201028238 六、發明說明： 【發明所屬之技術領域】 本發明係有關於-㈣作薄膜太陽能電池之雷射切割方法及 其雷射機台，尤指-種雷射方向本質上與重力方向相反之雷射切割 方法及其雷射機台。 參 【先前技術】 目刖太陽此電池技術主要可分為晶片（wa运r_base(|)太陽能電 池與薄膜（thin-fiim)太陽能電池。晶片太陽能電池普遍以單晶矽或 多晶矽為基板材料，其缺點為材料成本較高。薄膜太陽能電池則是 在一般平滑之玻璃基板上沉積多晶矽、非晶矽或三五族材料之薄膜。 從製程來看，晶片太陽能電池以高純度之矽晶棒為材料，經過 響 切割、拋光、清洗及蝕刻後形成矽晶圓，作為晶片太陽能電池之基 板。接著在矽晶圓上摻雜與擴散微量硼、磷、銻等摻雜物，以於晶 圓上形成p-n結構。之後再以蒸鑛或印刷等方式製作晶片太陽能電 池之金屬電極。然後，可以晶片太陽能電池之表面裝設超白壓花玻 璃（ultra clear patterned glass)，以完成整個晶片太陽能電池製作。 超白壓花玻璃可以減少入射之光線被直接反射的機會，並且減少光 線入射之後再被反射出去的機會’進而增加光線進入晶片太陽能電 池的利用率。然而，晶片太陽能電池之缺點為材料成本較高，而薄 . 膜太陽能電池則具有低成本、容易大面積生產且模組化製程簡單等 201028238 優點，因 此薄臈太陽能電池之研發逐漸成為新的發展方白 =太_電池之㈣方式係以表面平滑麵為基板，直接於 玻璃基板上形錢_賴、p型或n型非晶料 電 二薄膜太陽能電池之製作過程中需以雷射機台從上往二 出雷射光束，穿透玻璃絲在背面聚焦而切_層，以 ❹ =。基於薄膜太陽能電池之製程與結構因素，若要將超白壓花玻 太陽能電池中來提升光線利用率，則超白壓花玻璃之 =Γ切割製程之雷射光束散射，而無法準確聚焦進行 溥臈圖案的切割製程。 【發明内容】 本發明之主要目的係為提供一種製作薄膜太陽能電池之雷射切 割方法及其雷械自，以解猶述胃知卩摘。 ❹ 為達上述之目的，本發明提供—種製作薄膜太陽能電池之雷射 =!*法。首先’提供-透光基板與—待切難層。待切割膜層設 ;、光絲之下方’喊絲板未設置_顧之—表面具有至 Γ凹凸之職紋路。之後，提供―雷射光束，雷射光束係由下往 :進，使·光束魏之雷射方向本f上與重力方向相反 ，不穿 過透先基板特焦於待切_層之所在位置⑽職切割膜層。 卜本發月亦提供—種雷射機台，包含—承載架、—雷射發 5 201028238 光裝置與一裝置基座。承載架用以承載一待切割物件，接觸待切割 物件之週邊並且暴露出待切割物件之部分下表面。雷射發光裝置設 置於承載架下方，其中雷射發光裝置之設置方向係使雷射方向本質 上與重力方向相反，而由下往上行進。裝置基座設置於承載架下方， 裝置基座具有一容納空間’以容納雷射發光裝置於容納空間中移動。 由於本發明提供之雷射絲不過透光基板即可聚焦於待切 ❹纖層之所在位置，因此可避免透光基板影響雷射光束之聚焦狀 況，也可以避免透光基板表面之粉塵影響雷射光束，使得雷射切割 製程的控制更加精準。此外，由於本發明提供之雷射光束係由下往 上行進’與重力方向相反，因此切割膜層而產生之碎屑可以直接脫 離待切割膜層，而不會影響雷射切割製程。 為讓本發明之上述目的、特徵、和優點能更明顯祕，下文特 ❹舉較佳實施方式’並配合所附圖式，作詳細說明如下。然而如下之 較佳實施方式與圖式係作為參考與說賴，並賴來對本發明加以 限制者。 【實施方式】 :參閱第1 sj ’其繪示的是本翻之—較佳實施侧用雷射機 :進仃雷射切割方法之剖面示意圖，其中相同的元件或部位沿用相 同的符號來表示。需注意的是圖式僅以說明為目的，並未依照原尺 •寸作圖。本發明尤其_於製作_太陽能電池，_是針對透光 6 201028238 基板具有粗化表面之薄膜太陽能電池，但不限於此，亦可應用於製 作晶片太陽能電池、發光二極體、發光二極體之封裝底板等等。 如第1圖所示，本發明提供一種薄膜太陽能電池之雷射機台 100可包含-承載架102、-雷射發光襄置1〇4、一裝置基座n -水平移動裝置⑽與-傳輸裝置11G。承載架⑽用以承載一待 切割物件118 ’例如-個表面上具有待切割膜層112之透光基板 ⑩114。*载架102可固定於裝置基錢6上，可包含至少一固定組件 l〇2a與至少-高度調整組件職。固定組件腿用以接觸、承載 或固定待切割物件118之週邊，並且暴露出待切割物件118之部分 下表面，例如為各式支撐架、各式夾盤、各式卡盤、各式夹頭、或 各式吸盤等。而高度調整組件膽可用以控制固定組件職之高 度以配合f射發光裝置100之雷射光束116至待切割物件的焦距， 例如包含欽鍵模組、螺紋套管等等。傳輸裝置11〇移動待切割物件 ❹118至承載架102 ’且自承載架102移除待切割物件118，例如包含 輸送警或是機械手臂等。 裝置基座106設置於承載架1〇2下方，可固定並承載 裝置⑽，且褒置基座1〇6具有一容納空間12〇,以容納雷射發光裝 置1〇4於容納空間120中移動。水平移動裝置1〇8連接至雷射發光 裝置104，以控制雷射發光裝置1〇4之水平移動。例如，水平移動 裝置108可以包含至少-x轴方向之傳動軸與至少—γ抽方向之傳 動軸(圖未示），使得雷射發光裝置104可以於乂轴方向與/或丫轴方 201028238 向上移動。雷射發光裝置1〇4設置於承載架1〇2下方，可包含有可 產生雷射光束116之雷射產生元件(圖未示）、功率調整裝置(圖未 示），以及可用以調整雷射方向與聚焦之光學模組(圖未示）。 其中，由於裝置基座106特別設置了容納空間12〇來設置雷射 發光裝置104 ’因此本發明雷射發光裝置1〇4之設置方向可以使雷 射光束II6可由下往上行進，也就是使雷射木束110行進之雷射方 ❹向本質上與重力方向相反。如此-來，切割待切割膜層112而產生 之碎屬可以直接脫離待切割膜層112，不會累積在待切割膜層112 表面’因而不會影響雷射切割製程。對此，雷射機台1〇〇亦可另包 含-集舰置(®未示）’例如錢流產生裝置，⑽—步減少雷射 機台100内之切f，j剌、粉塵或污雜。集絲置紐可設置於裝 置基座106之容納空間120 ’如此一來可使集塵裝置對應於待切割 物件118下方，更可有效處理切割待切割膜層112而產生之碎屑°。 ❹ 承載架102、雷射發光裝置104、裝置基座1〇6、水平移動裝置 ⑽與-傳輸裝置110之詳細結構均可根據產品需求或製程需求等 因素進行健’而不需舰赠述圖式所示。舉勤言，請參閱 2圖與第3圖’其繪示的是本發明之兩個較佳實施例之裝置基座之 結構示意圖。如第2圖所示，本實施例之裝置基座2〇6包含一中 1 支推組件222，而中空支撐組件222之中空部份即構成容納空間-120。或如第3圖所示’本實施例之裝置基座3〇6包含至少二實心 .件322’而實心支馳件322可圍繞或區隔出容納空間^於 8 201028238 其他實施例中，裝置基座可以包含三個或是更多之 亦可同時包含有中空支推組件與實心讀組件2切組件， 組件與實心支細牛之形狀與大小均不需受到前述圖式:= 可以為正方形、環形、弧形、扇形之水平戴面之立體結構。° ❹ 請參照第4圖至第5圖，並可一併對照第i圖第*至 示的是本發明利用雷射機台⑽進行雷射切割而製作薄膜太陽能電 池的方法示意圖。如第4圖所示，首先提供一透光基板他，透光 基板402的材質例如是玻璃或其他合適之透明材質，具有相對之一 内表面條與-入光面娜，其中透光基板4〇2之入光面娜可 具有至少-凹凸之壓花紋路，由複數個表面微結構所構成例如為 超白壓花玻璃或各式壓花玻璃基板。 