Ο Ο 201038162 六、發明說明： 【發明所屬之技術領域】 t發明係指一種「印刷電路板製 一種 應用乾式製程之印刷電路板製法。 【先前技術】 按’印刷電路板（prlntedclreultB〇ard;簡 門：PCB) $各種電器產品的基本配備，故應用範 K佈民生家书、產業機械及國防科學上，而且該 p:電路板製造業是集材料、電學、機械、化學、 學及管理科學（電路佈局）的綜合工業，因此被 ^為是m統產品之母」或「3g產業之基礎」， 足證印刷電路板在電子產品中的地分重要 性。 同夺a 了於印刷電路板中之金屬層形成線路 圖案化u路層，經常使用例如餘刻（Etchingk 方式t评而言之，在藉由#刻方式形成圖案化線 路結構時’必須先在該印刷電路板中之金屬層上以 顯影技術—叫）形成-圖案化之阻層，該 阻層可為光阻或乾膜等材料，藉以覆蓋住欲圖案化 之線路結構，接著’進行用於形成線路結構之蝕刻 技術’以移除該線路結構外之金屬I，進而留下— 圖案化之線路結構。Ο Ο 201038162 VI. Description of the invention: [Technical field to which the invention pertains] t invention refers to a method of manufacturing a printed circuit board using a printed circuit board for a dry process. [Prior Art] Press 'Printed circuit board (prlnted clreult B〇ard; Jane Door: PCB) $Basic equipment for various electrical products, so the application of Fan K Bu Minsheng's book, industrial machinery and national defense science, and the p: circuit board manufacturing is a collection of materials, electricity, machinery, chemistry, science and management science ( The integrated industry of circuit layout) is therefore the mother of m products or the foundation of 3g industry, which proves the importance of printed circuit boards in electronic products. Forming a line patterned u-layer with a metal layer in a printed circuit board, often using, for example, a residual (Etchingk method t-review, when forming a patterned line structure by #刻" must first The metal layer in the printed circuit board is formed by a developing technique-called a patterned resist layer, which may be a material such as a photoresist or a dry film, thereby covering the circuit structure to be patterned, and then performing The etching technique for forming the wiring structure is to remove the metal I outside the wiring structure, thereby leaving a patterned circuit structure.
201038162 -般所謂的蝕刻技術係泛指使用物理或化學 :::來移除一材料，目前常用的钱刻方式包括濕式 蝕』（wetEtching)與乾式钱刻（叫叫一）。 濕式㈣係以化學溶液方法進㈣刻程序，例如將 材料浸沒於化學溶液中’利用化學溶液與材料產生 化學作用’以逐層移除與該化學溶液接觸之材料表 面原子。乾式_則是以物理方式進行㈣程序， 例如利用電漿離子來轟擊材料原子或是將電浆離 子與材料原子產生化合反應’藉以達到移除材料之 目的。 惟，濕式蝕刻中，化學溶液對於材料所進行的 侵蝕作用並沒有特定的方向性，而為一種等向性 (Isotropic )蝕刻，因此在向下蝕刻時將導致例如 底切（Undercut )現象，影響圖案化製程之精度。 再者，應用此種濕式蝕刻時，影響該蝕刻製程 之反應速率變數包括藥液選擇、藥液濃度、溫度、 反應時間、壓力與接觸面積等因素，其中，藥液選 擇、藥液濃度、溫度 '反應時間 '壓力等變數可依 製程需求而達最佳化，但是反應藥液與反應物質間 之接觸面積則會因實際需求之圖案化結構而有所 改變；例如’當接觸面積變大時，藥液流經未被顯 影之光阻所形成之阻力變小’新的藥液能較快速地 替換舊的藥液’進而提升反應速率，因此在蝕刻製 4 201038162 程中接觸面積較大者會產生較大之㈣反應。換言 之’此種習知技術所需的處理技術均較為複雜，故 夕半要由專業的代工廠處理，而使電路板的製程無 法一貫作業，導致製造時間及成本均居高不下。’…201038162 - The so-called etching technique generally refers to the use of physics or chemistry ::: to remove a material, currently used in the form of money etching (wetEtching) and dry money engraving (calling a). The wet type (4) is carried out by a chemical solution method, for example, by immersing the material in a chemical solution 'chemically reacting with the material using a chemical solution' to remove the surface atoms of the material in contact with the chemical solution layer by layer. Dry _ is a physical process (4), such as using plasma ions to bombard material atoms or chemically reacting plasma ions with material atoms to achieve material removal. However, in wet etching, the chemical solution does not have a specific directional effect on the etching of the material, but is an isotropic etching, which causes, for example, an undercut phenomenon when etched down. Affect the precision of the patterning process. Furthermore, when such wet etching is applied, the reaction rate variables affecting the etching process include factors such as liquid selection, concentration of the liquid, temperature, reaction time, pressure and contact area, among which, the liquid selection, the concentration of the liquid, The temperature 'reaction time' pressure and other variables can be optimized according to the process requirements, but the contact area between the reaction liquid and the reaction material will change due to the actual demanded patterned structure; for example, 'when the contact area becomes larger When the chemical solution flows through the undeveloped photoresist to reduce the resistance, the new liquid can replace the old liquid solution more quickly, thereby increasing the reaction rate, so the contact area is larger in the etching process 4 201038162 The person will produce a larger (four) response. In other words, the processing techniques required for such conventional techniques are relatively complicated. Therefore, it is handled by a professional foundry, and the process of the circuit board cannot be consistently operated, resulting in high manufacturing time and cost. ’...
