TW201029800A - Dicing system and method - Google Patents

Abstract

A singulation system for dicing IC units from a substrate comprising; a block for receiving said substrate, said block movable from a substrate receiving station to a dicing station; a first dicing saw for dicing the substrate when at the dicing station; a second dicing saw for dicing the substrate when at the dicing station; wherein the first and second dicing saws are of different varieties so as to perform different dicing functions on said substrate.

Description

201029800 VI. Description of the Invention: [Technical Field of the Invention] The present invention relates to a substrate for separating a plurality of individual dragon circuit units. More particularly, the present invention relates to systems and methods for processing such substrates that require varying types of substrates and varying forms of separation. [Prior Art] In the processing of the integrated circuit unit for a large volume of similar calling elements, the (four) discriminating factor for the (4) job may be the rate _ and quality of the unit (4). In the case of varying types of integrated circuit units or the different needs of such units is necessary - in different markets, then the key determinants will also be quality and the flexibility of the processing equipment. For example, in an individual IC unit in which the substrate is cut such that the cutting or separation system may require different conditions, the volume of the substrate can be substantially reduced under any particular conditions. Therefore, the rate can be less critical and compared to the ability to manage this flexibility. To date, systems that handle this flexibility involve processing small volumes and connecting them online to achieve the desired results. However, the cost of capital to hold and connect is extremely high and will preferably be available if a low cost intensive solution is available. SUMMARY OF THE INVENTION In a first aspect, the present invention provides a separation system for a self-substrate cutting ic unit, comprising: a block for receiving the substrate, the block being self-substrate The receiving station moves to a cutting table; __ the first cutting saw, when it is in the cutting table, 'is used to cut the substrate; a second cutting 144735.doc 201029800 saw' when it is used in the cutting table The substrate, wherein the first and second dicing saws are of different types to perform different cutting functions on the substrate. . In a second aspect, the present invention provides a method for cutting a button unit from a substrate. The method includes the steps of: providing a first and second cutting ore division; and moving the substrate to the second Mine: the second metal is partially cut by the second part; the substrate is moved to the first ore, and the cutting of the substrate is completed using the first saw. In the third aspect of the invention, the present invention provides a processing system for processing a substrate containing an array of κ cells, the system comprising: a loading station for storing a plurality of different substrate types; - (4), (4) The substrate becomes an individual IC unit; the separation system includes at least two delivery systems 'the at least two delivery systems for transporting the substrates to a plurality of cuttings; and the cuttings are configured to perform different on the substrate Cutting ^ can. Accordingly, the present invention provides flexibility by integrating different types of cuts into the system. The use of such a system would provide an integrated approach where either substrate needs to be screened out of light order (e.g., different materials or different degrees of cut applied to the master substrate). It will be understood that a control system can be included with $βο 一 一 以 以 以 以 识别 识别 识别 识别 识别 - - - - - - - - 基板 基板 基板 基板 基板 基板 基板 基板 基板 基板 基板 基板 基板 基板 基板 基板 基板 基板 基板 基板 基板For example, the two dicing saws can be a single early blasting plate or a different substrate within a particular batch requiring different thicknesses and <cutting different thicknesses. When a system can be implemented, the control device will operate to move the substrate, for example, = I44735.doc 201029800, to align the substrate relative to the cutting saw, the cutting saw having the special cutting required And other characteristics. The different conditions accommodated by the separation system according to the present invention can be <cutting with different thicknesses. Or it may involve cutting a substrate of a different material in the same substrate or in one of the batches processed by the helium separation system. In another embodiment, for example, a third cutting device can be implemented. The benefit of a third cutting device can include a cutting mine 2: the snapping has a similar feature to the first cutting saw or the second cutting saw in order to lift the ability to cut. Alternatively the third cutting ore may have a third characteristic: such that the separation system according to this embodiment may provide three different types of cutting. In another embodiment, the third cutting device can be a suitable device for forming a cut such as water jet or laser cutting. In an embodiment, the separation system can be part of a larger processing system for loading substrates to the separation system and then classifying the separated 1c units into one of various categories. The processing system can include an inspection device disposed in or adjacent to the loading section of the processing system. The inspection device can be configured to inspect the quality or warpage of the substrates loaded to the system. The inspection apparatus can further have the ability to identify different types of substrates. In the latter case, the information can be communicated to the separation system at the identification-special substrate j' such that the predefined separation process is carried out by the separation system according to the desired characteristics of the substrate. In the alternative, the substrate or the different substrates in the batch can have different layers of different materials. In this case, the separation system may comprise a cutting saw adapted to different types of materials, such as a mine that is more advantageous for cutting metal 144735.doc 201029800. In this case, the process can be optimized to utilize the metal cutting ore to completely or partially cut the metal such that the second saw can cut the reminder section of the substrate or other substrate within the batch, the The two saws are more suitable for the reminder section. In optimizing the system, the optimization criteria may include the cutting rate, the life of the cutting blade, and/or the cost of the cutting blade. For example, a blade from both of the dicing saws can simultaneously cut the metal layer. For example, the blade of the dicing saw can have a better life than the second dicing of the blade's resistance to the abrasive properties of cutting the metal layer. ❹ In another embodiment, wherein the blades vary in thickness that requires cutting, the two cutting saws can have a thick blade such as a thickness of one millimeter and a thin blade such as one of 0.3 mm thick. In another embodiment, the separation system

