201102930 六、發明說明： 【發明所屬之技術領域】 [0001] 本發明係有關於一種金屬箔無線射頻辨識標籤之製 程及其成形機，尤指一種利用簡便之設備設計，以降低 製造成本，並於製程中達到環保等實質效益。 [先前技術] [0002] 按，射頻識別〔尺卩11)，尺3(11〇?犷6〇11611。7 1〇611- t i f i cat i on〕技術，是一種通信技術，可通過無線電訊· 號識別特定目標並讀寫相關數據，而無需識別系統與特 定目標之間建立機械或光學接觸。 射頻識別標籤〔RFID Tag〕則是目前射頻識別技術 的關鍵，可存儲一定容量的信息，並具一定的信息處理 功能，讀寫設備可通過無線電訊號以一定的數據傳輸率 與標籤交換信息，而現今射頻識別標籤〔RFID Tag〕製 程可分為三大階段，係依序為天線製造、晶片〔1C〕焊 接及壓合，其製造技術說明如下： A、天線製造： 1.蚀刻法〔Etching〕： 使用銅箔薄膜覆蓋於聚對苯二甲酸乙二酯〔PET〕 當作天線底材，其中銅箔薄膜厚度約18微米〔uin〕〜35 微米〔um〕，聚對苯二甲酸乙二酯〔PET〕厚度約25微米 〔um〕〜50微米〔um〕，然後，利用網版印刷將财酸油 墨印出天線圖樣於底材正面，再經酸洗蝕刻、耐酸油墨 剝離、消泡處理、抗氧化、水洗等製程，將射頻識別〔 RFID〕天線製造出來。這種方法的優點是製造良率較高 、天線性能優異且穩定；而缺點是製程繁瑣、產出較差 098123939 表單編號 A0101 第 4 頁/共 20 頁 0982040802-0 201102930 ，且大部分銅箔薄膜均被蝕刻剝離而浪費掉，所以成本 昂貴。一般來說，成本是網印法的2〜3倍，成本結構無 法符合物流供應鏈應用之要求。 2. 網印法〔Printing〕： 利用網版印刷將導電銀膠〔Conduct iveSi lver Ink〕直接印出天線圖樣於聚對苯二甲酸乙二酯〔PET〕 底材上，再經烘烤，即可完成天線製造，這種方法的優 點只有一個，就是產出最大，成本最低；但是缺點實在 多的令人望而卻步，首先導電銀膠導電度僅為銅的1/10 ，甚至更小，由於導體電阻會隨著頻率增加而增加，因 此導體中央的電流密度會減少，而導電邊緣的電流密度 會逐步增加，此即為肌膚效應〔Skin Effect〕，它造 成天線輻射效率、指向性及增益均大大受影響，第二、 導電銀膠中銀的成份必須大於80%以上，才能導電，當 經烘烤製程後，隨著溶劑揮發，銀的覆著度降低，天線 導線若經彎曲，銀導線會很容易剝落，第三、若為了增 加導電度而增加導電銀膠厚度，則烘烤時間會成指數曲 線上升，而唯一方法是升高溫度，但是會破壞聚對苯二 甲酸乙二酯〔PET〕底材。 3. 電鑛法〔Plating〕： 利用網版印刷將電鍍油墨〔P1 a t i ng I nk〕直接 印出天線圖樣於聚對苯二甲酸乙二酯〔PET〕底材上，再 經電鍍水槽以氧化還原法，電鍍出銅材質的天線，這種 方法的優點是產出大、可靠性高、製程技術普遍而易懂 ;而缺點是小量生產成本會很昂貴，必須極大量生產才 會划算，天線圖樣不能小於50毫米〔mm〕，故不適合微 098123939 表單編號A0101 第5頁/共20頁 0982040802-0 201102930 型化天線。 β、晶片〔I c〕焊接： 當天線製造完成之後，就必須執行天線與晶片〔 1C〕的焊接工作，射頻識別積體電路〔rfid IC〕的焊 接工作，基本上是延循半導體產業之焊接技術，機械移 位精密度必須小於20微米〔um〕以内，才能完成焊接工 作’其一般方法如下說明： 1. 覆晶穿刺法： 將晶片〔1C〕舉起’然後翻轉180。後，將晶片〔 Ic〕二端接腳穿刺於天線導線接點上，但在將晶片〔Ic 〕舉起前，天線導線接點上必須微注入非導電顆粒骐〔 NCP ’ None Conductive Paste〕接著劑，這種方法的 優點是成本低，但缺點是製造良率較差，原因是非導電 顆粒膜〔NCP〕本身不俱導紐，㈣力道參數成為最重 要之關鍵因素，穿刺力道過低，接點可能無接觸而不導 通，穿刺力道過高，可能直接刺穿過聚對丨束二甲酸乙二 酯〔PET〕底材。 2. 覆晶黏著法：： 將晶片〔IC〕端接腳與天線導接點以異嚮導電膠 〔ACP，Anisotropic Conductive Paste〕' 異方性 導電膜〔ACF，Anisotropic Conductive Film〕接著 劑黏接，這種方法的優點是製造良率較高，標籤性能優 異且穩疋，但缺點是成本昂貴，因為異嚮導電膠〔Acp〕 、異方性導電膜〔ACF〕本身是銀膠，銀是屬於貴重金屬 〇 3. 超接波振動法： 098123939 表單編號A0101 第6頁/共20頁 0982040802胃0 201102930 將晶片〔1C〕二端接腳與天線導線接點對準接觸 後’以超音波振動法使接點溫度升高，來達成焊接的目 的；最後再直接注入接著劑，將晶片〔IC〕與天線導線 接處固定起來，此方法成本昂貴，故甚少使用於射頻識 別標籤〔RFID Tag〕製造上’但在半導體產業上卻屬於 常見。 C.签合〔Lamination〕： 當天線製造完成之後，就必須執行壓合步驟，以 完成最後的射頻識別標籤〔RFID Tag〕成品，這政成〇 巧·依使用者不同需求，而有不同製造方法，所使用的製 造設備也會芩全不同，基本上，有自黏性射頻識別標籤 〔RFID Tag〕標籤、有三層壓合〔上標+天線+下標〕軟 卡式標籤及有五層壓合硬卡式橾藏。 今，本發明人有鑑於現有射頻識別標籤〔RFID Tag 〕製造上普遍使用網印法及電鍍蝕刻法等須高價設備進 行製作，有成本南，以及電鍍液易造成污染環境等缺失 ，乃藉其多年於相關領域的製造及設計經驗和知識的輔 佐，並經多方巧思，針對該射頻識別標籤〔RFID Tag〕 製程做更新的研發改良，以期發揮其更高的實用效益性 〇 [發明内容】 [〇〇〇3] 本發明係有關於—種金屬箔無線射頻辨識標籤之製 程及其成形機’其主要實施目的係為了降低製造成本， 益於製程中達到環保等實質效益。 於是’為了達到上述目的，本發明人乃研擬如下金 屬箱無線射頻辨識標籤成形機，係包含： 098123939 表單編號 A0101 第 7 頁/共 2〇 頁 0982040802-0 201102930 一入料裝置，係設有入料滾筒； 一壓模裝置，乃接續設於入料襞置之後’係包含一 昇降動力源以及一與昇降動力源相組接之模板，並於該 模板底部設有無線射頻辨識標籤預成形之圖形. 一除料裝置，乃接續設於壓模裝置之後，係設有正 料捲收組及廢料捲收組’並使該正料捲收組與廢料捲收 組各設有捲收輪與X作輪，且使該正料捲收組及廢料捲 收組之工作輪相接觸，再於該正料捲收組之捲收輪、工 作輪上捲繞有黏著帶； -點膠裝置，係接續設於除料裝置之後，乃包含有 昇降動力源’並於該昇降動相、上組設有點膠單元； -覆晶裝置，乃接續設於點膠裝£之後，係設有一 移位動力源’錢與該移位動力源相組接之晶片取放單 元。 據此’係將金職由人卿m傳送至壓模 裝置’而後由壓模裝置之模板向下壓出無線射頻辨識標 籤圖元，續之，將，無線射頻辨喻籤圖元之金屬箱 傳送至除料裝置進行與無線射頻_減圖元的分離， 接著將分㈣無線㈣辨識標_元輸送至师裝置於 預設晶片處點膠，復使已點膠之無線射頻辨識標籤圖元 傳送到覆晶裝置黏上晶片’以完成無線射頻辨識標戴。 【實施方式】 [0004] 而為令本發明之技術手段、μ目的及達成功效能 夠有更完整且清楚的揭露1詳細說明如τ，並請_併 參閱所附之圖式及圖號。 