201042721 -六、發明說明： •【發明所屬之技術領域】 戶識種可同時-次將數個用 【先前技術】 、卜時期之晶粒只是—般使用點焊方式將其111定於電路板 '電面並無使用任何保護物體或是膜，而使該 因，期使用產生熱度下，使得該晶粒易發生脆裂或易破等情形 ，因此，各個廠商紛紛開始研發如何強化晶粒的強度 〇易脆裂或易破等情形。 ㈣強|使其不會發生 諸廠商所研發之解決問題’以目前來說由各個晶粒上表面 ===細㈣麵娜，树止該晶粒發 然上述保護膜於使㈣，為確實存在下觸題與缺失尚待改進： 該保護膜雖具有防護積體電路（J C)之功效，但，相關技術 者於對該積㈣路（I C)塗佈保護断，必須各個分別塗佈，長期塗 ，下則不僅浪費掉許多時間，且生產競爭力則無法提升，以及成本居 ifj不下等問題。 ❹ f一習知技術係將晶粒設於一用戶識別卡組上，而該晶粒係已密 封保護’再制戶識別卡組可與—用戶卡(SIM)做結合，而該用戶卡 (SIM)上係界定有一穿孔，該穿孔係與該晶粒相對應，俾當使用者欲 ，該用戶識別卡組_戶卡(SIM)結合時，可直接將其附上，同時該 晶粒置入該穿孔内，藉此達到該用戶識別卡組與該用戶卡(SIM)結合 〇 然上述用戶識別卡組與該用戶卡(Sim)結合於使用時，為確實存 在下列問題與缺失尚待改進： 該用戶識別卡與該用戶卡(SIM)結合時，該用戶識別卡必須藉由 穿孔的設置才能與該用戶卡(SIM)結合，若無穿孔之設置則亦發生該 用戶卡(SIM)翹邊情況，而發生此情況後則無法於手機内置放，非常 3 201042721 之不便。 是以，要如何解決上述習用之問題與 與從事此行㈣嶋峨職卩;^㈣之發明人 【發明内容】 方，明鑑於上述缺失，乃搜集相關資料，經由多 種可同時—次將數個用戶識別卡組之晶粒封膠S 膜覆晶封膠之製程的發明專利者。 ，町釈 f 本發明之主要目的在於：錄賴晶封膠_於傾用戶識 、，且上經由軟膜覆asa(Flip Chip)触後之晶粒(裸晶），並且可 -個或數個晶粒進行密封，其主要包括有一板體及一膠質，該板體二 表面係界定有至少-面積大於該晶粒之穿孔，且該？孔係與該等晶粒 相對應’而於該板體上健蓋有該膠質，該膠⑽供保護該等晶粒用 ，巧當相關技術領域人員欲將該用戶識別卡組上之晶粒披覆該膠質時 藉由該板體將其覆盘於該用戶識別卡組上，同時該等穿孔與該等晶 粒相對應，而後將該膠質利用印刷機或平面器具塗佈覆蓋於該板體: ，，且該膠質則填滿該等穿孔，亦達到於該等晶粒周圍覆蓋具有保護 膜態樣之膠質，而經一預定時間後移離該板體，再將用戶識別卡組（ 軟膜）置入烤相使膠質固化則完成該覆晶封膠的密封；藉由上述技術 ，可針對習用保護膜所存在之該保護膜雖具有防護晶粒之功效，但， 相關技術領域者於對該晶粒塗佈保護膜時，必須各個分別塗佈，長期 塗佈下則不僅浪費掉許多時間，且生產競爭力則無法提升，以及成本 居高不下的問題點加以突破，以及針對另一習用用戶識別卡組與該 用戶卡(SIM)結合於使用時’該用戶識別卡必須藉由穿孔的設置才能 與該用戶卡(SIM)結合，若無穿孔之設置則亦發生該用戶卡(SIM)翹邊 情況’而發生此情況後則無法於手機内置放，非常之不便的問題點加 以突破’達到強化該晶粒之堅固性及防止脆裂，並且覆蓋一次即完成 該等晶粒之封膠，無需各個分別上膠，以及，達到省時、省力、省成 本之特性，再者，相關領域之技術人員亦可控制該板體之厚度，且上 201042721 • ^:而針對另一習_，本創作用戶識別卡組 ..戶卡(sfM==二=，本創作之晶粒係為超薄裸晶，使該用 結合後不會產生龜邊情況之進步性打…亥用戶識別卡組相結合，且 【實施方式】 的及功效’本發贿採狀技術手段及構造，茲繪 ί^ΐϊ例詳加翻其特徵與功能如下，俾利完全了解 中可ΐ**看’係為本發明較佳實施例之步驟流程圖，由圖 Ο Ο #曰曰粒，而該晶粒係為超_晶粒，且為裸晶；其主要步驟流程如 (a 具有至少-面積大於該晶粒的穿孔之板體將其覆蓋 3等用戶識別卡組上，且該等用戶朗卡 性材質之軟膜； ^ 5 b ；)同時該等穿孔係分別與該等晶粒相互對應； (c)再將一膠質塗佈於該板體上； (d ^於塗佈同時該膠質則透過該穿孔將該等晶粒密封；及 以再將該板體與該用戶識別卡組（軟膜）分離後； ()再將該用戶識別卡.组（軟膜）置入烤箱使膠質固化即完 該封膠製程。 係可述之板體係進—步可為鋼板，且塗佈於該板體上之膠質 佈前係可於該晶粒周圍進—步塗佈有絕緣層，而 二:^塗?該板體上時因為該板體之厚度係大於該晶粒之厚度，且 二私山、可：不f態樣’因此’該晶粒可完整被該谬質所密封，同時 同日^㈣ί I1之態?1並且’上述膠質於塗佈覆蓋於該板體上時亦可 ϋ H、# Ba粒進行密封封裝進一步可透過印刷機將其覆蓋於該 具將其覆餘雜體上，辭―麟可為刮刀 明參閱第二圖、第二入圖、第二⑽、第二C圖及第二D圖所示 5 201042721 ，係為本發明較佳實施例之剖視圖、立立 一 圖一、二，由圖中可清楚看出本發明係用於伴^ ^圖及實施示意 之晶粒1 〇 i，且可同時對一個』個識別卡組1 0上 1係為超薄型晶粒，且為裸晶，封’而該晶粒1 〇 成，其包括有： x戶識別卡組10係由軟膜所構 表面戶識別卡組10上’係於 穿孔2 0 1，而該板體2 〇係:粒1 0 1相對應之 一膠質3 0，係覆蓋於該鋼板丄及 ，其中該膠質3 0係可為軟膜膠。 ’且⑥、封於該等穿孔2 01 r ^度:=====〇上時，其該板體 晶粒1 0 1，使該膠質3 ◦於高於該 密封該晶粒1 〇 1。 具兩茨穿孔2 0 1½•亦可有效完整覆蓋 意圖?同=3冗=圖=2為本發明較佳實施例之實施示 L 數_戶崎組⑴上之晶粒^ 覆蓋膠質時可同時對多個曰二分，應該等晶粒1 〇 1 a，於 時配合參閱第-D圖ί ΐ101a進行封裝密封者。又者，請同 對-個設於用戶識別體2，上之穿孔2 〇 1 b不僅只能一 蓋數個設於一用戶識別卡=曰曰粒1 〇 1 a，係進-步可同時覆 需求枝並且具有省時省成本之^ 1◦1b ’達到一對多的 ，係^二、第三圖、第四圖、第五圖及第六圖所示 楚看出，該圖及動作示意圖一〜四’由圖中可清 1，該用戶識別卡組1=用於保瘦用戶識別卡組10上之晶粒1〇 該晶粒101係為裸i 1係為超_晶粒1 〇 1，且 面係界定有至少-面主要包括有—板體2 〇 ’該板體2 0於表 積大於該晶粒1〇1之穿孔2 01，且該穿孔2 6 201042721 ο ·〇 1係與該等晶粒1 0 1相對應，而於該板體2 〇上係覆蓋有一膠質 3 0 ’該膠質3 〇係供保護該等晶粒1〇1用，再者，於該晶粒1〇 -1周圍係塗佈有絕緣層4〇 ’該絕緣層4〇係可防止該晶粒1〇1腳 位因外界因素而導致短路；藉此，俾當相關技術領域人員欲對該用戶 識別卡組1〇上之晶粒1〇1披覆該膠質3 0時，首先將該晶粒1〇 j於腳位周圍塗佈一絕緣層4 〇，再將該板體2 〇覆蓋於該用戶識別 :組1,0上，並且該板體2 〇上之穿孔2 〇 ；[與該等晶粒i i相對 ^二，，於該板體2 〇上係可進—步透過—印刷機將其覆蓋於該板體 ?2亡ί透過—平面器具（該平面器具係可為刮刀或任—刀具之-者 )覆蓋於該板體2 