接著，在透光基板402上形成一透明導電層，作為待切割膜層， ❹ 具有壓花紋路之入光面402b較佳可位於透明導電層之相對側，藉以 有效提升薄膜太陽能電池的光線利用率，其後再利用第1圖所示之 雷射機台100進行切割。 具體而言，先利用第1圖所示之傳輸裝置110將透光基板402 與透明導電層傳送至承載架102，其中透明導電層設置於透光基板 402之下方。之後，利用雷射發光裝置1〇4提供至少一雷射光束U6。 由於裝置基座106特別設置了容納空間〗2〇來設置雷射發光裝置 104，因此本發明雷射發光裝置之設置方向可以使雷射光束116 9 201028238 可由下往上行進’使雷就束116行進之雷射方向本質上與重力方 向相反。搭配承載架102之高度調整與水平移動裝置⑽之水平位 置=’雷射光束116不需穿過透光基板4〇2即可聚焦於待切 明導電層的所在位置，並且可於—水平方向上移動以切割透 導電層’形成第5圖之第—電極·。接著’反覆進行膜層形成 製程與雷射切割製程而製作光電轉換層414與第二電極424，再利 用封裝材料進行封裝，並結合—壓合基板432，形成第$圖之 薄臈太陽能電池。 第-電極410與第二電極424可以為透明導電氧化物 (transparentconductive〇xide，TC〇) _，其材質例如是氧化辞 (ZnO ) 一氧化錫(sn〇2 )、氧化銦錫（触細版⑽说，IT〇 )或氧 化銦（1叱〇3)，可以為金屬層，其材質例如是鋁（Α1)、銀（Ag)、 鋇（Mo)、銅（Cu)或其他適合之金屬或合金。光電轉換層4i4可以 ❹為㈣半導體、本質（intrinsic)半導體或”!半導體，其材質例如 是非結晶料其合金、硫倾（Cds)、銅鱗二鄉尬⑽句， CIGS )、銅銦二砸（CuInSe2，CIS )、碲化鑛((：抓）、有機材料（零心 material)或上述材料堆疊之多層結構。 由於薄臈太陽能電池通常是直接於透光基板上形成膜層結構， 而傳統雷射切賴程僅能由上而τ發出雷射光束，穿過透光基板而 聚焦於膜層，因此傳統薄膜太陽能電池不能於透光基板上形成壓花 紋路或粗化表面，否則就會散射雷射切割製程的雷射光束，影響聚 201028238 焦情形。相較之下，本發明改良之雷射機台可突破傳統機台之設備 限制’而可以不透過透光基板直接聚焦於膜層，並且維持良好之製 程良率。 相較之下’傳統雷射機台之聚焦位置高度與機台基座過於接 近，機台下方沒有足夠的空間容置雷射發光裝置，也沒有足夠的聚 焦距離來操作雷射切割製程，因此傳統雷射機台需從上往下發出雷 β 射光束，穿過透光基板而聚焦於待切割膜層。但，雷射機台中難以 避免地會具有些許粉塵沉積於透光基板上表面(即太陽能電池之入 光面），這些粉塵會影響到雷射光束。此外，透光基板之表面狀況也 會影響到雷射光束，這導致傳統薄膜太陽能電池之透光基板不能具 有會導致散射的微結構。 由於本發明提供之雷射光束不需穿過透光基板即可糕於待切 ❹繼層之所在位置’因此待切割膜層之下表面可直接與雷射光束接 觸而並未被其他基板或膜層所覆蓋。如此一來，本發明可有效避免 透光基板影響雷射絲之料、狀況，也可⑽免透光基板上表面之 沉積的粉塵影響雷射光束，使得雷射切割製程的控制更加精準。此 外，由於本發明之雷射光束不需穿過透光基板即可聚焦於待切割膜 層’因此本發财再需要穿透待_物件謂㈣、，不但可適用於 具有微結構之待切割物件，同時也突破了傳統雷射機台之限制。、 以上所賴為本發明之錄實關，凡依本㈣”專利範圍 201028238 所做之均等變化與修飾，皆應屬本發明之涵蓋範固。 【圖式簡單說明】 第1圖繪示的是本發明之一較佳實施例利用雷射機台進行雷射切割 方法之刮面示意圖。 第2圖與第3圖繪示的是本發明之兩個較佳實施例之裝置基座之結 構示意圖。 參第4圖至第5圖綠示的是本發明利用雷射機台進行雷射切割而製作 薄膜太陽能電池的方法示意圖。 【主要元件符號說明】 100 雷射機台 104 雷射發光裝置 102a 固定組件 108 水平移動裝置 112 待切割膜層 114a 粗化表面 118 待切割物件 206 裝置基座 306 裝置基座 402 透光基板 402b 入光面 414 光電轉換層 102 承載架 106 裝置基座 102b 高度調整組件 110 傳輸裝置 114 透光基板 116 雷射光束 120 容納空間 222 中空支撐組件 322 實心支撐組件 402a 内表面 410 第一電極 424 第二電極 12 201028238 攀 壓合基板 430 封裝材料 432201028238 VI. Description of the invention: [Technical field to which the invention pertains] The present invention relates to a laser cutting method for a thin film solar cell and a laser machine thereof, in particular, the laser direction is essentially opposite to the direction of gravity Laser cutting method and its laser machine. Refer to [Prior Art] Seeing the Sun This battery technology can be mainly divided into wafers (wa-run r_base(|) solar cells and thin-fiim solar cells. The wafer solar cells generally use single crystal germanium or polycrystalline germanium as the substrate material, The disadvantage is that the material cost is high. The thin film solar cell is a thin film of polycrystalline germanium, amorphous germanium or tri-five material deposited on a generally smooth glass substrate. From the process point of view, the wafer solar cell is made of high-purity twine. After being cut, polished, cleaned and etched, a germanium wafer is formed as a substrate for the wafer solar cell, and then dopants such as boron, phosphorus and germanium are doped and diffused on the germanium wafer to form on the wafer. Pn structure. The metal electrode of the wafer solar cell is then fabricated by steaming or printing, etc. Then, the surface of the wafer solar cell can be provided with ultra clear patterned glass to complete the whole wafer solar cell fabrication. Ultra-white embossed glass reduces the chance of incident light being reflected directly and reduces the incidence of light before it is reflected The opportunity to go 'in turn increases the utilization of light into the wafer solar cell. However, the disadvantage of wafer solar cells is that the material cost is higher, and the thin film solar cell has low cost, easy to produce in large area, and simple modular process. 