TW201032142A - Method of manufacturing radio frequency identification (RFID) tag - Google Patents

Method of manufacturing radio frequency identification (RFID) tag Download PDF

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Publication number
TW201032142A
TW201032142A TW98105404A TW98105404A TW201032142A TW 201032142 A TW201032142 A TW 201032142A TW 98105404 A TW98105404 A TW 98105404A TW 98105404 A TW98105404 A TW 98105404A TW 201032142 A TW201032142 A TW 201032142A
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Taiwan
Prior art keywords
substrate
radio frequency
frequency identification
identification tag
antenna
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TW98105404A
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Chinese (zh)
Inventor
Yi-Ru Fu
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Elka Internat Ltd
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Priority to TW98105404A priority Critical patent/TW201032142A/en
Publication of TW201032142A publication Critical patent/TW201032142A/en

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Abstract

A method for manufacturing radio frequency identification tag includes steps of: (1) selecting a substrate with an entire continuous conductive surface; (2) making holes on the substrate and installing identification chips with flip-chip electrical connection; and (3) processing the substrate to form slot antennas. Thereby, this invention makes the radio frequency identification tag have characteristics of low cost, low power consumption, power saving, pollution-free, recyclable, significant high-gain antenna, strong reflection, and high conductivity. In addition, the shielding effect of the entire conductive surface of the substrate is good and the electrical interference of the target and the environment on the radio frequency identification tag can be significantly reduced. Therefore, this invention is suitable for radio frequency identification tags to be applied on targets such as metal objects and water-containing conductors.

Description

201032142 六、發明說明: 【發明所屬之技術領域】 本發明係有關一種無線射頻識別標籤的製作方 法,尤指在整面連續導電性能的基材上直接加工形 成開槽天線,可大幅降低製造成本、無污染、可回 收,又具有顯著的高增益天線,強反射率,高導電 率…等實用優點。 【先前技術】 射頻識別技術 RFID (Radio Frequency IDenti f i cat ion),又稱電子標籤,是一種在識別系統與特 定目標之間無需建立機械或光學接觸,就可通過無 線電訊號識別特定目標並讀寫相關數據的通信技 術。 目前被動式的RFID標藏是市場主流,因為它具 有價格低廉,無需電源的優貼。應用時,RFID標籤 内部識別晶片接收到RFID讀取器發出的電磁波進行 驅動,當標籤接收到足夠的訊號時,可以向讀取器 發出數據。這些數據不僅包括ID號(全球唯一標示 ID),還可以包括預先存在於標籤内EEPR0M中的數 據。 射頻識別技術的應用領域十分廣泛,可結合資 3 201032142 料庫管理系統、電腦網路與防火牆等技術,提供全 .自動安全便利的即時監控系統功能。如鈔單及產品 防偽技術、身份證、通行證、電子收費系統、物流 管理、航空行李監控、生產自動化管控、倉儲管理、 運輸監控、保全管制以及醫療管理· . ·等。 如第1圖所示,習知的射頻標籤結構製造時, 採用蝕刻法(etching)銀印法(Printing)濺鍍 ® 法...等,在塑膠膜或紙質基材上設有導電銀膠天 線,再於天線上植入識別晶月,不但製造麻煩成本 呵,且所製成的導電銀膠天線實際面積大小相當有 限’周圍塑膠膜或紙質基材的屏壁效果又差,故易 受金屬背景物件和水份環境的干擾,對射頻識別標 鐵電性影響’使RFID讀取器無正確讀取,應用範圍 相對受到限制。 ® 除此’其實施上尚具有如下缺點: 1. 高成本:皆需配置昂貴的機具設備,約數千萬 元至一億元的設備成本,用以將天線印刷或蝕刻於 塑膠膜或紙質基材上。且銀膠等高成本耗材及蝕刻 等產生的高污染處理成本,造成射頻標籤的天線製 作單價居高不下。 2. 低良率:銀膠濺鍍等印刷材料為顆粒結構,其 導電性不如連續性導體的金屬材質,且所印的天線 201032142 極易產生斷裂失效。蝕刻方式則因曝光不足或過度 曝光等,皆導致天線導電性的不良及不連續。 3. 低電性精確度:天線阻抗等電波特性,因銀膠 厚薄,蝕刻不均等因素,造成電導、磁導等特性分 怖不均,造成天線頻率漂移及阻抗不匹配等誤差, 使得精確度難以控制,失敗率增加。 4. 耐久性低:銀印之銀膠棒發。蝕刻線路的鏽蝕, ❹ 皆使得射頻標籤庫存不易及運作時間不長的限制。 5. 高客製化成本:因應客戶應用標地物的特徵需 求,例如頻率漂移,組抗變遷等,皆需製作網版, 用以銀印或蝕刻天線,經實際測試後,視電性偏差 量,再度製作網版再經銀印、蝕刻、及測試。如此 一再重複試驗,客製化成本居高不下,無法達到單 一備料、單一庫存之目標。 