The flexibility can further enhance the thickness of the first and second dicing saws that do not correspond to the required thickness, but the thickness is greater than the thickness of the thinnest blade, and the thin blade can be included in the process. Multiple passes to achieve the cut-thickness. Therefore, in another embodiment, as compared to separating 1C

The substrate is generally normal or of standard thickness and the blade thickness is optimized to minimize the number of passes required. The substrates can be substantially uniform in nature. Or the substrates may be layered with different layers of material. In another embodiment, multiple substrates can be placed over a substrate of more than eight substrates such that the separation system can accommodate multiple substrates that are laid down to form a better integrated device. [Embodiment] The present invention will be further described with respect to the description of the present invention and the following drawings. The basin of the present invention, which is configured as possible and therefore the following figures, 144735.doc -6 - 201029800, is not to be construed as a substitute for the generality of the prior description of the invention. In the following terms, the cutting, sawing, cutting and separating are all about separating (partially separating) the ic unit from the self-plate. Soil * In the case of I, the present invention provides a separation system comprising at least two cutting saws that perform different functions in order to perform different purposes. A pair of dicing saws are provided to collectively achieve a cumulative result based on the different imaginary of the φ plates being considered, as shown in the various embodiments of Figures 1, 2 and 3. ... Figures 18 and 18 illustrate different stages of cutting a substrate 31. The substrate 31 is located above a block of, for example, a clamping table 3 that is rotatable so that the substrate 3 i is along the two cutting lines 45, 50 that define the individual integrated circuit 32. Align. Accordingly, in this embodiment +, the separation system 5 includes a pair of dicing saws 10, 15'. The pair of dicing saws 10, 15 are shafts having individual blades 2, 25 positioned on ❹ #. The substrate is disposed in one of the individual integrated circuit units 32 formed in the overall substrate 31, and the overall substrate 31 is cut along the octagonal main axes 45, 50. • Where (4) the separation system 5 of this embodiment provides an advantage over the prior art that the integrated circuit unit 32 is required to have the octagonal axes 45, 5〇 of different thicknesses. The short axis 45 is required! The clearing area of the millimeter is 4 〇 to separate the circuit between adjacent ic units. However, the vertical axis requires only a standard clearance area 35 of ο.% mm. To achieve this, the first cutting is staggered and the blade has a thickness that matches the desired clearance area 40 of 1 mm thickness. Correspondingly, 144735.doc 201029800 is shown in Fig. 1B green to indicate that the clamping table 3 has been rotated to align the stub shaft with the first cutting saw 10 for the wider clearance area. It should be understood that the actual thickness of the two blades can vary depending on industry standards, the economics of the substrate to be processed, and other specific operating standards. Prior to or after the first cutting cut, the second cutting saw 5 as shown in FIG. 1A is aligned with the blade 25 having a blade thickness 45 to match the desired clearance area 35, which The blade 25 is aligned to cut the longitudinal axis 50. Thus, the substrate requires two different types of cutting systems to be implemented by a separation system 5 by providing two sources 1, 15 having different features of the blades 20, 25 of different thicknesses, i.e., in this case. 2A and 2B illustrate another embodiment of the separation system 55 in which the present invention is applied to the problem of cutting different materials used on different types of substrates. In this case, the substrate 80 is a plurality of QFN cells having a first layer 85 made