影響到傳輸的品質。 因此，為改善上述缺點，則會在電纜填料中採用防 水成份配方，其中以橡膠充當膠凝劑使用，目的在於長 098127793 表單編號 Α0101 第 3 頁/共 15 頁 0982047672-0 201108263 時間錯存期間及不同溫度狀況下，能使結晶結構產生穩 定作用；又可充當防溼層使用具有極佳特性，以避免污 染物質滲入，並能防止電纜因作業當中機械力所產生的 斷裂，同時，由於其黏性適當，能在押（射）出、填充電 缓空隙並賦與適合支撐電線之產品特性。 其中，如中華民國93年5月21日所公告之發明第 588382號「電纜填料成份」專利案，其係揭露包括一種 礦物油及-種放射性氫化笨乙稀_τ二稀塊共聚物之合成 橡膠，其成份之比例為：（a)礦物油從7〇%至9〇% ; (b)放 射性氫化苯乙烯-丁二烯塊共聚物之合成橡膠從2%至15% 又如中華民國9 4年1 〇月21日所公告之發明第 1242028號「電欖凝膠」專利案，其係揭露在於除了聚丙 二醇和聚醇之外，它們尚含有b15重量％之已用㈣油 使之成為疏水性的經壓縮烟矽石〔fumed siUca〕，藉 以能顯著縮短產製電纜凝膠所需之時間，同時觸變的電 纜凝膠的流變性及與應用有關之性質仍保持一樣好。當 產製電纜凝膠時此種時間上之節省使成本能減低。 另如中華民國96年4月1日所公開之發明第 200713336號「以聚丙烯為主之導線及電纜絕緣體或封 套」專利案，其係揭露一種導電裝置的絕緣塗層或封套 可以包括結合有一種或多種添加劑的聚合物摻合物。典 型地，聚合物摻合物包括至少約3〇wt%的絕緣塗層或封套 ，較佳地是至少約4〇wt%的絕緣塗層或封套，更佳地是約 50wt%的絕緣塗層或封套。其中典型的添加劑包括的物質 098127793 像填料、顏料、交聯劑、加工助劑、金屬減活劑、增量201108263 VI. Description of the invention: [Technical field to which the invention pertains] The present invention relates to a submarine cable, a semiconductive waterproof filling composition and a method of manufacturing the same, and in particular to the use of eucalyptus oil, titanium dioxide and conductive carbon black According to the weight percentage of the fixed-mixed--heat-resistant, water-repellent, semi-conductive waterproof filling composition that does not leave moisture and avoid blackening of copper wire and submarine electricity continued [Prior Art] [0002] For the power supply to the island, it is usually necessary to use the submarine cable > Saki transmission, because the submarine electricity is buried deep in the sea, so it is necessary to have excellent water resistance, so that the supply wheel of electricity can be stabilized. However, since the cable is usually manufactured by twisting a plurality of steel wires into a cable core, and then the inner semi-conductive layer, the insulating layer and the outer semi-conductive layer are wrapped by the three-child extrusion method on the periphery of the core. Covering the outer edge of the cable core, thereby preventing the semi-conductive layer from absorbing moisture, and avoiding the adhesion of impurities during the extrusion process, and the adhesion between the insulating layer and the inner and outer semi-conductive layers is good and the pore-free hair is generated. However, since the cable core is in the process of splicing, the copper wire still has a gap between the copper wire and the air is accumulated therein, so 15 〇 will be generated during the double extrusion molding process. <>(: The above high temperature causes the air between the copper wires to be converted into moisture due to heat, and remains inside the cable, and the copper wire will be oxidized and rusted in the future, resulting in poor conductivity. And the heat is too large due to the impedance, so that the short circuit is dangerous, and the copper wire is also affected by the high temperature of 150X: or higher, so that the surface color becomes darker or darker, which affects the quality of the transmission. To improve the above shortcomings, a waterproof component formulation is used in the cable packing, in which rubber is used as a gelling agent for the purpose of length 098127793 Form No. 1010101 Page 3 of 15 0982047672-0 201108263 Time lapse period and different temperature conditions The crystal structure