201044043 六、發明說明： 【發明所屬之技術領域】 本發明係有關於-種光束導 — 水功能之可撓式光束導引模組。、、尤私種具有防 【先前技術】 ~ -，在這些電子產品;都之資訊產品之 了讓使用者可《在無切照射%/ 力能。為 =及功能’-般都在電子產品的按鍵結:内鍵 上的圖形及數字、楚看見母—個按鍵的位置及按鍵表面 -般按鍵結構内部的背光源 :後，該光線可由導二 表面的數字或圖形可以顯示出來，使付按鍵 的環境下，依然可以執行操作按 ；二:= 面所顧會逐漸衷減’致使導光板後端對應的按鍵表 上的字及圖形的亮度不足。因此，為了讓導光板 二//、=勻，即在導光板周緣增加多個發光元件或一個 反光板，以達導光板上的光源均勻。如此一 子產品的耗電量增加，収成本也相對增加。將 【發明内容】 201044043 本發_要解決的技㈣題，在於提供 f能之可撓式光束導引模組。本發明透 j = *内=可棱性光束導引薄膜内，以‘=广 宰，提供ίΛ述技賴題’根據本發明之其中一種方 束導引薄膜、一光束反射元件及-光束ΐ 引薄膜料束反射元件係設置於該可撓性光束導 ο 光束產生元件係具有一電路基板及至少 —電性連接於該電路基板上之光束產生晶片。 夕 .宰，述技㈣題’根據本發明之其中一種方 :，m、-種具有防水功能之可挽式光束導引模组 的下方以做為該鍵盤模組的背光模組:其 \引模組係包括：一可挽性光束導引薄 井击射兀件及一光束產生元件。其中，該可撓性 係設置於該鍵盤模組的下方。該光束反射元 〇 可挽性光束導引薄膜的底部。該光束產生元 =產有生一:;基板及至少-電性連接於該電路基板上 因此，本發明的有益效果在於： 壤胺1透過將s亥光束產生元件内嵌於該可撓性光束導引 4膜内’以達到防水之功能。 2、 透過該可撓性光束導引薄膜的使用，使得本發明 可貼附在任何平面或曲面上。 3、 本發明之可徺性光束導引薄膜與㈣反射元件係 5 201044043 可以體成型的方式製作出來，因此可降低製作成本。 4 :本發明的應用領域廣，乏，例如：滑鼠、鍵盤背光 二ΐ击夕媒體遙控器、手機、汽車（内部儀表板燈飾、外 =車燈、方向指示燈等）、夜間雨衣、反光指示燈背心 衣物、庭院太陽能路燈、步道燈、室内燈具、招牌等等。 為了忐更進一步瞭解本發明為達成預定目的所採取 ^技術、手段及功效，請參閱以下有關本發明之詳細說明 =附圖，相信本發明之目的、特徵與特點，當可由此得一 =且具體之瞭解’然而所附圖式僅提供參考與說明用， 並非用來對本發明加以限制者。 【實施方式】 睛參閱第-圖所示，本發明第一實施例係提供一種且 2水功能之可撓式光束導引模組，其包括：& =引薄膜ia、-光束反料件^及—光束產 ci a ° 透光ίΓ該可撓性光束導㈣膜1 可為面板式軟性 透先塑膠’例如聚碳酸酯（polycarbonate，PC)、壓克力 =^esiI〇 —膠（siUeagel)等等，並且該可挽性 j導引薄膜1 a的厚度係介於㈣5至5 _之間較 可：Ϊίίΐ〇.07至〇·15 _之間。然而’上述關於該 :::性光束導引薄膜i 3之材料及厚度的界定乃是本案 、較佳實施例，而並非用以限定本發明。 v、 Μ 該光束反射元件2 3係設置於該可撓性光束導 溥、1 a的底部’其中以第一實施例所舉的例子而言 (此例子並非用以限定本發明），該光束反射元件2以系 可為一設置於該可撓性光束導引薄膜1 a底部之反光片、 201044043 2 0 a ° 另外，5玄光束產生元件3 a係内散於該可撓性光束導 引薄膜1 a内的一側端，其中該光束產生元件3 a係具有 一電路基板3 0 a及複數個電性連接於該電路基板3 〇 a上之光束產生晶片3 1 a。以第一實施例所舉的例子而 s (此例子並非用以限定本發明），該電路基板3 a係 可為一硬式電路板或一軟式電路板，並且每一個光束產生 晶片3 1 a係可為一發光二極體晶片。 ❹ 因此，從該光束產生元件3 a之該等光束產生晶片3 1 a所產生之光束（圖未示），其係可透過「該可撓性光 束導引薄膜1 a之導引」及「該光束反射元件2 a之反光 片2 0 a的反射」，而產生向上的整面投光效果（產生面 光源）。 請參閱第二A圖所示，本發明第二實施例係提供一種 具有防水功能之可撓式光束導引模組，其包括：一可撓性 光束導引薄膜lb、一光束反射元件2b及一光束產生元 件3 b。本發明第二實施例與第一實施例最大的差別在 W於：在第二實施例中，該光束反射元件2b係為複數個向 =凸出之反光微結構2 〇 b。另外，依據不同的設計需 ' 11亥等反光微結構2 0 b係可透過「任何的成形方式」 (例如印刷、喷塗等等）而設置於該可撓性光束導引薄膜 l b的底部，並且該等反光微結構2 〇 b亦可直接一體成 ^於該可撓性光束導引薄膜i b的底部（亦即該可撓性光 ^導弓丨薄膜1 b與該等反光微結構2 〇 b係以—體成型 楚，式直接一起被製作出來，例如：射出成型或壓模成型 荨等）。 7 201044043 因此，從該光束產生元件3 b之該等光束產生晶片3 1 b所產生之光束Lb，其係可透過「該可撓性光束導引 薄膜1 b之導引」及「該光束反射元件2 b之該等反光微 結構2 Ob的反射」，而產生向上的整面投光效果（產生 面光源）。 另外，請參閲第二B圖所示，本發明第二實施例之可 撓式光束導引模組係可應用於一鍵盤模組κ，例如：該可 撓式光束導引模組係安裝於一鍵盤模組κ的下方以做為 該鍵盤模組Κ的背光模組，其中該可撓性光束導引薄膜工 b係設置於該鍵盤模組κ的下方。 請參閱第三圖所示，本發明第三實施例係提供一種具 有防水功能之可撓式光束導引模組，其包括：—可挽性光 束導引薄膜1 c、-光束反射元件2 c及-光束產生元件 3 c。本發明第三實施例與上述其它實施例最大的差別在 於：在第三實施财，該光束反射元件2 e係為複數個向 内凹設之反光微結構2 ◦ c ’並且該等向内凹設之反光微 結構2 Q e係直接-體成型於該可撓性光束導引薄 c的底部。 、 "當然，上述第二實施例所揭露之「該等向外凸出之反 光微結構2 Q b」與第三實施例所揭露之「該等向内凹設 =反光微結構2G c：」亦可隨著不_設計需求，而以混 合的方式以成形於該可撓性光束導引薄们c的底部。因 =亥光束反射S件係可為複數個可選擇性地物） 向外凸出及向内凹設之反光微結構。 ::而，上述對於該光束反射元件之界定（例如反光片 或反先微結構）只是用來舉例而已，*並非用以限定本發 201044043 明。舉凡任何可造成反射效果之光束反射元件，皆為本發 明所保護之範疇。 又 因此，從該光束產生元件3 c之該等光束產生晶片3 1 c所產生之光束l c，其係可透過「該可撓性光束導引 薄膜1 c之導引」及「該光束反射元件2 c之該等反光微 結構2 0 c的反射」，而產生向上的整面投光效果（產生 面光源）。 〇 ❹ 請參閱第四圖所示，本發明第四實施例係提供一種具 有防水功能之可撓式光束導引模組，其包括：一可撓性^ 束導引薄膜1 d、-光束反射元件2 d及一光束產生元件 3 d。本發明第四實施例與上述其它實施例最大 於：在第四實施例中，該光束產生元件3d之電路基板f 〇d的底部3QQ d係外露於該可撓性光束導引薄膜工 部（亦即該電路基板3 〇 d的底部3 〇 〇 d係接觸 =)。因此，該光束產生元件3 d之該等光束產生晶 说」所產生的熱量係可透過該電路基板3 Q d的傳 有^引至外界（如第四圖中向下的箭頭所示），此方式 有利：增進該等光束產生晶片3 Id之散熱效果。 f參閱第五圖所示，本發明第五實施例係提供一種具 撓式光束導引模組，其包括:-可撓性光 3 太、e、一光束反射元件2 e及一光束產生元件 :發明第五實施例與第四實施例最大的差別在於： 施例中，該可撓性光束導 二 =光束產生元件3e下方之散熱孔 〇 e ^ 生凡件3 e之電路基板3 Q e之底部3 0 的一部分係透過該散熱孔1 0 e而連通於外界。因 9 201044043 此，該光束產生元件3 e之該等光束產生晶片3 2 e所產 生的熱量係可透過該電路基板3 〇 e的傳遞而從上述至 少兩個散熱孔1 〇 e通過以導引至外界（如第五圖中向下 的箭頭所示），此方式有利於增進該等光束產生晶片3 2 e之散熱效果。 請參閱第六圖所示，本發明第六實施例係提供一種具 有防水功能之可撓式光束導引模組，其包括：一可撓性^ 束導引薄膜1 f、一光束反射元件2 f及一光束產生元件 3 f。本發明第六實施例與第五實施例最大的差別在於： 在第六實施例中，該可撓性光束導引薄膜i f係具有至少 兩個成形於該光束產生元件3 f下方之散熱孔i 〇 f及 至 > 兩個分別填充或設置於上述至少兩個散熱孔1 〇于 内之散熱體1 1 f (例如導熱金屬材料）。