201039738 六、發明說明： 【發明所屬之技術領域】 本發明涉及一種散熱裝置，尤係可用於電子元件 散熱之散熱裝置。 【先前技術】 隨著近年來電腦技術之不斷發展，部分視頻圖像 卡（VGA卡）等附加卡逐步採用二單獨處理器來提 0 高其運算速度及操作能力。該二處理器通常由一主 處理器及一輔助處理器組成。通常採用二相同之散 熱模組分別對該二處理器進行散熱。主處理器之功 率較輔助處理器之功率大，其工作時產生之熱量較 辅助處理器產生之熱量多，因此，與主處理器接觸 之散熱模組之溫度較高，而與輔助處理器接觸之散 熱模組溫度較低。如此，造成一散熱模組之散熱負 荷過大，導致主處理器散發之熱量得不到及時散 〇 發，而另一散熱器之散熱效率不高。 【發明内容】 有鑒於此，實有必要提供一種散熱效率較高之散 熱裝置。 一種散熱裝置，用於對電路板上之一第一發熱元 件及一第二發熱元件散熱，其包括一與第一、第二 發熱元件貼設之一均溫板，該均溫板包括一密封之 殼體、位於殼體内之毛細結構及工作液體，一連接 3 201039738 板貼置於均溫板之下表面，複數固定件穿過電路板 並與該連接板配合，從而將均溫板固定於電路板上。 與習知技術相比，本發明之均溫板通過一連接板 固定至電路板上，從而避免了在均溫板上開設螺孔 而破壞其内部之毛細結構、或導致均溫板内部之工 作液體洩漏、或導致外界空氣進入均溫板内等危 害，從而使均溫板之使用更加安全可靠。 【實施方式】 請參閱圖1，其示出了本發明一個較佳實施例中 之散熱裝置，該散熱裝置主要用於對電路板20上之 一第一發熱電子元件21、一第二發熱電子元件23及 分別設置於第一、第二發熱電子元件21、23周圍之 其他電子元件25散熱。在本實施例中，該電路板20 為視頻圖像卡（VGA)，該第一、第二發熱電子元件 21、23為GPU，且第一發熱電子元件21之功率比第 二發熱電子元件23之功率高。 該散熱裝置包括位於電路板20下方之一背板 10、位於電路板20上方之一支架30、固定於支架 30上且分別與第一、第二發熱電子元件21、23貼設 之一均溫板50、貼設于均溫板50上表面之一散熱片 組70、裝設於支架30上且位於均溫板50 —側之一 風扇40及將風扇40、散熱片組70及均溫板50罩設 其内之一風扇罩80。 4 201039738 請同時參閱圖2,該背板1〇包括一縱長之散熱 板11及二支撐架13。該散熱板u為由導熱性能良 好之金屬材料如銘材製成之板體，其熱連接於電路 板20之下表面，用於吸收電路板2〇下表面之埶量。 每一支撐架13呈“十，，字形，用於支撐電路板I散 熱板11上開設有：通孔112,用於分職容二支撐 架13，每一通孔112為正方形以恰好收容其對應之201039738 VI. Description of the Invention: [Technical Field] The present invention relates to a heat dissipating device, and more particularly to a heat dissipating device for dissipating heat of electronic components. [Prior Art] With the continuous development of computer technology in recent years, some additional cards such as video image cards (VGA cards) have gradually adopted two separate processors to increase their computing speed and operation capability. The two processors are usually composed of a main processor and an auxiliary processor. The two processors are usually separately cooled by two identical heat dissipation modules. The power of the main processor is larger than that of the auxiliary processor, and the heat generated during operation is more than the heat generated by the auxiliary processor. Therefore, the temperature of the heat dissipation module in contact with the main processor is higher, and the auxiliary processor is in contact with the auxiliary processor. The cooling module has a lower temperature. In this way, the heat dissipation load of a heat dissipation module is too large, so that the heat dissipated by the main processor is not dissipated in time, and the heat dissipation efficiency of the other heat sink is not high. SUMMARY OF THE INVENTION In view of the above, it is necessary to provide a heat sink having a high heat dissipation efficiency. A heat dissipating device is configured to dissipate heat from a first heat generating component and a second heat generating component on the circuit board, and includes a temperature equalizing plate attached to the first and second heat generating components, wherein the temperature equalizing plate includes a seal The casing, the capillary structure and the working liquid in the casing, a connection 3 201039738 plate is placed on the lower surface of the temperature equalization plate, and a plurality of fixing members pass through the circuit board and cooperate with the connection plate to fix the temperature equalization plate On the board. Compared with the prior art, the temperature equalizing plate of the present invention is fixed to the circuit board through a connecting plate, thereby avoiding the opening of the screw hole on the temperature equalizing plate to break the capillary structure inside or causing the work inside the temperature equalizing plate. The liquid leaks or causes the outside air to enter the uniform temperature plate and so on, so that the use of the temperature equalizing