201041657 六、發明說明： 【發明所屬之技術領域】 本發明一般係關於製造電子裝置之方法。特定言之，為 關於連續塗佈液相層之方法與喷嘴裝置，其使用一用於具 低固體含量之液體混合物的特定喷嘴組件。 本專利申請案依據35 U.S.C. § 119(e)主張於2〇〇8年12月 27曰申請之臨時專利申請案第61/14〇,945號之優先權，其 以引用方式完整併入本說明書中。201041657 VI. Description of the Invention: TECHNICAL FIELD OF THE INVENTION The present invention generally relates to a method of manufacturing an electronic device. In particular, it is a method and nozzle apparatus for continuously coating a liquid phase layer using a specific nozzle assembly for a liquid mixture having a low solids content. This patent application is based on 35 USC § 119(e), the priority of which is hereby incorporated by reference in its entire entire entire entire entire entire entire entire entire entire entire entire entire entire entire entire entire entire entire entire entire entire entire entire in.
【先前技術】 於電子裝置使用活性有機分子日趨增多。這些活性有機 刀子具有電性質或電輻射性質，包含電致發光。併入有機 活性材料之電子裝置，可用以將電能轉換為輻射，且可包 含發光二極體、發光二極體顯示器或二極體雷射。 、習知用以製備有機發光二極體（〇LED)顯示器之兩種方 法為.真空沈積與液相加工(後者包含自液體，例如真溶 液’懸浮液，塗佈至層之所有形式。）真空沉積設備典型 地需高投資成本，但材料利用差(高操作成本)，因此液相 加工較佳’尤其是用於大面積顯示器。 用以沉積有機活性層之液相加工包含任意數目之㈣ 用以批基材上的層厚度。這些技術有些包含自控方月 =控厚纟’包含旋轉塗佈、棒塗佈、浸塗、輥塗抹、 ^或、平版或膠版印刷、網印塗佈或印刷等。 調控沉積厚度之技術為使用經調控沉積技術包含 墨㈣、喷塗、喷嘴塗佈、狹縫模具式塗佈、簾流塗佈 145642.doc 201041657 棒塗佈或斜板式塗佈等。 、雨2式技術有數種缺點。用於塗佈〇LED顯示器的液體 述起伏形貌之表面電極、接觸塾、薄膜電 ::體、由光阻形成之像素井、陰極間件結構等。由 術/儿積的濕層，其均句性取決於塗佈間隙及所得㈣分 佈，因此基材起伏形貌的變化造成濕沉積厚度產生不期二 發生的變4匕。自如r j 士分- . 、， 二uT 一般有具高操作成本之缺點，因為 並非所有基材上液靡的、、▽接 ⑥體均-積。-些液體在流體浴(例如浸 主）中’或在施用器、上（例如輥塗抹、凹板塗模）循環，或a 廢棄(例如旋轉塗佈)。溶劑自循環流體中揮發，故需調： 以保持加工穩定性。廢棄材料、循環及調整材料均增加 本。 八 +調控技術提供低操作成本。不過m形中，· 贺嘴之精密設備的磨損’導致其於乾燥時只有數奈米厚之 各層上調控不良。#密機械噴嘴的製造昂責，且提供嘴 陣列以涵盍大面積之基材區域將擴大調控問題。有機層的 不均句形成-般導致不佳的裝置效能，與裝 : 低產率。 對於OLED應用之有機材料之液相沉積的改良製程 有需求。 、巧 【發明内容】 於調控塗佈方法中’所有供應至塗佈噴嘴之液體係施用 至基材或工作件。平均濕塗佈厚度可根據塗佈液體之體積 流率、塗佈寬度與基材通過噴嘴之速度事先計算。流體性 145642.doc 201041657 例如黏度、表面張力）與外力（例如重力）可影響塗佈口 質，但不會影響平均濕厚度。對於調控塗佈方法的特別Ζ 人具興趣者為連續式喷嘴塗佈方法，特別是具有一碟二 至噴嘴主體末端凹陷處的電鑄製程。 Ο 〇 連、..Λ式f嘴操作具有多種變化，包含嘴嘴設計本身 片塗佈相對於連續式塗怖、條紋式塗佈與藉產生慶力以1白占 使流體離開嗔嘴的方法。連續式喷嘴塗佈—般為利用由^ 隙與基材與工作件隔開之喷嘴進行塗佈。 與喷嘴相關之典型厚度，#仍„，為數十微米等級， 且可乾燥為最終薄膜為數毫米等級。相對之下，以連續 喷嘴塗佈有機層製造〇LED顯示器，產生的層厚度典践 約〇.1至500奈米厚。需改良製程以於該等薄尺度 受的層效能。 ^接 由喷嘴發射之喷流（也稱作柱流（pi))的衰減，於乾燥 層内造成有機材料之不可接受的沉積與效能。當使用於嘖 :的配置時’ 16個噴嘴配置中之一個喷嘴噴流的衰減，可 ¥致不可接受的產物損失，此乃因大量裝置於配置操作中 ^行塗佈。於本發明揭露之一實施例，一電鑄碟可附接於 -喷嘴主體，以於喷流衰減到不可接受的參數時，可易於 更換碟。不必更換签個噴嘴組件，只有位於噴嘴末端之碟 需更換。 至少-實施例包含—噴嘴組件包含：主體，其含有—凹 區位於前述主體之末端，與具有位於中央之孔洞的碟。前 述孔洞為具有直L之孔洞，碟直徑則為~。此外，碟 145642.doc 201041657 之知·徵在於具有第一側與第二侧，其中前述之第一側附接 於前述主體上的凹區，第二側則具有孔洞位於一凹區内。 位於碟之第二側之凹區的直徑為A，其中心比七大。 於一實施例，孔洞的直徑dA小於或等於〇 〇5公釐。於另 —實施例，dA小於或等於0.01公釐。於另—實施例，‘為 於碟第一側與碟第二側之間變化。於另一實施例，在第一 側之心大於在第二側者。於另—實施例，半徑Q定義出一 位於第-與第二側間的孔洞表面。於一實施例，半徑小於 〇」〇5公釐。於另—實施例’半徑u小於請㈣。於另一 實施例，半徑rA小於〇.〇3公楚。 至少-實施例包含液相塗佈方法包含數步驟，例如提供 -主體’在1T述主體末端包含一凹區。提供一碟包含一位 於中央之孔洞，前述孔洞具有直徑為‘之孔洞，且碟具有 直徑dD、第-側與第二側。碟的第二側具有一孔洞位於直 徑為旬凹區中，其中碟直栌d 罝仫^大於心。碟的第一側附接於 主體的凹區以形成喷嘴級件，且提供含有液體與固體之混 合物。前述混合物被導向通過噴嘴組件以產生層。於一/奮 施例’該液體為有機溶劑。於另-實施例，該液體為水 於一實施例，混合物為且有伋狃马水。 、有低於10%固體含量之溶液，曰 於另一實施例，混合物A白人& 夜且 夜 為包含低於10%固體含量之懸浮 於一實施例，工作件包含 如玻璃)。術語「有機電子装：有機電子裝置之基材⑼ 置」’意指包含-個或多個時僅稱為「電子裝 如有機+導體層或材料之骏置。 145642.doc -6- 201041657 有機迅子I置包含，但不限於：（1)轉換電能為輻射能之裝 置（例如發光二極體、發光二極體顯示器、二極體雷射或 照明板），（2)利用電子程序偵測訊號之裝置（例如光偵檢 器、光導電池、光敏電阻器、光控開關、光電晶體、光 管、紅外線偵測器或生物感測器），(3)輻射能轉換為電能 之裝置（例如光伏裝置或太陽能電池）與（4)包含—個或多個 電子組件（其包含一個或多個有機半導體層）之裝置（例如電 Ο ❹ 晶體或二極體）’或上述（1)至（4)之裝置之任何組合。 【實施方式】 ' σ 包含有機發光二極體（0LED)之電子裝置之一例係示於 圖!且指定為1〇〇。該裝置具有陽極層11〇、緩衝層⑶、光 活靡〇與陰極層15〇。鄰近於陰極層15〇者為視需要之 1子-庄人/傳遞層14〇。於緩衝層12績総性層⑽為視 祐要之電洞-注入/傳遞層（未顯示）。 ==使用，術語「緩衝層」或「緩衝材料」為指電 ! X 料，且在有機電子襄置具有-種或多種功 :二限於底塗層平坦化、電荷傳遞與/或電荷注 入性貝、例如氧或金屬離子之雜質的清 改良㈣t+μ μ & ^ 及有利於或 4一 此的其他態樣。緩衝材料可為聚合 物、暴聚物或小分子，1 液、1制 /、形式可為溶液、分散液、懸浮 “1、膠體混合物或其他組 當指稱層、材料、組成㈣脖”，遽」 或結構有助於正電荷相 ；成 過該層、材料 Μ說具效率且電荷損失小而通 材科、組成或結構之厚度的遷移。術語「電子傳 145642.doc 201041657 遞」當指稱層、材料、組成或結構時，意指該層、材料、 組成或結構促進或有助於負電荷通過該層、材料、組成或 結構至另一層、材料、組成或έ 一 戈、，，〇構的遷移。術語「電洞注 入」當指稱層、材料、組成或結構時，意指該層、材料、 組成或結構有助於正電荷以相對來說具效率且電荷損失小 而通過該層、材料、組成或結構之厚度的遷移。術語厂電 子注入」田才曰稱層、材料、組成或結構時，意指該層、材 料、組成或結構有助於負電荷以相對來說具效率且電荷損 失小而通過該層、材料、組成或結構之厚度的遷移。 裝置可包含鄰近於陽極層11〇或陰極層15〇之一支持體或 基材（未顯示）。最常見者為此—支持體鄰近於陽極層ua〇。 該支持體可為可撓的或剛直的，有機的或無機的。一般來 說，使用玻璃或可撓性有機膜作為支持體。陽極層ιι〇為 電極，相較於陰極層150在電洞注入上更具效率。陽極材 料可包含金屬、混合金屬、合金、金屬氧化物或混合氧化 物。合適的材料包含第2族元素（例如鈹、鎂、鈣、勰、 鎖、错）’ W族元素、第4、5、6族與第8至1〇族過渡元 素之混合氧化物。當陽極層11〇為第12、13與14族之透光 (light transmitting)之混合氧化物時，可使用例如銦錫氧化 物。如於此所使用者，術語「混合氧化物」意指具有2種 或更多種選自第2族元素或第12、13或14族元素不同陽離 子之氧化物。一些非限制性之特定實例，關於陽極層u〇 材質包含，但不限於，銦錫氧化物（r IT〇」）、鋁錫氧化 物、金、銀、銅與鎳。陽極也可包含有機材料例如聚苯 145642.doc 201041657 胺、聚噻吩或聚吡咯。於此為使用國際化學會（IUPAC)命 名系統，其中週期表中的族為由左向右編號為1至18(CRC 化學與物理手冊（CRC Handbook of Chemistry and Physics)， 第 81版，2000)。 於一實施例，緩衝層120包含電洞傳遞材料。層120之電洞 傳遞材料實例已加以總結，例如（基爾克-歐特瑪化學工藝 百科全書（Kirk-Othmer Encyclopedia of Chemical Technology)， 第4版，第18冊，第837-860頁，1996，Y_ Wang。電洞傳 遞分子或聚合物均可使用。一般使用的電洞傳遞分子包括 但不限於：4,4'，4"-三（N，N-二苯基-胺基）-三苯基胺（4,4'，4"_ tris(N,N-diphenyl-amino)-triphenylamine, TDATA)、4,4'，4"-三 (N-3-甲基苯基-N-苯基-胺基）-三苯基胺（4,4'，4"-tris(N-3-methylphenyl-N-phenyl-amino)-triphenylamine, MTDATA)、 Ν,Ν’-二苯基-Ν,Ν'-雙（3-甲基苯基）-[1,1'-聯苯]-4,4’-二胺 (N,N'-diphenyl-N,N'-bis(3 -methylphenyl)-[ 1,1 '-biphenyl]-4,4'-diamine，TPD)、1,1-雙[(二-4-曱苯基胺基）苯基]環己 烧（l，l-bis[(di-4-tolylamino) phenyl]cyclohexane，TAPC)、 N，N’-雙（4-曱基苯基）-Ν,Ν’-雙（4-乙基苯基二甲 基）聯苯]-4,4’-二胺（>1，1^-1^(4-11^11}^1^]1丫1)-风1^'-1)丨3(4-ethylphenyl)-[l,l'-(3,3'-dimethyl)biphenyl]-4,4'-diamine，ETPD)、 四-(3-甲基苯基）-队队^'-2,5-伸苯基二胺〇61^匕3-(3-methylphenylj-N^jN'jN'-ljS-phenylenediamine, PDA) ' α-苯基-4-Ν，Ν-二苯基胺基苯乙烯（a-phenyl-4-N，N-diphenylaminostyrene，TPS)、對-(二乙基胺基）苯曱搭二苯 145642.doc 201041657 基腙（p-(diethylamino)benzaldehyde diphenylhydrazone，DEH)、 三苯基胺（triphenylamine, TPA)、雙[4-(N，N-二乙基胺基）- 2- 甲基苯基](4-曱基苯基）甲烷（1^[4-(队氺(1丨6化71&〇^11〇)-2-methylphenyl](4-methylphenyl)methane，MPMP)、1-苯基- 3- [對-(二乙基胺基）苯乙烯基]-5-[對-(二乙基胺基）苯]°比唑 口林（1 -phenyl-3-[p-(diethylamino)styryl]-5-[p-(diethylamino) phenyl] pyrazoline, PPR or DEASP) ' 1,2-反-雙（9H-口卡口坐-9-基）環丁烧（l，2-trans-bis(9H-carbazol-9-yl)cyclobutane, DCZB)、 Ν，Ν，Ν·，Ν·-四（4-曱基苯基）-(1,Γ-聯苯）-4,4’-二胺（队队>1·,；^-tetrakis(4-methylpheny 1)-(1,1 '-bipheny 1)-4,4'-diamine, TTB)、 N,N'-雙（萘-1-基）-Ν，Ν·-二-(苯基）聯苯胺（队>^-bis(naphthalen-l-yl)-N,N'-bis-(phenyl)benzidine, α-ΝΡΒ) ' 以及紫質（porphyrinic)化合物如銅S大菁。一般常用電洞傳 遞聚合物包含，但不限於，聚（9,9,-2辛基-苐-共-N-(4 -丁基 苯基）二苯基胺）(poly(9,9，-dioctyl-fluorene-co-N-(4-butylphenyl)diphenylamine)等、聚乙浠基0卡 °坐、（苯基甲 基）聚矽烷、聚（二氡基噻吩）、聚苯胺與聚吡咯。藉由將電 洞傳遞分子（例如前述者）摻雜至聚合物如聚苯乙烯與聚碳 酸酯中，亦可能獲得電洞傳遞聚合物。 光活性層130典型地為任何有機電致發光（EL)材料，包 含但不限於小分子有機螢光化合物、螢光與磷光金屬錯合 物、共概聚合物與其混合物。螢光化合物包含但不限於 芘、茈、紅螢稀、香豆素、其衍生物與其混合物。金屬錯 合物之實例包括但不限於金屬螯合類咢辛（oxinoid)化合 145642.doc -10- 201041657 物，例如參（8-經基啥琳）|呂（tris(8-hydroxyquinolato)aluminum, Alq3)、環金屬化（cyclometalated)銀與銘電致發光化合物，例 如銀與苯基 D比 D定(phenylpyridine)、.苯基啥琳（phenylquinoline) 或苯基。密咬（phenylpyrimidine)配體之錯合物，例如Petrov et al. 之美國第6,670,645專利與已公開之PCT第WO 03/063555及 WO 2004/016710號申請案所揭露，以及有機金屬錯合物， 例如於已公開之PCT第WO 03/008424、WO 03/09 1688及 WO 03/040257號申請案所述者及其混合物。電致發光發射 材料包含帶電主體材料與金屬錯合物，此已經於Thompson et al.之美國專利第6,303,238號與Burrows與Thompson之已 公開PCT申請案WO 00/70655與WO 01/41512中述及。共軛 聚合物之實例包含但不限於聚（苯乙烯）、聚第、聚（螺二 第）、聚噻吩、聚（對-伸苯）、其共聚物與其混合物。 特定材料為根據特定應用，操作中可能使用者，或其他 因素選擇。含有電致發光有機材料之EL層130，可使用包 含液相加工之任何技術予以施用。於另一實施例，可施用 EL聚合物前驅物，之後典型地藉由加熱或其他外界能源 (例如可見光或紫外光）轉化為聚合物。 視需要之層140可作用為電子注入/傳遞兩者，也可作為 侷限層以防止層間的淬火反應。更特定言之，層140可促 進電子移動率與降低若層130與150為直接接觸時之淬火反 應的可能性。用於視需要之層140材料之實例包含但不限 於金屬螯合類咢辛（oxinoid)化合物例如三（8-經喧琳）銘 (tris(8-hydroxyquinolato)aluminum, Alq3)、雙（2-曱基-8-喧 145642.doc 11 201041657 琳）（對苯基齡）銘（III) (bis(2-methyl-8-quinolinolato)(para-phenyl-phenolato)aluminum(III), BA1Q)、肆-(8-經基喧琳） 錄（IV) (tetrakis-(8-hydroxyquinolinato)zirconium (IV)，ZrQ); 與唑類（azole)化合物，例如2-(4-聯苯基）-5-(4-第三丁基苯 基）-1,3,4- °惡二唆（2-(4-1^卩11611>^1)-5-(4-1;-131^71卩1161171)-l，3,4-oxadiazole，PBD)、3-(4-聯苯基）-4-苯-5-(4-第三丁基 苯基）-1,2,4-三 σ坐(3-(4-biphenylyl)-4-phenyl-5-(4-t-butylphenyl)-l，2,4-triazole，TAZ)與 1,3,5-三（苯基-2-苯并咪唑） 苯（1,3,5_tri(phenyl-2-benzimidazole)benzene，TPBI);喧喏 啉（quinoxaline)衍生物，例如，2,3-雙（4-氟苯基）喹喏啉 (2,3-bis(4-fluorophenyl)quinoxaline);啡咯啉（phenanthrolines)， 例如，4,7-二苯基-1,10-啡洛琳（4,7-diphenyl-1,10-phenanthroline，DPA)與 2,9-二甲基-4,7-二苯基-ΐ，ι〇_ 啡咯啉 (2,9-dimethyl-4,7-diphenyl-l，l〇-phenanthroline，DDPA);與其 混合物。或者’視需要之層140可為無機的，且包含氧化 鋇、氟化鋰、氧化鋰等。 陰極層1 5 0為電極對於注入電子或負電荷載體特別有效 率。