201024352 33295pif 六、發明說明： 本申請案主張於2008年12月30號向韓國智慧財產 局提出申請之韓國專利申請案第2〇〇8 〇136316號的優先 權，5亥專利申請案所揭露之内容完整結合於本說明書中。 【發明所屬之技術領域】 本發明關於一種樹脂組成物。 【先前技術】 隨者電氣/電子設備日益微型化、整合且重量減輕，讀 L ί有必要製如部零件之模組。舉例衫，需要EMI/RF =之内雜架需要導電軸麵強度，*需要脳歷 佶田^外部材料需要ΕΜ卿1屏蔽與極佳外觀。傳統上 2有不同功能之材料的組合來提供最終材料所需戈 ==曰益希望使用具有多種功能之材料。此外， 材枓之尚生產$為滿足大量生產之要求所必需。 設備且高_耗之電氣/以 提高之電磁屏収ΐ 故現代世界愈來愈需要 為金統方法使用金屬材料塗佈或電鍍。因 2導電性^以經由表面反射屏蔽電磁ϊ 然而，金屬塗佈:亦可有效屏蔽電磁波。 :生產力且會‘===有有限 -會包括複雜的步驟，諸如除骑(degre—二方:: 201024352 33295pif (etching )、中和（neutralization )、活化（activating )、促 進（promotion)、金屬化（metallizing )、第一電鑛、第二 電鍍以及第三電鍍。 【發明内容】 本發明提供一種樹脂組成物（resin composition)，其 為多功能樹脂組成物且可具有高衝擊強度（impact strengt；h )、高導電性（electrical conductivity )以及高電磁 干擾（electromagnetic interference，EMI)及/或射頻干擾 (radio frequency interference 5 RFI) 屏蔽。 本發明之樹脂組成物包含熱塑性樹脂（thermoplastic resin )(A)、體積電阻（v〇lUme resistance )小於約 1CT3 Ω ·ιη 且相對磁導率（relative permeability)大於約5,000之無機 化合物（inorganic compound) (B)以及纖維填料（fiber filler) (C)。 本發明之樹脂組成物可更包含碳填料（carb〇n filler) (D)〇 樹脂組成物可包含約40重量％至約8〇重量％之熱塑 性，脂（A)、約3重量％至約20重量％之體積電阻小於約 10 且相對磁導率大於約之無機化合物（b)、 ，5重量％至約4〇重量％之纖維填料（c)以及約〇 〇5重 量％至約1〇重量％之碳填料（D)。 本發明更提供一種模製塑膠物品（m〇lded plastic article) ’其包括樹脂組成物。模製塑膠物品可用於需要高 201024352 33295pif 衝擊強度、高導電性以及EMI/RFI屏蔽之應用。 【實施方式】 現將在下文實施方式中更詳細地描述本發明，在實施 方式中描述本發明之一些（但非全部）實施例。實際上， 本發明可以許多不同形式實施且不應理解為本發明僅限於 本文所述之實施例；相反，提供所述實施例以便本揭露案 能符合適用的法律規定。 ' 導電材料諸如破纖維（carb〇n fiber)、碳奈米管（carb〇n nanotube)以及其類似物可單獨或與增強劑（reinf〇rcing agent)混合添加至樹脂中，以形成具有高衝擊強度以及高 導電性之複合物。然而，當使用包括碳之導電材料時，需 要其他額外的方法來改良EMI/RFI性質。本發明提供一種 樹脂組成物，其具有高衝擊強度、高導電性以及極佳 EMI/RFI 屏蔽。 根據表示電磁波屏蔽效率之下式1，本發明可藉由提 高内吸收（inner absorption )以及電磁反射（electromagnetic reflection)來提高電磁波屏蔽效能（稱為「SB」）。 〔式1〕201024352 33295pif VI. INSTRUCTIONS: This application claims the priority of Korean Patent Application No. 2, 〇 136, 316, 316, filed on December 30, 2008, to the Korean Intellectual Property Office. The content is fully integrated into this specification. TECHNICAL FIELD OF THE INVENTION The present invention relates to a resin composition. [Prior Art] With the increasing miniaturization, integration, and weight reduction of electrical/electronic devices, it is necessary to read modules such as parts. For example, if you need EMI/RF =, the cross-frame needs the strength of the conductive shaft. *Requires the calendar. The external materials need to be shielded and excellent. Traditionally, a combination of materials with different functions to provide the final material requires the use of materials with multiple functions. In addition, the production of the material is required to meet the requirements of mass production. Equipment and high-consumption electrical / with improved electromagnetic screens, the modern world is increasingly needed to use metal materials for coating or plating. Because of the conductivity 2, the electromagnetic ϊ is shielded by surface reflection. However, metal coating: can also effectively shield electromagnetic waves. : Productivity will be '=== limited - will include complex steps, such as riding (degre - two sides:: 201024352 33295pif (etching), neutralization, activation, promotion, metal The present invention provides a resin composition which is a multifunctional resin composition and