plate is safer and more reliable. [Embodiment] Please refer to FIG. 1 , which shows a heat dissipating device in a preferred embodiment of the present invention. The heat dissipating device is mainly used for one of the first heat-generating electronic components 21 and a second heat-generating electron on the circuit board 20 . The element 23 and the other electronic components 25 disposed around the first and second heat-generating electronic components 21, 23 respectively dissipate heat. In this embodiment, the circuit board 20 is a video image card (VGA), the first and second heat-generating electronic components 21, 23 are GPUs, and the power of the first heat-generating electronic component 21 is higher than that of the second heat-generating electronic component 23. The power is high. The heat dissipating device includes a backing plate 10 located below the circuit board 20, a bracket 30 above the circuit board 20, and is fixed on the bracket 30 and is respectively cooled with one of the first and second heat-generating electronic components 21 and 23 The plate 50, the heat sink group 70 attached to the upper surface of the temperature equalizing plate 50, the fan 40 mounted on the bracket 30 and located on the side of the temperature equalizing plate 50, and the fan 40, the heat sink group 70 and the temperature equalizing plate 50 is provided with a fan cover 80 therein. 4 201039738 Please also refer to FIG. 2, the back panel 1〇 includes a longitudinal heat sink 11 and two support frames 13. The heat dissipating plate u is a plate body made of a metal material such as a material having good thermal conductivity, and is thermally connected to the lower surface of the circuit board 20 for absorbing the amount of the lower surface of the circuit board 2. Each of the support frames 13 has a ten-shaped shape for supporting the circuit board. The heat dissipation plate 11 is provided with a through hole 112 for dividing the support frame 13 and each of the through holes 112 is square to just accommodate the corresponding one. It
一支撐架13。可以理解地，支撐架13及通孔112之 形狀不限於此。 該支架30由導熱性能佳之材料製成，較佳地， 其可採用銘材製成，其包括一大致呈方形之本體Μ 及自本體31 —端向外延伸之—弧形之延伸部％。該 之中部開設—方形通孔314，用於與均溫板 " 支架30上遠離電路板20插腳所在側之第 側之頂面凸伸有複數散熱柱312,且該等散熱柱 架2:本Γ31之長度方向間隔排列，以充分利用支 :、之表面來輔助散發支架30吸收之熱量。該支 =相對二第二側兩端向内凸伸有二_之承載 側相鄰 承载均溫板5〇,且該二第二側與第- !相鄰。母一承載部316由二間 =接二承載片3162之一連接片3164組=62 承載片3162均為方报夕H挪 氣人一 之第-側之分別位於本體31 對設置^ 鄰拐角處。二承載部316之開口相 母承載片3162上開設有一安裝孔3165。 5 201039738 均溫板50承載於承載部316且容置於本體3ι之通 孔314，用於與電路板20上之第―、第：發熱電= 元件21、23配合。該風扇40裝設於延伸部％之中 部’用以冷卻均溫板50及散熱片組70。本體31 底緣用以貼設電路板20上之其他電子元件乃。之 一 只嚴J上及與頂A support frame 13. It is to be understood that the shape of the support frame 13 and the through hole 112 is not limited thereto. The bracket 30 is made of a material having good thermal conductivity. Preferably, it can be made of a material which includes a substantially square body Μ and an arc-shaped extension portion extending outward from the end of the body 31. The middle portion is provided with a square through hole 314 for projecting a plurality of heat dissipation columns 312 on a top surface of the temperature equalization plate on the side of the bracket 30 away from the side of the circuit board 20 pin, and the heat dissipation column 2: The lengths of the tops 31 are spaced apart to fully utilize the surface of the support to dissipate the heat absorbed by the holder 30. The support is opposite to the second side of the second side, and the two sides of the second side are inwardly projecting with the temperature equalizing plate 5〇, and the second side is adjacent to the first! The mother-bearing portion 316 is connected by two of the two-bearing-supporting pieces 3162, and the connecting piece 3164 is set to 62. The supporting piece 3162 is the first side of the side of the body, and is located at the corner of the body 31. . A mounting hole 3165 is defined in the opening mother carrier piece 3162 of the second carrying portion 316. 