參 【發明内容】 有鑑於此,本發明人乃針對上述缺失深入研究 改良,⑩供-種無線射賴別標貞的製作方法, 其主要包括: 1.選擇具有整面連續導電性能的基材; 2·在基材上打孔覆晶電性逹接設有識別晶片,以 201032142 3.於基材上加工形成開槽天線; 藉此,使無線射頻識別標籤製造成本大幅降 低、省電、節能、無污染、可回收,又具有顯著的 面增益天線(Antenna Gain),強反肘率(Ref lectiv ity)’高導電率(Conductivity),而且基材整面導 電性能的屏壁效果佳’亦可顯著降低目標物及環 境’對射頻識別標籤電性影響,因而更適於金屬物 ⑩ 件和含水導體等目標物的射頻識別標籤應用❶ 【實施方式】 本發明之構成内容及其他特點將可於閱讀以 下配合附圖之實施例詳細說明後,而趨於明瞭。 如第2〜4圖所示,本發明所設之一種無線射頻 識別標籤的製作方法,其主要包括: @ 1.選擇具有整面連續導電性能的基材 2. 在基材1上打孔U覆晶電性連接設有識別晶片 2,以及; 3. 於基材1上加工形成開槽天線j 2 ; 當然,理論上加工時也可將第2步驟及第3步驟 對調,先形成開槽天線丨2 ,再設置識別晶片2,其 製法完全相同僅步驟互異,故文中不再赘述。 藉此,可選用鋁箔、鍚镇或導電金屬材料等作 6 201032142 為基材l ’直接覆晶並以刀模沖孔戋雷射切割將開 槽天線12成型製成射頻識別標籤10,方法新穎具 體可行,材料與製程單純誤差低,產品良率高;製 造時不需配置高成本的銀印機或蝕刻機,成本低廉 且省電、節能、無污染、可回收。完全没有傳統的 銀印、蚀刻、藏鍵等昂貴、高污染、費時、不易儲 存等缺點。 ❹ 如第3〜5圖所示’本發明更具體的製造方法可 進一步包括: 基材:以鋁箔或錫箔紙導電金屬為天線基材1 ; 延展:將基材1延展至微米μιη以下的厚度,分條 捲成卷狀 Roll to Roll Process ; 衝孔:以刀模或衝壓機在基材1上設有符合識別晶 月2腳位的間距打孔11 ; ❹ 覆晶:將識別晶片2以導電膠(圖未示),可為異 方性或非異方性導電膠,固著於已打孔丨丨成卷的基 材1上; 天線成型:以刀模或雷射切割在已完成覆晶的基 材1上進行切割製成開槽天線丨2,以及; 後續處理:進行背膠、護膜(圖未示)以製成無線 射頻識別標籤10 (Inlay)。 7 201032142 請參第5、6圖所示,本發明製法的最大特色, 除了可直接-貫作業進行夭線成型加工外,製程中 並可將識別晶片2先行覆合於成卷銘謂基材J上,如 此不但可避免裸晶元易氧化,而且成卷覆晶的半成 η口基材1也可方便入庫儲存備用,使後續作業更為 機動方便,如第7圖所示’生產時再依據客製化需 求規劃各料同天線設計,修改刀模於完成覆晶的 ® ㈣基材1上,以適當刀模或雷射切割,將所需要 的開槽天線12切刻成型,產品外形多樣化製造更為 方便。 本發明製成之無線射頻識別標籤1〇,因為可在 金屬基材1直接形成開槽天線12,故應用上比之傳 統的銀印或蝕刻天線,具有顯著的高增益天線(Ant enna Gain),強反射率(Reflectivity),高導電 © 率(Conductivity)。使得於無線射頻識別系統的運 用’可達更遠的距離(140%)。 尤其,如第8圖所示,本發明因為所製成的無 線射頻識別標籤10,金屬基材i具有一大面積的屏 壁效果,應用時可顯著降低目標物及環境,對射頻 識別標籤10電性影響,因而更適於金屬物件或含 水份導體目標物的射頻識別i 〇標籤應用,以供 RFID讀取器3準確讀取。 201032142 另外’上述本發明製程方法並不限於無線射頻 識別標籤之製作,舉凡軟性電子電路導線成型,皆 可應用該一製造技術。而且所用的基材1並不限於 鋁4或錫箔等材質,其他如電路板、金屬機殼、 金屬導體、銘版等皆可依此製成原理實施。 本發明與傳統製法相較至少具有如下之優點: 1. 低材料成本:鋁箔、鎖箔等導電金屬材料取得 ® 各易,而且價格又比銀漿,蝕刻藥劑明顯便宜許多。 2. 低設備投資:不需製版機曝光機蝕刻機銀印機 乾燥機等設備。 3. 高效率製程:單一卷筒式(R〇u t〇R〇u)製程; 線上孔’覆晶,滾筒式刀模開槽,背膠,測試,包 裘…可高速一氣喝成。 4. 低製作成本:自動化生產;低人力及低水電能 _ 量消耗。 5. 低損耗:無銀漿,蝕刻藥劑等耗材,唯有滾 刀模之損耗。 5 &高良率:材料與製程單純誤差低,產品良率高。 7·單一料件備料:單m紙基材進料"備 斜成本低。 8.單一半成品庫存:單一庫存。 已覆晶之紹 、錫箔基材 9 201032142 9. 低庫存損耗:無銀膠揮發或蝕刻鏽蝕之問題。 10. 快速客製化:不需製版、銀印、覆晶、乾燥、 測試、再製版、銀印·.反覆測試流程。只需修 文刀模即可直接在已完成覆晶之|呂、錫羯庫存基 材上,線上開槽天線,背膠、測試、包裝、出貨。 11·低電性影響:全導電基材及開槽式天線,標籤 電性受目標物材質影響小。 ❹ I2.堅固:鋁、錫箔紙延展性高,受外力彎曲不易 斷裂。 13.耐久·鋁、錫箔紙,本身即耐久於高溫、高濕 環境,故對以此為基材之舯頻標籤影響低。 14·屏壁效果高:全導電基材及開槽式天線,受目 標物材質影響小。例如:杯體裝添物(水油等導體) 15. 咼反射率·紹、錫箔紙為高導電之導體,應用 ® 為射頻標籤天線,可達高f波反射率。 16. 高共構性:鋁、錫箔紙為常用包裝材料,可直 接將無線射頻識別標籤與包裝材共構製作。 上列詳細說明係針對本發明之一可行實施例 之具體說明,惟該實施例並非用以限制本發明之專 利範圍,凡未脫離本發明技藝精神所為之等效實施 或變更,均應包含於本案之專利範圍中。 綜上所述,本發明不但釗新,並能比習式製程 201032142 增進功效,應已充分符合新穎性及進步性之法定專 利要件,爰依法提出申請,懇請貴局核准本發明 專利申請案,以勵創作,至感德便。 【圖式簡單說明】 第1圖為習知無線射頻標蕺結構之應用示意圖。 第2圖為本發明製法之方塊圖。 第3圖為本發明之製造實施例圖。 ® 第4圖為本發明無線射頻標籤威品的平面圖。 第5圖為本發明製法之流程圖。 第6圖為本發明半成品庫存加工製法之示意圖。 第7圖為本發明開槽天線方便加工製成不同造形之示意圖。 第8圖為本發明無線射頻標籤之較佳應用示意圖。 【主要元件符號說明】 _ 基材…1 射頻識別標籤…10 打孔…11 開槽天線…12 識別晶片…2 RFID讀取器…3 11201032142 VI. Description of the Invention: [Technical Field] The present invention relates to a method for fabricating a radio frequency identification tag, in particular, directly forming a slotted antenna on a substrate having continuous conductive performance over the entire surface, which can greatly reduce manufacturing cost It is non-polluting, recyclable, and has significant advantages such as high gain antenna, strong reflectivity, high conductivity, etc. [Prior Art] Radio Frequency Identification (RFID), also known as electronic tag, is a way to identify and read and