〇上，並且該膠質3⑽填滿該等洞口 2 〇工 诚、箱=該等晶粒1◦1周圍覆蓋具有保護膜態樣之踢質3 0，而 後Γ該板體2 ◦，再將軟膜置人烤箱使谬質固化則完 /目關技術領域人員亦可藉由該板體2 0不同之 0制f f於該晶粒1 0 1的膠質3 0厚度，且該穿孔2 亦可有=狀或大小態樣，達到_3◦所密封之大小形狀201042721 -6, invention description: • [Technical field of invention] Household knowledge can be used several times at the same time [previous technology], the grain of the period is only used to spot 111 on the board 'The electric surface does not use any protective objects or membranes, so the cause, the use of heat, makes the crystals susceptible to brittle cracking or breakage. Therefore, various manufacturers have begun to develop how to strengthen the grain. The strength is easily brittle or easily broken. (4) Strong|so that it will not solve the problem solved by the manufacturers'. At present, the upper surface of each crystal grain ===fine (four) face, the tree is stopped, and the above protective film is used to make (4) There are still some problems in the existence of the touch and the missing: The protective film has the effect of protecting the integrated circuit (JC), but the relevant technical person must apply the separate coatings to the protective coating of the product (IC). Long-term coating, not only waste a lot of time, and the production competitiveness can not be improved, and the cost is not the same as if. ❹ f a conventional technology is to set the die on a user identification card set, and the die is sealed and protected. The remanufacturer identification card group can be combined with the user card (SIM), and the user card ( The SIM) defines a perforation corresponding to the die. When the user wants to use the user identification card group (SIM), the user can directly attach it, and the die is placed. Entering the perforation, thereby achieving the combination of the user identification card group and the user card (SIM). When the user identification card group is combined with the user card (Sim), the following problems and defects are still needed to be improved. : When the user identification card is combined with the user card (SIM), the user identification card must be combined with the user card (SIM) by the setting of the punch, and the user card (SIM) is also generated if there is no punch setting. In the case of the situation, after this happens, it cannot be built in the phone, which is very inconvenient for 3, 2010,427. Therefore, how to solve the above-mentioned problems and the inventors of the company (4) 嶋峨 卩; ^ (4) [inventory content] Fang, in view of the above-mentioned missing, is to collect relevant information, through a variety of simultaneous - times The invention patent of the process of the crystal sealant S film fusing sealant of the user identification card group. , 釈 釈 f The main purpose of the present invention is to: record the crystal sealant _ _ user knowledge, and through the soft film covered asa (Flip Chip) after the touch of the grain (bare crystal), and can be - or several The die is sealed, and mainly comprises a plate body and a gel. The