which can have high impact strength (impact strengt). ;h), high conductivity (electrical interference) and high electromagnetic interference (EMI) and/or radio frequency interference (RFI) shielding. The resin composition of the present invention comprises a thermoplastic resin (A) An inorganic compound (B) having a volume resistance (v〇lUme resistance) of less than about 1 CT3 Ω ·ιη and a relative permeability of greater than about 5,000 and a fiber filler (C). The resin composition of the invention may further comprise a carbon filler (D). The resin composition may comprise about 40 weights. Up to about 8% by weight of thermoplastic, fat (A), from about 3% by weight to about 20% by weight, having a volume resistance of less than about 10 and a relative magnetic permeability greater than about about inorganic compound (b), from 5% by weight to about 4% 〇% by weight of the fibrous filler (c) and about 5% by weight to about 1% by weight of the carbon filler (D). The present invention further provides a molded plastic article (which includes a resin composition) Molded plastic articles can be used in applications requiring high 201024352 33295pif impact strength, high electrical conductivity, and EMI/RFI shielding. [Embodiment] The present invention will now be described in more detail in the following embodiments, which are described in the embodiments Some, but not all, of the embodiments of the invention. In fact, the invention may be embodied in many different forms and should not be construed as being limited to the embodiments described herein; rather, the embodiments are provided so that the disclosure can be Applicable legal regulations. 'Conductive materials such as carb〇n fiber, carb〇n nanotube and the like can be mixed alone or in combination with a reinf〇rcing agent. Was added to the resin, to form a composite having high impact strength and high electrical conductivity of. However, when using conductive materials including carbon, other additional methods are needed to improve the EMI/RFI properties. The present invention provides a resin composition having high impact strength, high electrical conductivity, and excellent EMI/RFI shielding. According to the formula 1 showing the electromagnetic shielding efficiency, the present invention can improve the electromagnetic shielding effectiveness (referred to as "SB") by improving inner absorption and electromagnetic reflection. 〔Formula 1〕
S.B. = R + A + B 在上式中’R為電磁波之表面反射（導電性），A為電 磁波之内吸收，且B為由多次反射造成之損失。 因為樹脂組成物之導電性低於金屬材料之導電性，所 以提高由式1表示的組份之内吸收以及表面反射可能較為 重要。因此，可藉由誘導電磁波之内吸收來增加A值並藉 201024352 33295pif 由降低表面阻抗（surface impedance)(增加導電性）來捭 加R值以增加樹脂組成物之電磁屏蔽效率來製傷$電磁^ 蔽複合樹脂。 μ 換言之，樹脂組成物之電磁屏蔽效率與電磁波之内吸 收以及導電性相關。電磁波之内吸收與材料磁導率直接相 關。