陰極層1 50可為具有與第一電接觸層相較（於本例中為 陽極層110)為較低功函數之任何金屬或非金屬。如於此所 使用，「低功函數」意指具有不高於約4·4電子伏特之功函 數之材料。如於此所使用，「高功函數」意指材料具有高 於約4.4電子伏特之功函數之材料。 陰極層材料可選自第一族鹼金屬（例如鋰、鈉、鉀、 铷、铯）、第二族金屬（例如鎂、妈、鎖等）、第12族金屬、 145642.doc •12- 201041657 鋼系（例如、飾、彭、銪等）與釣系（例如鉉、蚀等）。亦可 使用材料例如銘，銦，紀與其組合。陰極層15〇材料 疋非限制實例包含但不限於鋇、鐘、鈽、鉋、销、麵、 紀、鎮、釤與其合金與化合物。 ‘ a於其他實施例，額外層可存在於有機電子裝置内。例如 1於緩衝請與肌層130之層(未顯示)有利於正 ，、層的帶間隙配合、作為保護層等。相似的，介卿 〇 二與：極層150間的額外層(未顯示)有利於負電荷傳遞: 層的w曰1隙配合、作為保護層等。可使用本技術領域之習 =層。此外’任何上述層可為兩層或更多層所成者。或 所有或部份無機陽極層11()、緩衝層⑽、此層⑽語 層15G可為表面經處理的，以增加電荷載體傳遞效 ^母-成份層之材料選擇可藉由將提供具有高裝置效率 裝置與製造成本、製造複雜度或其他潛在因素之 以平衡而加以決定。 τ 〇 /同層可具有㈣適當厚度。於—實施例，無機陽極材 料110通常不大於約5〇〇奈米，例如，約1〇至2〇〇奈米 衝層120，一般為不大於約25〇奈乎 '、 不木例如約50至200奈 =’EL層13〇’ -般為不大於約⑽奈米例如⑽謂夺 視需要之層140 一般不大於約⑽奈米，例如約20至80 不未，與陰極層15〇, -般不大於約1〇〇奈米例如約工至 匕〇奈米。若陽極層110或陰極層15〇需要傳遞至少一些光， 這些層厚度不可超過約1〇〇奈米。 — 於有機發光二極體（〇LEDS)中，電子與電洞分別由陰極 145642.doc 13- 201041657 150與陽極11〇注入EL層13〇，於聚合物中形成帶負電與正 電之極性離子。這些極性離子受施加之電場影響遷移，形 成具有帶相反電荷物種之極性離子激發，且之後進行軤射 重組。陽極與陰極間具足夠能量差，通常可施加至裝=小 於約12伏特，於許多情況不大於5伏特。真正的能量差取 決於大型電元件中所使用裝置。於許多實施例中，操作電 子裝置時，陽極110偏壓至正電壓，且陰極層15〇實質地= 接地電位或零伏特。電池或其他供能裝置可以電連接至電 裝置作為線路之一部，但並未顯示於圖1。 圖2顯不碟200之一實施例。碟2〇〇具有第一側2⑽（參照 圖3)與第二側204。孔洞206通過碟200且於第二側2〇4具有 孔洞直徑dA。第二侧2〇4更包含凹區2〇8。凹區2〇8作為防 止喷流叉到因基材（未繪示）與噴嘴組件5〇2(參見圖勾間相 對運動所產生風的影響。一靜止區域形成於凹區以產 生較能調控之沉積條件。於本發明之—實施例，碟的直徑 D可為1 0公分或更低。於另一實施例，dD可為5公分或更 低。於另一孔洞實施例，直徑dA可為0 05公釐或更低。於 ^ —實施例’ dA可為〇.〇1公釐或更低。於另一實施例，凹 區之直徑d2可為l〇公釐或更低。於另一實施例，4可為 a藶或更低。tD/d2之比例為足以在凹區2〇8產生靜止 品或於貫把例，tD可為〇 〇5公釐且屯可為〇 5公釐。 么圖3顯示為碟200之邊視圖之一實施例，如沿著圖2之3-3 泉第表面202與第二表面204為碟厚度（表示為tD)所分 ]”中tD可為0·1公釐或更低。於本發明之一實施例，碟 145642.doc -14- 201041657 2又tD可為0·05公釐或更低。於另—實施例’實施例Η =3公㈣更低。於—孔洞之厚度實施例、可為5峨 “或更低。於一實施例，以可為1〇微米或更低。除非孔洞 的薄厚度造成失壓情況減輕，否則嘴流出口速度可以保持 喷机也不谷易碎裂為滴狀。這種實施例可用於沉積緩衝 層電何P早壁層、電荷注入層、電荷傳遞層、電致發光層 或其組合。 曰 Ο 〇 圖4顯示-實施例，主體包含凹區包含外緣部他金 開口例。碟200結合至主體彻其中第一表面2〇2為結合^ 外緣部402以形成噴嘴組件5〇2(如圖5所示）。結合可包含機 械結合例如扣件、夾件或其他機械工具、黏結、鮮接、鑄 造、溶接等。於一實施例，主體彻為銘且經錄塗佈 200以銲接方式接於主體4〇〇之凹區。其他材質與製程可以 在不改變本發明範圍下使用。例如，主體400之—末端可 不包含一凹區，碟細可以直接與主體働之—末端連而接 (未顯示）。 圖5表不一喷嘴組件5〇2之線型配置5〇〇的實施例，該配 置物500為線型結構包含共16個噴嘴組件5〇2，但可使用任 何數目’且均在本發明揭露範圍内。混合物傳遞通過賁嘴 組件，以提供在基材上經調控之沉積。混合物包含液體盘 固體材料以產生溶液、懸浮液、分散液、乳液 '膠體混合 物與其他组成物。液體可以為有機溶劑或水，如下述所討 論。固體可以為任何伸用於 °' 勹17便用於綾衝層120、EL層130或視需要 之層140之材質。 145642.doc -15. 201041657 數種變數使用於喷嘴塗佈製程中，以改良電子裝置的產 率與最終效能。塗佈間隙為200至800微米，塗佈速度為2 至10公尺/秒。混合物固體含量為2至15%、黏滞度為0.5至 1 〇厘泊（cp)，與表面張力為20至100 dynes/cm。 於另一實施例’液體混合物之黏滞度為大於5厘泊 (centipoise)。於另一實施例，液體混合物包含液體溶劑。 其中液體溶劑可包含兩種或更多種溶劑。於再一實施例， 溶劑知至少一者為水。 額外的設備可置入喷嘴組件502或與其一併使用，包含 容器與進料線與噴嘴組件502保持液體耦合，以容納任何 數目的成份’形成液相混合物。其他設備可包含任何一種 或多種之步進馬達、幫浦、過瀘、器、調控電子設備、其他 電子、機械或電子-機械組合或次組合、設備結合件或其 任何組合。 於塗佈操作，喷觜组件502内壓力範圍為約1〇〇至5〇〇千 帕。於一實施例，壓力保持恆定，且流動以質量流調控器 凋控。液體混合物自噴嘴組件5〇2離開之流速範圍可為5〇 至600(微升/分鐘p於另—實施例，可使用更高或更低壓 力，更高或更低流速或其任何組合。於閱讀說明書後，此 項技術領域中具有通常知識者可以調整或修改塗佈操作， 以得到其定應用所需之壓力與流速。 3.液體組成物 喷嘴組件5 02可用以沉藉久猫τ门u , /几積各種不同材料，包含液體溶 液。下述段落只包含部份並非斛古 W #所有可用材質。於一實施 145642.doc 201041657 例種或多種供電子裝置有機層使用材質係使用喷脅組 件502形成。 ' ’ 喷嘴組件5〇2適合用於印刷液體組成物。與傳統喷墨印 氣機裔比較，噴嘴組件5〇2可容忍廣範圍操作參數與液體 組成物。於-實施例，一種或多種參數可以影響液體組成 物之流速特徵。㈣度為可以影響流速特徵之參數。黏滯 度可以I由選擇液體介質、液體介質内固體含量、液體組 成之溫度或其他一種或多種潛在因素或其任何組合而受到 影響。黏滞度可直接受到溫度影響（液體介質黏滞度隨溫 度降低而升高’或隨溫度升高而降低）或間接為液體組成 中液體介質蒸散速率影響（例如使用具有較低或較高沸點 之液體介質、改變液體組成之溫度或其組合）。於閱讀本 說明書後，此項技術領域中具有通常知識者可思及使用其 他方式’容許顯著較大選擇性之液體介質、廣範圍之液體 組成内固體含量或其組合。 液體混合物可為溶液、分散液、乳劑或懸浮液。於下述 段落’提供固體材料與液體介質之非限制性實例。固體材 料可根據電子或電_性質選取，以應用於後續形成層。 液體介質可根據本說明書後述標準選取。 當使用噴嘴組件502，液體成份可大於約2_〇重量百分 比’而仍不茜要考慮於塞。於一實施例，固體含量範圍為 約2.0至3.0重量百分比。因此，與傳統喷墨印刷機相比 較，喷嘴組件5〇2可使用具有較高黏滞性或較低沸點之液 體組成物。此外，與傳統喷墨印刷機相比較，噴嘴組件 145642.doc -17- 201041657 外Λ/* ㈣性錢高彿點之㈣組成物。此 夕卜’邊成中的液體介質在印刷前不需要脫氣。例如， 用以在水溶液中分配傳導性有機材料之習知喷墨印刷機， 需要對水性溶劑脫氣。’然而，因為嘴嘴組件如容許更多 處理極限’自液體介質脫氣並非適當操㈣嘴 所必須。 使用贺嘴組件502印刷之有機層，可包含有機活性層（例 如輻射發射有機活性層或輻射反應有機活性層卜過滤 層、緩衝層、電荷注入層、電荷傳遞層、電荷阻障層或其 任何組合。有機層可以用作電阻、電晶體、電容器、二極 體等之一部分。 對於輻射發射有機活性層’適合的輻射發射材料包含一 種或多種小分子材料、一種或多種聚合物材料或其組合。 小分子材料可包含下述文獻所記載之任一者或多者，例如 美國專利第4,356,429號（「Tang」）；美國專利第4,539,5〇7 號（「VanSlyke」）；美國專利公開案第US2〇〇2/〇i2i638號 (「Grushin」）；或美國專利第6,459，199號（「Kid〇」）。或 者，聚合物材料可包含下述文獻所記载之任一者或多者， 包括美國專利第5,247，190號（「Friend」）；美國專利第 5,408，109 號（「Heeger」）；或美國專利第 5,317,169 號 (「Nakano」）。例示材料為半導體共扼聚合物。關於這種 聚合物實例包含聚（對伸苯伸乙烯）(PPV)、對伸苯伸乙烯共 聚物、聚苐、聚伸苯、聚乙炔、聚烷基噻吩、聚（正-乙烯 咔唑）(PVK)等。於一特定實施例，不含任何客宿材料 145642.doc -18- 201041657 (guest material)之輻射發射活性層可發射藍光。 對於輻射反應有機活性層，適當輻射反應村料包含, 聚合物或電致發光材料。這種材料包含，例如，丘輕聚人 物或電致-與光致發光材料。特定實例包含聚（2_甲氧基， 5-(2-乙基-乙氧基H，4_伸苯伸乙烯）（「MEH_ppv」）或⑶_ PPV與MEH-PPV之複合物。 對於電洞注人材料、電動傳遞層、電子障壁層或其任何 組合，適合材料包含聚苯胺（「PANI」）、聚（3,4_伸乙二氧 基噻吩）（「PEDOT」）、聚吡咯、有機電荷傳遞化合物（例 如四硫虽瓦烯四氰基喹啉並二甲烷（「ttf_TCqn」））、電 洞傳遞材料如Kido所述者或其任何組合。 對於電子注入層、電子傳遞層、電洞障壁層或其任何組 合，適當材料包含金屬螯合類等辛（〇xin〇id)化合物（例如三 (8-羥喹啉）鋁（Alq3)或鋁（ΙΠ)雙（2_甲基_8_喹啉）4_苯基酚 (「BAlq」）），啡琳為主之化合物（例如2,9_二甲基_4,7_二 Q 苯基_1，10-啡啉（「DDpA」）或9，10--二苯基蒽（「DPA」））； 唑類化合物（例如2-第三-丁基苯基_5_聯笨_丨，3，4_噁二唑（2_ tert-butylphenyl-5-biphenyl-l，3,4-oxadiazole(「PBD」））或 3-(4-聯苯）-4-苯-5-(4-第三丁基苯基）_1，2，4-三唑（3-(4-biphenyl)-4-phenyl-5-(4-t-butylphenyl)-l,2,4-triazole (「TAZ」））； Kido中敘述之電子傳遞材料；二苯基蒽衍生物；二萘基蒽 衍生物；4,4-雙（2,2-二苯基-乙烯-1_基）_聯二苯（4,4-1^(2,2-diphenyl-ethen-l-yl)-biphenyl (「DPVBI」））；9,10-二-β-萘基蒽 (9,10-di-beta-naphthylanthracene); 9，10-二-(萘基）蒽（9,10- -19· 145642.doc 201041657 di-(naphenthyl)anthracene) ; 9，10-二-(2-萘基）蒽（9，10-di-(2-naphthyl)anthracene, 「ADN」）；4,4'-雙（叶 °坐-9-基）聯 苯（4,4'-bis(carbazol-9-yl)biphenyl (「CBP」））；9，10-雙-[4-(2,2 -二苯基乙烯基）-苯基]-蒽（9,10-bis-[4-(2,2-diphenylvinyl)-phenyl]-anthracene (「BDPVPA」））；蔥’ N-芳基苯并味 〇坐 N-arylbenzimidazoles(such as 「TPBI」）； 1,4-雙[2-(9-乙基-3-肼甲醯基）伸乙烯基]苯（l，4-bis[2-(9-ethyl-3-carbazoyl)vinylenyl]benzene) ; 4,4-雙[2-(9-乙基-3-肼曱醯基）伸乙烯基]-1 , 1 -聯苯（4,4'-1^3[2-(9411^1-3-carbazoyl)vinylenyl]-l，l'-biphenyl) ; 9,10-雙[2,2-(9,9-伸苐基） 伸乙浠基]蒽（9,10-bis[2,2-(9,9-fluorenylene)vinylenyl] anthracene) ; 1,4-雙[2,2-(9,9-伸苐基）伸乙烯基]苯（1,4-1^[2,2-(9,9-£111〇代11丫161^)¥11171611>4作61176116);4,4'-雙[2,2-(9,9-伸 第基）乙烯基]-1,1-聯苯（4,4，-bis[2,2-(9,9 -fluorenylene)vinylenyl]-l,l'-biphenyl);花（perylene);替 代花（substituted perylenes);四-第三 T*^(tetra-tert-butylperylene (「TBPe」））；雙（3,5-二氟-2-(2-° 比唆基）苯 基-(2-叛口比 口定））銥 III (bisdS-difluoro-S-P-pyridyGphenyl-p-carboxypyridyl) iridium III (「F(Ir)Pic」））；芘 (pyrene) ♦’ 替代范（substituted pyrene)；苯乙稀胺 (styrylamine);氟化伸苯基（fluorinated phenylene);氧化 α坐（oxidazole) ; 1,8-萘二甲醯亞胺（1，8-naphthalimide);聚 0奎琳（polyquinoline) ; PPV内之一種或多種奈米碳管；或其 任何組合。 145642.doc -20- 201041657 對於諸如電阻器、電晶體、電容器等電子組件而言，有 機層可含噻吩（例如聚噻吩、聚（烷基噻吩）、烷基噻吩、雙 (二噻吩并噻吩）、烷基蒽噻吩等）、聚乙炔、并五苯、酞菁 或其任何組合中的一者或多者。 有機染料之實例包括4-二氰亞曱基-2-曱基_6_(對-二曱基 胺基苯乙烯基）-4H-哌喃（DCM)、香豆素、芘、茈、紅螢 烯、其衍生物或其任何組合。 有機金屬材料之實例含有官能化聚合物，其包含與至少 〇 一金屬配位之一種或多種官能基。供使用而涵蓋之例示性 官能基包括羧酸、羧酸鹽、磺酸基、磺酸鹽、具有〇1^部 分之基、胺、亞胺、二亞胺、N_氧化物、膦、膦氧化物、 β-二羰基或其任何組合。供使用而涵蓋之例示性金屬包括 鑭系金屬（例如，銪、铽）、第7族金屬（例如，銖）、第8族 金屬（例如，釕、锇）、第9族金屬（例如，铑、銥）、第1〇族 金屬（例如，鈀、鉑）、第丨丨族金屬（例如，金）、第12族金 Q 屬（例如，辞）、第13族金屬（例如，鋁）或其任何組合。此 有機金屬材料含有金屬螯合類咢辛化合物，諸如三（8_羥基 喹啉）鋁（AlqO;環金屬化銥或鉑電致發光化合物，諸如公 開PCT申請案W0 02/02714中所述之具有苯基。比咬、苯基 喹啉或苯基嘧啶配體之銥的錯合物；描述於（例如）公開申 請案 2001/0019782、EP 1191612、WO 02/15645、w〇 〇2/3 娜 及EPH916!钟之有機金屬錯合物；或其彳壬何混合物。 共輛聚合物之實例包括聚（伸苯伸乙雄）、聚第、聚（螺二 苐）、其共聚物或其任何組合。 145642.doc -21 - 201041657 選擇液體介質亦可為達成液體組合物之一種或多種固有 特徵之重要因素。在選擇液體介質時所考慮之因素包括 (例如）所得溶液、乳液、懸浮液或分散液之黏度、聚合物 材料之分子量、固體裝載、液體介質類型、液體介質沸 點、底塗層基板之溫度、接收客體材料之有機層之厚度或 其任何組合。 在一些實施例中，液體介質含有至少一溶劑。例示性有 機溶劑包括iS化溶劑、膠體形成聚合酸、烴溶劑、芳烴溶 劑、溶劑、環醚溶劑、醇溶劑、二醇溶劑、酮溶劑、腈 溶劑、亞颯溶劑、醯胺溶劑或其任何組合。 例示性鹵化溶劑包括四氯化碳、二氯甲烧、三氯曱烧、 四氯乙烷、氯苯、雙（2-氯乙基）醚、氯曱基乙基醚、氯曱 基曱基醚、2-氣乙基乙基醚、2-氯乙基丙基醚、2-氣乙基 曱基鍵或其任何組合。 例示性膠體形成聚合酸包括氟化磺酸（例如，氟化烷基 石黃酸，諸如全氣化乙烯績酸）或其任何組合。 例示性烴溶劑包括戊烧、己炫、環己烧、庚烧、辛烧、 十氫化萘、石油醚（petroleum ether)、石腦油（ligroine)或 其任何組合。 例示性芳烴溶劑包括苯、萘、甲苯、二曱苯、乙基苯、 枯烯（異丙苯）1,3,5-三甲苯（三曱基苯）、乙基曱苯、丁基 苯、異丙苯（異丙基甲苯）、二乙基苯、異丁基苯、四曱基 苯、第二丁基苯、第三丁基苯、苯甲醚、4-甲基苯曱醚、 3，4-二曱基苯曱醚或其任何組合。 145642.doc -22- 201041657 例示性醚溶劑含有二乙基醚、乙基丙基醚、二丙基醚、 二異丙基醚、二丁基醚、甲基第三丁基醚、乙二醇二甲 醚、二乙二醇二甲醚、苯甲基醚'異色滿、2_苯基乙基甲 基醚、正丁基乙基醚、i，二乙氧基乙烷、第二丁基醚、 二異丁基醚、乙基正丙基醚、乙基異丙基醚、正己基甲基 醚、正丁基甲基喊、甲基正丙基_或其任何組合。土 例示性環轉溶劑包括四氫咳喃、二喔烧、四氫η底喃、 Ο 〇 广一惡燒、4_苯基仏二噪烧一氧雜環戊 烧、2_甲基―1，3'二氧雜環戊 2,5_一 f乳基四氫吱喃、2,5_二甲氧基_2,5_ 任何組合。 a ^ 例示性醇溶劑包括甲醇、乙醇丙醇、2_丙醇 =丁醇、”“丙醇(亦即，異丁醇) :(;亦：：第三丁醇戊醇、2… 基-1-丙酵、b己醇、環戍醇、3_子基小丁醇、3_甲美_2 丁醇、2-甲基-丁醇、2,2_二甲基 ^ 醇、4-甲基-2-戊醇、2甲其 土 口 -己醇、2-己 伙0手、2-甲基-1 _戎醢 ^ 甲其^ λ·、^ 1 戍酉予2-乙基丁醇、2 4_二 庚醇、庚醇、2·庚醇、。庚醇、2-乙基-己醇、2,6-二甲基_4_庚醇、 土 > 己醇、3 -甲其摄p 醇、4-甲基環己醇或其任何說合。 甲“己 亦可採用醇醚溶劑。例 醇、2-甲氣W 醇鍵溶劑包括卜甲氧基_2-丙 哔二甲氧基乙醇、2-乙氧其 一醇覃显虱基乙醇、1-甲氧基-2-丁醇、乙 …異丙基醚、“乙氧基 = 二醇單異丁基醚、乙二醇 f乳基小丁醇 '乙 早正丁基醚、3-曱氧基_3_甲基丁 145642.doc •23- 201041657 醇乙一醇單第三丁基醚或其任何組合。 