201028238 Advantages, so the development of thin solar cells has gradually become a new development method = too _ battery (four) way to surface smooth surface as a substrate, directly on the glass substrate, _ La, p-type or n-type amorphous material In the manufacturing process of the electric two-film solar cell, the laser beam needs to be laser beam from the top to the bottom of the laser, and the glass wire is focused on the back side to cut the layer to ❹ =. Based on the process and structural factors of the thin film solar cell, In order to improve the light utilization efficiency of the ultra-white embossed glass solar cell, the laser beam of the ultra-white embossed glass=Γ cutting process is scattered, and the cutting process of the enamel pattern cannot be accurately focused. The main object of the invention is to provide a laser cutting method for manufacturing a thin film solar cell and a laser device for solving the problem. For the above purpose, the present invention provides a laser=!* method for fabricating a thin film solar cell. Firstly, 'provide-transparent substrate and-to-cut difficult layer. The film layer to be cut is set; The board is not set _ Gu Zhi - the surface has a job to the bumps and ridges. After that, provide a "laser beam, the laser beam from the bottom to the: into, the beam of the beam of the direction of the laser on the f opposite to the direction of gravity, not wearing The first substrate is specially focused on the position of the layer to be cut (10). The laser is also provided with a laser machine, including a carrier, a laser transmitter, and a device base. The carrier is configured to carry an object to be cut, contact the periphery of the object to be cut and expose a part of the lower surface of the object to be cut. The laser emitting device is disposed under the carrier, wherein the laser light emitting device is disposed in a direction of the laser. Essentially, it is opposite to the direction of gravity and travels from bottom to top. The device base is disposed below the carrier, and the device base has a receiving space to accommodate the laser light emitting device to move in the receiving space. Since the laser provided by the present invention can focus on the position of the layer to be cut, the transparent substrate can be prevented from affecting the focusing condition of the laser beam, and the dust on the surface of the transparent substrate can be prevented from affecting the lightning. The beam of light makes the control of the laser cutting process more precise. In addition, since the laser beam provided by the present invention travels from the bottom to the side opposite to the direction of gravity, the debris generated by cutting the film layer