098123939 首先，請參閱第一圖所示 表單編號Α0101 第8頁/共2〇頁 本發明之金屬箔無線射 0982040802-0 201102930 頻辨識標藏之製程及其成形機，該金屬羯無線射頻辨識 標籤成形機係由入料裝置（i)、壓模裝置（2)、除 料裝置（3)、點膠裳置、覆晶裝置及傳 送裝置（6)所組成；其中： 該入料裝置（1)，係設有入料滚筒，以供金屬箔 〔為銘落〕捲繞其上；201102930 VI. Description of the Invention: [Technical Field of the Invention] [0001] The present invention relates to a process for forming a metal foil radio frequency identification tag and a molding machine thereof, and more particularly to a device design that is easy to use, thereby reducing manufacturing costs, and In the process of achieving environmental benefits such as environmental protection. [Prior Art] [0002] Press, radio frequency identification (footprint 11), ruler 3 (11〇?犷6〇11611.7 1〇611-tifi cat i on) technology, is a communication technology, can be through radio Identify specific targets and read and write related data without identifying mechanical or optical contact between the system and a specific target. RFID tags are the key to current RFID technology and can store a certain amount of information. With certain information processing functions, the reading and writing device can exchange information with the tag at a certain data transmission rate through radio signals. Today, the RFID tag process can be divided into three stages, which are sequentially used for antenna manufacturing and chip [ 1C] Welding and pressing, the manufacturing technology is described as follows: A. Antenna manufacturing: 1. Etching method: Covering polyethylene terephthalate (PET) with a copper foil film as an antenna substrate, wherein The thickness of the copper foil film is about 18 μm [uin]~35 μm [um], and the thickness of polyethylene terephthalate (PET) is about 25 μm [um] to 50 μm [um], and then the screen printing is used to make money. The acid ink prints the antenna pattern on the front side of the substrate, and then the RFID chip is manufactured by pickling etching, acid-resistant ink stripping, defoaming treatment, oxidation resistance, water washing, etc. The advantage of this method is that it is manufactured well. The ratio is high, the antenna performance is excellent and stable; and the disadvantage is that the process is cumbersome and the output is poor 098123939 Form No. A0101 Page 4 of 20 0982040802-0 201102930, and most of the copper foil film is etched and stripped, so it is wasted, so The cost is expensive. Generally speaking, the cost is 2 to 3 times that of the screen printing method, and the cost structure cannot meet the requirements of the logistics supply chain application. 2. Printing method: Conductive silver glue using screen printing [Conductive iveSi lver Ink] directly prints the antenna pattern on the polyethylene terephthalate (PET) substrate and then bakes it to complete the antenna manufacturing. This method has only one advantage, that is, the output is the largest and the cost is the lowest; But the shortcomings are really prohibitive. First, the conductivity of conductive silver glue is only 1/10 of that of copper, or even smaller, because the conductor resistance increases with frequency. The current density in the center of the conductor will decrease, and the current density of the conductive edge will gradually increase. This is the skin effect, which causes the antenna radiation efficiency, directivity and gain to be greatly