201024463 九、發明說明： 【發明所屬之技術領域】 * 本發明涉及鍍膜技術領域，特別涉及一種具有多層膜 結構之基板。 【先前技術】 鍍膜作為一種薄膜製程技術，其主要包括電漿鍍膜 法、磁控濺射鍍膜法、真空蒸發法、化學氣相沈積法等。 參 Ichiki，M.等人於 2003 年 5 月發表於 2003 Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS 之論文 Thin film formation-a fabrication on non-planar surface by spray coating method中介紹了藉由喷塗於非平面 形成薄膜之方法。以反應式磁控濺射鍍膜方式，於金屬或 玻璃基底上鍍製具備高金屬質感與色彩豔麗飽滿之多層膜 結構已日益廣泛地應用於消費類電子產品上。 _ 目前，為提高所鍍膜層之硬度與耐磨性，通常採用增 加所鍍製膜之層數以及膜層厚度。然而，當鍍膜層係表現 為金屬性之合金，而被鍍基底為玻璃基底時，該被鍍基底 該與鍍膜層之間會存在晶格結構以及膨脹係數等物理性能 上之差異，使該鍍膜層與被鍍基底之結合能力降低，導致 該鍍膜層不财磨耗而容易脫落等缺點。 【發明内容】 有鑑於此，提供一種具有多層膜結構之玻璃板，以解 7 201024463 決上述問題’提高具有多層臈結構之基板之穩定性實屬必 要。 、 . 以下將以實施例說明一種具有多層膜結構之基板。 -種具有多層膜結構之基板，其包括基材層、鐵膜層 及設置於基材層與鍍膜層之間之過渡膜。該過渡膜含鉻^ 氮，其含鉻量由基材層表面向鍍膜層表面減小。 與先前技術相比，基材層藉由過渡膜與鍍膜層相結 纛合，提高基材層及外層膜與過渡膜之結合力，從而提高^ 有多層膜結構之基板之結構穩定性。 门^ 【實施方式】 下面將結合附圖及複數實施例，對本技術方案提供 具有多層膜結構之基作進一步之詳細說明。 請參閱圖1’本技術方案第一實施例提供之呈 基板10 ’其包括基材層η，鍍臈層12與設 ©材層11與鍍膜層13之間之過渡膜13。 、基 該基材層11採用金屬材料製作，例如：金屬 鋁、鈦）或合金（如：不銹鋼、銘欽合金）。該 · 包括位於最外側之外表面m，用於設置鍍層。"土 9 11 該鑛膜層12設置於基材層u上，可根日據需要鍍製不 同材料組成之臈層。軸膜層12包括位於最外 Π相對之外層膜121，其可為由一種材 成：= 膜（即：該單層骐為外層膜），亦可為 :成之早層 成之多層膜。該外層膜121採用：：，層早層膜疊加形 卜賴121㈣非金屬材_成 8 201024463 類鑽碳、玻璃或陶瓷。該陶瓷為含氮、碳或氧之金屬化合 物，例如：氮化鈦、；5炭化鉻、氣化铭鈦。 該過渡膜13之相對兩側分別與基材層11及鍍膜層 • 12。本實施例中，過渡膜13之相對兩侧分別與外表面111 及外層膜121接觸。該過渡膜13包含鉻與氮，其化學式為： CrNx，X小於等於1且大於等於0。該過渡膜13含鉻量由 基材層表面向鍍膜層表面減小。由於過渡膜13中鉻含量較 &高時（如：鉻，Cr )，表現為金屬性，而氮含量較高時（如： 氮化鉻，CrN)，表現為非金屬性。因此，過渡膜13與基材 層11及外層膜121於接觸界面處之材料之物理性能（如： 晶格結構、膨脹係數等）相近，提高基材層11及外層膜121 與過渡膜13之結合力，從而提高具有多層膜結構之基板10 之結構穩定性。當然，過渡膜13可包括具有較高硬度之 CrN，以提高整個鍍層之硬度。 該過渡膜13可採用真空鍍膜之方法製備。本實施例 ⑩中，以鉻作為起始材料，於真空鍍腔内通入氬氣與氮氣之 混合氣體，經電磁場作用使其電漿化，並與鉻結合形成包 含氮與鉻之過渡層13。於鍍膜過程中，可藉由調整通入真 空腔内氬氣與氮氣之比例，以及濺鍍速度等參數，從而獲 得具有所需性能之過渡層13。 例如，當通入氮氣含量較高之氬氣與氮氣之混合氣體 (如：氬氣以每分鐘25立方釐米之速度通入，氮氣以每分 鐘99立方釐米之速度通入），即可形成過渡膜13中含氮量 較高之區域，即：CrN。相反地，當降低氮氣含量或停止通 9 201024463 入氮氣（如：氬氣以每分鐘25立方釐米之速度通入，氮氣 停止通入）即可形成過渡膜13中含鉻量較高之區域，即： Cr。另外，可根據過渡膜13所需硬度之要求調整氮氣之含 •量（於每分鐘0至99立方釐米之速度之間調整）。 請參閱圖2,本技術方案第二實施例提供之具有多層膜 結構之基板20，其結構與第一實施例提供之具有多層膜結 構之基板10之結構大致相同，其區別在於，基材層21。該 A基材層21採用非金屬材料製作。該非金屬材料可為玻璃或 陶瓷。該陶瓷為含氮、碳或氧之金屬化合物。 為保證膜層之結合力，基板20於基材層21與過渡膜 23之間設置第一匹配層24。該第一匹配層24之相對兩侧 與外表面211及過渡層23接觸。該第一匹配層24含氮與 鉻，且含氮量高於過渡膜23之含氮量，如：氮化鉻。該過 渡膜23背離基材層21之一侧與外層膜221接觸。 請參閱圖3,本技術方案第三實施例提供之具有多層膜 ®結構之基板30，其結構與第一實施例提供之具有多層膜結 構之基板10之結構大致相同，其區別在於，鍍膜層32。該 鍍膜層32之外層膜321為金屬膜。 為保證膜層之結合力，基板30於外層膜321與過渡膜 33之間設·置第二匹配層35。該第二匹配層35之相對兩侧 與外層膜321及過渡膜33接觸。該第二匹配層35含氮與 鉻，且含鉻量高於過渡膜33之含鉻量，如：鉻。 另外，如果基材層為非金屬材料製作，而外層膜為金 屬膜，該基板可同時於基材層與過渡層以及過渡層與外層 201024463 膜之間分別設置第一匹配層與第二匹配層，以獲得較好之 膜層結合力。 綜上所述，本發明確已符合發明專利之要件，遂依法 * 提出專利申請。惟，以上所述者僅為本發明之較佳實施方 式，自不能以此限制本案之申請專利範圍。舉凡熟悉本案 技藝之人士援依本發明之精神所作之等效修飾或變化，皆 應涵蓋於以下申請專利範圍内。 ©【圖式簡單說明】 圖1係本技術方案第一實施例提供之基板之結構示意 圖。 圖2係本技術方案第二實施例提供之基板之結構示意 圖。 圖3.係本技術方案第三實施例提供之基板之結構示意 圖。 φ【主要元件符號說明】 基板 10 、 20 、 30 基材層 11、21 鍍膜層 12、32 過渡膜 13 、 23 、 33 外表面 111 、 211 外層膜 121 > 221 ' 321 第一匹配層 24 第二匹配層 35 π201024463 IX. Description of the Invention: [Technical Field] The present invention relates to the field of coating technology, and in particular to a substrate having a multilayer film structure. [Prior Art] As a film processing technology, the coating mainly includes a plasma plating method, a magnetron sputtering coating method, a vacuum evaporation method, a chemical vapor deposition method, and the like. Ichiki, M. et al., May 2003, 2003, Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS, Thin film formation-a fabrication on non-planar surface by spray coating method A method of spraying a non-planar film. The reactive magnetron sputtering coating method is applied to metal or glass substrates to form a multi-layer film structure with high metallic texture and colorful fullness. It has been widely used in consumer electronic products. _ At present, in order to improve the hardness and wear resistance of the coated layer, it is common to increase the number of layers of the film to be coated and the thickness of the film. However, when the coating layer is a metallic alloy and the substrate to be plated is a glass substrate, there is a difference in physical properties such as a lattice structure and a coefficient of expansion between the substrate to be plated and the coating layer. The ability to bond the layer to the substrate to be plated is reduced, resulting in the disadvantage that the coating layer is not worn out and is