此外，上述至 y兩個散熱孔1 〇 f係為一由該可撓性光束導引薄膜1 二與兩個拔模腳（圖未示）配合而成形之開孔。換言之， 當使用上述兩個拔模腳以支撐該光束產生元件3 f時，即 可使用射出成型的方式射出該可撓性光束導 乂以用於包覆該光束產生元件以及每4二=上 邓刀。因此，當上述兩個拔模腳脫離該可撓性光束導引薄 膜1 f時，即可成形出上述至少兩個散熱孔i 〇 f。 因此，该光束產生元件3 f之該等光束產生晶片3工 f所產生的熱量係可透過該電路基板3 〇 f的傳遞而從 上述至少兩個散熱體i i f通過以導引至外界（如第六圖 中向下的箭頭所示），此方式有利於增進該等光束產生晶 片3 1 ί之散熱效果。 請參閱第七圖所示，本發明第七實施例係提供一種具 201044043 有防水功此之可撓式光束導引模組，其包括：一可撓性光 ^導引薄膜1g、-光束反射元件2 g及—光束產生元件 g。本發明第七實施例與第四實施例最大的差別在於·· ^第七實施例中’該光束產生元件3 g係具有—設置於該 ，路基板3 Q g底端之散熱元件3 2 g。因此，該光束產 钫：Γ3!之散熱元件3 2 g的底部3 2 0宮係外露於 ^ w凡性光束導引薄膜i g的底部（亦即該散熱元件3 2 =底部3 2 Q g係接觸於外界）。因此，該光束產生元 0之該等光束產生晶片31 3所產生的熱量係可透 =電路基板3Qm該散熱#32g的傳遞而導引 進向下的箭頭所示）’此方式有利於增 先束產生晶片3 1 g之散熱效果。 凊參閱第八圖所示’本發明第八實施例係提供一種具 =水功能之可撓式光束導引模組，其包括：一可挽性光 ^弓丨薄膜1 h、一光束反射元件2 h及一光束產生元件 。本發明第八實施例與第七實施例最大的差別在於： 第八實施例中，該可撓性光束導引薄膜丄h係具有至少 你！成形於該光束產生元件3 h下方之散熱孔1 〇 h，以 ^該光束產生元件3 h之散熱元件3 2 h之底部3 2 此▲的，部分係透過該散熱孔1 〇 h而連通於外界。因 决光束產生元件3 h之該等光束產生晶片31h所產 ί =量係可透過該電路基板3 0 h及該散熱元件3 2 ^傳遞而從上述至少兩個散熱孔1◦h通過以導引至 今榮（如第八圖中向下的箭頭所示），此方式有利於增進 轉=束產，晶片3lh之散熱效果。 凊參閱第九圖所示，本發明第九實施例係提供一種具 201044043 =水功能之可撓式光束導引模組，其包括：挽 ί導:丨=、-光束反射元件2 J及-光束產生4 ^ i 發明第九實施例與第八實施例最大的差別在於： 在第九實施例中，該可撓性光束導引薄膜工』係具 :個成形於該光束產生元件3j下方之散熱孔；叫及 分別填充於上述至少兩個散熱孔i 内之散 ^，此’該光束產生树3』之該等光束產生 1所產生的熱量係可透過該電路基板3 0 j及 μ υ ί 3 2 j的傳遞而從上述至少兩個散熱體工工 以導引至外界（如第九圖中向下的箭頭所示），此 方式=於，進該等光束產生晶片3 i』之散熱效果。 〇月參閱弟十圖所示’本發明第十實施例係提供一種且 束導引模組，其包括:-可撓性光 、★ 光束反射元件2k及一光束產生元件 二土明第十實施例與上述其它實施例最大的差別在 ' 十實她例中’因為該光束產生元件3 k的整體厚 於5亥可撓性光束導引薄膜1 k的厚度，所以該可撓 •二導引薄膜1 k係大致區分成一用於容納該光束產 一，，3 k之第一區段A及一連接於該第一區段a之第 一，&B，並且該第一區段A的厚度係大於該第二區段b 2度。因此，即使該可撓性光束導引薄膜1k因著特殊 必須做的特別薄時，該光束產生元件3 k仍然可以 被包^在該可撓性光束導引薄膜1k内。 4參閱第十一圖所示，本發明第十一實施例係提供一 種二有防水功能之可撓式光束導引模組，其包括：一可撓 光束導弓丨，#膜1 m、—光束反射元件2 m及—光束產生 201044043 Ο 〇 在於.發明第十一實施例與第一實施例最大的差別 施例中’該光束產生元件3 m只具有- 片3 lm，並且該可撓性光束導引薄膜1 m係 因Λ本發明不僅可以透過第-實施例之可 :二=引薄膜13產生面光源（如第-3圖所示)， m產% f:透過第十一實施例之可撓性光束導引薄膜1 111產生面光源（如第十一圖所示）。 料本發明透過將該光束產生元件㈣於該可 ΐίίί薄膜内，以達到防水之功能。此外，透過該 ，性先束導㈣膜的❹，使得本㈣可_在任何平 =或曲面上，因此本發明的應用領域非常廣泛。另外 ίΓί可撓性光束導引薄膜與光束反射元件係可以一體 成里的方式製作出來，因此可降低製作成本。 進，H發明之时㈣應訂述之申請專利範圍為 σ於本發明申料利範圍之精神與其類似變化之 =，皆應包含於本發明之範嘴中，任何熟悉該項技蔽者 之：域内，可輕易思及之變化或修飾皆可“在 以下本案之專利範圍。 【圖式簡單說明】 第-圖係為本發明具有防水功能之可撓式光束導引模板 的第一實施例之立體示意圖； • Α圖係為本發明具有ρ方水功能之可撓式光束導引模 組的第二實施例之側視示意圖； 、 B圖係為本發明第二實_中具有防水功能之可栌 式光束導引模組應用於鍵盤模組的之侧視示意圖二 .圖係為本發明具有防水功能之可撓式光束導引 %莫組 第 第 第 13 201044043 的第三實施例之側視示意圖； 組 第四圖係為本發明具有防水功能之可 的第四實施例之側視示意圖；①式光束導引模 第五圖係為本發明具有防水功能之可 的第五實施例之側視示意圖；式光束導引模組 第六圖係為本發明具有防水功能之可 的第六實施例之側視示意圖；工光束導引模組 第七圖係為本發明具有防水功能之可 的第七實施例之側視示意圖；①式光束導引模組 第八圖係為本發明具有防水功能之可 組 的第八實施例之側視示意圖；光束導引模組 第九圖係為本發明具有防水功能之可 的第九實施例之側視示意圖；"光束導弓丨模 第十圖係為本發明具有防水功能之可 的第十實施例之側視示意圖； 導引模組 第十-圖係為本發明具有防水功能之 組的第十一實施例之側視示意圖； 導引模 【主要元件符號說明】 [第一實施例] la 2 a 反光片 2 0 a 3 a 電路基板 3 0 a 光束產生晶片 3 1 a lb 2 b 反光微結構 2 0 b 可撓性光束導引薄膜 光束反射元件 光束產生元件 [弟'~實施例] 可撓性光束導引薄膜 光束反射元件 14 201044043201044043 VI. Description of the Invention: [Technical Field of the Invention] The present invention relates to a flexible beam guiding module for a light guiding function. , and especially private species have anti-[previous technology] ~ -, in these electronic products; all of the information products allow users to "in the absence of cut% / force. For the = and function '- all in the electronic product's button knot: the graphics and numbers on the inner button, Chu see the mother - the position of the button and the surface of the button - the backlight inside the button structure: after the light can be guided by The number or graphic of the surface can be displayed, so that the operation can be performed under the environment of the button; the second: = the face will be gradually reduced, causing the brightness of the words and graphics on the button table corresponding to the rear end of the light guide plate to be insufficient. . Therefore, in