two surfaces of the plate body define at least a hole having a larger area than the die, and the? The hole system corresponds to the crystal grains, and the glue is covered on the plate body, and the glue (10) is used for protecting the crystal grains, and the person skilled in the art wants to identify the crystal grains on the card group. When the gel is applied, the plate is coated on the user identification card set, and the perforations correspond to the crystal grains, and then the glue is coated on the plate by using a printing machine or a flat tool. Body: , and the gel fills the perforations, and the glue is covered around the crystal grains with a protective film state, and after a predetermined time, the plate body is removed, and then the user identification card group is The soft film is placed in the baking phase to solidify the gel to complete the sealing of the flip chip seal; the above-mentioned technology can protect the film from the protective film, although the protective film has the effect of protecting the crystal grains, but the related art When the protective film is coated on the die, it must be separately coated, and long-term coating not only wastes a lot of time, but also the production competitiveness cannot be improved, and the problem of high cost is broken, and another Custom user identification card When combined with the user card (SIM), the user identification card must be combined with the user card (SIM) by a perforation setting. If there is no perforation setting, the user card (SIM) warping condition also occurs. After this happens, it can't be built into the mobile phone, and the problem is very difficult to break through. It can strengthen the robustness of the die and prevent brittle cracking, and complete the sealing of the die once without covering each other. Gluing, and, to achieve time-saving, labor-saving, cost-saving characteristics, in addition, the technical personnel in the relevant field can also control the thickness of the plate, and on the 201042721 • ^: and for another study _, the author of this creation Card group: household card (sfM==two=, the grain of the creation is ultra-thin bare crystal, so that the combination does not produce the progress of the turtle edge situation, the combination of the user identification card group, and [Embodiment] and the efficacy of this bribe mining technology and structure, the paintings and details of the details and functions are as follows, 俾利 fully understand the Chinese ΐ ** see ' is better for the invention Flow chart of the steps of the embodiment, by Figure Ο Ο #曰Granules, and the crystallites are super-grain and are bare crystals; the main steps of the process are as follows: (a has at least - a plate having a larger area than the perforations of the die, which covers the user identification card set such as 3, and a soft film of the user's Langka material; ^ 5 b ;) at the same time, the perforations respectively correspond to the crystal