of copper and a lower polymer mold 90. A substrate of a BGa unit is not shown, wherein one of the polymer PCBs is also placed on a polymer mold. The separation system 55 can be used to cut different types of substrates without causing the blades 70, 75 of the cutting saws 60, 65 by providing the sources 6, 65 of the blades 7, 75 of different materials. Excessive wear and tear. The separation system 55 includes a first dicing saw 6 〇 having a metal blade adapted to cut one of the BGA units. The second dicing saw "haves a resin-bonding blade 75 adapted to cut one of the copper layers 85 for a QFN unit. Thus for this separation system 55, the first dicing saw 6 can be used to allow the clamping table to rotate for alignment The orthogonal axis of the corresponding blade cuts a BGa substrate. The metal blade resists the polymer mold of the BGA substrate for a very long time of 144735.doc 201029800 and thus obtains the benefit of lifetime. However, the first cutting ore 6 The metal blade will be quickly degraded if the blade is applied to the copper layer of the QFN substrate. By first passing through the QFN substrate 80 through the second cutting error 65, the resin bonding blade 75 is adapted. The copper layer 85 is cut. However, the second cutting error will only perform a partial cut 95 of the copper layer 85. Then the portion of the cut substrate 80 is guided to the first dicing saw 6 〇, the full cut 1 〇〇 The polymer mold 90 completes the separation of the substrate. The more expensive tree φ grease-bonding blade 75 is then subjected to unnecessary cutting of the polymer mold and thus provides a small one of the life of the resin-bonding blade 75. Thus, the separation system 55 achieves the ability to cut qfn, and any other multi-layer substrate while optimizing the life of the blade by wisely using the functions of the different blades 70, 75 of the dicing saws 6, 65 3A and 3B illustrate another embodiment in which the separation system 1〇5 can further increase the function and application of cutting different types of substrates. Here, a substrate 120 is formed by using a BGA substrate m. The BGA substrate • I25 is mounted on a QFN substrate 130 to form a single substrate. The present invention is directed to having a plurality of integrated units. However, in order to achieve this integration, the cutting saw will be of the same kind and therefore not optimized for use. Different types of sources, the separation system according to the prior art will suffer substantial wear. Thus the separation system 1〇5 again has a first cutting saw 11〇 and a second cutting error 115, the first cutting saw 11 and the second The cutting error 115 has different types of blades 135, 140. As in the embodiment of Figures 2A and 2B, the first dicing saw 110 has a metal blade adapted to cut a BGA substrate, the second cutting The blade 14 of the saw saw 115 has a resin bonded blade 140 adapted to cut the underlying QFN substrate 13 144735.doc 201029800. The method of operation is similar to that described in Figures 2A and 2B. However, the BGA substrate 125 is at the top portion 145 is performed on the BGA substrate by the metal blade 140 of the second dicing saw 115. Then the substrate 120 having the partial dicing is moved to have the The resin bonds the first dicing saw 110 of the blade 135. When the resin bonding blade 135 cuts the residual copper layer that passes through the QFN substrate ,0, the dicing is completed 150 here. Figure 4 illustrates the separation system 19 being tethered to one of the processing systems 160 therein. The processing system 16A includes a loading station 165 for loading a substrate into a separation station. The separation system 17 includes the separation 190 as mentioned, which is received from a substrate of a clamping station configuration 185. An inspection region 19 is provided between the cooling station configuration 185 and the separation system 19. The inlet channel (substrate turret) region 180 aligns the substrate angle with the direction of the detector. On the knife off, the individual Ic unit moves to feed the unit into a class system 2 〇 5 - net A π π Λ , Α

