TW201035153A - Shaping method - Google Patents

Abstract

A shaping method in which a shaped object such as a lens can be produced with higher accuracy than in conventional techniques. A shaped object, e.g., a lens array or a die for nanoimprinting, is produced by repeatedly performing a transfer step a plurality of times, the transfer step comprising: a deformation step in which a photocurable composition comprising an epoxy compound and a polymerization initiator is brought into contact with a transfer object (62) having a shape to be transferred that is either the same as the shape of an aspherical lens part (312) or the reverse of the shape of an aspherical lens part (312), and the photocurable composition is thereby deformed so as to conform to the shape to be transferred of the transfer object (62); a curing step in which at least the deformed portion of the deformed photocurable composition is cured by irradiation with light using a light irradiator (60); and a separation step in which the photocurable composition that has been cured is separated from the transfer member.

Description

[Technical Field] The present invention relates to a method of forming a lens such as a lens array having a lens portion formed by an aspherical shape, or a shape for forming such a lens. [Prior Art] 0 Patent Document 1 discloses a method of manufacturing a microlens array using a metal mold having a lens-shaped surface, wherein the first resin is cured to the lens shape on the first substrate by the mold. a step of forming a plurality of lens substrates, a step of arranging the lens substrates in an array, a step of forming a mask having a surface on which the array lens substrate is plated to form the lens shape, and a lens forming the mask a step of depositing a mother mold on the surface of the shape, a step of forming a shape by the master mold, and a step of curing the second resin into the lens shape by the molding type on the second substrate a method of forming a microlens array, wherein the step of removing the portion of the second substrate while removing the second resin by dry etching. Further, Patent Document 2 discloses a method for producing a microstructure in which a fine pattern of a surface of a mother stamper is sequentially transferred, which comprises (1) fixing the mother stamper to a substrate. a step of supplying a resin at a predetermined position, (2) a step of supplying a resin between the mother stamper and the substrate, and (3) a step of pressing the mother stamper against the resin in a vacuum, and (4) curing the foregoing a step of removing the mother stamper from the hardened resin, and (6) changing the relative position of the mother stamper to the substrate, and moving the mother stamper or the substrate After the step, and (7) the foregoing step (6), the steps of the steps (2) to (6) are repeated a predetermined number of times. [Patent Document 1] JP-A-2003-94445 [Patent Document 2] However, in the techniques disclosed in Patent Document 1 and Patent Document 2, for example, it is difficult to form an aspheric surface. A problem such as a lens made of a shape is required to be a high-precision shaped object. The present invention has been made in view of a method for forming a shape such as a lens with high precision, as compared with the prior art. According to a feature of the present invention, there is provided a transfer formed by a transfer shape formed by forming a shape, a shape of a lens portion formed by an aspherical shape, or a shape of a lens formed by the aspherical shape. The body is in contact with each other 'the deformation step of deforming the shaped object into the transfer shape, the hardened hardening step with the at least deformed portion of the shaped object, and the separated shape from the transfer body a separating step, a moving step of moving the transfer body relative to another position of the object to be formed, and a forming step of repeating the transfer step of transferring the transfer shape to the object to be shaped, which is the aforementioned forming The method is a method of forming a curable composition containing an epoxy compound and a polymerization initiator. The curable composition preferably contains -6-201035153 (a) a bisphenol type epoxy compound represented by the following general formula (1), [Chemical Formula 1]

(wherein X represents a single bond, a methyl group, an ethylene group, an isopropylidene group or a sulfonyl group, Y represents a hydrogen atom or a 2,3-epoxypropyl group, and η is an integer of 0 to 10) (b An oxetane compound and (c) a polymerization initiator are characterized. Preferably, the mass ratio of the epoxy compound (a) to the oxetane compound (b) contained in the curable composition is 80/2 〇 to 20/80, as in the patent application scope. The method of forming any one of items 1 to 3.