order to make the light guide plate two//, = uniform, that is, a plurality of light-emitting elements or a light-reflecting plate are added on the periphery of the light guide plate, so that the light source on the light guide plate is uniform. As a result, the power consumption of such a product increases, and the cost of receiving is relatively increased. [Summary of the Invention] 201044043 The problem of the technique (4) to be solved is to provide a flexible beam guiding module of f energy. The present invention is transparent to j = * inner = prismatic beam guiding film, with '= 广 slaughter, providing a technical explanation one of the square beam guiding film, a beam reflecting element and a beam ΐ according to the present invention The light film beam reflecting element is disposed on the flexible light beam. The light beam generating element has a circuit substrate and at least a light beam generating chip electrically connected to the circuit substrate.夕.宰,述技术(四)题' According to one of the aspects of the present invention: m, a kind of waterproofing function of the pullable beam guiding module below as the backlight module of the keyboard module: The lead module includes: a leastable beam guiding thin hole firing element and a beam generating element. The flexibility is disposed below the keyboard module. The beam reflection element 〇 the beam guides the bottom of the film. The light beam generating element has a substrate and is at least electrically connected to the circuit substrate. Therefore, the present invention has the beneficial effects that: the surface amine 1 is embedded in the flexible light beam through the sig beam generating element. Guide 4 inside the film to achieve waterproof function. 2. The use of the flexible beam guiding film allows the invention to be attached to any plane or curved surface. 3. The detachable beam guiding film of the present invention and the (four) reflecting element system 5 201044043 can be fabricated in a body molding manner, thereby reducing the manufacturing cost. 4: The application field of the invention is wide and lacking, for example: mouse, keyboard backlight, second smashing media remote control, mobile phone, automobile (internal instrument panel lighting, exterior = lamp, direction indicator, etc.), night raincoat, reflective Indicator vest clothing, courtyard solar street lights, trail lights, indoor lighting, signboards, etc. In order to further understand the technology, means, and efficacy of the present invention in order to achieve the intended purpose, refer to the following detailed description of the invention. FIG. It is to be understood that the invention is not to be construed as limited. [Embodiment] As shown in the first figure, the first embodiment of the present invention provides a flexible water guiding module with a water function of 2, which includes: & = lead film ia, - beam counter member ^和—beam production ci a ° light transmission 可 The flexible beam guide (4) film 1 can be a panel type soft through plastics such as polycarbonate (PC), acrylic = ^esiI〇 - glue (siUeagel And so on, and the thickness of the levisable film 1a is between (4) 5 and 5 _: Ϊ ίίΐ〇.07 to 〇·15 _. However, the above description of the material and thickness of the :::-beam guiding film i 3 is a preferred embodiment of the present invention and is not intended to limit the present invention. v, Μ the beam reflecting element 23 is disposed at the bottom of the flexible beam guide, 1 a. In the example of the first embodiment (this example is not intended to limit the invention), the beam The reflective element 2 can