can be directly separated from the film to be cut without affecting the laser cutting process. The above described objects, features and advantages of the present invention will become more apparent from the aspects of the appended claims. However, the following preferred embodiments and drawings are to be considered as a reference, and the invention is limited. [Embodiment]: Refer to the 1st sj', which is a cross-sectional view of the preferred embodiment of the laser: a laser cutting method, wherein the same components or parts are represented by the same symbols. . It should be noted that the drawings are for illustrative purposes only and are not based on the original size. The invention is particularly for the production of a solar cell, and is a thin film solar cell having a roughened surface for a light transmissive 6 201028238 substrate, but is not limited thereto, and can also be applied to a wafer solar cell, a light emitting diode, and a light emitting diode. Package bottom plate and so on. As shown in FIG. 1, the present invention provides a laser solar cell laser station 100 that can include a carrier 102, a laser light emitting device 1〇4, a device base n-horizontal mobile device (10) and a transmission. Device 11G. The carrier (10) is configured to carry a member to be cut 118', for example, a light-transmissive substrate 10114 having a film layer 112 to be cut on its surface. * The carrier 102 can be fixed to the device base 6, and can include at least one fixed component l〇2a and at least a height adjustment component. The fixing component legs are used for contacting, carrying or fixing the periphery of the object to be cut 118, and exposing a part of the lower surface of the object to be cut 118, for example, various support frames, various chucks, various chucks, and various chucks. , or all kinds of suction cups, etc. The height adjustment assembly can be used to control the height of the fixed assembly to match the focal length of the laser beam 116 of the illumination device 100 to the object to be cut, for example, including a key module, a threaded sleeve, and the like. The transport device 11 moves the object to be cut ❹ 118 to the carrier 102' and removes the object 118 to be cut from the carrier 102, for example, including a transport police or robotic arm. The device base 106 is disposed under the carrier 1〇2, and can fix and carry the device (10), and the mounting base 1〇6 has a receiving space 12〇 for accommodating the laser light emitting device 1〇4 to move in the receiving space 120. . The horizontal moving device 1〇8 is connected to the laser emitting device 104 to control the horizontal movement of the laser emitting device 1〇4. For example, the horizontal moving device 108 can include a drive shaft of at least an -x-axis direction and a drive shaft (not shown) of at least a -γ pumping direction such that the laser-emitting device 104 can be oriented in the x-axis direction and/or the x-axis side 201028238 mobile. The laser light emitting device 1〇4 is disposed under the carrier 1〇2, and may include a laser generating component (not shown) capable of generating the laser beam 116, a power adjusting device (not shown), and