can be stabilized; it can also serve as a moisture-proof layer with excellent properties to prevent infiltration of contaminants and prevent the cable from being in operation. The fracture caused by the force, at the same time, due to its proper viscosity, can be used to shoot (fill), fill the electric slow space and give the product characteristics suitable for supporting the wire. Among them, the invention announced on May 21, 1993, the Republic of China. No. 588382 "Cable Filling Ingredients" patent, which discloses a synthetic rubber comprising a mineral oil and a radioactive hydrogenated stupid ethylene-thumbth dilute block copolymer, the proportion of which is: (a) mineral oil from 7 〇% to 9〇%; (b) Synthetic rubber of radioactive hydrogenated styrene-butadiene block copolymer from 2% to 15% and as in the invention of the Republic of China on September 21, 2001, No. 1242028 In the case of the Polyethylene Gel, the patent discloses that in addition to polypropylene glycol and polyalcohol, they still contain b15% by weight of fumed siUca which has been made hydrophobic by using (iv) oil. Significantly reduce the time required to produce cable gels, while the thixotropic cable gel rheology and application-related properties remain as good. This time savings when producing cable gels reduces costs. Another example is the Republic of China on April 1, 1996. Patent Publication No. 200713336, "Polypropylene-Based Wire and Cable Insulators or Enclosures", discloses that an insulating coating or envelope of a conductive device may comprise a polymer blend incorporating one or more additives. Typically, the polymer blend comprises at least about 3% by weight of an insulating coating or envelope, preferably at least about 4% by weight of an insulating coating or envelope, more preferably about 50% by weight of an insulating coating. Or envelopes. Typical additives include substances 098127793 like fillers, pigments, crosslinkers, processing aids, metal deactivators, increments
表單編號_1 ^ 4 I/* 15 I 0982047672-0 201108263 ο 油、抗氧化劑、穩定劑、潤滑劑、阻燃劑等等。當使用 填料時’絕緣體或封套較佳地包括從大於〇至約7〇wt%的 至少一種填料’更佳地是約從10討％至約70^%的至少一 種填料’更佳地從約2〇wt%至70wt%的至少一種填料。代 表性的填料包括碳黑、二氧化矽（例如，玻璃珠）、滑石 、碳酸#5、黏土、氟碳化物、矽氧烧等等。適當的增量 油包括（或塑化劑）包括芳香油、環烧烴油、石蠛油或氫 化（白）油和這些物質中兩種或更多的混合物。如果增量 油被加入絕緣體或封套組成中，那麼典型地加入標準是 每一百重量份中加入從約〇. 5至約25重量份，較佳地是每 一百份重量份中加入從約5至約15份重量份。 上述該等專利案雖然揭露有電親之填料、凝膠、絕 緣體或封套等技術特徵，但莫均無法有效克服銅線之間 殘留水氣及顏色變深或變黑之缺點，故在使用上仍未盡 理想。 [0003] Ο 【發明内容】 有鑑於習知的海底電纜具有上述之缺點，故本發明 提供一種海底電纜之半導電性防水充填組成物，其係由 22至25wt%〔重量百分比〕之粉體與75至78 wt%之矽油 〔CH3[(CH3)]2SiO〕nSi(CH3)3〕組合而成一膠狀組成 物，其中粉體則由91 wt%之鈦白粉〔二氧化鈦（丁丨〇2 )〕 與9wt%的導電性碳黑〔（c)n〕混合而成。 2 上述半導電性防水充填組成物之黏度值為48±10cps 〇 098127793 上述半導電性防水充填組成物之絕緣電阻係為1χ1〇8 Ω-cm以下。 表單編號删1 第5頁/共15頁 0982047672- 201108263 上述半導電性防水充填組成物之耐熱溫度為15 0 °C以 上。 本發明亦為一種具有上述半導電性防水充填組成物 的海底電纜製造方法，其係將該半導電性防水充填組成 物利用淋膜方式成型被覆於銅線之外緣，再將至少二條 以上之銅線互相絞接，使該半導電性防水充填組成物充 滿於每一條銅線之間的空隙，再以刮除器刮除該等銅線 外緣過多之半導電性防水充填組成物，然後以押出成型 方式將内半導電層、絕緣層及外半導電層，依序包覆於 該等銅線的外緣。 本發明亦為一種上述半導電性防水充填組成物的海 底電纜，係於互相絞接之銅線外緣依序分別形成有内半 導電層、絕緣層及外半導電層；其特徵係在於：每一條 銅線之間的空隙，及該等銅線與内半導電層之間均充滿 有半導電性防水充填組成物。 本發明亦為一種海底電纔之半導電性防水充填組成 物的製造方法，係包含有下列步驟：A.係將91wt%之鈦白 粉〔二氧化鈦（Ti〇2)〕與9wt°/«的導電性碳黑予以混合 攪拌均勻；B.將混合後之粉體利用濾網進行筛選，並將 大於濾網篩孔網目之粉體顆粒予以研磨；C.然後將篩選 研磨過後22至25wt%之粉體與75至78 wt%之矽油共同混 合；D.將其攪拌後形成一膠狀之半導電性防水充填組成 物。 上述步驟B中篩網之篩孔係為6 0網目。 上述步驟D中之攪拌時間為30至45分鐘。 