CN101752473B - Photoelectric element packaging structure, photoelectric element module and outdoor billboard - Google Patents
Photoelectric element packaging structure, photoelectric element module and outdoor billboard Download PDFInfo
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- CN101752473B CN101752473B CN2008101852060A CN200810185206A CN101752473B CN 101752473 B CN101752473 B CN 101752473B CN 2008101852060 A CN2008101852060 A CN 2008101852060A CN 200810185206 A CN200810185206 A CN 200810185206A CN 101752473 B CN101752473 B CN 101752473B
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Abstract
The invention discloses a photoelectric element packaging structure capable of generating multiple colors, a photoelectric element module and an outdoor billboard. The photoelectric element packaging structure comprises a transparent carrier, a circuit layer positioned on the transparent carrier, a photoelectric element which is positioned on the transparent carrier, is electrically connected with the circuit layer and is capable of emitting a first wavelength, a first wavelength conversion structure positioned on the side wall of the photoelectric element, a reflecting layer positioned on the first wavelength conversion structure, and a transparent packaging material positioned on the reflecting layer and the photoelectric element.
Description
Technical field
The present invention relates to a kind of optoelectronic component encapsulation construction that produces multiple coloured light, photoelectric element module and the billboards of double-sided display information function simultaneously.
Background technology
Led technology is advanced by leaps and bounds in recent years, and its improved efficiency speed is out of expection, and the price required along with unit brightness constantly reduces, and it has been within sight that light-emitting diode is applied to illumination.And illumination has diversified demand; Comprise that mainly the open air makes scape and room lighting; Because light-emitting diode has photochromic protean characteristic; So colorful also is the first impression that light-emitting diode is given the people, how with the advantage mass efficient of light-emitting diode be applied to the traditional lighting design, will be the key that light-emitting diode gets into lighting field.
Generally, must use the polychrome chip to do arrangement, so make chip use many whiles of quantitative change also let the circuit design relative complex, virtually cost improved manyly, cause the entering obstacle of light-emitting diode application in order to have polychrome performance.
Summary of the invention
The present invention provides a kind of heterogeneous light optoelectronic component encapsulation construction that produces, and support plate wherein is transparent support plate, and forms circuit layer on first plane of transparent support plate.
The present invention provides a kind of heterogeneous light optoelectronic component encapsulation construction that produces, and wherein has the photoelectric cell that can send first wavelength on first plane of transparent support plate, and photoelectric cell and circuit layer electrically connect.
The present invention provides a kind of heterogeneous light optoelectronic component encapsulation construction that produces, and wherein the light of first wavelength can be blue light.
The present invention provides a kind of heterogeneous light optoelectronic component encapsulation construction that produces, and wherein the photoelectric cell sidewall has first Wavelength transformational structure, and its light that can make the photoelectric cell side direction send first wavelength converts the light of second wavelength into.
The present invention provides a kind of heterogeneous light optoelectronic component encapsulation construction that produces, and wherein the light of second wavelength can be white light.
The present invention provides a kind of heterogeneous light optoelectronic component encapsulation construction that produces, and wherein has the reflector on first Wavelength transformational structure, and it can make light reflected back first Wavelength transformational structure of second wavelength, and in transparency carrier second planar light extracting.
The present invention provides a kind of heterogeneous light optoelectronic component encapsulation construction that produces, and wherein on reflector and photoelectric cell, has transparent encapsulation material, makes the light of the wavelength of winning pass transparent encapsulation material and bright dipping.
The present invention provides a kind of heterogeneous light optoelectronic component encapsulation construction that produces; Wherein between reflector, photoelectric cell and transparent encapsulation material, also have second Wavelength transformational structure, its light that can make photoelectric cell send first wavelength produces the light of three-wavelength through second Wavelength transformational structure.
The present invention provides a kind of heterogeneous light optoelectronic component encapsulation construction that produces, and wherein the light of first wavelength can be ultraviolet light, and the light of three-wavelength can be blue light.
The present invention provides a kind of heterogeneous light optoelectronic component encapsulation construction that produces, and can form a kind of heterogeneous light photoelectric element module that produces by it.
The present invention provides a kind of heterogeneous light optoelectronic component encapsulation construction that produces, and can form a kind of billboards of the function of double-sided display information simultaneously by it.
Description of drawings
Fig. 1～Fig. 6 describes the technology of first embodiment of the invention luminous element packing structure 100.
Fig. 7 describes the light bright dipping figure of first embodiment of the invention luminous element packing structure 100.
Fig. 8～Figure 14 describes the technology of second embodiment of the invention luminous element packing structure 200.