至於一般習用的乾式蝕刻，係以 刻表面’主要係在裁切、厂堅合一具有銅箱之 後’再藉由機具以例如濺擊蝕刻（sputtering 咖叫）或電漿姓刻（piasmaEtching)等方式來 而’雖錢擊㈣或電槳㈣所具非等向性 s( SGU()Ple )之㈣特性可以縮小導線線寬，但 呈中僅能採用低蝕刻速率，故只適用於厚度較 ::半導體晶片（例如數個奈米（nm))，對於厚度 又:（例如5至3〇μΐΏ)之印刷電路板而言，則將 毛相當高之a寺間成本’且所需的設 亦無法於—拉从τ〜^ 1貝 改善之缺點“工廠内獨立完成’因此仍存在需要 【發明内容】 本發明之一目的在 般的工廠内獨立完 鑑於前逑習知技術之缺失， 於提供—種電路板製法，俾於— 成製程。 本發明之另 目的在於提供一種可縮減製造成 5 201038162 本及時間之印刷電路板製法。 為達上述目的及盆仙 ，、他目的，本發明提供一種印 刷電路板製法’該製法包括：提供一基板；提供一 銅猪’該㈣上形成有輯，而該線路μ置有剝 離性基材’以及以膠結合該銅簿與該基板。 於一貫施態樣47，可挺At i r 了如供一銅·治，該銅箔於相 對表面分別設有筮—人& ν、° a層以及線路，而該線路上As for the conventional dry etching, the surface is 'mainly after cutting, the factory is firmly equipped with a copper box' and then by means of tools such as splashing or piasmaEtching. The way to 'but the money hit (four) or the electric paddle (four) has the non-isotropic s (SGU () Ple) (four) characteristics can reduce the wire width, but only in the low etch rate, so only for thickness ::Semiconductor wafers (for example, several nanometers (nm)), for printed circuit boards with thickness: (for example, 5 to 3 〇μΐΏ), the cost of a temple is quite high, and the required design It is also impossible to pull the shortcomings from the improvement of τ~^1, "there is a complete completion in the factory", so there is still a need. [Inventive content] One of the objects of the present invention is independent in the factory, in view of the lack of the prior art, The present invention provides a method for manufacturing a printed circuit board which can be reduced to 5 201038162 and the time. In order to achieve the above object and the purpose of the invention, the present invention Providing a printed circuit The method of manufacturing comprises the steps of: providing a substrate; providing a copper pig, wherein the line is formed with a release substrate, and the line is provided with a peelable substrate and bonding the copper book and the substrate with glue. 47, can be quite At ir, for a copper treatment, the copper foil on the opposite surface is provided with 筮-人& ν, ° a layer and line, and on the line
設置有剝離性基材；提供一 促1、 基板，邊基板一表面設 有第二結合層；以及將該第-結合層對接該第二結 合層，以壓合結合該銅荡與該基板。 當然’並未限制提供該基板與該銅笛之順序， 亦即i亦可僅设置一層結合層於該基板與該銅箔 之間，4者是僅S置一層結合層於該銅帛以及該基 板其中-者之表面，較佳地，該結合層係為銅鋁膠 層 前述「印刷電路板製法」中，形成該第一結合 層與該線路之順序可為先形成該線路再形成該第一 結合層、先形成該第一結合層再形成該線路、或者 同時形成該線路與該第一結合層，其中，形成該線 路之方式係採用選自包括雷射加工、銑刀銑製二印 刷及壓切成型之方式所組成群組之其中一者。該第 一結合層與該第二結合層係為銅鋁膠層，以供對應 壓合結合該銅箱與該基板。該剝離性基材係為離型 紙。同時，復可包括移除該剝離性基材之步驟，於 6 201038162 • 移除該剝離性基材之後，係可施以選自包括防銹、 • 塗佈保護塗層、及清洗之製程所組成群組之其中一 者。該基板則可為選自包括鋁基板'玻璃纖維基板、 以及玻璃基板所組成群組之其中一者。 相較於習知技術，本發明分別於基板與銅箔設 • 置結合層，並以剝離性基材覆蓋銅猪之線路，於一 _ 般的工廠内即可獨立完成製程，故可解決習知技術 〇 中因處理技術複雜所增加之製造時間及成本，相對 可縮減製造成本及時間之印刷電路板製法。 -貫施方式】 為使貝審查委員能清楚了解本發明之内容，僅 以下列S兒明搭配圖式，說明如后。 〇 立弟1及第2圖依本發明第一實施例所繪製之示 心圖如第1圖配合第2圖所示，本發明係將一銅 :"1 )以一結合層（1 2 )結合至一基板（丄 θ本實施例之印刷電路板製法包括：步驟100, 供该基板（1 2# 土板（1 3 )可為例如|呂基 ;步驟20。，提供該鋼落（i丄），該銅落（ j形成有該線路（113)，而該線路（ii3)上 *又置有剝離性基材（ ^ ^ ^ - r 1 1 5 );步驟300，以及以膠 …鋼1 1 )與該基板（i 3 )。 、本貝知例，係以例如為銅鋁膠層之結合層（工 )來結合該基板（13)與編（11)，結合 7 201038162 . 該基板（1 3 )與該銅箱（1 !)之後再移除該線 . 路（1 1 3 )上所貼覆之剝離性基材（1 1 5 )。其 中，可先在板具或其他等效裝置中形成該結合層（1 2 )，使該結合層（丄2 )呈—片狀之膠層，再提供 至本貫施例。 ' 如第2圖所示，本實施例係由下上而分別提供 ' 該基板（1 3 )、該結合層（1 2 )、具有該線路（丄 ο 13)之銅治（11)、以及該剝離性基材（115)， 並將之結合在-起；但應注意的是，所屬技術領域 中具通常知識者亦可依本發明之概念加以變化。