例示性二醇溶劑包括乙二醇、丙二醇、丙二醇單甲㈣ (PGME)、二丙二醇單甲基鍵（DpGME)或其任何組合。 例不性酮溶劑包括丙酮、甲基乙基鲷、甲基異丁基酮' 環己酮、異丙基f基，、戊酮、3_戊酮、3·己酮、二異 丙基嗣、2-己酮、環戊酮、…、異戊基〒基酮、3_庚 酮^庚綱、4_甲氧基_4巧基士戊明、5_甲基_3_庚酮、2_ 甲基己酮、一異丁基酮、5_甲基_2_辛酮、甲基環己 酮2衣己烯小酮、4_甲基環己嗣、環庚酮、第三丁基 環己酮、異佛爾酮、苄基丙酮或其任何組合。 例示性腈溶劑包括乙腈、丙烯腈、三氯乙腈、丙腈、特 戊腈、異丁腈、正丁腈、甲氧基乙腈、2•甲基丁腈、異戊 腈：N-戊腈、正已腈、3_甲氧基丙睛、3-乙氧基丙腈、 3,3’-氧基二丙腈、正庚烷腈、乙醇腈、苯甲腈' 乙烯氰 醇、丁二腈、丙酮氰醇、3_正丁氧基丙腈或其任何組合。 例示性亞職溶劑包括二甲亞石風、二_正丁基亞礙、四亞 甲基亞砜、曱基苯基亞砜或其任何組合。 例示性醯胺溶劑包括二甲基甲酿胺、二甲基乙醯胺、醯 胺、2-乙醯胺乙醇、N，N_二甲基-間曱苯醯胺、三氟乙醯 胺、N，N-二甲基乙醯胺、N，N_二乙基十二醯胺、E_己内醯 胺、N，N-二乙基乙醯胺、N_第三丁基曱醯胺、曱醯胺、特 戊醯胺、N-丁酿胺、N，N-二甲基乙醯乙醯胺、N-甲基甲酿 胺、n，n-二乙基甲醯月安、N_甲醯基乙基胺、乙酸胺、n，n_ 二異丙基甲醯胺、b甲醯基哌啶、N_甲基甲醯苯胺或其任 145642.doc -24· 201041657 何组合。 所涵蓋之冠醚包括冠醚中之一或多者，其可作用以有助 於減少作為根據本發明之部分經處理組合物的環氧化合物 起始材料之氯化物含量。例示性冠醚溶劑包括苯并_ 15 _冠_ 5 ;苯并-18-冠-6 ; 12-冠-4 ; 15-冠-5 ; 18-冠-6 ;環己醇_ 15-旭-5;4’，4」（5」）-二第三丁基二苯并_18_冠_6;4，，4」 (5」）_二第三丁基二環己醇_18_冠_6 ;二環己醇_18-冠_6 ; ❹ 一裱己醇_24_冠-8 ; 4，-胺基苯-15-冠-5 ; 4，-胺基苯_18_冠_ 6 ’ 2-(胺基曱基）_15_冠_5 ; 2_(胺基甲基冠f胺 基-5-確基苯并_15_冠_5;丨_氮雜_12_冠_4;卜氮雜-15_冠_ 氮雜18-冠-6，苯并-12-冠-4;苯并-15-冠_5;苯并_ 九6，雙（（本并_15_冠_5)_15_曱基）庚二酸鹽；溴苯 并 18 冠-6 ’（+)_(18-冠·6)_2,3，11,12-四-緩酸；二苯并 _18_ " —笨并-24_冠 ;二苯并-30-冠-10 ; ar_ar'_二·第三 丁基二苯并_丨8_冠_6 ; 4，_甲醯基苯并_丨5_冠_5 ; 2_(羥甲 〇 基）心冠_4; 2-(經甲基）-15-冠-5; 2-⑽甲基）-18_冠_6; 4硝基苯并-15~冠-5;聚-[(二苯并-18-冠-6)-共-甲醛]; 二甲基妙-ll-冠_4; 二曱基石夕善冠_5; hl_二甲基 石夕-17-冠_5 ; 4酸納；Μ，ι〇，ΐ3_四硫雜_7，16_二氮雜環十 八烧；外吩或其任何組合。 ;另實細•例，液體介質包含水。傳導聚合物與水溶性 ’體形成聚合酸錯合，可沉積於基材且使用作為電荷傳遞 層。 、上描述了許多不同類別之液體介質（例如齒化溶劑、 I45642.doc -25- 201041657 溶劑、芳烴溶劑 '水等）。 體介質混合物。 可使用一種以上不同類的液 液體混合物更可包含惰性好 材枓，例如黏結材料、填料或 其組合。關於液體混合物，惰 月性材料不會明顯影響全由 至少部份由液體混合物形成t # μ + a 一 反應性質。 4之層的電子、輕射發射或輕射 ^ , + —特徵，疋為了清楚說明之用意而 3己載在上述不同實施例中， 些特徵也可描述於同一實施 例中。相反地’本發明許多特 — 符戊為了間雄起見，許多特徵 敘述於同' —貫施例中，ρ此麻 Jτ ^些實施例可分開敘述於次要植人 中。此外，範圍内描述的相 σ 哥數值包括所述範圍内的各個 及每個值。 【圖式簡單說明】 圖1為一電子裝置示意圖； 圖2為本發明之具有設置於中央孔洞的碟之實施例 圖； 2之3-3線之邊視示意圖； 體末端之凹區之一實施例示意 圖3為本發明之碟沿著圖 圖4為本發明之噴嘴主 圖；及 圖5為本發明之喷嘴配置之—實施例示意圖 【主要元件符號說明】 100 有機發光二極體 110 陽極層 120 緩衝層 145642.doc -26- 201041657 130 EL層 140 選擇層 150 陰極層 200 碟 202 第一側 204 第二側 206 孔洞 208 凹區 Ο 400 主體 402 外緣部 404 開口 500 線型配置 502 喷嘴組件 Ο 145642.doc -27-[Prior Art] The use of active organic molecules in electronic devices is increasing. These active organic knives have electrical or electro-radiative properties, including electroluminescence. An electronic device incorporating an organic active material, which can be used to convert electrical energy into radiation, and can include a light emitting diode, a light emitting diode display, or a diode laser. Two methods for preparing an organic light emitting diode (〇LED) display are known. Vacuum deposition and liquid phase processing (the latter consists of a liquid, such as a true solution 'suspension, applied to all forms of the layer.) Vacuum deposition equipment typically requires high investment costs, but poor material utilization (high operating costs), so liquid Phase processing is better' especially for large area displays. The liquid phase processing used to deposit the organic active layer comprises any number (iv) of layer thicknesses on the batch substrate. Some of these techniques include self-control sizing = thickness control, including spin coating, bar coating, dip coating, roll coating, ^ or lithographic or offset printing, screen printing or printing. The technique for controlling the thickness of the deposited layer consists of using controlled deposition techniques including ink (4), spray coating, nozzle coating, slot die coating, curtain coating 145642. Doc 201041657 Bar coating or slant coating. The rain 2 technology has several shortcomings. The liquid used for coating the 〇LED display is a surface electrode, a contact 塾, a thin film, a pixel well formed by a photoresist, a cathode structure, and the like. The wet layer of the surgery/child accumulation depends on the coating gap and the obtained (4) distribution. Therefore, the change of the undulation morphology of the substrate causes the wet deposition thickness to change unexpectedly. Freely j j - The two uTs generally have the disadvantage of high operating cost, because not all of the liquid helium on the substrate is entangled. - some of the liquid is circulated in a fluid bath (e.g., immersion) or on an applicator, (e.g., roll smearing, gravure coating), or a waste (e.g., spin coating). The solvent evaporates from the circulating fluid, so it needs to be adjusted: to maintain processing stability. Waste materials, recycling and adjustment materials are all increased. Eight+ regulation technology provides low operating costs. However, in the m-shape, the wear and tear of the precision equipment of Hezui caused it to be poorly regulated on the layers of several nanometers thick when dry. The manufacture of #密mechanical nozzles is blameless, and providing the array of nozzles to cover a large area of the substrate will expand the regulation problem. The formation of heterogeneous sentences in the organic layer generally leads to poor device performance, and loading: low yield. There is a need for an improved process for liquid phase deposition of organic materials for OLED applications. [Invention] In the conditioning coating method, all liquid systems supplied to the coating nozzle are applied to the substrate or workpiece. The average wet coating thickness can be calculated in advance based on the volume flow rate of the coating liquid, the coating width, and the speed at which the substrate passes through the nozzle. Fluidity 145642. Doc 201041657 such as viscosity, surface tension) and external forces (such as gravity) can affect the coating quality without affecting the average wet thickness. A particular interest in the method of regulating coating is a continuous nozzle coating process, particularly an electroforming process having a dish 2 to the recess at the end of the nozzle body. Ο 连 Lian, . The f-type f-mouth operation has a variety of variations, including the nozzle design itself, the sheet coating relative to the continuous smear, the strip coating, and the method of generating a white force to take the fluid away from the mouth. Continuous nozzle coating is typically applied by a nozzle that is separated from the substrate by a workpiece. The typical thickness associated with the nozzle, still tens, is on the order of tens of microns, and can be dried to a final film of the order of a few millimeters. In contrast, the organic layer is coated with a continuous nozzle to produce a 显示器LED display, resulting in a layer thickness Hey. 1 to 500 nm thick. Process improvements are needed to achieve layer performance at these thin scales. The attenuation of the jet (also referred to as the column flow (pi)) emitted by the nozzle causes unacceptable deposition and potency of the organic material in the dried layer. When used in the configuration of 啧:, the attenuation of one of the 16 nozzle configurations can result in unacceptable product loss due to the large number of devices being coated during the configuration operation. In one embodiment of the present disclosure, an electroformed disc can be attached to the -nozzle body to facilitate easy replacement of the disc when the jet is attenuated to unacceptable parameters. It is not necessary to change the nozzle assembly, only the disc at the end of the nozzle needs to be replaced. At least - the embodiment includes - the nozzle assembly includes: a body having a recessed region at an end of the body and a dish having a centrally located aperture. The aforementioned hole is a hole having a straight L, and the diameter of the disk is ~. In addition, the dish 145642. Doc 201041657 is characterized by having a first side and a second side, wherein the aforementioned first side is attached to the recessed area on the body, and the second side has a hole in a recessed area. The concave area on the second side of the dish has a diameter A and a center larger than seven. In one embodiment, the diameter dA of the hole is less than or equal to 〇 5 mm. In another embodiment, dA is less than or equal to 0. 