affected. Second, conductive silver paste The composition of BOC must be greater than 80% to be conductive. When the baking process is completed, as the solvent evaporates, the coverage of silver decreases. If the antenna wire is bent, the silver wire will easily peel off. Third, if it is to increase The conductivity increases the thickness of the conductive silver paste, and the baking time rises exponentially. The only way is to raise the temperature, but it will destroy the polyethylene terephthalate (PET) substrate. 3. Plating: The electroplating ink [P1 ati ng I nk] is directly printed on the polyethylene terephthalate (PET) substrate by screen printing, and then oxidized by electroplating the water tank. Reduction method, electroplating copper antenna, the advantages of this method is large output, high reliability, and the process technology is generally easy to understand; the disadvantage is that the small production cost will be very expensive, and it must be cost-effective to produce in large quantities. The antenna pattern cannot be less than 50 mm [mm], so it is not suitable for micro 098123939 Form No. A0101 Page 5 / Total 20 pages 0982040802-0 201102930 Type antenna. 、, wafer [I c] soldering: After the antenna is manufactured, it is necessary to perform the welding work of the antenna and the wafer [1C], and the welding work of the radio frequency identification integrated circuit [rfid IC] is basically the welding of the semiconductor industry. Technology, mechanical shift precision must be less than 20 microns [um], in order to complete the welding work 'the general method is as follows: 1. Cladding puncture method: lift the wafer [1C] 'and then flip 180. After that, the two ends of the wafer [Ic] are punctured on the antenna wire contacts, but before the wafer [Ic] is lifted, the antenna wire contacts must be micro-injected with non-conductive particles [NCP 'None Conductive Paste]. Agent, the advantage of this method is low cost, but the disadvantage is that the manufacturing yield is poor, because the non-conductive particle film [NCP] itself is not well-adjusted, (4) the force parameter becomes the most important key factor, the puncture force is too low, the contact point It may be non-contact and not conductive, and the puncture force is too high, and may directly puncture through the polyethylene terephthalate dicarboxylate (PET) substrate. 2. Flip-on bonding method: Bonding the wafer [IC] terminal and the antenna to the ACP (Anisotropic Conductive Paste) ACF (Anisotropic Conductive Film) adhesive The advantage of this method is that the manufacturing yield is high, the label performance is excellent and stable, but the disadvantage is that it is expensive because the anisotropic conductive adhesive [Acp], the anisotropic conductive film [ACF] itself is silver paste, and silver is Belongs to precious metal 〇3. Super-wave vibration method: 098123939 Form No. A0101 Page 6/Total 20 pages 0982040802 Stomach 0 201102930 After the wafer [1C] two-terminal pin is in contact with the antenna wire contact, it is vibrated by ultrasonic vibration. The method raises the temperature of the joint to achieve the purpose of soldering; finally, the adhesive is directly injected to fix the wafer (IC) and the antenna wire. This method is expensive, so it is rarely used in RFID tags. Manufactured 'but it is common in the semiconductor industry. C. Lamination: After the antenna is manufactured, the pressing step must be performed to complete the final RFID tag. This is a good deal. It has different manufacturing requirements depending on the user's needs. The method used is also very different. Basically, there are self-adhesive RFID tags, three-layered (superscript + antenna + subscript) soft card type label and five layers. Press hard card storage. Nowadays, the present inventors have in view of the widespread use of high-priced equipment such as screen printing and electroplating etching in the manufacture of RFID tags, which are costly, and the plating solution is liable to cause environmental pollution, etc. Years of experience in manufacturing and design related knowledge and knowledge in related fields, and through many ingenuity, the R&D and improvement of the RFID tag process has been updated in order to exert its higher practical efficiency. [Invention content] [〇〇〇3] The present invention relates to a process for forming a metal foil radio frequency identification tag and a molding machine thereof. The main purpose of the invention is to reduce the manufacturing cost and benefit from environmental benefits such as environmental protection during the process. Therefore, in order to achieve the above object, the inventors have developed the following metal box radio frequency identification label forming machine, which includes: 098123939 Form No. A0101 Page 7 / Total 2 page 0992040802-0 201102930 A feeding device is provided a feeding drum; a die pressing device, which is connected after the feeding device, includes a lifting power source and a template connected with the lifting power source, and a radio frequency identification tag preform is formed at the bottom of the template The drawing device is provided after the die-pressing device, and is provided with a positive-receiving group and a scrap-receiving group, and the winding-receiving group is provided with the winding-receiving group and the scrap-receiving group. And making a wheel with X, and contacting the working wheel of the raw material winding group and the scrap collecting group, and then winding the adhesive tape on the winding wheel and the working wheel of the raw material winding group; - dispensing device After being connected to the material removal device, the utility model comprises a lifting power source 'and a dispensing unit in the upper moving phase and the upper group; - the chipping device is connected to the dispensing device, and is provided with a Displacement power source 'money and the displacement power source Group received the wafer pick and place unit. According to this, 'the gold is transferred from the person to the die-molding device' and then the template of the die-pressing device is pressed out of the RFID tag, and then, the radio frequency identification sign metal box Transfer to the stripping device for separation from the radio frequency_subtractive primitive, and then transfer the sub (4) wireless (4) identification label to the division device to dispense the glue at the preset wafer, and repeat the demultiplexed radio frequency identification tag primitive Transfer to the flip chip device to attach the wafer 'to complete the radio frequency identification. [Embodiment] [0004] In order to make the technical means, μ purpose and successful performance of the present invention have a more complete and clear disclosure, a detailed description such as τ, and please refer to the attached drawings and drawings. 