write specific targets by radio signals without establishing mechanical or optical contact between the identification system and a specific target. Communication technology for related data. The current passive RFID tag is the mainstream in the market because it has a low price and does not require a power supply. In application, the RFID tag internal identification chip receives electromagnetic waves from the RFID reader for driving, and when the tag receives enough signals, it can send data to the reader. These data include not only the ID number (global unique identification ID), but also data pre-existing in the EEPR0M in the tag. The application field of RFID technology is very extensive, and it can provide all-in-one automatic and convenient real-time monitoring system functions by combining the technology of 201032142 database management system, computer network and firewall. Such as bills and products anti-counterfeiting technology, ID card, pass, electronic toll collection system, logistics management, air baggage monitoring, production automation control, warehousing management, transportation monitoring, security control and medical management. As shown in Fig. 1, the conventional RF tag structure is manufactured by using an etching etching method, etc., and a conductive silver paste is provided on a plastic film or a paper substrate. The antenna, and then the identification of the crystal moon on the antenna, not only creates troublesome costs, but also the actual size of the conductive silver plastic antenna is quite limited. The surrounding plastic film or paper substrate has poor screen wall effect, so it is easy to be The interference of the metal background object and the moisture environment, the electrical influence of the radio frequency identification standard, 'the RFID reader is not correctly read, and the application range is relatively limited. In addition to this, its implementation has the following disadvantages: 1. High cost: all need to configure expensive equipment, equipment costs of tens of millions to 100 million yuan, to print or etch the antenna on plastic film or paper On the substrate. The high cost of consumables such as silver glue and the high pollution treatment costs caused by etching have resulted in high RF tag antenna production prices. 2. Low yield: printing materials such as silver sputter are granular structures, their conductivity is not as good as that of continuous conductors, and the printed antenna 201032142 is prone to breakage. The etching method causes poor and discontinuous conductivity of the antenna due to insufficient exposure or excessive exposure. 3. Low-electricity accuracy: the characteristics of the antenna such as the impedance of the antenna, due to the thickness of the silver paste, uneven etching, etc., resulting in uneven distribution of conductance and magnetic permeability, resulting in errors such as antenna frequency drift and impedance mismatch, resulting in accuracy. It is difficult to control and the failure rate increases. 