5 201039738 The temperature equalizing plate 50 is carried on the carrying portion 316 and is received in the through hole 314 of the main body 3i for cooperating with the first and second heating elements=21, 23 on the circuit board 20. The fan 40 is mounted in the middle portion of the extension portion for cooling the temperature equalization plate 50 and the heat sink group 70. The bottom edge of the body 31 is used to attach other electronic components on the circuit board 20. One of the strict J and the top
盍51配合之一大致呈碗狀之底蓋53。該頂蓋51及 底盍53共同圍成一密封之腔室，以收容毛細結構（未 圖不）及工作液體（未圖示）於其内，優選地，該 腔至被抽成真空。該頂蓋51 _側中部開設有一 口形 缺口 513，以與支架30配合。該底蓋53中部向下^ 伸，並在頂面形成一容置空間（未目示） 空間在頂蓋5i覆蓋於底蓋53上時形成上述密封之 該底蓋53向下凸伸之中部即形成均溫板50 與弟一、第二發熱電子元件21、23貼設之吸熱部。 =外’底蓋53對應頂蓋51開〇513處開設有一對 應之U形開口 533,以與支架3()配合。該底蓋幻 下表面之㈣分別形成二開σ相對之u形臺階部 54’該二U形臺階部54與二承载部316之結構相適 愿。 二U形連滅60焊接于均溫板％之底蓋以 -臺階部54 ，其可以採用片狀金屬材料一體沖壓 而成。每-連接板6G包括二平行且間隔設置之方形 6 201039738 ΟThe cymbal 51 is fitted with a substantially bowl-shaped bottom cover 53. The top cover 51 and the bottom cymbal 53 together define a sealed chamber for receiving a capillary structure (not shown) and a working fluid (not shown) therein, preferably the chamber is evacuated. The top cover 51 has a mouth-shaped notch 513 in the middle of the side to cooperate with the bracket 30. The bottom cover 53 is downwardly extended, and an accommodating space (not shown) is formed on the top surface. When the top cover 5i covers the bottom cover 53, the bottom cover 53 is formed to protrude downward. The heat absorbing portion of the temperature equalizing plate 50 and the first heat generating electronic components 21 and 23 is formed. The outer bottom cover 53 is provided with a pair of U-shaped openings 533 corresponding to the opening 513 of the top cover 51 to cooperate with the bracket 3 (). The (4) of the lower surface of the bottom cover respectively forms a U-shaped step portion 54' opposite to the opening σ, and the two U-shaped step portions 54 are compatible with the structure of the two carrying portions 316. The two U-shaped joints 60 are welded to the bottom cover of the temperature equalizing plate % - a step portion 54 which can be integrally stamped with a sheet metal material. Each of the connecting plates 6G includes two parallel and spaced squares 6 201039738 Ο
連接片61及位於二連接“i之間且垂直連接二連 接片之-過渡片63。二連接片61上分別開設有 一螺孔612，用於與螺釘9 2配合，從而降低了在均 溫板50上開設螺孔所帶來危害之機率，例如，破壞 均溫板5G内部之毛細結構、或導致均溫板％内部 之工作液體茂漏、或導致外界空氣進人均溫板％内 等，從而使均溫板50之使用更加安全可靠。二連接 片61之間之間距等於或稍大於底蓋53最外端之寬 度。每一連接板60收容于均溫板5〇之二臺階部54 處。 該散熱片組70由複數縱長之散熱片71組成。該 等散熱片71之相對兩侧相互卡合、其他部分間隔且 平行設置。每一散熱片71之頂端一角被傾斜向下地 切掉一二角形之部分，從而使散熱片組7〇之頂端一 侧形成一向下傾斜之斜面73。該斜面73用於將風扇 40產生之氣流導入散熱片組7〇。散熱片組7〇裝設 于均溫板50之頂蓋51之上表面，用於散熱均溫板 50吸收之熱量。 該風扇罩80包括將散熱片組7〇及均溫板5〇罩 設其内之一第一罩設部81及將風扇4〇罩設其内之 一第二罩設部83。第一罩設部81包括一大致呈方形 之頂板813及自頂板813相對兩側邊緣垂直向下延 伸之二侧板815。該第一罩設部81之二側板815固 7 201039738 定於支架30之本體31之上方。支架30之本體31 上之凸柱312位於側板815之外側。該第二罩設部 83為與第一罩設部81連通之圓柱形結構，包括一中 部開有圓形開口 831之頂板833及自頂板833周緣 向下延伸之側板835。該側板835固定於支架30之 延伸部33之上方，且其開口 833與風扇40對應。 請同時參閱圖3及圖4，上述散熱裝置組裝時， ^ 先將二連接板60焊接至均溫板50之底蓋53下表面 〇 之臺階部54處並使其與支架30之二承載部316對 應，同時將散熱片組.70焊接在均溫板50之頂蓋51 之上表面，併使散熱片組70具有斜面73之一端靠 近支架30之延伸部33。然後使均溫板50上之連接 板60承載於承載部316且使均溫板50向下凸伸之 吸熱部容置於本體31之通孔314。風扇40裝設於支 架30延伸部33上表面之中部。將風扇罩80裝設於 ❹ 支架30上。將背板10之散熱板11貼設在電路板20 之下表面。複數螺釘91穿過散熱板11之邊緣、電 路板20並與風扇罩80配合，從而將散熱板11及風 扇罩80固定在電路板20相對兩侧。八螺釘92穿過 背板10之支撐架13之各角及電路板20，其中四螺 釘92與電路板20螺合，另外四螺釘92穿過支架30 之承載部316之安裝孔3165並與連接板60之螺孔 612螺合，從而將均溫板50固定在電路板20上。 