098123939 First, please refer to the form number shown in the first figure Α0101 Page 8/Total 2 page The metal foil wireless shot of the invention is 0982040802-0 201102930 The process of frequency identification and its forming machine, the metal 羯 radio frequency identification tag The forming machine is composed of a feeding device (i), a pressing device (2), a removing device (3), a dispensing device, a flip chip device and a conveying device (6); wherein: the feeding device (1) ), is provided with a feeding roller for winding the metal foil [for the inscription];
098123939 該壓模裝置（2)，係接續設於入料裝置（丄）之 後，乃包含一昇降動力源，以及一與昇降動力源相組接 之模板（2 1)，並於該模板乂2丄）底部設有無線射 頻辨硪標籤〔rfid Tag〕預成形之圖形； 該除料裝置（3 )，乃接續設於壓模裝置（2)之 後，係設有正料捲收組（3 i )及廢料捲收纟豈（3 2) ，並使該正料捲收組（3工）與廢料捲收組（3 2)分 別設有捲收輪（311)、（321)與工作輪（31 2)、（ 3 2 2 )，再使該正料捲收組（3 1)及廢料 捲收組（3 2)之工作輪（3丄2)、（ 3 2 2 )相接 觸，且於該正料捲收組（3 1 )之捲收輪（3工丄）、 工作輪（3 1 2)上捲繞有黏著帶（3 3); 該點膠裝置（4)，係接續設於除料裝置之 後’乃包含有昇_力源，並於該昇㈣力源上組設有 點膠單元； 該覆晶裝置（5) ’乃續接於點膠裝置（4)之後 ，主要設有i位動力源，以及與該移位動力源相組接 之晶片取放單元； 該傳送裝置（6)，係設於入料裝置（1)、磨模 裝置（2)、除料裝置（3) '點膠裝置⑷及覆晶 表單編號A0101 第9頁/共20頁 0982040802-0 201102930 裴置（5)之間，乃形成導輪之型態。 據此，當使用實施時，其實施步驟係包含如下，^ —併參閱第二圖所示： ，吻 A，入料：係將金屬箔（7 )捲放在入料裝置（1 ) 之入料滾筒上，並使金屬箔（7)與傳送裝 繞設； b )相 B•壓模：繼之，請一併參閱第三圖所示，由傳送裝 置（6)將金屬箱（7)導引進入壓模震置（？），此、 :’壓模裝置（2)之昇降動力源係帶動相組接之模板 =1)往下作動’以使模板（21)底部㈣於金屬 :二)上，而於金屬箱⑺上點斷形成無線射頻辨 識^籤〔RFID Tag〕圖元（8 ); C·除料：續之，請-併參閱第四圖所示，傳送裝置 (6 )續將已於其上點斷壓擎出無線射頻辨識標籤圖形 的金屬箱⑺傳送至除料裝置⑴處，並通過除料 裝置（3)其相制之正料捲㈣(31)及廢料捲收 ，卫（3 2 )之工作輪.m 9、 (d 1 2)、（ 3 2 2 )間，經二 =輪（312)、（3^)相互滾職，金屬落（ 结上呈點斷之無線射頻辨識標籤圖元（8)即黏附於 捲收組(3 ”之工作輪⑴2)上的黏 再續由傳送裝置（6)將黏附於黏著帶 U射頻辨識域圖元（8 )往點膠裝置 C4)方向輪送，另請— 併參閱第五圖所示，已移除無 線射頻辨識標籤圖元彳8 … 之金屬箔（7)則由廢料捲 收組（3 2)之工作輪r q 〇 〇、 k 3 2 2)反向捲收至廢料捲收 紐C 3 2)之捲收輪（3 098123939 表單編號侧 第 )處作集收； 弟10頁/共20頁 098204080 201102930 D. 點膠：請再一併參閱第六圖所示，於無線射頻辨 識標籤圖元（8 )輸送至點膠裝置（4)後，點膠裝置 (4)之昇降動力源即帶動組設之點膠單元往下作動， 以於無線射頻辨識標籤圖元（8)之預結合晶片（10 )之位置處點上黏膠（9); E. 覆晶：隨之，請一併參閱第七圖所示，點上黏膠 之無線射頻辨識標籤圖元（8)係由傳送裝置（6)傳 輸至覆晶裝置（5)處，此時，覆晶裝置（5 )之移位 動力源係作動相組接之晶片取放單元至晶片（10)置 放處，以拿取晶片（10) ’再將晶片（10)移至無 線射頻辨識標籤圖元（8)已點上黏膠之位置處，而後 ，將晶片（1 0 )黏附其上，依此·，即可以自動化一貫 完成無線射頻辨識標籤之組裝程序。 經由以上的實施說明，可知本發明具有數多優點， 如： 1. 本發明於製程上無需採用網印或蝕刻等高價設備 進行製作無線射頻辨識標籤，僅需運用壓模裝置、除料 裝置便可製作完成無線射頻辨識標籤，故實施上可大幅 降低在設備上耗費的成本。 2. 本發明之無線射頻辨識標藏可採用各種金屬箔， 以現今已量產之金屬箔加工〔例如：鋁箔紙〕，加工過 程既無環保疑慮，同時可以大幅降低材料成本。 综上所述，本發明實施例確能達到所預期之使用功 效，又其所揭露之具體構造，不僅未曾見諸於同類產品 中，亦未曾公開於申請前，誠已完全符合專利法之規定 與要求，爰依法提出發明專利之申請，懇請惠予審查， 098123939 表單編號A0101 第11頁/共20頁 0982040802-0 201102930 並賜准專利，則實感德便。 【圖式簡單說明】 [0005] 第一圖：本發明之金屬箔無線射頻辨識標籤成形機剖視 圖 第二圖：本發明之金屬箱無線射頻辨識標籤製程壓模狀 態圖 第三圖：本發明之金屬羯無線射頻辨識標籤製程除料狀 態圖（一） 第四圖：本發明之金屬箔無線射頻辨識標籤製程除料狀 態圖（二） . 