然而，應注意僅具有高磁導率之材料（例如不導電材 料’諸如鋁矽鐵粉（Sendust)、肥粒鐵（ferrite)以及其類S.B. = R + A + B In the above formula, 'R is the surface reflection (conductivity) of the electromagnetic wave, A is the absorption within the electromagnetic wave, and B is the loss caused by the multiple reflection. Since the conductivity of the resin composition is lower than that of the metal material, it is important to increase the absorption and surface reflection of the component represented by Formula 1. Therefore, it is possible to increase the A value by inducing absorption within the electromagnetic wave and by using 201024352 33295pif to reduce the surface impedance (increasing the conductivity) to increase the electromagnetic value of the resin composition by increasing the R value to increase the electromagnetic shielding efficiency of the resin composition. ^ Covering composite resin. μ In other words, the electromagnetic shielding efficiency of the resin composition is related to the absorption and conductivity within the electromagnetic wave. The absorption within the electromagnetic wave is directly related to the magnetic permeability of the material. However, attention should be paid to materials having only high magnetic permeability (e.g., non-conductive materials such as stendust, ferrite, and the like).
似物）之EMI/RFI屏蔽效率極低。相反，具有導電性^高 磁導率之材料（諸如#金屬（mu_metal )或坡莫合金 (permalloy))之EMI/RFI屏蔽效率極高。因為此等無^材 料具有良好的導電性且因具有高磁導率而有效吸收 '電磁 波，所以無機材料亦可藉由幫助在亦使用諸如碳纖維以及 碳奈米管之碳材料的樹脂組成物中形成導電路徑而提高導 電性。 ° 使用樹脂組成物製備之屏蔽材料可藉由擠壓複合樹 脂經濟且有效地製造。 本發明之具有高衝擊強度以及高導電性的EMI/RFI 屏，樹脂組成物可包括熱塑性樹脂（A)、體積電阻小於約 ίο3 Ω·ιη且相對磁導率大於5,0⑻之無機化合物（B)以 及纖維填料（C)。 例不性纖維填料（c)包括（但不限於）碳纖維、玻 璃纖維（glass fiber )、蝴纖維（boron fiber )、酿胺纖維（amide fiber )液日日聚 g旨纖維（liquid CfyStauine p〇iyester fiber )及 其類似物以及其組合。 7 201024352 33295pif 本發明之樹脂組成物可更包含碳填料（D)。例示性礙 填料（D )包括（但不限於）碳奈米管、碳黑（carb〇n恤士）、 碳奈米纖維及其類似物以及其組合。 本發明之樹脂組成物可包含約40重量％至約go重量 %之熱塑性樹脂、約3重量％至約20重量％之具有導電性 以及高磁導率之無機化合物、以及約0.05重量％至約1〇〇 重量％之碳填料，各以所有組份之總和為丨⑻重量％計。 本發明之樹脂組成物可藉由混合各組份來製備。熱塑 性樹脂可形成基質，且樹脂組成物可具有填料分散於基質 中之結構。 現將在下文實施方式中更詳細地描述本發明之各組 份。 (A)熱塑性樹脂 例示性熱塑性樹脂包括（但不限於）聚醯胺 (polyamide )、聚對笨二甲酸烷二酯（polyalkylene terephthalate )(諸如聚對苯二甲酸乙二酯（polyethylene terephthalate )以及聚對苯二曱酸 丁二酯（p〇iybutylene terephthalate ))、聚縮醛(p〇lyacetal )、聚碳酸酯 (polycarbonate )、聚醯亞胺（polyimide )、聚苯醚 (polyphenylene oxide)、聚硬（polysulfone)、聚苯硫醚 (polyphenylene sulfide )、聚醯胺醯亞胺（polyamide imide)、聚醚颯（polyether sulfone)、液晶聚合物、聚謎酮 (polyether ketone)、聚驗醯亞胺（polyether imide)、聚浠 烴（諸如聚丙烯（polypropylene )以及聚乙浠 201024352 33295pif (polyethylene ))、丙烯腈-丁二烯-笨乙烯共聚物 (acrylonitrile butadiene styrene，ABS )、聚苯乙稀 (polystyrene)、間規聚苯乙烯（syndi〇tactic p〇lystyrene) 及其類似物以及其組合。 脂 舉例而言，本發明之熱塑性樹脂可為結晶熱塑性樹 結晶聚合物具有製造電通路優於非晶形聚合物之優 點，因為結晶域不包括導電材料，從而使各導電材料具有 較高的鏈接機率。亦即，因為結晶域減小聚合物基質中 電材料之可移動區域，所以其可具有更高的相遇機會。因 此’由於結晶熱塑性樹脂具有在結晶期間將為除本發明樹 脂組^物中之組份⑷以外的填料排除在結晶區域 故其可比非晶形結晶樹脂更容易地形成導電路 枚。此外’結晶熱塑性樹脂中之增強填料可能比 脂中之增強填料更有效地提高機械衝擊強产、、°曰曰 =晶熱塑性樹脂可包括(但不;於)聚醯胺、 ，對本一曱酸乙二g旨、聚對苯二甲酸丁二醋、聚縮路 苯硫醚、液晶聚合物、聚_、_ 其類似物卩及其組合。 嶋聚本乙婦及 拍^且成物可包括約40重量％至約8〇重量 ^之至％重量％)之量的_性樹脂。若執塑性 ==約4〇重量％ ’則可能難以加工樹脂組成物， 且右…塑性樹脂之量大於約8〇重 脂組成物之敏_理性質。$|/°，财鮮以提供樹 ⑻具有導電性以及高磁導率之無機化合物 9 201024352 33295pif 具有導電性以及高磁導率之無機化合物可具有小於 約ίο·3 Ω.Π1之體積電阻以及大於約5,00〇之相對磁導率。 例示性無機化合物可包括（但不限於）鎳鐵合金，諸如以 金屬（其可具有約75%鎳、約15%鐵，加上銅以及鉬）、 坡莫合金（其可具有約20%鐵以及約80%鎳）及其類似物 以及其組合。 樹脂組成物可包括約3重量％至約20重量％ (例如約 5重量％至約15重量％)之量的具有導電性以及高磁導率 之無機化合物。若無機化合物之量小於約3重量。乂，則 EMI/RFI屏蔽之提高極小。大於約2〇重量％之無機化合物 可能對樹脂組成物之黏度以及比重產生負面影響。 (C)纖維填料 曰 例示性纖維填料包括（但不限於）碳纖維、破璃纖維、 硼纖維、醯胺纖維、液晶聚醋纖維及其類似物以及並组入。 纖維填料（C)可具有約i μηι至約20 μπι之平均直徑以口及 約1 mm至約15 mm之平均長度。 例示性碳纖維包括（但不限於）以聚丙烯腈 為主之碳纖維、以瀝青為主之碳纖維及其類似物以组 維可具有約5μιη至約12μπι之平均直徑，約二 路之平均長度，小於約爪3 之體積電阻以 及大於約100 GPa之拉伸強度。 於降低僅使用碳纖維之樹脂組成物 之脆性以及“衝擊強度之任何制玻璃纖維，例如可使 用用於增強物理性質之具有高衝擊強度之玻璃纖維。