01 mm. In another embodiment, 'there is a change between the first side of the dish and the second side of the dish. In another embodiment, the center of the first side is greater than the center of the second side. In another embodiment, the radius Q defines a surface of the hole between the first and second sides. In one embodiment, the radius is less than 〇"〇5 mm. In another embodiment, the radius u is less than (4). In another embodiment, the radius rA is less than 〇. 〇 3 public Chu. At least - the embodiment comprises a liquid phase coating process comprising a number of steps, e.g., providing - a body ' comprising a recess at the end of the 1T body. A disc is provided to include a hole in the center, the hole having a diameter of 'the hole, and the dish having a diameter dD, a first side and a second side. The second side of the dish has a hole in the semi-concave area, wherein the disc is larger than the heart. The first side of the dish is attached to the recessed portion of the body to form a nozzle stage member and provides a mixture comprising a liquid and a solid. The foregoing mixture is directed through the nozzle assembly to create a layer. The liquid is an organic solvent. In another embodiment, the liquid is water. In one embodiment, the mixture is and has hummer water. There is a solution having a solids content of less than 10%, and in another embodiment, the mixture A white & night and night is suspended in an embodiment containing less than 10% solids, the working member comprising, for example, glass). The term "organic electronic device: substrate (9) of an organic electronic device" means that only one or more of them are referred to as "electronic devices such as organic + conductor layers or materials. 145642. Doc -6- 201041657 Organic Xunzi I includes, but is not limited to: (1) devices that convert electrical energy into radiant energy (such as light-emitting diodes, light-emitting diode displays, diode lasers or lighting panels), ( 2) Devices that use electronic programs to detect signals (such as optical detectors, photoconductive batteries, photoresistors, light switches, photonic crystals, light pipes, infrared detectors or biosensors), (3) radiant energy A device that converts to electrical energy (such as a photovoltaic device or a solar cell) and (4) a device that includes one or more electronic components (which include one or more organic semiconductor layers) (eg, an electrothermal 晶体 crystal or a diode). Or any combination of the devices of (1) to (4) above. [Embodiment] An example of an electronic device including σ organic light-emitting diode (0LED) is shown in Fig. and designated as 1 〇〇. The device has an anode layer 11A, a buffer layer (3), a photoactive crucible and a cathode layer 15A. Adjacent to the cathode layer 15 is a sub-Zhuang/transfer layer 14 视 as needed. The buffer layer 12 (10) is a hole-injection/transfer layer (not shown). ==Use, the term "buffer layer" or "buffer material" refers to electricity! X material, and has one or more kinds of work in organic electronic devices: 2 is limited to undercoating flattening, charge transfer and / or charge injection The improvement of impurities such as oxygen or metal ions (4) t + μ μ & ^ and other aspects that favor or otherwise. The buffer material may be a polymer, a violent polymer or a small molecule, and the 1 liquid, 1 system/form may be a solution, a dispersion, a suspension "1, a colloidal mixture or other group when referring to a layer, a material, a composition (4) neck", 遽Or the structure contributes to the positive charge phase; the formation of the layer, the material is said to be efficient and the charge loss is small and the thickness of the material, composition or structure migrates. The term "electronic transmission 145642. Doc 201041657 "When referring to a layer, material, composition or structure, it means that the layer, material, composition or structure promotes or facilitates the passage of a negative charge through the layer, material, composition or structure to another layer, material, composition or structure. The migration of Yi Ge,,, and Shu. The term "hole injection" when referring to a layer, material, composition or structure means that the layer, material, composition or structure contributes to the positive charge being relatively efficient and having a small charge loss through the layer, material, composition Or the migration of the thickness of the structure. The term "electron injection" means that a layer, material, composition or structure means that the layer, material, composition or structure contributes to the negative charge being relatively efficient and having a small charge loss through the layer, material, Migration of the thickness of the composition or structure. The device may comprise a support or substrate (not shown) adjacent to the anode layer 11 or the cathode layer 15 . The most common is for this - the support is adjacent to the anode layer ua. The support can be flexible or rigid, organic or inorganic. Generally, a glass or a flexible organic film is used as a support. The anode layer is an electrode and is more efficient in hole injection than the cathode layer 150. The anode material may comprise a metal, a mixed metal, an alloy, a metal oxide or a mixed oxide. Suitable materials include Group 2 elements (e.g., barium, magnesium, calcium, strontium, lock, steric) 'W group elements, mixed oxides of Groups 4, 5, 6 and 8 to 1 steroid transition elements. When the anode layer 11 is a light-transmitting mixed oxide of Groups 12, 13 and 14, for example, indium tin oxide can be used. As used herein, the term "mixed oxide" means an oxide having two or more different cations selected from Group 2 elements or Group 12, 13 or 14 elements. Some non-limiting specific examples include, but are not limited to, indium tin oxide (r IT), aluminum tin oxide, gold, silver, copper, and nickel. The anode may also comprise an organic material such as polyphenyl 145642. Doc 201041657 Amine, polythiophene or polypyrrole. This is the use of the International Chemical Society (IUPAC) nomenclature system, in which the families in the periodic table are numbered 1 to 18 from left to right (CRC Handbook of Chemistry and Physics, 81st edition, 2000). . In one embodiment, the buffer layer 120 includes a hole transfer material. Examples of hole transfer materials for layer 120 have been summarized, for example (Kirk-Othmer Encyclopedia of Chemical Technology, 4th Edition, Vol. 18, pp. 837-860, 1996). , Y_ Wang. The hole transfer molecule or polymer can be used. Commonly used hole transfer molecules include but are not limited to: 4,4',4"-tris(N,N-diphenyl-amino)-three Phenylamine (4,4',4"_tris(N,N-diphenyl-amino)-triphenylamine, TDATA), 4,4',4"-tris(N-3-methylphenyl-N-benzene -4,4',4"-tris(N-3-methylphenyl-N-phenyl-amino)-triphenylamine, MTDATA), hydrazine, Ν'-diphenyl-hydrazine, Ν'-Bis(3-methylphenyl)-[1,1'-biphenyl]-4,4'-diamine (N,N'-diphenyl-N,N'-bis(3 -methylphenyl)- [ 1,1 '-biphenyl]-4,4'-diamine,TPD), 1,1-bis[(di-4-indolylphenyl)phenyl]cyclohexene (l,l-bis[( Di-4-tolylamino) phenyl]cyclohexane,TAPC), N,N'-bis(4-mercaptophenyl)-fluorene, Ν'-bis(4-ethylphenyldimethyl)biphenyl]-4 , 4'-diamine (>1,1^-1^(4-11^11}^1^]1丫1)-wind 1 ^'-1)丨3(4-ethylphenyl)-[l,l'-(3,3'-dimethyl)biphenyl]-4,4'-diamine, ETPD), tetrakis-(3-methylphenyl) - Team ^'-2,5-phenylenediamine 〇61^匕3-(3-methylphenylj-N^jN'jN'-ljS-phenylenediamine, PDA) 'α-phenyl-4-Ν,Ν -A-phenyl-4-N,N-diphenylaminostyrene (TPS), p-(diethylamino)benzoquinone diphenyl 145642. Doc 201041657 (p-(diethylamino)benzaldehyde diphenylhydrazone, DEH), triphenylamine (TPA), bis[4-(N,N-diethylamino)-2-methylphenyl]( 4-mercaptophenyl)methane (1^[4-(1丨6化71&〇^11〇)-2-methylphenyl](4-methylphenyl)methane,MPMP), 