4. Low durability: Silver-printed silver glue sticks. Corrosion of the etched lines, 皆 makes the RF tag inventory difficult and the operation time is not long. 5. High customization cost: In response to the customer's application of the characteristics of the target object, such as frequency drift, group resistance, etc., it is necessary to make a screen for silver printing or etching the antenna. After actual testing, the electrical deviation Quantity, re-produce the screen and then silver, etch, and test. Repeated trials and so on, the cost of customization is still high, and it is impossible to achieve the goal of single stocking and single stock. In view of the above, the inventors have made in-depth research and improvement on the above-mentioned deficiencies, and 10 methods for fabricating a wireless ray-receiving label, which mainly include: 1. selecting a substrate having continuous conduction properties over the entire surface. 2) Punching the substrate on the substrate and providing the identification chip to the 201032142 3. Processing the slotted antenna on the substrate; thereby reducing the manufacturing cost of the RFID tag and saving power, Energy-saving, non-polluting, recyclable, and has a remarkable surface gain antenna (Antenna Gain), strong yelection rate (Conductivity), and the surface of the substrate has good surface conductivity. It can also significantly reduce the electrical influence of the target and the environment 'on the RFID tag, so it is more suitable for the RFID tag application of 10 objects such as metal objects and water-conducting conductors. EMBODIMENT The constitution and other features of the present invention will be The detailed description of the embodiments with reference to the accompanying drawings will be understood and understood. As shown in Figures 2 to 4, a method for fabricating a radio frequency identification tag according to the present invention mainly comprises: @ 1. selecting a substrate having a continuous electrical conductivity of the entire surface 2. punching a hole in the substrate 1 The flip chip is electrically connected to the identification wafer 2, and 3. the substrate 1 is processed to form the slotted antenna j 2 ; of course, the second step and the third step can be reversed in theory, and the slot is formed first. The antenna 丨2 is further provided with the identification wafer 2, and the preparation method is completely the same, and only the steps are different, so the details are not described herein again. Therefore, the aluminum foil, the enamel or the conductive metal material can be used as the base material l' direct flip chip and the slotted antenna 12 is formed into the radio frequency identification tag 10 by the die punching and laser cutting. The method is novel. It is feasible and feasible, the material and process have low error and high product yield; no need to configure high-cost silver printing machine or etching machine during manufacturing, low cost, energy saving, energy saving, pollution-free and recyclable. There are no such disadvantages as traditional silver printing, etching, and hiding keys, which are expensive, highly polluting, time consuming, and difficult to store. ❹ As shown in FIGS. 3 to 5, a more specific manufacturing method of the present invention may further include: a substrate: an aluminum foil or a foil paper conductive metal as the antenna substrate 1; and an extension: the substrate 1 is stretched to a thickness of not more than μmηη Rolling Roll to Roll Process; Punching: a punching 11 is provided on the substrate 1 by a die or a punch to meet the identification of the pitch of the crystal moon; ❹ flip chip: the wafer 2 will be identified Conductive adhesive (not shown), which can be anisotropic or non- anisotropic conductive adhesive, fixed on the substrate 1 which has been punched and rolled into a roll; Antenna molding: cutting with a die or laser has been completed The flip-chip substrate 1 is cut to form a slotted antenna 丨2, and a subsequent process: a backing, a film (not shown) is formed to form a radio frequency identification tag 10 (Inlay). 7 201032142 Please refer to the fifth and sixth figures. The most important feature of the method of the present invention is that, in addition to the direct-through operation of the twist forming process, the identification wafer 2 can be firstly laminated on the substrate. J, this can not only avoid the easy oxidation of the bare crystal, but also the roll-to-roll semi-n-shaped substrate 1 can also be conveniently stored in the storage, making the subsequent operation more maneuverable, as shown in Figure 7 According to the customization requirements, plan the same antenna design, modify the die to complete the flip chip® (4) substrate 1, cut the desired slotted antenna 12 with appropriate die or laser cutting, and product Diversified manufacturing is more convenient. The radio frequency identification tag manufactured by the present invention has a significantly high gain antenna (Antenna Gain) compared to the conventional silver-printed or etched antenna, since the slotted antenna 12 can be directly formed on the metal substrate 1. , strong reflectivity (Reflectivity), high conductivity rate (Conductivity). This enables the use of radio frequency identification systems to reach farther distances (140%). In particular, as shown in FIG. 8, the present invention has a large-area screen wall effect due to the fabricated radio frequency identification tag 10, which can significantly reduce the target and environment during application, and the radio frequency identification tag 10 The electrical influence is therefore more suitable for radio frequency identification i 〇 label applications for metal objects or hydrated conductor targets for accurate reading by the RFID reader 3. 201032142 Further, the above-described process method of the present invention is not limited to the fabrication of a radio frequency identification tag, and the manufacturing technique can be applied to the flexible electronic circuit wire forming. Further, the substrate 1 to be used is not limited to materials such as aluminum 4 or tin foil, and other such as a circuit board, a metal casing, a metal conductor, a nameplate, etc. can be implemented according to the principle. Compared with the traditional manufacturing method, the invention has at least the following advantages: 1. Low material cost: conductive metal materials such as aluminum foil and lock foil are obtained, and the price is much cheaper than silver paste and etching agent. 2. Low equipment investment: no need for plate making machine exposure machine etching machine silver printing machine dryer and other equipment. 3. High-efficiency process: single roll type (R〇u t〇R〇u) process; line hole 'covering crystal, drum type die slotting, backing, testing, wrapping 裘... can be brewed at high speed. 