8 201039738 使用時，第一、第二發熱電子元件21、23之熱 量被均溫板50吸收後傳導至散熱片組70。由於第 一、第二發熱電子元件21、23之功率不同，兩者散 發之熱量也不同，均溫板50不同位置吸收熱量後， 其内之工作液體將該等熱量傳導至均温板50之各 處，從而使均溫板50均勻地將第一、第二發熱電子 元件21、23之熱量傳導至其上之散熱片組70上。 風扇40啟動’使外界之冷空氣自風扇罩8〇之開口 831進入第二罩設部83，然後流向第一罩設部81内 之散熱片組7 0 ’最後自第一罩設部81之一端流出， 從而冷卻散熱片組70及均溫板50。 综上所述’本發明確已符合發明專利之要件，遂 依法提出專利申請。惟，以上所述者僅為本發明之 較佳實施方式，自不能以此限制本案之申請專利範 圍。舉凡熟悉本案技藝之人士援依本發明之精神所 作之等效修飾或變化，皆應涵蓋於以下申請專利範 圍内。 【圖式簡單說明】 圖1係本發明散熱裝置之立體分解圖。 圖2係圖1之倒置圖。 圖3係圖1中散熱裝置之部分分解圖。 圖4係圖1中散熱裝置之組裝圖。 【主要元件符號說明】 9 201039738 背板 支撐架 第一發熱電子 元件 其他電子元件 本體 風扇 頂蓋 臺階部 連接片 散熱片組 風扇罩 第二罩設部 通孔 承載部 螺孔 頂板 承載片 安裝孔 散熱板 11 電路板 20 第二發熱電 子 丁 23 元件 支架 30 延伸部 33 均溫板 50 底蓋 53 連接板 60 過渡片 63 散熱片 71 第一罩設部 81 螺釘 91、92 314散熱柱 312 開口 533、 831 缺口 513 833側板 815、 835 連接片 3164The connecting piece 61 and the transition piece 63 are disposed between the two connecting "i" and perpendicularly connecting the two connecting pieces. The two connecting pieces 61 respectively have a screw hole 612 for engaging with the screw 92, thereby reducing the temperature equalizing plate. The probability of damage caused by the opening of the screw hole on the 50, for example, destroying the capillary structure inside the 5G of the temperature equalizing plate, or causing the working liquid inside the temperature equalizing plate to leak, or causing the outside air to enter the temperature equalizing plate, etc., thereby The use of the temperature equalizing plate 50 is more secure and reliable. The distance between the two connecting pieces 61 is equal to or slightly larger than the width of the outermost end of the bottom cover 53. Each connecting plate 60 is received at the step portion 54 of the temperature equalizing plate 5 The fin group 70 is composed of a plurality of longitudinal fins 71. The opposite sides of the fins 71 are engaged with each other, and other portions are spaced and arranged in parallel. One corner of each fin 71 is cut obliquely downward. a portion of a square shape such that a top side of the fin group 7 is formed with a downwardly inclined slope 73. The slope 73 is used to introduce the airflow generated by the fan 40 into the heat sink group 7〇. Above the top cover 51 of the temperature equalization plate 50 The heat is absorbed by the heat dissipation temperature plate 50. The fan cover 80 includes a first cover portion 81 for covering the heat sink group 7 and the temperature equalization plate 5, and the fan 4 is covered therein. A second cover portion 83. The first cover portion 81 includes a substantially square top plate 813 and two side plates 815 extending vertically downward from opposite side edges of the top plate 813. The first cover portion 81 The side plate 815 solid 7 201039738 is positioned above the body 31 of the bracket 30. The protrusion 312 on the body 31 of the bracket 30 is located on the outer side of the side plate 815. The second cover portion 83 is a cylindrical shape communicating with the first cover portion 81. The structure includes a top plate 833 having a circular opening 831 in the middle and a side plate 835 extending downward from the periphery of the top plate 833. The side plate 835 is fixed above the extending portion 33 of the bracket 30, and the opening 833 thereof corresponds to the fan 40. Referring to FIG. 3 and FIG. 4, when the heat dissipating device is assembled, the two connecting plates 60 are first welded to the step portion 54 of the lower surface of the bottom cover 53 of the temperature equalizing plate 50 and are coupled to the carrier portion 316 of the bracket 30. Correspondingly, the heat sink group .70 is welded to the upper surface of the top cover 51 of the temperature equalizing plate 50, and The fin