grains; (c) applying a gel to the plate; (d ^ coating At the same time, the gel is sealed through the perforations; and the board is separated from the user identification card set (soft film); () the user identification card group (soft film) is placed in the oven. The gel curing process completes the sealing process. The plate system can be described as a steel plate, and the rubber cloth coated on the plate body can be coated with an insulating layer around the grain. And two: ^ coating on the board because the thickness of the plate is greater than the thickness of the die, and the two private mountains, can: not f state 'so 'the grain can be completely sealed by the enamel At the same time, the same day ^ (four) ί I1 state? 1 and 'the above-mentioned gel can be sealed and encapsulated when the coating is coated on the plate body. The step can be covered by the printing machine to cover the remaining body. The word "Lin" can be referred to as the second figure, the second picture, the second (10), the second C picture and the second D picture. 5 201042721, which is a cross-sectional view of a preferred embodiment of the present invention, and a figure 1 and 2, which are clearly seen in the accompanying drawings, and the present invention is applied to the accompanying figure and the illustrated die 1 〇i, and At the same time, one of the identification card sets 10 is an ultra-thin crystal grain, and is a bare crystal, and the crystal grain 1 is formed, which includes: x household identification card group 10 is composed of a soft film The surface-receiving household identification card group 10 is 'attached to the perforation 200, and the plate body 2 is: the particle 1 0 1 corresponds to one of the colloids 30, covering the steel plate and the colloidal 3 0 system. Can be a soft film glue. 'And 6, sealed in the perforation 2 01 r ^ degrees: ===== 〇, the plate grain 1 0 1, the glue 3 ◦ above the sealing of the grain 1 〇 1 . The two-piece perforation 2 0 11⁄2• can also effectively cover the entire intent. The same = 3 redundancy = Figure = 2 for the implementation of the preferred embodiment of the present invention L number _ the group of the Osaki group (1) can cover the glue at the same time For a plurality of bismuth dice, the dies 1 〇 1 a should be equalized, and the package is sealed with reference to the -D figure ΐ 101a. In addition, please be the same as the one set on the user identification body 2, the perforation 2 〇 1 b can not only be one cover and one set on one user identification card = 曰曰 grain 1 〇 1 a, the system can be simultaneously Covering the demand branch and having the time and cost savings ^ 1◦1b 'to achieve one-to-many, the system ^ 2, the third picture, the fourth picture, the fifth picture and the sixth picture show the Chu, the figure and the action The schematic diagrams 1 to 4' can be cleared from the figure, the user identification card group 1 = the crystal 1 on the thin-skin user identification card group 10, the