在本 201024352 33295pif 發明之一個實施例中’玻璃纖維可具有約8 μηι至約15 μηι 之平均直徑以及約2 mm至約12 mm之平均長声。 由於纖維填料可與樹脂組成物之導電性1^及高衝擊 強度相關，因此可能更希望本發明之纖維填料的體積電阻 較低且拉伸強度較高。The EMI/RFI shielding efficiency of the object is extremely low. In contrast, materials with conductivity, high magnetic permeability, such as #metal (mu_metal) or permalloy, have extremely high EMI/RFI shielding efficiency. Since such materials have good electrical conductivity and are effective in absorbing 'electromagnetic waves due to high magnetic permeability, inorganic materials can also be used in resin compositions which also use carbon materials such as carbon fibers and carbon nanotubes. A conductive path is formed to improve conductivity. ° Shielding materials prepared using a resin composition can be economically and efficiently manufactured by extruding a composite resin. In the EMI/RFI screen of the present invention having high impact strength and high electrical conductivity, the resin composition may include a thermoplastic resin (A), an inorganic compound having a volume resistance of less than about ίο3 Ω·ιη and a relative magnetic permeability of more than 5,0 (8) (B) ) and fibrous filler (C). Examples of non-fibrous fiber fillers (c) include, but are not limited to, carbon fiber, glass fiber, boron fiber, amide fiber liquid, liquid CfyStauine p〇iyester Fiber ) and its analogs, and combinations thereof. 7 201024352 33295pif The resin composition of the present invention may further comprise a carbon filler (D). Exemplary barrier fillers (D) include, but are not limited to, carbon nanotubes, carbon blacks, carbon nanofibers, and the like, and combinations thereof. The resin composition of the present invention may comprise from about 40% by weight to about % by weight of the thermoplastic resin, from about 3% by weight to about 20% by weight of the inorganic compound having conductivity and high magnetic permeability, and from about 0.05% by weight to about 1% by weight of carbon filler, each based on the sum of all components being 丨(8)% by weight. The resin composition of the present invention can be prepared by mixing the components. The thermoplastic resin can form a matrix, and the resin composition can have a structure in which the filler is dispersed in the matrix. The components of the present invention will now be described in more detail in the following examples. (A) Thermoplastic Resins Exemplary thermoplastic resins include, but are not limited to, polyamides, polyalkylene terephthalates (such as polyethylene terephthalate, and poly P〇iybutylene terephthalate), polyacetal, polycarbonate, polyimide, polyphenylene oxide, polyhard (polysulfone), polyphenylene sulfide, polyamide imide, polyether sulfone, liquid crystal polymer, polyether ketone, polyethylidene ketone Polyether imide), polyalkylene (such as polypropylene and polyethylene hydride 201024352 33295pif (polyethylene)), acrylonitrile butadiene styrene (ABS), polystyrene ), syndiotactic polystyrene (syndi〇tactic p〇lystyrene) and the like, and combinations thereof. For example, the thermoplastic resin of the present invention may be a crystalline thermoplastic