be a reflector disposed at the bottom of the flexible beam guiding film 1 a, 201044043 2 0 a °, and the 5th beam generating element 3 a is dispersed in the flexible beam guide One side end of the film 1 a, wherein the light beam generating element 3 a has a circuit substrate 30 a and a plurality of light beam generating chips 3 1 a electrically connected to the circuit substrate 3 〇 a. In the example of the first embodiment, which is not intended to limit the present invention, the circuit substrate 3a may be a rigid circuit board or a flexible circuit board, and each of the light beams generates a wafer 3 1 a system. It can be a light emitting diode wafer. Therefore, the light beams generated from the light beam generating element 3a generate a light beam (not shown) generated by the wafer 31a, which is permeable to the "guide of the flexible light guiding film 1a" and " The reflection of the light reflecting sheet 20 a of the light reflecting element 2 a produces an upward full-surface light-emitting effect (generating a surface light source). Referring to FIG. 2A, a second embodiment of the present invention provides a flexible beam guiding module having a waterproof function, comprising: a flexible beam guiding film lb, a beam reflecting component 2b, and A light beam generating element 3b. The greatest difference between the second embodiment of the present invention and the first embodiment is that in the second embodiment, the beam reflecting element 2b is a plurality of retroreflective microstructures 2 〇 b. In addition, depending on the design, the reflective microstructure of the 11th floor can be placed at the bottom of the flexible beam guiding film lb by "any forming method" (for example, printing, spraying, etc.). And the reflective microstructures 2 〇b can also be directly integrated into the bottom of the flexible beam guiding film ib (that is, the flexible light guiding film 1 b and the reflective microstructures 2 〇 b is formed by body molding, and the formula is directly produced together, for example, injection molding or compression molding, etc.). 7 201044043 Therefore, the light beams Lb generated by the light beam generating element 3b generate the light beam Lb generated by the wafer 3 1 b through the "guide of the flexible light guiding film 1 b" and "the light beam reflection The reflection of the reflective microstructures 2 Ob of the elements 2 b produces an upward full-surface light-emitting effect (generating a surface light source). In addition, referring to the second B, the flexible beam guiding module of the second embodiment of the present invention can be applied to a keyboard module κ, for example, the flexible beam guiding module is installed. The backlight module of the keyboard module is disposed under the keyboard module κ, wherein the flexible beam guiding film is disposed below the keyboard module κ. Referring to the third embodiment, a third embodiment of the present invention provides a flexible beam guiding module with waterproof function, comprising: a leastable beam guiding film 1 c, a beam reflecting element 2 c And a beam generating element 3 c. The greatest difference between the third embodiment of the present invention and the other embodiments described above is that, in the third implementation, the beam reflecting element 2 e is a plurality of inwardly concave reflective microstructures 2 ◦ c ' and the inward concave The reflective microstructure 2 Q e is directly formed in the bottom of the flexible beam guiding thin c. " Of course, the "outwardly convex retroreflective microstructures 2 Q b" disclosed in the above