easily peeled off. SUMMARY OF THE INVENTION In view of the above, it is necessary to provide a glass sheet having a multilayer film structure to solve the above problems by the solution of the present invention. A substrate having a multilayer film structure will be described below by way of examples. A substrate having a multilayer film structure comprising a substrate layer, an iron film layer, and a transition film disposed between the substrate layer and the plating layer. The transition film contains chromium oxide, and the chromium content thereof is reduced from the surface of the substrate layer to the surface of the coating layer. Compared with the prior art, the substrate layer is bonded to the coating layer by the transition film to improve the bonding force between the substrate layer and the outer layer film and the transition film, thereby improving the structural stability of the substrate having the multilayer film structure. [Embodiment] Hereinafter, a base having a multilayer film structure will be further described in detail with reference to the accompanying drawings and the plural embodiments. Referring to Fig. 1', the substrate 10' provided in the first embodiment of the present invention includes a substrate layer η, a ruthenium layer 12 and a transition film 13 between the material layer 11 and the plating layer 13. The base material layer 11 is made of a metal material such as metal aluminum, titanium or an alloy (e.g., stainless steel, Mingqin alloy). This includes a surface m on the outermost side for setting the plating. " soil 9 11 The mineral film layer 12 is placed on the substrate layer u, and the root layer can be plated with different materials as needed. The axial film layer 12 includes an outermost film relative to the outer layer 121, which may be composed of one material: = film (i.e., the single layer layer is an outer layer film), or may be a multilayer film formed earlier. The outer layer film 121 adopts::, the layer of the early layer film is superimposed. The sheet is made of 12, and the non-metal material is formed into a carbon, glass or ceramic. The ceramic is a metal compound containing nitrogen, carbon or oxygen, for example: titanium nitride, 5 carbon chromium, gasified magnesium. The opposite sides of the transition film 13 are respectively associated with the substrate layer 11 and the plating layer 12 . In this embodiment, the opposite sides of the transition film 13 are in contact with the outer surface 111 and the outer layer film 121, respectively. The transition film 13 contains chromium and nitrogen, and has the chemical formula: CrNx, X is 1 or less and 0 or more. The chromium content of the transition film 13 is reduced from the surface of the substrate layer to the surface of the coating layer. Since the chromium content in the transition film 13 is higher than that of the & high (e.g., chromium, Cr), it is metallic, and when the nitrogen content is high (e.g., chromium nitride, CrN), it is non-metallic. Therefore, the physical properties (such as: lattice structure, expansion coefficient, etc.) of the material of the transition film 13 and the substrate layer 11 and the outer layer film 121 at the contact interface are similar, and the substrate layer 11 and the outer layer film 121 and the transition film 13 are improved. The bonding force increases the structural stability of the substrate 10 having the multilayer film structure. Of course, the transition film 13 may include CrN having a higher hardness to increase the hardness of the entire plating layer. The transition film 13 can be prepared by vacuum coating. In the embodiment 10, a chromium gas is used as a starting material, and a mixed gas of argon gas and nitrogen gas is introduced into the vacuum plating chamber, which is plasma-formed by an electromagnetic field and combined with chromium to form a transition layer containing nitrogen and chromium. . In the coating process, the transition layer 13 having the desired properties can be obtained by adjusting parameters such as the ratio of argon to nitrogen in the true cavity and the sputtering speed. For example, when a mixed gas of argon and nitrogen