Preferably, the viscosity of the curable composition is 100 to 5 〇〇〇 mPa · S. The present invention is compared with the prior art. A method of forming a shape such as a lens with high precision can be provided.  Next, an embodiment of the present invention will be described based on the drawings.  Fig. 1 shows a forming device 1 according to a first embodiment of the present invention. Shape forming device 1 is a shape, a base 12 having a lens array for use in an optical component disposed on a setting surface, A movable table 24 is supported on the base 12, and a support table 14 is further supported on the upper side of the movable table 24.  The movable table 24 is formed by a lower side portion 26 of the protruding portion 25 formed with a downwardly projecting shape. The projection portion 25 formed in the upper side upper portion 27 of the lower portion 26 is fitted in a groove (not shown) in the direction of the y-axis 201035153 in which the upward facing surface 12a of the base 12 is formed. It is assembled to the base 12 . Therefore, it is guided by the groove in the y-axis direction. The movable table 24 is movable in the y-axis direction on the surface 12a. A delivery screw 28 is inserted into the projection 25. The axial direction (long direction) of the conveying screw 28 is set to the y-axis direction. Use bearing 30, The conveyor screw 28 is supported by the base 12 in a freely rotatable manner. The left end of the conveying screw 28 in Fig. 1, It is coupled to the y-axis motor 32 fixed to the base 12. therefore, By driving the y-axis motor 32' to convey the drive to the projection 25 via the delivery screw 28, The movable table 24 moves in the y-axis direction. Which direction of the movable table to move to the y-axis is determined by controlling the direction of rotation of the y-axis motor 32.  On the upper side portion 27 of the movable table 24, A zero-axis motor 34 is provided. The 0-axis motor 34 is the upper side portion 27 of the movable table 24, For the lower side portion 26 of the movable table 24, The rotation is performed centering on the rotation axis perpendicular to the Z axis. Thus, the entire movable table 24 can be moved in the y-axis direction. At the same time, the upper side portion 27 becomes rotatable to the lower side portion 26.  On support desk I4, For example, a wafer W made of glass or the like is placed, The support table I4 supports the wafer W placed on the lower side from the gravity direction. also, On the support table 14, For example, a drive source 18 including a motor or the like is connected. therefore, Support station 14 can be, The upper side portion 27 of the movable table 24 is rotated integrally with the wafer W, On the wafer W, a rotary table for spin coating which is used for coating a curable composition or the like by spin coating is formed. Alternatively, the support table 14 is constructed as a rotary table for spin coating. The substitution structure is as follows: coating the curable composition by spin coating on the wafer W, On the plurality of holes h2 (refer to FIG. 2) formed by the wafer W, For example, an injection device (not shown) for injecting a curable composition as in the case of injection is provided in the shaping device 10, -8- 201035153 The injection device injects a hardening composition into the plurality of holes h2 formed in the wafer W. The support table 14 is For example, a material having light transparency such as glass is used. It is made light that can be emitted by the light irradiation device 60 as will be described later. And, The wafer W is placed on the support table 14 When the wafer W is removed by the support stage 14 being placed, For example, a mounting/removing device (not shown) formed by a robot or the like can be used. It is also possible for the operator to work with his hands.  〇 on the upper side portion 27 of the movable table 24, A supply device 36 for supplying the photocurable composition used as the object to the wafer W is provided. In the supply device 36, Via valve 3 8, a storage portion 40 for storing the photocurable composition, The supply device 36 is a photocurable composition to be stored in the storage portion 40,  A slightly central portion of the wafer W formed by a substantially circular shape (a circular plate shape) is dropped from above and is supplied. The photohardenable composition supplied to the wafer W is By the support station 14 rotating at a predetermined predetermined time and diffusing by centrifugal force, It is formed in a state in which the surface of the wafer W is coated to a slightly uniform thickness.  Oh, again, On the upper side portion 27 of the movable table 24, A light irradiation device 60 used as a curing device is provided. The light irradiation device 60 is connected to the light source 70 by the optical fiber 68 used as the light communication means. It is used when light is applied to the photocurable composition coated on the wafer W. In this embodiment, The illumination device 60 is, For the support desk 14, Wafer W, And a photocurable composition coated on the wafer W, It is provided on the lower side opposite to the transfer body 62 to be described later. therefore, When the transfer body 62 is in contact with the photocurable composition,  Will not be covered by the transfer body 62, The photocurable composition can illuminate light.  On the base 12, While the device is movable 24, The pillar 42 is fixed. On the branch -9 - 201035153 on the column 42, The movable unit 44, which is movable in the z-axis direction, for the strut 42 is assembled. The movable unit 4 4 is located at the left side portion of the left side of the figure.  It is formed with the right side portion 50 fixed to the left side portion 48. The left part 48 is,  Supporting for the support of the strut 42 in the direction of the x-axis, Insert the conveyor screw 52. The conveying screw 52 is rotatable on the strut 42 by the bearing 5 4 having the axial direction in the z-axis direction.  At one end of the conveying screw 52, The x-axis motor 56 of the assembly post 42 is coupled. therefore, When the reel motor 56 is rotated, The drive of the cymbal motor 56 is conveyed via the delivery screw 52 to the left side portion 48. The left side portion 48 of the movable unit 44 is integrated with the right side portion 50. It moves in the direction of the x-axis. The direction in which the movable unit 44 moves in the direction of the x-axis is determined by controlling the direction of rotation of the x-axis motor 56.  On the right side portion 50 of the movable unit 44, The transfer body 62 is attached via the support member 45. The support member 45 is a projection 46 that is assembled to be movable in the z-axis direction with respect to the movable unit 44, and protrudes from the left side in Fig. 1, It is formed by a support portion 47 fixed to the protruding portion 46. On the support unit 47, For example, the transfer body 62 can be attached and detached on the lower surface, The transfer body 62 is adapted to the shape of the lens portion to be formed, Or, the type of the curable composition used as the object to be formed, or the like is assembled into one type which can be selected from those having different sizes or shapes.  The conveying screw 58 is screwed onto the projection 46. The conveying screw 58 is on the right side portion 50 of the movable unit 44. Assembled into the use of bearings 61, 61 can rotate the axis direction in the z-axis direction. The upper end portion of the conveying screw 58 is coupled to the z-axis motor 64 for the support member. therefore, When the z-axis motor 64 for the support member is rotated, Transmitting the drive screw 58 to the support member 45 to convey the drive, Support member 4 5, Supporting -10- 201035153 The transfer body 62 of the support member 45 is integrally moved in the z-axis direction.  In the right portion 50 of the movable unit 44, As the detecting means 72 used for detecting means for detecting the position of the wafer w and the transfer body 62, It is assembled to be movable up and down independently of the support member 45 (movable in the z-axis direction).  The detecting device 72 is, for example, having a photographing unit 74 formed by a CCD camera,  a lens unit 76 provided on the wafer W side of the photographing unit 74, And a lamp 0 78 used as an illumination means capable of ensuring the sharpness of photography by the photographing unit 74. The z-axis motor 80 for detecting the device is assembled to the detecting device 72, The detecting device uses the z-axis motor 80 as a driving source for moving the detecting unit 72 to the movable unit 44 in the z-axis direction. By moving the detecting device 72 up and down, The focus of the photographing portion 74 can be aligned with the transfer body 62 or the like.  As above, The support member 45 is assembled to be movable in the z-axis direction with respect to the movable unit 44, The movable unit 44 is assembled so as to be movable in the X-axis direction with respect to the strut 42. therefore, By controlling the X-axis motor 56 and the z-axis motor 64 for the support member, The support member 45 and the transfer body 62 are simultaneously movable in the X-axis direction and the z-axis direction Q. Further, as described above, the support table 14 is driven by the y-axis motor 32 and the θ-axis motor 34, The movable table 24 can be simultaneously moved and rotated in the y-axis direction.  With this, By controlling the y-axis motor 32, X-axis motor 56, Support member with z-axis motor 64, And the shaft motor 34, Can be changed with wafer W, The relative positional relationship between the light irradiation device 60 and the transfer body 62.  therefore, The photocurable composition applied to the wafer W and the transfer body 62' can be brought into contact with each other by changing the relative positional relationship between the wafer W and the transfer member 62. In this embodiment, Y-axis motor 32, X-axis motor 56' support member z-axis motor 64, And the shaft motor 34 and the conveying screw 28, 52.  -11 - 201035153 5 8 and the like, the photocurable composition and the transfer body 62 are in contact with each other and left, A mobile device that moves at least one of the photocurable composition and the transfer body 62 is used. For the y-axis motor 32, X-axis motor 56, Support member with z-axis motor 64, The details of the control of the x-axis motor 34 will be described later. The photocurable composition is  A hardenable composition that can be cured by irradiation of light. also, In the embodiment described above, Although a photocurable composition is used as the shaped object,  As a shaped object, By contacting the transfer body 62, Or the pressure contact with the transfer body 62 may be deformed in accordance with the shape of the transfer body 62. It can be applied to materials that can be hardened under deformation. For example, a thermosetting composition which is cured by heating by the above curable composition can be used. also, In this embodiment, as a hardening device for hardening a shaped object, Although a light irradiation device using a hardened photohardenable composition is used, However, the hardening device can be suitably selected in combination with the material used as the object to be formed. For example, when a thermosetting composition is used as the object to be formed as described above, As the hardening means, a heater for heating the thermosetting composition can be selected.  FIG. 2 shows the details of the transfer body 62 and the wafer W.  as shown in picture 2, The wafer W has a structure in which the holding plate W2 is overlapped above the substrate. The substrate W1 is made of, for example, glass permeable to light, the thickness t1, For example, 4〇〇μ. Keep board W2, For example, made of liquid,  When the high-hardness pre-curing photocurable composition is held at a predetermined position, it is used, for example, by enamel. The thickness t2, For example, 725μ, A plurality of through holes hi penetrating from above to below are formed. Each through hole hi, For example, it becomes -12- 201035153, which is narrowed from the top to the bottom.  in this way, a holding plate W2 disposed above the substrate W1, If it passes through the retaining plate W2, Forming a plurality of through holes hi, Therefore, the lower side of the through hole hi is sealed by the substrate W1. On the substrate W1, It is in a state of forming a plurality of holes h2 formed by the shape of the recess which is closed below and opened upward. also, At a position between the through holes h 1 adjacent to each other of the substrate W1, For example, on the inside of the substrate W 1 , Forming a scriber layer (staining portion) S » forming a substrate W1) The position of the characterization layer S is weaker than that of other portions, Therefore, when the substrate W1 is divided, The substrate W1 is divided along the scribed layer S.  The transfer body 62 is made of, for example, metal. The lens portion formed by the aspherical shape has the same shape as the lens portion 312 (see Fig. 8 described later) used.  Or as a transfer body formed by a transfer shape formed by the reverse shape of the lens portion 312, As the transfer shape, For example, the convex portion 90 is formed. also,  The transfer body 62 is used to imitate the shape of the convex portion 90 and deform the photocurable composition. Hardening the photocurable composition in a deformed state, The transfer shape formed on the transfer body 62 transfers the photocurable composition. The convex portion 90 is a transfer body 62 made of metal, For example, using a working machine such as a mechanical center, For example, cutting out, etc. Formed by mechanical processing, Become an aspherical shape.  The formed object formed on the transfer shape of the transfer body 62 by the transfer is required to have high precision. therefore, For example, the transfer shape formed by the convex portion 90 on the transfer body 62 also requires high precision. And the convex portion 90 has an aspherical shape, which is difficult to process, Therefore, it takes a long time and a high cost to process the transfer body 62. therefore, In this embodiment, Want to shorten the processing time ‘cost suppression, The transfer shape is formed in only one place on the transfer body 62.  -13- 201035153 where, The aspherical shape is a surface shape other than the curved shape formed by the shape of the portion which is generally cut out of the spherical surface. Further, 'in the optical component of the lens portion 312' is referred to as a shape represented by the aspherical shape shown by the following formula (1).  z - C · ρ 2/[1 + {1-(1+κ1) · C2 · p 2 } 1/2] · * * Formula (1) However, Taking C as the inverse of the radius of curvature R', Ρ is taken as the height of the optical axis of the mirror surface, Using ζ as the amount of sag, ΐ is taken as the cone coefficient.  In Figure 2, On the face of the wafer W facing up, Coating the photocurable composition by spin coating, The coated photohardenable composition flows into the hole h2 of the holding plate W2, And kept on the holding plate W2, For the cured photohardenable composition, At least the convex portion 90 is in contact with the photocurable composition to present a state in which the transfer body 62 is in contact. In this state, The position where the light-irradiating device 60 is in contact with the convex portion 90 of the photo-curable composition, And when the periphery is illuminated by light,  The photohardenable composition is hardened, The transfer shape forming the convex portion is transferred to the photohardenable composition. After the photohardenable composition is hardened, The transfer body 62 is a two-point chain line as shown in FIG. Leaving from wafer W, As shown in the arrow in Figure 2, For example, it moves in contact with the uncured hardenable composition held by the adjacent hole h2 of the hole h2 which holds the hardened curable composition.  As shown in Figure 3, Instead of the wafer W facing up, Coating the photocurable composition by spin coating, In the plurality of holes h2 formed by the wafer W, When an optical curing composition is injected using an injection device (not shown), For -14 - 201035153 to maintain the photo-curable composition of the board W2, At least the convex portion 90 is in contact with the photocurable composition, The state in which the transfer body 62 is contacted is displayed. at this time,  The photocurable composition held in one hole h2 is in contact with the convex portion 90, When the light is illuminated, It has become a state in which the hole h2 adjacent to the hole has been injected with the photocurable composition. After the photohardenable composition in one hole h2 is hardened, The transfer body 62 is shown by a two-dot chain line in FIG. Leaving from wafer W, As shown in the arrow in Figure 3, It moves in contact with the uncured hardenable composition held by the hole h2 which maintains the hardened curable composition. The transfer body 62 in a state of being in contact with the hardenable composition held by the adjacent hole h2 is Before moving further adjacent hole h2 to adjacent hole h2, The further adjacent hole h2 is injected into the photocurable composition by the injection device.  which is, As shown in Figure 3, When the photocurable composition is injected into the hole h2 using an injection device, When the photocurable composition is deformed in the transfer body 62 (deformation step), Pre-forming the wafer W of the plurality of holes h2, Injecting light into a hardening composition (injection step), a photohardenable group of pigments injected into the hole h2, Contact with the transfer body 62 (contact step). also, When the photocurable composition is deformed, Injection of the photohardenable composition of the hole h2 (injection step), The contact with the transfer body 62 of the photocurable composition injected in the hole h2 (contact step) can be repeated several times.  FIG. 4 shows a first modification of the wafer W. The crystal circle W of the above embodiment is in a state in which the substrate boundary 1 and the holding plate W2 are laminated. However, the substrate W 1 of the first modification is formed only by the holding plate W2. When the substrate W1 of the first modification is used, At least one of the through holes hi is inserted underneath,  The transfer body 62 is brought into contact with the holding plate W2 from below, By being plugged by -15- 201035153 below, Providing a photocurable composition from above in the formed hole h2, The photocurable composition supplied to the hole h2 can be irradiated with light from above. The configuration of the forming device 1 must be changed. When the related wafer w of the first modification is used, After the photohardenable composition injected in the hole h2 is hardened, The through hole hi adjacent to the transfer body 62 is moved downward by the lower side, After that, if the through hole hi is closed,  The photocurable composition is injected into the adjacent hole h2 formed by the injection device.  And, For the same part of the wafer W as the related embodiment, The same reference numerals are given to those in Fig. 3, and the description is omitted.  As explained above, Using the wafer W having the holding plate W2, Or when the wafer W formed by the holding plate W2 is formed, Since the photocurable composition is held on the holding plate W2, Different from the case where the holding plate W2 is not maintained, The photocurable composition does not exist in a continuous manner on the entire surface of the wafer W. It is subdivided into the existence state of the space formed by the small volume of plural. therefore, For the point at which the photohardenable composition shrinks, Due to the shrinkage of the photohardenable composition, Therefore, the shape of the transfer body 62 is at the transferred position, The disadvantages of the error between the position and the desired position can be prevented. also, With unused retainer W2,  For comparison when the substrate W 1 is completely coated with the photocurable composition, The amount of the photocurable composition used can be reduced.  FIG. 5 shows a second modification of the wafer W.  In the case where the wafer W1 and the holding plate W2 are laminated in the wafer W of the above embodiment, In the second modification, The wafer W does not have the holding plate W2 but is formed by the substrate W1. When the related wafer W of the second modification is used, Applying a photocurable composition to the entire surface of the wafer W by spin coating, For the photocurable composition applied to the wafer W, Further, it is printed by the transfer body 62 -16-201035153.  