本發明具有下列之優點： 098127793 表單編號A0101 第6頁/共15頁 0982047672-0 201108263 1. 本發明係利用半導電性防水充填組成物，可以充 滿於每一條相互絞接銅線之間的空隙，可使内半導電層 、絕緣層及外半導電層與銅線間之密著性良好，無任何 氣孔產生，不會因殘留有空氣而變成水氣，故能防止銅 線因鏽钱而阻抗過大，而發熱造成短路發生危險者。 2. 本發明利用該半導電性防水充填組成物之耐熱性 ，可以於150°C高溫下，使該等銅線之顏色不會變深或變 黑，以避免銅線產生質變者。 3. 本發明利用半導電性防充填組成物之被覆，可以 〇 免除押出過程中造成雜質附著，而影響到導電性。 4. 本發明並利用半導電性防水充填組成物之阻隔作 用，可以確保海水不會滲入到海底電纜内部，以達到完 全防水之功效，可以延長海底電纜之使用壽命。 【實施方式】 [0004] 本發明係為一種海底電纜之防水充填組成物，其係 由22至25wt%〔重量百分tb〕之粉體與75至78 wt%之石夕 油〔CHQ[(CHq)]2SiO〕nSi(CHq)Q〕組合而成一膠狀組 Ο Ο 0 0 。 成物，其中粉體則由91wt%之鈦白粉〔二氧化鈦（Ti〇2) 〕與9\^%具導電性的碳黑〔（C)n〕混合而成。 上述半導電性防水充填組成物係不含有任何水份， 且黏度值〔轉速：50rpm〕為48±10cps，並具有半導電 性質，其絕緣電阻係為1χ108Ω-cm以下，而耐熱溫度可 達150°C以上。 本發明係為一種海底電纜之半導電性防水充填組成 物的製造方法，如第一圖所示，包含有下列步驟： A.混合粉體：係將91 wt°/。之鈦白粉〔二氧化鈦（ 098127793 表單編號A0101 第7頁/共15頁 0982047672-0 201108263 2)〕與9wt%的導電性碳黑予以混合攪拌均勻。 B.篩選研磨：係將上述混合後之粉體置入於研磨機 中利用一具有6 0網目篩孔的渡網進行筛選，再將大於 濾網篩孔的粉體顆粒利用研磨機予以研磨，使其粒徑可 小於6 0網目。 c.加入矽油：然後將筛選及研磨過後22至25討％之 粉體加入75至78 wt%之矽油，再共同置入於攪拌器内。 D.混合攪拌：將已加入矽油之粉體予以充分混合攪 拌，經攪拌30至45分鐘後，則可形成一灰色膠狀之半導 電性防水充填組成物。 本發明係為一種海底電纜及其製造方法，如第二圖 所不，其係將矽油、麫白粉及導電性碳黑依照重量百分 比〔wt%〕為77 : 20 : 2之比例，予以攪拌混合而成一半 導電性防水充填組成物（1)，再將該半導電性防水充填組 成物（1)，利用淋膜方式成型被覆於銅線（2)之外緣，其 淋膜之方式如第三圖所示，係將半導電性防水充填組成 物（1)由上往下形成一水幕狀態，再將該銅線（2)使其通 過該等半導電性防水充填組成物（1)，如此，則可於該等 銅線（2)之外緣被覆有一層半導電性防水充填組成物 ，然後將至少二條以上之銅線（2)互相絞接而成一纜芯後 ，可使該半導電性防水充填組成物（丨）充滿於每一條銅線 (2)之間的空隙，最後再以刮除器（3)包覆於該等銅線 (2)之外緣，予以到除該等銅線（2)外緣過多之半導電性 防水充填組成物（1)，然後再以三重一次押出成型方式， 將内半導電層（4)、絕緣層（5)及外半導電層（6)依序包 覆於該等銅線（2)的外緣，藉以構成一海底電纜者。 0982047672-0 098127793 表單編號A0101 第8頁/共15頁 201108263 如果係製造直牷較粗的海底電纜時，則需要絞接多 條以上之纜芯，其係可再重覆上述步驟，將上述每一條 已製造完成之纜芯，再利用淋膜方式於其外緣被覆有半 導電性防水充填組成物（丨），然後將多條纜芯予以絞接後 ’再經刮除及押出成型等步驟，而製成一具有同等功效 且直徑較粗之海底電纜。 如此，利用該防水充填組成物（1)之耐熱性，即使於 150 C同溫下，仍使該等鋼線（2)之顏色不會變深或變黑 ’而可由於半導電性防水充填組成物⑴係已填滿了每一 條銅線（2)之間的空隙，使内半導電層（4)、絕緣層（5) 及外半導電層（6)與銅線（2)間之密著性良好，而無任何 氣孔產生’故不會因殘留有空氣而變成水氣的狀況發生 ’以避免銅線（2)因職而阻抗過大，造成短路而發生危 險’並利用半導電性防水充填組成物（1)之阻隔作用，也 可確保海水不會渗人到海底魏内部，達到完全防水， 並能免除押出過程中雜質附著。 【圖式簡單說明】 剛 第—圖係、為本發明海底㈣之半導電性防水充填組 成物之製造步驟流程圖。 第二圖係為本發明所製成之海底電規剖視圖。 第三圖係為本發明於鋼線外緣被覆半導電性防水充 填組成物後進行絞接及到除多餘防水充填組成物之簡單 示意圖。 【主要元件符號說明】 [0006] (1)半導電性防水充填組成物 098127793 表單編號A0101 第9頁/共15頁 0982047672-0 201108263 刮除器 (2 ) 銅線 (3) 刮除器 (4 ) 内半導電層 (5) 絕緣層 (6 ) 外半導電層 098127793 表單編號A0101 第10頁/共15頁 0982047672-0Form number_1 ^ 4 I/* 15 I 0982047672-0 201108263 ο Oil, antioxidants, stabilizers, lubricants, flame retardants, etc. When the filler is used, the 'insulator or envelope preferably comprises from at least one 〇 to about 7 〇 wt% of at least one filler', more preferably from about 10% to about 70% by weight of at least one filler' more preferably from about 2% by weight to 70% by weight of at least one filler. Representative fillers include carbon black, cerium oxide (e.g., glass beads), talc, carbonic acid #5, clay, fluorocarbon, oxime, and the like. Suitable extender oils include (or plasticizers) including aromatic oils, cyclic hydrocarbon oils, sphagnum oils or hydrogenated (white) oils and mixtures of two or more of these. If the extender oil is added to the insulator or envelope composition, then typically the standard is added from about 0.5 to about 25 parts by weight, preferably from about 100 parts by weight, preferably from about 100 parts by weight. 