第五圖：本發明之金屬猪無線射頻辨識標籤製程點膠狀 態圖 第六圖：本發明之金屬箔無線射頻辨識標籤製程覆晶狀 態圖 【主要元件符號說明】 [0006] 無線射頻辨識標籤圖元 (1 ) 入料裝置 (21) 模板 (31) 正料捲收組 (3 1 2)工作輪 (3 2 1 )捲收輪 (33) 黏著帶 (5) 覆晶裝置 (7) 金屬箔 (8 ) (9) 黏膠 (2) 壓模裝置 (3) 除料裝置 (3 1 1 )捲收輪 (32) 廢料捲收組 (3 2 2 )工作輪 (4) 點膠裝置 (6) 傳送裝置 (10) 晶片 098123939 表單編號A0101 第12頁/共20頁 0982040802-0098123939 The die-pressing device (2), which is connected after the feeding device (丄), comprises a lifting power source, and a template (2 1) combined with the lifting power source, and the template 乂 2丄) The bottom part is provided with a pre-formed pattern of a radio frequency identification tag; the de-carrying device (3) is connected to the die-pressing device (2), and is provided with a positive-receiving group (3 i) And the waste volume collection (3 2), and the reel collection group (3 workers) and the scrap collection group (3 2) are provided with rewinding wheels (311), (321) and work wheels ( 31 2), (3 2 2 ), and then contact the working wheel (3丄2) and (3 2 2) of the raw material retracting group (3 1) and the scrap retracting group (3 2), and The reeling belt (3 1 ) of the winding reel (3 1 ) and the working wheel (3 1 2) are wound with an adhesive tape (3 3); the dispensing device (4) is continuously connected to After the material removal device, the light source includes a liquid source, and a dispensing unit is disposed on the power source (4); the crystal chip device (5) is continuously connected to the dispensing device (4), and is mainly provided. There is an i-bit power source, and the displacement power source The wafer pick-and-place unit is connected to the feeding device (1), the feeding device (1), the grinding device (2), the removing device (3), the dispensing device (4), and the flip chip form number A0101. Page / Total 20 pages 0982040802-0 201102930 Between the set (5), the shape of the guide wheel is formed. Accordingly, when used, the implementation steps include the following, and refer to the second figure: , kiss A, feeding: the metal foil (7) roll is placed in the feeding device (1) On the drum, and to wrap the metal foil (7) and the conveyor; b) Phase B • Die: Next, please refer to the third figure, the metal box (7) is conveyed by the conveyor (6) Guide into the stamper (?), this: 'The die power device (2)'s lifting power source is driven by the moving phase of the template = 1) to actuate 'to make the template (21) bottom (four) to the metal: 2) On the metal box (7), the RFID tag is formed on the metal box (7); C. Divide: Continued, please - and refer to the fourth picture, the transmission device (6) Continued to transfer the metal box (7) that has been pressed out of the RFID tag graphic to the stripping device (1), and through the stripping device (3), the phased roll (4) (31) and scrap Rolling, Wei (3 2) work wheel.m 9, (d 1 2), (3 2 2), after two = round (312), (3^) roll off each other, the metal falls (the knot is Point-breaking radio frequency identification tag map (8) The adhesion adhered to the reeling group (3" working wheel (1) 2) is adhered by the conveying device (6) to the adhesive belt U radio frequency identification domain element (8) to the dispensing device C4) Send, please also - and as shown in the fifth figure, the metal foil (7) with the removed RFID tag element 彳 8 ... is the work wheel rq 〇〇, k 3 of the scrap collection group (3 2) 2 2) Reverse winding to the scrap roll to receive the new C 3 2) roll round (3 098123939 form number side) for collection; brother 10 pages / total 20 pages 098204080 