4. Low production cost: automated production; low manpower and low water power _ consumption. 5. Low loss: no silver paste, etched chemicals and other consumables, only the loss of the knives. 5 & high yield: low material and process error, high product yield. 7. Single material preparation: single m paper substrate feeding " low cost. 8. Single and half finished goods inventory: single stock. Flip-coated, tin foil substrate 9 201032142 9. Low inventory loss: no silver volatilization or etching rust. 10. Quick customization: no need for plate making, silver printing, flip chip, drying, testing, re-plate making, silver printing · repeated test process. You only need to repair the knife die to directly slot the antenna, backing, testing, packaging and shipping on the finished substrate of Lu, Tin and Tin. 11. Low-light effect: All-electric substrate and slotted antenna, the electrical properties of the tag are less affected by the target material. ❹ I2. Sturdy: Aluminum and tin foil have high ductility and are not easily broken by external force. 13. Durable · Aluminum and tin foil paper, which is durable in high temperature and high humidity environment, has low influence on the frequency label of the substrate. 14·High screen wall effect: Fully conductive substrate and slotted antenna are less affected by the target material. For example: cup body additive (conductor such as water and oil) 15. 咼 Reflectivity · 锡, tin foil is a highly conductive conductor, application ® is a radio frequency tag antenna, which can achieve high f-wave reflectivity. 16. High co-construction: Aluminum and tin foil are commonly used packaging materials, which can be directly co-constructed with RFID tags and packaging materials. The detailed description of the preferred embodiments of the present invention is intended to be limited to the scope of the invention, and is not intended to limit the scope of the invention. The patent scope of this case. In summary, the present invention is not only new, but also can improve the efficiency compared with the conventional process 201032142, and should fully comply with the statutory patent requirements of novelty and progress, and apply in accordance with the law, and invites you to approve the patent application of the invention. Encourage creation, to the sense of virtue. [Simple description of the figure] Fig. 1 is a schematic diagram of the application of the conventional radio frequency standard structure. Figure 2 is a block diagram of the method of the present invention. Fig. 3 is a view showing a manufacturing embodiment of the present invention. ® Figure 4 is a plan view of the radio frequency tag of the present invention. Figure 5 is a flow chart of the method of the present invention. Fig. 6 is a schematic view showing the method for processing the semi-finished product inventory of the present invention. Fig. 7 is a schematic view showing the convenience of processing the slotted antenna of the present invention into different shapes. Figure 8 is a schematic diagram of a preferred application of the radio frequency tag of the present invention. [Main component symbol description] _ Substrate...1 Radio frequency identification tag...10 Punch...11 Slotted antenna...12 Identification chip...2 RFID reader...3 11