5 to about 15 parts by weight. Although the above-mentioned patent cases disclose technical features such as electric fillers, gels, insulators or envelopes, Mo can't effectively overcome the disadvantages of residual moisture and darkening or blackening between copper wires, so it is used. Still not ideal. [0003] In view of the above-mentioned submarine cable having the above-mentioned disadvantages, the present invention provides a semiconductive waterproof filling composition for a submarine cable, which is composed of 22 to 25 wt% (by weight) of powder. Combined with 75 to 78 wt% of eucalyptus oil [CH3[(CH3)]2SiO]nSi(CH3)3] to form a gelatinous composition, wherein the powder is composed of 91 wt% of titanium dioxide [titanium dioxide (Bings 2) ] It is mixed with 9wt% of conductive carbon black [(c)n]. 2 The viscosity of the semiconductive waterproof filling composition is 48 ± 10 cps 〇 098127793 The insulating resistance of the semiconductive waterproof filling composition is 1 χ 1 〇 8 Ω-cm or less. Form number deletion 1 Page 5 of 15 0982047672- 201108263 The above semiconductive waterproof filling composition has a heat resistance temperature of 150 ° C or more. The present invention also provides a method for manufacturing a submarine cable having the semiconductive waterproof filling composition, wherein the semiconductive waterproof filling composition is formed by coating by a lamination method to cover the outer edge of the copper wire, and then at least two or more The copper wires are spliced to each other such that the semi-conductive waterproof filling composition fills the gap between each copper wire, and then the scraper is used to scrape off the semi-conductive waterproof filling composition of the outer edge of the copper wires, and then The inner semiconductive layer, the insulating layer and the outer semiconductive layer are sequentially coated on the outer edge of the copper wires by extrusion molding. The present invention is also a submarine cable for the above-mentioned semi-conductive waterproof filling composition, which is formed with an inner semi-conductive layer, an insulating layer and an outer semi-conductive layer, respectively, on the outer edges of the mutually spliced copper wires; A gap between each of the copper wires, and between the copper wires and the inner semiconductive layer, is filled with a semiconductive waterproof filling composition. The invention also relates to a method for manufacturing a semi-conductive waterproof filling composition for a submarine electric power, comprising the following steps: A. conducting 91 wt% of titanium dioxide (titanium dioxide (Ti〇2)) and 9 wt/« conductivity The carbon black is mixed and stirred uniformly; B. The mixed powder is screened by a sieve, and the powder particles larger than the mesh of the sieve mesh are ground; C. Then 22 to 25 wt% of the sieve after grinding The powder is mixed with 75 to 78 wt% of eucalyptus oil; D. is stirred to form a gelatinous semiconductive waterproof filling composition. In the above step B, the mesh of the screen is 60 mesh. The stirring time in the above step D is 30 to 45 minutes. The present invention has the following advantages: 098127793 Form No. A0101 Page 6 of 15 0982047672-0 201108263 1. The present invention utilizes a semi-conductive waterproof filling composition that can fill the gap between each of the mutually twisted copper wires. The adhesion between the inner semi-conductive layer, the insulating layer and the outer semi-conductive layer and the copper wire is good, no pores are generated, and no moisture is left due to residual air, so that the copper wire can be prevented from being rusted. The impedance is too large, and the heat causes the short circuit to be dangerous. 