201102930 D. Dispensing: please again Referring to the sixth figure, after the radio frequency identification tag element (8) is sent to the dispensing device (4), the lifting power source of the dispensing device (4) drives the dispensing unit to operate downward. Adhesive (9) is placed at the position of the pre-bonded wafer (10) of the RFID tag (8); E. Flip chip: Please, as shown in the seventh figure, click on the stick The RFID tag element (8) of the glue is transmitted from the transmitting device (6) to the flip chip device (5). At this time, the shifting power source of the flip chip device (5) is connected to the moving phase. The wafer pick-and-place unit is placed at the wafer (10) to take the wafer (10) and the wafer (10) is moved to the position where the RFID tag element (8) has been glued, and then By attaching the wafer (10) thereto, it is possible to automate the assembly process of the RFID tag. The present invention has several advantages, such as: 1. The present invention is on the process. It is not necessary to use high-priced equipment such as screen printing or etching to make radio frequency identification tags. It is only necessary to use the die-pressing device and the material-removing device to fabricate the RFID tag, so the cost of the device can be greatly reduced. 2. The RFID tag of the present invention can be used with various metal foils, and the metal foil processing (for example, aluminum foil paper) which has been mass-produced in the present invention has no environmental concerns and can greatly reduce the material cost. In summary, the embodiments of the present invention can achieve the expected use efficiency, and the specific structure disclosed therein has not been seen in similar products, nor has it been disclosed before the application, and has completely complied with the provisions of the Patent Law. And request, 申请 legally filed an invention patent application, please for review, 098123939 Form No. A0101 Page 11 / 20 pages 0982040802-0 201102930 and grant a patent, it is really good. BRIEF DESCRIPTION OF THE DRAWINGS FIG. 1 is a cross-sectional view showing a metal foil radio frequency identification tag forming machine of the present invention. FIG. 2 is a third view of a metal box radio frequency identification tag process stamping state diagram of the present invention: Metal 羯 Radio Frequency Identification Tag Process Release Status Diagram (I) Fourth Picture: Metal Foil RFID Identification Process Diagram of the Invention (2) . Figure 5: Metal Pig Radio Frequency Identification Label Process of the Invention Dispensing state diagram sixth figure: the metal foil radio frequency identification tag process flip-chip state diagram of the present invention [main component symbol description] [0006] radio frequency identification tag primitive (1) feeding device (21) template (31) Feeding group (3 1 2) Working wheel (3 2 1) Rewinding wheel (33) Adhesive tape (5) Flip chip device (7) Metal foil (8) (9) Adhesive (2) Molding device (3) Unloading device (3 1 1) Rewinding wheel (32) Waste retracting group (3 2 2) Working wheel (4) Dispensing device (6) Conveying device (10) Wafer 098123939 Form No. A0101 Page 12 / Total 20 pages 0982040802-0