The related wafer W of the second modification, Because there is no holding plate W2, Therefore, the photohardenable composition is in a state in which the entire surface of the wafer W exists in a continuous manner. For the point at which the photocurable composition shrinks, Due to the shrinkage of the cumulative photohardenable composition, The shape of the transfer body 62 is transferred, There is a discrepancy between the position and the desired position. therefore, To prevent this error from occurring, Cooperating with the shrinkage of the photocurable composition used, It is preferable to change the pitch of the position where the transfer body 62 0 is in contact with the photocurable composition. which is, The transfer body 62 is Transfer position 1 a distance from the position adjacent to the position at which the transfer body contacts the other position of the photocurable composition, In combination with the shrinkage rate of the photohardenable composition used, It becomes wider than the desired distance after the photocurable composition is hardened. Make settings, Change is better. And for the same part of the wafer w related to the foregoing embodiment, The same reference numerals as in Fig. 5 are given and the description is omitted.  Figure 6 shows a grid diagram of a control device 200 having a forming device 10.  〇 As shown in Figure 6, The control device 200 has an image recognition device 202 that recognizes an image captured by the detection device 72. The main control unit 204 is input from the output of the detecting device 72. The main control unit 204 controls the motor control circuit 206, Control the y-axis motor 32, X-axis motor 56, Support member with z-axis motor 6 4, And the shaft motor 34. also, The main control unit 504 controls the light source 70 by controlling the light source driving circuit 208'. also, The main control unit 204 controls the z-axis motor 8 检测 for the detecting device by controlling the motor control circuit 2 10 . also, The main control unit 2〇4 controls the valve 38 by controlling the valve drive circuit 212. also, The main control unit 204 controls the drive source 18 by controlling the drive source control circuit 214.  -17- 201035153 Again, When the injection device (not shown) for injecting the photocurable composition into the hole h2 formed in the wafer w is provided in the forming device 1', the control of the injection device is also carried out by the control device 200.  Figure 7 shows a first flow chart of the control of the forming device 10 by the control device 200, The steps of the method of forming a lens array for the optical component of the shaped object. Here, the lens array is an optical component in which a plurality of members form a plurality of lens portions. This is shown in the first flowchart. The step of coating the photocurable composition on the wafer W in total, for example, by spin coating.  At the beginning of a series of steps, In stage S 1 00, The mounting step of the wafer W placed on the support stage 14 is carried out. Secondly at stage S2 00, A photocurable composition coating step of applying a photocurable composition to the wafer W is carried out. In the photohardenable composition coating step, The main control unit 204 controls the valve drive circuit 2 1 2 , Put valve 38 at a preset time, Open state, A photocurable composition is supplied to the surface of the wafer W. After the supply of the photocurable composition is completed,  The main control unit 204 is a control driving source control circuit 214, The drive source 18 is driven at a predetermined time. By driving the drive source 18, Turn the support desk 1 4, The photohardenable composition supplied to the wafer W placed on the support table 14 is subjected to centrifugal force, The surface of the wafer W is in a state of being slightly uniformly diffused.  In the second stage S3 00, A transfer step of transferring the transfer shape formed by the transfer body 62 to the photocurable composition is carried out. The detailed description of the transfer step of the stage S3 00 will be described later.  In the next stage S400, Determine if all transfer steps have ended. which is,  As stage S300, For example, after repeating the transfer step of 1500 times to 2400 times, Determine if it is the last transfer step. In stage S400, If it is judged that -18-201035153 is not the final transfer step, Go back to stage S3 00. on the other hand, When it is judged as the last transfer step in the stage S300, Going to the next stage S500.  In stage S 5 00, Transfer onto the wafer W of the coated photocurable composition, Self-loading is placed on the support station 1 4 state, Moved out of the forming device 1 〇. And , The forming device 10 does not have the wafer W placed on the support table 14 . When a device such as a robot that carries out the wafer W from the forming device 10 is used, Wafer W to the mounting of the support table 14, The removal of the wafer W from the self-forming device 10 is performed by the operator with a hand 0 operation. The operations of the stages S100 and S500 by the control of the main control unit 2〇4 are not performed.  FIG. 8 shows a first flowchart of the transfer step by the control device 200,  When the photocurable composition is applied to the wafer W by spin coating or the like, A detailed flowchart of the control of the transfer step (stage S3 00) in which the thermosetting composition is transferred to the transfer shape of the transfer body 62.  At the beginning of the transfer step, The step of deforming the photocurable composition applied to the wafer W in the step S302 in a transfer shape formed on the transfer body 62 and deforming it is carried out. That is, in stage S302, The main control unit 204 controls the motor control circuit 206, Making the y-axis motor 32, X-axis motor 56, The support member uses a z-axis motor 64, And the shaft motor 34 is driven, The predetermined position of the photocurable composition applied to the wafer W is in contact with the transfer body 62, Deforming the photocurable composition, At least one of the transfer body 62 and the support table 14 is moved.  In the deformation step of stage S302, Detected by the detecting device 72, The data of the image processing by the image recognition device 02 is subject to In order to bring the transfer body 62 into contact with the positive position of the photocurable composition, The position correction data is created on the support table 14 and the transfer body 62. According to the correction data, At least one of the transfer body 62 and the support table 14 is movable by the control of the main control unit -19-201035153204.  In the deformation step of stage S302, The photocurable composition is deformed in accordance with the convex portion 90 of the transfer body 62. among them, The convex portion 90 of the transfer body 62 is processed to have an inverted shape of each lens portion (optical part portion) constituting the lens array. therefore, By deforming from the aspherical shape to the convex portion 90, The photohardenable composition is deformed into a shape of a lens portion formed by a concave aspherical shape.  And, In this embodiment, To form a concave shaped lens portion, Using the transfer body 62 having the convex portion 90, However, for example, a transfer body 62 or the like having a concave portion to form a convex shaped lens portion is used, In accordance with the shape of the optical part to be formed, A transfer body 62 having a transfer portion processed into the shape and the reverse shape of the optical component portion can be optionally used.  also, When the transfer body 62 is selected, Taking into account the type of photohardenable composition used, In combination with the shrinkage rate of the photocurable composition used, Even in the case of forming a lens portion of the same final shape, Can choose the degree of difference,  A transfer body such as a convex portion 90 of a different shape is formed. which is, In conjunction with shrinkage during the formation of the photocurable composition, It becomes a change of the transfer body 62.  In the next stage S3 04, By contact with the transfer body 62, A hardening step of hardening the photocurable composition which is deformed in accordance with the transfer body 62 is carried out.  which is, The main control unit 204 controls the light source driving circuit 208, At the light source 70, A portion of the photohardening composition that is deformed by contact with at least the transfer body 62 is irradiated with light for a predetermined period of time. By the hardening step of the stage S3 04, The photocurable composition is cured in a state of being deformed into the shape of the lens portion. One lens portion was produced in the photocurable composition.  In the next stage S306, A separation step of separating the hardened photohardenable composition from the -20-201035153 print 62 is carried out. which is, The main control unit 204 controls the motor control circuit 206, For example, the transfer body 62 in a state of being in contact with the thermosetting composition is moved to the z-axis motor 64 for the upper lower drive supporting member.  With the above description of stage S3 02, Stage S3 04, After the end of a series of transfer steps performed in stage S3 06, Indicates that the transfer step has ended. One lens portion is formed in the photocurable composition. And as shown in Figure 6, Matching the number of lens portions formed, By repeating the transfer step until the end of all transfer,  0 the shape of the lens portion in which the photocurable composition is transferred and the number of repeated transfer steps is the same, And the lens array is manufactured.  FIG. 9 shows a second flowchart of the control by the forming device 10 of the control device 200, The steps of the method of forming the lens array for the optical component of the shaped object. The first flowchart shows that the wafer W is comprehensive. For example, a step of coating a photocurable composition by spin coating. In contrast, In the second flowchart, the steps of injecting the photocurable composition into the plurality of holes h2 (see FIG. 2) for forming the wafer W using an injection device (not shown) are shown in the steps shown in the first flowchart. The stage sioo is implemented in the mounting step of the support station I4 to mount the wafer W, In the stage S200, the photocurable composition is completely coated on the wafer w, In stage S3 00, The transfer shape formed on the transfer body 62 is transferred to the photocurable composition. After determining whether all the transfer steps are completed in the stage S 4 0 0, The wafer W is carried out in the stage S5 00 outside the forming apparatus 1 相对 relative to this step in the second flowchart, No coating of the photocurable composition is performed on the wafer W in the stage S 2 〇 0, As described later for the transfer step of -21 - 201035153 stage S 3 00, A hardenable composition is injected into the hole h2 formed in the wafer W.  