tree crystalline polymer having the advantage of making an electrical path superior to an amorphous polymer because the crystalline domain does not include a conductive material, thereby giving each conductive material a high probability of linking. . That is, because the crystalline domains reduce the movable regions of the electrical material in the polymer matrix, they can have a higher chance of encounter. Therefore, since the crystalline thermoplastic resin has a filler other than the component (4) in the resin composition of the present invention during crystallization, it can be more easily formed into a conductive circuit than the amorphous crystalline resin. In addition, the reinforcing filler in the 'crystalline thermoplastic resin may increase the mechanical impact strength more effectively than the reinforcing filler in the fat, and the crystalline thermoplastic resin may include (but not;) polybenzamine, Ethylene glycol, polybutylene terephthalate, polyphenylene sulfide, liquid crystal polymer, poly-, its analogs, and combinations thereof. The conjugated resin may be included in an amount of from about 40% by weight to about 8% by weight to about % by weight. If the plasticity is == about 4% by weight, it may be difficult to process the resin composition, and the amount of the right plastic resin is greater than about 8 〇 of the lipid composition. $|/°, rich to provide an inorganic compound with electrical conductivity and high magnetic permeability of the tree (8) 201024352 33295pif inorganic compounds having electrical conductivity and high magnetic permeability may have a volume resistance of less than about ίο·3 Ω. Relative magnetic permeability greater than about 5,000 Å. Exemplary inorganic compounds can include, but are not limited to, nickel-iron alloys, such as metals (which can have about 75% nickel, about 15% iron, plus copper and molybdenum), permalloy (which can have about 20% iron, and About 80% nickel) and its analogs, as well as combinations thereof. The resin composition may include an inorganic compound having conductivity and high magnetic permeability in an amount of from about 3% by weight to about 20% by weight (e.g., from about 5% by weight to about 15% by weight). If the amount of inorganic compound is less than about 3 weights.乂, the EMI/RFI shielding is minimally improved. An inorganic compound of more than about 2% by weight may have a negative influence on the viscosity and specific gravity of the resin composition. (C) Fibrous Filler 曰 Exemplary fibrous fillers include, but are not limited to, carbon fibers, glass fibers, boron fibers, guanamine fibers, liquid crystal polyester fibers, and the like, and are incorporated. The fibrous filler (C) may have an average diameter of from about i μη to about 20 μm to the mouth and an average length of from about 1 mm to about 15 mm. Exemplary carbon fibers include, but are not limited to, polyacrylonitrile-based carbon fibers, pitch-based carbon fibers, and the like, and the group dimensions may have an average diameter of from about 5 μm to about 12 μm, an average length of about two passes, less than The volume resistance