a lightning can be used to adjust the lightning. Optical module for shooting direction and focusing (not shown). Wherein, since the device base 106 is particularly provided with the accommodation space 12A to set the laser light emitting device 104', the laser light emitting device 1?4 of the present invention is disposed in such a direction that the laser beam II6 can be moved from bottom to top, that is, The laser beam traveling toward the laser beam 110 is essentially opposite to the direction of gravity. In this way, the genus produced by cutting the film layer 112 to be cut can be directly separated from the film layer 112 to be diced, and does not accumulate on the surface of the film layer 112 to be diced, and thus does not affect the laser cutting process. In this regard, the laser machine 1 can also include a - set ship (® not shown) such as a money flow generating device, (10) - step to reduce the cut f, j 剌, dust or dirt in the laser machine 100 miscellaneous. The wire arranging can be disposed on the accommodating space 120' of the device base 106. Thus, the dust collecting device can be corresponding to the underside of the object to be cut 118, and the debris generated by cutting the film layer 112 to be cut can be effectively processed.详细 The detailed structure of the carrier 102, the laser emitting device 104, the device base 1〇6, the horizontal moving device (10) and the transmission device 110 can be carried out according to factors such as product requirements or process requirements. As shown in the formula. Referring to Figure 2 and Figure 3, there is shown a schematic view of the structure of the device base of two preferred embodiments of the present invention. As shown in Fig. 2, the apparatus base 2〇6 of the present embodiment includes a middle push unit 222, and the hollow portion of the hollow support unit 222 constitutes an accommodation space-120. Or as shown in FIG. 3, the device base 3〇6 of the present embodiment includes at least two solid members 322' and the solid support member 322 can surround or partition the receiving space. 8 201028238 In other embodiments, the device The pedestal may comprise three or more and may also include a hollow support assembly and a solid read assembly. The shape and size of the assembly and the solid branch are not subject to the foregoing pattern: = may be square The three-dimensional structure of the horizontal, curved, and fan-shaped horizontal surface. ° ❹ Refer to Figures 4 to 5, and a schematic diagram of a method for fabricating a thin film solar cell by laser cutting using the laser machine (10) according to the present invention will be described. As shown in FIG. 4, a transparent substrate is first provided. The material of the transparent substrate 402 is, for example, glass or other suitable transparent material, and has a pair of inner surface strips and a light-incident surface, wherein the transparent substrate 4 The entrance surface of the 〇2 may have at least a embossed road of irregularities, and is composed of a plurality of surface microstructures such as ultra-white embossed glass or various embossed glass substrates. Then, a transparent conductive layer is formed on