second embodiment and the third embodiment disclose "the inward recesses = reflective microstructures 2G c: Alternatively, it may be formed in a mixed manner to form the bottom of the flexible beam guiding film c as it is not required by the design. Because the = beam reflection S element can be a plurality of selectively visible) outwardly convex and inwardly concave reflective microstructure. :: However, the above definition of the beam reflecting element (for example, a retroreflective sheeting or an anti-micro-structure) is only used as an example, and * is not intended to limit the present invention. Any beam reflecting element that can cause a reflection effect is within the scope of the present invention. Further, the light beams from the light beam generating element 3c generate the light beam lc generated by the wafer 3 1 c, which is permeable to the "guide of the flexible light guiding film 1 c" and the "beam reflecting element" 2 c of these reflective microstructures 20 0 c reflection", resulting in an upward full-surface light projection effect (generating a surface light source).第四 Referring to the fourth embodiment, a fourth embodiment of the present invention provides a flexible beam guiding module with waterproof function, comprising: a flexible guiding film 1 d, beam reflection Element 2 d and a beam generating element 3 d. The fourth embodiment of the present invention and the other embodiments described above are the largest: in the fourth embodiment, the bottom portion 3QQ d of the circuit substrate f 〇d of the light beam generating element 3d is exposed to the flexible beam guiding film portion ( That is, the bottom 3 〇〇d of the circuit substrate 3 〇d is in contact =). Therefore, the heat generated by the light beams of the light beam generating element 3 d can be transmitted to the outside through the circuit board 3 Q d (as indicated by the downward arrow in the fourth figure). This approach is advantageous: to increase the heat dissipation effect of the light beam generating wafers 3 Id. As shown in the fifth figure, a fifth embodiment of the present invention provides a flexible beam guiding module comprising: - a flexible light 3, an e, a beam reflecting element 2 e and a beam generating element The greatest difference between the fifth embodiment and the fourth embodiment is that, in the embodiment, the flexible beam guide 2 = the heat dissipation hole below the beam generating element 3e, and the circuit substrate 3 Q e of the device 3 e A portion of the bottom portion 30 is communicated to the outside through the heat dissipation hole 10 e. According to 9 201044043, the heat generated by the light beam generating chips 3 2 e of the light beam generating element 3 e can be transmitted through the at least two heat dissipation holes 1 〇 e through the transmission of the circuit substrate 3 〇 e To the outside world (as indicated by the downward arrow in the fifth figure), this method is advantageous for enhancing the heat dissipation effect of the light beam generating wafers 3 2 e. Referring to the sixth embodiment, a sixth embodiment of the present invention provides a flexible beam guiding module with waterproof function, comprising: a flexible guiding film 1 f, a beam reflecting component 2 f and a beam generating element 3f. The greatest difference between the sixth embodiment of the present invention and the fifth embodiment is that: in the sixth embodiment, the flexible beam guiding film if has at least two heat dissipation holes formed under the light beam generating element 3 f 〇f and to> two heat sinks 1 1 f (for example, heat conductive metal