The 〇Fengtai configuration 20 (wherein the IC unit formed here is divided into various containers 210 for transfer to the last user.: The figure and the 5B edge have not been specifically adapted to handle multiple substrate types § The 65 AH loader platform 165 includes a plurality of substrates 220 〇 215. One of the loaders 225 including a pusher 225 is configured to transport the 91 91 η 5 a* , * / / 丞 丞 23 0 To a turntable 23 5. In Fig. 5a, a BGA substrate is transported to the main turret 235, which then rotates 240 the substrate to align with a pick-up 245 for transport to the clip. The solid table configuration (not shown in Figure 144735.doc 201029800). The turntable is used as a platform and is also used for inspection by being mounted to one of the track inspection devices with the extractor 245. The extractor 245 and the The inspection device 250 moves along a track 260 from the turntable to transfer the substrate after checking the device type and orientation. Following inspection, the BGA substrate is removed from the turntable by the extractor 245 and in this case Substituted by a QFN substrate 265, the qfn substrate 265 is also The urging device 225 is pushed to the turntable. The sill inspection device operates in a manner similar to one of the prior art. However, the inspection device may also identify the category of the substrate based on direct vision and notify the downstream separation system to adopt the identification corresponding to the identification. One of the different processes of the substrate. The identification may be derived from a known feature of the substrate that may also include a code, wherein the inspection device may also include a code reader. In another embodiment, the substrate may comprise an RFID device The RFID device can be read by an RnD reader (not shown), and the RFID device will transmit to a certain type of substrate conveyed by the separation system. Figures 6, 7 and 8 Shown as a clamping station configuration to a delivery system of the separation system. In this case, according to the embodiment of the separation system illustrated in Figure 2, the processing system 160 as mentioned (see Figure 4) The system is configured to process the substrate and the integrated circuit. Accordingly, the processing system 16 is geared to handle two different types of substrates. In this case, the two substrates used by the household are considered Rough grid array And a tin ball on the bottom side of the 1 (: one of the cells, the solder balls are used for direct mounting to the package. The second type is a square flat leadless unit. The BGA units are characterized by resting on one a polymer printed circuit board over the polymer mold. The (4) unit is made of a copper layer placed on top of a similar polymer mold with a 144735.doc • 11. 201029800. In this case, the treatment is performed. System 160 is configured to process both substrates, and as such, different dicing saws will be required to process both the substantially polymeric BGA unit and the copper QFN unit. Thus, returning to Figures 6, 7 and 8, the clamping station configuration involves transporting the BGA and QFN substrates from the turntable 235 to the respective clamping stations 266,271. As mentioned, an extractor 245 engages any substrate on the substrate turret 235 and transports it along a linear track 260 to the respective clamping stations 266, 271. Since the substrate is transported only one at a time, the substrate extractor 245 sequentially transports the substrates alternately between the BGA and QFN stages 266, 271. Simultaneous inspection is performed by the inspection device 250 as previously mentioned. Figure 6C illustrates the substrate transported to the respective clamping stations 266, 271, and Figure 7 illustrates the BGA substrate 267 delivered to the separation system 268. In this case, a first and second dicing saw 269, 273 is provided. As shown in the configuration of Figure 2, the first dicing saw 269 is configured to cut through the polymeric layers, and the second dicing saw 273 is configured to cut through the copper layer. On the separation of a BGA substrate 267, any sawing can be used and this will suffer from capacity and bottleneck problems. Figure 8 illustrates the withdrawal of the separate BGA substrate and delivery of the QFN substrate to the separation system 268. The method by which the QFN substrate can be cut has been described with respect to Figure 2 and therefore will not be repeated here.