Claims (1)

201032142 七、申請專利範圍: 1. 一種無線射頻識別標籤的製作方法,其主要包括: 1. 選擇具有整面連續導電性能的基材; 2. 在基材上打孔覆晶電性連接設有識別晶片,以 及; 3. 於基材上加工形成開槽天線; 藉此,使無線射頻識別標鐵製造容易、成本大 0 幅降低,又具有顯著的高增益天線、強反射率、及 高導電率。 2·如申請專利範圍第丨項所述之無線射頻識別標籤的 製作方法,進一步包括: 基材:以鋁箔或錫箔紙導電金屬為天線基材; 延展:將基材延展至微米μηι以下的厚度,分條捲 成卷狀; φ 衝孔:在基材上設有符合識別晶片腳位的間距打 孑L ; 覆晶.將識別晶片以導電勝,固著於已打孔成卷 的基材上; 天線成型:在已完成覆晶的基材上進行切割製成 開槽天線,以及; 後續處理:進行背膠、護膜以製成無線射頻識別 楳籤。 12 201032142 3. 如申請專利範圍第2項所述之無線射頻識別標籤的 製作方法,其中該衝孔步驟以刀模或衝壓機達成。 4. 如申請專利範圍第2項所述之無線射頻識別標籤的 製作方法’其中該天線成型步驟以刀模或雷射切割 達成。 5. 如申請專利範圍第2項所述之無線射頻識別標籤的 製作方法’其中覆晶固著的成卷基材作為庫存備 ❹ 用;再依客製化需求規劃設計,在已完成覆晶的基 材上’切刻加工形成開槽天線。 6. 如申凊專利範圍第1項所述之無線射頻識別標籤的 製作方法,其中第2步驟及第3步驟對調,先形成 開槽天線,再設置識別晶片。 rj 申請專利範圍第1或6項所述之無線射頻識別標 ❺ 籤的製作方法,其中該基材進一步選自金屬機殼、 電路板、及金屬銘版等其_之一種。 13201032142 VII. Patent application scope: 1. A method for fabricating a radio frequency identification tag, which mainly comprises: 1. selecting a substrate having a continuous electrical conductivity of the entire surface; 2. providing a perforated and electrically conductive connection on the substrate Identifying the wafer, and 3. forming a slotted antenna on the substrate; thereby making the RFID tag easy to manufacture, costing down to zero, and having a significant high gain antenna, strong reflectivity, and high conductivity rate. 2. The method for fabricating a radio frequency identification tag according to the scope of the patent application, further comprising: a substrate: an aluminum foil or a foil metal conductive metal as an antenna substrate; and an extension: extending the substrate to a thickness of less than μηηι , the strip is rolled into a roll; φ punching: on the substrate is provided with the spacing of the identification of the wafer pad, 覆L; flip chip. Will identify the wafer to conduct electricity, fixed to the substrate that has been punched into a roll Antenna forming: Slotting antennas are formed on the substrate that has been completed on the flip chip, and; subsequent processing: performing backing and film protection to form a radio frequency identification tag. 12 201032142 3. The method of fabricating a radio frequency identification tag according to claim 2, wherein the punching step is performed by a die or a punch. 4. The method of fabricating a radio frequency identification tag as claimed in claim 2, wherein the antenna forming step is achieved by knife or laser cutting. 5. The method for fabricating a radio frequency identification tag as described in claim 2, wherein the roll-form substrate is covered by a chip, and the chip is prepared according to the customized demand. The substrate is 'cut etched to form a slotted antenna. 6. The method for fabricating a radio frequency identification tag according to claim 1, wherein the second step and the third step are reversed, and a slotted antenna is formed first, and then the identification chip is disposed. The method for fabricating a radio frequency identification tag according to claim 1 or 6, wherein the substrate is further selected from the group consisting of a metal case, a circuit board, and a metal plate. 13
TW98105404A 2009-02-20 2009-02-20 Method of manufacturing radio frequency identification (RFID) tag TW201032142A (en)

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