of the jaws 3 and the tensile strength of greater than about 100 GPa. In order to reduce the brittleness of the resin composition using only carbon fibers and any glass fiber of "impact strength, for example, glass fibers having high impact strength for enhancing physical properties can be used. In one embodiment of the present invention 201024352 33295pif 'glass The fibers may have an average diameter of from about 8 μηι to about 15 μηι and an average long sound of from about 2 mm to about 12 mm. Since the fibrous filler may be related to the electrical conductivity of the resin composition and high impact strength, it may be more desirable The fibrous filler of the invention has a low volume resistance and a high tensile strength.
樹脂組成物可包括約5重量％至約4〇重量％(例如約 重量％至約25重量％)之量的纖維填料。若纖維填料之 量小於約5重量％，則可能難以獲得期望的物理性質，且 若纖維填料之量大於約40重量％，則可加工性可能會降低 且使用包括大於40重量％之纖維填料的樹脂組成物製備 之模製物品即使暴露於極小衝擊時亦可能脆裂。 (D)碳填料 例示性碳填料包括（但不限於）碳奈 、 ^米纖維及其_㈣及其組合。因為碳奈米管具有極佳 靜電放電（ESD)性質，@此可使时奈米管。 例示性碳奈米管可包括（但不限於）單壁夺 ，壁:炭奈米管、多壁竣奈米管及其類似物以及二2碳 不米官可具有約1 nm至約5〇 mn之平均外徑，約10 nm 至約2+0 μιη之平均長度以及大於約8〇%之純度。 樹脂組成物可包括約（Μ)5重量％至約1〇 〇重量％(例 殖^ 重量％至約〇.5重量％)之量的碳填料（D)。若碳 /二之量小於約〇.05重量％，則可能難以提供樹脂 望的物理性f，且若碳填料（D)之量大於約 •量/°，由於樹脂組成物之黏度會顯著增加，樹脂組 11 201024352 33295pif 成物可能難以處理。 之樹辦施财，本發賴錢用本發明 之f月曰、、且成物製備的模製物品。模製物品可使用任何習用 模製技術製備，諸如（^日尤职机、姑κ 災用1叮為用 (彳-不限於）擠壓、射itj成型以及其 f似技術。本發明之模製物品可具有高衝擊強度、高導電 …且可用於需要EMI/RFI屏蔽之領域。舉_言，本發 明之模製物品可餘製造各種模製物品，諸如（但不限於） 顯示裝置（諸如TV以及PDP)、諸如鶴、行動電話以及The resin composition may include a fibrous filler in an amount of from about 5% by weight to about 4,000% by weight (e.g., from about 5% by weight to about 25% by weight). If the amount of the fibrous filler is less than about 5% by weight, it may be difficult to obtain desired physical properties, and if the amount of the fibrous filler is more than about 40% by weight, workability may be lowered and a fibrous filler comprising more than 40% by weight may be used. Molded articles prepared from the resin composition may be brittle even when exposed to a very small impact. (D) Carbon Fillers Exemplary carbon fillers include, but are not limited to, carbon naphthalene, m-fiber, and _(iv), and combinations thereof. Because carbon nanotubes have excellent electrostatic discharge (ESD) properties, @this allows time nanotubes. Exemplary carbon nanotubes can include, but are not limited to, single walled, walled: carbon nanotubes, multi-walled nanotubes and the like, and two carbon monoxides can have from about 1 nm to about 5 inches. The average outer diameter of mn, an average length of from about 10 nm to about 2+0 μηη and a purity greater than about 8〇%. The resin composition may include a carbon filler (D) in an amount of from about 5% by weight to about 1% by weight (from 5% by weight to about 5% by weight). If the amount of carbon/two is less than about 〇.05 wt%, it may be difficult to provide the physical property f of the resin, and if the amount of the carbon filler (D) is more than about • amount/°, the viscosity of the resin composition is significantly increased. , Resin Group 11 201024352 33295pif The product may be difficult to handle. The tree is used for money management, and the present invention relies on the molded articles prepared by the present invention. Molded articles can be prepared using any conventional molding technique, such as (for example, 日 不 不 灾 彳 彳 彳 彳 不 不 不 、 、 、 、 、 、 、 、 、 、 、 以及 以及 以及 以及 。 