crystal 101 is the bare i 1 system is super_die 1 〇 1 , and the face system defines at least a face mainly includes a plate body 2 〇 'the plate body 20 is a perforation 2 01 whose surface product is larger than the crystal grain 1 〇 1 , and the perforation 2 6 201042721 ο · 〇 1 system Corresponding to the crystal grains 1 0 1 , and the plate body 2 is covered with a colloid 3 0 'the gel 3 lanthanum for protecting the crystal grains 1 〇 1 , and further, the crystal grains 1 The periphery of the crucible-1 is coated with an insulating layer 4'', which prevents the short-circuit of the die 1〇1 from being caused by external factors; thereby, the person skilled in the relevant art wants to identify the user. Card group 1 When the die 1〇1 covers the colloid 30, the die 1首先 is first coated with an insulating layer 4〇 around the pin, and the plate 22 is covered by the user identification: group 1,0 And the perforation 2 〇 on the plate body 2; [relative to the two dies ii, the plate body 2 can be advanced through the printing machine to cover the plate body? 2 ί ί — 平面 平面 平面 平面 平面 平面 平面 平面 平面 平面 平面 平面 平面 平面 平面 平面 平面 平面 平面 平面 平面 平面 平面 平面 平面 平面 平面 平面 平面 平面 平面 平面 平面 平面 平面 平面 平面 平面 平面 平面 平面 平面 平面 平面 平面 平面 平面 平面 平面 平面 平面 平面 平面 平面The die 1◦1 is covered with a protective film state of the kicking material 30, and then the plate body is 22, and then the soft film is placed in the oven to solidify the tannin, and the person skilled in the art can also use the board. The volume of the body 20 is different from the thickness of the glue 30 of the die 101, and the perforation 2 can also have a shape or a size to achieve a size of _3◦ sealed.
音圖請參閱第ί圖及第七_所示，係為本發明另—實施例之實施示 思圖-、二’由圖中可清楚看出，該 二《貫W 界定有-被膠質3 〇 c密封之晶粒工〇]5 : 10 C上於表面係The sound maps are shown in FIG. 1 and FIG. 7 , which are diagrams of the implementation of another embodiment of the present invention - and FIG. 2, which can be clearly seen from the figure. 〇c sealed grain work]5 : 10 C on the surface system
G 薄型晶粒l〇lc，於該用戶識g 曰曰粒l〇lc係為超 0 1 c面結合—用戶卡（s IM)，上係進—步可於晶粒1 :0表面係為完整之平面’藉此用戶、：’ (; I M) 與該!戶識別卡組1 〇 c結合，且不會產ggg)。5 〇可直接 於：疋以’本發明之軟膜覆晶封膠之製程為可改善二之技術關鍵在 達到強化該積體電路（J c)〗π 覆蓋-次即完成該等積體電路（ 堅固性及防止脆裂，並且 上膠，以及，達到省時、省力、省 〇1之封膠，無需各個分別 術人員亦可控制該板體2 〇之厚戶，f^性，再者，相關領域之技 再者，該晶粒係為超薄型晶粒 =狀亦可為多樣式。 且鄉f贿封該晶粒之表面係 7 201042721 為薄型態樣’俾使該用戶卡（s!M)可直接與該用戶識別卡組結合 ，且不會產生翹邊之情況，並且無須設置穿孔者。 - 惟’以上所述僅為本發明之較佳實施例而已，非因此即拘限 明，專利麵，故舉凡運用本發瓶明纽圖糾容所為之 ^ 及等效結觀化，均應同理包含於本發明之糊翻N， ^。 細上所述’本發明之軟膜覆晶封膠之製程於使用時 到其功效及目的，故本發明誠為-實用性優異 ;達 利之申請要件，爱依法提出申請，盼審委早發明專 發明人之辛苦發明，齡㈣局審委有任何^賜以保障 發明人定當竭力配合，實感公便。 w定明不吝來函指示， 201042721 【圖式簡單說明】 .第一圖係為本發明較佳實施例之步驟流程圖。 -第二圖係為本發明較佳實施例之剖視圖。 第一A圖係為本發明較佳實施例之立體圖。 ，二B圖係為本發明較佳實施例之局部示意圖。 第二C圖係為本發明較佳實施例之實施示意圖一。 巧二D圖係為本發明較佳實施例之實施示意圖二。 第三圖係為本發明較佳實施例之動作示意圖一。 ^四圖係為本發明較佳實施例之動作示意圖二。 第五圖係為本發明較佳實施例之動作示意圖三。 〇第六圖係為本發明較佳實施例之動作示意圖四。 第七圖係為本發明另一實施例之實施示意圖一。 第七A圖係為本發明另一實施例之實施示意圖二。 【主要元件符號說明】 〇 用戶識別卡組··· 晶粒··..... 板體....... 穿孔....... 膠質....... 絕緣層...... 