FIG. 10 shows a second flowchart of the transfer step by the control device 200,  It is represented by a plurality of holes h2 formed on the wafer W, When an optically curable composition is injected using an injection device, Detailed flowchart of the control of the transfer step (stage S3 00) of transferring the thermosetting composition to the transfer shape of the transfer body 6 2 〇 at the start of the transfer step, In stage S3 02, An injection step (stage S3 02a) of implanting a photocurable composition in a plurality of holes h2 formed in the wafer W, With stage S3 02a, a step of contacting (S3 02b) of contacting the photocurable composition injected into the hole h2 with the transfer body 62, A deformation step of deforming the photocurable composition in the transfer shape formed on the transfer body 62 is carried out. which is, In stage S 3 02, The main control unit 204 is a control injection device. After one of the plurality of holes h2 formed in the wafer W is injected into the photocurable composition, Control motor control circuit 206, The hole h2 injected into one hole h2 is in contact with the transfer body 62, At least one of the transfer body 62 and the support table 14 is moved.  In the next stage S304, A hardening step of hardening the light-hardening composition which is deformed in accordance with the transfer body 62 is carried out. which is, The main control unit 204 irradiates the light source 70 with at least light irradiation of the curable composition injected into the hole h2 in the step S3 02a. By the hardening step of the stage S304, The photocurable composition injected into the hole h2 is deformed into a lens portion shape to produce one lens portion.  In the next stage S306, Performing a light hardening composition injected into the hardened hole h2, A separation step from the transfer body 62.  With the above-mentioned stage S3 02a, Stage S 3 02b, Stage S3 04,  -22- 201035153 After the end of a series of transfer steps performed in stage S 3 0 6 by the end of the transfer step, While one of the plurality of holes h2 formed in the wafer W is injected with the photohardenable composition, When the photocurable composition is cured in a state of being deformed in a state of being deformed by the transfer shape of the transfer body 62, one lens portion is formed. And as shown in Figure 9, Matching the number of lens portions formed, By repeating the transfer step until all transfer ends, The same number of lens portions as the number of times the photocurable composition is transferred and repeated in the transfer step, Form a lens array 〇 column.  The lens array 304 formed by the steps described above is illustrated in Fig. 11, A step of producing a lens of an optical component having a lens portion formed by at least one aspherical shape.  First of all, The formed lens array is shown in Fig. 1 1 (a), Figure 1 1 (b) shows, The plurality of sheets are joined by bonding or the like as necessary (joining step). Figure 11 (a) shows three lens arrays 304 before bonding, Fig. 11(b) shows the bonded lens array 310 of the three lens arrays 306.  Ο Second, The cemented lens array 3 10 that will be joined by the bonding step, For example, it is divided into at least one lens portion by a method such as cutting (division step).  A lens is manufactured by dividing the bonded lens array 310. herein, As described above, when the patterned layer S is formed on the wafer W (refer to FIG. 2), The segmentation of the bonded lens array 310 is easy.  Fig. 11(c) shows a lens 314 manufactured by cutting the lens array 3'4 into a lens array 310' which is bonded to a lens unit 312. The lens 314' can be manufactured by, for example, being assembled on a light receiving element such as a CMOS sensor. The camera that was made, For example, it can be used as a camera built in the mobile phone -23- 201035153.  And, In the manufacturing steps of the lens described above, By joining a plurality of lens arrays 3 04, For forming a bonded lens array, By splitting the bonded lens array 3 1 0, A step of manufacturing a lens 3 1 4 having a plurality of lens portions will be described.  However, since the complex lens array 310 is not joined, the division is performed directly under a single layer. Therefore, the lens 314 can be formed of a single layer. also, Undivided lens array 304, Bonding the lens array 3 1 0, Can also be used as a lens array 3 04, The cemented lens array 3 1 0 is utilized.  Next, a second embodiment of the present invention will be described.  In the first embodiment, For the formation of the lens array 304 (refer to Fig. 11) using the forming device 10 (refer to Fig. 1), In the second embodiment,  Use the shape device〗 〇, The formation of the model used in forming the lens array is performed. The model is the same as that of the first embodiment. Through the loading step of stage S 1 00, a step of applying a photocurable composition at stage S200, Transfer step of stage S3〇0, Forming the wafer carrying out step of stage S 5 00, The transfer step of the stage S 3 00 is repeated in accordance with the number of lens portions of the finally formed lens array.  In the first embodiment described above, The transfer body 62 (refer to Fig. 2) uses a transfer body 62 having a lens portion formed by the aspherical shape formed by the lens array 304 and a transfer portion processed into a reverse shape. In contrast, In the second embodiment, A transfer body 62 having a lens portion processed in the same shape as the lens portion of the lens array finally formed is used. Therefore, in the model for forming a lens, The shape of the lens portion 3 1 2 of the finally formed lens array 3〇4 is transferred.  -24- 201035153 Figure 1 2, In the second embodiment of the present invention, Using a model that has been shaped using a forming device 10, Forming a lens array as a primary optical component, The step of manufacturing a lens as a secondary optical component by dividing the formed lens array will be described.  Using a model shaped by the forming device 10 and forming a lens array, When manufacturing a lens, First, as shown in Figure 12 (a), Using the forming device 10 and forming the model 3 00 (formation step), Using the shaped model 3 00, For example, using the technology of nanoimprint, The shaped lens array 304 (transparent lens forming step). For example, prepare two models 300, Will be 2 models 300, The sides of the shape of the transfer body 62 (refer to Fig. 2) are transferred in opposite directions to each other. On model 3 00, Between 3 00, Using the supply device 3 02, For example, a material for supplying a lens array such as a curable composition, A material such as a hardening composition is modeled on the model 300, 3 00 shape and deformed to make it harden, A lens array having a transfer surface shape and an opposite shape of the mold 300 is formed. at this time, For example, when the model 300 is manufactured, When using a photocurable composition for the material of the lens array, By illuminating the light,  The hardenable composition can be hardened.  And, Instead of arranging the two models 300 into the shape of the transfer body 62, the transferred sides are opposed to each other, In model 300, The material supplied to the lens array between 300, The shape of the transfer body 62 configured as the model 300 is transferred to the side, In the opposite direction to a flat plate, The material of the lens array can also be supplied between the model 300 and the plate.  The lens array formed is the same as the lens array formed in the first embodiment, and the plurality of sheets are joined as necessary, as shown in Fig. 12 (b) (step -25-201035153). As shown in Fig. 12 (c), the cemented lens array 3 1 0 ' is divided into a cemented lens array 3 1 0 having at least one lens portion (dividing step) as shown in Fig. 12 (d). A lens 314 having one lens portion 312 is fabricated. The lens 314 is the same as the lens manufactured in the first embodiment described above. For example, a light-receiving element such as a CMOS sensor can be assembled to manufacture a camera. Manufactured camera, For example, it can be used as a camera built in a mobile phone.  In the same manner as in the first embodiment described above, The lens array 304 manufactured in the second embodiment is divided directly under a single layer without being joined. Therefore, a lens 314 formed of a single layer can be formed. also, No need to split the lens array 304, Bonding lens array 3 1 0, Can also be used as a lens array 3 04, The cemented lens array 3 10 is utilized.  In the first embodiment described above, Explain an example of forming a lens array, In the second embodiment, An example of forming a model to be formed into a lens array will be described. However, the shape in which the forming device 1 is used for forming is not limited to optical components such as lens arrays to be formed, Or the model of the optical part, For example, an electroforming mother type used in electroforming can be cited.  Into the slot model.  The hardenable composition used in the present invention will be described in detail below.  [Curable composition] The curable composition used in the present invention contains an epoxy compound and a polymerization initiator. The epoxy compound is a compound having at least one epoxy group.  If necessary, it may be used alone or in combination with a conventionally known alicyclic epoxy compound,  Aliphatic epoxy compounds, Use of aromatic epoxy compounds.  -26- 201035153 As an alicyclic epoxy compound, Suitable for cyclohexene oxide,  The pentene oxide is contained in the molecular structure.  The aliphatic epoxy compound is exemplified by polyethylene glycol diglycidyl ether. Polypropylene glycol diglycidyl ether, Neopentyl glycol dicondensate, Trimethylolpropane triglycidyl ether and the like.  As an aromatic epoxy compound, A cresol epoxy resin can be cited.  Type epoxy compounds, etc. It is preferable from the viewpoint of the shape followability of the bisphenol type epoxy compound from the viewpoint of the adhesion of the sheet.  a curable composition used in the present invention, Preferably, it contains (a phenolic epoxy compound, (b) Oxetane compound (c) is characterized by a polymerization initiator. In the following, (a) bisphenol type epoxy compound used in the present invention (a) bisphenol type epoxy compound (hereinafter, "(a) epoxy compound" is described) is as follows: 1):  [Chemical 2]