materials) respectively filled or disposed in the at least two heat dissipation holes 1 . In addition, the two vent holes 1 〇 f are an opening formed by the flexible beam guiding film 1 and the two draft legs (not shown). In other words, when the above two draft legs are used to support the beam generating element 3f, the flexible beam guide can be ejected by injection molding for coating the beam generating element and for every 4== Deng knife. Therefore, when the two draft legs are separated from the flexible beam guiding film 1f, the at least two heat dissipating holes i 〇 f can be formed. Therefore, the heat generated by the beam generating device 3f of the beam generating element 3f can be transmitted from the at least two heat sinks iif through the circuit board 3 〇f to be guided to the outside (eg, In the six figures, the downward arrow is shown), which is advantageous for improving the heat dissipation effect of the light beam generating chip 3 1 ί. Referring to the seventh embodiment, a seventh embodiment of the present invention provides a flexible beam guiding module with a waterproof function of 201044043, which comprises: a flexible optical guiding film 1g, - beam reflection Element 2 g and - beam generating element g. The greatest difference between the seventh embodiment of the present invention and the fourth embodiment is that the light beam generating element 3 g has a heat dissipating component 3 2 g disposed at the bottom end of the road substrate 3 Q g in the seventh embodiment. . Therefore, the light beam is produced: the bottom portion of the heat dissipating component 3 2 g of the Γ3! is exposed to the bottom of the ordinary light guiding film ig (that is, the heat dissipating component 3 2 = the bottom 3 2 Q g system) Contact with the outside world). Therefore, the heat generated by the light beam generating element 31 of the light beam generating unit 3 is permeable to the circuit board 3Qm, and the heat transfer #32g is transmitted and the downward arrow is indicated. The heat dissipation effect of the wafer 3 1 g is generated. Referring to the eighth embodiment, the eighth embodiment of the present invention provides a flexible beam guiding module with a water function, comprising: a switchable optical film 1 h, a beam reflecting component 2 h and a beam generating component. The greatest difference between the eighth embodiment of the present invention and the seventh embodiment is that: in the eighth embodiment, the flexible beam guiding film 丄h has at least you! a heat dissipating hole 1 〇h formed under the light beam generating element 3 h, so that the bottom portion 3 2 of the heat dissipating component 3 2 h of the light beam generating element 3 h is partially connected to the heat dissipating hole 1 〇h external. The amount of the light beam generating chip 31h generated by the light beam generating element 3h can be transmitted through the circuit substrate 30h and the heat dissipating element 3 2 ^ to pass through the at least two heat dissipation holes 1◦h. This is the best way to improve the heat dissipation effect of the wafers and the wafers. Referring to the ninth embodiment, a ninth embodiment of the present invention provides a flexible beam guiding module having a 201044043=water function, comprising: a ί=, a beam reflecting element 2 J and- The light beam is generated 4 ^ i. The greatest difference between the ninth embodiment and the eighth embodiment is that: in the ninth embodiment, the flexible beam guiding film is formed below the beam generating element 3j. The heat dissipation holes are respectively filled in the at least two