2. The present invention utilizes the heat resistance of the semiconductive waterproof filling composition, so that the color of the copper wires does not become dark or black at a high temperature of 150 ° C to avoid the occurrence of qualitative changes in the copper wires. 3. The present invention utilizes the coating of the semi-conductive anti-filling composition to eliminate the adhesion of impurities during the extrusion process and affect the conductivity. 4. The present invention utilizes the barrier function of the semi-conductive waterproof filling composition to ensure that seawater does not penetrate into the submarine cable to achieve full waterproofing effect and prolong the service life of the submarine cable. [Embodiment] The present invention relates to a waterproof filling composition for a submarine cable, which is composed of 22 to 25 wt% (weight percent tb) of powder and 75 to 78 wt% of Shixia oil [CHQ[( CHq)]2SiO]nSi(CHq)Q] is combined to form a gel group Ο 0 0 0 . The product, wherein the powder is composed of 91 wt% of titanium dioxide (titanium dioxide (Ti〇2)) and 9% by weight of conductive carbon black [(C)n]. The semiconductive waterproof filling composition does not contain any moisture, and has a viscosity value (rotation speed: 50 rpm) of 48 ± 10 cps, and has semiconducting properties, and the insulation resistance is 1 χ 108 Ω-cm or less, and the heat resistant temperature is 150. Above °C. The present invention is a method for producing a semiconductive waterproof filling composition for a submarine cable, as shown in the first figure, comprising the following steps: A. Mixed powder: 91 wt ° /. Titanium dioxide (TiO 2 (098127793 Form No. A0101, page 7 / page 15 0982047672-0 201108263 2)] is mixed with 9 wt% of conductive carbon black and uniformly stirred. B. Screening and grinding: the above-mentioned mixed powder is placed in a grinder and sieved by a network having a mesh opening of 60 mesh, and then the powder particles larger than the sieve mesh are ground by a grinder. , the particle size can be less than 60 mesh. c. Add oyster sauce: Then add 22 to 78 wt% of eucalyptus oil after screening and grinding, and put it into the blender. D. Mixing and stirring: The powder which has been added to the eucalyptus oil is thoroughly mixed and stirred, and after stirring for 30 to 45 minutes, a gray gel-like semiconductive waterproof filling composition can be formed. The invention relates to a submarine cable and a manufacturing method thereof. As shown in the second figure, the eucalyptus oil, chalk powder and conductive carbon black are stirred and mixed according to the weight percentage [wt%] of 77:20:2. The semi-conductive waterproof filling composition (1) is formed, and the semi-conductive waterproof filling composition (1) is formed by coating on the outer edge of the copper wire (2) by a lamination method, and the method of laminating is as follows. As