In the above general formula (1), X represents a single bond, a methyl group, an ethylene propylene group or a sulfonyl group, preferably a methyl group or an isopropylidene group. Y represents a hydrogen atom or a 2,3-epoxypropyl group. η is an integer of 0 to 10, preferably an integer of 0 to 5, preferably an integer of 0 to 1. Specific examples of the epoxy compound include, for example, an oxime or a cyclic glycerol bisphenol or a bisphenol, and a (1) group, a stretching number, and a -27-201035153 compound. The compound is a compound of the above formula (1), wherein η is hydrazine and hydrazine is an isopropylidene group. [化3]

<(b) Oxetane compound> The oxetane oxime compound used in the curable composition of the present invention is a compound having at least one oxetanyl group, A compound having two oxetane rings in the molecule represented by the following general formula (2) or (3) is used. 【化4】

In the general formula (2), 'R1 is a gas atom, a group having a carbon number of 1 to 6, a fluoroalkyl group having a carbon number of i to 6, an allyl group, an aryl group having a carbon number of 6 to 12, a decyl group or a thienyl group. It is preferably a methyl group, an ethyl group, a propyl group or a butyl group. R2 is a linear or branched alkyl group having a carbon number of 1 to 6, a linear or branched -28-201035153 poly(alkylene) group, a linear or branched unsaturated hydrocarbon group, and having a carbon number of 6 to 12 An aryl group, a carbonyl group, an alkylene group having a carbon number of i~6, a alkyl group having a carboxyl group having 1 to 6 carbon atoms, or an alkyl group having a carbon number of 1 to 6 containing an aminomethyl group. As a linear or branched alkyl group having 1 to 6 carbon atoms, it is preferable to use an extended ethyl group, a propyl group or a butyl group as a linear or branched poly(alkyloxy) group to An ethoxy) group or a poly(propenyloxy) group is preferred, and as a linear or branched unsaturated hydrocarbon group, a propenyl group, a methyl propylene group or a butenyl group is preferred as the carbon number. The aryl group of 6 to 12 is preferably a phenyl group. In the general formula (3), 'R3 is synonymous with R1 in the general formula (2). Specific examples of the (c) oxetane compound include the compounds shown below. 【化6】