heat dissipation holes i, and the heat generated by the light beam generation 1 of the 'beam generation tree 3' is transmitted through the circuit substrate 3 0 j and μ υ The transmission of ί 3 2 j is guided from the at least two heat sink workers to the outside (as indicated by the downward arrow in the ninth figure), in the manner that the light beam is generated into the wafer 3 i heat radiation. The tenth embodiment of the present invention provides a beam guiding module comprising: - a flexible light, a beam reflecting element 2k, and a beam generating element. The biggest difference between the example and the other embodiments described above is that the thickness of the beam generating element 3 k is thicker than the thickness of the 5 kel flexible beam guiding film 1 k, so the flexible/two guiding The film 1k is roughly divided into a first segment A for accommodating the beam, a first segment A of 3 k, and a first segment & B connected to the first segment a, and the first segment A The thickness is greater than 2 degrees of the second section b. Therefore, even if the flexible beam guiding film 1k is particularly thin due to special necessity, the beam generating element 3k can be enclosed in the flexible beam guiding film 1k. As shown in FIG. 11 , an eleventh embodiment of the present invention provides a flexible beam guiding module with a waterproof function, comprising: a flexible beam guiding bow, #膜1 m, The beam reflecting element 2 m and the beam generating 201044043 are in the greatest difference between the eleventh embodiment and the first embodiment. The beam generating element 3 m has only - a piece 3 lm, and the flexibility The light guiding film 1 m is because the present invention can not only transmit the surface light source (as shown in FIG. 3) through the second embodiment, but also produces the surface light source (as shown in FIG. 3). The flexible beam guiding film 1 111 produces a surface light source (as shown in Fig. 11). The present invention achieves the function of waterproofing by applying the beam generating element (4) to the film. In addition, through the squeezing of the first (four) film, the (4) can be on any flat = or curved surface, so the field of application of the present invention is very extensive. In addition, the ίΓί flexible beam guiding film and the beam reflecting element can be fabricated in one piece, thereby reducing the manufacturing cost. The invention shall be included in the scope of the invention, and the scope of the patent application shall be included in the scope of the invention. Anyone familiar with the technology shall be included in the scope of the invention. In the domain, the changes or modifications that can be easily considered can be “in the following patent scope of the present invention. [Simplified illustration] The first embodiment is a first embodiment of the flexible beam guiding template with waterproof function of the present invention. 3 is a schematic side view of a second embodiment of a flexible beam guiding module having a water function of the present invention; and B is a second embodiment of the present invention having a waterproof function A side view of a squeezable beam guiding module applied to a keyboard module. The figure is a third embodiment of the flexible beam guiding method of the present invention having a waterproof function. 