1-phenyl-3 - [p-(diethylamino)styryl]-5-[p-(diethylamino)benzene]° ratio zoazole (1 -phenyl-3-[p-(diethylamino)styryl] -5-[p-(diethylamino) phenyl] pyrazoline, PPR or DEASP) ' 1,2-trans-double (9H-port bayonet-9-yl) cyclobutane (l,2-trans-bis(9H -carbazol-9-yl)cyclobutane, DCZB), Ν,Ν,Ν·,Ν·-tetrakis(4-mercaptophenyl)-(1,Γ-biphenyl)-4,4'-diamine (team Team>1·,;^-tetrakis(4-methylpheny 1)-(1,1 '-bipheny 1)-4,4'-diamine, TTB), N,N'-bis(naphthalen-1-yl) -Ν,Ν--di-(phenyl)benzidine ([>^-bis(naphthalen-l-yl)-N,N'-bis-(phenyl)benzidine, α-ΝΡΒ)' and purpurin ( Porphyrinic) compounds such as copper S. Most commonly used hole transport polymers include, but are not limited to, poly(9,9,-2 xin -苐-co-N-(4-butylphenyl)diphenylamine), poly(9,9,-dioctyl-fluorene-co-N-(4-butylphenyl)diphenylamine) °,(phenylmethyl)polydecane, poly(dimercaptothiophene), polyaniline and polypyrrole. By doping a hole transporting molecule (such as the aforementioned one) to a polymer such as polystyrene and poly In carbonates, it is also possible to obtain a hole transporting polymer. Photoactive layer 130 is typically any organic electroluminescent (EL) material, including but not limited to small molecule organic fluorescent compounds, fluorescent and phosphorescent metal complexes, Copolymers and mixtures thereof. Fluorescent compounds include, but are not limited to, ruthenium, osmium, red phosgene, coumarin, derivatives thereof, and mixtures thereof. Examples of metal complexes include, but are not limited to, metal chelate oxins ) Compound 145642. Doc -10- 201041657, such as striatum (8-hydroxyquinolato), Alq3, cyclometalated silver and luminescent electroluminescent compounds, such as silver and phenyl D is more than phenylpyridine. Phenylquinoline or phenyl. A complex of phenylpyrimidine ligands, such as Petrov et al. U.S. Patent No. 6,670,645, the disclosure of which is incorporated herein by reference in its entirety, the disclosure of the disclosure of the disclosure of the disclosure of the disclosure of the disclosures of And the applicants described in WO 03/040257 and mixtures thereof. Electroluminescent emissive materials contain charged host materials and metal complexes, as described by Thompson et al. U.S. Pat. Examples of conjugated polymers include, but are not limited to, poly(styrene), polydiene, poly(spirobi), polythiophene, poly(p-phenylene), copolymers thereof, and mixtures thereof. Specific materials are selected based on the particular application, the user in the operation, or other factors. The EL layer 130 containing the electroluminescent organic material can be applied using any technique involving liquid phase processing. In another embodiment, the EL polymer precursor can be applied, followed by conversion to a polymer, typically by heating or other external source of energy, such as visible or ultraviolet light. The layer 140 as desired can function as both electron injection/transfer and can also serve as a localized layer to prevent quenching reactions between the layers. More specifically, layer 140 promotes electron mobility and reduces the likelihood of quenching reactions if layers 130 and 150 are in direct contact. Examples of materials for layer 140 as needed include, but are not limited to, metal chelate oxinoid compounds such as tris (8-hydroxyquinolato), Alq3, double (2-曱基-8-喧145642. Doc 11 201041657 琳) (p-phenyl-8) (bis(2-methyl-8-quinolinolato)(para-phenyl-phenolato)aluminum(III), BA1Q),肆-(8-经基喧琳) (IV) (tetrakis-(8-hydroxyquinolinato)zirconium (IV), ZrQ); with azole compounds such as 2-(4-biphenyl)-5-(4-tert-butylbenzene Base)-1,3,4-° oxadiazine (2-(4-1^卩11611>^1)-5-(4-1;-131^71卩1161171)-l,3,4-oxadiazole , PBD), 3-(4-biphenyl)-4-phenyl-5-(4-tert-butylphenyl)-1,2,4-trisylzine (3-(4-biphenylyl)-4 -phenyl-5-(4-t-butylphenyl)-l,2,4-triazole,TAZ) with 1,3,5-tris(phenyl-2-benzimidazole) benzene (1,3,5-tri(phenyl) -2-benzimidazole) benzene, quinoxaline derivative, for example, 2,3-bis(4-fluorophenyl)quinoxaline; Phenanthrolines, for example, 4,7-diphenyl-1,10-phenanthroline (DPA) and 2,9-dimethyl-4, 7-Diphenyl-indole, 2,9-dimethyl-4,7-diphenyl-l, l-phenanthroline (DDPA); a mixture thereof. Alternatively, the layer 140 as desired may be inorganic and comprise ruthenium oxide, lithium fluoride, lithium oxide or the like. The cathode layer 150 is an electrode which is particularly effective for injecting electrons or negatively charge carriers. Cathode layer 150 can be any metal or non-metal having a lower work function than the first electrical contact layer (in this example, anode layer 110). As used herein, "low work function" means a material having a work function of no more than about 4·4 electron volts. As used herein, "high work function" means that the material has a height of about 4. 4 electron volts of the function of the material. The cathode layer material may be selected from the group consisting of alkali metal (eg, lithium, sodium, potassium, rubidium, cesium), second group metals (eg, magnesium, mom, lock, etc.), Group 12 metals, 145642. Doc •12- 201041657 Steel systems (eg, ornaments, pens, urns, etc.) and fishing systems (eg sputum, eclipse, etc.). Materials such as Ming, Indium, and Ji can also be used in combination. Cathode Layer 15 〇 Materials 疋 Non-limiting examples include, but are not limited to, ruthenium, bell, ruthenium, planer, pin, surface, kiln, town, tantalum, alloys and compounds thereof. ‘a In other embodiments, additional layers may be present in the organic electronic device. For example, in the buffer, the layer of the muscle layer 130 (not shown) is advantageous for the positive layer, the layer with the gap is matched, and the protective layer is used. Similarly, an additional layer between the two layers (not shown) facilitates negative charge transfer: the w曰1 gap of the layer, as a protective layer, and the like. A sublayer of the art can be used. Further, any of the above layers may be formed by two or more layers. Or all or part of the inorganic anode layer 11 (), the buffer layer (10), the layer (10) layer 15G may be surface treated to increase the charge carrier transfer effect of the mother-component layer material selection by providing high The device efficiency device is determined by balancing manufacturing costs, manufacturing complexity, or other potential factors. τ 〇 / the same layer may have (4) a suitable thickness. In an embodiment, the inorganic anode material 110 is typically no greater than about 5 nanometers, for example, from about 1 to about 2 nanometers, typically no greater than about 25 nanometers, no wood, such as about 50. Up to 200 奈 = 'EL layer 13 〇' - generally no more than about (10) nanometers, for example (10), the layer 140 is generally not more than about (10) nanometers, for example about 20 to 80, and the cathode layer 15 - generally no more than about 1 〇〇 nanometer, for example, about work to 匕〇 nano. If the anode layer 110 or the cathode layer 15 is required to deliver at least some light, the thickness of these layers may not exceed about 1 nanometer. — In organic light-emitting diodes (〇LEDS), electrons and holes are respectively made by the cathode 145642. Doc 13- 201041657 150 is injected into the EL layer 13〇 with the anode 11〇 to form negatively and positively charged polar ions in the polymer. These polar ions are affected by the applied electric field to form polar ion excitations with oppositely charged species, followed by turbulent recombination. There is sufficient energy difference between the anode and the cathode, typically applied to a package = less than about 12 volts, and in many cases no greater than 5 volts. The true energy difference depends on the device used in the large electrical components. In many embodiments, when the electronic device is operated, the anode 110 is biased to a positive voltage and the cathode layer 15 is substantially = ground potential or zero volts. The battery or other energizing device can be electrically connected to the electrical device as part of the line, but is not shown in Figure 1. Figure 2 shows an embodiment of the disc 200. The disc 2 has a first side 2 (10) (see Fig. 3) and a second side 204. The hole 206 passes through the dish 200 and has a hole diameter dA on the second side 2〇4. The second side 2〇4 further includes a recessed area 2〇8. The recessed area 2〇8 serves as a prevention of the influence of the wind generated by the relative flow between the substrate (not shown) and the nozzle assembly 5〇2 (see the relative movement between the hooks. A stationary area is formed in the concave area to produce more controllable The deposition conditions. In the embodiment of the present invention, the diameter D of the dish may be 10 cm or less. In another embodiment, the dD may be 5 cm or less. In another embodiment of the hole, the diameter dA may be It is 0 05 mm or less. In the example - dA can be 〇. 