Among the two compounds shown above, the former is a compound of the above general formula (2), and R1 is an ethyl group and R2 is a phenylene group. Further, the latter is a compound of the above formula (3) wherein R3 is an ethyl group. The mass ratio of the epoxy compound (a) to the oxetane compound (b) contained in the curable composition of the present invention is 80/20 -29 to 201035153 to 20/80. When the ratio exceeds 80/20 or decreases to 20/80, the photohardening speed becomes slow, and the portion in contact with the air is hard to be hardened by oxygen inhibition, or is hardened, and a large amount of light irradiation energy or heating time is required. lengthen. <(c) Polymerization initiator> The polymerization initiator (c) used in the present invention may use a photopolymerization initiator or a thermal polymerization initiator, which also initiates cationic polymerization by irradiation with active light. The photopolymerization initiator of the substance is preferably an aryl diazonium salt (for example, P-33 (manufactured by Asahi Kasei Kogyo Co., Ltd.)) aryl iodide salt (for example, FC-509 (manufactured by 3 M)), Aryl sulfonium salt (Syra cureUVI-6974, UVI-6970, UVI-6990, UVI-6950 (manufactured by Union Carbide), SP-150, SP-170 (made by Asahi Kasei Kogyo Co., Ltd.), array-ion complex (e.g., CG-24-61 (manufactured by Ciba-geigy Co., Ltd.)), etc., as a particularly preferred polymerization initiator (C) for use in a curable composition, the following is not caused by irradiation of active light. At least one photoacid generator of the onium salt represented by the general formulae (4) to (7). 【化8】

-30- 201035153

[1 1]

(wherein Rsi to RS17 each represent a hydrogen atom or a substituent, and RS1 to RS3F represent a hydrogen atom at the same time, and RS8 to Rs11 do not simultaneously represent a hydrogen atom, and rs12 to Rs17 do not simultaneously represent a hydrogen atom. X· represents a non- In the present invention, "there is no benzene generated by irradiation with active light" means that benzene is not substantially produced, and specifically, it is produced when the amount of active light that can be sufficiently decomposed by the photoacid generator is generated. The amount of benzene is extremely small or absent below 5 pg. As the gun salt, a sulfonium salt or an iodonium salt is preferred, and when it has a substituent on the benzene ring bonded to -31 - 201035153 S or 1+, the above-mentioned salt can be satisfied as described above. (4) The compound represented by the above (7) is preferably 'only when the substituent is bonded to the benzene ring bonded to s +, the above conditions are sufficient. For the above-mentioned general formulas (4) to (7), RS1 to RS17 are each a table or a substituent. However, RS1 to Rs3 do not simultaneously represent a hydrogen atom. Rs7 does not simultaneously represent a hydrogen atom, and Rs8~Rsii are not simultaneously represented. Rsi2~Rs &quot; does not simultaneously represent a hydrogen atom. The substituent represented by RS1 to RS17 is preferably an alkyl group such as a methyl group, a propyl group, an isopropyl group, a butyl group, an isobutyl group, a t-butyl group or a pentyl group, a methoxy group or an ethoxy group. Alkoxy group such as propyl group, butoxy group, hexyloxy group, eleventh oxy group, ethoxy group, propenoxy group, oxy group, decyl carbonyloxy group, methoxycarbonyl group, ethoxy group A halogen such as a carbonyl group such as a carbonylcarbonyl group, a phenylthio group, a fluorine, a chlorine, a bromine or a iodine, a nitro group, a hydroxyl group or the like. X represents a non-nucleophilic anion residue, and examples thereof include a halogen atom such as F and I, B(C6F5)4, R18COO, R19S〇3, AsF6, PF6, and BF4. However, '1118 and 1119 each represent an alkyl group such as a methyl group, an ethyl group or a butyl group; a halogen atom such as fluorine, chlorine, bromine or iodine; a nitro group; and an alkane which may be substituted by an alkoxy group such as a methoxy group or an ethoxy group. base. Among them, B(C6F5)4 and PF6 are preferred from the viewpoint of safety. The above compounds and THE CHEMICAL SOCIETY OF Vol.71 Νο·1ΐ, 998 998, organic electroluminescent materials research will be edited with organic materials, and Bun-shin published (1 &quot; 3 years) conditions. Salinization of hydrazine can be expressed as hydrogen atom RS4~ hydrogen atom, ethyl, hexyl, decyl carbonyl, benzene atom, Cl, Br SbF6, propyl, cyanide or phenyl JAPAN In the present invention, the onium salt represented by the general formulae (4) to (7) is an onium salt selected from the following general formulas (8) to (16). At least one of them is particularly preferred. X· represents an anion which is not nucleophilic, and is the same as described above.

HjCO

X OCHj (8)

【化1 4】 (9)

X (10) ch3 -33- 201035153 【化1 5】

(11) och3

[化1 7]

-34- 201035153

[化1 8]

[化1 9]

The exemplified compound containing an iodine salt may be, for example, X to PF of the above formula (8) to (16), and the following compounds may be mentioned. -35- 201035153 【化2 1】

[2 2] pf6

H3C0 PFe'

[化2 3]

Pf6~

-36- 201035153 【化2 4】

[Chem. 2 6]

-37- 201035153 [Chem. 2 7]

CH3

[化2 9]

F

PFe

CHa -38- 201035153 【化3 0】

[化3 1]

PFe-

[化3 4]

HsCO CHs Ρρβ -39- 201035153 【化3 5】

OCH, the content of the photopolymerization initiator in the curable composition is only an appropriate amount of the hardenable hardenable composition, for (a) bisphenol type epoxy compound and (b) oxetane ( The total amount of the 〇xetane) compound is preferably 0.01 to 10 parts by mass, more preferably 0.1 to 10 parts by mass, still more preferably 1 to 5 parts by mass per 1 part by mass. When the amount of the photopolymerization initiator added is too large, the storage stability of the curable composition is lowered, or the crosslinking is caused when the cured product is crosslinked and the cured product is crosslinked, and the problem of cracking during hardening occurs. Further, when the amount of the photopolymerization initiator added is too small, the curable composition cannot be sufficiently cured. In addition, the curable composition used in the present invention may contain a flattening agent, an antioxidant, an ultraviolet absorber, a solvent, and the like, as long as it does not impair the viscosity of the composition and the transparency and heat resistance of the cured product. Fillers such as pigments and other inorganic materials, reactive diluents, other modifiers, and the like. As the pingping agent, for example, a polyether-denatured dimethyl polyoxyalkylene copolymer, a polyester-denatured dimethyl polyoxyalkylene copolymer, and a polyether-denatured methyl alkyl polyoxyalkylene copolymer are exemplified. And aralkyl modified methyl alkyl polyoxyalkylene copolymer, polyether modified methyl alkyl polyoxyalkylene copolymer, and the like. Examples of the chelating agent or pigment include calcium carbonate, talc, mica, clay, Aerosil (registered trademark), barium sulfate, aluminum hydroxide, zinc stearate, zinc silicate, iron oxide, and azo pigment. The curable composition of the present invention containing such various components is a cone-plate type -40-201035153 viscometer DV-IIIULTRA (manufactured by BROOKFIELD Co., Ltd.) at 25 ° C,