用戶卡（S IM) · 1 〇、1 0 a、1 1 0 1、1 0 1 a 2 0 ' 2 0 a > 2 20 1 ' 20 1 a 3 0、3 0 c 40 5 0 0 b、1 〇 c 、101b、l〇lc Ob '201b 9G thin grain l〇lc, in this user know g 曰曰 granule l 〇 lc is super 0 1 c surface bonding - user card (s IM), the upper step can be on the surface of the grain 1:0 The complete plane 'by this user, :' (; IM) is combined with the household identification card group 1 〇c, and does not produce ggg). 5 〇 can be directly: 疋 ' ' 本 本 本 本 本 本 本 本 本 本 本 本 本 本 本 本 本 本 本 本 本 本 本 本 本 本 本 本 本 本 本 本 本 本 本 本 本 本 本 本 本 本 本 本 本 本 本Ruggedness and prevention of brittle cracking, and sizing, as well as saving time, effort, and saving the sealant, it is not necessary for the individual technicians to control the thick body of the board, f^, and, Further, in the related art, the grain system is ultra-thin crystal grain shape or multi-pattern. And the surface layer of the grain is sealed. 7 201042721 is a thin type of '俾使该 user card ( s!M) can be directly combined with the user identification card set without the occurrence of warping, and there is no need to provide a puncher. - Only the above description is only a preferred embodiment of the present invention, and therefore The invention is limited to the patent surface, so the use of the hair bottle to modify the image and the equivalent of the equivalent, should be similarly included in the paste of the present invention N, ^. The process of soft film flip-chip sealant is effective and practical in use, so the invention is excellent-utility; Dali Apply for the requirements, love to apply in accordance with the law, and hope that the trial committee invented the inventor's hard work, the age (four) bureau review committee has any ^ to protect the inventor to do their best to cooperate, feel the public. w Mingming letter, 201042721 [ BRIEF DESCRIPTION OF THE DRAWINGS The first drawing is a flow chart of a preferred embodiment of the present invention. The second drawing is a cross-sectional view of a preferred embodiment of the present invention. The first A is a preferred embodiment of the present invention. 2B is a partial schematic view of a preferred embodiment of the present invention. The second C is a schematic diagram of the preferred embodiment of the present invention. The second diagram is a schematic diagram of the implementation of the preferred embodiment of the present invention. The third embodiment is a schematic diagram of the operation of the preferred embodiment of the present invention. The fourth diagram is the second schematic diagram of the operation of the preferred embodiment of the present invention. Figure 6 is a schematic view of the operation of a preferred embodiment of the present invention. Figure 7 is a first embodiment of the present invention. Figure 7 is a second embodiment of the present invention. 【main Description of the symbols] 〇 User identification card group··· ......·... plate body............ perforation....... glue....... insulation layer.. .... User card (S IM) · 1 〇, 1 0 a, 1 1 0 1 , 1 0 1 a 2 0 ' 2 0 a > 2 20 1 ' 20 1 a 3 0, 3 0 c 40 5 0 0 b, 1 〇c, 101b, l〇lc Ob '201b 9