〇 1 mm or less. In another embodiment, the diameter d2 of the recess may be 1 mm or less. In another embodiment, 4 can be a 苈 or lower. The ratio of tD/d2 is sufficient to produce a stationary product in the recessed area 2〇8, and tD may be 〇 5 mm and 屯 5 〇. Figure 3 shows an embodiment of the side view of the dish 200, such as along the 3-3 of Figure 2, the spring surface 202 and the second surface 204 are disc thickness (denoted as tD)]" tD can be 0 1 mm or less. In one embodiment of the invention, dish 145642. Doc -14- 201041657 2 The tD can be 0. 05 mm or less. In the other embodiment, the embodiment Η = 3 (four) is lower. The embodiment of the thickness of the hole may be 5" or lower. In one embodiment, it may be 1 micron or less. Unless the thickness of the hole is reduced, the pressure at the mouth can be maintained. The sprayer is also not easily broken into droplets. Such an embodiment can be used to deposit a buffer layer, a P-wall layer, a charge injection layer, a charge transport layer, an electroluminescent layer, or a combination thereof. In an embodiment, the body comprises a recessed region comprising an outer edge portion of the gold opening. The dish 200 is bonded to the body, wherein the first surface 2〇2 is a combined outer edge portion 402 to form the nozzle assembly 5〇2 (as shown in FIG. 5). The combination may include mechanical bonding such as fasteners, clips or other mechanical tools, bonding, splicing, casting, welding, etc. In one embodiment, the body is well-understood and the coated coating 200 is welded to the body 4 Other materials and processes can be used without changing the scope of the present invention. For example, the end of the main body 400 may not include a concave area, and the disc may be directly connected to the end of the main body (not shown). Figure 5 shows the line of the nozzle assembly 5〇2 An embodiment of a configuration of 5, which is a linear structure comprising a total of 16 nozzle assemblies 5〇2, but any number can be used and is within the scope of the present disclosure. The mixture is passed through the mouthpiece assembly to provide Controlled deposition on a substrate. The mixture comprises a liquid disk solid material to produce a solution, suspension, dispersion, emulsion 'colloid mixture and other compositions. The liquid can be an organic solvent or water, as discussed below. Any material that is used for °' 勹 17 for the buffer layer 120, the EL layer 130, or the desired layer 140. 145642. Doc -15. 201041657 Several variables are used in the nozzle coating process to improve the yield and final performance of electronic devices. The coating gap is 200 to 800 microns and the coating speed is 2 to 10 meters per second. The mixture has a solid content of 2 to 15% and a viscosity of 0. 5 to 1 centipoise (cp) with a surface tension of 20 to 100 dynes/cm. In another embodiment, the viscosity of the liquid mixture is greater than 5 centipoise. In another embodiment, the liquid mixture comprises a liquid solvent. Wherein the liquid solvent may comprise two or more solvents. In still another embodiment, the solvent is known to be at least one of water. Additional equipment can be placed into or used with the nozzle assembly 502, including the container and feed line being in fluid communication with the nozzle assembly 502 to accommodate any number of components' forming a liquid phase mixture. Other devices may include any one or more of stepper motors, pumps, filters, regulating electronics, other electronic, mechanical or electro-mechanical combinations or sub-combinations, device combinations, or any combination thereof. In the coating operation, the pressure within the squirt assembly 502 ranges from about 1 Torr to 5 kPa. In one embodiment, the pressure is held constant and the flow is controlled by the mass flow regulator. The flow rate of the liquid mixture exiting the nozzle assembly 5〇2 can range from 5 〇 to 600 (microliters per minute p in another embodiment, higher or lower pressures, higher or lower flow rates, or any combination thereof can be used. After reading the instructions, one of ordinary skill in the art can adjust or modify the coating operation to obtain the pressure and flow rate required for its application. The liquid composition nozzle assembly 5 02 can be used to sink a long-term cat τ door u, / a variety of different materials, including a liquid solution. The following paragraphs contain only some of the available materials that are not available. In one implementation 145642. Doc 201041657 The material used for the organic layer of one or more of the electronic devices is formed using the damper component 502. The 'nozzle assembly 5' is suitable for printing liquid compositions. The nozzle assembly 5〇2 can tolerate a wide range of operating parameters and liquid compositions as compared to conventional inkjet printers. In the embodiment, one or more parameters can affect the flow rate characteristics of the liquid composition. (4) Degree is a parameter that can affect the characteristics of the flow rate. Viscosity can be affected by the choice of liquid medium, solids content in the liquid medium, temperature of the liquid composition, or one or more other potential factors, or any combination thereof. Viscosity can be directly affected by temperature (the viscosity of the liquid medium increases with decreasing temperature or decreases with increasing temperature) or indirectly affects the evapotranspiration rate of the liquid medium in the liquid composition (eg using a lower or higher boiling point) The liquid medium, the temperature at which the liquid composition is changed, or a combination thereof. After reading this specification, those of ordinary skill in the art will be able to use other means to allow for a significantly greater selective liquid medium, a wide range of liquid compositions, internal solids content, or combinations thereof. The liquid mixture can be a solution, dispersion, emulsion or suspension. Non-limiting examples of solid materials and liquid media are provided in the following paragraphs. The solid material can be selected based on electron or electricity properties for subsequent formation of layers. The liquid medium can be selected according to the criteria described later in this specification. When nozzle assembly 502 is used, the liquid composition can be greater than about 2% by weight ' while still not considering the plug. In one embodiment, the solids content ranges from about 2. 0 to 3. 0 weight percent. Therefore, the nozzle assembly 5〇2 can use a liquid composition having a higher viscosity or a lower boiling point than a conventional ink jet printer. In addition, the nozzle assembly 145642 is compared to a conventional ink jet printer. Doc -17- 201041657 外Λ/* (4) The composition of the high-salt Buddha's (4). The liquid medium in this side does not need to be degassed before printing. For example, conventional ink jet printers for dispensing conductive organic materials in aqueous solutions require degassing of the aqueous solvent. 