例 士可先提供该基板（1 3 )，例如以塗佈銅鋁膠之 方气在α亥基板（1 3)上形成該結合層（1 2)， 然後將該銅箱（1 1 )形成於該基板（1 3 )，並在 σ亥銅白（1 1 )上形成該線路（1 1 3 )，再貼覆該 剝離性基材（1 1 5 )，而該剝離性基材（1 1 5 ) 0 則可為離型紙。 換s之，本實施例係於銅箔以及基板之間失設 、'’口 σ層，但於其他實施例中，亦可於該銅箔以及 忒基板至少其中一者之表面設有一結合層。 第3至第7圖依本發明第二實施例所繪製之示 思圖’與第—實施例相同或相似之元件或步驟，係 以相同或相似的元件符號表示之，並省略詳細之說 明。 弟一實施例係於銅箔以及基板之間夾設〜結合 8 Ο ❹ 201038162 層’第二實施例則於該銅箔 形成結合層。 …该基板之表面分別 如弟3圖所示，本發明 牛 印刷電路板製法包括：A peeling substrate is disposed; a substrate is provided, and a surface of the substrate is provided with a second bonding layer; and the first bonding layer is butted to the second bonding layer to press-bond the copper to the substrate. Of course, the order of providing the substrate and the copper flute is not limited, that is, i may also be provided with only one bonding layer between the substrate and the copper foil, and the other is that only S is provided with a bonding layer on the copper bead and the Preferably, the bonding layer is a copper-aluminum rubber layer. In the above-mentioned "printed circuit board manufacturing method", the order of forming the first bonding layer and the circuit may be to form the line first to form the first a bonding layer, first forming the first bonding layer to form the circuit, or simultaneously forming the circuit and the first bonding layer, wherein the way of forming the circuit is selected from the group consisting of laser processing, milling and milling And one of the groups formed by the method of press forming. The first bonding layer and the second bonding layer are copper-aluminum adhesive layers for correspondingly bonding and bonding the copper box and the substrate. The release substrate is a release paper. Meanwhile, the step of removing the peelable substrate may be performed at 6 201038162. After removing the peelable substrate, a process selected from the group consisting of rust prevention, coating protection, and cleaning may be applied. Form one of the groups. The substrate may be one selected from the group consisting of an aluminum substrate 'glass fiber substrate, and a glass substrate. Compared with the prior art, the present invention separately sets a bonding layer between the substrate and the copper foil, and covers the copper pig line with a peeling substrate, and the process can be independently completed in a general factory, so the solution can be solved. In the know-how, the manufacturing time and cost increased due to the complexity of the processing technology, and the printed circuit board method which can reduce the manufacturing cost and time. - The method of the present invention. In order to make the contents of the present invention clear to the members of the Board of Directors, the following S. 