The viscosity measured under Spindle No. CP-41 is generally 100 to 5000 mPa·s, and even if it does not contain a solvent, it has extremely low viscosity and good handleability. <Method for Producing Curable Composition> The curable composition used in the present invention preferably contains a bisphenol type epoxy compound (a) and an oxetane compound (b) and an anthracene polymerization. The starting agent (C) is produced by uniform mixing. The method of uniform mixing is not particularly limited, and examples thereof include a method of stirring and mixing in a reactor equipped with a stirrer under a room temperature condition, or a stirrer, a bead honing machine, three rolls, and the like. The method of mixing is carried out, and the obtained curable composition is filtered as necessary. This filtration system is carried out for the purpose of removing foreign matter such as garbage in the curable composition. The filtration method is not particularly limited, but a method of performing pressure filtration using a filter such as a membrane type of a pressure filtration pore size of Ομιη 、 and a filter cartridge type is preferred. Even if the curable composition does not contain a solvent, the viscosity is low and the handleability is good. When the curable composition is in a lack of hardenability, the portion in contact with the air cannot be hardened by oxygen resistance, so that when the shape is not obtained or is to be cured, a large amount of light must be irradiated with energy or the heating time becomes long. The viewpoint of productivity is not preferable, but the curable composition is excellent in curability. Therefore, when photocuring or thermal curing is performed in the air, it is not affected by oxygen and it is easy to obtain a cured product. -41 - 201035153 [Cured material] The curable composition used in the present invention can be used as an optical lens, a disk substrate, a plastic substrate for a liquid crystal display element, a color filter substrate, or a plastic for an organic EL display device. A cured product used for components such as a substrate, a solar cell substrate, a touch panel, an optical element, an optical waveguide, and an LED sealing material. Among them, since the hardening shrinkage ratio is small, it can be used for various moldings, and is particularly a cured product which can be used as a mold used for forming an optical component such as a lens array. <Method for Producing Hardened Material> A cured product can be obtained by curing the curable composition used in the present invention. The curing method includes an epoxy group of the bisphenol epoxy compound (a) and an oxygen heterocycle of the oxetane compound (b) by irradiation with an active energy ray. A method of crosslinking oxetane based groups. The cured product of the curable composition used in the present invention is applied, for example, to a substrate such as a glass plate, a plastic plate, a metal plate or a tantalum wafer to form a coating film, and then subjected to a deformation step. The curable composition is obtained by irradiating an active energy ray. Examples of the coating method of the curable composition include a bar coater, an applicator, a slit coater, a spin coater, an inkjet applicator, a curtain coater, and a roll. Coating by an applicator or the like, coating by a mesh coater or the like, or coating by dipping or the like. -42- 201035153 As the active energy ray used for hardening, light in the wavelength range of electron beam or ultraviolet to infrared light is preferred. As the light source, for example, an ultra-high pressure mercury light source or a metal halogen light source can be used only for ultraviolet rays, a metal halogen light source or a halogen light source can be used only for visible light, a halogen light source can be used only for infrared rays, and a laser source such as a laser or a led light can be used. The irradiation amount of the active energy ray is preferably set to 0 depending on the type of the light source, the thickness of the coating film, etc., and is preferably an epoxy group of the bisphenol type epoxy compound (a) and an oxetane. The reaction rate of the oxetane group of the compound (b) is 80% or more, preferably 90% or more. Further, after the active energy ray is irradiated and hardened, it may be further cured by heat treatment (calcination treatment) as necessary. The heating temperature at this time is preferably in the range of 80 to 200 °C. The heating time is preferably in the range of 10 minutes to 60 minutes. In the cured product, a curable composition is applied onto a substrate such as glass, and the curable composition is brought into contact with the transfer body, and the curable composition is deformed in a state in which the shape of the transfer body is deformed and the curable composition is deformed. The object is obtained by hardening by light irradiation or the like, and the transfer shape forming the transfer body is transferred into a cured product. The above-mentioned cured product has excellent shape followability to the transfer body. Here, the "excellent shape followability" is such that the shape of the transfer body is directly transferred as a shape of a cured product, and it is difficult to cause collapse or crack on the surface of the cured product. After the transfer, the cured product is separated from the transfer body. When this separation is performed, it is necessary to keep the substrate side adhered, but the cured product has substrate adhesion -43 to 201035153. When the substrate adhesion is inferior, the cured product is removed by the transfer body side, and the cured product is peeled off from the substrate. Therefore, for example, the mold used for molding the optical component may lose the function. <Cured material> The cured product of the curable composition used in the present invention has excellent transparency, hardenability, shape followability, and substrate adhesion, and is used for forming a mold used for forming optical components such as a lens array. It is better. Since the cured product has excellent transparency, the light transmittance at a wavelength of 40 nm at a thickness of the cured film 较佳μηη is preferably 85 % or more. When the light transmittance is 85% or less, when the cured product is used as a transparent molding type, light is hardly transmitted, so that the light use efficiency is lowered, and the hardenability of the molded material in the mold is insufficient. [Embodiment] [Example 1] Hereinafter, the curable composition used in the present invention will be described in detail by way of examples, but the curable composition is not limited to the following examples as long as it does not exceed the gist. [Preparation of curable composition] (Adjustment Examples 1 to 4) A hardening type composition was produced according to the composition shown in Table 1 based on a biguanide type epoxy compound, an oxetane compound, and a polymerization initiator. . -44 - 201035153 The amount added in the table is expressed in parts by mass. Preparation Example 1 Preparation Example 2 Preparation Example 3 Preparation Example 4 Composition of Curable Composition 1 Curable Composition 2 Curable Composition 3 Curable Composition 4 Bisphenol-Type Epoxy Compound (a) Epikote 828 50.0 50.0 90.0 10.0 Oxetane compound (b) ΟΧΤ-121 ΟΧΤ-221 50.0 50.0 10.0 90.0 Polymerization initiator (c) CPI-100Ρ 10.0 10.0 10.0 10.0 Composition viscosity mPa · s 2700 1700 4400 1350 Compound used in the table The structure is shown in Table 2. ❹ -45- 201035153 [Table 2] Structure bisphenol type epoxy compound (a) Epikote828 oxetane compound (b) oxr-i2i, 0' 0 ρχτ-2?1 V 聚合 polymerization initiator (C) CPI-100P Ο Epikote 828: OXT-221, manufactured by Nippon Epoxy Co., Ltd.: OXT-121, manufactured by Toagosei Co., Ltd.: CPI-1 OOP manufactured by Toago Chemical Co., Ltd.: 50% liquid of propylene carbonate manufactured by Dow Chemical Co., Ltd. <Active energy ray hardening> In the examples and the comparative examples, the curable composition was applied to a respective glass substrate (50 mm x 50 mm), and the thickness of the cured film was ΙΟΟμηη, and an exposure apparatus equipped with an ultrahigh pressure mercury lamp was used. /cm2 exposure to harden the film [performance evaluation method] -46- 201035153, estimate the wipe. Refers to the hand hard to no face is to estimate the film evaluation to hard to peel, whether it is the film hard observation line by energy, sexual wipes> As shown below, the results are shown in Table 3. A: No peeling at all. Even if you wipe it with your nails, there are no scars. Fully harden. B: Although there is no peeling at all, there is a scar by wiping with a nail. Harden it. C: A part of the film exhibits a liquid portion, and the hardening is slightly insufficient. D: The film was completely liquid and completely peeled off. Hardening is not sufficient. <Transmittance> The light transmittance of the obtained cured film at a wavelength of 400 nm was measured in accordance with JIS-K7 105 using a spectrophotometer (UV3100 manufactured by JASCO Corporation). The results are shown in Table 2. The higher the transmittance, the better the cured film having better transparency. Further, the total light transmittance of the obtained cured film was measured using a color turbidity meter (COH 4 00 manufactured by Sakamoto Denshi Kogyo Co., Ltd.). The results are shown in Table 3. The larger the total light transmittance 値 indicates that a cured film having a higher transparency is obtained. <Shape Followability> As shown in FIG. 3, the curable composition is injected onto the wafer W by using an injection device, and for the curable composition, the transfer member 62 is brought into contact with the transfer portion 62 to contact the photo-hardening of -47-201035153. The composition was exposed to 4 J/cm 2 and hardened under an exposure apparatus equipped with an ultrahigh pressure mercury lamp. Thereafter, the transfer body 62 is separated from the wafer W. The above operation i is repeated, and a cured product which is transferred by the shape of one transfer body 62 is obtained. The shape of the one of the hardened materials was evaluated by an optical microscope to evaluate the presence or absence of cracks or cracks. The evaluation criteria are as follows. The results are shown in Table 3. A: No breaks at all, cracks occur B: No breaks occur. 'The frequency of cracks is 90/1 00 or more C: No breaks occur, the frequency of cracks is above 50/100, not up to 90/100 D: not The frequency at which the folds and cracks are generated is less than 5 0/1 00 <substrate adhesion> As shown in Fig. 3, the curable composition is injected onto the wafer W using an injection device, and the curable composition is contact-transferred. The printing body 6 2 was brought into contact with the photocurable composition by the convex portion 90, and exposed and cured at 4 J/cm2 under an exposure apparatus equipped with an ultrahigh pressure mercury lamp. Thereafter, the transfer body 62 is separated from the wafer W. The above operation was repeated 100 times. When the transfer body 62 is separated from the wafer W, when the substrate of the cured product is inferior in adhesion, the cured product adheres to the side of the transfer body 62 and is peeled off by the wafer W. Table 3 shows the results of evaluation of the number of the cured materials adhered to the wafer w as the substrate adhesion. For example, 90 out of 100 when the wafer W is dense, indicates the evaluation result of 90/100. <Curing and shrinking ratio> -48- 201035153 A resin solution was applied onto a tantalum wafer by a spin coater method. The coated substrate was measured by an optical film thickness meter. This film thickness was made into the initial film thickness. Thereafter, the film was exposed to light in a nitrogen atmosphere to prepare a cured film, and the film thickness was measured in the same manner. This film thickness was made into the film thickness after exposure. The hardening shrinkage ratio was determined by the following formula. Further, the measurement was carried out at 5 places, and the average enthalpy was calculated. (Initial film thickness - film thickness after exposure) / initial film thickness xl 00 &lt;%&gt; 〇 [Table 3] Preparation Example 1 Preparation Example 2 Preparation Example 3 Preparation Example 4 Curable Composition 1 Curable Composition 2 Curability Composition 3 Curable composition 4 Curable AAB~CB~C Hardened 400 nm transmittance % 90 91 90 90 Total light transmittance of cured product % 92 93 92 92 Shape follow-up ABAA Substrate adhesion 100/100 100 /100 100/100 100/100 Hardening shrinkage percentage 1.36 1.30 - As shown in Table 3, the curable compositions of Preparation Examples 1 and 2 have excellent hardenability, shape followability, substrate adhesion, and transparency. Therefore, it can be applied to the molding of a mold used when forming an optical component such as a lens array. On the other hand, the curable compositions of Preparation Examples 3 and 4 have excellent substrate adhesion, transparency, and shape followability, but have lower curability than Modification Examples 1 and 2, and must take longer when hardened. Time requires a lot of light to illuminate energy. -49 - 201035153 (Example) After the steps shown in Fig. 10, Fig. 11 and Fig. 12 were carried out using the curable compositions 1 to 4 produced by the methods shown in Preparation Examples 1 to 4 of the curable composition described above. A model for forming a good lens array and a lens can be obtained. In particular, the shape of the model used for the formation of the lens is good in both shape followability and substrate adhesion. When the curable compositions 1 and 2 produced by the methods shown in Preparation Examples 1 and 2 were used, the curability was also excellent. [Industrial Applicability] As described above, the present invention can be applied to, for example, a lens such as a lens array having a lens portion formed of an aspherical shape, or a shape forming method such as a model used for forming a lens. on. BRIEF DESCRIPTION OF THE DRAWINGS Fig. 1 is a plan view showing a configuration of a forming apparatus according to a first embodiment of the present invention. Fig. 1(a) is a plan view, and Fig. 1(b) is a left side view. Fig. 2 is a partial cross-sectional view showing a transfer body and a crystal used in the first embodiment of the present invention. Fig. 3 is an explanatory view showing a modification of the step of injecting a photocurable composition onto the hole formed in the crystal circle of the first embodiment of the present invention. Fig. 4 is a partial cross-sectional view showing a first modification of the transfer body and the crystal used in the embodiment of the present invention. Fig. 5 is a partial cross-sectional view showing a second modification of the transfer body and the crystal - 50 - 201035153 circle according to the first embodiment of the present invention. Fig. 6 is a block diagram showing a control device used in the forming device according to the first embodiment of the present invention. Fig. 7 is a first flowchart showing the operation of the forming apparatus according to the first embodiment of the present invention. Fig. 8 is a first flowchart showing a transfer operation of the forming apparatus according to the first embodiment of the present invention. [Fig. 9] Fig. 9 is a second flowchart showing the operation of the forming apparatus according to the first embodiment of the present invention. Fig. 10 shows a second flowchart of the transfer operation of the forming apparatus according to the first embodiment of the present invention. [Fig. 1 1] is an explanatory view showing a procedure of a lens manufacturing method according to a first embodiment of the present invention. Fig. 12 is an explanatory view showing a procedure of a lens manufacturing method according to a second embodiment of the present invention. 〇【Main component symbol description】 1 0 : Shape forming device 1 4 : Support table 1 8 : Drive source 24 : Movable table 32 : Y-axis motor 3 4 : Clamp motor 3 6 : Supply device -51 - 201035153 44 : Movable unit 5 6 : X-axis motor 60 : Light irradiation device 6 2 : Transfer body 6 4 : Support member z-axis motor 68 : Optical fiber 7 〇 : Light source 72 : Detection device 74 : Photographing unit 7 6 : Lens unit 90 : Convex Part 2 0 0 : Control device 2 04 : Main control unit 300 0 : Model 3 04 : Lens array 3 1 0 : Bonded lens array 3 12 : Lens portion 3 14 : Lens W : Wafer W1 : Substrate W2 : Holding plate h 1 : through hole h2 : hole -52-

Claims (1)

201035153 VII. Patent application scope: 1. A forming method which has a deformation step of bringing a shaped object into contact with a transfer body forming a transfer shape and deforming the shaped object in accordance with the transfer shape. a step of hardening at least a deformed portion of the shaped object, and a separating step of separating the formed object from the front transfer body, and repeating the transfer step of transferring the transfer shape to the shaped object a plurality of times The method for forming a shape is characterized in that the object to be formed is composed of a curable composition containing an epoxy compound and a polymerization initiator. (2) The method for forming a shape according to the first aspect of the invention, wherein the curable composition is (b) a bisphenol type epoxy compound represented by the following general formula (1). The group, Y represents a hydrogen atom or a 2,3-epoxypropyl group, and η is an integer of 0 to 10) (b) an oxetane compound, and (c) a polymerization initiator. 3. The method of forming the first or second aspect of the patent application, wherein the mass ratio of the epoxy compound (a) to the oxetane compound (b) is 80/20 to 20/ 80. 4. The method of forming according to any one of claims 1 to 3, wherein the viscosity of the curable composition is from 1 5000 to 5000 mPa·s. -53-