having a high nitrogen content is introduced (for example, argon gas is introduced at a rate of 25 cubic centimeters per minute and nitrogen gas is introduced at a rate of 99 cubic centimeters per minute), a transition can be formed. The region of the film 13 having a high nitrogen content, that is, CrN. Conversely, when the nitrogen content is lowered or the nitrogen gas is stopped (for example, argon gas is introduced at a rate of 25 cubic centimeters per minute, and nitrogen gas is stopped), a region containing a high chromium content in the transition film 13 is formed. Namely: Cr. In addition, the amount of nitrogen (adjusted between 0 and 99 cubic centimeters per minute) can be adjusted according to the required hardness of the transition film 13. Referring to FIG. 2, a substrate 20 having a multilayer film structure according to a second embodiment of the present invention has a structure substantially the same as that of the substrate 10 having a multilayer film structure provided by the first embodiment, and the difference is that the substrate layer twenty one. The A substrate layer 21 is made of a non-metal material. The non-metallic material can be glass or ceramic. The ceramic is a metal compound containing nitrogen, carbon or oxygen. In order to ensure the bonding force of the film layer, the substrate 20 is provided with a first matching layer 24 between the substrate layer 21 and the transition film 23. The opposite sides of the first matching layer 24 are in contact with the outer surface 211 and the transition layer 23. The first matching layer 24 contains nitrogen and chromium, and the nitrogen content is higher than the nitrogen content of the transition film 23, such as chromium nitride. The transition film 23 is in contact with the outer layer film 221 on the side facing away from the substrate layer 21. Referring to FIG. 3, a substrate 30 having a multilayer film® structure according to a third embodiment of the present invention has a structure substantially the same as that of the substrate 10 having a multilayer film structure provided by the first embodiment, and the difference is that the coating layer 32. The outer layer film 321 of the plating layer 32 is a metal film. In order to secure the bonding force of the film layer, the substrate 30 is provided with a second matching layer 35 between the outer layer film 321 and the transition film 33. The opposite sides of the second matching layer 35 are in contact with the outer layer film 321 and the transition film 33. The second matching layer 35 contains nitrogen and chromium, and the chromium content is higher than the chromium content of the transition film 33, such as chromium. In addition, if the substrate layer is made of a non-metal material and the outer layer film is a metal film, the substrate can be provided with a first matching layer and a second matching layer between the substrate layer and the transition layer and the transition layer and the outer layer 201024463 film, respectively. To obtain better film adhesion. In summary, the present invention has indeed met the requirements of the invention patent, and has filed a patent application according to law. However, the above description is only a preferred embodiment of the present invention, and it is not possible to limit the scope of the patent application of the present invention. Equivalent modifications or variations made by persons skilled in the art in light of the present invention are intended to be included within the scope of the following claims. BRIEF DESCRIPTION OF THE DRAWINGS Fig. 1 is a schematic view showing the structure of a substrate provided in a first embodiment of the present technical solution. Fig. 2 is a schematic structural view of a substrate provided by a second embodiment of the present technical solution. Fig. 3 is a schematic structural view of a substrate provided by a third embodiment of the present technical solution. φ [Description of main component symbols] substrate 10, 20, 30 substrate layer 11, 21 coating layer 12, 32 transition film 13, 23, 33 outer surface 111, 211 outer film 121 > 221 '321 first matching layer 24 Two matching layers 35 π