。 。 。 。 。 。 。 。 The article can have high impact strength, high electrical conductivity... and can be used in fields requiring EMI/RFI shielding. In other words, the molded article of the present invention can be used to manufacture various molded articles such as, but not limited to, display devices such as TV and PDP), such as cranes, mobile phones, and
辦公至自動化褒置之電氣/電子設備之零件、内部框架以及 其類似物。Parts of electrical/electronic equipment, internal frames, and the like, from office to automated installation.
在本發明之一個實施例中，根據本發明之模製塑膠物 品可具有約15 dB至約50 dB之電磁波屏蔽效率，根據 ASTMD257所量測約1〇Ω/□至約1〇4Q/□之表面電阻， 根據ASTM D790以1/4”寬度所量測約12 Gpa至約30 GPa 之彎曲強度，以及根據ASTM D256以1/8Π寬度所量測約 25 J/m至約70 J/m之缺口艾氏衝擊強度（n〇tched izod impact strength ) ° 可參考以下實例更透徹地理解本發明，所述實例欲出 於說明之目的且無論如何不應理解為限制本發明之範嘴， 本發明之範疇由隨附申請專利範圍界定。 實例 (A)熱塑性樹脂 使用聚苯硫醚（pps)作為熱塑性樹脂，其中聚苯硫 醚（PPS)之溶體流動指數在316°C下為約48 g/10 min至 12 201024352 約 7〇g/10min，且負荷為 127〇g。 (B)具有導電性以及高磁導率之無機化合物 使用坡莫合金作為具有導電性以及高磁導率之無機 化合物，其中坡莫合金為鎳鐵合金（Dongbu Fine Chemicals Corporation) ’且體積電阻為1〇-7〔n.m〕且相對磁導率為 10,000。 (C1)纖維填料 使用瀝青碳纖維作為纖維填料，其中瀝青碳纖維之直 徑為7μιη ’長度為4 mm，體積電阻為1〇-5〔Ω·ιη〕且拉伸 強度為200GPa。 (C2)纖維填料 使用玻璃纖維作為纖維填料，其中玻璃纖維之直徑為 10 μπι，長度為3 mm，且表面塗覆有矽烷增容劑以與PPS 良好黏著。 (D)碳填料 使用多壁碳奈米管作為碳填料，其中多壁碳奈米管之 • 直徑為9.5nm，長度為 1.5 mm且純度為90%。 在藉由混合如表1中所列之上述組份來製備樹脂組成 物以提供實例1至6以及比較實例後，使用習用雙螺桿擠 壓機以及注射成型機製備用於量測物理性質之樣品。 EMI屏蔽效應是經由ROHDE & SCHWARZ製造的 波譜分析儀來進行測量。 根據ASTMD257量測所製備樣品之表面電阻。 根據ASTMD790以1/4’’寬度量測彎曲強度。 13 201024352 33295pif 根據ASTM D256以1/8"寬度量測缺口艾氏衝擊強度。 所量測物理性質之結果呈示於下表丨中。 又 表1之實例以及比較實例證明用作纖維填料之碳纖維 (C1)主要有助於衝㈣度職導紐，碳填料有助於導 電性’玻璃纖維（C2)有助於衝擊強度，且用作無機化合 物之坡莫合金有助於增加腿/RFI#蔽性質，而所述屏蔽 性質由碳纖維以及碳奈米管的提高有限。 因此，本發明藉由混合無機化合物與導電且高磁導率 ❹ 之纖維填料以及視纽選狀碳填料，可提供具有高衝擊 強度、高導f性以及良好EMI/RFI屏龜f之多功能樹脂 組成物。 〔表1〕 (A)熱塑性樹 機化¥ 物〔坡莫合金〕 (ci) mmmf (C2) mmWnIn one embodiment of the invention, a molded plastic article according to the present invention may have an electromagnetic wave shielding efficiency of from about 15 dB to about 50 dB, measured from about 1 〇 Ω / □ to about 1 〇 4 Q / □ according to ASTM D257 Surface resistance, measured from 1/4" width according to ASTM D790, from about 12 Gpa to about 30 GPa, and from about 25 J/m to about 70 J/m in accordance with ASTM D256 at 1/8 inch width. The invention is more thoroughly understood by reference to the following examples, which are intended for purposes of illustration and should not be construed as limiting the invention in any way, the invention The scope is defined by the scope of the accompanying application. Example (A) Thermoplastic resin uses polyphenylene sulfide (pps) as a thermoplastic resin, wherein the polyphenylene sulfide (PPS) has a solution flow index of about 48 g at 316 °C. /10 min to 12 201024352 about 7〇g/10min, and the load is 127〇g. (B) Inorganic compounds with conductivity and high magnetic permeability use permalloy as an inorganic compound with conductivity and high magnetic permeability , in which permalloy is nickel-iron alloy (Dongbu F Ine Chemicals Corporation) 'and volume resistance