〇立弟1 and Fig. 2 are diagrams according to the first embodiment of the present invention. As shown in Fig. 1 and Fig. 2, the present invention uses a copper: "1) as a bonding layer (1 2 Bonding to a substrate (丄θ The printed circuit board manufacturing method of the embodiment includes: step 100, for the substrate (1 2# earth plate (1 3 ) may be, for example, | Luji; step 20), providing the steel drop ( i丄), the copper drop (j is formed with the line (113), and the line (ii3) is further provided with a peelable substrate (^^^-r1 15); step 300, and with glue... Steel 1 1 ) and the substrate (i 3 ). In this example, the substrate (13) and the braid (11) are bonded by a bonding layer such as a copper-aluminum rubber layer, in combination with 7 201038162. After the substrate (13) and the copper box (1!), the stripping substrate (1 15) attached to the line (1 1 3) is removed. Among them, the board or other The bonding layer (12) is formed in the equivalent device, and the bonding layer (丄2) is provided as a sheet-like adhesive layer, and is supplied to the present embodiment. As shown in Fig. 2, the embodiment is Providing 'the substrate (1 3 ), the bonding layer separately (1 2 ), the copper rule (11) having the line (丄ο 13), and the release substrate (115), and combining them; however, it should be noted that The knowledge can also be changed according to the concept of the present invention. The substrate can be provided by a person (1 3 ), for example, by forming a bonding layer of a copper-aluminum rubber on the α-hai substrate (13) (1 2). Then, the copper box (1 1 ) is formed on the substrate (1 3 ), and the line (1 1 3 ) is formed on the sigma copper white (1 1 ), and the peelable substrate is attached. 1 5), the release substrate (1 15) 0 can be a release paper. In other words, the present embodiment is a copper foil and a substrate between the substrate, the ''single layer, but other implementations In an example, a bonding layer may be disposed on a surface of at least one of the copper foil and the germanium substrate. The third to seventh embodiments of the present invention are the same as the first embodiment or The same elements or steps are denoted by the same or similar reference numerals, and the detailed description is omitted. One embodiment is based on the copper foil and the substrate. 8 Ο ❹ 201038162 layer 'of the second embodiment of the bonding layer formed on the copper foil surface of the substrate ... respectively as shown in FIG. 3 brother, bovine printed circuit board manufacturing method according to the present invention comprises:
乂驟1 0 0 ，提供一銅落，兮^ A . 5亥鋼·治於相對表面分別 設有第一結合層以及線路， 神其从止 而该線路上設置有剝離 抓右琶^ 杈夂―基板，該基板一表面 Γ 結合層；以及步驟咖’，將該第-結合 層對接该第二結合層，以壓 & 口結合該銅箱與該基板。 於本貫施例中，如第4 弟4圖所示，係提供一銅箔（1 1 )，該銅箔（1 1 )具有柏 反兮京. 對之第一與第二表面， 在該弟一表面形成一第—社八 、。〇層（111)，在 二表面形成線路（1 1 1、 、丄丄d )，而該線路（工工3 )上 則設置剝離性基材（丄]ς J J上 〇 J。可例如塗佈一展呈古 結合介質之膠層作為該第 s /、有 次弗—結合層（1 1 膠層可為銅鋁膠層或其他常 θ )，且此 等效膠層。 、、·、。5印刷電路板之 該銅箔上形成該線路（ 工廠即可選用的方式，例如3 )的方法是以一般 印刷或壓切成型、或i 田射加工、銑刀銑製、 其中，係可選擇先形成2形成線路的等效方式。 第一結合層（1丄5 ).,路（1 1 3 ),再形成該 b )，或者，係券 層（1 1 5 )，再形成 係先形成該第一結合 同時形成該線路（1飞 丄d )，或者，係 5)。 3)與該第-結合層（11 9 201038162 • 當形成该線路（1 1 3 )後，再覆貼該剝離性基 . 材（1 1 5 )’以由該剝離性基材（1 1 5 )固定該 線路（1 1 3 )而不易散脫’而構成—待塵合的線 路銅片。 如第5圖所示，係提供一基板（丄3 )，其規格 - 和前述之銅箱（1 1 )相搭配，在其一侧塗佈具有 結合介質之膠層作為第二結合層（1 3 1 )，而構成 0 一待壓合基板。於本實施例與第一實施例中，該基 板（1 3 )係皆為易於散熱的鋁基板，而其他實施 例中，亦可因應设計需求，而使用玻璃纖維基板、 玻璃基板或其他適當基板，而非侷限於本實施例中 所述者。 當欲結合第4與第5圖之構件時，可使該第一結 。層（1 1 5)與該第二結合層（工31)彼此面 對面，然後壓合該銅箔（丄丄）與該基板（丄3 )， 〇 如第6圖所示；之後，可取下該剝離性基材（1 1 5 )’如第7圖所示。此外，在取下該剝離性基材（1 j 5 )後，可施以防銹、塗佈保護塗層、或者清洗 等處理。