'However, because the mouthpiece assembly allows for more processing limits, degassing from the liquid medium is not necessary for proper operation. The organic layer printed using the mouthpiece component 502 may comprise an organic active layer (eg, a radiation-emitting organic active layer or a radiation-reactive organic active layer, a buffer layer, a charge injection layer, a charge transport layer, a charge barrier layer, or any thereof) The organic layer can be used as part of a resistor, a transistor, a capacitor, a diode, etc. For a radiation-emitting organic active layer, a suitable radiation-emitting material comprises one or more small molecular materials, one or more polymeric materials, or a combination thereof. The small molecule material may include any one or more of the following documents, for example, U.S. Patent No. 4,356,429 ("Tang"); U.S. Patent No. 4,539,5,7 ("VanSlyke"); U.S. Patent Publications US 2 〇〇 2 / 〇 i2i 638 ("Grushin"); or US Patent No. 6,459,199 ("Kid〇"). Alternatively, the polymeric material may comprise any one or more of the following documents. , including U.S. Patent No. 5,247,190 ("Friend"); U.S. Patent No. 5,408,109 ("Heeger"); or U.S. Patent No. 5,317,169 ("Nakano") The exemplified material is a semiconductor conjugated polymer. Examples of such a polymer include poly(p-phenylene-extended ethylene) (PPV), para-extension ethylene copolymer, polyfluorene, poly-extension benzene, polyacetylene, polyalkylthiophene. , poly(n-vinylcarbazole) (PVK), etc. In a specific embodiment, does not contain any guest materials 145642. Doc -18- 201041657 (guest material) The radiation-emitting active layer emits blue light. For radiation-reactive organic active layers, suitable radiation reaction materials include, polymers or electroluminescent materials. Such materials include, for example, a light-weighted or electro- and photoluminescent material. Specific examples include a complex of poly(2-methoxy, 5-(2-ethyl-ethoxy-H,4-)-extended ethylene ("MEH_ppv") or (3)_PVV and MEH-PPV. Injecting materials, electrodynamic transfer layers, electronic barrier layers, or any combination thereof, suitable materials include polyaniline ("PANI"), poly(3,4_ethylenedioxythiophene) ("PEDOT"), polypyrrole, organic a charge transfer compound (eg, tetrathiane tetracyanoquinodimethane ("ttf_TCqn")), a hole transporting material such as Kido, or any combination thereof. For electron injection layers, electron transport layers, holes The barrier layer or any combination thereof, suitable materials include chelating compounds such as metal chelates (for example, tris(8-hydroxyquinoline)aluminum (Alq3) or aluminum (bismuth) bis (2-methyl-8) _ quinoline) 4-phenylphenol ("BAlq")), a compound based on morphine (eg 2,9-dimethyl-4,7-di-Q-phenyl-1,10-morpholine ("DDpA ") or 9,10--diphenylanthracene ("DPA")); azole compounds (eg 2-tert-butylphenyl _5_ 联 _ 丨, 3,4 oxadiazole (2_) Tert-butylphenyl-5-biphenyl-l 3,4-oxadiazole ("PBD")) or 3-(4-biphenyl)-4-phenyl-5-(4-t-butylphenyl)_1,2,4-triazole (3-(4) -biphenyl)-4-phenyl-5-(4-t-butylphenyl)-l,2,4-triazole ("TAZ")); electron transfer material described in Kido; diphenylanthracene derivative; dinaphthyl Anthracene derivative; 4,4-bis(2,2-diphenyl-ethenyl-1-yl)-biphenyl (4,4-1^(2,2-diphenyl-ethen-l-yl)-biphenyl ("DPVBI")); 9,10-di-beta-naphthylanthracene; 9,10-di-(naphthyl)anthracene (9,10--19· 145642 . Doc 201041657 di-(naphenthyl)anthracene); 9,10-di-(2-naphthyl) anthracene ("ADN"); 4,4'-double (leaf °,4,4'-bis(carbazol-9-yl)biphenyl ("CBP")); 9,10-bis-[4-(2,2-diphenylvinyl) )-Phenyl]-indole (9,10-bis-[4-(2,2-diphenylvinyl)-phenyl]-anthracene ("BDPVPA")); onion 'N-arylbenzo-benzoate sitting on N-arylbenzimidazoles (such as "TPBI"); 1,4-bis[2-(9-ethyl-3-indolyl)-vinyl]benzene (l,4-bis[2-(9-ethyl-3-) Carbazoyl)vinylenyl]benzene) ; 4,4-bis[2-(9-ethyl-3-indolyl)-extended vinyl]-1 , 1-biphenyl (4,4'-1^3[2 -(9411^1-3-carbazoyl)vinylenyl]-l,l'-biphenyl) ; 9,10-bis[2,2-(9,9-extended fluorenyl) acetamido] 蒽 (9,10 -bis[2,2-(9,9-fluorenylene)vinylenyl] anthracene) ; 1,4-bis[2,2-(9,9-extended fluorenyl)vinyl]benzene (1,4-1^ [2,2-(9,9-£111〇代11丫161^)¥11171611>4 for 61176116); 4,4'-bis[2,2-(9,9-extension)vinyl] -1,1-biphenyl (4,4,-bis[2,2-(9,9-fluorenylene)vinylenyl]-l,l'-biphenyl); flower (pery Lene); substituted perylenes; tetra-tert-butylperylene ("TBPe"); bis(3,5-difluoro-2-(2-° thiol)benzene Bis-difluoro-SP-pyridyGphenyl-p-carboxypyridyl iridium III ("F(Ir)Pic")); pyrene (pyrene) ♦' alternative vane Pyrene); styrylamine; fluorinated phenylene; oxidized oxidazole; 1,8-naphthalene imine (1,8-naphthalimide); (polyquinoline); one or more carbon nanotubes within the PPV; or any combination thereof. 145642. Doc -20- 201041657 For electronic components such as resistors, transistors, capacitors, etc., the organic layer may contain thiophene (eg polythiophene, poly(alkylthiophene), alkylthiophene, bis(dithienothiophene), alkane One or more of thiophene, etc., polyacetylene, pentacene, phthalocyanine, or any combination thereof. Examples of organic dyes include 4-dicyanodecyl-2-indenyl-6-(p-didecylaminostyryl)-4H-pyran (DCM), coumarin, anthraquinone, anthracene, red fluorescens Alkene, a derivative thereof or any combination thereof. An example of an organometallic material contains a functionalized polymer comprising one or more functional groups coordinated to at least one of the metals. Exemplary functional groups encompassed by use include carboxylic acids, carboxylates, sulfonates, sulfonates, groups having a moiety, amines, imines, diimines, N-oxides, phosphines, phosphines Oxide, β-dicarbonyl or any combination thereof. Exemplary metals for use include lanthanide metals (e.g., ruthenium, osmium), Group 7 metals (e.g., ruthenium), Group 8 metals (e.g., ruthenium, osmium), Group 9 metals (e.g., ruthenium) , 铱), a 1st lanthanum metal (eg, palladium, platinum), a steroidal metal (eg, gold), a 12th group of gold Q (eg, a word), a group 13 metal (eg, aluminum) or Any combination of them. The organometallic material contains a metal chelating oxin compound such as tris(8-hydroxyquinoline)aluminum (AlqO; a cyclometallated ruthenium or a platinum electroluminescent compound, such as described in published PCT application WO 02/02714 A complex having a phenyl group, a guanidine, a phenylquinoline or a phenylpyrimidine ligand; as described in, for example, published application No. 2001/0019782, EP 1191612, WO 02/15645, w〇〇2/3 Na and EPH916! Organic metal complexes of the bell; or any mixture thereof. Examples of the co-polymers include poly(phenylene), poly, poly(spirobi), copolymers thereof or any Combination. 145642. Doc -21 - 201041657 The choice of liquid medium can also be an important factor in achieving one or more of the inherent characteristics of a liquid composition. Factors considered in selecting a liquid medium include, for example, the viscosity of the resulting solution, emulsion, suspension or dispersion, molecular weight of the polymeric material, solid loading, type of liquid medium, boiling point of the liquid medium, temperature of the undercoat substrate, The thickness of the organic layer of the guest material or any combination thereof. In some embodiments, the liquid medium contains at least one solvent. Exemplary organic solvents include iS solvent, colloid-forming polymeric acid, hydrocarbon solvent, aromatic hydrocarbon solvent, solvent, cyclic ether solvent, alcohol solvent, glycol solvent, ketone solvent, nitrile solvent, hydrazine solvent, guanamine solvent, or any combination thereof. . Exemplary halogenated solvents include carbon tetrachloride, methylene chloride, trichloropyrene, tetrachloroethane, chlorobenzene, bis(2-chloroethyl)ether, chlorodecylethyl ether, chlorodecyl fluorenyl Ether, 2-vapor ethyl ethyl ether, 2-chloroethyl propyl ether, 2- gas ethyl sulfhydryl linkage or any combination thereof. Exemplary colloid-forming polymeric acids include fluorinated sulfonic acids (e.g., fluorinated alkyl retines, such as fully gasified vinyl acid) or any combination thereof. Exemplary hydrocarbon solvents include pentyl burn, hexazepine, cyclohexane, heptane, octyl, decalin, petroleum ether, ligroine, or any combination thereof. Exemplary aromatic hydrocarbon solvents include benzene, naphthalene, toluene, diphenylbenzene, ethylbenzene, cumene (cumene) 1,3,5-trimethylbenzene (tridecylbenzene), ethyl anthracene, butylbenzene, Cumene (isopropyl toluene), diethylbenzene, isobutylbenzene, tetradecylbenzene, t-butylbenzene, t-butylbenzene, anisole, 4-methylphenyl ether, 3 , 4-dimercaptophenyl oxime ether or any combination thereof. 