Figure 15 describes the light bright dipping figure of second embodiment of the invention luminous element packing structure 200.
Description of reference numerals
11: transparent support plate
11a: transparent support plate first plane
11b: transparent support plate second plane
12: circuit layer
13: blue light-emitting diode
14: electrically connect mechanism
15: the first Wavelength transformational structures
16: the reflector
17: transparent encapsulation material
18: Cutting Road
19: ultraviolet light-emitting diodes
20: the second Wavelength transformational structures
100,200: optoelectronic component encapsulation construction
λ
1: the light of first wavelength
λ
2: the light of second wavelength
λ
3: the light of three-wavelength
Embodiment
The present invention discloses a kind of optoelectronic component encapsulation construction and manufacturing approach thereof that produces multiple coloured light.In order to make narration of the present invention more detailed and complete, can be with reference to the accompanying drawing of following description and cooperation Fig. 1 to Figure 15.
The embodiment of the invention one produce multiple coloured light optoelectronic component encapsulation construction 100 and manufacturing approach thereof such as Fig. 1 to shown in Figure 6.As shown in Figure 1, transparent support plate 11 is provided, it has the first plane 11a and the second plane 11b, and forms circuit layer 12 on the first plane 11a of transparent support plate.Blue light-emitting diode 13 with the tool transparency carrier is fixed on the first plane 11a of transparent support plate 11 respectively, through electrically connect mechanism 14 blue light-emitting diode is engaged with circuit layer 12, and is as shown in Figure 2.Form first Wavelength transformational structure 15 in the blue light-emitting diode sidewall, form one deck reflector 16 again on first Wavelength transformational structure 15, as shown in Figure 3.Wherein the blue light that sends of blue light-emitting diode sidewall converts white light to after through first Wavelength transformational structure 15, and through reflector 16 reflection back bright dippings by the transparent support plate second plane 11b.Again in the reflector 16 and blue light-emitting diode 13 tops form transparent encapsulation material 17, make blue light that blue light-emitting diode produced through this transparent encapsulation material and bright dipping is as shown in Figure 4., as shown in Figure 5 from transparent encapsulation material 17 from top to bottom to transparent support plate 11 formation Cutting Roads 18.Can form a plurality of multiple coloured light optoelectronic component encapsulation constructions 100 that produce along Cutting Road 18 cuttings, as shown in Figure 6.Fig. 7 is the light bright dipping figure of multiple coloured light optoelectronic component encapsulation construction 100.
The embodiment of the invention two produce multiple coloured light optoelectronic component encapsulation construction 200 and manufacturing approach thereof such as Fig. 8 to shown in Figure 14.As shown in Figure 8, transparent support plate 11 is provided, it has the first plane 11a and the second plane 11b, and forms circuit layer 12 on the first plane 11a of transparent support plate.Ultraviolet light-emitting diodes 19 with the tool transparency carrier is fixed on the first plane 11a of transparent support plate 11 respectively, through electrically connect mechanism 14 ultraviolet light-emitting diodes is engaged with circuit layer 12, and is as shown in Figure 9.Form first Wavelength transformational structure 15 in the ultraviolet light-emitting diodes sidewall, form one deck reflector 16 again on first Wavelength transformational structure 15, shown in figure 10.Wherein the ultraviolet light that sends of ultraviolet light-emitting diodes sidewall converts white light to after through first Wavelength transformational structure 15, and through reflector 16 reflection back bright dippings by the transparent support plate second plane 11b.In the reflector 16 and ultraviolet light-emitting diodes 19 tops form second Wavelength transformational structure 20, shown in figure 11.On second Wavelength transformational structure 20, form transparent encapsulation material 17 again, shown in figure 12.The ultraviolet light that ultraviolet light-emitting diodes 19 is produced converts blue light to after through second Wavelength transformational structure 20, and through transparent encapsulation material 17 and bright dipping., shown in figure 13 from transparent encapsulation material 17 from top to bottom to transparent support plate 11 formation Cutting Roads 18.Can form a plurality of multiple coloured light optoelectronic component encapsulation constructions 200 that produce along Cutting Road 18 cuttings, shown in figure 14.Figure 15 is the light bright dipping figure of multiple coloured light optoelectronic component encapsulation construction 200.
The present invention provides and can produce heterogeneous light optoelectronic component encapsulation construction 100 and 200, can form a kind of heterogeneous light photoelectric element module that produces by it.Utilization can produce the billboards that heterogeneous light photoelectric element module also can be formed a kind of function of double-sided display information simultaneously.