移除該剝離性基材（丄丄5 )之後，便可 供後續製程使用本發明所製成之印刷電路板。 應了解的是，亦可於該銅箔或該基板其中一者 之表面形成一結合層即可。由於此為所屬技術領域 中具有通常知識者可理解並據以實施者，故於此不 再多做說明。 10 201038162 第8圖係依本發明第三實施例所繪製之示意 ®，如第8圖所示，亦可為形成非立體線路（工上 3 ‘）、或其他設計所需之線路。亦即，為了便於顯 示與說明，第二實施例中之線路（1 i 3)係為立 體線路，但並非以此限制本發明。 使用本發明時’將可使-般單面板或雙面板之 線路在製板的過程後立即實施，在卫廠内直接一貫Step 1 0 0, provide a copper drop, 兮 ^ A. 5 Hei Steel · The opposite surface is provided with a first joint layer and a line, and the god is stopped and the line is provided with a peeling and grabbing right 琶 ^ 杈夂a substrate, the surface of which is bonded to the substrate, and a step of: bonding the first bonding layer to the second bonding layer to bond the copper case and the substrate with a pressure & In the present embodiment, as shown in the fourth brother 4, a copper foil (1 1 ) is provided, and the copper foil (1 1 ) has a cypress and a second surface. On the other hand, the younger brother formed a first-social VIII. The enamel layer (111) forms a line (1 1 1 , 丄丄d ) on the two surfaces, and the line (worker 3) is provided with a peelable substrate (丄) ς JJ upper 〇 J. For example, coating A layer of adhesive material in the form of an ancient combination medium is used as the s /, a sub-fog-bonding layer (the 1 1 glue layer may be a copper-aluminum rubber layer or other constant θ), and the equivalent rubber layer. , , ·,. 5 The method of forming the circuit on the copper foil of the printed circuit board (factory selectable method, for example, 3) is a general printing or press forming, or i field processing, milling milling, wherein Select the equivalent method of forming 2 to form the line first. The first bonding layer (1丄5)., the road (1 1 3), and then the b), or the coupon layer (1 1 5), and then form the system first Forming the first bond simultaneously forms the line (1 fly d), or, line 5). 3) and the first bonding layer (11 9 201038162 • after forming the wiring (1 1 3 ), the releasable base material (1 15) is applied to the releasable substrate (1 1 5 Fixing the line (1 1 3) without being easily dissipated and forming a copper strip to be dusted. As shown in Fig. 5, a substrate (丄3) is provided, the specification - and the aforementioned copper box ( 1 1 ) in combination with a glue layer having a bonding medium as a second bonding layer (1 3 1 ) on one side thereof to constitute a substrate to be pressed. In this embodiment and the first embodiment, The substrate (13) is an aluminum substrate that is easy to dissipate heat. In other embodiments, a glass fiber substrate, a glass substrate or other suitable substrate may be used according to design requirements, and is not limited to the embodiment. When the members of the fourth and fifth figures are to be combined, the first junction layer (1 15) and the second bonding layer (work 31) may face each other and then press the copper foil (丄丄And the substrate (丄3), as shown in Fig. 6; after that, the peelable substrate (1 15) can be removed as shown in Fig. 7. In addition, in the removal After the release substrate (1 j 5 ), rust prevention, application of a protective coating, or cleaning, etc. may be applied. After the release substrate (丄丄5) is removed, the present invention