During the separation of the QFN substrate, the BGA units are then transferred to a cleaning station 280 by a unit extractor 275, in which case the device extractor 275 is linear along the substrate extractor 255. The linear track 260 with the same track moves. Figures 9, 10 and 11 illustrate following the cutting and withdrawing the split QFN 144735.doc -12- 201029800 unit, a new BGA substrate 279 being transported to the next stage of the separation system 268. During this time, the first BGA substrate has been transferred to the sorting section including the drying block 300 on which the separation unit is deposited. The drying block operates to interface between the sorting station 200 after the cleaning station 280 and the BGA and QFN units that are retained on the drying block 300 prior to further sorting. Within the sorting station 200 is a dual unit extractor having one side of the BGA unit 335 and one of the remaining sides of the qfn unit: 330. The dual unit extractor transports the units from the drying block 300 to the baffle 315 and then uses the respective BGA extractor 335 as shown in FIG. 1 or as shown in FIG. The qfn extractor 330 is individually delivered to the BGA platform 310 or the QFN network station 325. When in the idle block 320, the dual unit extractor further includes an inspection device 340 to inspect the individual unit. The inspection device 340 can include inspection of the quality of the unit that follows the separation. It can also be confirmed that there are no error cells in the separation array or that the original position can be shifted from the φ. The inspection device can further detect any debris caused by the separation process that remains trapped between the separation units. 12A, 12B, and 12C illustrate that the BGA network platform 310 and the QFN network station 325 move along a linear slide to bring the bGA network platform 31〇&qfn network station 325 into proximity and linear orbits 390, 395, 4〇〇. Parallel below a phase. The linear tracks have been associated with the unit splits that are again exclusive to the respective 1 (: type. For example, the BGA platform 310 begins with and has three BGA extractors 360, 370, 38 mounted thereon. The two linear tracks 39, 395 are in proximity. The diverters 360, 370, 380 are configured to engage the unit on the 144735.doc • 13-201029800 platform 310 and transport the diverters to the BGA rack. 425, 430, the BGA racks 425, 430 then transport the BGA units to the dedicated BGA containers 405, 410. The BGA extractors 360, 370, 380 can be contacted with the prior inspection device 340 due to disposal or rework. Thus, the pre-programmed to deliver the damaged unit to an auxiliary container. One of the options 370 further includes an inspection device for performing a final inspection, the final inspection being primarily focused on the platform Errors or misaligned units on the 3 10. Further attention will be paid to the linear tracks 390, 395, which can be rotated on a turntable 350 to determine all of the 1C units by the three unit extractors 3 60, 3 70, 3 80 are accessible. 12A, 12B and 12C further illustrate a parallel system of QFN cells, wherein the QFN net 325 begins to approach two linear tracks 395, 400. It will be noted that for convenience or efficiency, a central linear track 395 accommodates a BGA cutout. The device 360 and a QFN extractor 375. It will be further appreciated that the various linear orbits can independently act or act in conjunction with the need to complete the processing system. Thus the QFN net 325 moves along a linear track so that Accessible by three QFN extractors 365, 375, 385 for transporting the QFN units to the two racks 435, 440, the two racks 435, 440 transport the QFN units to the containers 415, 420. The communication to the container can be seen in Figures 13A, B, C and D, wherein the shelves are moved along a linear track for transporting the unit containers 450, 455, 460, 465. The shelves are filled with the respective containers. It may be removed by allowing another capacity to receive one of the boxes of the respective units. 144735.doc -14- 201029800 BRIEF DESCRIPTION OF THE DRAWINGS Figures 1A and 1B are plan views of a separation system in accordance with one embodiment of the present invention. And front view 2A and 2B are a plan view and a front view of a separation system according to a second embodiment of the present invention; and Figs. 3A and 3B are a plan view and a front view of a separation system according to a third embodiment of the present invention; Figure 5A and SB are plan views of one of the processing systems of Figure 4; Figures 6A, 6B and 6C are the processing system of Figure 4 - clamping Figure 7 is a front elevational view of one of the clamping stations of Figure 6C; Figure 8 is a front elevational view of one of the clamping stations of Figure 7; Figure 9 is a clamping station configuration of the processing system according to Figure 4 FIG. 10 is a front elevational view showing one of the clamping station configuration and the network configuration of FIG. 9; FIG. 11 is a front view showing one of the clamping station configuration and the network configuration of FIG. 10; 12B and 12C are changes in the classification system of the processing system of Fig. 4; Figs. 13A, 13B, 13C and 13D are perspective views of the unloader of the processing system of Fig. 4. [Main component symbol description] Separation system 144735.doc •15· 201029800 10 First dicing saw 15 Second dicing saw 20 Blade 25 Blade 30 Cooling table 31 Substrate 32 Integrated circuit 35 Standard clearance area 40 Wide clearance area 45 Eight Edge shaft 50 Octagonal shaft 55 Separation system 60 Cutting saw 65 Cutting saw 70 Blade 75 Blade 80 DFN substrate 85 Copper layer 90 Polymer mold 95 Partial cutting 100 Full cutting 105 Separation system 110 First cutting saw 115 Second cutting saw