the transparent substrate 402 as a film layer to be cut, and the light incident surface 402b having a embossed road is preferably located on the opposite side of the transparent conductive layer, thereby effectively improving the light utilization of the thin film solar cell. The rate is then cut using the laser machine 100 shown in Fig. 1. Specifically, the transparent substrate 402 and the transparent conductive layer are first transferred to the carrier 102 by using the transmission device 110 shown in FIG. 1 , wherein the transparent conductive layer is disposed under the transparent substrate 402 . Thereafter, at least one laser beam U6 is provided by the laser illumination device 1〇4. Since the device base 106 is provided with a housing space 特别2〇 to set the laser illuminating device 104, the laser illuminating device of the present invention can be arranged in such a direction that the laser beam 116 9 201028238 can be moved from bottom to top. The direction of the laser that travels is essentially opposite to the direction of gravity. The height adjustment of the collocation frame 102 and the horizontal position of the horizontal moving device (10) = 'the laser beam 116 can be focused on the position of the conductive layer to be clarified without passing through the transparent substrate 4 〇 2, and can be in the horizontal direction Move to cut through the conductive layer 'to form the first electrode of Figure 5. Then, the film formation process and the laser cutting process are repeated to form the photoelectric conversion layer 414 and the second electrode 424, and then packaged with a sealing material, and the substrate 432 is bonded-bonded to form a thin-film solar cell of the figure #. The first electrode 410 and the second electrode 424 may be transparent conductive oxide (TC〇) _, and the material thereof is, for example, oxidized (ZnO) tin oxide (sn〇2), indium tin oxide (touch plate) (10) said that IT〇) or indium oxide (1叱〇3) may be a metal layer, such as aluminum (Α1), silver (Ag), bismuth (Mo), copper (Cu) or other suitable metal or alloy. The photoelectric conversion layer 4i4 may be a (four) semiconductor, an intrinsic semiconductor or a "! semiconductor, and its material is, for example, an amorphous alloy, an alloy thereof, a sulfur tilt (Cds), a copper scale, a nostalgic (10) sentence, CIGS), and a copper indium diene. (CuInSe2, CIS), bismuth ore ((: grab), organic material (zero core material) or a multilayer structure of the above materials stack. Since thin tantalum solar cells usually form a film structure directly on the light transmissive substrate, the conventional The laser cutting process can only emit a laser beam from the top and τ, and is focused on the film through the transparent substrate. Therefore, the conventional thin film solar cell cannot form a embossed road or a roughened surface on the transparent substrate, otherwise it will The laser beam of the scattering laser cutting process affects the convergence of the 201028238. In contrast, the improved laser machine of the present invention can break through the limitations of the conventional machine and can directly focus on the film without transmitting the transparent