The embodiment that more than provides is in order to description different techniques characteristic of the present invention, but according to notion of the present invention, it can comprise or apply to technical scope widely.It is noted that; Embodiment is only in order to disclose the ad hoc approach of technology of the present invention, device, composition, manufacturing and use, not in order to limit the present invention, any persons skilled in the art; Do not breaking away from the spirit and scope of the present invention, when doing a little change and retouching.Therefore, protection scope of the present invention is as the criterion when looking appended the claim person of defining.
Claims (9)
1. optoelectronic component encapsulation construction that produces multiple coloured light comprises:
Transparent support plate has first plane and second plane;
Circuit layer is formed on first plane of this transparent support plate;
The photoelectric cell that sends first wavelength is formed on this transparent support plate, and with this circuit layer electrically connect;
First Wavelength transformational structure is positioned at the sidewall of this photoelectric cell, and wherein this first Wavelength transformational structure makes the light of this first wavelength that this photoelectric cell side direction sends convert the light of second wavelength into;
The reflector is formed at this first Wavelength transformational structure top, and wherein this reflector makes this first Wavelength transformational structure of light reflected back of this second wavelength, at second planar light extracting of this transparent support plate; And
Transparent encapsulation material is formed at this reflector and this photoelectric cell top, makes the light of this first wavelength pass this transparent encapsulation material and bright dipping.
2. the optoelectronic component encapsulation construction of the multiple coloured light of generation as claimed in claim 1, wherein the light of this first wavelength is blue light.
3. the optoelectronic component encapsulation construction of the multiple coloured light of generation as claimed in claim 1, wherein the light of this second wavelength is white light.
4. optoelectronic component encapsulation construction that produces multiple coloured light comprises:
Transparent support plate has first plane and second plane;
Circuit layer is formed on first plane of this transparent support plate;
Send the photoelectric cell of first wavelength, be formed on this transparent support plate, and with this circuit layer electrically connect;
First Wavelength transformational structure is positioned at the sidewall of this photoelectric cell, and wherein this first Wavelength transformational structure makes the light of this first wavelength that this photoelectric cell side direction sends convert the light of second wavelength into;
The reflector is formed at this first Wavelength transformational structure top, and wherein this reflector makes this first Wavelength transformational structure of light reflected back of second wavelength that this first Wavelength transformational structure produces, at second planar light extracting of this transparent support plate;
Second Wavelength transformational structure is positioned at this reflector and this photoelectric cell top, and wherein this second Wavelength transformational structure light of making this photoelectric cell send first wavelength produces the light of three-wavelength through this second Wavelength transformational structure; And
Transparent encapsulation material is formed at this second Wavelength transformational structure top, makes the light of this three-wavelength pass this transparent encapsulation material and bright dipping.
5. the optoelectronic component encapsulation construction of the multiple coloured light of generation as claimed in claim 4, wherein the light of this first wavelength is ultraviolet light.
6. the optoelectronic component encapsulation construction of the multiple coloured light of generation as claimed in claim 4, wherein the light of this second wavelength is white light.
7. the optoelectronic component encapsulation construction of the multiple coloured light of generation as claimed in claim 5, wherein the light of this three-wavelength is blue light.
8. a photoelectric element module that produces multiple coloured light comprises the optoelectronic component encapsulation construction like the multiple coloured light of one of them described generation of claim 1 to 7 at least.
9. the billboards of a while double-sided display information function comprises the optoelectronic component encapsulation construction like the multiple coloured light of one of them described generation of claim 1 to 7 at least.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2008101852060A CN101752473B (en) | 2008-12-18 | 2008-12-18 | Photoelectric element packaging structure, photoelectric element module and outdoor billboard |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2008101852060A CN101752473B (en) | 2008-12-18 | 2008-12-18 | Photoelectric element packaging structure, photoelectric element module and outdoor billboard |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN101752473A CN101752473A (en) | 2010-06-23 |
| CN101752473B true CN101752473B (en) | 2012-07-04 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2008101852060A Active CN101752473B (en) | 2008-12-18 | 2008-12-18 | Photoelectric element packaging structure, photoelectric element module and outdoor billboard |
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| CN (1) | CN101752473B (en) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102569597A (en) * | 2011-08-20 | 2012-07-11 | 中国科学院福建物质结构研究所 | LED (Light Emitting Diode) packaging structure using rear earth element doped transparent ceramic as base |
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2008
- 2008-12-18 CN CN2008101852060A patent/CN101752473B/en active Active
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| Publication number | Publication date |
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| CN101752473A (en) | 2010-06-23 |
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