145642. Doc -22- 201041657 The exemplary ether solvent contains diethyl ether, ethyl propyl ether, dipropyl ether, diisopropyl ether, dibutyl ether, methyl tert-butyl ether, ethylene glycol Ether, diethylene glycol dimethyl ether, benzyl ether 'isochroman, 2_phenylethyl methyl ether, n-butyl ethyl ether, i, diethoxyethane, second butyl ether, Diisobutyl ether, ethyl n-propyl ether, ethyl isopropyl ether, n-hexyl methyl ether, n-butyl methyl shunt, methyl n-propyl _ or any combination thereof. The exemplary cyclic solvent for the soil includes tetrahydrocethane, diterpene, tetrahydro η, Ο 〇 一 恶 、, 4 phenyl 仏 噪 一 一 氧, _ 甲基 、 , 3' dioxol 2,5--f-milyltetrahydrofuran, 2,5-dimethoxy-2,5_ any combination. a ^ Exemplary alcohol solvent includes methanol, ethanol propanol, 2-propanol = butanol, ""propanol (ie, isobutanol): (; also:: butanol pentanol, 2... base - 1-propanyl, b-hexanol, cyclodecyl alcohol, 3-mercaptobutanol, 3-methylpyrene-2-butanol, 2-methyl-butanol, 2,2-dimethylol, 4- Methyl-2-pentanol, 2 methyl ketone-hexanol, 2-hexol 0 hand, 2-methyl-1 _戎醢^ 甲其^ λ·, ^ 1 戍酉 to 2-ethyl butyl Alcohol, 24 - diheptanol, heptanol, 2 · heptanol, heptanol, 2-ethyl-hexanol, 2,6-dimethyl-4-heptanol, earth > hexanol, 3 - It can be taken from p-alcohol, 4-methylcyclohexanol or any of its combinations. A "Alcohol ether solvent can also be used. The alcohol, 2-methyl W-alcohol solvent includes methoxy-2-propionate. Dimethoxyethanol, 2-ethoxyoxanol, mercaptoethanol, 1-methoxy-2-butanol, ethyl isopropyl ether, "ethoxyl = diol monoisobutyl ether, ethylene Alcohol f-milyl butanol 'ethyl early n-butyl ether, 3-decyloxy _3_methyl butyl 145642. Doc •23- 201041657 Alcohol Ethylene mono-t-butyl ether or any combination thereof. Exemplary glycol solvents include ethylene glycol, propylene glycol, propylene glycol monomethyl (tetra) (PGME), dipropylene glycol monomethyl linkage (DpGME), or any combination thereof. Examples of the ketone solvent include acetone, methyl ethyl hydrazine, methyl isobutyl ketone 'cyclohexanone, isopropyl f group, pentanone, 3-pentanone, 3 · ketone, diisopropyl hydrazine, 2-hexanone, cyclopentanone, ..., isoamyl decyl ketone, 3_heptanone, dimethylglycol, 4 methoxy -4- 4 kebendamine, 5 _ methyl _ 3 _ heptanone, 2 _ Methylhexanone, isobutyl ketone, 5-methyl-2-octanone, methylcyclohexanone 2 hexenene ketone, 4-methylcyclohexanone, cycloheptanone, tert-butyl ring Hexanone, isophorone, benzylacetone or any combination thereof. Exemplary nitrile solvents include acetonitrile, acrylonitrile, trichloroacetonitrile, propionitrile, pivalonitrile, isobutyronitrile, n-butyronitrile, methoxyacetonitrile, 2 methylbutyronitrile, isovaleronitrile: N-valeronitrile, Nitrile, 3_methoxypropanol, 3-ethoxypropionitrile, 3,3'-oxydipropionitrile, n-heptanenitrile, glycolonitrile, benzonitrile 'vinyl cyanohydrin, succinonitrile , acetone cyanohydrin, 3-n-butoxypropionitrile or any combination thereof. Exemplary sub-service solvents include dimethyl sulphate, di-n-butyl sulphate, tetramethylene sulfoxide, nonylphenyl sulfoxide, or any combination thereof. Exemplary guanamine solvents include dimethyl ketoamine, dimethyl acetamide, guanamine, 2-acetamidethanol, N,N-dimethyl-m-nonylbenzamide, trifluoroacetamide, N,N-dimethylacetamide, N,N-diethyldodecanamide, E_caprolactam, N,N-diethylacetamide, N_t-butyl decylamine , guanamine, pentamidine, N-butylamine, N,N-dimethylacetamidine, N-methylcartoamine, n,n-diethylformamidine, N _Methylmercaptoethylamine, amine acetate, n, n-diisopropylformamide, b-mercaptopiperidine, N-methylformamide or any of them 145642. Doc -24· 201041657 What combination. The crown ethers contemplated include one or more of the crown ethers which act to help reduce the chloride content of the epoxy compound starting material as part of the treated composition according to the present invention. Exemplary crown ether solvents include benzo- 15 _ crown _ 5 ; benzo-18-crown-6; 12-crown-4; 15-crown-5; 18-crown-6; cyclohexanol _ 15-xu 5;4',4"(5")-di-t-butyldibenzo- 18_ crown_6;4,,4" (5")_di-t-butyldicyclohexanol_18_crown _6; dicyclohexanol _18-crown _6; ❹ monohexanol _24_ crown-8; 4,-aminobenzene-15-crown-5; 4,-aminobenzene _18_ crown _ 6 '2-(Aminoguanidino)_15_Crown_5; 2_(Aminomethyl crown f-amino-5-cis-benzo-3-15_ crown_5; 丨_aza_12_crown_4 ; aza--15_ crown_aza-l-crown-6, benzo-12-crown-4; benzo-15-crown_5; benzo- _9,6, double ((this is _15_ crown) _5)_15_曱基)pimelate; bromobenzo 18 crown-6 '(+)_(18-crown·6)_2,3,11,12-tetra-salt acid; dibenzo-18_ "-Stupid-24_ crown; dibenzo-30-crown-10; ar_ar'_di-t-butyldibenzo-indole 8_ crown_6; 4,_methylmercaptobenzo-indole 5_冠_5 ; 2_(hydroxymethyl fluorenyl) crown _4; 2-(methyl)-15-crown-5; 2-(10)methyl)-18_ crown _6; 4 nitrobenzo -15~crown-5; poly-[(dibenzo-18-crown-6)-co-formaldehyde]; dimethyl mitope-ll-crown _4; diterpene base xishan crown _5; hl_ two Methyl Shi Xi-17- _5; 4 acid sodium; Μ, ι〇, ΐ3_ four-thia-diazabicyclo eighteen _7,16_ burning; outer thiophene or any combination thereof. In addition, the liquid medium contains water. The conductive polymer is mismatched with the water-soluble ' body forming polymeric acid, can be deposited on the substrate and used as a charge transport layer. Many different types of liquid media are described above (eg, toothed solvent, I45642. Doc -25- 201041657 Solvent, aromatic solvent 'water, etc.'. Bulk medium mixture. It is possible to use more than one different type of liquid liquid mixture and more preferably to contain inert materials such as bonding materials, fillers or combinations thereof. With regard to the liquid mixture, the inert material does not significantly affect all of the reaction properties formed by at least a portion of the liquid mixture forming t #μ + a. The layers of 4, electrons, light shots or light shots ^, + - features, for the sake of clarity of description, are contained in the various embodiments described above, and the features may also be described in the same embodiment. Conversely, many of the features of the present invention are for the sake of interspersedness, and many of the features are recited in the same example, and the embodiments can be described separately in the secondary implant. Further, the values of the phase σ described in the range include each and every value within the range. BRIEF DESCRIPTION OF THE DRAWINGS FIG. 1 is a schematic view of an electronic device; FIG. 2 is a view showing an embodiment of a disk having a central hole according to the present invention; FIG. 2 is a side view of the line 3-3; 3 is a main diagram of a nozzle according to the present invention; and FIG. 5 is a schematic view of a nozzle configuration according to the present invention. [Signaling of main components] 100 Organic light-emitting diode 110 anode Layer 120 buffer layer 145642. Doc -26- 201041657 130 EL layer 140 Select layer 150 Cathode layer 200 Disc 202 First side 204 Second side 206 Hole 208 Recessed area Ο 400 Main body 402 Outer edge 404 Opening 500 Linear configuration 502 Nozzle assembly Ο 145642. Doc -27-