substrate. And maintain a good process yield. In contrast, the focus position of the traditional laser machine is too close to the base of the machine, and there is not enough space under the machine to accommodate the laser device. There is not enough focus distance to operate the laser cutting process, so the traditional laser machine needs to emit a thunder beta beam from top to bottom, and focus on the film to be cut through the transparent substrate. However, it is difficult to avoid in the laser machine. The ground will have some dust deposited on the upper surface of the light-transmissive substrate (ie, the light-incident surface of the solar cell), which will affect the laser beam. In addition, the surface condition of the transparent substrate will also affect the laser beam, which leads to the tradition. The transparent substrate of the thin film solar cell cannot have a microstructure which causes scattering. Since the laser beam provided by the present invention does not need to pass through the transparent substrate, it can be placed at the position of the layer to be cut, so that the film to be cut is The lower surface can be directly in contact with the laser beam without being covered by other substrates or film layers. Thus, the present invention can effectively prevent the light-transmitting substrate from affecting the material and condition of the laser, and can also be used on the transparent substrate. The deposited dust on the surface affects the laser beam, making the control of the laser cutting process more precise. In addition, since the laser beam of the present invention does not need to pass through the transparent substrate, it can be focused on Cutting the film layer 'so the money needs to penetrate the object to be (4), not only can be applied to the object to be cut with microstructure, but also breaks through the limitations of the traditional laser machine. The fairness and modification of the patent scope 201028238 shall be covered by the invention. [Simplified description of the drawings] Figure 1 shows a preferred embodiment of the present invention. Embodiments A schematic diagram of a scraping surface of a laser cutting method using a laser machine. Fig. 2 and Fig. 3 are schematic views showing the structure of a device base of two preferred embodiments of the present invention. Fig. 5 is a schematic view showing a method of fabricating a thin film solar cell by laser cutting using a laser machine. [Main component symbol description] 100 laser machine 104 laser light emitting device 102a fixing component 108 horizontal moving device 112 to be cut film layer 114a roughened surface 118 object to be cut 206 device base 306 device base 402 light transmissive substrate 402b light incident surface 414 photoelectric conversion layer 102 carrier 106 device base 102b Adjusting means 114 transmission assembly 110 116410 transparent substrate 402a first electrode inner surface 322 of the solid support assembly receiving the laser beam 120 supporting the hollow space 222 of the second electrode assembly 424 12201028238 climbing pressed substrate 430 sealing material 432
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