shown in the three figures, the semi-conductive waterproof filling composition (1) is formed into a water curtain state from top to bottom, and the copper wire (2) is passed through the semi-conductive waterproof filling composition (1). In this way, a semi-conductive waterproof filling composition may be coated on the outer edge of the copper wire (2), and then at least two copper wires (2) are spliced to each other to form a core. The semi-conductive waterproof filling composition (丨) is filled in the gap between each copper wire (2), and finally covered by the scraper (3) on the outer edge of the copper wire (2), to be removed The copper wire (2) has a semi-conductive waterproof filling composition (1) with too many outer edges, and then three times In the molding method, the inner semi-conductive layer (4), the insulating layer (5) and the outer semi-conductive layer (6) are sequentially coated on the outer edges of the copper wires (2) to form a submarine cable. 0982047672-0 098127793 Form No. A0101 Page 8 of 15 201108263 If you are manufacturing a submarine cable with a thick straight line, you need to splicing more than one cable core, which can repeat the above steps. A finished cable core is coated with a semi-conductive waterproof filling composition (丨) on the outer edge thereof by lamination, and then the plurality of cores are spliced, and then scraped and extruded. And make a submarine cable with the same effect and a relatively large diameter. Thus, the heat resistance of the waterproof filling composition (1) is such that the color of the steel wires (2) does not become dark or black even at the same temperature of 150 C, and the semiconductive waterproof filling can be used. The composition (1) has filled the gap between each copper wire (2) to make the inner semiconductive layer (4), the insulating layer (5) and the outer semiconductive layer (6) and the copper wire (2) Good adhesion, without any pores, so it will not become a condition of moisture due to residual air. 'To avoid the copper wire (2) due to excessive resistance, causing a short circuit and causing danger' and using semi-conductivity The barrier function of the waterproof filling composition (1) also ensures that the seawater does not infiltrate into the interior of the seabed, achieves complete waterproofing, and can avoid the adhesion of impurities during the extrusion process. BRIEF DESCRIPTION OF THE DRAWINGS Fig. 1 is a flow chart showing the manufacturing steps of the semiconductive waterproof filling composition of the seabed (four) of the present invention. The second figure is a cross-sectional view of the subsea electrical gauge made by the present invention. The third figure is a simplified schematic diagram of the present invention in which the semi-conductive waterproof filling composition is coated on the outer edge of the steel wire and then spliced and removed to the excess waterproof filling composition. [Main component symbol description] [0006] (1) Semi-conductive waterproof filling composition 098127793 Form No. A0101 Page 9 of 15 0982047672-0 201108263 Scraper (2) Copper wire (3) Scraper (4 Inner semiconducting layer (5) Insulating layer (6) Outer semiconducting layer 098127793 Form No. A0101 Page 10 of 15 0982047672-0