4 is a schematic side view of a fourth embodiment of the present invention having a waterproof function; the fifth embodiment of the type 1 beam guiding die is a fifth embodiment of the present invention having a waterproof function. Side view of the schematic; The sixth embodiment of the beam guiding module is a side view of the sixth embodiment of the invention having the waterproof function; the seventh drawing of the beam guiding module is the seventh embodiment of the invention having the waterproof function. FIG. 1 is a side view of the eighth embodiment of the present invention having a waterproof function; the ninth diagram of the beam guiding module is a waterproof function of the present invention. A side view of the ninth embodiment of the present invention; "The light beam guide bow model is a side view of the tenth embodiment of the present invention having a waterproof function; A side view of an eleventh embodiment of the present invention having a waterproof function; a guide mode [main element symbol description] [first embodiment] la 2 a reflector 2 0 a 3 a circuit substrate 3 0 a beam Generating wafer 3 1 a lb 2 b Reflective microstructure 2 0 b Flexible beam guiding film beam reflecting element beam generating element [Different embodiment] Flexible beam guiding film beam reflecting element 14 201044043
光束產生元件 3 b 光束 Lb 鍵盤模組 K [第三實施例] 可撓性光束導引薄膜 1 c 光束反射元件 2 c 反光微結構 2 0c 光束產生元件 3 c 光束 L c [第四實施例] 可撓性光束導引薄膜 Id 光束反射元件 2d 光束產生元件 3d 電路基板 3 0 d 底部 3 0 0 光束產生晶片 3 1 d 光束 L d [第五實施例] 可撓性光束導引薄膜 1 e 散熱孔 1 0 e 光束反射元件 2 e 光束產生元件 3 e 電路基板 3 0 e 底部 3 0 0 光束產生晶片 3 1 e 光束 L e [第六實施例] 可撓性光束導引薄膜 If 散熱孔 1 0 f 散熱體 Ilf 光束反射元件 2 f 15 201044043 光束產生元件 3 f 電路基板 3 0 f 光束產生晶片 3 1 f 光束 L f [第七實施例] 可撓性光束導引薄膜 1 g 光束反射元件 2 g 光束產生元件 3 g 電路基板 3 0 g 光束產生晶片 3 1 g 散熱元件 3 2 g 底部 3 2 0 g 光束 L g [第八實施例] 可撓性光束導引薄膜 1 h 散熱孔 1 0 h 光束反射元件 2 h 光束產生元件 3 h 電路基板 3 0 h 光束產生晶片 3 1 h 散熱元件 3 2 h 底部 3 2 0 h 光束 L h [第九實施例] 可撓性光束導引薄膜 1 j 散熱孔 1 0 j 散熱體 1 1 j 光束反射元件 2 j 光束產生元件 3 j 電路基板 3 0 j 光束產生晶片 3 1 j 散熱元件 3 2 j 16 201044043 光束 L j [第十實施例] 可撓性光束導引薄膜 1 k 第一區段 A 光束反射元件 2 k 第二區段 B 光束產生元件 3 k [第十一實施例] 可撓性光束導引薄膜 1 m 光束反射元件 2 m 光束產生元件 3 m 光束產生晶片 31m 〇 17Beam generating element 3 b Beam Lb Keyboard module K [Third embodiment] Flexible beam guiding film 1 c Beam reflecting element 2 c Reflecting microstructure 2 0c Beam generating element 3 c Beam L c [Fourth embodiment] Flexible beam guiding film Id beam reflecting element 2d beam generating element 3d circuit substrate 3 0 d bottom 3 0 0 beam generating wafer 3 1 d beam L d [fifth embodiment] flexible beam guiding film 1 e heat dissipation Hole 10 e Beam reflecting element 2 e Beam generating element 3 e Circuit board 3 0 e Bottom 3 0 0 Beam generating wafer 3 1 e Beam L e [Sixth embodiment] Flexible beam guiding film If heat sink 1 0 f Heat sink Ilf Beam reflecting element 2 f 15 201044043 Beam generating element 3 f Circuit board 3 0 f Beam generating wafer 3 1 f Beam L f [Seventh embodiment] Flexible beam guiding film 1 g Beam reflecting element 2 g Beam generating element 3 g Circuit board 3 0 g Beam generating chip 3 1 g Heat dissipating element 3 2 g Bottom 3 2 0 g Beam L g [No. Example] Flexible Beam Guide Film 1 h Heat Sink 1 0 h Beam Reflecting Element 2 h Beam Generating Element 3 h Circuit Board 3 0 h Beam Generating Chip 3 1 h Heat Dissipating Element 3 2 h Bottom 3 2 0 h Beam L h [Ninth embodiment] Flexible beam guiding film 1 j louver 1 0 j heat sink 1 1 j beam reflecting element 2 j beam generating element 3 j circuit substrate 3 0 j beam generating wafer 3 1 j heat dissipating element 3 2 j 16 201044043 Light beam L j [Tenth embodiment] Flexible beam guiding film 1 k First section A Beam reflecting element 2 k Second section B Beam generating element 3 k [Eleventh embodiment] Flexible beam guiding film 1 m beam reflecting element 2 m beam generating element 3 m beam generating chip 31m 〇17