can be used for subsequent processes. The printed circuit board can be formed. It should be understood that a bonding layer can also be formed on the surface of one of the copper foil or the substrate, as it is understood by those of ordinary skill in the art and The embodiment is not described here. 10 201038162 Fig. 8 is a schematic diagram drawn according to the third embodiment of the present invention, as shown in Fig. 8, or a non-stereoscopic line (on the 3' , or other lines required for design. That is, the line (1 i 3) in the second embodiment is a three-dimensional line for convenience of display and description, but the invention is not limited thereto. It can make the single-panel or double-panel line be implemented immediately after the process of making the board, and it is directly consistent in the factory.
作業，並不需要另外送$皇愿^ 丄 p而文力冲达主專屬的加工廠作代工，因 :成本及時間均能予以降低’是本發明之優點。同 時’應用本發明不需使用昂貴的設備，相對可降低 製造成本。 _ 上所述者，僅為本發 亚非用以限定本發明實施之範圍，例如可改變 : 材貝、結合介質的膠層、《者在各步驟之間The operation does not require the additional payment of the Emperor's wish 丄p and the Wenli Chongda's exclusive processing factory for the OEM, because the cost and time can be reduced' is the advantage of the present invention. At the same time, the application of the present invention does not require the use of expensive equipment, and the manufacturing cost can be relatively reduced. The above is only the scope of the present invention to define the scope of the present invention, for example, it can be changed: the material shell, the glue layer of the bonding medium, and the person between the steps
所增加-個以上的製程，但在不脫離本發 蓋於：;4lT所作之等效取代與修飾，皆應涵 ^明之專利範圍内。 11 201038162 . 【圖式簡單說明】 第1圖係本發明第一實施例之製程流程方塊圖。 第2圖係本發明第一實施例之銅箔的示意圖。 第3圖係本發明第二實施例之製程流程方塊圖。 第4圖係本發明第二實施例之銅箔的示意圖。 . 第5圖係本發明第二實施例之基板的示意圖。 第6圖係結合以第4圖之銅箔與第5圖之基板後之 _ 結構示意圖。 ❹ 第7圖係移除第6圖之剝離性基材後之結構示意 圖。 第8圖係本發明第三實施例之立體示意圖。 【主要元件符號說明】 銅猪The addition of more than one process, but without departing from the equivalent of: 4lT equivalent substitutions and modifications, should be within the scope of the patent. 11 201038162 . [Simple Description of the Drawings] Fig. 1 is a block diagram showing the process flow of the first embodiment of the present invention. Fig. 2 is a schematic view showing a copper foil according to a first embodiment of the present invention. Figure 3 is a block diagram showing the process flow of the second embodiment of the present invention. Fig. 4 is a schematic view showing a copper foil of a second embodiment of the present invention. Fig. 5 is a schematic view showing a substrate of a second embodiment of the present invention. Fig. 6 is a schematic view showing the structure of the copper foil of Fig. 4 and the substrate of Fig. 5. ❹ Fig. 7 is a schematic view showing the structure after removing the peelable substrate of Fig. 6. Figure 8 is a perspective view of a third embodiment of the present invention. [Main component symbol description] Copper pig
第一結合層 線路 非立體線路 剝離性基材 結合層 基板 13 1 第二結合層 100、100’、200、步驟 200、300、300’ 12First bonding layer line non-stereoscopic line peeling substrate bonding layer substrate 13 1 second bonding layer 100, 100', 200, steps 200, 300, 300' 12