144735.doc -16- 201029800

120 Substrate 125 BGA Substrate 130 QFN Substrate 135 Blade 140 Blade 145 Partial Cut 150 Full Cut 160 Processing System 165 Loading Platform 170 Separation Station 180 Entry Track Area 185 Clamping Table Configuration 190 Separation System 195 Inspection Area 200 Platform Configuration 205 Classification System 210 Container 215 Table 220 Substrate 225 Propeller 226 Loader 230 Substrate 235 Turntable 245 Extractor 144735.doc -17- 201029800 250 Inspection Device 255 Substrate Extractor 260 Track 265 QFN Substrate 266 Clamping Table 267 BGA Substrate 269 First Cut Saw 271 Clamping station 273 Second dicing saw 275 Device ejector 279 BGA substrate 280 Cleaning station 300 Drying block 310 BGA slab 315 Baffle 320 Idle block 325 QFN slab 330 QFN unit 335 BGA unit 340 Inspection device 350 Turntable 360 BGA extractor 370 BGA extractor 380 BGA extractor 144735.doc 201029800 ❿ Linear track linear track linear track BGA container BGA container container container BGA frame BGA rack frame 144735.doc

Claims (1)

201029800 VII. Patent application scope: 1. A separation system for cutting from a substrate (: unit, comprising: a block for receiving the substrate, the block can be moved from a substrate receiving station to a a cutting table; a first dicing saw for cutting the substrate when in the cutting table; and a second dicing saw for cutting the slab when in the cutting table; wherein the first And the second dicing saw is of a different type to perform different cutting functions on the substrate. 2. The separation system of Kiss 1 further comprising a first blade mounted to the first dicing saw and a mounting to the first a second cymbal of the second dicing saw, wherein the first blade has a thickness greater than the thickness of the second blade. 3. A separation system as claimed, wherein the system is configured to The two dicing saw partially cuts the substrate and cuts the portion by the first cutting. / 2. The separation system of claim 3, wherein the portion of the cut comprises one of a metal layer on the substrate that is completely cut. 5. The separation system of the above-mentioned claim 1 - the first blade of the dicing saw and the blade - wherein the first blade is - a bonding resin. The method further includes a second metal blade mounted to the second dicing saw and the second blade is a method comprising the following steps: a method of cutting an IC unit from a substrate: 144735.doc 201029800 Providing - a separation system including the first and second cutting records; moving the substrate to the second error; partially cutting the metal layer of the substrate with the second ore; and moving the substrate to the first recording, using the The first-mine completes the cutting of the substrate. 8. The method of claim 6, further comprising the steps of: moving the substrate to the first saw and partially cutting a top layer of the substrate prior to the step of moving the substrate to the second saw. The method of the 1C unit is spaced apart by a rectangular array having a distance from the substrate. The method of cutting a 1C unit from a substrate different from the longitudinal spacing comprises the steps of: providing a first mine and a second mine a separation system, the first and third mines having blades of different thicknesses for mounting the separation system; moving the substrate to align the blade of the first saw along the horizontal axis and being staggered along the horizontal axis; Moving the substrate to the second data to align the longitudinal pump with the blade on the second mine and saw along the longitudinal axis. A processing system for processing a substrate having a 1C cell array includes: a loading station 'for loading a plurality of different substrate types; a knife separating system for cutting the substrates into individual sheets / the separation system including at least Two conveying systems for transporting the substrates to a plurality of (four)*, the cutting minerals being placed on a substrate such as HI, etc., performing different cutting functions, further comprising a Classification station, with 10. The processing system class of claim 9 is for receiving the 笪+*研0' the collection 荨Cut 1C unit and the dicing Ic independent batch for classification. π is divided into 11 processing systems for cutting integrated circuit units from a plurality of substrates, comprising: a load port 'which is used to carry different kinds of substrates; and one of the separation systems 1 to 5 The separation system is used to cut the substrates. 144735.doc