group 70 has one end of the inclined surface 73 adjacent to the extending portion 33 of the bracket 30. Then, the connecting plate 60 on the temperature equalizing plate 50 is carried on the carrying portion 316, and the heat absorbing portion that protrudes downward from the temperature equalizing plate 50 is received in the body 31. The through hole 314. The fan 40 is mounted on the upper surface of the upper surface of the extension portion 33 of the bracket 30. The fan cover 80 is mounted on the cymbal holder 30. The heat dissipation plate 11 of the back plate 10 is attached to the lower surface of the circuit board 20. The plurality of screws 91 pass through the edge of the heat sink 11 and the circuit board 20 and cooperate with the fan cover 80 to fix the heat sink 11 and the fan cover 80 on opposite sides of the circuit board 20. The eight screws 92 pass through the corners of the support frame 13 of the backboard 10 and the circuit board 20, wherein the four screws 92 are screwed into the circuit board 20, and the other four screws 92 pass through the mounting holes 3165 of the carrier portion 316 of the bracket 30 and are connected thereto. The screw holes 612 of the plate 60 are screwed to fix the temperature equalizing plate 50 to the circuit board 20. 8 201039738 In use, the heat of the first and second heat-generating electronic components 21, 23 is absorbed by the temperature equalizing plate 50 and then conducted to the heat sink group 70. Since the power of the first and second heat-generating electronic components 21, 23 is different, the heat radiated by the two is different. After the heat-absorbing plate 50 absorbs heat at different positions, the working liquid therein transfers the heat to the temperature equalizing plate 50. In all places, the temperature equalizing plate 50 uniformly conducts the heat of the first and second heat-generating electronic components 21, 23 to the heat sink group 70 thereon. The fan 40 activates 'the outside cold air from the opening 831 of the fan cover 8 into the second cover portion 83, and then flows to the heat sink group 70 in the first cover portion 81. Finally, from the first cover portion 81 One end flows out to cool the fin group 70 and the temperature equalizing plate 50. In summary, the present invention has indeed met the requirements of the invention patent, and has filed a patent application according to law. However, the above is only a preferred embodiment of the present invention, and it is not possible to limit the scope of the patent application of the present invention. Equivalent modifications or variations made by those skilled in the art to the spirit of the invention are intended to be included in the following claims. BRIEF DESCRIPTION OF THE DRAWINGS Fig. 1 is an exploded perspective view of a heat sink of the present invention. Figure 2 is an inverted view of Figure 1. Figure 3 is a partially exploded view of the heat sink of Figure 1. 4 is an assembled view of the heat sink of FIG. 1. [Main component symbol description] 9 201039738 Backplane support frame first heating electronic component Other electronic component body Fan top cover Step connection piece Heat sink group Fan cover Second cover part Through hole bearing part Screw hole Top plate Carrier piece Mounting hole heat dissipation Board 11 circuit board 20 second heat-generating electronic unit 23 component holder 30 extension portion 33 temperature equalization plate 50 bottom cover 53 connection plate 60 transition piece 63 heat sink 71 first cover portion 81 screw 91, 92 314 heat dissipation post 312 opening 533, 831 notch 513 833 side panel 815, 835 connecting piece 3164