is 1〇-7 [nm] and relative magnetic permeability is 10,000. (C1) Fiber filler uses pitch carbon fiber as fiber filler, wherein pitch carbon fiber has a diameter of 7μηη 'length is 4 mm, volume The electric resistance is 1〇-5[Ω·ιη] and the tensile strength is 200GPa. (C2) The fibrous filler uses glass fiber as the fibrous filler, wherein the glass fiber has a diameter of 10 μm, a length of 3 mm, and the surface is coated with decane. The compatibilizer adheres well to the PPS. (D) The carbon filler uses a multi-walled carbon nanotube as the carbon filler, wherein the multi-walled carbon nanotube has a diameter of 9.5 nm, a length of 1.5 mm and a purity of 90%. A resin composition was prepared by mixing the above components as listed in Table 1 to provide Examples 1 to 6 and a comparative example, and a sample for measuring physical properties was prepared using a conventional twin-screw extruder and an injection molding machine. The EMI shielding effect was measured by a spectrum analyzer manufactured by ROHDE & SCHWARZ. The surface resistance of the prepared sample was measured according to ASTM D257. The bending strength was measured in 1/4" width according to ASTM D790. 201024352 33295pif Measure the notched Izod impact strength in 1/8" width according to ASTM D256. The results of the measured physical properties are shown in the following table. Further examples of Table 1 and comparative examples demonstrate carbon fiber used as fiber filler (C1) It mainly contributes to the rushing (four) degree guide, the carbon filler contributes to the conductivity 'glass fiber (C2) contributes to the impact strength, and the permalloy used as the inorganic compound helps to increase the leg/RFI# properties. And the shielding properties are limited by the improvement of carbon fiber and carbon nanotubes. Therefore, the present invention can provide a high impact strength, a high conductivity, and a good EMI/RFI screen turtle by mixing an inorganic compound with a conductive and high magnetic permeability 纤维 fiber filler and a fluorinated carbon filler. Resin composition. [Table 1] (A) Thermoplastic tree Machined material [Permalloy] (ci) mmmf (C2) mmWn
表面電阻 〔Ω/口〕 〔GPa〕___ 缺口艾氏 [J/m] - -—^---L _ 具有上文說明書中所提供之教示之益處的本發明之 許多^改以及其他實施砸本發明所屬之麟領域之熟習 者而言應油然*生。因此’應瞭解本發糾限於所揭露之 ❹ 14 201024352 * 33295pif 特定實施例，且所述修改以及其他實施例意欲包括在隨附 申請專利範圍之範疇内。雖然本文使用特定術語，但其僅 以一般性以及描述性意義使用且無限制目的， 之範 疇在申請專利範圍中界定。 & 【圖式簡單說明】 無 馨 【主要元件符號說明】 無 15Surface Resistance [Ω/口] [GPa]___ Notched Ehrlich [J/m] - - -^---L _ Many modifications and other implementations of the present invention having the benefits of the teachings provided in the above specification砸Those skilled in the art to which the present invention pertains should be alive. Therefore, it should be understood that the present invention is limited to the disclosed embodiments. The present invention is intended to be included within the scope of the appended claims. Although specific terms are employed herein, they are used in a generic and descriptive sense and are not intended to limit the scope of the invention. & [Simple diagram description] No Xin [Main component symbol description] None 15